Wafer automatic boxing machine

Abstract

The present application discloses an automatic silicon wafer cartoning machine, which includes: a silicon wafer aligning device, which is configured to be arranged around the silicon wafer at a set position and has a gap with the silicon wafer in the horizontal direction, and the silicon wafer aligning device is configured to be able to move in the horizontal direction to increase or eliminate the gap; a defect detection device is located downstream of the silicon wafer aligning device, and the defect detection device includes a support frame, an integrated support, a first shooting module and a second shooting module, the shooting direction of the first shooting module is toward the side of the silicon wafer, and the shooting direction of the second shooting module is toward the chamfer of the silicon wafer, and the defect detection device is used to detect whether the silicon wafer is complete, and a bagging folding device is located downstream of the defect detection device, and the bagging folding device is used to fold the packaging bag of the silicon wafer. Through the above arrangement, the safety of the automatic cartoning machine is improved, and the efficiency of the automatic cartoning machine is also improved.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic silicon wafer boxing equipment, and in particular to an automatic silicon wafer boxing machine. Background Art

[0002] Box packaging is an important process in the production of silicon wafers. It is of great significance in the production process of silicon wafers. With the development of the photovoltaic industry, in order to effectively control costs and obtain greater benefits, the thickness of photovoltaic silicon wafers is getting smaller and smaller, and the area is getting larger and larger. Therefore, photovoltaic silicon wafers are easily damaged during transfer, and even cause large-scale breakage. In addition, in the prior art, due to the deviation of each layer of silicon wafers in the horizontal direction, the silicon wafers will be damaged during transportation. In the inspection process of silicon wafers, traditional manual packaging has problems such as missed inspection and over-inspection due to inconsistent inspection standards, resulting in a low benefit conversion ratio. At the same time, manual packaging production efficiency is low and the labor cost of enterprises is high. Summary of the invention

[0003] In order to solve the deficiencies of the prior art, an object of the present invention is to provide a silicon wafer automatic boxing machine with high efficiency and high safety.

[0004] To achieve the above objectives, this application adopts the following technical solutions:

[0005] A silicon wafer automatic cartoning machine, the silicon wafer automatic cartoning machine comprises: a silicon wafer regularization device, the silicon wafer regularization device comprises a frame, a regularization component, an air knife component and an exhaust component, the regularization component is installed on the frame, and the regularization component can move relative to the frame in the height direction; the silicon wafer regularization device surrounds the silicon wafer when the position is set, and has a gap with the silicon wafer in the horizontal direction, and at least part of the regularization component can move in the horizontal direction to increase or eliminate the gap; the air knife component is installed on the regularization component, and the air outlet of the air knife component is parallel to the horizontal direction and faces the silicon wafer; the exhaust component is installed on the frame for pressing or loosening the silicon wafer in the height direction; the silicon wafer regularization device is located downstream of the silicon wafer regularization device, and the defect detection device comprises a support frame, an integrated support, a first shooting module and a second shooting module, the integrated support is installed on the support frame and movably connected with the support frame, the first shooting module and the second shooting module are both fixed on the integrated support, and the shooting direction of the first shooting module faces the side of the silicon wafer edge, the shooting direction of the second shooting module is toward the chamfer of the silicon wafer, the first shooting module and the second shooting module are configured to move synchronously in the height direction; a bagging and folding device is located downstream of the defect detection device, the bagging and folding device includes a carrying component, an upper bag component and a folding component, the carrying component is used to place the packaging bag, the upper bag component is located on one side of the carrying component, and is used to grab the packaging bag and transport the packaging bag to the carrying component, the folding component includes a rotating drive mechanism and a first folding plate and a second folding plate extending in the horizontal direction, wherein the extension directions of the first folding plate and the second folding plate are parallel, the first folding plate and the second folding plate move relative to each other in the height direction to clamp the bag opening of the packaging bag, when the first folding plate and the second folding plate clamp the bag opening of the packaging bag, the first folding plate is clamped between the packaging bag and the second folding plate, and the second folding plate can rotate around the first folding plate under the action of the rotating drive mechanism to drive the bag opening of the packaging bag to flip to the bottom of the packaging bag.

[0006] Furthermore, the regularization assembly includes a group of regularization plates arranged relatively front to back and another group of regularization plates arranged relatively left to right, the four regularization plates respectively corresponding to the four sides of the silicon wafer, wherein there is a gap between any regularization plate and the silicon wafer; the regularization assembly also includes a first driving member for driving the regularization plates, the first driving member is configured to drive the regularization plates to move in a horizontal direction relative to the silicon wafer to increase or eliminate the gap.

[0007] Furthermore, the exhaust assembly includes an exhaust pressure plate and a second driving member connected to the exhaust pressure plate. The exhaust pressure plate is located in the area surrounded by the regular assembly. The exhaust pressure plate is configured to move in the height direction under the drive of the second driving member to tighten or loosen the silicon wafer.

[0008] Furthermore, the wind knife assembly includes a group of wind knifes arranged relatively front to back and another group of wind knifes arranged relatively left to right. The four wind knifes respectively correspond to the four sides of the silicon wafer. The wind knifes are installed on the regular plate and are located on the side of the regular plate away from the silicon wafer. The air outlet of the wind knife faces the silicon wafer.

[0009] Furthermore, the automatic silicon wafer box packing machine also includes a transfer component, which is used to grab the silicon wafers and transfer the silicon wafers from the silicon wafer straightening device to the defect detection device, or transfer the silicon wafers from the defect detection device to the bagging and folding device; the transfer component includes a pair of clamps and a clamping mechanism connected to the clamps, and there is a gap between the pair of clamps for placing the silicon wafers, and the clamping mechanism is configured to drive the pair of clamps to move relative to or away from each other.

[0010] Furthermore, the automatic silicon wafer cartoning machine also includes at least two paper loading modules, which are used to transfer the padding paper to the silicon wafer. One of the paper loading modules is located between the silicon wafer straightening device and the defect detection device to transfer the padding paper to the bottom of the silicon wafer, and the other paper loading module is located between the defect detection device and the bagging and folding device to transfer the padding paper to the top of the silicon wafer.

