A laser engraving machine for IC carrier board processing

Abstract

The present invention provides a laser engraving machine for IC carrier board processing, which relates to the technical field of IC carrier board processing equipment. It includes a laser engraving machine base. A first adjusting frame is arranged at the upper end of the laser engraving machine base. A second adjusting frame is installed on the first adjusting frame. A laser box is installed on the second adjusting frame. A laser head is arranged inside the laser box. A top rod is fixedly installed at the upper end of the laser box. Clamping plates are fixedly installed at the opposite ends of two connecting bars. Fourth chutes are symmetrically opened at the upper end of the placement rack. Slide columns are symmetrically and slidably installed inside the two fourth chutes. By pushing two first limit blocks and the inner column to slide outwards through two second threaded rings, and then completing positioning and clamping through the insertion blocks. During the entire flipping process, one end of the placement rack will always be located inside the inner groove, thereby ensuring the stability during its flipping and preventing the phenomenon of dropping due to careless handling. Moreover, this flipping method simplifies the existing flipping steps and improves the processing efficiency of the equipment.

Description

Technical Field

[0001] The present invention belongs to the technical field of IC carrier board processing equipment, and more specifically, particularly relates to a laser engraving machine for IC carrier board processing. Background Art

[0002] A laser engraving machine for IC carrier board processing refers to equipment dedicated to laser engraving on an integrated circuit (IC) carrier board. Such laser engraving machines usually have the characteristics of high precision, high stability, and high adaptability to meet the strict requirements for fineness, consistency, and material compatibility during the IC carrier board processing.

[0003] However, the existing laser engraving machines for IC carrier board processing still have the following deficiencies when in use:

[0004] 1. Before processing the IC carrier board, it is necessary to fix it first to ensure stability. However, since the IC carrier board may contain embedded passive components (such as resistors, capacitors), buried interconnect structures, or bumps, etc., these structures will cause local height differences on the surface of the carrier board, resulting in the processing position of the IC carrier board being prone to change due to the change of the clamping position, and the height difference of the IC carrier board is relatively large after each fixation. Therefore, it is necessary to adjust the distance (focal length) between the laser engraving head and the IC carrier board before each processing, which affects the processing efficiency.

[0005] 2. When the IC carrier board needs to be laser engraved on both sides, the existing technology usually removes the IC carrier board from the fixture, then turns it over and installs it on the fixture again. The repeated clamping has low processing efficiency, and there is also a risk of dropping and breaking during the taking process.

[0006] Therefore, in view of this, research and improvement are carried out on the existing structure and deficiencies, and a laser engraving machine for IC carrier board processing is provided, with the expectation of achieving a more practical value. Summary of the Invention

[0007] To solve the above technical problems, the present invention provides a laser engraving machine for IC carrier board processing to solve the above problems.

[0008] A laser engraving machine for IC carrier board processing includes a laser engraving machine base. A first adjusting frame is arranged at the upper end of the laser engraving machine base. A second adjusting frame is installed on the first adjusting frame. A laser box is installed on the second adjusting frame. A laser head is arranged inside the laser box. A top rod is fixedly installed at the upper end of the laser box. First sliding grooves are opened on both side walls of the top rod. First screw rods are fixedly installed on both side walls of the laser head. First threaded rings are threadedly installed on both of the first screw rods;

[0009] A protection mechanism is slidably installed on the laser box;

[0010] The protection mechanism includes a U-shaped frame which is slidably mounted on the laser box. First sliders are fixedly mounted on the side walls of both sides of the U-shaped frame, and the two first sliders are respectively slidably mounted in two first chutes. The two first threaded rings are respectively located below the two first sliders and are in contact with them.

[0011] Preferably, a circular groove is penetratingly opened at the center inside the U-shaped frame, a cleaning cotton is installed in the inner wall of the circular groove, the laser head is in contact with the cleaning cotton, a vertical bar is fixedly mounted at the lower end of the U-shaped frame, a side bar is fixedly mounted on the side wall of the vertical bar, and a fan assembly is fixedly mounted on the side bar.

[0012] Preferably, a placement table is fixedly mounted at the upper end of the base of the laser engraving machine. Inner grooves are symmetrically opened in the inner wall of the placement table, card slots are opened in the inner walls of the two inner grooves, and a placement rack is placed inside the placement table.

