Method for processing impurities in display module, display module and display device

Abstract

The invention discloses an impurity treatment method in a display module, the display module and a display device, and relates to the technical field of micro-display, and the impurity treatment method in the display module comprises the following steps: providing a display panel, a transparent adhesive and a glass cover plate; coating a transparent adhesive on the surface of the display panel to form a transparent adhesive layer; processing a preset slotting position on the surface of the glass cover plate to form an accommodating groove, and attaching one side, provided with the accommodating groove, of the glass cover plate to the surface of the transparent bonding layer, so that the accommodating groove corresponds to the non-display area of the display panel; the display panel is lightened, and the positions of impurities in the display module are determined; and the impurities are gasified through laser, and the gasified impurities are transferred into the containing groove. The impurities in the display module are treated and then concentrated in the containing grooves of the corresponding non-display areas, so that the optical performance of a product and the use experience of a user are improved.

Description

Technical Field

[0001] The present invention relates to the field of micro-display technology, and in particular to a method for processing impurities in a display module, a display module, and a display device. Background Art

[0002] Silicon-based OLED (Organic Light Emitting Diode) display modules are widely used in wearable devices such as virtual reality (VR) display devices and augmented reality (AR) display devices due to their high resolution, low power consumption, wide viewing angle, high color saturation, small size and light weight.

[0003] Although the manufacturing of silicon-based OLED display modules is carried out in a clean room, it is inevitable that impurities from the surrounding environment will enter the display module. These impurities may form dark spots when the silicon-based OLED display module displays images, seriously affecting the optical performance of the silicon-based OLED display module and the user's viewing experience.

[0004] In the relevant technical research, the applicant found that it is possible to use laser irradiation to remove impurities in the silicon-based OLED display module, and use the concentrated laser beam to vaporize the impurities to reduce the obvious display dark spot problem caused by impurities. However, after further testing the technical effect of reducing the display dark spots of the display module by the above laser irradiation method, the applicant found that although the impurities inside the display module can be dissipated to a certain extent under the action of laser irradiation, the dark spot problem of the display module can be alleviated, but the impurities vaporized by the laser are still retained inside the display module in the form of smaller bubbles. These smaller bubbles will affect the display effect of the display module when the display module is in different states:

[0005] 1. Static impact;

[0006] When the display module is in a non-moving state, the complex light / electric wave signals inside the display module will act on the tiny bubble impurities, causing these bubble impurities to attract each other and agglomerate. In addition, a large number of bubbles formed after the impurities are vaporized will also gather together after the display module is left stationary to form larger bubbles, affecting the propagation of light and causing the above-mentioned dark spot defects to reappear on the display module.

[0007] 2. Dynamic impact;

[0008] When the display module is transported and moved during the packaging process, the above-mentioned bubble impurities will move inside the display module. The distribution density of the impurities in one area of ​​the display module may be different from that in another area of ​​the display module, resulting in uneven display effects in different display areas of the display module.

[0009] The applicant proposed the present invention based on the above research background. Summary of the invention

[0010] The main purpose of the present invention is to propose a method for processing impurities in a display module, a display module, and a display device, aiming to solve the problem that after impurities in the display module are vaporized by laser, the impurities are scattered in the display screen, affecting the display effect of the display module.

[0011] To achieve the above object, the present invention provides a method for processing impurities in a display module, the method comprising the steps of:

[0012] Providing a display panel, a transparent adhesive, and a glass cover;

[0013] Applying the transparent adhesive on the surface of the display panel to form a transparent adhesive layer;

[0014] Processing a groove at a preset groove position on the surface of the glass cover plate to form a groove, and attaching a side of the glass cover plate with the groove to the surface of the transparent adhesive layer so that the groove is arranged corresponding to the non-display area of ​​the display panel;

[0015] Lighting up the display panel to determine the location of the impurities in the display module;

[0016] The impurities are vaporized by laser, so that the vaporized impurities are transferred into the containing tank.

[0017] In one embodiment of the present invention, the step of forming a receiving groove at a preset groove position on the surface of the glass cover plate comprises:

[0018] Setting a first positioning mark on the display panel and setting a second positioning mark on the glass cover plate;

[0019] Establishing a first plane coordinate system of the non-display area of ​​the display panel based on the first positioning mark, and establishing a second plane coordinate system of the glass cover plate based on the second positioning mark;

[0020] Coordinate information of the non-display area on the glass cover plate is determined according to the first plane coordinate system and the second plane coordinate system, and the preset slot position is determined according to the obtained coordinate information.

[0021] In one embodiment of the present invention, the step of determining the preset slot position according to the obtained coordinate information includes:

[0022] Forming the receiving groove at the preset groove position of the glass cover plate by dry etching;

[0023] Clean the impurities on the glass cover plate generated after dry etching.

[0024] In one embodiment of the present invention, the step of gasifying the impurities with laser comprises:

[0025] Heating the display module for a first preset time;

[0026] The display module is left to stand for a second preset time.

[0027] In one embodiment of the present invention, the step of transferring the gasified impurities into the container comprises:

[0028] The transparent adhesive layer is cured by ultraviolet light irradiation.

[0029] In order to solve the above technical problems, the present invention further provides a display module, which includes:

[0030] A display panel, the display panel comprising a substrate and a light-emitting module, the light-emitting module being arranged on the substrate, the light-emitting module having a display area and a non-display area surrounding the display area;

[0031] a transparent adhesive layer, the transparent adhesive layer being disposed on a side of the light emitting module facing away from the substrate; and

[0032] A glass cover plate is provided on a side of the transparent adhesive layer facing away from the light emitting module, and a receiving groove is provided on a side of the glass cover plate facing the transparent adhesive layer, and the receiving groove is provided corresponding to the non-display area of ​​the light emitting module.