[0011] Furthermore, the paper loading module includes a separation mechanism and a plurality of adsorption parts, the adsorption parts are used to adsorb the pad paper, the plurality of adsorption parts are horizontally distributed and surround to form an adsorption area, the separation mechanism is located in the adsorption area, and the separation mechanism is configured to exert a force on the pad paper when the adsorption parts adsorb the pad paper so as to separate at least two pad papers on the adsorption parts.

[0012] Furthermore, the paper loading module includes a paper bin for placing pad paper, the paper bin includes a plurality of limiting structures extending along the height direction, the plurality of limiting structures surround a space for placing pad paper, and a structural member protruding into the space is formed on one end surface of the limiting structure facing the space.

[0013] Furthermore, the bag folding device also includes a smoothing assembly, which is located downstream of the supporting assembly. The smoothing assembly includes smoothing pressure plates distributed on both sides of the packaging bag, wherein the smoothing pressure plates on either side include a first pressure plate and a second pressure plate distributed up and down, and the two pressure plates each form an inclination angle greater than 0° and less than 180° between the surfaces of the packaging bag.

[0014] Furthermore, the folding assembly also includes a clamping assembly, which is arranged between the smoothing assembly and the load-bearing assembly and can move between the smoothing assembly and the load-bearing assembly; the clamping assembly includes a top block that can move in the height direction, when the bag opening of the packaging bag is folded to the bottom of the packaging bag, the top block presses the bag opening from bottom to top, and the second folding plate has a notch, when the top block presses the bag opening, the top block is located in the notch, so that the second folding plate can be pulled away from the bottom of the packaging bag in a direction away from the notch.

[0015] The above-mentioned automatic silicon wafer cartoning machine realizes the regularization of silicon wafers and the detection of defects by arranging silicon wafer regularization devices, defect detection devices and bagging and folding devices, thereby improving the safety of the automatic cartoning machine. In addition, the bagging and folding device can also automatically fold the edges of silicon wafers, thereby improving the efficiency of the automatic cartoning machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of the automatic silicon wafer box packing machine in the embodiment of the present application;

[0017] Figure 2 This is a schematic diagram of the structure of a silicon wafer tidying device in an embodiment of the present application;

[0018] Figure 3 This is a schematic diagram of the structure of a defect detection device in an embodiment of the present application;

[0019] Figure 4 This is a schematic diagram of the structure of the bagging and folding device in the embodiment of the present application;

[0020] Figure 5 This is a schematic diagram of the structure of the hemming assembly in the embodiment of the present application;

[0021] Figure 6 This is a schematic diagram of the structure of the upper bag assembly in the embodiment of the present application;

[0022] Figure 7 This is a structural schematic diagram of the expansion mechanism in the implementation manner of the present application;

[0023] Figure 8 It is a structural schematic diagram of the paper loading module in the embodiment of the present application. DETAILED DESCRIPTION

[0024] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the specific implementation manner of the present application will be clearly and completely described below in conjunction with the drawings in the implementation manner of the present application.

[0025] like Figure 1 As shown, the embodiment of the present application provides a silicon wafer automatic cartoning machine 100, which is used to realize the automatic cartoning of silicon wafers. The silicon wafer automatic cartoning machine 100 includes a silicon wafer tidying device 11, a defect detection device 12 and a bagging and folding device 13. The silicon wafer tidying device 11 is used to tidy up the stacked silicon wafers, so as to avoid damage to the silicon wafers due to unevenness during subsequent transportation. The defect detection device 12 is arranged downstream of the silicon wafer tidying device 11, and is used to receive the whole stack of silicon wafers after tidying. The bagging and folding device 13 is located downstream of the defect detection device 12, and the silicon wafers are transported to the bagging and folding device 13 after being detected by the defect detection device 12.

[0026] like Figure 2 As shown, the silicon wafer aligning device 11 includes a frame 111, an aligning assembly 112, an air knife assembly 113 and an exhaust assembly 114. The aligning assembly 112 is mounted on the frame 111, and the aligning assembly 112 can move relative to the frame 111 in the up and down directions. The silicon wafer aligning device 11 is configured to be arranged around the silicon wafer when in a set position, and to have a gap with the silicon wafer in the horizontal direction, and at least part of the aligning assembly 112 can move in the horizontal direction to increase or eliminate the gap.

[0027] It should be noted that the set position refers to the position of the silicon wafer tidying device 11 when clamping a whole stack of silicon wafers. Since silicon wafers are usually stacked in several layers, there may be deviations between the layers of silicon wafers in the horizontal direction. The silicon wafers can be tidy in the horizontal direction through the tidying component 112, thereby avoiding damage to the silicon wafers due to unevenness during subsequent transportation. The wind knife component 113 is installed on the tidying component 112. The air outlet of the wind knife component 113 is parallel to the horizontal direction and faces the silicon wafer. The wind knife component 113 can blow air to the silicon wafer from the horizontal direction, thereby eliminating dust or impurities such as silicon powder between the layers of silicon wafers. In addition, the wind knife component 113 blowing air to the silicon wafer from the horizontal direction can also cause gaps between the layers of silicon wafers, thereby reducing the friction between the layers of silicon wafers, thereby facilitating the tidying of the silicon wafers. The exhaust component 114 is installed on the frame 111. The exhaust component 114 can move in the up and down directions to compress or loosen the silicon wafers in the up and down directions, thereby eliminating the gaps between the layers of silicon wafers, thereby avoiding the silicon wafers from slipping due to the presence of air during the removal of the silicon wafer aligning device 11.

[0028] like Figure 3 As shown, the defect detection device 12 includes a support frame 121, an integrated support frame 122, a first shooting module 123 and a second shooting module 124. The integrated support frame 122 is mounted on the support frame 121 and is movably connected to the support frame 121. The first shooting module 123 and the second shooting module 124 are both fixed on the integrated support frame 122. The shooting direction of the first shooting module 123 is toward the side of the silicon wafer, so that the first shooting module 123 can obtain the side image information of the silicon wafer; the shooting direction of the second shooting module 124 is toward the chamfer of the silicon wafer, so that the second shooting module 124 can obtain the chamfer image information of the silicon wafer. The first shooting module 123 and the second shooting module 124 are configured to move synchronously in the up-down direction, so as to simultaneously detect the side and chamfer of the silicon wafer. By using vertical line scanning to collect wafer images of a whole stack of stacked silicon wafers, the image storage volume is reduced while ensuring pixel requirements, which helps to improve algorithm processing speed and reduce the processing pressure on hardware such as industrial computers, CPUs, and graphics cards, thereby greatly improving the inspection efficiency of silicon wafer groups on the production line.

