Removable memory card with efficient card locking mechanism, XY ratio and pad layout

Abstract

A memory card is provided with various pad layouts to prevent data signal pads from contacting power contacts in a host during insertion and removal of the memory card. The memory card may have form factors and features that accommodate relatively large memory and relatively high performance as well as concomitant thermal conditions. The invention further provides an efficient card locking mechanism.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 522,206, filed on June 21, 2023, which is hereby incorporated by reference. Background Art

[0003] The host can use the memory card to read and write data. The host can be, for example, a mobile computing device such as a phone, tablet, or laptop. The memory card can be, for example, a microSD TM Other types of hosts and memory cards may be used. BRIEF DESCRIPTION OF THE DRAWINGS

[0004] Figure 1 is a rear top perspective view of a memory card, according to one embodiment.

[0005] Figure 2 yes Figure 1 A front top perspective view of a memory card is shown.

[0006] Figure 3 yes Figure 1 A top view of a memory card is shown.

[0007] Figure 4 yes Figure 1 Left side view of a memory card is shown.

[0008] Figure 5 yes Figure 1 Right side view of a memory card is shown.

[0009] Figure 6 yes Figure 1 Front view of a memory card is shown.

[0010] Figure 7 yes Figure 1 Rear view of the memory card shown.

[0011] Figure 8 yes Figure 1 A front bottom perspective view of a memory card is shown.

[0012] Fig. 9 shows a first pad layout having Figure 8 A front bottom perspective view of a memory card is shown.

[0013] Fig.10 shows a second pad layout Figure 8 A front bottom perspective view of a memory card is shown.

[0014] Fig.11 yes Figure 1 Bottom view of the memory card shown.

[0015] Fig.12 shows a first pad layout having Fig.11 Bottom view of the memory card shown.

[0016] Fig.13 shows a second pad layout Fig.11 Bottom view of the memory card shown.

[0017] Fig.14 shows a more detailed view of the first pad layout Fig.12 Bottom view of the memory card shown.

[0018] Fig.15 shows a more detailed view of the second pad layout Fig.13 Bottom view of the memory card shown.

[0019] Fig.16 is a rear top perspective view of another embodiment of a memory card having a metal plate.

[0020] Fig.17 yes Fig.16 A top view of a memory card is shown.

[0021] Fig.18 is a rear top perspective view of another embodiment of a memory card with a different card locking support proportional size and placement.

[0022] Fig.19 yes Fig.18 A front top perspective view of a memory card is shown.

[0023] Fig. 20 yes Fig.18 A top view of a memory card is shown.

[0024] Fig.21 yes Fig.18 Left side view of a memory card is shown.

[0025] Fig. 22 yes Fig.18 Right side view of a memory card is shown.

[0026] Fig.23 yes Fig.18 Front view of a memory card is shown.

[0027] Fig.24 yes Fig.18 Rear view of the memory card shown.

[0028] Fig.25 yes Fig.18 A front bottom perspective view of a memory card is shown.

[0029] Fig.26 shows a first pad layout having Fig.25 A front bottom perspective view of a memory card is shown.

[0030] Fig. 27 shows a second pad layout Fig.25 A front bottom perspective view of a memory card is shown.

[0031] Fig.28 yes Fig.18 Bottom view of the memory card shown.

[0032] Fig.29 shows a second pad layout Fig. 27 Bottom view of the memory card shown.

[0033] Fig.30 shows a first pad layout having Fig.26 Bottom view of the memory card shown.

[0034] Fig.31 shows a more detailed view of the first pad layout Fig.30 Bottom view of the memory card shown.

[0035] Fig.32 shows a more detailed view of the second pad layout Fig.29 Bottom view of the memory card shown.

[0036] Fig.33 is a rear top perspective view of another embodiment of a memory card having a metal plate.

[0037] Fig.34 yes Fig.33 A top view of a memory card is shown.

[0038] Fig.35 Shown is a sample size Fig.30 Bottom view of the memory card shown.

[0039] Fig.36 A microSD card with sample dimensions is shown. TM Bottom view of a memory card.

[0040] Fig.37 yes Fig.33 A top view of a memory card is shown.

[0041] Fig.38 yes Fig.37 A cross-sectional view of a memory card is shown.

[0042] Fig.39 is a rear top perspective view of a memory card, according to one embodiment.

[0043] Fig.40 yes Fig.39 A front bottom perspective view of a memory card is shown.

[0044] Fig.41 yes Fig.39 A top view of a memory card is shown.

[0045] Fig.42 yes Fig.39 Left side view of a memory card is shown.

[0046] Fig.43 yes Fig.39 Right side view of a memory card is shown.

