Passive wireless temperature measurement system and temperature measurement method

Abstract

The invention discloses a passive wireless temperature measurement system and method, and the system comprises a terminal and a passive temperature measurement assembly, the passive temperature measurement assembly comprises a substrate, a heat conduction pedestal disposed on the lower surface of the substrate, a surface acoustic wave resonator disposed on the upper surface of the substrate, and a planar antenna disposed above the substrate, the heat conduction base is used for being in contact with a component to be subjected to temperature measurement, the heat conduction base is in heat conduction connection with the surface acoustic wave resonator, the surface acoustic wave resonator is electrically connected with the panel antenna, and the panel antenna is used for receiving an excitation radio frequency signal; the surface acoustic wave resonator is used for responding to the excitation radio frequency signal and generating a frequency signal containing temperature information, and the panel antenna is also used for sending the frequency signal containing the temperature information to the terminal; and the terminal is used for analyzing the temperature of the component to be subjected to temperature measurement according to the frequency signal containing the temperature information. The invention aims to solve the problems of large temperature measurement error and low temperature monitoring efficiency.

Description

Technical Field

[0001] The invention belongs to the technical field of temperature measurement of electric power equipment, and in particular relates to a passive wireless temperature measurement system and a temperature measurement method. Background Art

[0002] In the modern industrial system, key areas such as electricity and metallurgy have put forward high standards for the stability and safety of equipment operation. As one of the core elements to ensure the efficient and safe operation of these systems, the importance of temperature monitoring technology has become increasingly prominent. Especially in complex and changing industrial environments, the operating status of power equipment is often directly related to changes in its internal temperature, especially cable temperature, which is an important indicator of the health status of the equipment and the potential risk of failure.

[0003] Traditional temperature monitoring methods, such as handheld infrared thermometers, can measure the temperature of equipment to a certain extent, but they have certain limitations. First, infrared temperature measurement technology relies on the infrared energy radiated by the surface of the object. Therefore, when facing a bright or polished metal surface, the accuracy of the temperature measurement result will be affected due to the strong reflection effect, resulting in an increase in measurement error. Secondly, handheld temperature measurement requires regular manual inspections, which not only increases labor costs, but also makes it difficult to ensure real-time monitoring of equipment temperature, especially in harsh environments with high temperature, high pressure or toxic and harmful substances. Personnel safety is difficult to guarantee and monitoring efficiency is low. More importantly, in modern power systems, a large number of high-voltage cables are densely arranged inside the electrical cabinet. These cables are often blocked by various components, making it difficult for traditional infrared temperature measurement technology to directly reach and accurately measure their temperature. Once the cable temperature rises due to overload, poor contact, etc., and is not discovered and handled in time, it may quickly cause serious consequences such as insulation damage and short circuit, which will not only affect the normal operation of the equipment, but also cause catastrophic damage to the entire power system. Summary of the invention

[0004] In view of the problems existing in the prior art, the present invention provides a passive wireless temperature measurement system and a temperature measurement method, which aims to solve the problems of large temperature measurement error and low temperature monitoring efficiency.

[0005] In order to solve the above technical problems, the present invention is implemented by the following technical solutions: According to a first aspect of the present invention, a passive wireless temperature measurement system is provided, comprising a terminal and a passive temperature measurement component, wherein the passive temperature measurement component comprises a substrate, a heat-conducting base arranged on the lower surface of the substrate, a surface acoustic wave resonator arranged on the upper surface of the substrate, and a planar antenna arranged above the substrate, wherein the heat-conducting base is used to contact a component to be temperature-measured, the heat-conducting base is thermally connected to the surface acoustic wave resonator, the surface acoustic wave resonator is electrically connected to the planar antenna, the planar antenna is used to receive an excitation radio frequency signal, the surface acoustic wave resonator is used to respond to the excitation radio frequency signal and generate a frequency signal containing temperature information, and the planar antenna is also used to send the frequency signal containing temperature information to the terminal; the terminal is used to parse the temperature of the component to be temperature-measured according to the frequency signal containing temperature information.

[0006] In a possible implementation of the first aspect, the terminal includes a transceiver antenna, an excitation RF signal generating module electrically connected to the transceiver antenna, and a frequency signal analysis module electrically connected to the transceiver antenna, the excitation RF signal generating module is used to generate an excitation RF signal, and the transceiver antenna is used to send the excitation RF signal to the flat antenna; the transceiver antenna is also used to receive the frequency signal containing temperature information, and the frequency signal analysis module is used to analyze the temperature of the component to be measured according to the frequency signal containing temperature information.