[0029] like Figure 4As shown, the bagging and folding device 13 includes a carrying component 131, an upper bag component 132 and a folding component 133. The carrying component 131 includes a carrying platform 1311 for placing packaging bags. The upper bag component 132 is located on one side of the carrying component 131. The upper bag component 132 is used to grab the packaging bags and transport the packaging bags to the carrying component 131. The folding component 133 is used to fold the packaging bags containing a whole stack of silicon wafers.

[0030] like Figure 5 As shown, the folding assembly 133 includes a first folding plate 1331, a second folding plate 1332 and a rotating drive mechanism 1333, the second folding plate 1332 is installed on the rotating drive mechanism 1333, and the first folding plate 1331 and the second folding plate 1332 can move relative to each other in the height direction. It should be noted that the first folding plate 1331 and the second folding plate 1332 are arranged in the height direction, and the first folding plate 1331 is located below the second folding plate 1332, and the two can move toward each other to clamp the bag mouth of the packaging bag; after completing the folding of the packaging bag, the two can move back to each other, so that the first folding plate 1331 and the second folding plate 1332 can perform the next folding process.

[0031] The first folding plate 1331 and the second folding plate 1332 are spaced apart in the direction of the bag opening of the packaging bag, and the extension direction of the two is parallel to the horizontal plane and perpendicular to the bag opening direction of the packaging bag. Based on this design, the first folding plate 1331 can move upward to lift the bag opening of the packaging bag, so that the bag opening of the packaging bag generates a first fold. Since there is a certain interval between the second folding plate 1332 and the first folding plate 1331, the second folding plate 1332 can pass through the first folding plate 1331 when moving downward, and press down the bag opening of the lifted packaging bag, so that the bag opening of the packaging bag generates a second fold. At this time, the first folding plate 1331 and the second folding plate 1332 clamp the bag opening of the packaging bag. When the two clamp the bag opening of the packaging bag, the first folding plate 1331 is clamped between the second folding plate 1332 and the packaging bag, or the first folding plate 1331 is between the first fold and the second fold.

[0032] The second folding plate 1332 is installed on the rotating drive mechanism 1333. When the first folding plate 1331 and the second folding plate 1332 clamp the bag opening of the packaging bag, the second folding plate 1332 can rotate around the first folding plate 1331 under the action of the rotating drive mechanism 1333, so that the bag opening of the packaging bag is folded to the bottom of the packaging bag driven by the second folding plate 1332 to achieve the folding of the packaging bag. The rotating drive mechanism 1333 includes but is not limited to a rotating cylinder or a motor.

[0033] like Figure 1As shown, in some embodiments, the silicon wafer automatic boxing machine 100 further includes a transfer assembly 14, which is located between the defect detection device 12 and the silicon wafer aligning device 11. The transfer assembly 14 is used to grab the silicon wafer and transfer the silicon wafer from the silicon wafer aligning device 11 to the defect detection device 12. The transfer assembly 14 includes a pair of clamps 141 and a clamping mechanism 142 connected to the clamps 141. There is a gap between the pair of clamps 141 for placing the silicon wafer. The clamping mechanism 142 is configured to drive the pair of clamps 141 to move relative to or away from each other, thereby achieving the grabbing and separation of the silicon wafer. The clamping mechanism 142 includes but is not limited to a cylinder or a linear motor.

[0034] In the prior art, silicon wafers are usually placed into packaging bags manually, and the packaging of silicon wafers is realized by manual operation, which results in low packaging efficiency of silicon wafers. In addition, there is a probability of damaging silicon wafers during manual bagging, thereby affecting the production efficiency of silicon wafers. By setting up the silicon wafer boxing machine of the embodiment of the present application, the packaging efficiency of silicon wafers can be improved, and the damage of silicon wafers caused by manual bagging can also be avoided.

[0035] like Figure 2 As shown, an embodiment of the present application provides a silicon wafer tidying device 11, which includes a frame 111, a tidying component 112, a wind knife component 113 and an exhaust component 114. The tidying component 112 is mounted on the frame 111, and the tidying component 112 can move relative to the frame 111 in the up and down directions. The silicon wafer tidying device 11 is configured to be arranged around the silicon wafer when in a set position, and to have a gap with the silicon wafer in the horizontal direction, and at least part of the tidying component 112 can move in the horizontal direction to increase or eliminate the gap. The wind knife component 113 is mounted on the tidying component 112, and the air outlet of the wind knife component 113 is parallel to the horizontal direction and faces the silicon wafer, and the wind knife component 113 can blow air to the silicon wafer from the horizontal direction. Specifically, the wind knife assembly 113 is first started to supply air to the entire stack of silicon wafers, thereby overcoming or partially overcoming the self-weight of the silicon wafers above the air supply position, so that the pressure on the silicon wafers at the bottom is greatly reduced. While continuing to supply air, the straightening assembly 112 is driven to squeeze the four sides of the entire stack of silicon wafers for straightening, thereby reducing the risk of corner collapse, surface collapse or breakage of the silicon wafers during straightening.

[0036] In some embodiments, when the unprocessed stack of silicon wafers is transferred to the set position by the conveyor belt, the silicon wafer tidying device 11 is arranged around the silicon wafer. The tidying assembly 112 includes a group of tidying plates 1121 arranged relatively front to back and another group of tidying plates 1121 arranged relatively left to right, and the four tidying plates 1121 each correspond to the four sides of the silicon wafer, wherein there is a gap between any tidying plate 1121 and the silicon wafer. The tidying assembly 112 also includes a first driving member 1122 for driving the tidying plates 1121, the first driving member 1122 is installed on the frame 111, the first driving member 1122 is set to four, and the four first driving members 1122 are respectively connected to the four tidying plates 1121, and the first driving member 1122 is configured to be able to drive the tidying plates 1121 to move relative to the silicon wafer in the horizontal direction to increase or eliminate the gap. The exhaust assembly 114 includes an exhaust pressure plate 1141 and a second driving member 1142 connected to the exhaust pressure plate 1141. The second driving member 1142 is installed on the frame 111. The exhaust pressure plate 1141 is located in the area formed by the regular assembly 112. The exhaust pressure plate 1141 is configured to be able to move in the up and down direction under the drive of the second driving member 1142 to compress or loosen the silicon wafer. The exhaust pressure plate 1141 is also provided with a through hole, and the air between the exhaust pressure plate 1141 and the silicon wafer can be discharged from the through hole, which is convenient for shaping the silicon wafer group and the stack of silicon wafers.

