Molded part

Abstract

The molded member is provided with: an inner member having an electronic component body (detection component body) and a lead extending from the electronic component body (detection component body); connection terminals connected to the leads (11, 13, 22, 23); a first molded portion covering the inner member and holding the connection terminal; and a second molded part covering the first molded part. The second molded part has a non-water-immersed region disposed in a region where water immersion is suppressed, and a through-hole (outer through-hole) extending from the surface of the second molded part to the first molded part is formed only in the non-water-immersed region of the second molded part.

Description

Technical Field

[0001] The present disclosure relates to molded parts. Background Art

[0002] A wheel speed sensor for measuring the rotation speed of a wheel is mounted on a vehicle such as an automobile. As such a wheel speed sensor, a device described in Japanese Patent Publication No. 2017-096828 is known. The wheel speed sensor described in Japanese Patent Publication No. 2017-096828 includes a plurality of detection element parts and a bracket part for holding the plurality of detection element parts. The bracket part is formed by injection molding while holding the detection element parts in a predetermined configuration. In addition, the detection element part and the bracket part are covered by a resin molded part to form a molded body.

[0003] Prior art literature

[0004] Patent Document 1: Japanese Patent Application Publication No. 2017-096828 Summary of the invention

[0005] Problems to be solved by the invention

[0006] Here, when forming the resin molded part, the bracket part as the insert is fixed by a pin, so a through hole is formed in the resin molded part to penetrate from the outer surface of the resin molded part to the bracket part. It is desired to further suppress water intrusion into the internal components.

[0007] Therefore, an object of the present invention is to provide a molded component that further suppresses water intrusion into internal components.

[0008] Means for solving problems

[0009] The molded component disclosed herein comprises: an internal component having an electronic component body and a lead extending from the electronic component body; a connecting terminal connected to the lead, a first molded portion covering the internal component and holding the connecting terminal; and a second molded portion covering the first molded portion, wherein the second molded portion has a non-water-immersed area arranged in an area where water immersion is suppressed, and a through hole extending from the surface of the second molded portion to the first molded portion is formed only in the non-water-immersed area of ​​the second molded portion.

[0010] Effects of the Invention

[0011] According to the present invention, since the through-holes are formed only in the non-water-immersion area, water intrusion into the through-holes can be suppressed, thereby further suppressing water intrusion into internal components through the through-holes. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a three-dimensional diagram showing a molded part.

[0013] Figure 2 It is a perspective view showing the portion of the molded component excluding the second molded portion.

[0014] Figure 3 This is a partial enlarged view showing a part of the connecting portion of the first molded portion together with the exposed portion of the lead and the exposed portion of the connection terminal.

[0015] Figure 4 This is a partial enlarged view showing a part of the connecting portion of the first molded portion together with the exposed portion of the lead and the exposed portion of the connection terminal.

[0016] Figure 5 This is a plan view showing a molded component in a state of being assembled to an assembly target component together with a part of the assembly target component.

[0017] Figure 6 This is a side view showing a molded component in a state of being assembled to an assembly target component together with a part of the assembly target component.

[0018] Figure 7 This is an explanatory diagram showing a process in manufacturing a molded part.

[0019] Figure 8 This is an explanatory diagram showing a process in manufacturing a molded part. DETAILED DESCRIPTION

[0020] [Description of Embodiments of the Present Disclosure]

[0021] First, embodiments of the present disclosure will be described below.

[0022] The molded part of the present disclosure is as follows.

[0023] (1) A molded component comprising: an internal component having an electronic component body and a lead extending from the electronic component body; a connection terminal connected to the lead; a first molded portion covering the internal component and holding the connection terminal; and a second molded portion covering the first molded portion, the second molded portion having a non-water-immersed area arranged in an area where water immersion is suppressed, and a through hole extending from a surface of the second molded portion to the first molded portion is formed only in the non-water-immersed area of ​​the second molded portion.

[0024] According to such a molded component, since the first molded part is a component that covers the internal component and holds the connecting terminal, when the second molded part is molded, the through hole formed in the non-water-immersed area can be used to position the internal component covered by the first molded part and the connecting terminal held by the first molded part in the second molded part.

[0025] In addition, since the through hole is formed only in the non-water-immersion area, the through hole can be used to position the first molded part, which is a part covering the internal parts and holding the connection terminals, so it is difficult for water to penetrate into the through hole itself. Therefore, it is also difficult for water to penetrate between the first molded part and the second molded part. Thus, water intrusion into the internal parts can be suppressed.

[0026] Furthermore, since the internal component and the connection terminal can be molded by the first molded portion as one component, the number of manufacturing steps can be reduced compared to the case where the internal component and the connection terminal are molded separately.

[0027] (2) In (1), on the basis of the molded component, the first molded portion may include: a head portion covering the electronic component body, a connection terminal holding portion holding a portion of the connection terminal, and a connecting portion connecting the head portion and the connection terminal holding portion, wherein the lead and the connection terminal each have an exposed portion exposed from the first molded portion, and in the connecting portion, the exposed portion of the lead and the exposed portion of the connection terminal are connected by solder, and the second molded portion covers the exposed portion of the lead in the connecting portion, the exposed portion of the connection terminal, and the solder connecting the exposed portion of the lead and the exposed portion of the connection terminal.