[0013] Preferably, second chutes are symmetrically opened in the inner wall of the placement rack, column grooves are symmetrically opened on the side walls of both sides of the placement rack, threaded cylinders are fixedly mounted on the side walls of both sides of the placement rack, and strip-shaped grooves are opened in the two threaded cylinders.

[0014] Preferably, second threaded rings are threadedly mounted on the two threaded cylinders, inner columns are slidably mounted in the two threaded cylinders, first limit blocks are fixedly mounted on the two inner columns, and the two groups of first limit blocks are respectively slidably mounted in the two strip-shaped grooves.

[0015] Preferably, insertion blocks are fixedly mounted on the opposite ends of the two inner columns, and the two insertion blocks are respectively adapted to the two card slots.

[0016] Preferably, moving bars are symmetrically and slidably mounted inside the placement rack, second limit blocks are fixedly mounted on the side walls of both sides of the two moving bars, and the two groups of second limit blocks are respectively slidably mounted in the two second chutes.

[0017] Preferably, third chutes are opened in the two moving bars, third screw rods are symmetrically and fixedly mounted on the opposite ends of the two moving bars, the two groups of third screw rods are respectively inserted into the two column grooves, and third threaded rings are threadedly mounted on the two groups of third screw rods.

[0018] Preferably, fixing frames are fixedly mounted on the opposite ends of the two moving bars, drive motors are fixedly mounted on the upper ends of the two fixing frames, threaded sleeves are symmetrically and fixedly mounted on the output shafts of the two drive motors, the two threaded sleeves have opposite threads, connecting bars are symmetrically and slidably mounted inside the two third chutes, and the two groups of connecting bars are respectively threadedly mounted on the two groups of threaded sleeves.

[0019] Preferably, clamping plates are fixedly installed on the opposite ends of the two groups of connecting bars. The upper end of the placement rack is symmetrically provided with fourth chutes. Inside each of the two fourth chutes, sliding columns are symmetrically and slidably installed. Springs are fixedly installed on each group of sliding columns. The upper ends of the two groups of sliding columns are fixedly installed with fixing blocks, and the two groups of fixing blocks are respectively slidably installed inside the two fourth chutes.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] In the present invention, by providing column grooves, moving bars, third screws, and third threaded rings, the movement of the two moving bars will drive the two groups of third screws to slide inside the two groups of column grooves. When the two moving bars move to abut against the two ends of the IC carrier, two groups of third threaded rings can be rotated on the two groups of third screws at this time, thereby completing the limitation of the two moving bars, so that the device is applicable to fixing and processing IC carriers of any specification during use, enhancing the applicable range of the device;

[0022] In the present invention, by providing a laser head, a third chute, a driving motor, a threaded sleeve, a connecting bar, and a clamping plate, the driving motor will drive the two threaded sleeves connected to its output shaft to rotate. Since the two threaded sleeves have opposite thread structures, their rotation will drive the two connecting bars to move towards the middle inside the third chute. At this time, the two connecting bars will respectively drive the two groups of clamping plates to move towards the middle. The movement of the two clamping plates will complete the fixation of the two ends of the IC carrier. By designing the two clamping plates to synchronously adjust and clamp the IC carrier, the position of the IC carrier can always be kept at the center after each fixation, so that the placement height of the IC carrier is not likely to shift and misalign, effectively reducing the cumbersome steps of adjusting the distance between the laser head and the IC carrier before each processing, thereby enhancing the convenience during the processing of the IC carrier;

[0023] In the present invention, by providing an inner groove, a placement rack, a threaded cylinder, a second threaded ring, an inner column, a first limiting block, a sliding column, a spring, and a fixing block, the movement of the two fixing blocks will drive the two sliding columns to move relatively, and at this time the spring will be compressed accordingly. When the two sliding columns slide out of the two inner grooves, the placement rack can be rotated counterclockwise by 180° around the first screw at this time, and then the two sliding columns can be inserted back into the inner grooves to complete the installation. Then, two second threaded rings can be rotated again on the two threaded cylinders. The two second threaded rings push the two first limiting blocks and the inner column to slide outwards, and then positioning and clamping are completed through the insertion blocks. During the entire flipping process, one end of the placement rack will always be inside the inner groove, thereby ensuring the stability during its flipping and preventing the phenomenon of falling due to careless handling. Moreover, this flipping method simplifies the existing flipping steps and increases the processing efficiency of the device;