[0007] In a possible implementation manner of the first aspect, the flat panel antenna has the same frequency as the transceiver antenna.

[0008] In a possible implementation manner of the first aspect, parsing the temperature of the component to be temperature-measured according to the frequency signal containing the temperature information is specifically: The preset frequency-temperature characteristic database is traversed to find the temperature corresponding to the frequency matching the frequency signal containing temperature information, which is the temperature of the component to be measured.

[0009] In a possible implementation manner of the first aspect, the passive temperature measurement component further includes a winding inductor, which is disposed on the substrate, one end of the winding inductor is electrically connected to the surface acoustic wave resonator, and the other end of the winding inductor is grounded.

[0010] In a possible implementation of the first aspect, a plurality of through holes are formed through the upper and lower surfaces of the substrate between the thermally conductive base and the surface acoustic wave resonator, and a thermally conductive material passing through the through holes is used to achieve a thermal conduction connection between the thermally conductive base and the surface acoustic wave resonator.

[0011] In a possible implementation manner of the first aspect, the flat panel antenna is arranged in parallel and directly above the substrate, and a distance between a lower surface of the flat panel antenna and an upper surface of the substrate is 2.3 mm to 2.7 mm.

[0012] In a possible implementation manner of the first aspect, a plug board is provided on a side of the flat antenna, a plug hole corresponding to the plug board is opened on the substrate, and the plug board is plugged into the plug hole.

[0013] In a possible implementation manner of the first aspect, a groove is formed downward on an upper end surface of the thermally conductive base, and the thermally conductive base is in a U-shaped block shape.

[0014] According to a second aspect of the present invention, a passive wireless temperature measurement method is provided. Using the passive wireless temperature measurement system, the temperature measurement method includes: Making the thermally conductive base contact with the component to be temperature measured; The flat panel antenna receives an excitation radio frequency signal; The surface acoustic wave resonator responds to the excitation radio frequency signal and generates a frequency signal containing temperature information; The flat antenna sends the frequency signal containing the temperature information to the terminal; The terminal parses the temperature of the component to be measured according to the frequency signal containing the temperature information.

[0015] Compared with the prior art, the present invention has at least the following beneficial effects: The present invention provides a passive wireless temperature measurement system, in which a heat-conducting base contacts a component to be measured, and the heat-conducting base conducts the temperature of the component to be measured to a surface acoustic wave resonator. The surface acoustic wave resonator responds to an excitation radio frequency signal and generates a frequency signal containing temperature information. The flat antenna sends the frequency signal containing temperature information to a terminal, and the terminal parses the temperature of the component to be measured according to the frequency signal containing temperature information. It can be seen that by adopting the surface acoustic wave resonator technology, direct and accurate measurement of the internal temperature of the device can be achieved, especially for areas that are difficult to reach with traditional infrared temperature measurement technology, such as obstructed high-voltage cables. The surface acoustic wave resonator does not rely on infrared radiation on the surface of an object, thus avoiding measurement errors caused by reflections from bright or polished metal surfaces, and improving the accuracy of temperature measurement. At the same time, the passive wireless temperature measurement system of the present invention does not require an external power supply, and can work by relying on the received excitation radio frequency signal, which greatly simplifies the installation and maintenance process of the system, reduces the complexity of the system, and also eliminates potential risks caused by power cord or battery failure. The passive wireless temperature measurement system of the present invention can capture and transmit temperature information to the terminal in real time, realizing continuous and uninterrupted monitoring of the device temperature. The real-time performance is conducive to timely discovery and handling of potential faults, and further helps to prevent serious problems such as insulation layer damage and short circuit caused by overheating of the equipment, thereby ensuring the safe and stable operation of the power system and other key facilities. Compared with the traditional handheld infrared temperature measurement method, the present invention does not require manual regular inspections, reducing labor costs. At the same time, it avoids direct exposure of personnel to high temperature, high pressure or toxic and harmful environments, ensures personnel safety, and improves work efficiency and monitoring sustainability.

[0016] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the specific implementation modes of the present invention, the drawings required for use in the description of the specific implementation modes will be briefly introduced below. Obviously, the drawings described below are some implementation modes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is a schematic diagram of a passive wireless temperature measurement system according to an embodiment of the present invention; Figure 2 A schematic diagram of a thermally conductive base in a passive wireless temperature measurement system according to an embodiment of the present invention; Figure 3 The figure is a schematic diagram of a flat panel antenna in a passive wireless temperature measurement system according to an embodiment of the present invention.