[0033] In one embodiment of the present invention, a plurality of the containing grooves are formed on a side of the glass cover plate facing the transparent adhesive layer. The containing grooves are arranged in an array and are disposed corresponding to the non-display area of ​​the light emitting module.

[0034] In one embodiment of the present invention, the light emitting module includes a pixel isolation layer and an anode layer, a light emitting layer, and a cathode layer stacked in sequence;

[0035] The anode layer includes a plurality of anode units spaced apart on the surface of the substrate, the pixel isolation layer has an isolation portion and a plurality of openings, each anode unit is disposed in one of the openings, and the isolation portion is disposed around the periphery of each anode unit;

[0036] The isolation portion is arranged corresponding to the non-display area of ​​the light emitting module, and the orthographic projection of any of the containing grooves on the pixel isolation layer is located in the isolation portion.

[0037] In one embodiment of the present invention, the anode layer includes a first titanium layer, an aluminum layer, a second titanium layer and an indium tin oxide layer stacked in sequence along the direction of the substrate toward the light-emitting layer, and the light-emitting layer is arranged on the side of the indium tin oxide layer facing away from the second titanium layer.

[0038] In one embodiment of the present invention, the light emitting module further comprises a thin film encapsulation layer, and the thin film encapsulation layer is arranged on a side of the cathode layer facing away from the light emitting layer;

[0039] The thin film encapsulation layer comprises a first thin film layer, a second thin film layer and a third thin film layer stacked in sequence along the direction from the light emitting layer to the cathode layer;

[0040] Wherein, the first film layer and the third film layer are both aluminum oxide layers, and the second film layer is a silicon nitride layer.

[0041] In one embodiment of the present invention, the light emitting module further includes a filter layer and a light shielding layer;

[0042] The filter layer includes a plurality of filter units spaced apart on the side of the thin film encapsulation layer facing away from the cathode layer. The light shielding layer is arranged around the periphery of each of the filter units. The light shielding layer is arranged corresponding to the non-display area of ​​the light emitting module, and each of the containing grooves is arranged corresponding to the light shielding layer.

[0043] In order to solve the above technical problem, the present invention further provides a display device, which includes the display module as described above.

[0044] The method for handling impurities in a display module proposed by the present invention is to apply a transparent adhesive to the side of the light-emitting module away from the substrate to form a transparent adhesive layer; and then a glass cover plate with a groove is attached to the transparent adhesive layer to form a display module. Then the display panel is lit, and the impurities inside the display module will affect the propagation of light, so they will appear as dark spots on the screen surface, so that the position of the impurities in the display module can be determined, and the laser is adjusted based on the position of the impurity, so that the laser is focused on the impurity, and the impurity is vaporized by the heat generated by the laser. The vaporized impurities will float up and move to the groove of the glass cover plate under the heat gathering effect of the laser energy. Since the groove corresponds to the non-display area of ​​the display panel, the vaporized impurities will not affect the propagation of light in the display panel when they are contained in the groove, thereby alleviating the problem that the impurities are vaporized by the laser and spread in the display area, causing poor display of dark spots and affecting the display effect, and can make the display effect of the display panel more uniform in all parts of the display area. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0046] Figure 1 A flowchart of the steps of a method for treating impurities in a display module provided by the present invention in one embodiment;

[0047] Figure 2 for Figure 1 A flow chart of the steps of forming a receiving groove at a preset groove position on the surface of the glass cover plate;

[0048] Figure 3 for Figure 2 A flowchart of the steps after determining the preset slotting position according to the obtained coordinate information;

[0049] Figure 4 for Figure 1 A flow chart of the steps after laser vaporization of impurities;

[0050] Figure 5 for Figure 1 A flow chart of the steps after the gasified impurities are transferred into the container;

[0051] Figure 6 A schematic diagram of the internal structure of the display module provided by the present invention before impurities are processed;

[0052] Figure 7 A schematic diagram of the internal structure of the display module provided by the present invention after impurities are processed;

[0053] Figure 8 A schematic diagram of the structure of a display panel in a display module provided by the present invention;

[0054] Fig. 9 for Figure 8 A schematic diagram of the structure of a glass cover plate in a display module in one embodiment;

[0055] Fig.10 This is a schematic structural diagram of a glass cover plate in a display module provided by the present invention in another embodiment.

[0056] Description of Figure Numbers:

[0057] 10. Substrate; 11. Underlying layer; 12. Driving circuit; 20. Light-emitting module; 201. Display area; 202. Non-display area; 21. Anode layer; 211. Anode unit; 22. Pixel isolation layer; 221. Isolation portion; 222. Opening portion; 23. Light-emitting layer; 24. Cathode layer; 25. Thin-film encapsulation layer; 251. Third thin-film layer; 252. Second thin-film layer; 253. First thin-film layer; 26. Filter layer; 27. First positioning mark; 30. Transparent adhesive layer; 40. Glass cover; 41. Receptacle; 42. Second positioning mark.

[0058] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0059] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0060] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, etc.), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indication will also change accordingly.

[0061] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0062] The present invention proposes a method for processing impurities in a display module. The method for processing impurities in a display module can be applied to display modules such as LCD display modules, LED display modules and OLED display modules. The following embodiments of the present invention take a silicon-based OLED display module as an example to illustrate the impurity processing method.