[0024] In the present invention, by providing a laser head, a U-shaped frame, a circular groove, cleaning cotton, and a blower assembly, the laser head will slide out of the circular groove under the movement of the U-shaped frame, and then laser engraving operation can be performed on the IC carrier. Under the movement of the U-shaped frame, the laser head will contact the cleaning cotton, and then the laser head can be effectively cleaned. Moreover, the blower assembly can be started during laser engraving, and the blower assembly can blow and clean the processing part of the IC carrier, so that the equipment is convenient for cleaning the laser head and the IC carrier during use, ensuring that the IC carrier is in a clean state during processing, and thus enhancing the processing effect.

[0025] In the present invention, by providing a laser head, a first screw, a first threaded ring, and a U-shaped frame, the first threaded ring can be rotated on the first screw. At this time, the two first sliders will drive the U-shaped frame to slide downward under the action of gravity. When the U-shaped frame slides below the laser head, the U-shaped frame will effectively protect the laser head, ensuring that the laser head will not be damaged due to accidental contact, and enhancing its service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 is a schematic three-dimensional structure diagram of the present invention;

[0027] Figure 2 is a schematic connection structure diagram of the laser box of the present invention;

[0028] Figure 3 is a schematic exploded connection structure diagram of the U-shaped frame of the present invention;

[0029] Figure 4 is a schematic exploded connection structure diagram of the placement rack of the present invention;

[0030] Figure 5 is a schematic exploded connection structure diagram of the sliding column of the present invention;

[0031] Figure 6 is a schematic exploded connection structure diagram of the moving bar of the present invention;

[0032] Figure 7 is a schematic exploded connection structure diagram of the clamping plate of the present invention;

[0033] Figure 8 is a schematic exploded connection structure diagram of the insertion block of the present invention.

[0034] In the figure, the correspondence between the component names and the drawing numbers is as follows: 11, the base of the laser engraving machine; 12, the first adjusting frame; 13, the second adjusting frame; 14, the laser box; 15, the laser head; 16, the ejector rod; 17, the first chute; 18, the first screw rod; 19, the first threaded ring; 21, the U-shaped frame; 22, the first slider; 23, the circular groove; 24, the cleaning cotton; 25, the vertical bar; 26, the side bar; 27, the fan assembly; 31, the placement table; 32, the inner groove; 33, the card slot; 34, the placement rack; 35, the second chute; 36, the column groove; 41, the threaded barrel; 42, the strip-shaped groove; 43, the second threaded ring; 44, the inner column; 45, the first limiting block; 46, the insertion block; 51, the moving bar; 52, the second limiting block; 53, the third chute; 54, the third screw rod; 55, the third threaded ring; 56, the fixing frame; 57, the driving motor; 58, the threaded sleeve; 59, the connecting bar; 61, the clamping plate; 62, the fourth chute; 63, the sliding column; 64, the spring; 65, the fixing block. Detailed implementation manners

[0035] The following further describes in detail the implementation manners of the present invention in conjunction with the drawings and embodiments. The following embodiments are used to illustrate the present invention, but cannot be used to limit the scope of the present invention.

[0036] Please refer to Figures 1 - 8 , the present invention provides a laser engraving machine for IC carrier board processing, including a base 11 of the laser engraving machine. A first adjusting frame 12 is arranged at the upper end of the base 11 of the laser engraving machine. A second adjusting frame 13 is installed on the first adjusting frame 12. A laser box 14 is installed on the second adjusting frame 13. A laser head 15 is arranged inside the laser box 14. An ejector rod 16 is fixedly installed at the upper end of the laser box 14. First chutes 17 are opened on both side walls of the ejector rod 16. First screw rods 18 are fixedly installed on both side walls of the laser head 15. First threaded rings 19 are threadedly installed on both first screw rods 18;

[0037] A protection mechanism is slidably installed on the laser box 14;

[0038] The protection mechanism includes a U-shaped frame 21. The U-shaped frame 21 is slidably installed on the laser box 14. First sliders 22 are fixedly installed on both side walls of the U-shaped frame 21. The two first sliders 22 are respectively slidably installed in the two first chutes 17. The two first threaded rings 19 are respectively located below the two first sliders 22 and are in contact with them. When the equipment is used up, the first threaded rings 19 can be rotated on the first screw rods 18 at this time. At this time, the two first sliders 22 will drive the U-shaped frame 21 to slide downward under the action of gravity. When the U-shaped frame 21 slides below the laser head 15, the U-shaped frame 21 will effectively protect the laser head 15 at this time, ensuring that the laser head 15 will not be damaged due to accidental touch, and enhancing its service life.