[0019] In the figure: 1-terminal; 10-transmitting and receiving antenna; 11-excitation RF signal generating module; 12-frequency signal analyzing module; 2-passive temperature measuring component; 20-substrate; 21-thermal conductive base; 210-groove; 22-surface acoustic wave resonator; 23-planar antenna; 230-plug board. DETAILED DESCRIPTION

[0020] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] Passive wireless temperature measurement is a temperature measurement technology that does not require external power supply and transmits temperature data through wireless signals. Figure 1 As shown, an embodiment of the present invention provides a passive wireless temperature measurement system, which is mainly used to solve the problems of large temperature measurement errors and low temperature monitoring efficiency of traditional handheld infrared thermometers, especially for a large number of high-voltage cables densely arranged inside the electrical cabinet. These cables are often blocked by various components, making it difficult for traditional infrared temperature measurement technology to directly touch and accurately measure their temperature. The passive wireless temperature measurement system includes a terminal 1 and a passive temperature measurement component 2, and the passive temperature measurement component 2 includes a substrate 20, a heat-conducting base 21 arranged on the lower surface of the substrate 20, a surface acoustic wave resonator 22 arranged on the upper surface of the substrate 20, and a flat antenna 23 arranged above the substrate 20. The heat-conducting base 21 is used to contact the component to be measured, the heat-conducting base 21 is connected to the surface acoustic wave resonator 22 by thermal conduction, the surface acoustic wave resonator 22 is electrically connected to the flat antenna 23, the flat antenna 23 is used to receive an excitation radio frequency signal, the surface acoustic wave resonator 22 is used to respond to the excitation radio frequency signal and generate a frequency signal containing temperature information, and the flat antenna 23 is also used to send a frequency signal containing temperature information to the terminal 1. Terminal 1 is used to parse out the temperature of the component to be measured according to the frequency signal containing temperature information.

[0022] Specifically, the passive wireless temperature measurement system is mainly composed of two parts: a terminal 1 and a passive temperature measurement component 2. The substrate 20 serves as the basic support structure of the passive temperature measurement component 2. For example, the substrate 20 uses a PCB board, such as a FR-4 double-layer substrate. The thermal conductive base 21 is attached to the lower surface of the substrate 20 and is designed to be in direct contact with the component to be measured (such as a high-voltage cable). The thermal conductive base 21 is made of a metal material with a high thermal conductivity (such as copper or aluminum) to quickly and accurately conduct the temperature of the component to be measured to the surface acoustic wave resonator 22. For example, the thermal conductive base 21 uses a brass base with excellent thermal conductivity. The surface acoustic wave resonator 22 is arranged on the upper surface of the substrate 20 and is connected to the thermal conductive base 21 through the substrate 20 by thermal conduction. It should be understood that the surface acoustic wave resonator 22 uses surface acoustic wave technology, and its operating frequency changes with temperature, and is a key element for temperature information conversion. The flat antenna 23 is located above the substrate 20 and is electrically connected to the surface acoustic wave resonator 22. The flat antenna 23 is responsible for receiving an excitation radio frequency signal from the outside (such as the terminal 1) and triggering the surface acoustic wave resonator 22 to generate a frequency signal containing temperature information. At the same time, the flat antenna 23 is also responsible for wirelessly sending the frequency signal containing the temperature information back to the terminal 1 to achieve wireless data transmission. Exemplarily, the flat antenna 23 is a copper plate antenna.

[0023] The working principle of the passive wireless temperature measurement system is as follows: the flat antenna 23 of the passive temperature measurement component 2 receives an excitation radio frequency signal sent by an external device. For example, the terminal 1 may send an excitation radio frequency signal to the flat antenna 23 of the passive temperature measurement component 2 in a wireless manner; when the excitation radio frequency signal reaches the flat antenna 23, the surface acoustic wave resonator 22 is activated. Since the operating frequency of the surface acoustic wave resonator 22 is affected by temperature, the frequency signal generated by the surface acoustic wave resonator 22 contains the temperature information of the component to be measured; the frequency signal containing the temperature information is wirelessly sent to the terminal 1 via the flat antenna 23; after receiving the frequency signal containing the temperature information, the terminal 1 parses out the temperature value.

[0024] Preferably, the analyzed temperature value can be displayed in real time on a display screen. At the same time, the terminal 1 can also issue an alarm according to a preset temperature threshold value, and promptly notify the staff to handle the abnormal situation.