[0037] The first driving member 1122 and the second driving member 1142 include but are not limited to cylinders or linear motors.

[0038] Specifically, the wind knife assembly 113 includes a group of wind knives 1131 arranged relatively front and back and another group of wind knives 1131 arranged relatively left and right, and the four wind knives 1131 correspond to the four sides of the silicon wafer respectively. The wind knives 1131 are installed on the regular plate 1121 and are located on the side of the regular plate 1121 away from the silicon wafer, and the air outlet of the wind knife 1131 faces the side of the silicon wafer. The wind knife 1131 is also connected to the external fan so that the wind knife 1131 can blow air to the silicon wafer. The number of air outlets is set to several, and the several air outlets are arranged in the up and down direction, and the distance between adjacent air outlets is equal to the thickness of each layer of silicon wafers in the whole stack of silicon wafers, so that when the wind knife 1131 blows air to the silicon wafer, impurities between each layer of silicon wafers can be eliminated. Optionally, the air outlet of the wind knife 1131 can also be set as a through hole extending in the up and down direction, and the length of the air outlet extending in the up and down direction is greater than the thickness of the whole stack of silicon wafers.

[0039] Optionally, the wind knife assembly 113 also includes a wind knife 1131 installed on the top of the regularization plate 1121, and the air outlet of the top wind knife 1131 is facing the top of the silicon wafer. When the exhaust pressure plate 1141 presses the silicon wafer, the top wind knife 1131 can blow air toward the top of the silicon wafer to remove impurities between the silicon wafer and the exhaust pressure plate 1141, thereby avoiding damage to the silicon wafer caused by the exhaust pressure plate 1141.

[0040] The silicon wafer aligning device 11 provided in this embodiment is suitable for aligning large quantities of silicon wafers. It uses a flow rate of 200L / min and an air pressure of 0.6MPa, and can overcome the deadweight of 225 silicon wafers of 210 specifications, which is currently the leading aligning quantity in the industry. Specifically, according to the actual aligning quantity and the deadweight of the silicon wafers, the wind force that can overcome the deadweight of part of the silicon wafers can be selected to achieve aligning.

[0041] like Figure 3 As shown, the embodiment of the present application provides a defect detection device 12, which includes a support frame 121, an integrated support frame 122, a first shooting module 123 and a second shooting module 124. The integrated support frame 122 is mounted on the support frame 121 and is movably connected to the support frame 121. The first shooting module 123 and the second shooting module 124 are both fixed on the integrated support frame 122. The shooting direction of the first shooting module 123 is toward the side of the silicon wafer, so that the first shooting module 123 can obtain the side image information of the silicon wafer; the shooting direction of the second shooting module 124 is toward the chamfer of the silicon wafer, so that the second shooting module 124 can obtain the chamfer image information of the silicon wafer. The first shooting module 123 and the second shooting module 124 are configured to move synchronously in the up and down directions.

[0042] The first camera module 123 is a line scan camera, the line scan direction of which is parallel to the long side direction or thickness direction of the silicon wafer. The second camera module 124 is an area array camera, the field of view of which covers the height of the silicon wafer.

[0043] Taking the image acquisition requirements of a silicon wafer group with a length, width and height of 210mm*210mm*22.5mm as an example, the adapter camera must meet the following conditions: the camera field of view height only needs to cover the height of the silicon wafer. The conventional inspection object is a 22.5mm silicon wafer group, so the camera field of view height is set to 40mm. The scanning length covers the length of the silicon wafer and is set to 230mm. The resulting magnification is 0.7168.

[0044] Based on the above preset conditions, an adapted area array camera is selected. When the area array camera is a 12-megapixel camera, its target surface size is 1 / 1", and its resolution is 4096×3000. Correspondingly, the horizontal dimension of the camera's field of view is 230mm, the vertical dimension is 168mm, the magnification is 0.06144, and the camera frame rate is 9.4FPS. The imaging accuracy of the camera is 3000÷168=17.8 pixels / mm, the number of pixels in the thickness direction of each silicon wafer is: 17.8×0.15=2.67 pixels, the shooting time = 1÷9.4=0.1s, and the image size is 12000000×3÷1024÷1024=36MB.

[0045] Based on the above preset conditions, a suitable 4K line scan camera is selected, and when the vertical line scan method is used for image acquisition, the resolution of the 4K line scan camera is 4096×2, and the moving speed is 600mm / s. If the line scan direction is horizontal to the thickness direction of the silicon wafer, the line scan distance needs to cover the height of the silicon wafer, which can be set to 40mm, and the field of view length needs to cover the length of the silicon wafer, which is set to 230mm. The magnification of the camera imaging is 0.124, and the imaging accuracy is 4096÷230=17.8 pixels / mm. The number of pixels in the thickness direction of each silicon wafer is 17.8×0.15=2.67 pixels, the shooting time = 40÷600=0.067s, and the image size = 4096×17.8×40×3÷1024÷1024=8MB.

[0046] As can be seen from the above, in the shooting scheme of the area array camera, the pixel accuracy of the image is limited by the camera accuracy, and the pixel accuracy of the 12-megapixel area array camera is higher. In the shooting scheme of the linear array camera, the vertical shooting method adopted in the embodiment of the present application can greatly shorten the image shooting time and reduce the image volume while ensuring pixel accuracy. At the same time, the vertical line scanning shooting scheme adopted in the embodiment of the present application has a shorter shooting time and a smaller image volume under the condition of achieving the same shooting accuracy as the 12-megapixel area array camera. Therefore, the defect detection device 12 based on the embodiment of the present application can greatly reduce the image volume while ensuring sufficient pixel accuracy, improve the algorithm processing speed, reduce the performance requirements for industrial computer CPU, graphics card and other equipment, and reduce the equipment cost. In addition, due to the shortened image shooting time, the detection efficiency of the silicon wafer group can be greatly improved.