[0028] According to such a molded component, since the exposed portion of the lead wire and the exposed portion of the connection terminal are provided at the connection portion, soldering is easy.

[0029] In addition, since the solder is covered by the second molded portion, the connection between the lead and the connection terminal becomes more reliable. In addition, since the exposed portion of the lead, the exposed portion of the connection terminal and the solder are covered by the second molded portion, water infiltration into the exposed portion of the lead, the exposed portion of the connection terminal and the solder can be suppressed.

[0030] (3) In the molded component of (1) or (2), the connection terminal may include a connector exposed portion exposed from the first molded portion and the second molded portion, and the connector exposed portion is a connection portion connected to a connector connected to another electrical component.

[0031] According to such a molded component, the exposed portion for connector is held by the first molded portion at a constant position suitable for connection with the connector. Therefore, the exposed portion for connector is easily connected to the connector.

[0032] (4) In the molded component according to any one of (1) to (3), the non-water-immersed area may include an area covering the electronic component body.

[0033] According to such a molded component, since the non-water-immersed area includes the area covering the electronic component body, the through hole is formed in the area covering the electronic component body (the area covering the head). As a result, it is easy to position the portion of the first molded part covering the electronic component body in the second molded part using the through hole. Therefore, the position accuracy of the electronic component body in the first molded part and the second molded part is improved.

[0034] (5) In the molded component according to any one of (1) to (4), an O-ring may be attached to an outer periphery of the second molded portion, and the O-ring may partition the non-water-immersed area from an area other than the non-water-immersed area.

[0035] According to such a molded component, a non-water-immersed area is provided by the water-stopping effect of the O-ring. A through hole is formed only in the non-water-immersed area, thereby suppressing water intrusion into the internal component.

[0036] (6) In the molded component described in any one of (1) to (5), the second molded portion may include a first surface and a second surface facing in a direction opposite to the first surface, the through holes are formed on both the first surface and the second surface, and the number of through holes formed on the first surface is at least two.

[0037] According to such a molded component, since the through holes are formed on both the first surface and the second surface, the first molded portion can be positioned in the direction connecting the first surface and the second surface by using the through holes. In addition, since two or more through holes are formed on the first surface, the rotational deviation of the first molded portion as an insert can be suppressed during the molding of the second molded portion.

[0038] [Details of the embodiments of the present disclosure]

[0039] Hereinafter, specific examples of the molded component of the present disclosure will be described with reference to the drawings. In addition, the present disclosure is not limited to these examples, but is indicated by the claims, and is intended to include all changes within the meaning and scope equivalent to the claims.

[0040] In addition, the drawings are schematically shown, and for the convenience of explanation, the structure is appropriately omitted or simplified in the drawings. In addition, the size and position of the structures shown in different drawings are not necessarily accurately recorded and can be appropriately changed. In addition, in drawings such as top views that are not sectional views, hatching is sometimes marked to facilitate understanding of the contents of the embodiments.

[0041] In the following description, the same components are denoted by the same reference numerals and the same names and functions are also the same, so in order to avoid duplication, their detailed description may be omitted.

[0042] [First embodiment]

[0043] Hereinafter, the molded component 1 according to the present embodiment will be described. Figure 1 It is a perspective view showing the molded component 1. Figure 2 It is a perspective view showing a portion of the molded component 1 excluding the second molded portion 50 . Figure 3 This is a partially enlarged view showing a part of the connecting portion 43 of the first molded portion 40 together with the exposed portions 12 a and 13 a of the leads 12 and 13 and the exposed portions 31 a and 32 a of the connection terminals 30 . Figure 4 This is a partially enlarged view showing a part of the connecting portion 43 of the first molded portion 40 together with the exposed portions 22 a and 23 a of the leads 22 and 23 and the exposed portions 33 a and 33 a of the connection terminals 30 . Figure 3 is a stereoscopic view viewed from the first surface I side, Figure 4 This is a perspective view as viewed from the second surface II side. In each figure and the following description, the longitudinal direction of the molded component 1 is L, and the width direction is W.

[0044] <Structure of Molded Part 1>

[0045] The molded component 1 is used, for example, to measure the rotation speed of a tire of a vehicle. The molded component 1 detects, for example, a change in a magnetic field caused by the rotation of a detected object that rotates together with the rotation of the tire. The molded component 1 includes: two inner components 10 and 20, connection terminals 30 connected to the inner components 10 and 20, respectively, a first molded portion 40 that covers the inner components 10 and 20 and holds the connection terminals 30, and a second molded portion 50 that covers the first molded portion 40. In addition, the second molded portion 50 has a first surface I and a second surface II facing in a direction opposite to the first surface I.

[0046] <Structure of internal components 10, 20>

[0047] The internal component 10 has a detection element body 11 as an electronic component body and a plurality of (here, two) leads 12, 13 extending from the detection element body 11. The two leads 12, 13 are arranged side by side with a gap. The internal component 20 has the same structure as the internal component 10. The internal component 20 has a detection element body 21 as an electronic component body and a plurality of (here, two) leads 22, 23.

[0048] The inner components 10 and 20 are arranged in parallel in the width direction W of the molded component 1. The four leads 12, 13, 22, and 23 extend in the longitudinal direction L of the molded component 1 in a state of being arranged in parallel with each other.