[0063] Combination Figure 1 As shown, in one embodiment of the present invention, a method for processing impurities in a display module includes the steps of:

[0064] Providing a display panel, a transparent adhesive and a glass cover 40;

[0065] S100: coating a transparent adhesive on the surface of the display panel to form a transparent adhesive layer 30;

[0066] S200: forming a receiving groove 41 at a preset groove position on the surface of the glass cover plate 40, and attaching a side of the glass cover plate 40 with the receiving groove 41 to the surface of the transparent adhesive layer 30, so that the receiving groove 41 is arranged corresponding to the non-display area 202 of the display panel;

[0067] S300: lighting up the display panel and determining the location of the impurities in the display module;

[0068] S400 : vaporizing impurities with laser, and transferring the vaporized impurities into the container tank 41 .

[0069] In this embodiment, the display panel includes a substrate 10 and a light-emitting module 20 deposited on the substrate 10, and a glass cover plate 40 is encapsulated on the display panel through a transparent adhesive layer 30. The glass cover plate 40 has good rigidity and light transmittance, and thus can provide support and protection for the display panel. The transparent adhesive forming the transparent adhesive layer 30 is an OCA (Optically Clear Adhesive) optical adhesive, which has good light transmittance and bonding strength. The transparent adhesive can be coated on the surface of the display panel using a glue coating device, and the transparent adhesive before curing has good fluidity and can fully flow and spread and cover the surface of the display panel.

[0070] In order to improve the bonding strength between the transparent adhesive and the display panel, before applying the transparent adhesive, the surface of the display panel needs to be cleaned, such as plasma cleaning, organic solvent cleaning or ultrapure water cleaning, so that the surface of the display panel has a smaller water drop angle, thereby improving the bonding strength between the display panel and the transparent adhesive.

[0071] In the steps of forming the groove 41 at the preset position of the glass cover plate 40 and attaching the glass cover plate 40 to the transparent adhesive layer 30, the groove 41 can be formed by dry etching, wet etching, etc., and the size of the groove 41 can be controlled by selecting different etching materials and controlling the etching time. The glass cover plate 40 etched with the groove 41 is attached to the surface of the display panel using a high-precision bonding device. During bonding, the glass cover plate 40 and the display panel are positioned using the optical detection system of the bonding device so that the groove 41 corresponds to the non-display area 202 of the display panel. The groove 41 is arranged on the side of the glass cover plate 40 facing the transparent adhesive layer 30. When the glass cover plate 40 is attached to the transparent adhesive layer 30, the groove 41 and the transparent adhesive layer 30 are enclosed to form a cavity. It can be understood that the step of forming the groove 41 on the surface of the glass cover plate 40 can also be performed before the display panel is processed and formed, while the display panel is processed and formed, or while the surface of the display panel is coated with a transparent adhesive.

[0072] When performing a display panel lighting test, the signal generator and the power module are electrically connected to the drive circuit of the display panel. The drive circuit receives the command signal generated by the signal generator and outputs a drive voltage signal to the light emitting module 20 so that the display panel displays a test image. Since impurities block or refract the light of the display panel, dark spots appear on the display module. The dark spots of the display module can be scanned by AOI (Automated Optical Inspection) automatic optical inspection equipment to determine the location and size of the impurities. Then the laser is focused on the location of the impurity using a laser transmitter head, and the energy generated by the laser vaporizes the impurity.

[0073] In the processing of the display panel, the anode layer 21, the light-emitting layer 23 and the cathode layer 24 in the light-emitting module 20 are generated by deposition, and the deposition methods include vapor deposition, physical deposition, etc., and the process accuracy of the deposition is mostly at the nanometer level, and the deposition process has high requirements for the dust-free level of the environment (for example, a class 100 clean room or a class 10 clean room). The bonding accuracy requirements of the transparent adhesive layer 30 and the glass cover plate 40 are relatively low, and the bonding accuracy requirements are usually controlled at the micron level. At the same time, the dustproof level of the bonding equipment is relatively low, and the bonding process has low requirements for the dust-free level of the environment (for example, a class 1000 clean room). Most of the impurities in the display module will be distributed in the transparent adhesive layer 30 used in the above-mentioned bonding process. Since the material of the transparent adhesive layer 30 is optical glue, its fluidity before curing is relatively large, and the distance between the transparent adhesive layer 30 and the container 41 is also close, so the impurities after laser vaporization can float up in the form of gas under the support of laser energy and move into the container 41. Therefore, the present application provides a groove 41 on the glass cover plate 40 for accommodating vaporized impurities, which can deal with the decomposition of most impurities remaining in the display module and has a good improvement effect on the dark spot display problem of the display module.

[0074] In addition, in the actual display module packaging process, most of the impurities in the display module are organic matter, so the impurities can be vaporized by controlling the energy of the laser. The vaporized impurities float and converge toward the glass cover plate 40 under the action of buoyancy, so that the vaporized impurities can be better collected in the container 41, thereby improving the problem of poor display of dark spots caused by impurities scattered inside the packaging structure of the display module, and improving the optical performance of the display module and the user experience.

[0075] Combination Figure 2 As shown, in one embodiment of the present invention, the step of forming the receiving groove 41 at the preset groove position on the surface of the glass cover plate 40 includes:

[0076] S210: setting a first positioning mark 27 on the display panel and a second positioning mark 42 on the glass cover 40;

[0077] S220: establishing a first plane coordinate system of the non-display area 202 of the display panel based on the first positioning mark 27, and establishing a second plane coordinate system of the glass cover plate 40 based on the second positioning mark 42;

[0078] S230: Determine coordinate information of the non-display area 202 on the glass cover 40 according to the first plane coordinate system and the second plane coordinate system, and determine a preset slot position according to the obtained coordinate information.