[0047] Fig.44 yes Fig.39 Front view of a memory card is shown.

[0048] Fig.45 yes Fig.39 Rear view of the memory card shown.

[0049] Fig.46 yes Fig.39 Bottom view of the memory card shown.

[0050] Fig.47 is a bottom view of a memory card according to another embodiment.

[0051] Fig.48 yes Fig.46 Detailed illustration of the bottom view of .

[0052] Fig.49 yes Fig.47 Detailed illustration of the bottom view of . DETAILED DESCRIPTION

[0053] As an overview, there is a need for a removable memory card that is easy to replace and upgrade or expand, has a thin profile, has a relatively large memory, and has a relatively high performance in mobile computing devices (e.g., phones, tablets, laptops, game consoles, Internet of Things (IoT)). Existing memory cards such as microSD TM Memory cards have form factors that are too small to handle the high performance requirements and the thermal conditions caused by such high performance. The following embodiments provide memory cards with different form factors that can solve the above problems.

[0054] In one embodiment, a memory card is provided, which has a memory card similar to a microSD card. TM but with a larger size and different pad layout to support the above memory, performance and thermal capabilities. Figures 1 to 8 as well as Fig.11Various views of one such memory card 10 of one embodiment are shown to illustrate the form factor of the memory card. Various pad layouts can be used on the bottom of the memory card. Fig. 9 , Fig.12 and Fig.14 An exemplary pad layout is shown, and Fig.10 , Fig.13 and Fig.15 Another exemplary pad layout is shown. To aid in heat dissipation and potential EMI protection, a metal plate 40 may be used on top of the memory card 10, and Fig.16 and Fig.17 An example of this is shown.

[0055] The pads can be used to connect to corresponding electrical connectors in a host to place the host in communication with the memory card 10. The memory card 10 can include any suitable memory (including three-dimensional memory) and a controller that can be configured to read data from the memory and store data in the memory. The controller can implement other functions, such as error correction and storage algorithms.

[0056] There are several basic assumptions about the two pad layouts for these implementations:

[0057] - Supports four Peripheral Component Interconnect Express (PCIe) lanes using up to two power supplies (e.g., 3.3v / 1.8v or 2.7v / 1.2v)

[0058] -Separate PCIe high-speed I / O from the rest and group them by PCIe lanes

[0059] - Provides GND isolation when needed

[0060] - Allows for PWR / GND balanced differential interface

[0061] - Separate pad rows for power, clock, and sideband signals

[0062] -Avoid any conflict of signal pads touching power pads during hot insertion / removal

[0063] - The distribution in three rows allows for better heat dissipation from the card to the printed circuit board and for easier connector design with dense pads of sufficient strength.

[0064] - Includes PRSNT# (Presence Detect) function pad for card insertion / removal detection (card detect switch not required)

[0065] - Includes two pads for CardType, which allows the hardware host to detect the card type after detecting a card insertion. This can provide advance information about the card type if necessary

[0066] - Includes several pads reserved for the future (i.e., Power Line Notification - PLN).

[0067] In the above two pad layouts 20 and 30, there are three rows of pads. One row includes power signals, clock signals and sideband signals, and the other rows include the required number of differential high-speed interfaces. These pads support high-speed differential interfaces based on the PCIe interface standard. The pads are powered by at least one power supply together with several sideband signals. The pads are arranged in a certain way so that the signal pads will never contact any power pads on the host side during card insertion or removal, thereby avoiding any conflicts in hot plug / unplug (i.e., the card is inserted or removed when the host is providing power to the card). Several pads are allocated for card type indication, allowing the host to detect the type of inserted card and / or the characteristics of the card through the hardware of the host. Use the presence detection pad to detect card insertion / removal, thereby eliminating the need for microSD TM The need for a card detection switch commonly used in cards. In this embodiment, the pads are arranged in a certain way so that the presence detection contact on the connector side never touches any other signal pad, power pad or ground pad during card insertion or removal, thereby avoiding any false card detection.

[0068] As mentioned above, the multi-row pad layout 20,30 of these embodiments solves the possible conflict of signal short circuit during hot plug / remove.Due to the needs of small card size and supporting multiple PCIe channels, a large number of pads may need to be placed in a relatively small area.Therefore, three rows of pads may need to be placed in succession.Hot plug / remove can be supported because the consumer can remove the card without any notice.That is, electricity can be supplied to the power contacts of the connector during the card insertion or removal, and if any signal pad or ground pad can contact any power contacts during the insertion / removal path of the card, it is expected that the card or the host will not be damaged.If the presence-detection contact of the host contacts any signal, electricity or grounding during the card insertion / removal path, the same potential problem may occur.This type of unintentional contact can cause wrong card detection to the host, which is a thing to be avoided.In addition, the host may wish to use the hardware circuit of the host and obtain information about the type or specific characteristics or configuration of the card when the internal information of the card is not required to be initialized. Such a need may be necessary to anticipate hardware-related support requirements that are provided before any card operation can occur (i.e., supplying a specific power voltage level during initialization time or allowing a specific maximum current draw, etc.) Methods may be provided that allow such information to be provided to the host and not be erroneously detected due to hot plug / unplug path conflicts.

