Manufacturing method of camera module and camera module

Abstract

A manufacturing method of a camera module comprises the steps that a circuit board is provided and comprises a middle area and a turnover area, and the turnover area is connected with the middle area; the surface of the middle area is connected with a camera; the surface of the folding area is connected with a light source and a light source sensor, the light source, the light source sensor and the camera are located on the same surface of the circuit board, and the light source sensor is used for detecting light intensity; the turnover area is turned over, so that the turnover area is arranged around the camera in a surrounding mode; the circuit board is connected with at least one chip, and the chip is used for receiving and analyzing the detection result of the light source sensor on the light intensity and controlling the on-off of the light source according to the analysis result; a packaging plate is adopted to package the turnover area, the packaging plate and the folded circuit board jointly define a cavity, and the light source, the light source sensor and the camera are contained in the cavity. The invention further provides a camera module.

Description

Technical Field

[0001] The present application relates to the field of cameras, and in particular to a method for manufacturing a camera module and a camera module. Background Art

[0002] Electronic products with camera functions (such as mobile phones) use multiple cameras with different functions to share a flash. When using the camera function, the images may not be clear due to environmental factors. For example, when the light is too dark, it is difficult to take a clear picture of a distant image; when shooting against the light, the contrast is too large, resulting in unclear images. Summary of the invention

[0003] In view of this, it is necessary to provide a method for manufacturing a camera module that can take clear pictures and a camera module.

[0004] A method for manufacturing a camera module comprises: providing a circuit board, comprising a middle area and a folding area, wherein the folding area is connected to the middle area; connecting a camera to the surface of the middle area; connecting a light source and a light source sensor to the surface of the folding area, wherein the light source, the light source sensor and the camera are located on the same surface of the circuit board, and the light source sensor is used to detect light intensity; folding the folding area so that the folding area is surrounded by the camera; connecting at least one chip on the circuit board, wherein the chip is used to receive the light intensity detection result of the light source sensor for analysis and control the switching of the light source according to the analysis result; and encapsulating the folding area with a packaging board, wherein the packaging board and the folded circuit board are jointly surrounded to form a cavity, and the light source, the light source sensor and the camera are accommodated in the cavity.

[0005] In some embodiments, before the step of connecting the camera to the middle area, the manufacturing method further includes: connecting an anti-shake portion to the surface of the middle area; and connecting the camera to a surface of the anti-shake portion facing away from the middle area.

[0006] In some embodiments, the anti-shake part includes a shell, five spiral columns, a top cover and a magnet. The spiral columns, the top cover and the magnet are accommodated in the shell, and the two ends of each spiral column are respectively connected to the shell and the magnet so that the magnet can be movably connected relative to the shell; the shell is connected to the middle area, and the top cover is connected to the magnet and the camera.

[0007] In some embodiments, after the folding area is folded, the manufacturing method further comprises: bonding the folding area and / or the middle area with a packaging adhesive; conductive particles are dispersed in the packaging adhesive.

[0008] In some embodiments, the cavity is evacuated.

[0009] A camera module includes a circuit board, a packaging board, a camera, a light source, a light source sensor and a chip. The circuit board includes a middle area and a folding area, the folding area is located on the same side of the middle area and surrounds the middle area; the packaging board is packaged on the side of the folding area away from the middle area, and the packaging board and the circuit board are jointly surrounded to form a cavity; the camera is connected to the middle area and accommodated in the cavity; the light source and the light source sensor are both connected to the folding area and accommodated in the cavity, and the light source sensor is used to detect light intensity; the chip is connected to the circuit board, and the chip is used to receive the light intensity detection result of the light source sensor for analysis and control the switch of the light source according to the analysis result.

[0010] In some embodiments, the camera module further includes an anti-shake portion, which is disposed between the middle area and the camera.

[0011] In some embodiments, the anti-shake part includes a shell, five spiral columns, a top cover and a magnet. The spiral columns, the top cover and the magnet are accommodated in the shell, and the two ends of each spiral column are respectively connected to the shell and the magnet so that the magnet can be movably connected relative to the shell; the shell is connected to the middle area, and the top cover is connected to the magnet and the camera.

[0012] In some embodiments, the camera module further includes a packaging adhesive, the packaging adhesive bonds the folded area and / or the middle area; and conductive particles are dispersed in the packaging adhesive.

[0013] In some embodiments, there is a negative pressure in the cavity.

