Battery formation lower computer and control method thereof

Abstract

The invention provides a battery formation lower computer and a control method thereof. The battery formation lower computer comprises a main control board; the power board comprises a main circuit board and a side circuit board, the main circuit board is connected with the main control board, and the side circuit board is electrically connected with the main circuit board while being detachably connected with the main circuit board through a connecting assembly; the side circuit board is located at the edge of the main circuit board and forms a preset angle with the main circuit board; the radiating device comprises a radiator arranged on the main circuit board, and the side part of the radiator is close to the side circuit board; the main circuit board has a first surface, and the projection of the radiator on the main circuit board is located on the first surface; and the area ratio of the projection to the first surface is 0.6-1. Interference is reduced by separating the main control board and the power board, the processing difficulty is reduced through detachable connection of the main circuit board and the side circuit board, the space utilization rate is improved through the design that the main circuit board and the side circuit board form the preset angle, and the heat dissipation device makes full contact with the power board so as to improve the heat dissipation effect.

Description

Technical Field

[0001] The invention relates to the technical field of battery formation, and in particular to a battery formation slave computer and a control method thereof. Background Art

[0002] Lithium batteries have been widely used in various fields such as electronic products due to their excellent performance such as high energy density, high voltage, high cycle, high safety, long cycle life, and green environmental protection. Battery formation is an important part of battery production, and the formation process has a crucial impact on the performance of lithium batteries. In terms of the control transmission structure of the battery formation system, the upper computer controls the lower computer or the upper computer / middle computer / lower computer progressive transmission structure is currently adopted. The upper computer is mainly responsible for monitoring battery information, and the lower computer connects to the battery for formation.

[0003] However, the existing lower computers have the following defects: first, the various components of the existing lower computers are integrated into one structure, which is difficult to process and requires high processing costs; second, the existing lower computer equipment is large in size, occupies a large space, and has an unreasonable spatial layout; third, as long as one of the devices in the lower computer fails, the formation system will crash; if you want to repair one of the devices, there are disadvantages of high repair difficulty and cost, and if the entire lower computer is replaced, the cost is huge; fourth, the independence of each component is poor and interference is prone to occur. Summary of the invention

[0004] In order to overcome the defects of the above-mentioned prior art, the present invention provides a battery formation lower computer and a control method thereof, which reduces equipment interference by making the main control board and the power board relatively independent; at the same time, the power board has high space utilization, good heat dissipation effect, long service life and safety and reliability. The specific technical solution is as follows:

[0005] A battery formation lower computer, comprising:

[0006] Main control board;

[0007] A power board, comprising a main circuit board and a side circuit board, wherein the main circuit board is electrically connected to the main control board; a connecting component is provided between the main circuit board and the side circuit board, and is used to electrically connect the main circuit board and the side circuit board while the main circuit board and the side circuit board are detachably connected; and the side circuit board is located at an edge of the main circuit board and is at a preset angle to the main circuit board;

[0008] A heat dissipation device comprises a heat sink, wherein the heat sink is arranged on the main circuit board, and the side of the heat sink is close to the side circuit board; the main circuit board has a first surface, and the projection of the heat sink on the main circuit board is located on the first surface; and the projection area of ​​the heat sink on the main circuit board is a first projection area, and the ratio of the first projection area to the area of ​​the first surface is between 0.6 and 1.

[0009] In a specific embodiment, the main circuit board has a formation drive circuit, and the formation drive circuit includes one or more of a capacitor and a switch circuit;

[0010] The side circuit board is provided with a communication circuit, a collection circuit and a control circuit, and the communication circuit, the collection circuit and the control circuit are electrically connected to the formation drive circuit respectively.

[0011] In a specific embodiment, the side circuit board includes at least two driving boards, each of which is correspondingly provided with the communication circuit, the acquisition circuit and the control circuit; at least two of the driving boards are located on the same side of the main circuit board and are spaced apart along the edge of the main circuit board.

[0012] In a specific embodiment, the radiator has a first side portion, the first side portion is close to the side circuit board; the projection of the side circuit board on the radiator is located on the first side portion; and the projection area of ​​the side circuit board on the radiator is a second projection area, and the ratio of the second projection area to the area of ​​the first side portion is 0.1-0.5.