[0047] Furthermore, the defect detection device 12 also includes a third driving member 125, which is installed on the support frame 121 and connected to the integrated bracket 122. The third driving member 125 is used to drive the integrated bracket 122 to move in the up and down direction, so as to drive the first shooting module 123 and the second shooting module 124 to move synchronously in the up and down direction. The third driving member 125 includes but is not limited to a cylinder or a linear motor. The first shooting module 123 and the second shooting module 124 are both communicatively connected to an external processing terminal, and the processing terminal can obtain image information of the first shooting module 123 and the second shooting module 124, and use the image information to determine whether the silicon wafer is damaged. The processing terminal includes but is not limited to a computer or an industrial computer. The modular design of the integrated bracket 122 is realized, which is convenient for the assembly and subsequent maintenance of the equipment and reduces the maintenance cost.

[0048] The defect detection device 12 further includes a detection platen 126 mounted on the support frame 121, and the detection platen 126 is configured to be movable in the up-down direction relative to the support frame 121. During the process of the first shooting module 123 and the second shooting module 124 shooting the silicon wafers, the detection platen 126 can press the whole stack of silicon wafers, thereby eliminating the air between the layers of silicon wafers, thereby avoiding affecting the detection accuracy of the defect detection device 12 due to the gaps between the layers of silicon wafers.

[0049] The defect detection device 12 further includes a fourth driving member 127, which is mounted on the support frame 121 and connected to the detection platen 126, and is configured to drive the detection platen 126 to move in the up and down direction relative to the support frame 121. The fourth driving member 127 includes but is not limited to a cylinder or a linear motor.

[0050] like Figures 4 to 6 As shown, the embodiment of the present application further provides a bagging and folding device 13, which includes a carrying component 131, an upper bag component 132 and a folding component 133. The carrying component 131 includes a carrying platform 1311 for placing a packaging bag, the upper bag component 132 is located on one side of the carrying component 131, the upper bag component 132 is used to grab the packaging bag and transport the packaging bag to the carrying component 131, and the folding component 133 is used to fold the packaging bag containing a whole stack of silicon wafers.

[0051] A silo assembly 134 is provided next to the upper bag assembly 132, and unused packaging bags are placed in the silo assembly 134. The upper bag assembly 132 includes a first adsorbent 1321 and a moving mechanism 1322, wherein the first adsorbent 1321 is mounted on the moving mechanism 1322, and the first adsorbent 1321 is used to adsorb the upper surface of the packaging bag, and the first adsorbent 1321 can also transport the packaging bag to the carrying platform 1311 under the action of the moving mechanism 1322.

[0052] Exemplarily, the first adsorbent 1321 is a suction cup, and the number of the first adsorbents 1321 is set to four, and the four first adsorbents 1321 are respectively adsorbed on the four corners of the packaging bag, thereby improving the stability of the upper bag assembly 132 when grasping. The first adsorbent 1321 is connected to an external vacuum machine through a pipeline, so that the first adsorbent 1321 adsorbs the packaging bag by vacuum adsorption.

[0053] The moving mechanism 1322 is configured to drive the first adsorbent 1321 to move in the up-down direction, so that the first adsorbent 1321 can move into the bin assembly 134 to adsorb the packaging bag, or the first adsorbent 1321 can move the packaging bag out of the bin assembly. The moving mechanism 1322 is also configured to drive the first adsorbent 1321 to move in the horizontal direction, so that the first adsorbent 1321 can move the packaging bag to the carrier 1311 in the horizontal direction. The moving mechanism 1322 includes but is not limited to a cylinder or a linear motor.

[0054] A second adsorption component 1312 is provided on the surface of the supporting platform 1311. When the packaging bag is placed on the supporting platform 1311, the second adsorption component 1312 adsorbs the lower surface of the packaging bag from below the packaging bag, and the moving mechanism 1322 drives the first adsorption component 1321 to move to the side away from the supporting platform 1311 to open the bag mouth of the packaging bag.

[0055] Exemplarily, the second adsorbent 1312 is a through hole opened on the carrier 1311. When the packaging bag is located on the carrier 1311, the second adsorbent 1312 is located below the bag opening of the packaging bag. The second adsorbent 1312 is connected to an external vacuum machine through a pipeline so that the second adsorbent 1312 can adsorb the packaging bag by vacuum adsorption. Optionally, the second adsorbent 1312 can also be set as a suction cup, and the adsorption surface of the suction cup is parallel to the bearing surface of the carrier 1311.

[0056] like Figure 4 As shown, in some embodiments, the supporting component 131 also includes a widening mechanism 1313, which is located on the side of the supporting platform 1311 close to the transfer component 14, and at least a portion of the widening mechanism 1313 can penetrate into the bag opening of the packaging bag and laterally expand the bag opening of the packaging bag.

[0057] The expansion mechanism 1313 includes a pair of expansion brackets 1313a and a lateral movement module 1313b (see Figure 7 ), the transverse movement module 1313b is connected to the two flaring brackets 1313a, and the transverse movement module 1313b is configured to drive the two flaring brackets 1313a to move synchronously and relatively away from each other. When the bag opening of the packaging bag is opened, the transverse movement module 1313b can drive the two flaring brackets 1313a from the bag opening of the packaging bag to penetrate into the packaging bag, and drive the two flaring brackets 1313a to move relatively away from each other, so that the bag opening of the packaging bag is stretched horizontally. The transverse movement module 1313b includes but is not limited to a cylinder or a linear motor. Through the above arrangement, it is possible to avoid the silicon wafer from colliding with the bag opening of the packaging bag when entering the packaging bag, thereby preventing the silicon wafer from being damaged, thereby improving the safety of the silicon wafer packaging process.

[0058] Exemplarily, taking any expansion bracket 1313a as an example, the expansion bracket 1313a includes at least two rod-shaped structural members arranged along the height direction, and the maximum interval between the multiple structural members is basically consistent with the thickness of the packaging bag, so that the bag mouth of the packaging bag can be evenly opened.

[0059] Optionally, the structural member may also be configured as a plate-shaped member.

[0060] like Figure 5 As shown, in other embodiments, the hemming assembly 133 includes a first driving mechanism 1334 and a second driving mechanism 1335 that can move in the up-down direction, and the first hemming plate 1331 is installed on the first driving mechanism 1334, and the first driving mechanism 1334 is configured to drive the first hemming plate 1331 to move in the up-down direction. The second hemming plate 1332 is installed on the second driving mechanism 1335, and the second driving mechanism 1335 is configured to drive the second hemming plate 1332 to move in the up-down direction, thereby realizing the relative movement of the first hemming plate 1331 and the second hemming plate 1332.

