Method for researching influence of enclosure structure on indoor thermal environment based on double thermal parameters

Abstract

The invention discloses a method for researching the influence of an enclosure structure on an indoor thermal environment based on double thermal parameters, and relates to the technical field of heat transfer of the enclosure structure, and the method comprises the following steps: obtaining experimental data of a to-be-tested region, the experimental data comprising a geographic position, climate characteristics, the enclosure structure and materials; establishing a heat transfer function model of the enclosure structure by using double thermal parameters according to the enclosure structure, and performing numerical simulation by using building thermal simulation software EnergyPlus; based on the double thermal parameters in the heat transfer function model, different pressures and pressure intensities are applied in the simulation process to construct a heat conductivity coefficient influence data set, and a heat transfer influence coefficient is obtained; obtaining a new heat conductivity coefficient and a heat transfer function model based on a machine learning algorithm according to the heat transfer influence coefficient and the double thermal parameters; by optimizing the heat transfer function model, the problems of reducing building energy consumption and heating cost, improving indoor comfort and saving building energy under different pressures and intensities in different regions are solved.

Description

Technical Field

[0001] The invention relates to the field of building technology, and more specifically to a method for studying the influence of an enclosure structure on an indoor thermal environment based on dual thermal parameters. Background Art

[0002] In architectural design and environmental engineering, the impact of envelope structures on indoor thermal environment is extremely important. The thermal insulation design of envelope structures can effectively improve the quality of indoor thermal environment and reduce the building's dependence on heating and cooling systems. In my country, about 70% of the regions require heating in winter. Buildings in these regions must ensure good indoor temperature while saving heating costs, and the emergence of envelope structures solves these problems. By studying the impact of envelope structures on indoor thermal environment, optimizing the thermal performance of envelope structures, such as exterior walls and exterior windows, significantly reduces heating costs, helps improve building energy conservation and improve thermal environment quality, meets people's demand for living environment comfort, and promotes the development of green buildings and building energy conservation.

[0003] The above disclosed technical solutions have at least the following technical problems: Due to different geographical regions, the thermal conductivity and thermal resistance of building materials made from the same raw materials vary significantly, while the prices are almost the same. For developers, choosing excellent insulation materials will not have much impact on project costs, because these projects involve large-scale procurement and the price has been fully considered in the budget. However, during the construction process, as the floors continue to rise, the pressure and stress on the materials also change, which affects the thermal conductivity and thermal resistance of the materials, causing the enclosure structure to affect the indoor thermal environment.

[0004] In view of the above problems, the present invention proposes a solution. Summary of the invention

[0005] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a research method for the influence of the enclosure structure on the indoor thermal environment based on dual thermal parameters. By applying different pressures and pressures to the building materials, the thermal conductivity under different pressures and pressures is obtained and a thermal conductivity influence data set is constructed. By analyzing and processing the thermal conductivity influence data set, the influence coefficient of pressure on the thermal conductivity and the influence coefficient of pressure on the thermal conductivity are obtained, thereby constructing a new thermal conductivity formula and optimizing the heat transfer function model to solve the problems of reducing building energy consumption and heating costs, improving indoor comfort and building energy saving under different pressures and pressures in different regions.

[0006] To achieve the above object, the present invention provides the following technical solutions: The research method of the influence of the enclosure structure on the indoor thermal environment based on dual thermal parameters includes: obtaining experimental data of the area to be tested, wherein the experimental data includes climate characteristics, enclosure structure and materials; establishing a heat transfer function model of the enclosure structure using dual thermal parameters according to the enclosure structure, and performing numerical simulation using building thermal simulation software EnergyPlus; based on the heat transfer function model, applying different pressures and pressures during the simulation process to construct a thermal conductivity influence data set to obtain the heat transfer influence coefficient; and obtaining a new thermal conductivity and heat transfer function model based on a machine learning algorithm according to the heat transfer influence coefficient and dual thermal parameters.

[0007] In a preferred embodiment, the obtaining of experimental data of the area to be tested is specifically as follows: obtaining climate characteristic data of the area to be tested, including temperature, precipitation, air humidity and wind speed; obtaining the climate type of the area to be tested by time series analysis based on the climate characteristic data; determining performance indicators of the enclosure structure based on the climate type, the performance indicators including thermal insulation, waterproofness, wind resistance and durability; and selecting building materials for testing based on the functional requirements of the enclosure structure.

