High-temperature aging test method for microwave digital-analog hybrid module

Abstract

The invention discloses a high-temperature aging test method for a microwave digital-analog hybrid module, and the method comprises the steps: installing the microwave digital-analog hybrid module on a module aging socket on an aging board, the module aging socket is provided with a heating module used for heating the microwave digital-analog hybrid module, a temperature acquisition module used for acquiring the temperature of the microwave digital-analog hybrid module, a cooling module used for cooling the microwave digital-analog hybrid module, and a temperature control module. The temperature control module controls the heating module and the cooling module to work cooperatively according to the temperature information acquired by the temperature acquisition module and a preset aging temperature range of the microwave digital-analog hybrid module, so that the temperature of the microwave digital-analog hybrid module is maintained within the aging temperature range of the microwave digital-analog hybrid module; and loading an aging test program of the microwave digital-analog hybrid module, and carrying out an aging test according to the aging test program. According to the invention, the aging effect of the microwave digital-analog hybrid module can be ensured, and the electronic device of the aging plate is effectively prevented from being damaged due to high temperature in the aging process.

Description

Technical Field

[0001] The invention belongs to the technical field of microwave digital-analog hybrid modules, and in particular relates to a high-temperature aging test method for a microwave digital-analog hybrid module. Background Art

[0002] With the development of electronic technology, various electronic devices are increasingly used in complex systems, and their quality and reliability have become key factors in ensuring the stable operation of the system. In this context, reliability testing has become an indispensable part of evaluating product performance, screening potential defects, and improving overall quality. Aging testing, as a comprehensive reliability screening method that combines electrical parameters, functional and performance testing, can effectively simulate the working state of products under extreme conditions, quickly expose and eliminate individuals with the risk of early failure, thereby ensuring that the quality and reliability of the final delivered products meet the preset standards.

[0003] Microwave digital-analog hybrid modules have been widely used in high-tech fields such as radar systems and microwave communications due to their unique advantages in signal processing and data transmission. This type of module integrates microwave circuits and digital / analog circuits, has complex functions and high performance requirements, so strict control of its reliability is very important. As an effective means to improve the reliability of microwave digital-analog hybrid modules, the core of the aging test is to accelerate the exposure process of potential defects inside the device by controlling the appropriate aging temperature. To ensure the aging effect, microwave digital-analog hybrid modules usually need to be heated to a specific temperature of about 125°C for aging. However, in this high-temperature environment, the electronic devices on the aging board face severe heat resistance tests and are easily damaged due to excessive temperatures, which not only affects the smooth progress of the aging test, but also increases the test cost. In order to solve this problem, a direct method is to replace existing devices with high-temperature resistant electronic devices, but this will undoubtedly greatly increase the material cost and is not conducive to product cost control. Summary of the invention

[0004] In view of the problems existing in the prior art, the present invention provides a high-temperature aging test method for a microwave digital-analog hybrid module, which can ensure the aging effect of the microwave digital-analog hybrid module while effectively avoiding damage to electronic devices on the aging board due to high temperature during the aging process.

[0005] In order to solve the above technical problems, the present invention is implemented by the following technical solutions:

[0006] A high temperature aging test method for a microwave digital-analog hybrid module, comprising:

[0007] The microwave digital-analog hybrid module is mounted on the module aging socket on the aging board, wherein the module aging socket is provided with a heating module for heating the microwave digital-analog hybrid module, a temperature acquisition module for collecting the temperature of the microwave digital-analog hybrid module, a cooling module for cooling the microwave digital-analog hybrid module, and a temperature control module;

[0008] The temperature control module controls the heating module and the cooling module to work in coordination with each other according to the temperature information collected by the temperature collection module and the preset microwave digital-analog hybrid module aging temperature range, so that the temperature of the microwave digital-analog hybrid module is maintained within the microwave digital-analog hybrid module aging temperature range;

[0009] Load the microwave digital-analog hybrid module aging test program and perform aging tests according to the aging test program.