[0013] In a specific embodiment, the preset angle is 90°.

[0014] In a specific embodiment, the heat sink has a heat receiving portion, which is in contact with the first surface and is used to receive heat from the main circuit board; the area ratio of the heat receiving portion to the first surface is between 0.2-1.

[0015] In a specific embodiment, the heat dissipation device further comprises at least one fan, and the fan is arranged in a region close to the heat sink;

[0016] The radiator comprises a plurality of radiating fins, the plurality of radiating fins are arranged at intervals to form a plurality of radiating channels, and the air outlet direction of the fan or the air suction direction of the fan is toward the radiating channels.

[0017] In a specific embodiment, the main control board has a microcontroller unit, an operational amplifier, a photoelectric isolator and a first acquisition module. The microcontroller unit, the operational amplifier, the photoelectric isolator and the first acquisition module are electrically connected in sequence, and the first acquisition module is used to collect the voltage of the battery.

[0018] In a specific embodiment, the main control board further has a power module and a second acquisition module, the power module is provided with a switch for controlling the on and off of the power supply, and the power module is electrically connected to the micro control unit for supplying power to the micro control unit;

[0019] The second acquisition module is electrically connected to the micro control unit and is used to acquire the temperature of the battery.

[0020] A battery formation control method, using the battery formation slave computer as described above, the control method comprises:

[0021] If a signal sent by the upper computer or the intermediate computer is obtained, a control signal for battery formation is generated based on the main control board and sent to the main circuit board;

[0022] forwarding the control signal to the side circuit board based on the main circuit board, so as to generate a driving signal based on the side circuit board and transmit the driving signal to the main circuit board;

[0023] The formation driving circuit is driven based on the driving signal to transmit the signal processed by the formation driving circuit to the battery device.

[0024] The present invention has at least the following beneficial effects:

[0025] The present invention provides a battery formation lower computer and a control method thereof, wherein the battery formation lower computer comprises: a main control board; a power board, comprising a main circuit board and a side circuit board, wherein the main circuit board is electrically connected to the main control board; a connecting assembly is provided between the main circuit board and the side circuit board, and is used to electrically connect the main circuit board and the side circuit board while the main circuit board and the side circuit board are detachably connected; and the side circuit board is located at the edge of the main circuit board and is at a preset angle to the main circuit board; a heat dissipation device comprises a radiator, the radiator is arranged on the main circuit board, and the side of the radiator is close to the side circuit board; the main circuit board has a first surface, and the projection of the radiator on the main circuit board is located on the first surface; and the projection area of ​​the radiator on the main circuit board is the first projection area, and the ratio of the first projection area to the area of ​​the first surface is between 0.6 and 1. The present invention separates the main control board and the power board so as to separate the low-power control signal and the high-power power signal, thereby reducing signal interference. At the same time, since the high-power power board is easy to heat up, separating the power board and the main control board can reduce the heat transfer of the power board to the main control board, so that the temperature of the main control board is stable and not easy to heat up, thereby improving the service life of the equipment. Furthermore, the present invention is designed on the structure of the power board. The detachable structural design of the main circuit board and the side circuit board reduces the difficulty of processing. The main circuit board and the side circuit board are independent of each other. If the parts on the side circuit board are damaged, it will not affect the parts on the main circuit board. The parts on the side circuit board can be replaced or the entire side circuit board can be replaced as needed, which greatly reduces the difficulty of maintenance. At the same time, the model size or function of the side circuit board can be replaced according to the needs of different scale battery formations, thereby improving the scope of application of the product. Furthermore, the present invention has also made improvements in the spatial design of the circuit board. The main circuit board and the side circuit board are at a preset angle, so that the space utilization rate of the entire device is improved, and the heat dissipation device is fully in contact with the power board, thereby improving the heat dissipation effect.