[0079] In this embodiment, the first positioning mark 27 and the second positioning mark 42 can be formed on the surface of the material by laser equipment, or can be deposited on the surface of the material by coating. The first positioning mark 27 and the second positioning mark 42 are used to position the display panel and the glass cover plate 40 respectively. When the groove 41 is opened and the glass cover plate 40 is aligned and attached to the display panel, the first positioning mark 27 and the second positioning mark 42 are identified by an optical detection module such as an industrial camera, and the coordinate origin of the plane coordinate system to be established with the surface of the display panel and the glass cover plate 40 as the base surface is obtained, and the coordinate information of the first plane coordinate system of the non-display area 202 on the display panel relative to the coordinate origin is established with this coordinate origin, and the coordinate information of the non-display area 202 relative to the positioning mark is transmitted to the groove opening device of the glass cover plate 40, and the groove opening device then accurately opens the groove 41 corresponding to the non-display area 202 on the glass cover plate 40 at the coordinate position of the non-display area 202 in the second plane coordinate system obtained by the second positioning mark 42.

[0080] When the glass cover plate 40 and the display panel are aligned and bonded, the optical detection module of the bonding equipment identifies the respective positioning marks on the display panel and the glass cover plate 40 to determine the position information of the display panel and the glass cover plate 40 in the bonding equipment, and then covers the glass cover plate 40 on the display panel through the adsorption module so that the positioning mark of the glass cover plate 40 coincides with the positioning mark of the display panel, thereby achieving the correspondence between the receiving groove 41 on the glass cover plate 40 and the non-display area 202 of the display panel.

[0081] Combination Figure 3 As shown, in one embodiment of the present invention, the step of determining the preset slot position according to the obtained coordinate information includes:

[0082] S240: forming a receiving groove 41 at a preset groove position on the surface of the glass cover plate 40 by dry etching;

[0083] S250: Cleaning impurities generated on the glass cover plate 40 after dry etching.

[0084] In this embodiment, the containment groove 41 is etched by a dry etching process. Since dry etching uses plasma bombardment to bombard the surface of the glass cover plate 40, compared with the wet etching process that uses a corrosive solvent to corrode the glass surface, dry etching can obtain the containment groove 41 with higher processing accuracy.

[0085] A lot of glass debris or etching reactants will appear around the groove 41 formed after etching, and these substances will also affect the light propagation of the display panel, so the glass cover plate 40 needs to be cleaned after etching. Pure water or ultrapure water is used as a cleaning solution during cleaning. Pure water is also deionized water, which has a lower conductivity and can improve the hydrophilicity of the glass cover plate 40, so that the cleaned glass cover plate 40 is easier to bond with the transparent adhesive layer 30. After using pure water to clean the glass cover plate 40, the glass cover plate 40 can be dried to remove moisture from the surface of the glass cover plate 40 to prevent moisture from remaining in the display module during the subsequent bonding process of the glass cover plate 40 and the display panel, thereby affecting the display effect of the display module.

[0086] Combination Figure 4 As shown, in one embodiment of the present invention, the step of vaporizing the impurities with laser includes:

[0087] S410: heating the display module for a first preset time;

[0088] S420: leaving the display module still for a second preset time.

[0089] In this embodiment, after the impurities are vaporized, they will automatically converge toward the glass cover plate 40 under the action of gas buoyancy. Therefore, after the impurities are vaporized by laser, the vaporized impurities can be moved and concentrated into the containing groove 41 by keeping the display module still for a period of time or by heating, so as to improve the treatment effect of the impurities. Since heating promotes the flow of gas, the first preset time will be shorter than the second preset time, and the flow status of the impurities is detected in real time by the AOI equipment to obtain the first preset time and the second preset time.

[0090] Combination Figure 5 As shown, in one embodiment of the present invention, the step of transferring the gasified impurities into the container 41 includes:

[0091] S430 : irradiating the transparent adhesive layer 30 with ultraviolet light to cure the transparent adhesive layer 30 .

[0092] In this embodiment, the photoinitiator in the transparent adhesive generates active free radicals or cations under ultraviolet irradiation, thereby initiating monomer polymerization, cross-linking and branching chemical reactions, and converting the transparent adhesive from a liquid state to a solid state. The transparent adhesive layer 30 is in a liquid state before ultraviolet curing. At this time, after the impurities are vaporized by laser, the vaporized impurities can move in the transparent adhesive layer 30 in a viscous state, thereby providing conditions for the vaporized impurities to move into the groove 41 on the glass cover plate 40 under the action of laser energy or heating. After the impurities are transferred to the groove 41, the transparent adhesive layer 30 is irradiated with ultraviolet light again, so that the transparent adhesive layer 30 is cured into a solid form that cannot flow or has extremely low fluidity. At this time, the cured transparent adhesive layer 30 covers the notch of the groove 41, thereby effectively preventing the impurities in the groove 41 from diffusing into the transparent adhesive layer 30 again, and more thoroughly and permanently solving the problem of poor display of dark spots caused by impurities being retained in the display area 201 of the display panel.

[0093] The invention also provides a display module.

[0094] The display module may be an LCD display module, an LED display module, an OLED display module, etc. The following embodiments of the present invention take a silicon-based OLED display module as an example to illustrate the specific structure of the display module.

[0095] Combination Figure 6 and Figure 7 As shown, in one embodiment of the present invention, the display module includes a display panel, a transparent adhesive layer 30 and a glass cover plate 40; the display panel includes a substrate 10 and a light-emitting module 20, the light-emitting module 20 is arranged on the substrate 10, and the light-emitting module 20 has a display area 201 and a non-display area 202 arranged around the display area 201; the transparent adhesive layer 30 is arranged on the side of the light-emitting module 20 facing away from the substrate 10; the glass cover plate 40 is arranged on the side of the transparent adhesive layer 30 facing away from the light-emitting module 20, and a receiving groove 41 is opened on the side of the glass cover plate 40 facing the transparent adhesive layer 30, and the receiving groove 41 is arranged corresponding to the non-display area 202 of the light-emitting module 20.