[0061] Among them, the first driving mechanism 1334 and the second driving mechanism 1335 are both lifting cylinders, and the first folding component 133 and the second folding component 133 are both connected to the lifting cylinders, so that the lifting cylinders can drive the first folding component 133 and the second folding component 133 to move in the up and down directions. Optionally, the first driving mechanism 1334 and the second driving mechanism 1335 can also be set as linear motors, and the first folding component 133 and the second folding component 133 are both connected to the output end of the linear motor. The driving mechanisms with the above functions are all within the protection scope required by this application.

[0062] In other embodiments, the folding assembly 133 also includes a third driving mechanism 1336, and the first driving mechanism 1334 and the second driving mechanism 1335 are both installed on the third driving mechanism 1336. The third driving mechanism 1336 is configured to drive the first driving mechanism 1334 and the second driving mechanism 1335 to move synchronously in the horizontal direction so that the first folding plate 1331 and the second folding plate 1332 are close to the packaging bag or pulled away from the packaging bag, wherein the third driving mechanism 1336 includes but is not limited to a cylinder or a linear motor, etc.

[0063] In other embodiments, the bagging folding device 13 further includes a smoothing assembly 135 and a clamping assembly 136, wherein the smoothing assembly 135 is disposed downstream of the carrying assembly 131, and the clamping assembly 136 is disposed between the smoothing assembly 135 and the carrying assembly 131, and is capable of moving between the smoothing assembly 135 and the carrying assembly 131. Specifically, the carrying platform 1311 has a receiving portion 1311a with an opening toward the smoothing assembly 135, and when the clamping assembly 136 moves to a side close to the carrying platform 1311, at least a portion of the clamping assembly 136 is in the receiving portion 1311a.

[0064] It should be noted that in order to avoid interference between the second folding plate 1332 and the supporting platform 1311 when the second folding plate 1332 rotates, when the silicon wafer is transported into the packaging bag, the clamping assembly 136 clamps the packaging bag containing the silicon wafer, and drives the packaging bag containing the silicon wafer to move to the folding station between the smoothing assembly 135 and the supporting assembly 131, and at the folding station, the bag mouth of the packaging bag is folded to the bottom of the packaging bag through the folding assembly 133.

[0065] like Figure 5 As shown, as an implementation, the clamping assembly 136 includes a first clamping unit 1361 and a second clamping unit 1362 arranged in the height direction, and the second clamping unit 1362 is arranged above the first clamping unit 1361, and the packaging bag containing silicon wafers is clamped by the cooperation of the second clamping unit 1362 and the first clamping unit 1361. The clamping assembly 136 also includes a transverse movement mechanism 1363, and the first clamping unit 1361 and the second clamping unit 1362 are both installed on the transverse movement mechanism 1363. The transverse movement mechanism 1363 can drive the first clamping unit 1361 and the second clamping unit 1362 to move synchronously in the horizontal direction, so as to move the packaging bag containing silicon wafers to the folding station between the hemming assembly 135 and the bearing assembly 131.

[0066] It should be noted that after the folding of the current packaging bag is completed, the first folding plate 1331 and the second folding plate 1332 need to be separated from the packaging bag to facilitate folding the next packaging bag. In order to avoid the bag opening of the packaging bag from sliding due to separation and thus causing the folding of the packaging bag to fail, the clamping assembly 136 is also provided with a top block 1364 that can move in the height direction. The top block 1364 is arranged below the first clamping unit 1361 and is located on the side of the first clamping unit 1361 facing the support platform 1311. When the second folding plate 1332 presses the bag opening of the packaging bag under the packaging bag, the top block 1364 can move from bottom to top to press the bag opening of the packaging bag, so that the bag opening of the packaging bag will not slide when the second folding plate 1332 is recovered. The second folding plate 1332 has a notch (see figure), which is connected to the outside. When the top block 1364 presses the bag opening of the packaging bag, the top block 1364 is located in the notch, so that the second folding plate 1332 can be pulled out from the bottom of the packaging bag along the opening direction away from the notch.

[0067] In some examples, the carrier 1311 is substantially U-shaped, and when the first clamping unit 1361 is in the receiving portion 1311a, the first clamping unit 1361 is substantially located in the middle of the carrier 1311, so that when the first clamping unit 1361 lifts up the packaging bag containing the silicon wafers, the first clamping unit 1361 abuts against the middle of the packaging bag containing the silicon wafers. Based on this, when the second folding plate 1332 folds the bag opening of the packaging bag to the bottom of the packaging bag, the second folding plate 1332 will not interfere with the first clamping unit 1361, and the top block 1364 will not interfere with the first clamping unit 1361.

[0068] like Figure 5 As shown, as an implementation, the bagging and folding device 13 further includes a conveying mechanism 137, and the edge-sliding components 135 are arranged on both sides of the conveying mechanism 137. The edge-sliding components 135 are located downstream of the carrying component 131 (see the figure), and are transported to the edge-sliding components 135 after the silicon wafers are fed into the packaging bag.

[0069] The edge smoothing assembly 135 includes edge smoothing pressing plates 1351 distributed on both sides of the conveying mechanism 137, and the edge smoothing pressing plates 1351 on both sides can move relatively. Among them, the edge smoothing pressing plates 1351 on either side include a first pressing plate 1351a and a second pressing plate 1351b distributed up and down, and the first pressing plate 1351a and the second pressing plate 1351b form an inclination angle greater than 0° and less than 180° toward the surface of the packaging bag.

[0070] When the transverse movement mechanism 1363 transports the packaging bag to the smoothing assembly 135, the two smoothing pressing plates 1351 are respectively located on the left and right sides of the packaging bag containing silicon wafers, and the first pressing plate 1351a is located above the packaging bag, and the second pressing plate 1351b is located below the packaging bag. The smoothing pressing plates 1351 on both sides can move in the direction close to the packaging bag containing silicon wafers. When the first pressing plate 1351a pushes the packaging bag to abut against the upper edge of the silicon wafer, and the second pressing plate 1351b pushes the packaging bag to abut against the lower edge of the silicon wafer, the first pressing plate 1351a and the second pressing plate 1351b can press the packaging bag and the silicon wafer on both sides. In addition, after the two smoothing pressing plates 1351 abut against the edges of the silicon wafer, the smoothing pressing plates 1351 on both sides can move in the direction away from the silicon wafer, and the two sides of the packaging bag can be smoothed under the action of the first pressing plate 1351a and the second pressing plate 1351b. The above arrangement can prevent the packaging bag on both sides from warping when the packaging bag is folded, thereby preventing the packaging of the silicon wafers from being affected.