[0049] The detection element bodies 11 and 21 detect, for example, magnetic field changes caused by the rotation of the detected object rotating together with the rotation of the tire. The detection element bodies 11 and 21 can also detect magnetic field changes around the detection element bodies 11 and 21 caused by the movement of a magnet such as a rotor installed in a magnetic encoder. The detection element bodies 11 and 21 output electrical signals corresponding to such magnetic field changes (wheel speed). The detection element bodies 11 and 21 are arranged at different positions in the rotation direction of the detected object, for example, thereby generating electrical signals at different timings. The electrical signals output from the detection element bodies 11 and 21 are transmitted to the connection terminals 30 via the leads 12, 13, 22, and 23. The electrical signals sent to the connection terminals 30 are input to other electrical components (for example, a control unit or a control device, etc.).

[0050] The leads 12, 13, 22, 23 are formed into a rectangular thin plate, for example. The leads 12, 13 extend from the detection element body 11 in parallel, and the leads 22, 23 extend from the detection element body 21 in parallel. The detection element bodies 11, 21 are adjacent to each other with a gap. In addition, the detection element bodies 11, 21 are in the same posture in the first molded portion 40. Therefore, the leads 12, 13, 22, 23 are also parallel to each other as a whole. Figure 3 As shown, the front ends of the leads 12 and 13 have exposed portions 12a and 13a exposed from the first molded portion 40. Parts of the exposed portions 12a and 13a of the leads 12 and 13 are lead soldering portions 12b and 13b. In addition, at the lead soldering portions 12b and 13b of the leads 12 and 13, the leads 12 and 13 are soldered and connected to the connection terminals 30 by soldering with solder 60.

[0051] like Figure 4 As shown in FIG. 1 , similarly to the leads 12 and 13, the leads 22 and 23 also have exposed portions 22a and 23a exposed from the first molded portion 40. In addition, a portion of the exposed portions 22a and 23a of the leads 22 and 23 is a lead soldering portion 22b and 23b. In addition, at the lead soldering portions 22b and 23b of the leads 22 and 23, the leads 22 and 23 are soldered and connected to the connection terminal 30 by soldering with a solder 60.

[0052] <Structure of the connection terminal 30>

[0053] The connection terminal 30 has four connection terminals 31, 32, 33, and 34. The material of the connection terminal 30 is, for example, a metal material such as copper, copper alloy, aluminum, aluminum alloy, and stainless steel. The connection terminal 30 is formed by, for example, stamping a metal plate having excellent conductivity. The connection terminal 30 preferably has a rigidity that allows the posture to be maintained in a constant shape.

[0054] Each connection terminal 31, 32, 33, 34 is connected to the lead wires 12, 13, 22, 23 respectively. Figure 1 and Figure 2 As shown, one end of each of the connection terminals 31 , 32 , 33 , 34 is exposed from the first molded portion 40 to form an exposed portion 31 a , 32 a , 33 a , 34 a .

[0055] Here, the connection terminals 31 and 32 of the connection terminal 30 are described. Figure 3 As shown, a part of the exposed portion 31a, 32a of the connection terminal 31, 32 is the connection terminal soldering portion 31b, 32b. The connection terminal soldering portion 31b, 32b is connected to the lead soldering portion 12b, 13b described above by solder 60. The connection between the connection terminal 33, 34 and the lead 22, 23 is the same as the connection between the connection terminal 31, 32 and the lead 12, 13, so the description is omitted. In addition, Figure 4 The connection terminal soldering portions 33b and 34b shown have the same structure as the connection terminal soldering portions 31b and 32b.

[0056] Each of the connection terminals 31, 32, 33, 34 has a connector exposed portion 31c, 32c, 33c, 34c exposed from the first molded portion 40 and the second molded portion 50. Specifically, the other end of each of the connection terminals 31, 32, 33, 34, which is different from the exposed portion 31a, 32a, 33a, 34a side, is exposed from the first molded portion 40 and the second molded portion 50, forming the connector exposed portion 31c, 32c, 33c, 34c. The connector exposed portion 31c, 32c, 33c, 34c is a connection portion connected to a connector connected to other electrical components. Through such a connector exposed portion 31c, 32c, 33c, 34c, the molded component 1 itself has a structure having a connector. As a result, the molded component 1 itself can be directly connected to a connector extending from other electrical components (for example, a control unit or a control device, etc.).

[0057] <First Molding Section 40>

[0058] The first molded portion 40 includes a head portion 41, a connection terminal holding portion 42, and a connecting portion 43 connecting the head portion 41 and the connection terminal holding portion 42. The first molded portion 40 is formed of, for example, resin. The first molded portion 40 is a portion molded with a resin material using the internal components 10 and 20 as inserts.

[0059] The head portion 41 covers the detection element main bodies 11 and 21. The head portion 41 is formed with a recessed portion 41a and an inner through hole 41b that penetrates from the surface of the first molded portion 40 to the inner member 20.

[0060] In the head 41 of the first molded part 40, a plurality of (three in this case) recessed parts 41a are formed on the first surface I side of the second molded part 50, and at least one (one in this case) recessed part 41a is formed on the second surface II side of the second molded part 50. The recessed part 41a is a portion into which the front end of a positioning pin for fixing the first molded part 40 is inserted when the second molded part 50 is molded. In other words, the recessed part 41a is a portion into which the positioning pin of the mold device is inserted when the first molded part 40 is molded as an insert. The recessed part 41a is a depression that opens on the surface of the first molded part 40 but does not reach the surface of the inner component 10, 20.