[0096] In this embodiment, the substrate 11 of the substrate 10 is made of silicon, which is a traditional semiconductor material used to manufacture integrated circuits and electronic devices. In silicon-based OLED display technology, semiconductor technology and OLED technology are combined, and the silicon substrate 10 provides stable support and good electrical performance, and has the advantages of high resolution, low power consumption, small size, light weight, etc., and is more widely used in AR, VR, and wearable devices.

[0097] The substrate 10 includes a substrate 11 and a CMOS driving circuit 12 arranged on the surface of the substrate 11. The driving circuit 12 is formed by semiconductor processing techniques such as epitaxy, photolithography, etching, deposition, and electroplating. The driving circuit 12 is arranged on the surface of the silicon substrate 11 to facilitate the electrical connection between the driving circuit 12 and the light-emitting module 20, thereby improving the integration of the display panel.

[0098] The display area 201 in the light-emitting module 20 includes an anode layer 21, a light-emitting layer 23 and a cathode layer 24, wherein the anode layer 21 and the cathode layer 24 are electrically connected to the driving circuit 12, so that an electric field is formed between the anode layer 21 and the cathode layer 24. Under the action of the electric field, the electrons in the light-emitting layer 23 transition to the holes and release energy in the form of light, thereby achieving the effect of luminescence. A light-shielding isolation area is provided between each pixel display area 201 of the light-emitting module 20 to prevent light mixing between adjacent pixel display areas 201, and the light-shielding isolation area is also the non-display area 202. Therefore, the container 41 for accommodating vaporized impurities on the glass cover plate 40 is provided corresponding to the non-display area 202 of the light-emitting module 20, so as to avoid the influence of the container 41 on the propagation of light in the display area 201, thereby ensuring the display effect of the display panel.

[0099] The transparent adhesive layer 30 may be made of an optically transparent adhesive material, which not only serves to fix the light emitting module 20 and the glass cover 40 , but also has good light transmittance to reduce light loss.

[0100] The surface of the glass cover plate 40 is treated with hydrophobic and oleophobic treatment to improve the anti-pollution capability. The glass cover plate 40 can be made of low-iron glass material to reduce color deviation and improve the accuracy of displayed colors.

[0101] When the display module is packaged, impurities such as dust and other non-packaging layer materials will inevitably exist inside the packaging structure. These impurities will affect the imaging and luminescence of the display panel. When the display panel is powered on, the display area 201 corresponding to the impurities will form a display dark spot. Therefore, the present application uses the impurity processing method in the above-mentioned display module to process the dark spots, using a laser to focus on the impurities, and the impurities are vaporized by the heat generated by the laser. The vaporized impurities float up and move to the groove 41 of the glass cover plate 40 under the heat concentration effect of the laser energy. Since the groove 41 is set corresponding to the non-display area 202 of the light-emitting module 20, the vaporized impurities are contained in the groove 41, which will not affect the light propagation in the display panel, thereby improving the dark spots in the display area 201 and making the display effect of various parts of the display panel more uniform.

[0102] Combination Figures 8 to 10 As shown, in one embodiment of the present invention, a glass cover plate 40 is provided with a plurality of grooves 41 on one side facing the transparent adhesive layer 30 . The grooves 41 are arranged in an array and are disposed corresponding to the non-display area 202 of the light emitting module 20 .

[0103] In this embodiment, the display area 201 of the light emitting module 20 is generally provided with a plurality of Figure 8 As shown, the display areas 201 are arrayed and spaced apart on the surface of the substrate 10, and the non-display areas 202 are arranged around the periphery of the display areas 201. Therefore, the shapes and positions of the plurality of grooves 41 are arranged to match the non-display areas 202, so that each groove 41 is arranged corresponding to the non-display area 202.

[0104] Specifically, in one embodiment, Fig. 9 As shown, the shape of the multiple containing grooves 41 is rectangular, and a containing groove 41 is set around each display area 201. The containing grooves 41 can be evenly arranged on the surface of the glass cover plate 40, or according to the probability of impurity distribution in the display module, more containing grooves 41 can be set corresponding to the positions where the probability of impurities appearing is higher, and fewer containing grooves 41 can be set corresponding to the positions where the probability of impurities appearing is lower.

[0105] In another embodiment, Fig.10 As shown, the multiple receiving grooves 41 are all annular in shape and are respectively arranged around the periphery of each display area 201. Through the above design, after the impurities in the display area 201 are gasified, they can be moved and accommodated in the receiving grooves 41 no matter which direction they move, effectively improving the display effect of different positions of the display panel.

[0106] In one embodiment of the present invention, the groove 41 is rectangular, and the width of the groove 41 is L, where 1um≤L≤10um; the size of the groove 41 is related to the size of the impurities and the thickness of the glass cover plate 40. A smaller width will affect the containment of impurities, resulting in the vaporized impurities being far away from the groove 41 and unable to quickly enter the groove 41, or the vaporized impurities overflowing the groove 41 and spreading around the periphery of the groove 41, affecting the improvement effect; at the same time, a larger width of the groove 41 will exceed the range of the non-display area 202, thereby affecting the display effect of the display panel (such as color saturation, color gamut, etc.), and the larger width of the groove 41 on the glass cover plate 40 will also affect the structural strength of the glass cover plate 40.