[0010] Furthermore, after the microwave digital-analog hybrid module is installed on the module aging socket on the aging board, it also includes:

[0011] The aging board equipped with the microwave digital-analog hybrid module is placed in an oven for heating. The heating temperature of the oven does not exceed the maximum tolerable temperature of each electronic component on the aging board. Each electronic component on the aging board is an electronic component that constitutes the aging board.

[0012] Furthermore, the microwave digital-analog hybrid module aging test program is loaded, specifically:

[0013] The microwave digital-analog hybrid module burn-in test program is loaded to the CPU-JTAG and FPGA-JTAG in the microwave digital-analog hybrid module through the CPU-JTAG interface and FPGA-JTAG interface on the burn-in board.

[0014] Furthermore, the burn-in test program includes a processor performance test program, a memory read and write test program, an external interface loopback test program, a digital-analog hybrid chip performance test program, and a microwave circuit performance test program.

[0015] Furthermore, before the microwave digital-analog hybrid module is installed on the module aging socket on the aging board, it also includes:

[0016] Connect the aging board to the aging machine;

[0017] When the burn-in test is performed according to the burn-in test procedure, if the current burn-in test result is correct, a high pulse signal is output to the oscilloscope of the burn-in machine.

[0018] Furthermore, different burn-in test programs correspond to different widths of the output high pulse signal.

[0019] Furthermore, the aging board is electrically connected to the aging machine using gold fingers.

[0020] Furthermore, a pair of decoupling capacitors is connected in parallel between each feeding lead for connecting the microwave digital-analog hybrid module and the module aging socket and the ground.

[0021] Furthermore, the heating module adopts a heating rod.

[0022] Furthermore, the cooling module adopts a fan.

[0023] Compared with the prior art, the present invention has at least the following beneficial effects:

[0024] The present invention provides a high-temperature aging test method for a microwave digital-analog hybrid module. Through the coordinated work of a temperature control module, a heating module, a cooling module and a temperature acquisition module, the temperature of the microwave digital-analog hybrid module is precisely controlled. This closed-loop control can ensure that the module temperature is always maintained within a preset aging temperature range, thereby effectively simulating the working state under extreme conditions, accelerating the exposure of potential defects, and improving the reliability of the aging test. Traditional high-temperature aging methods often require heating the entire aging board, which can easily cause damage to the electronic devices on the aging board due to excessive temperature. The present invention avoids overheating the entire aging board through precise temperature control, effectively protects the electronic devices on the aging board, reduces the risk of damage during the test, and reduces the test cost. Compared with the method of using high-temperature resistant electronic devices to replace existing devices, the present invention can achieve high-temperature aging tests without increasing additional material costs, which is beneficial to product cost control. Through the high-temperature aging test method provided by the present invention, it is possible to more effectively screen out microwave digital-analog hybrid modules that have the risk of early failure, thereby ensuring that the quality and reliability of the final delivered products meet the preset standards, which is of great significance for improving the application performance of microwave digital-analog hybrid modules in high-tech fields such as radar systems and microwave communications. In summary, the high-temperature aging test method for microwave digital-analog hybrid modules provided by the present invention has obvious advantages in improving the reliability of aging tests, protecting the electronic components of the aging board, optimizing cost control, and improving the reliability of microwave digital-analog hybrid modules.

[0025] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the specific implementation modes of the present invention, the drawings required for use in the description of the specific implementation modes will be briefly introduced below. Obviously, the drawings described below are some implementation modes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0027] Figure 1This is a flow chart of a high temperature aging test method for a microwave digital-analog hybrid module according to an embodiment of the present invention;

[0028] Figure 2 It is a schematic diagram of an aging board (including a microwave digital-analog hybrid module) in a high-temperature aging test method of a microwave digital-analog hybrid module according to an embodiment of the present invention;