[0026] Further, the main circuit board is provided with a formation drive circuit, the formation drive circuit includes one or more of a capacitor and a switch circuit; the side circuit board is provided with a communication circuit, a collection circuit and a control circuit, and the communication circuit, the collection circuit and the control circuit are electrically connected to the formation drive circuit respectively. The present invention arranges a high-power formation drive circuit on the main circuit board, and arranges a low-power communication circuit, a collection circuit and a control circuit on the side circuit board, so that most of the circuit boards that generate heat are concentrated on the main circuit board, the radiator is arranged on the main circuit board, and the first projection area and the area ratio of the first surface are between 0.6-1, so that the main circuit board can fully dissipate heat, and the different circuit designs of the main circuit board and the side circuit board make the heat generated by the main circuit board and the side circuit board different, and by setting the position of the radiator, the heat dissipation effect of the power board is better, so that the reliability and service life of the power board as a whole are improved.

[0027] Furthermore, the side circuit board includes at least two drive boards, which are located on the same side of the main circuit board and are spaced apart along the edge of the main circuit board. The spaced apart drive boards provide a good gas flow channel, further improving the heat dissipation effect, thereby improving the safety and reliability of the device.

[0028] Furthermore, the preset angle is 90°, and the space utilization is effectively improved by vertically arranging the side circuit board and the main circuit board, so that the heat dissipation device can fully dissipate the heat of the main circuit board and the side circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0030] Figure 1 The overall schematic diagram of the battery formation slave computer provided by the present invention;

[0031] Figure 2 A schematic diagram of a main control board of a battery formation slave computer provided by the present invention;

[0032] Figure 3 A first schematic diagram of a power board and a heat dissipation device of a battery formation slave machine provided by the present invention;

[0033] Figure 4 A second schematic diagram of a power board and a heat sink of a battery formation slave machine provided by the present invention;

[0034] Figure 5 A third schematic diagram of a power board and a heat sink of a battery formation slave machine provided by the present invention;

[0035] Figure 6 A fourth schematic diagram of a power board and a heat sink of a battery formation slave machine provided by the present invention;

[0036] Figure 7 The present invention provides a flow chart of the control method.

[0037] Reference numerals:

[0038] 1- Main control board; 2- Power board; 3- Heat dissipation device; 4- Connection components;

[0039] 21-main circuit board; 22-side circuit board;

[0040] 211 - capacitor; 212 - input end; 213 - output end; 214 - first surface;

[0041] 221-driving board;

[0042] 31- Radiator;

[0043] 311- heat sink fins; 312- connecting heat pipes; 313- first side portion;

[0044] 11-micro control unit; 12-operational amplifier; 13-photoelectric isolator; 14-first acquisition module; 15-power module; 16-second acquisition module; 17-input interface; 18-output interface. DETAILED DESCRIPTION

[0045] Hereinafter, various embodiments of the present invention will be described more fully. The present invention may have various embodiments, and adjustments and changes may be made therein. However, it should be understood that there is no intention to limit the various embodiments of the present invention to the specific embodiments disclosed herein, but the present invention should be understood to cover all adjustments, equivalents and / or alternatives falling within the spirit and scope of the various embodiments of the present invention.

[0046] like Figure 1-7As shown, a battery formation lower machine includes: a main control board 1; a power board 2, including a main circuit board 21 and a side circuit board 22, the main circuit board 21 is electrically connected to the main control board 1; a connecting component 4 is provided between the main circuit board 21 and the side circuit board 22, which is used to electrically connect the main circuit board 21 and the side circuit board 22 while the main circuit board 21 and the side circuit board 22 are detachably connected; and the side circuit board 22 is located at the edge of the main circuit board 21 and is at a preset angle to the main circuit board 21; a heat dissipation device 3, including a radiator 31, the radiator 31 is arranged on the main circuit board 21, and the side of the radiator 31 is close to the side circuit board 22; the main circuit board 21 has a first surface 214, and the projection of the radiator 31 on the main circuit board 21 is located on the first surface 214; and the projection area of ​​the radiator 31 on the main circuit board 21 is the first projection area, and the ratio of the first projection area to the area of ​​the first surface 214 is between 0.6 and 1. The present invention separates the main control board 1 and the power board 2 so as to separate the low-power control signal and the high-power power signal, thereby reducing signal interference. At the same time, since the high-power power board 2 is easy to heat up, separating the power board 2 and the main control board 1 can reduce the heat transfer of the power board 2 to the main control board 1, so that the temperature of the main control board 1 is stable and not easy to heat up, thereby improving the service life of the device. At the same time, the power board 2 will generate a lot of heat when working, so the present application is provided with a heat dissipation device 3 on the power board 2 to dissipate the power board 2, thereby improving the service life of the entire device, and the structural design is more reasonable, so that the lower machine structure composed of the main control board 1, the power board 2 and the heat dissipation device 3 is more reliable. Furthermore, considering the difficulty of processing and the effect of heat dissipation, the present application has made improvements in the power board 2. Specifically, the difficulty of processing is reduced by the detachable structural design of the main circuit board 21 and the side circuit board 22, so as to facilitate subsequent maintenance, thereby improving stability, life and anti-interference ability; at the same time, the spatial utilization rate of the device is improved by the spatial design of the two at a preset angle α, so that the heat dissipation device 3 is fully in contact with the power board 2, thereby improving the heat dissipation effect.