[0039] A circular groove 23 is penetrated and opened at the inner center of the U-shaped frame 21, and a cleaning cotton 24 is installed on the inner wall of the circular groove 23. The laser head 15 is in contact with the cleaning cotton 24. During use, two first threaded rings 19 can be rotated on the two first screw rods 18. Under the rotation of the two first threaded rings 19, the two first sliders 22 will be driven to move upward in the two first sliding grooves 17. At this time, the two first sliders 22 will drive the U-shaped frame 21 to move upward. Under the movement of the U-shaped frame 21, the laser head 15 will slide out of the circular groove 23, and then the IC carrier board can be laser engraved. Under the movement of the U-shaped frame 21, the laser head 15 will contact the cleaning cotton 24, and then the laser head 15 can be effectively cleaned. Moreover, the blower assembly 27 can be started during laser engraving. The blower assembly 27 can blow and clean the processing part of the IC carrier board, so that the equipment is convenient to clean the laser head 15 and the IC carrier board during use, ensuring that the IC carrier board is in a clean state during processing, and thus enhancing the processing effect;

[0040] A vertical bar 25 is fixedly installed at the lower end of the U-shaped frame 21. A side bar 26 is fixedly installed on the side wall of the vertical bar 25. A fan assembly 27 is fixedly installed on the side bar 26. A placement table 31 is fixedly installed at the upper end of the laser engraving machine base 11. Inner grooves 32 are symmetrically opened in the inner wall of the placement table 31. Card slots 33 are opened in the inner walls of the two inner grooves 32. A placement rack 34 is placed inside the placement table 31. Second sliding grooves 35 are symmetrically opened in the inner wall of the placement rack 34. Column grooves 36 are symmetrically opened on both side walls of the placement rack 34. Threaded cylinders 41 are fixedly installed on both side walls of the placement rack 34. Strip-shaped grooves 42 are opened inside the two threaded cylinders 41. Second threaded rings 43 are threadedly installed on the two threaded cylinders 41. Inner columns 44 are slidably installed inside the two threaded cylinders 41. First limit blocks 45 are fixedly installed on the two inner columns 44. The two groups of first limit blocks 45 are respectively slidably installed in the two strip-shaped grooves 42. Plug blocks 46 are fixedly installed on the opposite ends of the two inner columns 44. The two plug blocks 46 are respectively adapted to the two card slots 33. Moving bars 51 are symmetrically and slidably installed inside the placement rack 34. Second limit blocks 52 are fixedly installed on both side walls of the two moving bars 51. The two groups of second limit blocks 52 are respectively slidably installed in the two second sliding grooves 35. Third sliding grooves 53 are opened inside the two moving bars 51. Third screw rods 54 are symmetrically and fixedly installed on the opposite ends of the two moving bars 51. The two groups of third screw rods 54 are respectively inserted into the two column grooves 36. Third threaded rings 55 are threadedly installed on the two groups of third screw rods 54. During use, the two ends of the IC carrier can be first placed between the two groups of clamping plates 61. At this time, the two moving bars 51 can be relatively moved. With the movement of the two moving bars 51, the two groups of second limit blocks 52 will be driven to slide in the two second sliding grooves 35 accordingly. At the same time, with the movement of the two moving bars 51, the two groups of third screw rods 54 will also be driven to slide inside the two groups of column grooves 36. When the two moving bars 51 move to abut against the two ends of the IC carrier, the two groups of third threaded rings 55 can be rotated on the two groups of third screw rods 54 at this time, thereby completing the limitation of the two moving bars 51, making the device applicable to fixing and processing IC carriers of any specification during use, and enhancing the applicable range of the device;