[0029] Figure 3 The present invention is a schematic diagram of an aging circuit of a microwave digital-analog hybrid module in a high-temperature aging test method of a microwave digital-analog hybrid module according to an embodiment of the present invention. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0031] Combination Figure 1 As shown, the embodiment of the present invention provides a high temperature aging test method for a microwave digital-analog hybrid module, which can not only effectively simulate the working state of the product under extreme conditions, but also effectively control the test cost while ensuring the aging effect, and avoid damage to electronic devices caused by high temperature environment. The following are the detailed implementation steps of the method:

[0032] S1. Install the microwave digital-analog hybrid module onto the module aging socket on the aging board, wherein the module aging socket is provided with a heating module for heating the microwave digital-analog hybrid module, a temperature collection module for collecting the temperature of the microwave digital-analog hybrid module, a cooling module for cooling the microwave digital-analog hybrid module, and a temperature control module.

[0033] Specifically, first, install the microwave digital-analog hybrid module to be tested into the module aging socket on the aging board. It should be understood that good contact between the module and the socket must be ensured. In the present invention, a heating module, a temperature acquisition module, a cooling module and a temperature control module are integrated on the module aging socket. The heating module uses a heating element (such as a heating wire, a heating plate, etc.) to quickly increase the temperature of the microwave digital-analog hybrid module to the required range for aging; the temperature acquisition module uses a temperature sensor to monitor the temperature changes on the surface of the module in real time; the cooling module is used to lower the module temperature when necessary; the temperature control module, as the center of the entire system, is responsible for receiving data from the temperature acquisition module, and intelligently adjusts the working status of the heating module and the cooling module according to the preset aging temperature range (for example, 125°C ± 5°C).

[0034] S2. The temperature control module controls the heating module and the cooling module to work in coordination with each other according to the temperature information collected by the temperature collection module and the preset microwave digital-analog hybrid module aging temperature range, so that the temperature of the microwave digital-analog hybrid module is maintained within the microwave digital-analog hybrid module aging temperature range.

[0035] That is to say, before starting the aging test, the temperature acquisition module starts working, continuously monitors the actual temperature of the microwave digital-analog hybrid module, and feeds back the data to the temperature control module in real time. The temperature control module determines whether the current temperature is within the aging temperature range based on the received temperature data. If the temperature is lower than the lower limit, the temperature control module will instruct the heating module to start or increase the heating power; if the temperature is higher than the upper limit, the temperature control module will instruct the cooling module to start or enhance the cooling effect. This is achieved through closed-loop control to ensure that the module temperature is always maintained within the set aging temperature range, neither too high nor too low, to ensure the reliability of the aging test results.

[0036] By controlling the temperature in this way, it is effectively avoided that when the entire aging board and the microwave digital-analog hybrid module are heated together, the temperature is too high, which causes damage to various electronic devices on the aging board.

[0037] S3. Load the microwave digital-analog hybrid module aging test program and perform an aging test according to the aging test program.

[0038] That is to say, according to the specific functions and performance indicators of the microwave digital-analog hybrid module, a burn-in test program is compiled. The program should include multiple links such as electrical parameter testing, functional verification, and performance testing to comprehensively evaluate the working stability and reliability of the module in a high temperature environment. The prepared burn-in test program is loaded into the test system, and then the burn-in test is started. During the test, the test system automatically applies the corresponding test signal to the microwave digital-analog hybrid module according to the preset test program, and collects and analyzes the module's response data to determine whether the module has potential defects or performance degradation.

[0039] It should be understood that during the entire aging test process, attention should be paid to the working status and temperature changes of the microwave digital-analog hybrid module to promptly detect and handle any abnormal phenomena.

[0040] Through the above-mentioned implementation mode, the present invention provides an efficient and economical high-temperature aging test method for a microwave digital-analog hybrid module, which not only effectively improves the aging test reliability of the module, but also reduces the test cost. It is of great significance for promoting the application of microwave digital-analog hybrid modules in high-tech fields such as radar systems and microwave communications.