[0008] In a preferred embodiment, the specific steps of using the building thermal simulation software EnergyPlus for numerical simulation are as follows: obtaining building model data, the building model data including building materials, envelope structures and dual thermal parameters; setting the simulation environment data including climate type, and setting the temperature and humidity of the environment according to the climate type; setting the simulation time range, setting the temperature control strategy and start-stop logic for the building's HVAC system and air conditioning control; evaluating the impact of each strategy on energy consumption, comfort and system performance through the temperature control strategy; automatically shutting down the HVAC system through the start-stop logic when the indoor temperature approaches the set value to reduce human intervention; integrating the simulation environment data and the simulation time range and converting them into an IDF file; after entering the IDF file, starting the simulation through the command line tool.

[0009] In a preferred embodiment, the step of obtaining the thermal conductivity is as follows: obtaining index data of the material to be tested, the index data including mass, thickness, width and height, and calculating the area of ​​the heat transfer region according to the index data of the material; measuring the temperature difference between the inside and outside of the material by a sensor, and recording the time of the temperature change; using differential scanning calorimetry to measure the specific heat capacity of the material; and calculating based on the thermal conductivity formula according to the temperature difference, the area of ​​the heat transfer region, the mass of the material, the time of the temperature change and the specific heat capacity of the material to obtain the thermal conductivity of the material.

[0010] In a preferred embodiment, the step of obtaining the thermal resistance is as follows: obtaining the thermal conductivity, thickness, width and height of the material to be tested, and calculating the cross-sectional area of ​​the material perpendicular to the heat flow direction according to the thickness, width and height of the material; and calculating based on the thermal resistance formula according to the thickness, thermal conductivity and cross-sectional area of ​​the material perpendicular to the heat flow direction to obtain the thermal resistance of the material.

[0011] In a preferred embodiment, the step of obtaining the thermal diffusivity is specifically as follows: according to the characteristics of the material, the thermal conductivity is measured using a steady-state heat conduction method or a transient heat conduction method; the mass and volume of the material to be measured are obtained, and the density of the material is calculated based on the mass and volume, and the specific heat capacity of the material is measured using a differential scanning calorimeter; according to the obtained thermal conductivity, density and specific heat capacity, the thermal diffusivity of the material is calculated based on the thermal diffusivity formula.

[0012] In a preferred embodiment, based on the heat transfer function model, different pressures and stresses are applied during the simulation process to construct a thermal conductivity influence data set and obtain the heat transfer influence coefficient, specifically: under the same test conditions, different pressures and stresses are applied to the test material; the change of thermal conductivity during the pressure application process is recorded, and a thermal conductivity influence data set is constructed; the thermal conductivity influence data set is analyzed and processed by a machine learning algorithm to obtain the influence coefficient of pressure on thermal conductivity and the influence coefficient of pressure on thermal conductivity.

[0013] The technical effects and advantages of the research method of the influence of the enclosure structure on the indoor thermal environment based on dual thermal parameters of the present invention are as follows: 1. This invention quantifies the impact of the envelope structure on the indoor thermal environment by establishing an accurate heat transfer function model. The model not only takes into account the conduction and convection heat transfer mechanisms, but also analyzes the changes in thermal conductivity under different pressures and pressures, providing more reliable data support, thereby improving the energy efficiency and comfort of the building.

[0014] 2. The present invention takes into account a variety of thermal parameters, such as thermal conductivity, specific heat capacity, density and thermal resistance, making the analysis of the thermal performance of the enclosure structure more comprehensive. Through multi-dimensional analysis, it is suitable for thermal environment assessment of various building types, ensuring that the thermal performance during the design and construction process meets the expected standards of the owner.

[0015] 3. This method optimizes the thermal conductivity through machine learning algorithms, processes large-scale experimental data, and automatically discovers the optimal parameter combination through learning and pattern recognition. This data-driven method effectively improves the intelligence of the research and the accuracy of the results, avoiding the uncertainty caused by manual adjustments by personnel. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1It is a structural schematic diagram of the research method of the influence of the enclosure structure on the indoor thermal environment based on dual thermal parameters of the present invention. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] Embodiment 1, Figure 1 The present invention provides a method for studying the influence of the enclosure structure on the indoor thermal environment based on dual thermal parameters, which includes the following steps: S1, obtaining experimental data of the area to be tested, wherein the experimental data includes climate characteristics, enclosure structure and materials.