[0014] When the camera module provided in the embodiment of the present application is used in an electronic product, a light source and a light source sensor can be set in each area adjacent to the camera to perform appropriate light compensation for the function of the corresponding camera according to the actual light conditions, thereby making the camera module take clear pictures. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic cross-sectional view of a first circuit substrate and a second circuit substrate provided in an embodiment of the present application.

[0016] Figure 2 A schematic top view of the structure of the first circuit substrate provided in an embodiment of the present application.

[0017] Figure 3 For connection Figure 1 The cross-sectional schematic diagram of the circuit board obtained after the first circuit substrate and the second circuit substrate are shown.

[0018] Figure 4 For Figure 3 The schematic cross-sectional view of the first circuit substrate after the anti-shake unit, the light source and the light source sensor are connected is shown.

[0019] Figure 5 for Figure 4 The structural schematic diagram of the anti-shake unit is shown.

[0020] Figure 6 For Figure 4 The cross-sectional diagram of the anti-shake unit after being connected to the camera is shown.

[0021] Figure 7 For folding Figure 6 The first circuit substrate shown is a cross-sectional schematic diagram in which the first circuit substrate is arranged behind the camera.

[0022] Figure 8 For Figure 7 The cross-sectional view of the circuit board shown is a schematic diagram showing multiple chips connected to the circuit board.

[0023] Fig. 9 For packaging board packaging Figure 8 The cross-sectional schematic diagram of the camera module obtained after the first circuit substrate is folded is shown.

[0024] Main component symbols

[0025]

[0026] DETAILED DESCRIPTION

[0027] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the present application is described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other. In the following description, many specific details are set forth to facilitate a full understanding of the present application, and the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in the specification of this article are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes all and any combination of one or more related listed items.

[0029] In the embodiments of the present application, for the convenience of description and not to limit the present application, the term "connection" used in the patent application specification and claims of the present application is not limited to physical or mechanical connection, whether direct or indirect. "Up", "down", "above", "below", "left", "right", etc. are only used to indicate relative position relationship. When the absolute position of the described object changes, the relative position relationship also changes accordingly.

[0030] See also Figures 1 to 9 The present application embodiment provides a method for manufacturing a camera module 100, which may include the following steps:

[0031] Step S1: Please refer to Figure 1 , providing a first circuit substrate 11 and a second circuit substrate 13 , the first circuit substrate 11 includes a middle area 111 and a folding area 113 , the folding area 113 is connected to the middle area 111 ; the second circuit substrate 13 includes a connecting area 132 and an extending area 134 .

[0032] The first circuit substrate 11 includes a first dielectric layer 115, a first circuit layer 117 and a copper layer 119. The number of layers of the first dielectric layer 115 and the first circuit layer 117 can be one layer or more. The first dielectric layer 115 and the first circuit layer 117 are stacked, and the copper layer 119 is located on one surface of the first dielectric layer 115. The copper layer 119 and the first circuit layer 117 are spaced apart, and the copper layer 119 is located in the folding area 113 and extends to the middle area 111.

[0033] The material of the first dielectric layer 115 can be selected from one of flexible materials such as polyimide (PI), liquid crystal polymer (LCP) and modified polyimide (MPI), so that the first circuit substrate 11 can be bent in subsequent processes.

[0034] The number of the folding area 113 can be one or more, and the folding area 113 can be folded relative to the middle area 111, and the folding area 113 and the middle area 111 can form an open-covered cube or an open-covered rectangular parallelepiped after being folded. Figure 2 , are several possible implementations of the first circuit substrate 11, and the first circuit substrate 11 can be folded along the dotted line in the figure. The structural schematic diagram of the first circuit substrate 11 in this embodiment is as follows Figure 2 In (a), there are four folding areas 113 , and the four folding areas 113 are arranged around the middle area 111 . The four folding areas 113 and the middle area 111 form a “cross” structure.

[0035] The number of the extension area 134 may be one or more. The extension area 134 may be located around the connection area 132 or on both sides of the connection area 132, which is not limited here.

[0036] Please refer again Figure 1The second circuit substrate 13 includes a second dielectric layer 136 and a second circuit layer 138 . The second dielectric layer 136 and the second circuit layer 138 may have one layer or more layers. The second dielectric layer 136 and the second circuit layer 138 are stacked.

[0037] The second dielectric layer 136 can be selected from one of flexible materials such as PI, LCP and MPI, or can be selected from one of hard materials such as polypropylene (PP) and polytetrafluoroethylene (PTFE).