[0047] Further, a battery formation control method, using the battery formation lower computer as described above, the control method includes: S1: if the signal sent by the upper computer or the middle computer is obtained, the control signal of the battery formation is generated based on the main control board, and sent to the main circuit board; S2: based on the main circuit board, the control signal is forwarded to the side circuit board to generate a drive signal based on the side circuit board and the drive signal is delivered to the main circuit board; S3: based on the drive signal, the formation drive circuit is driven to deliver the signal processed by the formation drive circuit to the battery device. Through the battery formation control method provided by the present application, the signal transmission between the lower computer main control board 1, the main circuit board 21 and the side circuit board 22 is realized, and finally the processed signal is delivered from the main circuit board 21 to the battery, so that the battery formation is stable and reliable.

[0048] Example 1

[0049] like Figure 1 , 5 As shown, a battery formation lower computer includes:

[0050] Main control board 1;

[0051] The power board 2 includes a main circuit board 21 and a side circuit board 22, wherein the main circuit board 21 is electrically connected to the main control board 1; a connecting component 4 is provided between the main circuit board 21 and the side circuit board 22, which is used to electrically connect the main circuit board 21 and the side circuit board 22 while the main circuit board 21 and the side circuit board 22 are detachably connected; and the side circuit board 22 is located at the edge of the main circuit board 21 and is at a preset angle to the main circuit board 21;

[0052] The heat dissipation device 3 includes a radiator 31, which is arranged on the main circuit board 21, and the side of the radiator 31 is close to the side circuit board 22; the main circuit board 21 has a first surface 214, and the projection of the radiator 31 on the main circuit board 21 is located on the first surface 214; and the projection area of ​​the radiator 31 on the main circuit board 21 is the first projection area, and the ratio of the first projection area to the area of ​​the first surface 214 is between 0.6 and 1.

[0053] The present invention separates the main control board 1 and the power board 2 to separate the low-power control signal and the high-power power signal, thereby reducing signal interference. At the same time, since the high-power power board 2 is prone to heat up, separating the power board 2 and the main control board 1 can reduce the heat transfer from the power board 2 to the main control board 1, so that the temperature of the main control board 1 is stable and not easy to heat up, thereby improving the service life of the equipment. At the same time, the power board 2 will generate a lot of heat when working. Therefore, the present application is provided with a heat dissipation device 3 on the power board 2 to dissipate the heat of the power board 2, thereby improving the service life of the entire device. The structural design is more reasonable, and the lower computer structure composed of the main control board 1, the power board 2 and the heat dissipation device 3 is more reliable.

[0054] Furthermore, taking into account the difficulty of processing and the effect of heat dissipation, the present application has made improvements in the power board 2. Specifically, the difficulty of processing is reduced through the detachable structural design of the main circuit board 21 and the side circuit board 22, which is convenient for subsequent maintenance, thereby improving stability, life and anti-interference ability; at the same time, the spatial utilization rate of the device is improved through the spatial design of the two at a preset angle α, so that the heat dissipation device 3 is in full contact with the power board 2, thereby improving the heat dissipation effect.