[0107] The depth of the groove 41 is H, where 1um≤H≤50um. Similarly, a smaller depth will affect the amount of impurities contained after gasification; a larger depth will affect the strength of the glass cover plate 40 and the reliability of the display module. Since the thickness of the commonly used glass cover plate 40 is mostly 0.5mm or 0.7mm, the depth of the groove 41 is controlled between 1 and 50um to ensure that the structural strength and reliability of the glass cover plate 40 meet the requirements.

[0108] Combination Figure 6 and Figure 7As shown, in one embodiment of the present invention, the light emitting module 20 includes a pixel isolation layer 22 and an anode layer 21, a light emitting layer 23, and a cathode layer 24 stacked in sequence;

[0109] The anode layer 21 includes a plurality of anode units 211 spaced apart on the surface of the substrate 10. The pixel isolation layer 22 includes an isolation portion 221 and a plurality of openings 222. Each anode unit 211 is disposed in an opening 222. The isolation portion 221 is disposed around the periphery of each anode unit 211.

[0110] The isolation portion 221 is disposed corresponding to the non-display area 202 of the light emitting module 20 , and the orthographic projection of any receiving groove 41 on the pixel isolation layer 22 is located in the isolation portion 221 .

[0111] In this embodiment, driven by the electric field force of the anode layer 21 and the cathode layer 24, the electrons and holes injected from the anode layer 21 and the cathode layer 24 recombine in the light-emitting layer 23 to form excitons in a bound energy level. The excitons are in an unstable state and undergo radiative transitions, and release energy in the form of emitted photons, thereby generating visible light.

[0112] The anode layer 21 is divided into a plurality of anode units 211 arranged in sequence and spaced parallel to the surface of the substrate 10, so that the driving circuit 12 can generate an electric field by controlling different anode units 211 to realize light emission in different display areas 201 on the display panel. The material of the pixel isolation layer 22 is an inorganic substance, and the isolation part 221 arranged at the periphery of each anode unit 211 can isolate the anode unit 211, reduce the mutual interference of light between different display areas 201, and thus improve the clarity and contrast of the image.

[0113] Furthermore, the pixel isolation layer 22 also includes an isolation bottom layer, which is deposited between the anode layer 21 and the substrate 10, and an isolation portion 221 is deposited on the side of the isolation bottom layer facing the anode layer 21, and the isolation portion 221 is a T-shaped structure. The isolation bottom layer plays a role in electrically isolating the conductive anode layer 21 from the CMOS driving circuit 12 on the surface of the silicon wafer, and at the same time, a through hole is etched on the surface of the isolation bottom layer, and copper or silver is electroplated on the inner wall of the through hole, so that the anode layer 21 is electrically connected to a specific connection point on the CMOS circuit through the through hole.

[0114] like Figure 6 and Figure 7As shown, the isolation portion 221 with a T-shaped structure is located between two adjacent anode units 211, and the isolation portion 221 is deposited and pressed on the anode layer 21 toward both sides of the anode unit 211, and the portion pressed on the anode layer 21 is provided with a chamfer, and the inclination direction of the chamfer is toward the other end of the isolation portion 221. Therefore, the isolation portion 221 with a T-shaped structure can improve the light isolation effect between the two adjacent display areas 201 while reducing the shielding of the isolation portion 221 on the edge of the display area 201, thereby improving the uniformity of light emission at the edge of the display area 201.

[0115] Since the cavity 41 has a cavity structure, the gas and the glass cover plate 40 have different refractive indices, so the light path will be refracted and shifted after passing through the cavity 41. Therefore, each cavity 41 corresponds to an isolation portion 221 up and down, that is, each cavity 41 is located above the non-display area 202, so that the cavity 41 avoids the main light-emitting area of ​​the display panel, thereby reducing the influence of the arrangement of the cavity 41 on the display effect of the display panel.

[0116] The material of the pixel isolation layer 22 is an inorganic substance, for example, SiN, SiO, SiON can be selected. In one embodiment of the present invention, silicon nitride (SiN) is selected as the material of the pixel isolation layer 22, and the thickness of the silicon nitride is 100 to 500 nm. Since the resistivity of silicon nitride is extremely high, which can reach 1014Ω.cm, the resistivity is much higher than some common insulating materials, such as silicon oxide. The higher resistivity helps to improve the electrical isolation effect of the pixel isolation layer 22 on the anode layer 21 and the driving circuit 12, as well as the electrical isolation effect between the two anode units 211, thereby improving the electrical performance and reliability of the display panel.

[0117] In one embodiment of the present invention, the anode layer 21 includes a first titanium layer, an aluminum layer, a second titanium layer and an indium tin oxide layer stacked in sequence along the direction of the substrate 10 toward the light-emitting layer 23, and the light-emitting layer 23 is arranged on the side of the fourth indium tin oxide layer facing away from the second titanium layer.

[0118] The thickness of the first titanium layer is 10-30 nm. Since titanium has strong corrosion resistance and mechanical strength, the first titanium layer is disposed between the aluminum layer and the driving circuit 12 layer of the substrate 10 to improve the material strength of the anode layer 21 .

[0119] The thickness of the aluminum layer is 5 to 100 nm. Aluminum has good electrical conductivity and can improve the electrical conductivity between the anode layer 21 and the cathode layer 24, thereby improving the injection efficiency of holes in the light-emitting layer 23. In addition, aluminum has the function of reflecting light waves, and can reflect the light emitted by the light-emitting layer 23 toward the anode layer 21, thereby enhancing the light-emitting effect of the display panel.