[0019] In this embodiment, the acquisition of the geographical location, climate characteristics, enclosure structure and materials of the area to be measured is specifically: Obtain climate characteristic data of the area to be measured, including temperature, precipitation, air humidity and wind speed; According to the climate characteristic data, the climate type of the area to be tested is obtained through time series analysis; Determining performance indicators of the enclosure structure according to the climate type, wherein the performance indicators include thermal insulation, waterproofness, wind resistance and durability; The building materials tested were selected based on the functional requirements of the enclosure.

[0020] It should be noted that selecting envelope structures based on climate characteristics can effectively cope with local environmental conditions. Appropriate envelope structures can improve the comfort and durability of buildings and reduce building energy consumption and construction costs.

[0021] S2, a heat transfer function model of the envelope structure is established using dual thermal parameters according to the envelope structure, and numerical simulation is performed using the building thermal simulation software EnergyPlus.

[0022] In this embodiment, the dual thermal parameters are specifically: Thermal conductivity refers to the amount of heat transferred by a material through a unit area per unit time under stable heat transfer conditions. Thermal conductivity directly affects the heat transfer efficiency of building envelopes, determines how fast heat is transferred in a material, and is an important parameter for measuring the thermal conductivity of a material.

[0023] The steps for obtaining the thermal conductivity are as follows: Obtaining index data of the material to be tested, the index data including mass, thickness, width and height, and calculating the area of ​​the heat transfer region according to the index data of the material; The temperature difference between the inside and outside of the material is measured by the sensor, and the time of temperature change is recorded; The specific heat capacity of the material was measured using differential scanning calorimetry; According to the temperature difference, the area of ​​the heat transfer region, the mass of the material, the time of temperature change and the specific heat capacity of the material, the thermal conductivity of the material is calculated based on the thermal conductivity formula. The specific calculation formula of the thermal conductivity is as follows:

[0024] The specific calculation formula of the specific heat capacity is as follows:

[0025] Where K is the thermal conductivity, m is the mass of the material to be tested, and C is the specific heat capacity of the material to be tested. is the temperature difference between the inside and outside of the material. is the time to measure the temperature change of the material, A is the surface area of ​​the heat transfer region, is the final temperature of the material, is the initial temperature of the material and Q is the amount of heat absorbed or released.

[0026] It should be noted that the above calculation formula for thermal conductivity belongs to the transient heat conduction method (such as the hot wire method), which calculates the thermal conductivity of the material to be tested by measuring the temperature change in a short period of time. The thermal conductivity of the material to be tested can also be obtained by the steady-state heat conduction method (steady-state plate method). This method mainly calculates the thermal conductivity by measuring the temperature difference when a constant heat flux is applied on both sides of the material to be tested. The lower the thermal conductivity, the better the thermal insulation performance of the material, which effectively blocks the transfer of heat energy, maintains the indoor temperature, improves the energy efficiency and comfort of the building, and reduces energy consumption.

[0027] It should be noted that specific heat capacity refers to the amount of heat absorbed and released by an object per unit mass when the temperature changes. Specific heat capacity plays a decisive role in the material's ability to store and release heat during heating and cooling, and affects the energy efficiency of the building envelope. High specific heat capacity materials play an important role in maintaining indoor temperature stability. By selecting appropriate building materials based on the specific heat capacity of the material, the energy consumption performance of the building can be effectively optimized, the cost requirements for cooling and heating can be reduced, and the energy efficiency and comfort of the building can be effectively improved.

[0028] The specific calculation formula of the thermal conductivity of the steady-state heat conduction method is as follows:

[0029] Where K is the thermal conductivity, is the heat flow through the material, d is the thickness of the material, is the temperature difference between the inside and outside of the material, and A is the surface area of ​​the heat transfer region.

[0030] It should be noted that the steady-state heat conduction method is suitable for uniform materials. Uniform materials have good steady-state properties. In the steady state, the temperature field and heat flow field of the material are linear, which effectively simplifies the data processing process. The transient heat conduction method is suitable for non-uniform materials. This method has a good effect on the processing of materials with complex structures and non-uniform materials. During the test, you don’t need to care whether the material is in a stable state. Selecting the corresponding measurement method according to the characteristics of the material will effectively improve the efficiency of the experiment.

[0031] Thermal resistance is a measure of the temperature difference generated when a unit of heat passes through a material. It is a physical quantity that measures the degree of resistance of a material to the transfer of heat energy. When the thermal resistance is high, the heat transfer is more hindered; conversely, when the thermal resistance is low, heat is more easily transferred from one end to the other.