[0041] In one achievable method, after installing the microwave digital-analog hybrid module on the module aging socket on the aging board, it also includes: placing the aging board installed with the microwave digital-analog hybrid module in an oven for heating, and the heating temperature of the oven does not exceed the maximum tolerable temperature of each electronic component on the aging board, and each electronic component on the aging board is the electronic component that constitutes the aging board.

[0042] That is to say, the step of oven-assisted heating is introduced in the heating link, and the microwave digital-analog hybrid module is installed in the module aging socket on the aging board to ensure good electrical connection and thermal conductivity between the module and the socket. Check whether the heating module, temperature acquisition module, cooling module and temperature control module on the aging board are working properly, and preset the aging temperature range (such as 125℃±5℃) according to the test requirements. Put the aging board with the microwave digital-analog hybrid module installed in the oven as a whole, and set the heating temperature of the oven according to the maximum withstand temperature of each electronic device on the aging board (such as determined by the device specification or preliminary test) to ensure that the temperature does not exceed the maximum withstand temperature of any electronic device to avoid damage to the device due to overheating. Start the oven and use its rapid heating ability to preheat the aging board and the microwave digital-analog hybrid module on it to a low value close to but not exceeding the aging temperature, which can quickly increase the module temperature, shorten the time to reach the aging temperature, and reduce the workload of the subsequent heating module. When the oven is heated to the preset temperature, start the temperature acquisition module on the aging board to monitor the temperature of the microwave digital-analog hybrid module in real time. At the same time, the temperature control module intelligently adjusts the working status of the heating module and the cooling module according to the data of the temperature acquisition module to ensure that the module temperature is accurately maintained within the preset aging temperature range. After the temperature stabilizes, the aging test program is loaded into the test system. The program should cover all key performance indicators and functional tests of the microwave digital-analog hybrid module. According to the preset test process, the corresponding test signal is automatically applied to the module, and the module's response data is collected and analyzed.

[0043] In one implementable manner, the loading of the microwave digital-analog hybrid module burn-in test program is specifically as follows: loading the microwave digital-analog hybrid module burn-in test program to the CPU-JTAG and FPGA-JTAG in the microwave digital-analog hybrid module through the CPU-JTAG interface and FPGA-JTAG interface on the burn-in board.

[0044] Specifically, confirm that the CPU-JTAG interface and FPGA-JTAG interface on the burn-in board are aligned with the corresponding interfaces in the microwave digital-analog hybrid module and are correctly connected. According to the specific functions and performance indicators of the microwave digital-analog hybrid module, compile a burn-in test program. The program should include special tests for the CPU and FPGA, as well as functional verification and performance tests of the module as a whole. Through the CPU-JTAG interface and FPGA-JTAG interface on the burn-in board, establish connections with the CPU-JTAG and FPGA-JTAG in the microwave digital-analog hybrid module. Using the JTAG interface, load the prepared burn-in test program into the CPU and FPGA of the microwave digital-analog hybrid module respectively. Start the temperature acquisition module on the burn-in board to monitor the temperature of the microwave digital-analog hybrid module in real time. At the same time, the temperature control module intelligently adjusts the working status of the heating module and the cooling module according to the data of the temperature acquisition module to ensure that the module temperature is accurately maintained within the preset burn-in temperature range. After the temperature stabilizes, the burn-in test program in the CPU and FPGA automatically applies the corresponding test signal to the microwave digital-analog hybrid module, and collects and analyzes the response data of the module.

[0045] In one achievable manner, the burn-in test program includes a processor performance test program, a memory read and write test program, an external interface loopback test program, a digital-analog hybrid chip performance test program, and a microwave circuit performance test program.

[0046] In detail, the processor performance test program is used to test the key performance indicators of the CPU, such as the operation speed and processing power. The memory read and write test program performs read and write operation tests on the module's memory to verify the correctness of its data access. The external interface loopback test program sends test data and receives loopback data through the module's external interface (such as Ethernet, serial port, etc.) to verify the normal function of the interface. The digital-analog hybrid chip performance test program is designed for the digital-analog hybrid chip (such as ADC, DAC, etc.) in the module. Special performance test programs are designed to verify its conversion accuracy, linearity and other key parameters. The microwave circuit performance test program performs performance tests on the microwave circuit part, such as gain, phase stability, frequency response, etc.