[0025] Exemplarily, taking the temperature monitoring of high-voltage cables in the power system as an example, the thermally conductive base 21 of the passive temperature measurement component 2 is closely attached to the surface of the cable, and a stable connection is ensured by a fixing device. The terminal 1 is installed in a position convenient for monitoring and operation. When the temperature of the cable rises, the passive temperature measurement component 2 can sense in real time and wirelessly transmit the temperature information to the terminal 1 to realize remote and real-time temperature monitoring. Once an abnormal temperature is detected, the terminal 1 will immediately issue an alarm to remind the staff to take corresponding measures to effectively prevent potential safety accidents. It can be seen that the passive wireless temperature measurement system of the present invention realizes real-time and accurate temperature monitoring of components that are difficult to directly touch in complex industrial environments through temperature sensing and wireless transmission technology.

[0026] In one possible implementation, Figure 1 As shown, the terminal 1 includes a transceiver antenna 10, an excitation RF signal generating module 11 electrically connected to the transceiver antenna 10, and a frequency signal analyzing module 12 electrically connected to the transceiver antenna 10, the excitation RF signal generating module 11 is used to generate an excitation RF signal, and the transceiver antenna 10 is used to send the excitation RF signal to the flat antenna 23. The transceiver antenna 10 is also used to receive a frequency signal containing temperature information, and the frequency signal analyzing module 12 is used to analyze the temperature of the component to be measured according to the frequency signal containing temperature information.

[0027] Specifically, the transceiver antenna 10 is a bridge for communication between the terminal 1 and the passive temperature measurement component 2, and is responsible for sending and receiving wireless signals. In this embodiment, the transceiver antenna 10 is first used to wirelessly send the excitation RF signal generated by the excitation RF signal generating module 11 to the flat antenna 23 of the passive temperature measurement component 2. At the same time, the transceiver antenna 10 is also responsible for receiving the frequency signal containing temperature information reflected from the flat antenna 23. The excitation RF signal generating module 11 is a signal source inside the terminal 1, which is responsible for generating an excitation RF signal of a specific frequency and power. The excitation RF signal is sent to the passive temperature measurement component 2 via the transceiver antenna 10 to activate the surface acoustic wave resonator 22, so that the surface acoustic wave resonator 22 generates a frequency signal related to the temperature. The frequency signal analysis module 12 is responsible for receiving the frequency signal containing temperature information from the transceiver antenna 10. Through the built-in algorithm or lookup table, the frequency signal analysis module 12 can parse the temperature information in the frequency signal and convert it into a readable temperature value.

[0028] Preferably, the frequency signal analysis module 12 can also make a judgment based on a preset temperature threshold, and trigger an alarm mechanism if the temperature exceeds a normal range.

[0029] In this embodiment, the working principle of the passive wireless temperature measurement system is as follows: the excitation RF signal generating module 11 of the terminal 1 first generates an excitation RF signal, and wirelessly sends the excitation RF signal to the flat antenna 23 of the passive temperature measurement component 2 through the transceiver antenna 10. When the flat antenna 23 receives the excitation RF signal, it triggers the surface acoustic wave resonator 22 to generate a frequency signal related to the current temperature, which is then captured by the flat antenna 23 and reflected back to the transceiver antenna 10 of the terminal 1. After receiving the frequency signal containing temperature information, the transceiver antenna 10 passes it to the frequency signal analysis module 12 for processing. The frequency signal analysis module 12 converts the frequency signal into a corresponding temperature value through an analysis algorithm or a lookup table.

[0030] Preferably, the terminal 1 continuously monitors the analyzed temperature value and compares it with a preset temperature threshold. If the temperature exceeds the normal range, an alarm mechanism is triggered to remind the staff to pay attention and take corresponding measures through sound, light or sending an alarm signal.

[0031] Preferably, the flat antenna 23, as the transmitting / receiving antenna in the passive temperature measurement component 2, is of great importance for frequency matching with the transceiver antenna 10 in the terminal 1, which is not only related to the accurate transmission and reception of the excitation RF signal, but also directly affects the stable transmission and analysis of the frequency signal containing the temperature information. The flat antenna 23 has the same frequency as the transceiver antenna 10, ensuring that the transceiver antenna 10 can achieve good frequency matching and signal coupling with the flat antenna 23 when transmitting and receiving signals.

[0032] In one possible implementation, the temperature of the component to be measured is parsed based on the frequency signal containing temperature information, specifically: traverse a preset frequency-temperature characteristic database, find the temperature corresponding to the frequency matching the frequency signal containing temperature information, that is, the temperature of the component to be measured.