[0041] Fixed frames 56 are fixedly installed on the opposite ends of the two moving bars 51. Driving motors 57 are fixedly installed on the upper ends of the two fixed frames 56. Threaded sleeves 58 are symmetrically and fixedly installed on the output shafts of the two driving motors 57. The two threaded sleeves 58 have opposite threads. Connecting bars 59 are symmetrically and slidably installed inside the two third chutes 53. The two groups of connecting bars 59 are respectively threadedly installed on the two groups of threaded sleeves 58. After the two moving bars 51 limit the IC carrier, the two driving motors 57 can be selectively started at this time. (When the clamping part of the IC carrier is flat, the two driving motors 57 can be started simultaneously. When the clamping part of the IC carrier is uneven, the driving motor 57 at the flat end can be started). Under the action of the driving motor 57, the threaded sleeve 58 connected to its output shaft will be driven to rotate accordingly. Since the two threaded sleeves 58 have opposite thread structures, the two connecting bars 59 will be driven to move towards the middle inside the third chutes 53 during their rotation. At this time, the two connecting bars 59 will respectively drive the two clamping plates 61 to move towards the middle accordingly. With the movement of the two clamping plates 61, the two ends of the IC carrier will be fixed. By designing the two clamping plates 61 to synchronously adjust the clamping method to fix the IC carrier, the position of the IC carrier can always be kept at the center after each fixation, making it difficult for the placement height of the IC carrier to shift and misalign. The cumbersome steps of adjusting the distance between the laser head 15 and the IC carrier before each processing are effectively reduced, thereby enhancing the convenience during the processing of the IC carrier;

[0042] Clamping plates 61 are fixedly installed on the opposite ends of the two sets of connecting bars 59. Fourth sliding grooves 62 are symmetrically formed at the upper end of the placement rack 34. Slide columns 63 are symmetrically and slidably installed inside the two fourth sliding grooves 62. Springs 64 are fixedly installed on each set of slide columns 63. Fixed blocks 65 are fixedly installed on the upper ends of the two sets of slide columns 63. The two sets of fixed blocks 65 are respectively slidably installed inside the two fourth sliding grooves 62. When the IC carrier needs to be turned over for processing, two second threaded rings 43 can be rotated towards the middle on the two threaded barrels 41 at this time, and then two first limit blocks 45 can be moved towards the middle. With the movement of the two first limit blocks 45, two inserting blocks 46 will be driven to slide out of the two clamping slots 33 accordingly. At this time, the two fixed blocks 65 at the rear can be relatively squeezed. With the movement of the two fixed blocks 65, the two slide columns 63 will be driven to move relatively. At this time, the springs 64 will be compressed accordingly. After the two slide columns 63 slide out of the two inner slots 32, the placement rack 34 can be rotated counterclockwise by 180° around the first screw rod, and then the two slide columns 63 can be inserted back into the inner slots 32 to complete the installation. Then, the two second threaded rings 43 can be rotated again on the two threaded barrels 41. The two first limit blocks 45 and the inner column 44 are pushed to slide outwards by the two second threaded rings 43, and then positioning clamping is completed through the inserting blocks 46. During the whole turning process, one end of the placement rack 34 will always be located inside the inner slot 32, thus ensuring its stability during turning and preventing the phenomenon of dropping due to careless handling. Moreover, this turning method simplifies the existing turning steps and improves the processing efficiency of the equipment.

[0043] Working principle:

[0044] First step, during use, the two ends of the IC carrier can be respectively placed between the two sets of clamping plates 61. At this time, the two moving bars 51 can be moved relatively. With the movement of the two moving bars 51, the two sets of second limit blocks 52 will be driven to slide in the two second sliding grooves 35 accordingly. At the same time, with the movement of the two moving bars 51, the two sets of third screw rods 54 will also be driven to slide inside the two column grooves 36. When the two moving bars 51 move to abut against the two ends of the IC carrier, two sets of third threaded rings 55 can be rotated on the two sets of third screw rods 54, thereby completing the limitation of the two moving bars 51, making the equipment applicable to fixing and processing IC carriers of any specification during use and enhancing the applicable range of the equipment;