[0032] The steps for obtaining the thermal resistance are as follows: Obtain the thermal conductivity, thickness, width and height of the material to be tested, and calculate the cross-sectional area of ​​the material perpendicular to the heat flow direction based on the thickness, width and height of the material; The thermal resistance of the material is calculated based on the thermal resistance formula according to the material's thickness, thermal conductivity and the cross-sectional area of ​​the material perpendicular to the heat flow direction.

[0033] The specific calculation formula of the thermal resistance is as follows:

[0034] Where R is thermal resistance, L is material thickness, and K is thermal conductivity. It is the cross-sectional area of ​​the material perpendicular to the direction of heat flow.

[0035] It should be noted that the higher the thermal resistance of the material, the better the thermal insulation of the material, which helps to maintain the indoor temperature; conversely, the lower the thermal resistance, the lower the thermal insulation of the material, which leads to unstable indoor temperature and increases the burden of heating and cooling. Choosing appropriate materials according to the thermal resistance of the material will effectively improve the comfort and energy consumption of the building, save costs, reduce the impact on the environment, and achieve sustainable development and economic benefits.

[0036] Thermal diffusivity, thermal diffusivity is the ability of an object to maintain a uniform temperature during heating or cooling, and is also the heat storage capacity of an object, reflecting the ability of a substance to diffuse heat. A higher thermal diffusivity means that heat is transferred faster inside the object and the temperature changes more evenly.

[0037] The steps for obtaining the thermal diffusivity are as follows: The thermal conductivity is measured using the steady-state heat conduction method or the transient heat conduction method according to the characteristics of the material; Obtain the mass and volume of the material to be tested, and calculate the density of the material based on the mass and volume; The specific heat capacity of the material was measured using differential scanning calorimetry; According to the obtained thermal conductivity, density and specific heat capacity, the thermal diffusivity of the material is calculated based on the thermal diffusivity formula.

[0038] The specific calculation formula of the thermal diffusivity is as follows:

[0039] In the formula, is the thermal diffusivity of the material, is the thermal conductivity, is the density of the material, is the specific heat capacity of the material.

[0040] In this embodiment, the heat transfer function model of the enclosure structure is based on the basic principles of thermal conductivity and thermal diffusivity and uses Fourier's law to establish a digital model.

[0041] The specific calculation formula of the heat transfer function model of the enclosure structure is as follows:

[0042] In the formula, is the temperature, It's time. is the thermal diffusivity, is the spatial coordinate used to represent the location of the material, is the symbol of partial derivative, which means partial differential of a variable. Indicates temperature About Time The partial derivative of Indicates temperature Space coordinates The second-order partial derivative of .

[0043] It should be noted that in the heat transfer function model formula of the enclosure structure, thermal diffusivity has an important relationship with the model, and thermal diffusivity is positively correlated with thermal conductivity. The smaller the thermal conductivity, the better the thermal insulation of the material and the lower the thermal diffusivity.

[0044] In this embodiment, the specific steps of using the building thermal simulation software EnergyPlus to perform numerical simulation are as follows: Acquiring building model data, wherein the building model data includes building materials, enclosure structure and dual thermal parameters; Set the simulated environment data including climate type, and set the temperature and humidity of the environment according to the climate type; Set the simulation time range, set temperature control strategies and start / stop logic for the building’s HVAC system and air conditioning control; Evaluate the impact of each temperature control strategy on energy consumption, comfort, and system performance; The start-stop logic automatically shuts down the HVAC system when the indoor temperature approaches the set value, reducing human intervention; Integrate the simulation environment data and simulation time range and convert them into IDF files; After inputting the IDF file, start the simulation through the command line tool.

[0045] S3, based on the heat transfer function model, different pressures and pressures are applied during the simulation to construct a thermal conductivity influence data set and obtain the heat transfer influence coefficient.

[0046] In this embodiment, based on the heat transfer function model, different pressures and pressure data are applied during the simulation process to construct a thermal conductivity influence data set to obtain the heat transfer influence coefficient, specifically: Under the same test conditions, different pressures and stresses are applied to the selected test materials; In the process of applying pressure and pressure, at each pressure application stage, after the data is stable, the thermal conductivity value is tested and recorded, and the recorded thermal conductivity and the corresponding pressure and pressure data are collated into a data set; The thermal conductivity influence data set is analyzed and processed through machine learning algorithms to obtain the influence coefficients of pressure on thermal conductivity and the influence coefficients of pressure on thermal conductivity.