[0033] It should be noted that the establishment of the frequency-temperature characteristic database is as follows: first, it is necessary to collect a series of frequency signals generated by the passive temperature measurement component 2 (surface acoustic wave resonator 22) under different temperature conditions, which is usually completed through control experiments in a laboratory environment to ensure the accuracy and reliability of the data. The collected frequency and corresponding temperature data are sorted to form a one-to-one corresponding frequency-temperature data pair, and a preset frequency-temperature characteristic database is constructed using the collected data pairs. The database can be stored in the memory of the terminal 1 for quick access and query when needed.

[0034] Specifically, the temperature analysis process is as follows: when the flat antenna 23 receives the frequency signal containing temperature information from the surface acoustic wave resonator 22, the signal is received by the transceiver antenna 10 of the terminal 1 through wireless transmission. Inside the terminal 1, the received frequency signal is first preprocessed, such as filtering, amplification, etc., to improve the signal-to-noise ratio and resolution of the signal; then, the frequency signal analysis module 12 compares the processed frequency signal with the preset frequency-temperature characteristic database, and achieves this by traversing the frequency-temperature data pairs in the database to find the frequency value that best matches the current frequency signal. When a matching frequency value is found, the corresponding temperature value can be directly read from the database. This temperature value is the current temperature of the component to be measured, and will be displayed on the display screen of the terminal 1 for the user to view.

[0035] This embodiment adopts a method of traversing a preset frequency-temperature characteristic database to parse temperature. Since the data in the database is collected based on precise control experiments, the parsed temperature value has high accuracy. By updating the data pairs in the database, it can adapt to components to be measured in different models or specifications, thereby improving the versatility and flexibility of the system. This method is relatively simple to implement at the software level and does not require complex hardware support, thereby reducing the cost and maintenance difficulty of the system.

[0036] In one possible implementation, Figure 1 As shown, the passive temperature measurement component 2 also includes a winding inductor, which is arranged on the substrate 20, one end of the winding inductor is electrically connected to the surface acoustic wave resonator 22, and the other end of the winding inductor is grounded. The main function of the winding inductor is to provide a stable electrical connection and prevent adverse phenomena such as arcing under high voltage or high current conditions. Specifically, the winding inductor can limit the rapid change of current through its inductance effect, thereby reducing transient voltage spikes in the circuit and protecting the surface acoustic wave resonator 22 and the flat antenna 23 from damage. Exemplarily, the winding inductor adopts a domestic 100nh winding inductor.

[0037] In detail, in the passive wireless temperature measurement system, the main functions of the winding inductor are reflected in the following aspects: ① By limiting the rapid change of current, the winding inductor can effectively prevent adverse phenomena such as arcing under high voltage or high current conditions, thereby protecting the surface acoustic wave resonator 22 and other circuit components from damage. ② The introduction of the winding inductor helps to reduce noise interference and signal loss in the circuit, and improve the signal-to-noise ratio and resolution of the signal. ③ The winding inductor helps to improve the overall reliability of the passive wireless temperature measurement system, which is conducive to ensuring the long-term stable operation of the passive wireless temperature measurement system in a complex industrial environment.

[0038] In one possible implementation, a plurality of through holes are formed through the upper and lower surfaces of the substrate 20 between the thermally conductive base 21 and the surface acoustic wave resonator 22 , and a heat conductive connection between the thermally conductive base 21 and the surface acoustic wave resonator 22 is achieved by using a heat conductive material passing through the through holes.

[0039] Specifically, in order to optimize the heat conduction efficiency in the passive temperature measurement component 2, the substrate 20 is designed to have a plurality of through holes on the upper and lower surfaces. The function of the through holes is to provide a direct channel for the heat-conducting material so as to efficiently transfer the heat on the heat-conducting base 21 to the surface acoustic wave resonator 22. The heat-conducting material filled in the through hole should have good thermal conductivity. In this embodiment, soldering material is selected as the heat-conducting medium. The soldering material not only has good thermal conductivity, but also is easy to process and fill into the through hole. The soldering material can be firmly attached to the heat-conducting base 21 and the surface acoustic wave resonator 22 to form a stable heat conduction connection.

[0040] It should be noted that the number, size and distribution of the through holes should be designed according to actual needs to ensure uniform and efficient heat conduction.

[0041] In one implementation, the flat antenna 23 is arranged parallel to and directly above the substrate 20, and the distance between the lower surface of the flat antenna 23 and the upper surface of the substrate 20 is 2.3 mm to 2.7 mm. For example, the distance between the lower surface of the flat antenna 23 and the upper surface of the substrate 20 is 2.5 mm.