[0071] It should be noted that there is a gap between the first pressing plate 1351a and the second pressing plate 1351b in the height direction, thereby preventing the first pressing plate 1351a and the second pressing plate 1351b from clamping the packaging bag and causing damage to the packaging bag or dragging the packaging bag when the hemming pressing plates 1351 on both sides are away from the silicon wafer.

[0072] Furthermore, the smoothing assembly 135 also includes a distance adjustment mechanism 1352, and the smoothing plates 1351 on both sides are installed on the distance adjustment mechanism 1352. The distance mechanism is configured to drive the two smoothing plates 1351 to move in a direction close to the silicon wafer, or to drive the two smoothing plates 1351 to move in a direction away from the silicon wafer, so as to adjust the distance between the two smoothing plates 1351. The distance adjustment mechanism 1352 includes but is not limited to a traverse cylinder or a linear motor.

[0073] As an implementation method, the smoothing assembly 135 includes an angle adjustment mechanism 1353, and the first pressure plate 1351a and / or the second pressure plate 1351b are installed on the angle adjustment mechanism 1353. The angle adjustment mechanism 1353 is configured to drive and adjust the relative rotation of the first pressure plate 1351a and / or the second pressure plate 1351b, thereby adjusting the inclination angle between the first pressure plate 1351a and the second pressure plate 1351b.

[0074] When the first pressing plate 1351a and the second pressing plate 1351b are in contact with the packaging bag, the angle adjustment mechanism 1353 can increase or decrease the inclination angle between the first pressing plate 1351a and the second pressing plate 1351b, thereby adjusting the pressure of the first pressing plate 1351a and the second pressing plate 1351b on the packaging bag, thereby making the packaging bag and the silicon wafer fit more closely. In addition, since the thickness of each silicon wafer is different, by changing the inclination angle between the first pressing plate 1351a and the second pressing plate 1351b, the hemming assembly 135 can be applied to silicon wafers of different thicknesses, thereby improving the applicability of the bagging and folding device 13.

[0075] In the embodiment of the present application, the angle adjustment mechanism 1353 is two motors, which are respectively connected to the first pressing plate 1351a and the second pressing plate 1351b, so that the angle adjustment mechanism 1353 can adjust the inclination angle between the first pressing plate 1351a and the second pressing plate 1351b.

[0076] As shown in the figure, as an implementation method, the conveying mechanism 137 includes two conveyor belts 1371 arranged opposite to each other, and there is a space between the two conveyor belts 1371 for the first clamping unit 1361 to pass through. When the packaging bag containing silicon wafers completes the folding process, the clamping assembly 136 drives the packaging bag containing silicon wafers to move toward the conveying mechanism 137, and the first clamping unit 1361 moves to the space between the two conveyor belts 1371, so that the packaging bag containing silicon wafers is above the conveying mechanism 137. The first clamping unit 1361 moves downward until the packaging bag containing silicon wafers is placed on the conveying mechanism 137, and the packaging bag containing silicon wafers is transported to the next node through the conveying mechanism 137.

[0077] Through the above arrangement, the automatic packaging, smoothing and folding processes of silicon wafers are realized, the damage of silicon wafers caused by manual bagging is reduced, and the efficiency of silicon wafer bagging is improved.

[0078] As shown in FIG1 , in some embodiments, the silicon wafer automatic boxing machine 100 further includes at least two paper loading modules 15, which are used to transfer the padding paper to the silicon wafer. One of the paper loading modules 15 is located between the silicon wafer regularization device 11 and the defect detection device 12 to transfer the padding paper to the bottom of the silicon wafer. The other paper loading module 15 is located between the defect detection device 12 and the bagging and folding device 13 to transfer the padding paper to the top of the silicon wafer.

[0079] like Figure 8As shown, the paper loading module 15 includes a separation mechanism 151 and a plurality of adsorbents 152. The adsorbents 152 are used to adsorb the pad paper. The plurality of adsorbents 152 are horizontally distributed and surround to form an adsorption area. When the adsorbents 152 move above the pad paper, the adsorption area overlaps the pad paper in the height direction. The separation mechanism 151 is located in the adsorption area formed by the adsorbents 152. The separation mechanism 151 is configured to exert a force on the pad paper when the adsorbents 152 adsorb the pad paper, so as to separate at least two pad papers on the adsorbents 152.

[0080] Exemplarily, the adsorbent 152 is a suction cup, and the number of the adsorbents 152 is set to four, and the four suction cups are respectively adsorbed on the four corners of the pad paper, thereby improving the adsorption stability of the adsorbent 152. The paper loading module 15 also includes a lifting mechanism 153, which is connected to the adsorbent 152. The lifting mechanism 153 is configured to drive the adsorbent 152 to move in the up and down directions so that the adsorbent 152 can transfer the pad paper to the top and bottom of the silicon wafer. In addition, when the lifting mechanism 153 drives the adsorbent 152 to move in the up and down directions, the separation mechanism 151 can act on the pad paper to separate at least two pad papers on the adsorbent 152.

[0081] Furthermore, the upper paper module 15 includes a paper bin 154 for placing pad paper, and the paper bin 154 includes a plurality of limiting structures 1541 extending along the height direction. The plurality of limiting structures 1541 surround a space for placing pad paper, and a structural member 1542 protruding into the space is formed on the end surface of one side of the limiting structure 1541 facing the space. When the adsorbent 152 adsorbs the pad paper, if the adsorbent 152 adsorbs at least two sheets of pad paper, the edge of the pad paper is moved by the structural member 1542, so that excess pad paper falls into the paper bin 154, which can prevent the adsorbent 152 from adsorbing too much pad paper.

[0082] It should be understood that those skilled in the art can make improvements or changes based on the above description, and all these improvements and changes should fall within the scope of protection of the claims attached to this application.