[0055] like Figure 5As shown, the main circuit board 21 has a formation drive circuit, and the formation drive circuit includes one or more of a capacitor 211 and a switch circuit; the side circuit board 22 has a communication circuit, a collection circuit and a control circuit, and the communication circuit, the collection circuit and the control circuit are electrically connected to the formation drive circuit respectively. The present invention arranges a high-power formation drive circuit on the main circuit board 21, and arranges a low-power communication circuit, a collection circuit and a control circuit on the side circuit board 22, so that most of the circuit boards that generate heat are concentrated on the main circuit board 21, and the radiator 31 is arranged on the main circuit board 21, and the first projection area and the area ratio of the first surface 214 are between 0.6-1, so that the main circuit board 21 can fully dissipate heat, and the different circuit designs of the main circuit board 21 and the side circuit board 22 make the heat generated by the main circuit board 21 and the side circuit board 22 different, and the heat dissipation effect of the power board 2 is better through the arrangement of the position of the radiator 31, so that the overall reliability and service life of the power board 2 are improved.

[0056] The side circuit board 22 includes at least two drive boards 221, each of which is provided with a communication circuit, a collection circuit and a control circuit; at least two drive boards 221 are located on the same side of the main circuit board 21 and are arranged at intervals along the edge of the main circuit board 21. The drive boards 221 arranged at intervals provide a good gas flow channel, further improving the heat dissipation effect, thereby improving the safety and reliability of the device.

[0057] In this embodiment, the formation drive circuit includes a plurality of capacitors 211, each driving board 221 is electrically connected with one or more capacitors 211, and is used to drive the capacitor 211 to absorb the peak voltage; by arranging the driving board 221 and the absorption capacitor 211 at two different positions, the space utilization rate of the whole device is improved; at the same time, the capacitor 211 absorbs the IGBT peak voltage, avoids the IGBT from being repeatedly impacted and broken down, thereby improving the service life of the IGBT, and further improving the durability of the whole device. Among them, at least two driving boards 221 include a first driving board 221 and a second driving board 221, the first driving board 221 and the second driving board 221 are both located on the same side of the main circuit board 21, and are arranged at intervals along the edge of the main circuit board 21. The first driving board 221 is electrically connected with one or more capacitors 211, and the second driving board 221 is also electrically connected with one or more capacitors 211, and the first driving board 221 and the second driving board 221 jointly drive the capacitor 211 of the main circuit board 21 to absorb the peak voltage. On the one hand, the two driving boards 221 can fully absorb the peak voltage and are economical to a certain extent; on the other hand, the two driving boards 221 are independent and separately arranged, which is also convenient for heat dissipation and more reasonable in space design.

[0058] like Figure 1 ,3 As shown in Figures 4, 5 and 6, the heat sink 31 has a first side portion 313, and the first side portion 313 is close to the side circuit board 22; the projection of the side circuit board 22 on the heat sink 31 is located at the first side portion 313; and the projection area of ​​the side circuit board 22 on the heat sink 31 is a second projection area, and the ratio of the second projection area to the area of ​​the first side portion 313 is 0.1-0.5.

[0059] The heat dissipation effect is related not only to the contact area between the heat sink and the circuit board, but also to the size of the circuit board itself. Since the heat generated by the side circuit board 22 is small, the volume of the side circuit board can be reduced to save costs, so that the ratio of the second projection area to the area of ​​the first side 313 is 0.1-0.5, which not only reduces the space occupied by the side circuit board but also has a certain heat dissipation effect, and the structural design of the side circuit board is more reasonable.

[0060] The side circuit board 22 has a second surface, which is close to the first side portion 313, and the area of ​​the second surface is smaller than the area of ​​the first surface 214. This is because the heat generated by the side circuit board 22 is smaller than the heat generated by the main circuit board 21, so the side circuit board 22 can be made smaller than the main circuit board 21.

[0061] like Figure 5 As shown, the preset angle α is between 70° and 90°. By setting the angle between the main circuit board 21 and the side circuit board 22 between 70° and 90°, the space utilization rate of the device is improved, and the heat dissipation device 3 is in full contact with the power board 2, thereby improving the heat dissipation effect.