[0120] The thickness of the indium tin oxide layer is 1 to 100 nm. Indium tin oxide is a transparent conductive oxide with good conductivity, excellent chemical and physical stability, high hole injection efficiency, and high transparency. It can effectively inject holes into organic materials, improve the current efficiency of the device, and enable the device to achieve very high brightness at a relatively small current.

[0121] The applicant found in the study that indium tin oxide and aluminum are easily miscible, so a second titanium layer is provided between the indium tin oxide layer and the aluminum layer. The thickness of the second titanium layer is 1 to 5 nm to prevent the aluminum layer from miscible with the indium tin oxide layer.

[0122] Combination Figure 6 and Figure 7 As shown, in one embodiment of the present invention, the light emitting module 20 further includes a thin film encapsulation layer 25, and the thin film encapsulation layer 25 is disposed on a side of the cathode layer 24 facing away from the light emitting layer 23;

[0123] The thin film encapsulation layer 25 includes a first thin film layer 253, a second thin film layer 252 and a third thin film layer 251 which are sequentially stacked along the direction from the light emitting layer 23 to the cathode layer 24;

[0124] The first film layer 253 and the third film layer 251 are both aluminum oxide layers, and the second film layer 252 is both silicon nitride layers.

[0125] Since the light-emitting layer 23 of the OLED display panel is made of organic material, it is very sensitive to moisture and oxygen. The water and oxygen environmental factors will aggravate the aging of the device. Therefore, in this embodiment, a thin film encapsulation layer 25 is arranged on the side of the cathode layer 24 away from the light-emitting layer 23. The thin film encapsulation layer 25 can isolate the OLED light-emitting layer 23 from moisture and oxygen, thereby improving the stability and reliability of the device.

[0126] In this embodiment, the thin film encapsulation layer 25 adopts a three-layer stacked structure. Compared with a single-layer inorganic structure, the solution of the present application can make up for the defects of the single-layer thin film encapsulation layer 25.

[0127] Specifically, silicon nitride and aluminum oxide both have good barrier properties against water and oxygen, and the barrier properties increase with the increase of material thickness. However, the applicant found in the study that when the thickness of silicon nitride is large, it will generate greater stress inside the thin film encapsulation layer 25, and as the thickness of silicon nitride increases, the stress generated inside the thin film encapsulation layer 25 will also increase, and the thin film encapsulation layer 25 is prone to fall off, warping and damage. However, when the thickness of aluminum oxide increases, there will be no obvious increase in stress inside the thin film encapsulation layer 25, but the production time of aluminum oxide is longer, and thicker aluminum oxide means longer processing time and higher production costs.

[0128] Therefore, the present application designs the thin film encapsulation layer 25 as a three-layer stacked structure, and an aluminum oxide layer is arranged on both sides of the silicon nitride layer, wherein the thickness of the silicon nitride layer is 1 to 2 um, and the thickness of the aluminum oxide layer is 30 to 50 um, thereby achieving the effect of shorter processing time, better encapsulation effect, and prevention of stress and strain of the thin film encapsulation layer 25.

[0129] Combination Figure 6 and Figure 7 As shown, in one embodiment of the present invention, the light-emitting module 20 further includes a filter layer 26 and a shading layer; the shading layer includes a plurality of filter units spaced apart on the side of the thin-film encapsulation layer 25 facing away from the cathode layer 24, the shading layer is arranged around the periphery of each filter unit, the shading layer is arranged corresponding to the non-display area 202 of the light-emitting module 20, and each containing groove 41 is arranged corresponding to the shading layer.

[0130] In the filter layer 26 of the display panel, different light-emitting materials may be used in different filter units so that different display areas 201 emit light of different colors.

[0131] In this embodiment, a plurality of filter units are arranged adjacent to each other in a direction parallel to the surface of the substrate 10, and the light emitted from each filter unit has three different colors: red, green, and blue. The light shielding layer can be made of a material that absorbs light, such as a polymer doped with carbon black, that is, a black matrix (BM) in an OLED display panel, to prevent the light emitted from different filter units from being confused, and to absorb the excess ambient light entering from the outside of the display panel to improve the contrast of the display panel.

[0132] The receiving groove 41 on one side of the glass cover plate 40 is arranged corresponding to the light shielding layer, avoiding the light emitting surface of each filter unit, so as to avoid the influence of the receiving groove 41 on the display effect of the display panel.

[0133] Combination Figures 8 to 10 As shown, in one embodiment of the present invention, positioning marks are provided on the surfaces of the glass cover plate 40 and the display panel, and the positioning marks are used to position the glass cover plate 40 and the display panel when attaching the glass cover plate 40 .

[0134] Combined with the description of the above embodiment, it can be known that the groove 41 is arranged in the non-display area 202 to prevent the groove 41 from affecting the display effect of the display panel. Therefore, when the glass cover plate 40 is packaged and bonded, the alignment accuracy of the glass cover plate 40 and the display panel needs to be ensured.

[0135] Therefore, in this embodiment, positioning marks are provided on the surfaces of the glass cover plate 40 and the display panel. The color of the positioning marks is an opaque color such as black or gray, which can be clearly distinguished from the colors of the glass cover plate 40 and the display panel, so that the optical recognition module of the bonding device can recognize the outline of the positioning marks. The shape of the positioning mark can be a cross, triangle or T-shaped or other angular shapes to improve the angle recognition accuracy of the positioning mark by the optical recognition module. A plurality of positioning marks are provided on the glass cover plate 40 and the display panel, and are respectively arranged around the periphery of the glass cover plate 40 and the display panel. By positioning and identifying the plurality of positioning marks, the positioning accuracy of the glass cover plate 40 and the display panel can be further improved.