[0061] In addition, in the head 41 of the first molded part 40, a plurality of (here, two) inner through holes 41b are formed on the first surface I side of the second molded part 50. The inner through holes 41b are traces of positioning pins used to fix a portion of the internal components 10 and 20 when the first molded part 40 is molded. When the first molded part 40 is removed from the mold, the inner through holes 41b are formed as traces of the positioning pins. The inner through holes 41b penetrate to the surface of the internal components 10 and 20, and a portion of the surface of the internal components 10 and 20 is exposed in the inner through holes 41b. In the present embodiment, the positioning pins, for example, press and fix a portion of the leads 12, 13, 22, and 23 of the internal components 10 and 20. In addition, the inner through holes 41b are formed so that a portion of the leads 12, 13, 22, and 23 is exposed. Therefore, the leads 12, 13, 22, 23 fixed by the positioning pins when the first molded part 40 is molded are exposed to the outside of the first molded part 40 through the inner through hole 41b. Similarly, holes are formed on the second surface II side of the molded part 1 as traces of the holding member for holding the internal components 10 and 20, but they are omitted from the drawing.

[0062] The connection terminal holding portion 42 holds a portion of the connection terminal 30. The connection terminal holding portion 42 holds a plurality of (four in this case) connection terminals 31, 32, 33, 34 at a constant position. Therefore, the exposed portions 31a, 32a, 33a, 34a and the exposed portions 31c, 32c, 33c, 34c for the connector are held at a constant position. Thus, the exposed portions 31c, 32c, 33c, 34c for the connector are held at a constant position suitable for connection to a connector of another electrical component. For example, the exposed portions 31c, 32c, 33c, 34c for the connector are held in a posture parallel to each other and protruding in the same direction. In addition, the exposed portions 31a, 32a, 33a, 34a are held at a constant position suitable for connection to the leads 12, 13, 22, 23 (for example, a position in contact with the leads 12, 13, 22, 23 from the side opposite to the connecting portion 43).

[0063] The connection portion 43 connects the head portion 41 and the connection terminal holding portion 42 so that the connection terminal holding portion 42 is held at a constant position relative to the head portion 41. The connection portion 43 may be thinner than the head portion 41 and the connection terminal holding portion 42.

[0064] In this embodiment, the connection portion 43 has a placement portion 44 corresponding to the leads 12, 13, 22, 23, respectively. The placement portion 44 has a first placement surface 44a facing the first surface direction of the molded component 1 and a second placement surface 44b facing the second surface direction of the molded component 1. The second placement surface 44b faces the direction opposite to the direction faced by the first placement surface 44a. The placement portion 44 is also a separator between the leads 12, 13 and the leads 22, 23.

[0065] In addition, in this embodiment, the normal direction of the first mounting surface 44a and the second mounting surface 44b ( Figure 3 The arrow N in the figure is in the same direction. The leads 12 and 13 are placed on the first placement surface 44a, and the leads 22 and 23 are placed on the second placement surface 44b. The leads 12 and 13 are arranged on the first placement surface 44a, and the leads 22 and 23 are arranged on the second placement surface 44b, so that the solder 60 (refer to Figure 3 ) and the solder 60 on the leads 22 and 23 (refer to Figure 4 ) will not come into contact. Therefore, a short circuit between the leads 12, 13 and the leads 22, 23 can be prevented.

[0066] In addition, a first partition wall 45 is disposed between the leads 12 and 13 to separate the leads 12 and 13. The first partition wall 45 prevents the solder 60 on the lead 12 from contacting the solder 60 on the lead 13. In addition, the leads 12 and 13 do not contact each other. Therefore, a short circuit between the leads 12 and 13 can be prevented.

[0067] Similarly, a second partition wall 46 is disposed between the leads 22 and 23 to separate the leads 22 and 23. The second partition wall 46 prevents the solder 60 on the lead 22 from contacting the solder 60 on the lead 23. In addition, the leads 22 and 23 do not contact each other. Therefore, a short circuit between the leads 22 and 23 can be prevented.

[0068] <Second Molding Section 50>

[0069] The second molded portion 50 covers the first molded portion 40. The second molded portion 50 includes a head covering portion 51 covering the head 41 of the first molded portion 40, a cylindrical portion 52 surrounding a portion of the connection terminal 30, and a connecting portion 53 connecting the head covering portion 51 and the cylindrical portion 52. In addition, the second molded portion 50 includes an annular protrusion 54 protruding outward from the outer periphery of the connecting portion 53.

[0070] In the head covering portion 51 of the second molded portion 50, a plurality of (three in this case) outer through holes 51a are formed on the first surface I side, and at least one (one in this case) outer through hole 51a is formed on the second surface II side. The outer through hole 51a is a trace of a positioning pin used to fix a portion of the first molded portion 40 when the second molded portion 50 is molded. When the second molded portion 50 is taken out of the mold, the outer through hole 51a is formed as a trace of the positioning pin. The outer through hole 51a penetrates until it reaches the surface of the first molded portion 40, and a portion of the first molded portion 40 is exposed in the outer through hole 51a. In this embodiment, the positioning pin engages with the recessed portion 41a of the first molded portion 40 to fix the first molded portion 40. Therefore, the recessed portion 41a fixed by the positioning pin when the second molded portion 50 is molded is exposed to the outside of the second molded portion 50 through the outer through hole 51a.