[0062] Preferably, the preset angle α is 90°. The vertical arrangement of the side circuit board 22 and the main circuit board 21 effectively improves space utilization, so that the heat dissipation device 3 can fully dissipate heat for the main circuit board 21 and the side circuit board 22 .

[0063] like Figure 3 , 4 As shown, the heat sink 31 has a heat receiving portion, which contacts the first surface 214 and is used to receive the heat of the main circuit board 21; the area ratio of the heat receiving portion to the first surface 214 is between 0.2-1. By setting the area ratio of the heat receiving portion to the first surface 214 to between 0.2-1, the heat of the main circuit board 21 can be transferred to the heat sink in time, so as to be dissipated through the heat sink.

[0064] The heat receiving part and the main circuit board 21 can be fixed by welding or other methods.

[0065] The heat dissipation device 3 also includes at least one fan (not shown in the figure), which is arranged in an area close to the radiator 31; the radiator 31 includes a plurality of heat dissipation fins 311, and the plurality of heat dissipation fins 311 are arranged at intervals to form a plurality of heat dissipation channels, and the air outlet direction of the fan or the air suction direction of the fan is toward the heat dissipation channel.

[0066] The plurality of heat dissipation fins 311 can be stacked and spaced apart along the direction of the main circuit board 21 (eg, Figure 4 , 5 As shown), they can also be stacked and spaced along the direction of the side circuit board 22 (as shown Figure 3 , 6 shown).

[0067] In one embodiment, Figure 4 , 5 As shown, a plurality of heat sink fins 311 are stacked and spaced apart along the direction of the main circuit board 21, and the radiator 31 also includes a connecting heat pipe 312, which connects the plurality of heat sink fins 311, and at least a portion of the connecting heat pipe 312 contacts the main circuit board 21 to form a heat receiving portion, which is used to receive the heat of the main circuit board 21.

[0068] In another embodiment, Figure 3 As shown, a plurality of heat sink fins 311 are stacked and spaced apart along the direction of the side circuit board 22 , and the area where the plurality of heat sink fins 311 contact the main circuit board 21 forms a heat receiving portion, which is used to receive heat from the main circuit board 21 .

[0069] The heat dissipation fins 311 may be plate heat dissipation fins 311 or hollow heat dissipation fins 311 .

[0070] In one embodiment, Figure 3 , 6 As shown, the heat dissipation fins 311 are plate heat dissipation fins 311 , and heat dissipation channels are formed between adjacent plate heat dissipation fins 311 .

[0071] In another embodiment, Figure 4 As shown, the heat dissipation fins 311 are hollow heat dissipation fins 311; the heat dissipation channel includes a first heat dissipation channel and a second heat dissipation channel, and a first heat dissipation channel is formed between every two adjacent heat dissipation fins 311, and the first heat dissipation channel is convenient for dissipating heat to the side circuit board 22; a hollow structure is provided between each adjacent connecting heat pipe 312 to form a second heat dissipation channel through the hollow structure, and the second heat dissipation channel is convenient for dissipating heat to the main circuit board 21.

[0072] The fan may be one or more, preferably, the fan includes a first fan and a second fan, the first fan is arranged on the side of the radiator away from the side circuit board 22, and the air outlet direction or air intake direction of the first fan is toward the first heat dissipation channel; the second fan is arranged on the side of the radiator away from the main circuit board 21, and the air outlet direction or air intake direction of the second fan is toward the second heat dissipation channel. Through the joint action of the first fan, the second fan and the radiator, the heat and cold air are mixed, thereby achieving heat dissipation.

[0073] like Figure 2 As shown, the main control board 1 has a micro control unit 11, an operational amplifier 12, a photoelectric isolator 13 and a first acquisition module 14. The micro control unit 11, the operational amplifier 12, the photoelectric isolator 13 and the first acquisition module 14 are electrically connected in sequence, and the first acquisition module 14 is used to collect the voltage of the battery.

[0074] Among them, the microcontroller unit 11 is used to receive the signal from the intermediate computer or the host computer, and process it to generate a control signal. The operational amplifier 12 is used to amplify the amplitude of the input signal so that the weak signal can be amplified to an amplitude range suitable for subsequent circuit processing. The photoelectric isolator 13 is used to realize the transmission of electrical signals, realize the insulation isolation between input and output, and thus realize unidirectional signal transmission, which has the advantages of strong anti-interference and fast response speed.