[0047] It should be noted that during the pressure application phase, the same data needs to be repeatedly tested to screen out abnormal data and ensure the accuracy and reliability of the data.

[0048] S4, obtaining a new thermal conductivity and heat transfer function model based on a machine learning algorithm according to the heat transfer influence coefficient and dual thermal parameters.

[0049] In this embodiment, a new thermal conductivity is constructed based on the machine learning algorithm through the thermal conductivity, the influence coefficient of pressure on the thermal conductivity, and the influence coefficient of pressure on the thermal conductivity, so as to optimize the heat transfer function model. The required building materials are determined by the new thermal conductivity to meet the comfort needs of self-built house owners while reducing the energy consumption of heating and cooling.

[0050] The specific calculation formula of the optimized thermal conductivity is as follows:

[0051] In the formula, is the thermal conductivity under pressure and pressure, is the thermal conductivity at base pressure and pressure, It's the pressure that's applied. is the base pressure, is the applied pressure, is the base pressure, is the influence coefficient of pressure on thermal conductivity, is the effect of pressure on thermal conductivity.

[0052] It should be noted that the reference pressure and reference pressure refer to the standard pressure and pressure used for comparison in the experiment. The optimized thermal conductivity coefficient takes into account the influence of different pressures and pressures on the heat transfer function model, making up for the shortcomings of the traditional method. Through this coefficient, the construction cost and energy consumption can be further reduced, and the building energy consumption and comfort can be improved.

[0053] The above formulas are all dimensionless and numerical calculations. The formula is a formula for the most recent real situation obtained by collecting a large amount of data and performing software simulation. The preset parameters in the formula are set by technicians in this field according to actual conditions.

[0054] The above embodiments may be implemented in whole or in part by software, hardware, firmware or any other combination. When implemented by software, the above embodiments may be implemented in whole or in part in the form of a computer program product.

[0055] Those of ordinary skill in the art will appreciate that the modules and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application and design constraints of the technical solution. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.

[0056] In addition, each functional module in each embodiment of the present application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.

[0057] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

[0058] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A research method based on dual thermal parameters on the impact of enclosure structures on indoor thermal environment, characterized in that: include: Acquire experimental data of the area to be tested, wherein the experimental data includes geographical location, climate characteristics, enclosure structure and materials; A heat transfer function model of the enclosure structure is established using dual thermal parameters according to the enclosure structure, and a building thermal simulation software EnergyPlus is used for numerical simulation; Based on the heat transfer function model, different pressures and stresses are applied during the simulation process to construct a thermal conductivity influence data set and obtain the heat transfer influence coefficient; According to the heat transfer influence coefficient and dual thermal parameters, a new thermal conductivity coefficient and heat transfer function model is obtained based on a machine learning algorithm.

2. The method for studying the influence of enclosure structure on indoor thermal environment based on dual thermal parameters according to claim 1 is characterized in that: The obtaining of experimental data of the area to be tested is specifically as follows: Obtain climate characteristic data of the area to be measured, including temperature, precipitation, air humidity and wind speed; According to the climate characteristic data, the climate type of the area to be tested is obtained through time series analysis; Determining performance indicators of the enclosure structure according to the climate type, wherein the performance indicators include thermal insulation, waterproofness, wind resistance and durability; The building materials tested were selected based on the functional requirements of the enclosure.

3. The method for studying the influence of enclosure structure on indoor thermal environment based on dual thermal parameters according to claim 2 is characterized in that: The specific steps of using the building thermal simulation software EnergyPlus for numerical simulation are as follows: Acquiring building model data, wherein the building model data includes building materials, enclosure structure and dual thermal parameters; Set the simulated environment data including climate type, and set the temperature and humidity of the environment according to the climate type; Set the simulation time range, set temperature control strategies and start / stop logic for the building’s HVAC system and air conditioning control; Evaluate the impact of each temperature control strategy on energy consumption, comfort, and system performance; The start-stop logic automatically shuts down the HVAC system when the indoor temperature approaches the set value, reducing human intervention; Integrate the simulation environment data and simulation time range and convert them into IDF files; After inputting the IDF file, start the simulation through the command line tool.