[0047] In one implementable manner, before installing the microwave digital-analog hybrid module on the module aging socket on the aging board, it also includes: electrically connecting the aging board to the aging machine; when performing the aging test according to the aging test procedure, if the current aging test result is correct, a high pulse signal is output to the oscilloscope of the aging machine.

[0048] That is to say, the aging board is electrically connected to the aging machine through the electrical interface and the connecting wire to ensure reliable connection without short circuit or open circuit. After the aging temperature is stable, the microwave digital-analog hybrid module is automatically tested for comprehensive performance through the aging test program in the CPU and FPGA. During the test process, if the current aging test result is correct, that is, the test item of the current test program passes, the output port of the aging board outputs a high pulse signal to the oscilloscope of the aging machine. After the oscilloscope receives the signal, it can display the corresponding waveform as a visual indication that the test result is correct.

[0049] Preferably, if the current burn-in test result is correct, that is, the test passes, a high pulse signal is output to the oscilloscope. The width of the output high pulse signal corresponding to different burn-in test programs is different. For example, when the processor performance test program passes, a high pulse signal with a width of T1 is output; when the memory read and write test program passes, a high pulse signal with a width of T2 is output (T1≠T2), and so on. After the oscilloscope receives these high pulse signals of different widths, it can intuitively display the corresponding waveform and determine which burn-in test program's test result is currently output based on the width of the waveform.

[0050] In one possible implementation, the burn-in board is electrically connected to the burn-in machine using a gold finger. It should be understood that a gold finger is a gold-plated conductive contact piece used to achieve high-reliability electrical connection between circuit boards. The gold finger can ensure that the electrical connection between the burn-in board and the burn-in machine is stable and reliable without short circuit or open circuit.

[0051] In one achievable manner, a pair of decoupling capacitors is connected in parallel between each feeding lead for connecting the microwave digital-analog hybrid module and the module aging socket and the ground.

[0052] Specifically, a pair of decoupling capacitors is connected in parallel between each feed lead and the ground for connecting the microwave digital-analog hybrid module and the module aging socket. The function of the decoupling capacitor is to filter out high-frequency noise in the power supply and prevent the microwave circuit from generating self-oscillation due to impedance mismatch. Since the microwave circuit in the microwave digital-analog hybrid module has extremely high impedance matching requirements, severe impedance mismatch will lead to self-oscillation. During the aging test, the impedance of the device will change with the increase of temperature, and new self-oscillation may be generated. Therefore, by connecting decoupling capacitors in parallel, self-oscillation can be effectively prevented and eliminated to ensure the stable operation of the microwave circuit.

[0053] Preferably, the heating module uses a heating rod, which has efficient and stable heating performance and can quickly heat the microwave digital-analog hybrid module to a preset aging temperature. The cooling module uses a fan, which generates airflow to take away the heat on the microwave digital-analog hybrid module to achieve a cooling effect.

[0054] Example

[0055] In this embodiment, it should be noted that the microwave circuit is based on gallium arsenide or gallium nitride field effect transistors, so its electrostatic sensitivity level is relatively low. During the aging test, it is necessary to prevent electrostatic discharge (ESD) and electromagnetic pulse (EMP) effects to prevent device damage. In the high-temperature dynamic aging test, it is necessary to consider the working state of each chip of the microwave digital-analog hybrid module at high temperature. For example, for chips with a large number of transistors such as DDR, there are some sensitive parameters. These parameters fluctuate greatly with temperature, frequency, voltage, etc., which will affect the performance of the storage unit during the aging process, thereby affecting the change of the core parameter refresh time of DDR, and further affecting the performance of DDR. At the same time, for the design of the aging board, it is also necessary to consider whether the reduction in the efficiency of the power supply module at high temperature can meet the power supply requirements of the module. Whether the temperature drift of the clock crystal oscillator at high temperature will affect the test during the dynamic aging process. For signal lines with high signal transmission rates on the aging board, the wiring of the aging board is long and concentrated, and the signal integrity problem that occurs during the transmission of the signal cannot be ignored. The aging board is large in size and thin in thickness. When multiple modules are aged at the same time, the weight of the multiple modules and the aging sockets can easily cause the deformation of the aging board, resulting in problems such as poor contact between the modules, sockets and the aging board.