[0075] like Figure 2 As shown, the main control board 1 also has a power module 15 and a second acquisition module 16. The power module 15 is provided with a switch for controlling the on and off of the power supply. The power module 15 is electrically connected to the micro control unit 11 for supplying power to the micro control unit 11; the second acquisition module 16 is electrically connected to the micro control unit 11 for collecting the temperature of the battery.

[0076] Specifically, the power module 15 has a voltage divider unit, which is used to divide the total voltage of the power module 15 into one or more voltages. For example, the total power supply is 12V, of which 3.38V is divided to power the microcontroller unit 11, and positive and negative 8V are divided to power the image.

[0077] Among them, Figure 5 As shown, the connection component 4 includes one or more of a plug-in component, a socket component, and a snap-on component.

[0078] In this embodiment, the connecting component 4 is a plug-in component, which specifically includes a plurality of pins and a plurality of sockets. The plurality of pins are arranged on the driving board 221 and are arranged in an array on the driving board 221; the plurality of sockets are arranged on the main circuit board 21 and are arranged in an array on the main circuit board 21; the plurality of pins and the plurality of sockets correspond one to one, and are used to realize electrical connection while realizing mechanical connection, thereby realizing signal transmission.

[0079] Among them, the multiple pins include multiple input pins and multiple output pins, the jacks include multiple input jacks and multiple output jacks, the multiple input pins and the multiple output pins are all located on the same side of the driving board 221, the multiple input jacks and the multiple output jacks are all located on the same side of the main circuit board 21, the multiple input jacks correspond one-to-one to the multiple input pins, and are used to realize the signal transmission from the main circuit board 21 to the side circuit board 22; the multiple output jacks correspond one-to-one to the multiple output pins, and are used to realize the signal transmission from the side circuit board 22 to the main circuit board 21.

[0080] The number of output pins is the same as the number of input pins.

[0081] The present invention realizes the plug-in connection of the main circuit board 21 and the side circuit board 22 through the connecting component 4, thereby realizing the signal transmission of the main circuit board 21 and the side circuit board 22; at the same time, the plug-in method can facilitate the replacement of the main circuit board 21 or the side circuit board 22, facilitate maintenance, and also improve the stability of the product and extend the service life.

[0082] Example 2

[0083] like Figure 7 As shown, a battery formation control method uses the battery formation slave computer as described above, and the control method includes:

[0084] S1: If a signal from the host computer or the intermediate computer is obtained, a control signal for battery formation is generated based on the main control board and sent to the main circuit board;

[0085] S2: forwarding the control signal to the side circuit board based on the main circuit board, so as to generate a driving signal based on the side circuit board and transmit the driving signal to the main circuit board;

[0086] S3: driving the formation driving circuit based on the driving signal to transmit the signal processed by the formation driving circuit to the battery device.

[0087] Through the battery formation control method provided by the present application, the signal transmission between the lower computer main control board 1, the main circuit board 21 and the side circuit board 22 is realized, and finally the processed signal is transmitted from the main circuit board 21 to the battery, so that the battery formation is carried out stably and reliably. Among them, the control signal of the main control board 1 can be a signal for starting or shutting down the control power supply or a signal for opening or closing the control valve body, etc.

[0088] In various embodiments of the present invention, the expression "or" or "at least one of A or / and B" includes any combination or all combinations of the words listed at the same time. For example, the expression "A or B" or "at least one of A or / and B" may include A, may include B, or may include both A and B.

[0089] The expressions (such as "first", "second", etc.) used in various embodiments of the present invention may modify the various constituent elements in various embodiments, but may not limit the corresponding constituent elements. For example, the above expressions do not limit the order and / or importance of the elements. The above expressions are only used for the purpose of distinguishing an element from other elements. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, without departing from the scope of various embodiments of the present invention, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

[0090] It should be noted that in the present invention, unless otherwise clearly specified and defined, the terms such as "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0091] In the present invention, those skilled in the art need to understand that the terms indicating orientation or positional relationship herein are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0092] The terms used in various embodiments of the present invention are only used for the purpose of describing specific embodiments and are not intended to limit various embodiments of the present invention. As used herein, the singular form is intended to also include the plural form, unless the context clearly indicates otherwise. Unless otherwise limited, all terms used here (including technical terms and scientific terms) have the same meaning as the meaning generally understood by those of ordinary skill in the art to which the various embodiments of the present invention belong. The terms (such as the terms defined in the dictionary generally used) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning, unless clearly defined in various embodiments of the present invention.