[0045] Second step, after the two moving strips 51 limit the IC carrier board, two driving motors 57 can be selectively started at this time. (When the clamping part of the IC carrier board is flat, the two driving motors 57 can be started simultaneously. When the clamping part of the IC carrier board is uneven, the driving motor 57 at the flat end can be started.) Under the action of the driving motors 57, the threaded sleeves 58 connected to their output shafts will be driven to rotate accordingly. Since the two threaded sleeves 58 have opposite thread structures, their rotation will drive the two connecting bars 59 to move towards the middle in the two third chutes 53. At this time, the two connecting bars 59 will respectively drive the two clamping plates 61 to move towards the middle. Under the movement of the two clamping plates 61, the two ends of the IC carrier board will be fixed. By designing the two clamping plates 61 to adjust the clamping synchronously to fix the IC carrier board, the position of the IC carrier board can always be kept at the center after each fixation, so that the placement height of the IC carrier board is not likely to shift or be misaligned, effectively reducing the cumbersome steps of adjusting the distance between the laser head 15 and the IC carrier board before each processing, thereby enhancing the convenience during the processing of the IC carrier board;

[0046] Third step, when it is necessary to turn over the IC carrier board for processing, two second threaded rings 43 can be rotated towards the middle on the two threaded cylinders 41 at this time. Then, two first limit blocks 45 can be moved towards the middle. Under the movement of the two first limit blocks 45, the two insertion blocks 46 will be driven to slide out of the two card slots 33 accordingly. At this time, the two fixing blocks 65 at the rear can be relatively squeezed. Under the movement of the two fixing blocks 65, the two sliding columns 63 will be driven to move relatively. At this time, the spring 64 will be compressed accordingly. After the two sliding columns 63 slide out of the two inner slots 32, the placement rack 34 can be rotated counterclockwise by 180° around the first screw rod at this time, and then the two sliding columns 63 can be inserted back into the inner slots 32 to complete the installation. Then, the two second threaded rings 43 can be rotated again on the two threaded cylinders 41. The two second threaded rings 43 are used to push the two first limit blocks 45 and the inner column 44 to slide outwards, and then the positioning and clamping are completed through the insertion blocks 46. During the entire turning process, one end of the placement rack 34 will always be located inside the inner slot 32, thereby ensuring the stability during its turning and preventing the phenomenon of dropping due to careless handling. Moreover, this turning method simplifies the existing turning steps and increases the processing efficiency of the equipment;

[0047] Fourthly, when in use, two first thread rings 19 can be rotated on the two first screws 18. Driven by the rotation of the two first thread rings 19, two first sliders 22 will move upward in the two first sliding grooves 17 accordingly. At this time, the two first sliders 22 will drive the U-shaped frame 21 to move upward accordingly. Driven by the movement of the U-shaped frame 21, the laser head 15 will slide out of the circular groove 23, and then the IC carrier can be laser-engraved. Driven by the movement of the U-shaped frame 21, the laser head 15 will contact the cleaning cotton 24, and then the laser head 15 can be effectively cleaned. Moreover, when laser-engraving, the fan assembly 27 can be started. The fan assembly 27 can blow and clean the processing part of the IC carrier, making it convenient to clean the laser head 15 and the IC carrier when the equipment is in use, ensuring that the IC carrier is in a clean state during processing, and thus enhancing the processing effect.

[0048] Fifthly, after the equipment is used up, the first thread ring 19 can be rotated on the first screw 18 at this time. Under the action of gravity, the two first sliders 22 will drive the U-shaped frame 21 to slide downward accordingly. When the U-shaped frame 21 slides below the laser head 15, the U-shaped frame 21 will effectively protect the laser head 15 at this time, ensuring that the laser head 15 will not be damaged due to accidental touch, and enhancing its service life.

[0049] The embodiments of the present invention are given for the purposes of illustration and description, and are not exhaustive or limit the invention to the disclosed form. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are chosen and described in order to better explain the principles of the invention and its practical application, and to enable those of ordinary skill in the art to understand the invention and design various embodiments with various modifications suitable for specific purposes.