[0038] Step S2: Please refer to Figure 3 , connecting the middle area 111 and the connecting area 132.

[0039] The middle area 111 and the connection area 132 may be connected by a conductive adhesive 139 , so that the first circuit substrate 11 is electrically connected to the second circuit substrate 13 . The first circuit substrate 11 and the second circuit substrate 13 together form the circuit board 10 .

[0040] After the connection area 132 is connected to the middle area 111 , the circuit layer located in the connection area 132 and the middle area 111 can also play a certain reinforcement role.

[0041] Step S3: Please refer to Figure 4 The anti-shake unit 20 is connected to the surface of the middle area 111 away from the second circuit substrate 13 , and the light source 30 and the light source sensor 35 are connected to the surface of the folding area 113 away from the second circuit substrate 13 .

[0042] The number of the anti-shake unit 20 can be one or more. In this embodiment, the number of the anti-shake unit 20 is two. The anti-shake unit 20 can be manufactured using 3D printing technology. Figure 5 Each anti-shake unit 20 may include a housing 21, five spiral pillars 23, a magnet 25, and a top cover 27. The spiral pillars 23, the magnet 25, and the top cover 27 are accommodated in the housing 21, and the two ends of each spiral pillar 23 are respectively connected to the housing 21 and the magnet 25, so that the magnet 25 is movably connected relative to the housing 21. The housing 21 is connected to the middle area 111, and the top cover 27 is connected to the side of the magnet 25 away from the housing 21.

[0043] Specifically, the housing 21 is a cube with an open cover, such as a rectangular parallelepiped or a cube. The housing 21 includes a bottom plate 214 and four side plates 212. The four side plates 212 are arranged around the bottom plate 214 and are located on the same side of the bottom plate 214. The four side plates 212 and the bottom plate 214 together form a hollow cube with an open cover. Five spiral columns 23 and magnets 25 are accommodated in the housing 21, wherein one end of the four spiral columns 23 is connected to one of the side plates 212 and the other end is connected to the magnet 25, and one end of one of the spiral columns 23 is connected to the bottom plate 214 and the other end is connected to the magnet 25. The top cover 27 is connected to the side of the magnet 25 away from the bottom plate 214. The bottom plate 214 is connected to the middle area 111.

[0044] The housing 21 may also be provided with a circuit layer (not shown) electrically connected to the spiral pillar 23. The spiral pillar 23 may be energized through the circuit layer, and a first magnetic field may be generated during the energization process. The magnet 25 itself may generate a second magnetic field. The first magnetic field and the second magnetic field may interact with each other to adjust the position of the magnet 25 and thus the position of the top cover 27.

[0045] The material of the spiral column 23 can be metal or alloy, such as gold, silver, copper, iron or alloys thereof. The shape of the spiral column 23 is not limited to circular, square, polygonal, etc. The magnet 25 can include materials such as neodymium iron boron, ferroferric oxide, ferrite, etc.

[0046] In this embodiment, the light source 30 and the light source sensor 35 are respectively disposed on the two folding areas 113. The light source sensor 35 has the function of detecting the intensity of light.

[0047] Step S4: Please refer to Figure 6 , a camera 40 is connected to the anti-shake unit 20.

[0048] The camera 40 is connected to the top cover 27 so that the camera 40 is dynamically connected to the circuit board 10 through the anti-shake unit 20. The camera 40 can move synchronously with the top cover 27 to dynamically adjust the position of the camera 40, so that the anti-shake unit 20 plays an anti-shake function.

[0049] Step S5: Please refer to Figure 7 , the folding area 113 is folded so that the folding area 113 is arranged around the camera 40.

[0050] The folded folded area 113 and the middle area 111 form an open cube, in which the camera 40 is accommodated. The light source 30 and the light source sensor 35 disposed in the folded area 113 are disposed toward the camera 40 .

[0051] After the folding area 113 is folded, the copper layer 119 is arranged around and at the bottom of the camera 40. The copper layer 119 can play a certain shielding role without the need for an additional metal shell for shielding; and the copper layer 119 also has a certain heat dissipation effect.

[0052] Step S6: Please refer to Figure 8 , chips are connected on the first circuit substrate 11 and / or the second circuit substrate 13 .