[0071] The cylindrical portion 52 surrounds the exposed portions 31c, 32c, 33c, 34c of the connector in the connection terminal 30. The cylindrical portion 52 and the exposed portions 31c, 32c, 33c, 34c of the connector are formed into a shape suitable for engaging with the connector on the other side connected to other electrical components. For example, the connector on the other side has a plurality of terminal portions on the other side that can be connected to the exposed portions 31c, 32c, 33c, 34c of the connector. The terminal portion on the other side is formed into a columnar terminal shape, for example. The connector on the other side has a housing portion that holds the plurality of terminal portions on the other side at a position corresponding to the position of the exposed portions 31c, 32c, 33c, 34c of the connector. The cylindrical portion 52 is formed into a cylindrical shape that can be inserted into the housing portion of the connector on the other side. Thus, the cylindrical portion 52 and the exposed portions 31c, 32c, 33c, 34c of the connector are directly connected to the connector on the other side connected to other electrical components.

[0072] The connecting portion 53 is located between the head covering portion 51 and the cylindrical portion 52. The connecting portion 53 covers the exposed portions 12a, 13a, 22a, 23a of the leads 12, 13, 22, 23, the exposed portions 31c, 32c, 33c, 34c for connectors of the connection terminals 31, 32, 33, 34, and the solder 60. Thus, the leads 12, 13, 22, 23, the connection terminals 30, and the solder 60 are covered by the second molded portion 50 and are not exposed to the outside of the molded component 1.

[0073] An O-ring 70 is attached to the peripheral portion of the connecting portion 53 on the head covering portion 51 side relative to the annular protrusion 54. The O-ring 70 is connected to the fitting groove 55 (see FIG. 1 ) formed in the connecting portion 53. Figure 8 The O-ring 70 is an annular member formed of an elastic member such as rubber.

[0074] <Configuration of Molding Part 1>

[0075] Figure 5 It is a plan view showing the molded component 1 in a state of being assembled to the assembly target component 80 together with a part of the assembly target component 80 . Figure 6 This is a side view showing the molded component 1 in a state of being assembled to the assembly target component 80 together with a part of the assembly target component 80 .

[0076] like Figure 5 and Figure 6 As shown, at least a portion of the molded component 1 is inserted into the hole portion 81 of the assembly target component 80 and assembled to the assembly target component 80. In the present embodiment, a portion of the head cover portion 51 and the connecting portion 53 are inserted into the hole portion 81 of the assembly target component 80. The opening of the hole portion 81 of the assembly target component 80 is formed with, for example, a large diameter portion 82 that receives the annular protrusion 54. The large diameter portion 82 is formed in a shape suitable for the shape of the annular protrusion 54, and the annular protrusion 54 is fitted into the large diameter portion 82.

[0077] An O-ring 70 is fitted into the fitting groove 55 formed on the head cover 51 side relative to the annular protrusion 54. The outer periphery of the O-ring 70 is in liquid-tight contact with the inner periphery of the hole 81. Thus, water is prevented from intruding from a position on the cylindrical portion 52 side relative to the O-ring 70 to a position on the head cover 51 side relative to the O-ring 70. Therefore, even if water intrudes from the outer surface 83 of the assembly target component 80 to the head cover 51 side, the intrusion of water from the cylindrical portion 52 side to the head cover 51 side can be prevented with the O-ring 70 as a boundary.

[0078] As described above, in the second molded portion 50, a region X where water intrusion is suppressed (hereinafter referred to as "non-water intrusion region X") is set on the head cover portion 51 side with the O-ring 70 as a boundary (see Figure 5 and Figure 6). That is, Figure 5 and Figure 6 As shown, the O-ring 70 partitions the second molded portion 50 into a non-water-immersed area X and an area other than the non-water-immersed area X (hereinafter referred to as a “water-immersed area Y”).

[0079] In addition, in the present embodiment, an engaging groove portion 56 is formed on the outer periphery of the second molded portion 50 on the cylindrical portion 52 side relative to the annular protrusion 54. The locking member 90 is engaged with the periphery of the engaging groove portion 56. The locking member 90 is fixed to the outer surface 83 of the assembly object component 80 by a screw 91. Thus, the molded component 1 is fixed relative to the assembly object component 80. Preferably, the surface of the locking member 90 that contacts the outer surface 83 of the assembly object component 80 is formed into a shape corresponding to the shape of the outer surface 83 of the assembly object component 80. And the surface of the locking member 90 is in close contact with the outer surface 83 of the assembly object component 80. By the locking member 90 and the outer surface 83 of the assembly object component 80, the outer surface 83 of the assembly object component 80 is also used as a boundary, and the intrusion of water from the cylindrical portion 52 side to the head covering portion 51 side is further suppressed. In addition, a sealing member can also be clamped between the locking member 90 and the outer surface 83. According to such a structure, even if the surface of the locking part 90 and the shape of the outer surface 83 of the assembly object part 80 are not formed into a close contact state, the effect of the sealing part can further suppress the intrusion of water from the side of the cylindrical part 52 to the side of the head covering part 51 with the outer surface 83 of the assembly object part 80 as the boundary.