Claims

1. A battery formation slave computer, characterized in that: include: Main control board; A power board, comprising a main circuit board and a side circuit board, wherein the main circuit board is electrically connected to the main control board; a connecting component is provided between the main circuit board and the side circuit board, and is used to electrically connect the main circuit board and the side circuit board while the main circuit board and the side circuit board are detachably connected; and the side circuit board is located at an edge of the main circuit board and is at a preset angle to the main circuit board; A heat dissipation device, comprising a heat sink, wherein the heat sink is disposed on the main circuit board, and a side of the heat sink is close to the side circuit board; The main circuit board has a first surface, and the projection of the heat sink on the main circuit board is located on the first surface; and the projection area of ​​the heat sink on the main circuit board is a first projection area, and the ratio of the first projection area to the area of ​​the first surface is between 0.6-1.

2. The battery formation slave machine according to claim 1, characterized in that: The main circuit board is provided with a formation drive circuit, and the formation drive circuit includes one or more of a capacitor and a switch circuit; The side circuit board is provided with a communication circuit, a collection circuit and a control circuit, and the communication circuit, the collection circuit and the control circuit are electrically connected to the formation drive circuit respectively.

3. The battery formation slave machine according to claim 2, characterized in that: The side circuit board includes at least two driving boards, each of which is correspondingly provided with the communication circuit, the acquisition circuit and the control circuit; at least two driving boards are located on the same side of the main circuit board and are spaced apart along the edge of the main circuit board.

4. The battery formation slave machine according to claim 1, characterized in that: The radiator has a first side portion, which is close to the side circuit board; the projection of the side circuit board on the radiator is located on the first side portion; and the projection area of ​​the side circuit board on the radiator is a second projection area, and the ratio of the second projection area to the area of ​​the first side portion is 0.1-0.

5.

5. The battery formation slave machine according to claim 2, characterized in that: The preset angle is 90°.

6. The battery formation slave machine according to claim 3, characterized in that: The heat sink has a heat receiving portion, which is in contact with the first surface and is used to receive heat from the main circuit board; the area ratio of the heat receiving portion to the first surface is between 0.2-1.

7. The battery formation slave machine according to claim 1, characterized in that: The heat dissipation device further comprises at least one fan, wherein the fan is arranged in a region close to the heat sink; The radiator comprises a plurality of radiating fins, the plurality of radiating fins are arranged at intervals to form a plurality of radiating channels, and the air outlet direction of the fan or the air suction direction of the fan is toward the radiating channels.

8. The battery formation slave machine according to claim 1, characterized in that: The main control board is provided with a microcontroller unit, an operational amplifier, a photoelectric isolator and a first acquisition module. The microcontroller unit, the operational amplifier, the photoelectric isolator and the first acquisition module are electrically connected in sequence. The first acquisition module is used for acquiring the voltage of the battery.

9. The battery formation slave machine according to claim 8, characterized in that: The main control board also has a power module and a second acquisition module. The power module is provided with a switch for controlling the on and off of the power supply. The power module is electrically connected to the micro control unit to supply power to the micro control unit. The second acquisition module is electrically connected to the micro control unit and is used to acquire the temperature of the battery.

10. A battery formation control method, using the battery formation slave computer according to any one of claims 2 to 9, characterized in that: The control method comprises: If a signal sent by the upper computer or the intermediate computer is obtained, a control signal for battery formation is generated based on the main control board and sent to the main circuit board; forwarding the control signal to the side circuit board based on the main circuit board, so as to generate a driving signal based on the side circuit board and transmit the driving signal to the main circuit board; The formation driving circuit is driven based on the driving signal to transmit the signal processed by the formation driving circuit to the battery device.

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