4. The method for studying the influence of enclosure structure on indoor thermal environment based on dual thermal parameters according to claim 3 is characterized in that: The steps for obtaining the thermal conductivity are as follows: Obtaining index data of the material to be tested, the index data including mass, thickness, width and height, and calculating the area of ​​the heat transfer region according to the index data of the material; The temperature difference between the inside and outside of the material is measured by the sensor, and the time of temperature change is recorded; The specific heat capacity of the material was measured using differential scanning calorimetry; The thermal conductivity of the material is calculated based on the thermal conductivity formula according to the temperature difference, the area of ​​the heat transfer region, the mass of the material, the time of temperature change and the specific heat capacity of the material.

5. The method for studying the influence of enclosure structure on indoor thermal environment based on dual thermal parameters according to claim 4 is characterized in that: The steps for obtaining the thermal resistance are as follows: Obtain the thermal conductivity, thickness, width and height of the material to be tested, and calculate the cross-sectional area of ​​the material perpendicular to the heat flow direction based on the thickness, width and height of the material; The thermal resistance of the material is calculated based on the thermal resistance formula according to the material's thickness, thermal conductivity and the cross-sectional area of ​​the material perpendicular to the heat flow direction.

6. The method for studying the influence of enclosure structure on indoor thermal environment based on dual thermal parameters according to claim 5 is characterized in that: The steps for obtaining the thermal diffusivity are as follows: The thermal conductivity is measured using the steady-state heat conduction method or the transient heat conduction method according to the characteristics of the material; Obtain the mass and volume of the material to be tested, and calculate the density of the material based on the mass and volume; The specific heat capacity of the material was measured using differential scanning calorimetry; According to the obtained thermal conductivity, density and specific heat capacity, the thermal diffusivity of the material is calculated based on the thermal diffusivity formula.

7. The method for studying the influence of enclosure structure on indoor thermal environment based on dual thermal parameters according to claim 6 is characterized in that: Based on the heat transfer function model, different pressures and pressures are applied during the simulation process to construct a thermal conductivity influence data set to obtain the heat transfer influence coefficient, specifically: Under the same test conditions, different pressures and stresses are applied to the selected test materials; In the process of applying pressure and pressure, at each pressure application stage, after the data is stable, the thermal conductivity value is tested and recorded, and the recorded thermal conductivity and the corresponding pressure and pressure data are collated into a data set; The thermal conductivity influence data set is analyzed and processed through machine learning algorithms to obtain the influence coefficients of pressure on thermal conductivity and the influence coefficients of pressure on thermal conductivity.

8. The method for studying the influence of enclosure structure on indoor thermal environment based on dual thermal parameters according to claim 7 is characterized in that: There are two methods for obtaining the thermal conductivity: steady-state heat conduction method and transient heat conduction method, specifically: The specific calculation formula of the thermal conductivity of the transient heat conduction method is as follows: The specific calculation formula of the thermal conductivity of the steady-state heat conduction method is as follows: The specific calculation formula of the specific heat capacity is as follows: Where K is the thermal conductivity, m is the mass of the material to be tested, and C is the specific heat capacity of the material to be tested. is the time over which the temperature of the material is measured, is the heat flow through the material, d is the thickness of the material, is the temperature difference between the inside and outside of the material, A is the surface area of ​​the heat transfer region, is the final temperature of the material, is the initial temperature of the material and Q is the amount of heat absorbed or released.

9. The method for studying the influence of enclosure structure on indoor thermal environment based on dual thermal parameters according to claim 8 is characterized in that: The specific calculation formula of the heat transfer function model of the enclosure structure is as follows: The specific calculation formula of the thermal diffusivity is as follows: In the formula, is the temperature, It's time. is the thermal diffusivity of the material, is the spatial coordinate used to represent the location of the material, is the symbol of partial derivative, which means partial differential of a variable. Indicates temperature About Time The partial derivative of Indicates temperature Space coordinates The second-order partial derivative of is the thermal conductivity, is the density of the material, is the specific heat capacity of the material.

10. The method for studying the influence of enclosure structure on indoor thermal environment based on dual thermal parameters according to claim 9 is characterized in that: The specific calculation formula of the optimized thermal conductivity is as follows: In the formula, is the thermal conductivity under pressure and pressure, is the thermal conductivity at base pressure and pressure, It's the pressure that's applied. is the base pressure, is the applied pressure, is the base pressure, is the influence coefficient of pressure on thermal conductivity, is the effect of pressure on thermal conductivity.

Images