[0042] Specifically, the planar antenna 23 is designed to be arranged in parallel just above the substrate 20 to ensure that it can effectively receive and transmit wireless signals. Preferably, the planar antenna 23 is equivalent to the area of ​​the substrate 20. In order to form a better resonant cavity, the optimal distance range between the lower surface of the planar antenna 23 and the upper surface of the substrate 20 is determined to be 2.3 mm to 2.7 mm. Within this distance range, a stable electromagnetic field distribution can be formed between the planar antenna 23 and the substrate 20, which is conducive to the transmission and reception of wireless signals. At the same time, this distance also helps to reduce the attenuation and interference of the signal during the transmission process. The appropriate distance can ensure that the signal strength received by the planar antenna 23 is large enough to meet the sensitivity requirements of the system. Too close or too far distances may cause a reduction in signal strength or distortion of the signal. By optimizing the distance between the planar antenna 23 and the substrate 20, a better resonant cavity is formed, which is conducive to the transmission and reception of wireless signals. In the resonant cavity, the electromagnetic field distribution is more uniform and stable, which is conducive to reducing the reflection and scattering of the signal and improving the transmission quality of the signal.

[0043] In one possible implementation, Figure 1 and Figure 3As shown, a plug-in board 230 is disposed on the side of the flat antenna 23, and a plug-in hole corresponding to the plug-in board 230 is opened on the base plate 20, and the plug-in board 230 is plugged into the plug-in hole.

[0044] That is, one or more plug-in boards 230 are designed on the side of the flat antenna 23. These plug-in boards 230 can be integrally formed with the flat antenna 23, or can be subsequently installed on the flat antenna 23 by welding or the like. On the substrate 20, plug-in holes corresponding to the plug-in boards 230 are provided. The position, shape and size of the plug-in holes should match those of the plug-in boards 230 so that the plug-in boards 230 can be smoothly inserted and fixed in the plug-in holes. The design of the plug-in boards 230 and the plug-in holes makes the installation process of the flat antenna 23 simple and quick, and the close fit between the plug-in boards 230 and the plug-in holes helps to reduce the loosening or falling off of the connection caused by vibration or impact.

[0045] In one possible implementation, Figure 1 and Figure 2 As shown, a groove 210 is provided downwardly on the upper end surface of the thermal conductive base 21, and the thermal conductive base 21 is in a U-shaped block. Specifically, a groove 210 is provided downwardly on the upper end surface of the thermal conductive base 21, and the groove 210 is designed to facilitate the use of binding tools such as cable ties to bind and fix the thermal conductive base 21 to the component to be tested. By binding, it is possible to ensure that the thermal conductive base 21 and the component to be tested maintain close contact, thereby reducing temperature measurement errors caused by poor contact.

[0046] The embodiment of the present invention provides a passive wireless temperature measurement method, which specifically includes: placing a thermal conductive base 21 on a component to be measured, ensuring that it is in close contact with the component to be measured, and using the groove 210 at the upper end of the thermal conductive base 21 to tie and fix it with the component to be measured using tools such as cable ties to enhance the stability and reliability of the connection. The transceiver antenna 10 wirelessly sends the excitation RF signal generated by the excitation RF signal generating module 11 to the planar antenna 23 of the passive temperature measurement component 2, and the temperature of the component to be measured is transmitted to the surface acoustic wave resonator 22 through the thermal conductive base 21. The surface acoustic wave resonator 22 generates a frequency signal containing temperature information, and the surface acoustic wave resonator 22 changes its resonant frequency according to the received heat change, thereby realizing the measurement of temperature. The planar antenna 23 receives the frequency change signal generated by the surface acoustic wave resonator 22, and sends it to the transceiver antenna 10 through the planar antenna 23. The frequency signal analysis module 12 receives the frequency signal containing temperature information from the transceiver antenna 10 and extracts the temperature information.

[0047] In one embodiment, a manufacturing process of a passive temperature measurement component 2 is provided, which is specifically as follows: (1) Printing lead-free solder paste on the thermal conductive base 21 (brass base) and the substrate 20 (PCB board): a) Place the cleaned brass base and PCB board on the positioning workbench respectively, adjust the corresponding positions of the positioning holes of the printing stencil and fix the printing stencil.

[0048] b) Use a scraper to evenly spread the solder on the printing stencil, scrape the solder paste from top to bottom on the printing stencil with the scraper, and print tin on the brass base and PCB board. After printing, visually check whether there is any poor tin printing. Pick out the defective products, wipe them off, and then print tin. Send the tin-printed products to the next process for assembly.