[0136] The present invention also proposes a display device, which includes a display module. The specific structure of the display module refers to the above-mentioned embodiment. Since the display device adopts all technical solutions of all embodiments of the above-mentioned display module, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here one by one.

[0137] The display device can be a smart wearable device, a mobile phone, a computer and other devices. Since OLED display technology has the advantages of self-luminous characteristics, high contrast, thin and light appearance, low power consumption and so on, OLED display modules are widely used in smart wearable devices, such as smart watches, AR\VR glasses and other wearable display products. At the same time, combined with the structure of the silicon-based OLED display module of this application and the proposed technical solution to improve the influence of impurities in the display module on the display effect, the display module plays a greater role in the application of smart wearable devices.

[0138] Specifically, when the display module is applied to a smart wearable device, the smart wearable device also includes a device housing, a battery, a processor, a sensor, a communication module, and a connection component, wherein the battery, the sensor, the processor, and the communication module are all arranged inside the housing, and the battery supplies power to the above components. At the same time, the components are connected through line communication. The display module is exposed on the surface of the device housing, and the operating functions and pictures of the smart wearable device are displayed through the display module. Through the improvement scheme proposed by this application for the display module, its application on smart wearable devices improves the user experience.

[0139] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A method for treating impurities in a display module, characterized in that: Includes steps: Providing a display panel, a transparent adhesive, and a glass cover; Applying the transparent adhesive on the surface of the display panel to form a transparent adhesive layer; Processing a groove at a preset groove position on the surface of the glass cover plate to form a groove, and attaching a side of the glass cover plate with the groove to the surface of the transparent adhesive layer so that the groove is arranged corresponding to the non-display area of ​​the display panel; Lighting up the display panel to determine the location of the impurities in the display module; The impurities are vaporized by laser, so that the vaporized impurities are transferred into the containing tank.

2. The method for treating impurities in a display module according to claim 1, wherein: The step of machining a preset groove position on the surface of the glass cover plate to form a groove comprises: Setting a first positioning mark on the display panel and setting a second positioning mark on the glass cover plate; Establishing a first plane coordinate system of the non-display area of ​​the display panel based on the first positioning mark, and establishing a second plane coordinate system of the glass cover plate based on the second positioning mark; Coordinate information of the non-display area on the glass cover plate is determined according to the first plane coordinate system and the second plane coordinate system, and the preset slot position is determined according to the obtained coordinate information.

3. The method for treating impurities in a display module according to claim 2, wherein: After the step of determining the preset slot position according to the obtained coordinate information, the following steps are included: Forming the receiving groove at the preset groove position of the glass cover plate by dry etching; Clean the impurities on the glass cover plate generated after dry etching.

4. The method for treating impurities in a display module according to claim 1, wherein: The step of gasifying the impurities with laser comprises: Heating the display module for a first preset time; The display module is left to stand for a second preset time.

5. The method for treating impurities in a display module according to claim 1, wherein: After the step of transferring the gasified impurities into the container, the following steps are included: The transparent adhesive layer is cured by ultraviolet light irradiation.

6. A display module, characterized in that: The display module comprises: A display panel, the display panel comprising a substrate and a light-emitting module, the light-emitting module being arranged on the substrate, the light-emitting module having a display area and a non-display area surrounding the display area; a transparent adhesive layer, the transparent adhesive layer being disposed on a side of the light emitting module facing away from the substrate; and A glass cover plate is provided on a side of the transparent adhesive layer facing away from the light emitting module, and a receiving groove is provided on a side of the glass cover plate facing the transparent adhesive layer, and the receiving groove is provided corresponding to the non-display area of ​​the light emitting module.

7. The display module according to claim 6, wherein: A plurality of the containing grooves are formed on a side of the glass cover plate facing the transparent adhesive layer. The containing grooves are arranged in an array and are arranged corresponding to the non-display area of ​​the light emitting module.

8. The display module according to claim 6 or 7, characterized in that: The light emitting module comprises a pixel isolation layer and an anode layer, a light emitting layer and a cathode layer stacked in sequence; The anode layer includes a plurality of anode units spaced apart on the surface of the substrate, the pixel isolation layer has an isolation portion and a plurality of openings, each anode unit is disposed in one of the openings, and the isolation portion is disposed around the periphery of each anode unit; The isolation portion is arranged corresponding to the non-display area of ​​the light emitting module, and the orthographic projection of any of the containing grooves on the pixel isolation layer is located in the isolation portion.

9. The display module according to claim 8, wherein: The anode layer includes a first titanium layer, an aluminum layer, a second titanium layer and an indium tin oxide layer stacked in sequence along the direction from the substrate to the light-emitting layer. The light-emitting layer is arranged on a side of the indium tin oxide layer facing away from the second titanium layer.

10. The display module according to claim 8, wherein: The light emitting module further comprises a thin film encapsulation layer, and the thin film encapsulation layer is arranged on a side of the cathode layer facing away from the light emitting layer; The thin film encapsulation layer comprises a first thin film layer, a second thin film layer and a third thin film layer stacked in sequence along the direction from the light emitting layer to the cathode layer; Wherein, the first film layer and the third film layer are both aluminum oxide layers, and the second film layer is a silicon nitride layer.

11. The display module according to claim 10, wherein: The light emitting module further comprises a light filtering layer and a light shielding layer; The filter layer includes a plurality of filter units spaced apart on the side of the thin film encapsulation layer facing away from the cathode layer. The light shielding layer is arranged around the periphery of each of the filter units. The light shielding layer is arranged corresponding to the non-display area of ​​the light emitting module, and each of the containing grooves is arranged corresponding to the light shielding layer.

12. A display device, characterized in that: The display device comprises the display module as claimed in any one of claims 6 to 11.

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