[0056] This embodiment can quickly stimulate potential defects inside the device through the high-temperature aging test of the microwave digital-analog hybrid module, eliminate early failure products, provide life information, and provide a basis for reliability, safety, and maintainability evaluation.

[0057] The module high temperature aging system mainly includes: aging machine, module aging board, module aging socket, etc. The aging machine supplies power to the module aging board through the gold finger, performs waveform monitoring of the module aging test, and provides a reset signal for the module; the module aging board provides power supply, clock, program storage and loading, and resistor-capacitor network for the module; the module aging socket cover is equipped with a heating rod, temperature control chip and fan, which can be used with a thermometer to monitor the module shell temperature at any time and ensure that the module shell temperature is stable at the temperature required during aging. The schematic diagram of the aging board is as follows Figure 1 As shown, the circuit diagram of the single module of the aging test is as follows Figure 2 shown.

[0058] After the module is powered on, the burn-in program is automatically loaded through the burn-in board. The main test items in the module burn-in program include processor performance test, memory read and write test, external interface loopback test, digital-analog mixed chip performance test and microwave circuit performance test. If the test result is correct each time, a high pulse signal is output to the oscilloscope device of the burn-in machine and real-time monitoring is performed. The burn-in test personnel judge whether the module is operating normally under high temperature by monitoring the high pulse waveform displayed on the oscilloscope of the burn-in machine.

[0059] The following points should be noted when designing the microwave digital-analog hybrid module aging system:

[0060] 1. Issues that need to be paid attention to in microwave circuit aging

[0061] ① For microwave circuits in microwave digital-analog hybrid modules, serious impedance mismatch can lead to self-oscillation. During the aging test, since the size of the device impedance will change with the increase of temperature, new self-oscillation may be generated. Therefore, when aging modules containing microwave circuits, the prevention and elimination of self-oscillation should be considered. The wider the frequency band, the higher the gain, and the greater the output power of the microwave circuit, the easier it is to generate self-oscillation. Therefore, when designing the aging board, it is necessary to connect a pair of decoupling capacitors between each feed lead and the ground, and connect 50Ω chip resistors to the microwave input and output ports to prevent impedance mismatch of microwave devices.

[0062] ② Based on the high-temperature working characteristics of the aging test, the aging board should adopt a gold-plating process, and the areas other than the leads and pads should be treated with solder mask to prevent contamination and corrosion from hand sweat, oil stains, etc. The backing aluminum plate should also be treated with conductive oxidation to avoid increased contact resistance due to aluminum oxidation at high temperatures.

[0063] ③ Microwave circuits are based on gallium arsenide or gallium nitride field effect tubes, so their electrostatic sensitivity level is low. During the aging test, it is necessary to prevent electrostatic discharge (ESD) and electromagnetic pulse (EMP) effects to prevent device damage. Therefore, during the aging process, special attention should be paid to the electrostatic protection of the module, anti-static clothing should be worn correctly, anti-static wristbands and gloves should be worn during the aging test, and human body static discharge and other work should be performed before aging.

[0064] 2. Issues that need to be paid attention to in digital circuits

[0065] ① For chips with a large number of transistors such as digital circuit DDR, there are some sensitive parameters. These parameters fluctuate greatly with temperature, frequency, voltage, etc., which will affect the performance of the storage unit during the aging process, thereby affecting the change of the core parameter refresh time of DDR, and further affecting the performance of DDR. The refresh frequency of DDR is different at different temperatures, and the refresh frequency needs to be configured according to the manual at high temperatures.