[0069] As between the first and second pad layouts of these embodiments, in the first pad layout 20, the power rails are located on the back of the card 10, closer to the thicker areas of the card 10 (which may include internal power circuits). This requires an open path between the front pad rows, thereby eliminating contact between the front row pads and the power contacts during hot card insertion or removal. In the second pad layout 30, the power / control lines are located at the front, so the connector contacts of the other rows never contact them. This allows for greater distances between pads, which provides more flexibility.

[0070] In one embodiment, the following pad dimensions are used. Of course, this is just an example and other dimensions may be used.

[0071] - A pad width of about 0.75 mm and a distance between pad centers of about 1.05 mm (the distance between pads is about 0.3 mm).

[0072] The length of the short pad is about 1.35 mm, and the length of the long pad is about 1.65 mm.

[0073] The distance between the differential high speed signal lines may be approximately 2 mm.

[0074] As described above, an advantage of these simplified pad layouts 20, 30 is that they avoid any potential electrical conflicts or false card detect indications that could be caused by contact of any card pad with power contacts or presence detect (PRSNT#) contacts on the connector side during hot insertion / removal.

[0075] Existing cards do not adequately address the above issues. For example, edge card connectors (such as those used on motherboards) have a very large profile and are not desirable in small, thin devices such as mobile devices. In addition, hinge-type connectors (such as old "under-battery" SIM cards or XFMexpress cards) do not have the problem of the card pad sliding under other connector contacts during card insertion / removal. However, such connectors have a fairly high profile due to the mechanical strength of these connectors and are not very suitable for use with external removable cards. Other solutions allow such contact to occur (such as in SD UHSII cards and SDExpress cards), where special precautions are required to ensure that no damage occurs. Such matters limit the continued evolution of the functionality of the card and may put the card at risk if the card / host manufacturer does not meet the restricted protection rules.

[0076] In addition, the card type pad allows to provide hardware indications about various card types / configurations to the host immediately after the card is inserted into the detection. In addition, such information is usually provided by physical cutouts on the board (i.e., in M.2 cards) today. Such solutions require different printed circuit boards for each card type and configurable connectors. It also does not allow electrical indications (by software on the card or on-site programming) for a specific configuration. Other solutions provide information while the card is inserted. In such cases, those card type pads also need to be protected from conflicts during card insertion / removal, and require dedicated paths. And in a given solution, only after indicating card detection to the host, the host will be expected to read the card type pads. Such solutions do not need to protect the paths of those pads / contacts during card insertion / removal, and allow the card to provide a logical value corresponding to the type / configuration of the card after the card is inserted.

[0077] In summary, the memory card 10 of these embodiments solves several problems and provides several advantages. For example, the pad layout 20, 30 of these embodiments avoids any potential electrical conflicts or false card detection indications that may be caused by contact of any pad contact power contacts or card presence detection (PRSNT#) contacts on the connector side during hot insertion / removal. This is achieved by placing all power pads and presence-detection pads in the front row or keeping a clear path for those specific pads when they are placed in the second or third row. In addition, the card type pad allows the host to provide hardware indications about various card types / configurations after detecting the card insertion. Several card pads are dedicated to this, and they are only valid after the card 10 is inserted and are only sensed by the host after detecting the card insertion.

[0078] In another embodiment, a memory card having a different form factor is used. Figures 18 to 25 as well as Fig.28 Various views of the memory card are shown illustrating the form factor of one such memory card 50 of an embodiment. Fig.35 shows sample dimensions for one specific implementation of memory card 50, and Fig.36 shows a standard microSD TM Dimensions of card 55 for comparison. Various pad layouts can be used on the bottom of the memory card. Fig.26 , Fig.30 and Fig.31 An exemplary pad layout 30 is shown, and Fig. 27 , Fig.29 and Fig.32 Another exemplary pad layout 20 is shown.

[0079] Although the pad layouts 20, 30 provided above have three rows, pad layouts including a different number of rows may also be used (eg, to support a different number of differential interfaces).