[0080] In the present embodiment, the non-water-immersion area X includes an area covering the electronic component body (detection element body 11, 21). In the present embodiment, the head cover 51 covering the electronic component body (detection element body 11, 21) in the first molded part 40 is entirely located in the non-water-immersion area X. In addition, the outer through hole 51a is formed only in the head cover 51. That is, the outer through hole 51a is formed only in the non-water-immersion area of ​​the second molded part. Therefore, it is a structure in which water is difficult to penetrate into the outer through hole 51a.

[0081] In addition, the inner through hole 41b formed in the first molded portion 40 is also formed only in the head portion 41. That is, in the present embodiment, the outer through hole 51a and the inner through hole 41b are formed at positions close to each other. Even if the outer through hole 51a and the inner through hole 41b are formed in such a configuration, water intrusion into the outer through hole 51a can be suppressed, and therefore water intrusion into the inner through hole 41b can also be suppressed.

[0082] Furthermore, since the outer through-holes 51 a of the second molded portion 50 are formed only in the vicinity of the region covering the electronic component body (detection element bodies 11 , 21 ), the shape of the second molded portion 50 can be simplified.

[0083] <Method for Manufacturing Molded Component 1>

[0084] Figure 7 and Figure 8 This is an explanatory diagram showing a process when manufacturing the molded component 1. Figure 7 The state where the leads 12, 13, 22, 23 and the connection terminals 30 are connected by solder 60 after the first molded portion 40 is molded is shown from the side. Figure 8 Shown in side section Figure 7 After the process, when the second molded part 50 is molded using the first molded part 40 as an insert, the first molded part 40 and the solder 60 are installed in the mold device 100.

[0085] like Figure 7 As shown, first, the internal components 10, 20 and the connection terminals 30 are fixed in predetermined positions by the first molded portion 40. The exposed portions 12a, 13a, 22a, 23a of the leads 12, 13, 22, 23 exposed from the first molded portion 40 and the exposed portions 31a, 32a, 33a, 34a of the connection terminals 30 are connected by solder 60.

[0086] Next, Figure 7 The first molded portion 40 , the internal components 10 , 20 , the connection terminal 30 , and the solder 60 are shown to be installed in a mold device 100 for molding the second molded portion 50 .

[0087] The mold device 100 includes, for example: a lower side support mold 101, which supports the first molding part 40 from the second surface II side; an upper side support mold 102, which supports the first molding part 40 from the first surface I side; and a connecting terminal support mold 103, which supports the exposed parts 33c and 34c for the connector (although not shown in the figure, it also includes the exposed parts 31c and 32c for the connector) exposed from the first molding part 40.

[0088] The front end of the positioning pin 101a of the lower support mold 101 is held in the recessed portion 41a of the first molded portion 40. The front end of the positioning pin 102a of the upper support mold 102 is held in the recessed portion 41a of the first molded portion 40. In addition, the connection terminal support mold 103 holds the connection terminal 30. Thus, even if the recessed portion 41a is formed only in the head portion 41, the first molded portion 40 can be properly held by the mold device 100.

[0089] In addition, the molds 101 , 102 , and 103 of the mold device 100 have been described as an example, and the device for mold-molding the molded component 1 is not limited to the example of the mold device 100 .

[0090] <Effects Produced by the Embodiments Described Above>

[0091] Next, an example of the effect produced by the above-described embodiment is shown. In addition, in the following description, the effect is described based on the specific structure illustrated in the above-described embodiment, but it can also be replaced with other specific structures illustrated in the specification of this application within the scope of producing the same effect.

[0092] In addition, the replacement may be performed across a plurality of embodiments. That is, the same effect may be produced by combining the respective structures illustrated in different embodiments.

[0093] According to the molded component 1 configured as described above, since the first molded portion 40 covering the internal components 10 and 20 and holding the connection terminal 30 is provided, the first molded portion 40 can be positioned by the through hole (outer through hole 51 a) formed only in the non-water-immersion area X. In addition, since the first molded portion 40 covering the internal components 10 and 20 and holding the connection terminal 30 is provided, the arrangement relationship between the internal components 10 and 20 and the connection terminal 30 can be set to be constant. The manufactured component is less likely to have deviations.

[0094] In addition, a through hole (outer through hole 51a) penetrating from the outer side of the second molded part 50 to the first molded part 40 is formed in the non-water-immersed area X. Therefore, it is difficult for water to penetrate into the outer through hole 51a itself, and therefore it is difficult for water to penetrate between the first molded part 40 and the second molded part 50. Thus, it is possible to suppress water from penetrating into the inner components 10 and 20. Therefore, no matter where the through hole (inner through hole 41b) for positioning the inner components 10 and 20 is formed in the first molded part 40, it is possible to suppress water from penetrating into the inner components 10 and 20.

[0095] Furthermore, since the inner components 10 and 20 and the connection terminal 30 can be integrally molded, the number of steps required for manufacturing the molded component 1 as a whole can be reduced.

[0096] In addition, according to the molded component 1, in the connecting portion 43 of the first molded portion 40, since the leads 12, 13, 22, 23 and the connecting terminal 30 respectively have exposed portions exposed from the first molded portion 40 (exposed portions 12a, 13a, 22a, 23a of the leads 12, 13, 22, 23, exposed portions 31a, 32a, 33a, 34a of the connecting terminals 31, 32, 33, 34), the soldering operation of the solder 60 is easy.