[0049] (2) SAW resonator 22, winding inductor, and planar antenna 23 (copper plate antenna) are mounted on the PCB: a) Use tweezers to clamp the SAW resonator 22 in the right direction and place it vertically on the corresponding position of the PCB board printed with solder paste; b) Use tweezers to clamp the winding inductor in the right direction and place it vertically on the corresponding position of the PCB board with solder paste printed on it; c) After adjusting the copper plate antenna up and down to balance it, vertically insert it into the corresponding hole of the PCB board printed with solder paste; d) Place the PCB board assembled with the surface acoustic wave resonator 22, the winding inductor, and the copper plate antenna in the corresponding position on the brass base printed with solder paste; e) Check the assembled products for misalignment, sort the good products, put them on pallets and send them to the next process for assembly.

[0050] (3) Use a special fixture tray for reflow heating soldering: a) Turn on the power of the reflow oven and set the temperature of each section to 260°C for 3 minutes; b) After the temperature of each section of the reflow oven reaches the set value, the assembled products are placed on a tray and placed on a chain for heating and welding; c) After coming out of the reflow oven, observe that the solder paste on the PCB board, SAW resonator 22, winding inductor, and copper plate antenna is completely melted, and take out the product to cool naturally; d) After the product has cooled, use a magnifying glass (or microscope) to check for defects such as cold soldering, short circuit, displacement, etc.; e) The qualified products are sorted and placed on pallets and sent to the next process for assembly.

[0051] (4) Spray protective paint on the upper surface of the copper plate antenna: a) Fix the bottom of the copper plate antenna to be painted on a special fixture; b) Place the copper plate antenna on the carrier with the front side facing upwards, and spray paint on the front side of the copper plate antenna; c) Use tweezers to transfer the painted copper plate antenna to a tray and place it in a constant temperature bath and heat it at 70°C for 1 hour to cure the protective paint; d) After heating for 1 hour, take out the tray and let it cool naturally; e) After the product has cooled, check whether there are any defects such as paint leakage, bulging of the paint surface, uneven paint finish, etc.; f) The qualified products are sorted and placed on pallets and sent to the next process for assembly.

[0052] (5) Laser printing of coding on the upper surface of the copper plate antenna: a) Turn on the main power switches of the water chiller, computer and laser machine; b) Enter the marking software "***.ight", open the document and select the passive temperature measurement document, and select the required file; c) Adjust the laser focal height, click to display the print font, modify the required number in the text box and click "Apply" to confirm the change; d) Put in the debugging copper plate and try marking to confirm the effect; e) Put the product into the designated fixture position and then mark it; f) After marking, check whether there are any defects such as missing characters, uneven font depth, etc.; g) The qualified products are sorted and placed on pallets and sent to the next process for assembly.

[0053] (6) Passive temperature measurement component performance test: a) Open the test software on the computer; b) The transceiver antenna 10 is vertically attached to the steel plate wall, and the transceiver antenna 10 is placed vertically and perpendicular to the desktop; c) The passive temperature measurement components are placed on the test table. The passive temperature measurement components are placed at approximately equal intervals, and the horizontal distance from the transceiver antenna 10 is about 8 to 10 cm. d) Click the "on" button of the test software, then click the "start measurement" button, and the computer test system will start automatic measurement; e) Wait for about 1 to 2 minutes to test whether the software searches for stable signals, confirm the signal strength and temperature displayed in each window, and continue to observe for 1 to 2 hours to confirm whether the signal is stable; f) The tested products are sorted and placed on trays and sent to the next process for testing (7) High and low temperature shock and aging test of passive temperature measurement components: a) Place the required passive temperature measurement components in the temperature chamber; set the temperature chamber to implement the fixed value conditions for aging: temperature rise to 80℃ / maintain for 48 hours; b) Set the temperature box to implement the fixed value conditions for aging: temperature rise to 80℃ / maintain for 48 hours; c) After aging, take it out and let it cool naturally for 4 hours; d) Set the temperature box to implement high and low temperature cycle program, cycle conditions: heat up to 120℃ / maintain for 0.5 hours → cool down to -20℃ / maintain for 0.5 hours, cycle number: cycle 24 hours e) Place the required passive temperature measurement components in the temperature chamber; f) Set to run according to the program, select execute, the temperature box automatically rises and falls according to the set conditions to perform high and low temperature cycles; g) After completing the high and low temperature cycle, take out the sensor and place it at room temperature for more than 4 hours; h) Connect to the performance test environment to perform performance testing and check whether the functional indicators of the passive temperature measurement components are normal; i) The tested qualified products are sorted, placed on pallets and sent to the next process for packaging and storage.