[0053] The number of chips can be one or more. In this embodiment, the chip includes a first chip 51, a second chip 52 and a third chip 53. The first chip 51 and the second chip 52 are both connected to the extension area 134 and are located on opposite sides of the extension area 134. The third chip 53 is connected to the side of the connection area 132 away from the first circuit substrate 11. The first chip 51 is used to receive the detection result of the light intensity by the light source sensor 35 for analysis, and transmit the analysis result to the second chip 52; the second chip 52 controls the switch of the light source 30 according to the analysis result; the third chip 53 is used to control the brightness of the light source 30 for precise fill light. In some embodiments, the functions of the first chip 51 and the second chip 52 can also be integrated into one chip, and the functions of the first chip 51, the second chip 52 and the third chip 53 can also be integrated into one chip.

[0054] Step S7: Please refer to Fig. 9 The packaging board 60 is used to package the folded area 113. The packaging board 60 and the folded first circuit substrate 11 are jointly arranged to form a cavity 65. The light source 30, the light source sensor 35 and the camera 40 are accommodated in the cavity 65, thereby obtaining a camera module 100.

[0055] The packaging board 60 is located on the side of the camera 40 away from the second circuit substrate 13, and is connected to the folded area 113, thereby forming a sealed cavity 65 with the first circuit substrate 11. The packaging board 60 is made of transparent material, such as glass, acrylic board or resin.

[0056] In some embodiments, a packaging glue (not shown) is further used to bond the folded area 113 and / or the middle area 111, and the cavity 65 is evacuated to remove at least part of the air in the cavity 65, so that a negative pressure is formed in the cavity 65. On the one hand, when the air is removed, the water vapor in the air is also removed, which reduces the influence of the water vapor on the camera 40, thereby reducing the aging speed of the camera 40; on the other hand, it can isolate the camera 40 from damage by foreign objects (such as dust, particles, etc.).

[0057] In some embodiments, conductive particles are dispersed in the packaging glue to further play a shielding role.

[0058] Please refer again Fig. 9 The present application also provides a camera module 100, which can be manufactured by the above manufacturing method. The camera module 100 includes a circuit board 10, a packaging board 60, a camera 40, a light source 30, a light source sensor 35 and a chip. The circuit board 10 and the packaging board 60 form a cavity 65, the camera 40, the light source 30, and the light source sensor 35 are accommodated in the cavity 65, and the chip is connected to the circuit board 10. Among them, the light source 30 and the light source sensor 35 are accommodated in the same cavity 65, the light source sensor 35 can detect the light environment of the camera 40 at a close distance, and the light source 30 can also perform light compensation for the camera 40 at a close distance.

[0059] In this embodiment, the circuit board 10 may include a first circuit substrate 11 and a second circuit substrate 13. The first circuit substrate 11 is a flexible substrate, and the second circuit substrate 13 may be a flexible substrate or a hard substrate.

[0060] The first circuit substrate 11 includes a middle area 111 and a folding area 113 . The folding area 113 is located on the same side of the middle area 111 and surrounds the middle area 111 . The packaging plate 60 is packaged on the side of the folding area 113 away from the middle area 111 , thereby forming a cavity 65 together with the first circuit substrate 11 .

[0061] The second circuit substrate 13 includes a connection area 132 and an extension area 134 , and the extension area 134 is located at two sides of the connection area 132 . The connection area 132 and the middle area 111 may be electrically connected through a conductive adhesive 139 .

[0062] The first circuit substrate 11 includes a first dielectric layer 115, a first circuit layer 117 and a copper layer 119. The first dielectric layer 115 and the first circuit layer 117 are stacked, and the copper layer 119 is located on the side of the first dielectric layer 115 away from the cavity 65. The copper layer 119 and the first circuit layer 117 are spaced apart. The copper layer 119 is located in the folding area 113 and extends to the middle area 111. The copper layer 119 is used to play a certain shielding role and can also have a certain heat dissipation effect.

[0063] The camera module 100 may further include a packaging glue, which is located at the connection between the middle area 111 and the folding area 113, and is used to connect the middle area 111 and / or the folding area 113. The packaging glue may also include conductive particles, which can further play a shielding role.

[0064] In other embodiments, the structure of the circuit board 10 is not limited to the first circuit substrate 11 and the second circuit substrate 13 .

[0065] The light source 30 and the light source sensor 35 are both electrically connected to the circuit board 10. The light source sensor 35 is used to detect the light intensity and transmit the detection result to the chip through the circuit board 10. The chip analyzes the detection result and controls the switch of the light source 30 according to the analysis result, and can also control the brightness of the light source 30.