Claims

1. A laser engraving machine for processing IC substrates, comprising a laser engraving machine base (11), wherein a first adjustment frame (12) is arranged at the upper end of the laser engraving machine base (11), and characterized in that: A second adjustment frame (13) is mounted on the first adjustment frame (12), a laser box (14) is mounted on the second adjustment frame (13), a laser head (15) is arranged inside the laser box (14), and a push rod (16) is fixedly mounted on the upper end of the laser box (14); Wherein, first slide grooves (17) are provided on both side walls of the push rod (16), first screw rods (18) are fixedly mounted on both side walls of the laser head (15), and first threaded rings (19) are threadedly mounted on both first screw rods (18); A protective mechanism is slidably mounted on the laser box (14); The protection mechanism comprises a U-shaped frame (21), the U-shaped frame (21) is slidably mounted on the laser box (14), first sliders (22) are fixedly mounted on both side walls of the U-shaped frame (21), two first sliders (22) are respectively slidably mounted in two first slide grooves (17), and two first threaded rings (19) are respectively located below the two first sliders (22) and are in contact with them; A placing table (31) is fixedly installed on the upper end of the laser engraving machine base (11), a placing frame (34) is placed inside the placing table (31), a second slide groove (35) is symmetrically opened in the inner wall of the placing frame (34), column grooves (36) are symmetrically opened on both side walls of the placing frame (34), moving bars (51) are symmetrically slidably installed inside the placing frame (34), a third slide groove (53) is opened inside the two moving bars (51), and a third screw rod (54) is symmetrically fixedly installed on the opposite ends of the two moving bars (51), and the two sets of the third screw rods (54) are fixedly installed. 4) are respectively inserted into the two column grooves (36), the two groups of the third screw rods (54) are both threadedly installed with a third threaded ring (55), the two ends of the two moving bars (51) are both fixedly installed with a fixing frame (56), the upper ends of the two fixing frames (56) are both fixedly installed with a driving motor (57), the output shafts of the two driving motors (57) are both symmetrically fixedly installed with a threaded sleeve (58), the threads of the two threaded sleeves (58) are opposite, the insides of the two third slide grooves (53) are both symmetrically slidably installed with a connecting strip (59), and the two groups of the connecting strips (59) are respectively threaded The threaded sleeves (58) are mounted on two groups of threaded sleeves (58), and the two groups of connecting strips (59) are fixedly mounted with clamping plates (61) on opposite ends. The side walls of the placement rack (34) are fixedly mounted with threaded cylinders (41), and the two threaded cylinders (41) are provided with strip grooves (42) inside. The two threaded cylinders (41) are threadedly mounted with second threaded rings (43), and the two threaded cylinders (41) are slidably mounted with inner columns (44) inside. The two inner columns (44) are fixedly mounted with first limit blocks (45), and the two groups of the first limit blocks (45) are slidably mounted on the two In the strip groove (42), an insert block (46) is fixedly installed on the opposite ends of the two inner columns (44), and the two insert blocks (46) are respectively matched with the two slots (33). The upper end of the placement frame (34) is symmetrically provided with a fourth slide groove (62), and the two fourth slide grooves (62) are symmetrically slidably installed with slide columns (63) inside, and each group of the slide columns (63) is fixedly installed with a spring (64), and the upper ends of the two groups of slide columns (63) are fixedly installed with a fixed block (65), and the two groups of fixed blocks (65) are respectively slidably installed inside the two groups of fourth slide grooves (62).

2. A laser engraving machine for IC substrate processing as claimed in claim 1, characterized in that: A circular groove (23) is formed through the center of the U-shaped frame (21), a cleaning cotton (24) is installed in the inner wall of the circular groove (23), and the laser head (15) fits the cleaning cotton (24); Wherein, a vertical bar (25) is fixedly mounted on the lower end of the U-shaped frame (21), a side bar (26) is fixedly mounted on the side wall of the vertical bar (25), and a fan assembly (27) is fixedly mounted on the side bar (26).

3. A laser engraving machine for IC substrate processing as claimed in claim 1, characterized in that: The inner wall of the placement table (31) is symmetrically provided with inner grooves (32); Wherein, a clamping groove (33) is provided in the inner wall of each of the two inner grooves (32).

4. A laser engraving machine for IC substrate processing as claimed in claim 1, characterized in that: Second limit blocks (52) are fixedly mounted on both side walls of the two movable bars (51); Wherein, two groups of the second limit blocks (52) are slidably mounted in the two second sliding grooves (35) respectively.

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