[0066] ② For digital circuit power supply, it is necessary to consider whether the reduced efficiency of the power supply module at high temperature can meet the power demand of the module. During high-temperature aging, it is necessary to evaluate the total power consumption of the power module at high temperature and the relationship between the power loss of the power module and the ambient temperature, and consider the maximum power loss curve with ambient temperature under various heat dissipation and airflow conditions. When designing the aging board, it is necessary to calculate the total power loss of the module in detail, and consider the curve of the change of each output voltage of the power module with temperature when there are multiple outputs with different voltages and currents.

[0067] ③ For the clock circuit on the burn-in board, the temperature drift of the crystal oscillator at high temperature needs to be considered. When designing the burn-in board, it is necessary to consider whether the crystal oscillator frequency will change with the increase of temperature at high temperature. For circuits with higher clock requirements, it is recommended to use a temperature-compensated crystal oscillator.

[0068] ④ The wiring of the aging board is long and concentrated. For the signal lines with high signal transmission rate on the aging board, the signal integrity problem during the transmission process cannot be ignored. When wiring, the current generated by the circuit during operation must be considered, and the influence of the resistance generated during wiring must also be considered. When wiring, it is necessary to take into account both the current requirements of the circuit during operation and the minimum transmission attenuation of voltage and signal.

[0069] 3. Other issues that need to be paid attention to during high temperature aging

[0070] ① The problem of aging temperature control. The aging temperature must be strictly controlled. If the temperature is too high, the circuit will be overstressed; if the temperature is too low, the aging effect may not be achieved. Therefore, attention should be paid to temperature accuracy and stability. Consider designing a module aging socket on the test socket. The aging socket is equipped with a heating rod, a temperature control chip and a fan. Used in conjunction with a temperature controller, based on the ambient temperature, the shell temperature of the module is guaranteed to be stable at the required temperature through the control of the switch of the heating rod and the fan and the real-time monitoring of the temperature control chip. This design not only saves costs, because industrial-grade devices can be selected on the aging board (the ambient temperature can be set below 85°C). The shell temperature of the module can also be monitored in real time to ensure that the shell temperature of the module is stable at the required aging temperature, ensuring the accuracy of the aging test.

[0071] ② To eliminate the problem of failed circuits, during the aging process, it is necessary to observe the operation of the circuit in real time, and observe the waveform of the output signal, the voltage value and the current value. Because some circuits with obvious defects will change their own performance or parameters after a period of high-temperature operation. If abnormal values ​​are detected during aging, the circuit with problems must be found and removed to avoid affecting the aging of other circuits. Otherwise, due to changes in voltage or input signals, the conditions required for aging have changed. If the aging continues, the circuit will not work according to the actual situation, and the aging will not achieve its purpose.

[0072] ③ Cooling problem at the end of aging. When aging is over, do not rush to take out the module for testing, because if the module suddenly loses electrical stress and the temperature drops rapidly, the process parameters of the module itself will change, resulting in the performance of the non-aging failure module being affected. Be sure to cool to 35℃ before taking out the circuit and then conduct electrical performance and function tests at room temperature.

[0073] ④ The problem of poor contact of the module socket during aging. The aging board is large in size and thin in thickness. When aging multiple modules at the same time, the weight of multiple modules and aging sockets can easily cause deformation of the aging board, resulting in poor contact between the module, socket and aging board. The aging board structure is equipped with reinforcing ribs to support the aging board. A support plate is designed under the socket to support the module socket. The aging board is kept flat through support. This design ensures good contact between the socket and the module to be tested.

[0074] It should also be understood that the DC parameters, AC parameters, functions, and performance tests are performed on the modules before aging. Finally, the results of all modules before, during, and after aging are recorded and counted, and the statistical results are analyzed to analyze the potential weak links and inherent defects of the products.