Claims

1. A silicon wafer automatic boxing machine, characterized in that: include: A silicon wafer aligning device, the silicon wafer aligning device comprising a frame, an aligning assembly, an air knife assembly and an exhaust assembly, the aligning assembly being mounted on the frame and being movable relative to the frame in the height direction; the silicon wafer aligning device surrounds the silicon wafer when in a set position and has a gap with the silicon wafer in the horizontal direction, and at least part of the aligning assembly is movable in the horizontal direction to increase or eliminate the gap; the air knife assembly is mounted on the aligning assembly, and the air outlet of the air knife assembly is parallel to the horizontal direction and faces the silicon wafer; the exhaust assembly is mounted on the frame and is used to compress or loosen the silicon wafer in the height direction; A defect detection device, located downstream of the silicon wafer regularization device, comprising a support frame, an integrated support frame, a first shooting module and a second shooting module, wherein the integrated support frame is mounted on the support frame and movably connected to the support frame, the first shooting module and the second shooting module are both fixed on the integrated support frame, the shooting direction of the first shooting module is toward the side of the silicon wafer, the shooting direction of the second shooting module is toward the chamfer of the silicon wafer, and the first shooting module and the second shooting module are configured to move synchronously along the height direction; A bagging and folding device, located downstream of the defect detection device, the bagging and folding device comprises a carrying component, an upper bag component and a folding component, the carrying component is used to place the packaging bag, the upper bag component is located at one side of the carrying component, and is used to grab the packaging bag and transport the packaging bag to the carrying component, the folding component comprises a rotating drive mechanism and a first folding plate and a second folding plate extending in a horizontal direction, wherein the extension directions of the first folding plate and the second folding plate are parallel, the first folding plate and the second folding plate move relative to each other in a height direction to clamp the bag opening of the packaging bag, when the first folding plate and the second folding plate clamp the bag opening of the packaging bag, the first folding plate is clamped between the packaging bag and the second folding plate, and the second folding plate can rotate around the first folding plate under the action of the rotating drive mechanism to drive the bag opening of the packaging bag to flip to the bottom of the packaging bag; Among them, the bagging and folding device also includes a smoothing component, which is located downstream of the supporting component. The silicon wafer is fed into the packaging bag and then transported to the smoothing component. The smoothing component includes a smoothing pressure plate. When the packaging bag is transported to the smoothing component, the smoothing pressure plates are distributed on the left and right sides of the packaging bag. The smoothing pressure plates on both sides can move toward the packaging bag and abut against the edge of the packaging bag to smooth the edge of the packaging bag.

2. The automatic silicon wafer box packing machine according to claim 1, characterized in that: The tidying assembly includes a group of tidying plates arranged relatively front to back and another group of tidying plates arranged relatively left to right, the four tidying plates respectively corresponding to the four sides of the silicon wafer, wherein there is the gap between any of the tidying plates and the silicon wafer; the tidying assembly also includes a first driving member for driving the tidying plates, the first driving member being configured to drive the tidying plates to move in a horizontal direction relative to the silicon wafer so as to increase or eliminate the gap.

3. The automatic silicon wafer box packing machine according to claim 1, characterized in that: The exhaust assembly includes an exhaust pressure plate and a second driving member connected to the exhaust pressure plate. The exhaust pressure plate is located in the area surrounded by the regular assembly. The exhaust pressure plate is configured to move along the height direction under the drive of the second driving member to tighten or loosen the silicon wafer.

4. The automatic silicon wafer box packing machine according to claim 2, characterized in that: The wind knife assembly includes a group of wind knives arranged relatively front to back and another group of wind knives arranged relatively left to right. The four wind knives respectively correspond to the four sides of the silicon wafer. The wind knives are installed on the regular plate and are located on the side of the regular plate away from the silicon wafer. The air outlets of the wind knives face the silicon wafer.

5. The automatic silicon wafer box packing machine according to claim 1, characterized in that: The automatic silicon wafer box packing machine also includes a transfer assembly, which is used to grab the silicon wafer and transfer the silicon wafer from the silicon wafer tidying device to the defect detection device, or transfer the silicon wafer from the defect detection device to the bagging and folding device; the transfer assembly includes a pair of clamps and a clamping mechanism connected to the clamps, and there is a gap between the pair of clamps for placing the silicon wafer, and the clamping mechanism is configured to drive the pair of clamps to move relative to or away from each other.

6. The automatic silicon wafer box packing machine according to claim 1, characterized in that: The automatic silicon wafer cartoning machine also includes at least two paper loading modules, which are used to transfer padding paper to the silicon wafer. One of the paper loading modules is located between the silicon wafer aligning device and the defect detection device to transfer the padding paper to the bottom of the silicon wafer, and the other paper loading module is located between the defect detection device and the bagging and folding device to transfer the padding paper to the top of the silicon wafer.

7. The automatic silicon wafer box packing machine according to claim 6, characterized in that: The paper loading module includes a separation mechanism and a plurality of adsorption members, wherein the adsorption members are used to adsorb the pad paper, and the plurality of adsorption members are horizontally distributed and surround an adsorption area, wherein the separation mechanism is located in the adsorption area, and the separation mechanism is configured to exert a force on the pad paper when the adsorption members adsorb the pad paper, so as to separate at least two pieces of the pad paper on the adsorption members.

8. The automatic silicon wafer box packing machine according to claim 7, characterized in that: The paper loading module includes a paper bin for placing the pad paper, and the paper bin includes a plurality of limiting structures extending along the height direction. The plurality of limiting structures surround a space for placing the pad paper, and a structural member protruding into the space is formed on an end surface of one side of the limiting structure facing the space.

9. The automatic silicon wafer box packing machine according to claim 1, characterized in that: The edge smoothing pressing plate on either side includes a first pressing plate and a second pressing plate distributed up and down, and an inclination angle greater than 0° and less than 180° is formed between the two pressing plates facing the surface of the packaging bag respectively.

10. The automatic silicon wafer box packing machine according to claim 9, characterized in that: The folding assembly also includes a clamping assembly, which is arranged between the smoothing assembly and the load-bearing assembly and can move between the smoothing assembly and the load-bearing assembly; the clamping assembly includes a top block that can move in the height direction, when the bag opening of the packaging bag is folded to the bottom of the packaging bag, the top block presses the bag opening from bottom to top, the second folding plate has a notch, when the top block presses the bag opening, the top block is located in the notch, so that the second folding plate can be pulled away from the bottom of the packaging bag in a direction away from the notch.

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