[0066] In this embodiment, the chip includes a first chip 51, a second chip 52 and a third chip 53. The first chip 51 and the second chip 52 are both connected to the extension area 134 and are located on opposite sides of the extension area 134. The third chip 53 is connected to the side of the connection area 132 away from the first circuit substrate 11. The first chip 51 is used to receive the detection result of the light intensity by the light source sensor 35 for analysis, and transmit the analysis result to the second chip 52; the second chip 52 controls the switch of the light source 30 according to the analysis result; the third chip 53 is used to control the brightness of the light source 30 for accurate fill light. In other embodiments, the functions of the first chip 51 and / or the second chip 52 and / or the third chip 53 can also be integrated.

[0067] In some embodiments, the camera module 100 further includes an anti-shake unit 20 , which is disposed between the middle portion and the camera 40 to provide an anti-shake function.

[0068] When the camera module 100 provided in the embodiment of the present application is applied to an electronic product (not shown), a light source 30 and a light source sensor 35 can be set in each area adjacent to the camera 40 to perform appropriate light compensation for the function of the corresponding camera 40 according to the actual light conditions, thereby allowing the camera module 100 to capture clear images.

[0069] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A method for manufacturing a camera module, characterized in that: include: Providing a circuit board, comprising a middle area and a folding area, wherein the folding area is connected to the middle area; Connecting a camera to the surface of the middle area; A light source and a light source sensor are connected to the surface of the folding area, the light source, the light source sensor and the camera are located on the same surface of the circuit board, and the light source sensor is used to detect light intensity; Folding the folding area so that the folding area is arranged around the camera; At least one chip is connected to the circuit board, and the chip is used to receive the detection result of the light intensity by the light source sensor, analyze it, and control the switch of the light source according to the analysis result; as well as The folded area is packaged with a packaging plate, and the packaging plate and the folded circuit board are together arranged to form a cavity, and the light source, the light source sensor and the camera are accommodated in the cavity.

2. The method for manufacturing a camera module according to claim 1, characterized in that: Before the step of connecting the camera to the middle area, the manufacturing method further includes: An anti-shake portion is connected to the surface of the middle area; The camera is connected to a surface of the anti-shake portion facing away from the middle area.

3. The method for manufacturing a camera module according to claim 2, characterized in that: The anti-shake part includes a shell, five spiral columns, a top cover and a magnet. The spiral columns, the top cover and the magnet are accommodated in the shell, and both ends of each spiral column are respectively connected to the shell and the magnet so that the magnet can be movably connected relative to the shell; the shell is connected to the middle area, and the top cover is connected to the magnet and the camera.

4. The method for manufacturing a camera module according to any one of claims 1 to 3, characterized in that: After the folding area is folded, the manufacturing method further comprises: The folded area and / or the middle area are bonded with packaging glue; conductive particles are dispersed in the packaging glue.

5. The method for manufacturing a camera module according to claim 4, characterized in that: The cavity is subjected to a vacuum treatment.

6. A camera module, characterized in that: include: A circuit board comprises a middle area and a folding area, wherein the folding area is located on the same side of the middle area and surrounds the middle area; A packaging plate, packaged on a side of the folded area away from the middle area, the packaging plate and the circuit board are jointly arranged to form a cavity; A camera connected to the middle area and accommodated in the cavity; light source; A light source sensor, wherein the light source and the light source sensor are both connected to the folding area and accommodated in the cavity, and the light source sensor is used to detect light intensity; as well as A chip is connected to the circuit board, and the chip is used to receive the detection result of the light intensity by the light source sensor, analyze it, and control the switch of the light source according to the analysis result.

7. The camera module according to claim 6, characterized in that: The camera module also includes an anti-shake unit, which is arranged between the middle area and the camera.

8. The camera module according to claim 7, characterized in that: The anti-shake part includes a shell, five spiral columns, a top cover and a magnet. The spiral columns, the top cover and the magnet are accommodated in the shell, and both ends of each spiral column are respectively connected to the shell and the magnet so that the magnet can be movably connected relative to the shell; the shell is connected to the middle area, and the top cover is connected to the magnet and the camera.

9. The camera module according to any one of claims 6 to 8, characterized in that: The camera module further comprises a packaging adhesive, wherein the packaging adhesive bonds the folded area and / or the middle area; conductive particles are dispersed in the packaging adhesive.

10. The camera module according to any one of claims 6 to 8, characterized in that: The cavity is under negative pressure.

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