[0075] This embodiment focuses on the matters that need to be paid attention to in the design and testing of the microwave digital-analog hybrid module aging system. These factors have important guiding significance and ensure the accuracy of the aging screening test. The module needs to be tested for DC and AC parameters, functions, and performance before and after the aging test. By analyzing the results before, during, and after module aging, the potential defects inside the module can be analyzed, and early failure products can be eliminated to ensure the quality and reliability of the product, providing a data basis for the long-term stable operation of the microwave digital-analog hybrid module.

[0076] In the present invention, the terms "one embodiment", "some embodiments", "examples", "specific examples", or "some examples" etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the described specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0077] Finally, it should be noted that the above-described embodiments are only specific implementations of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The protection scope of the present invention is not limited thereto. Although the present invention is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed by the present invention, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be based on the protection scope of the claims.

Claims

1. A high temperature aging test method for a microwave digital-analog hybrid module, characterized in that: include: The microwave digital-analog hybrid module is mounted on the module aging socket on the aging board, wherein the module aging socket is provided with a heating module for heating the microwave digital-analog hybrid module, a temperature acquisition module for collecting the temperature of the microwave digital-analog hybrid module, a cooling module for cooling the microwave digital-analog hybrid module, and a temperature control module; The temperature control module controls the heating module and the cooling module to work in coordination with each other according to the temperature information collected by the temperature collection module and the preset microwave digital-analog hybrid module aging temperature range, so that the temperature of the microwave digital-analog hybrid module is maintained within the microwave digital-analog hybrid module aging temperature range; Load the microwave digital-analog hybrid module aging test program and perform aging tests according to the aging test program.

2. A high temperature aging test method for a microwave digital-analog hybrid module according to claim 1, characterized in that: After the microwave digital-analog hybrid module is installed on the module aging socket on the aging board, the method further includes: The aging board equipped with the microwave digital-analog hybrid module is placed in an oven for heating. The heating temperature of the oven does not exceed the maximum tolerable temperature of each electronic component on the aging board. Each electronic component on the aging board is an electronic component that constitutes the aging board.

3. The high temperature aging test method of a microwave digital-analog hybrid module according to claim 1, characterized in that: The microwave digital-analog hybrid module aging test program is specifically loaded as follows: The microwave digital-analog hybrid module burn-in test program is loaded to the CPU-JTAG and FPGA-JTAG in the microwave digital-analog hybrid module through the CPU-JTAG interface and FPGA-JTAG interface on the burn-in board.

4. A high temperature aging test method for a microwave digital-analog hybrid module according to claim 3, characterized in that: The burn-in test program includes a processor performance test program, a memory read-write test program, an external interface loopback test program, a digital-analog hybrid chip performance test program, and a microwave circuit performance test program.

5. The high temperature aging test method of a microwave digital-analog hybrid module according to claim 4, characterized in that: Before the microwave digital-analog hybrid module is installed on the module aging socket on the aging board, the method further includes: Connect the aging board to the aging machine; When the burn-in test is performed according to the burn-in test procedure, if the current burn-in test result is correct, a high pulse signal is output to the oscilloscope of the burn-in machine.

6. A high temperature aging test method for a microwave digital-analog hybrid module according to claim 5, characterized in that: Different aging test programs correspond to different widths of the output high pulse signal.

7. The high temperature aging test method for a microwave digital-analog hybrid module according to claim 5, characterized in that: The aging board is electrically connected to the aging machine using gold fingers.

8. The high temperature aging test method for a microwave digital-analog hybrid module according to claim 1, characterized in that: A pair of decoupling capacitors is connected in parallel between each feeding lead for connecting the microwave digital-analog hybrid module and the module aging socket and the ground.

9. The high temperature aging test method of a microwave digital-analog hybrid module according to claim 1, characterized in that: The heating module adopts a heating rod.

10. The high temperature aging test method for a microwave digital-analog hybrid module according to claim 1, characterized in that: The cooling module adopts a fan.

Images