[0097] In addition, since the leads 12 , 13 , 22 , 23 and the connection terminals 30 are connected by the solder 60 , the connection between the leads 12 , 13 , 22 , 23 and the connection terminals 30 is reliable.

[0098] In addition, since the solder 60 is covered by the second molded portion 50 , the connection between the leads 12 , 13 , 22 , 23 and the connection terminals 30 becomes more reliable.

[0099] The connection terminal 30 has exposed connector portions 31c, 32c, 33c, and 34c, which are connected to a connector connected to another electrical component. This is achieved by being held in a fixed position suitable for connection with the connector by the first molded portion 40.

[0100] In addition, the connector exposed portions 31c, 32c, 33c, and 34c of the connection terminal 30 function as connectors and are connected to connectors of other electrical components. Therefore, an electrical conductor such as a wire that relays between the molded component 1 and the connector is not required. Thus, the molded component 1 itself becomes a connector. In addition, the structure between the molded component 1 and the connector connected to other electrical components can be simplified.

[0101] In addition, the non-water-immersion area includes the area covering the electronic component body (detection element body 11, 21), and the through hole (outer through hole 51a) is formed only in the area covering the head 41 (head covering part 51). The first molded part 40 is formed with a through hole (inner through hole 41b) through which a positioning pin for fixing the internal components 10, 20 during molding passes. The inner through hole 41b penetrates the inner components 10, 20 and the outer side of the first molded part 40. Therefore, assuming that the inner through hole 41b is flooded, the internal components 10, 20 are also flooded. If the outer through hole 51a is also formed in the area covering the head 41 (head covering part 51), the outer through hole 51a is close to the inner through hole 41b. When the outer through hole 51a is close to the inner through hole 41b, it is conceivable that water infiltrating from the outer through hole 51a is easy to pass through the gap between the second molded part 50 and the first molded part 40 and infiltrate from the inner through hole 41b. However, the outer through-hole 51 a is formed in the non-water-intrusive region X, and water intrusion into the outer through-hole 51 a is suppressed, so water intrusion into the inner through-hole 41 b is also suppressed.

[0102] In addition, the through hole (outer through hole 51a) formed in the second molded portion 50 is formed only in the region covering the head 41 (head covering portion 51), and is not formed in other regions. Therefore, it is not necessary to form through holes in various locations of the second molded portion 50, and the shape of the second molded portion 50 can be simplified.

[0103] In addition, an O-ring 70 is installed on the outer periphery of the second molded portion 50, and the O-ring 70 separates the non-water-immersed area X from the other area Y. In other words, the non-water-immersed area X is provided by the water-stopping effect of the O-ring 70. A through hole (outer through hole 51a) is formed in the second molded portion 50 only in the non-water-immersed area X. Thus, water intrusion into the internal components 10 and 20 can be suppressed.

[0104] In addition, two or more through holes (outer through holes 51a) are formed on one surface (first surface I) of the molded component 1. That is, the second molded portion 50 is fixed to the first surface I by two or more positioning pins during the molding. Therefore, the rotation (positional deviation) of the insert (first molded portion 40) is suppressed during the molding of the second molded portion 50.

[0105] <Others>

[0106] In the above embodiment, in order to suppress water intrusion into the non-water-immersed area X (the area where the outer through-hole 51a is formed), the O-ring 70 is used, and the O-ring 70 partitions the non-water-immersed area X from the area other than the water-immersed area (the water-immersed area Y). However, the non-water-immersed area X and the area other than the water-immersed area (the water-immersed area Y) can also be partitioned by a method other than the O-ring 70. For example, in order to suppress water intrusion into the non-water-immersed area X (the area where the outer through-hole 51a is formed), the surface of the above-mentioned locking member 90 and the outer surface 83 of the assembly target component 80 may be used instead of the O-ring 70 (a sealing member may be further added). In this case, the contact portion between the surface of the locking member 90 and the outer surface 83 of the assembly target component 80 partitions the non-water-immersed area X from the area other than the water-immersed area (the water-immersed area Y).

[0107] In addition, in the above-mentioned embodiment, two inner components 10 and 20 are provided in parallel, but it is also possible to use a molded component including only one inner component or a molded component including three or more inner components.

[0108] In addition, in the above-mentioned embodiment, the leads 12, 13, 22, 23 and the connection terminals 30 are connected by the solder 60 after the first molded portion 40 is molded, but the leads 12, 13, 22, 23 and the connection terminals 30 may be connected by the solder 60 before the first molded portion 40 is molded. In this case, a structure in which the leads 12, 13, 22, 23 and the connection terminals 30 are not exposed in the connecting portion 43 can be adopted. According to such a structure, the shape of the first molded portion 40 can be further simplified.

[0109] In the above-mentioned embodiment, the leads 12, 13, 22, 23 and the connection terminals 30 are connected by the solder 60, but the present invention is not limited thereto. The leads 12, 13, 22, 23 and the connection terminals 30 may be connected by welding.