[0054] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0055] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0056] In the present invention, unless otherwise clearly specified and limited, the terms "connected", "connection" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0057] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0058] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0059] Finally, it should be noted that the above-described embodiments are only specific implementations of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The protection scope of the present invention is not limited thereto. Although the present invention is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed by the present invention, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A passive wireless temperature measurement system, characterized in that: The invention comprises a terminal (1) and a passive temperature measurement component (2), wherein the passive temperature measurement component (2) comprises a substrate (20), a heat-conducting base (21) arranged on the lower surface of the substrate (20), a surface acoustic wave resonator (22) arranged on the upper surface of the substrate (20), and a planar antenna (23) arranged above the substrate (20); the heat-conducting base (21) is used to contact a component to be temperature-measured; the heat-conducting base (21) is connected to the surface acoustic wave resonator (22) by thermal conduction; the surface acoustic wave resonator (22) is electrically connected to the planar antenna (23); the planar antenna (23) is used to receive an excitation radio frequency signal; the surface acoustic wave resonator (22) is used to respond to the excitation radio frequency signal and generate a frequency signal containing temperature information; the planar antenna (23) is also used to send the frequency signal containing temperature information to the terminal (1); and the terminal (1) is used to parse the temperature of the component to be temperature-measured according to the frequency signal containing temperature information.

2. A passive wireless temperature measurement system according to claim 1, characterized in that: The terminal (1) comprises a transceiver antenna (10), an excitation radio frequency signal generating module (11) electrically connected to the transceiver antenna (10), and a frequency signal analyzing module (12) electrically connected to the transceiver antenna (10), wherein the excitation radio frequency signal generating module (11) is used to generate an excitation radio frequency signal, and the transceiver antenna (10) is used to send the excitation radio frequency signal to the flat antenna (23); the transceiver antenna (10) is also used to receive the frequency signal containing temperature information, and the frequency signal analyzing module (12) is used to analyze the temperature of the component to be measured based on the frequency signal containing temperature information.

3. A passive wireless temperature measurement system according to claim 2, characterized in that: The flat panel antenna (23) has the same frequency as the transceiver antenna (10).

4. A passive wireless temperature measurement system according to claim 1, characterized in that: The step of analyzing the temperature of the component to be measured according to the frequency signal containing the temperature information is specifically as follows: The preset frequency-temperature characteristic database is traversed to find the temperature corresponding to the frequency matching the frequency signal containing temperature information, which is the temperature of the component to be measured.

5. The passive wireless temperature measurement system according to claim 1, characterized in that: The passive temperature measurement component (2) further comprises a winding inductor, the winding inductor being arranged on the substrate (20), one end of the winding inductor being electrically connected to the surface acoustic wave resonator (22), and the other end of the winding inductor being grounded.

6. A passive wireless temperature measurement system according to claim 1, characterized in that: A plurality of through holes are provided through the upper and lower surfaces of the substrate (20) between the heat-conducting base (21) and the surface acoustic wave resonator (22), and a heat-conducting connection between the heat-conducting base (21) and the surface acoustic wave resonator (22) is achieved by using heat-conducting material passing through the through holes.

7. A passive wireless temperature measurement system according to claim 1, characterized in that: The flat panel antenna (23) is arranged in parallel directly above the substrate (20), and the distance between the lower surface of the flat panel antenna (23) and the upper surface of the substrate (20) is 2.3 mm to 2.7 mm.

8. A passive wireless temperature measurement system according to claim 7, characterized in that: A plug board (230) is arranged on the side of the flat antenna (23), a plug hole corresponding to the plug board (230) is provided on the base plate (20), and the plug board (230) is plugged into the plug hole.

9. The passive wireless temperature measurement system according to claim 1, characterized in that: The upper end surface of the heat-conducting base (21) is provided with a groove (210) facing downwards, and the heat-conducting base (21) is in a U-shaped block shape.

10. A passive wireless temperature measurement method, characterized in that: Using a passive wireless temperature measurement system as described in any one of claims 1 to 9, the temperature measurement method comprises: The heat-conducting base (21) is brought into contact with the component to be temperature-measured; The flat panel antenna (23) receives an excitation radio frequency signal; The surface acoustic wave resonator (22) responds to the excitation radio frequency signal and generates a frequency signal containing temperature information; The flat antenna (23) sends the frequency signal containing the temperature information to the terminal (1); The terminal (1) parses the temperature of the component to be measured based on the frequency signal containing the temperature information.

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