[0110] In addition, in the above-mentioned embodiment, the internal components 10 and 20 are molded as inserts when the first molded portion 40 is molded, but the present invention is not limited thereto. When the first molded portion 40 is molded, the internal components 10 and 20 may not be molded as inserts. Therefore, a structure in which the inner through hole 41b is not formed may be adopted. For example, the first molded portion having a recessed portion in which the internal components 10 and 20 can be fitted may be molded separately from the internal components 10 and 20, and the internal components 10 and 20 may be fitted into the recessed portion of the first molded portion.

[0111] In addition, in the above-mentioned embodiment, the non-water-immersed area X is set to include the area covering the electronic component body (detection element body 11, 21), but the non-water-immersed area X may be set to exclude the area covering the electronic component body (detection element body 11, 21). For example, the non-water-immersed area X may be set in the connecting portion 53. In this case, the outer through hole 51a is formed only in the connecting portion 53.

[0112] In addition, in the above-mentioned embodiment, three outer through holes 51a are formed on the first surface I side, but it is also possible to form a single outer through hole 51a on the first surface I side. In this case, the outer through hole 51a is preferably in a shape other than a cylinder or a cone. For example, the shape of the outer through hole 51a is preferably a polygonal column shape or an elliptical column shape. In addition, it is also possible to form a plurality of outer through holes 51a other than three on the first surface I side. However, the outer through hole 51a is a portion where water can enter the internal components 10, 20, so it is preferred that the number is small.

[0113] <Regarding Modifications of the Embodiments Described Above>

[0114] In the above-described embodiments, the material, size, shape, relative configuration relationship or implementation conditions of each component are sometimes described, but these are examples in all aspects and are not limited to the contents described in the specification of this application.

[0115] Therefore, numerous variations and equivalents not shown in the examples are contemplated within the scope of the technology disclosed in the present specification, including, for example, variations, additions, or omissions of at least one component, and extraction of at least one component in at least one embodiment and combination with components in other embodiments.

[0116] Description of Reference Numerals

[0117] 1 Molding parts

[0118] 10, 20 Internal parts

[0119] 11, 21 detection element body

[0120] 12, 13, 22, 23 leads

[0121] 12a, 13a, 22a, 23a exposed parts

[0122] 12b, 13b, 22b, 23b lead wire soldering part

[0123] 30, 31, 32, 33, 34 connection terminals

[0124] 31a, 32a, 33a, 34a exposed parts

[0125] 31b, 32b, 33b, 34b connection terminal soldering part

[0126] 31c, 32c, 33c, 34c connector exposed part

[0127] 40First molding section

[0128] 41Head

[0129] 41a concave part

[0130] 41b inner through hole

[0131] 42 Connecting terminal holding portion

[0132] 43 connection part

[0133] 44 loading part

[0134] 44a first mounting surface

[0135] 44b Second mounting surface

[0136] 45 First isolation wall

[0137] 46 Second isolation wall

[0138] 50 Second molding department

[0139] 51 Head Covering

[0140] 51a Outer through hole

[0141] 52 cylindrical part

[0142] 53 connection part

[0143] 54 annular protrusion

[0144] 55 fitting slot

[0145] 56 engagement groove

[0146] 60 solder

[0147] 70O-ring

[0148] 80 Assembling target parts

[0149] 81 hole

[0150] 82 large diameter part

[0151] 83 External surface

[0152] 90 locking parts

[0153] 91 screws

[0154] 100 mold devices

[0155] 101 lower side support mold

[0156] 101a, 102a positioning pin

[0157] 102 upper side support mold

[0158] 103 connection terminal support mold

[0159] I Side 1

[0160] II Side 2

[0161] L Length direction

[0162] N Arrow

[0163] WWidth direction

[0164] X Non-immersed area

[0165] Y flooded area.

Claims

1. A molded component, comprising: An internal component having an electronic component body and leads extending from the electronic component body; A connecting terminal connected to the lead wire, a first molded portion covering the internal component and holding the connection terminal; and a second molding portion, covering the first molding portion, The second molded portion has a non-water-immersed area arranged in an area where water infiltration is suppressed, A through hole extending from the surface of the second molded portion to the first molded portion is formed only in the non-water-immersed region of the second molded portion.

2. The molded component according to claim 1, wherein: The first molding portion includes: a head portion covering the electronic component body, a connection terminal holding portion holding a portion of the connection terminal, and a connection portion connecting the head portion and the connection terminal holding portion. In the connection portion, the lead and the connection terminal each have an exposed portion exposed from the first molded portion, In the connection portion, the exposed portion of the lead wire and the exposed portion of the connection terminal are connected by solder, The second molded portion covers the exposed portion of the lead, the exposed portion of the connection terminal, and the solder connecting the exposed portion of the lead and the exposed portion of the connection terminal in the connection portion.

3. The molded component according to claim 1 or 2, wherein: The connection terminal has a connector exposed portion exposed from the first molded portion and the second molded portion. The connector exposed portion is a connection portion to be connected to a connector connected to another electrical component.

4. The molded component according to claim 1 or 2, wherein: The non-water-submersible area includes an area covering the electronic component body.

5. The molded component according to claim 1 or 2, wherein: An O-ring is installed on the outer periphery of the second molded part. The non-water-immersed area and an area other than the non-water-immersed area are separated by the O-ring.

6. The molded component according to claim 1 or 2, wherein: The second molded portion has a first surface and a second surface facing in a direction opposite to the first surface. The through hole is formed on both the first surface and the second surface, The number of the through holes formed on the first surface is at least two.

Images