[0080] Although the pad layouts 20 , 30 provided above have all the sideband signal and power pads in separate rows from the differential signals, some of these pads may be placed in other rows as well.

[0081] To aid in heat dissipation, a metal plate 80 may be used on top of the memory card 50, and Fig.33 and Fig.34 An example of this is shown. Fig.37 and Fig.38 A metal plate 80 and a cross-sectional view are shown respectively. This optional metal plate 80 not only provides better heat conduction, the metal plate also provides better protection from electromagnetic interference (EMI) in situations where the connector is insufficient. As shown in the cross-sectional view, the memory card 50 has a molded plastic 90, a substrate 92 (on which the metal plate 80 can be placed), and internal components 94.

[0082] As can be seen by comparing the form factors of the memory cards 10 and 50 of the two embodiments, the card locking mechanism 52 of the memory card 50 of the second embodiment has a microSD TM The shape and size of the card, while the actual card size is larger than microSD TM Card.

[0083] In general, these embodiments address the increased size form factor and the need for a new card locking mechanism. The removable memory card 10, 50 of these embodiments is larger in size than a typical microSD TM Cards that allow for higher capacities and better thermal characteristics using higher speeds. Card locking mechanisms are desired to achieve better locking of the card in mobile and / or other shaking devices. Regardless of the need for a card shape that allows for efficient card locking, the area of ​​the card is maximized to allow for the largest memory die and a large number of pads with enough space to manufacturably support the connector.

[0084] Additionally, the asymmetrical front edge of the memory card prevents reverse insertion, the far edge of the memory card allows for easy card pulling using a fingernail, a partially thin flat surface for servicing thin applications, and a partially thick edge to accommodate thicker internal components.

[0085] Provide a new card locking mechanism or simply enlarge the entire microSD card by the same proportion TM If the card is simply increased in size but otherwise uses a standard microSD TMIf the card is designed with the same ratio as in the first embodiment described above, then the narrow front portion of the card consumes most of the card and there is a very large unused area at the front half which limits the number of memory dies and pads in a row or prevents pads from having enough space to allow for an easy connector design. A solution to this would be to make the overall size of the card even larger. Another approach would be to have a wider area at the front but with a new small efficient locking mechanism 55 as shown in the second embodiment. However, using an existing microSD card of the same size and shape would not be possible. TM The locking mechanism while increasing the overall card size allows the use of existing mechanical locking mechanisms used in traditional connectors for more than 15 years and can increase confidence and reduce costs. However, by increasing the overall card size while maintaining the original locking mechanism size, the front end of the card is much larger, which means larger card area, more memory, better thermal capabilities, and larger pad area. It should be noted that in this embodiment, the size ratio between the locking shape and the overall card size is different from that of the microSD TM . Only the locking mechanism has the same shape and size.

[0086] Returning to the attached figure, Figures 39 to 46 1 and 10 are a rear top perspective view of a memory card 300 of another embodiment; a front bottom perspective view; a top view; a left side view; a right side view; a front view; a rear view; and a bottom view. As shown in these figures, the memory card 300 of the present embodiment has a width (i.e., a rear edge in the insertion direction) that is wider than the length of the memory card, and is shorter and wider than the above-mentioned memory card. Despite this difference in length and width, the notch on the side of the memory card 300 may have the same width as a conventional microSD card. TM Cards are the same shape and size.

[0087] In an exemplary implant (see Fig.41 ), the form factor of the memory card 300 is about 14 mm x 18 mm. In one embodiment, the thickness of the memory card 300 is between (a) about 1.0 + / - 0.1 mm at its thinner edge and about 1.4 + / - 0.1 mm at its thicker edge and (b) about 1.4 + / - 0.1 at its thinner edge and 2 + / - 0.1 mm at its thicker edge. It should be noted that other dimensions may be used and these dimensions should not be read into the claims unless explicitly recited therein. For example, in another embodiment, the memory card has dimensions of about 18 mm x 16 mm and has a thickness of about 1 mm at its thinner edge and about 1.4 mm at its thicker edge.

[0088] Fig.40 and Fig.46The pad layout on the bottom of the memory card 300 of this embodiment is shown. In an exemplary implementation, the length of the longer pad is about 1.6mm or 1.65mm, the length of the shorter pad is about 1.35mm, the pad width is about 0.70mm, 0.71mm or 0.72mm, and the distance between the pads is about 0.15mm. Again, these dimensions are examples only.

[0089] Fig.48 is a detailed illustration of the function of each of these pads in an exemplary embodiment. Fig.48 As shown, the power pads (three VDD1 pads and three VDD2 pads) are located on either side of the back row, and there are no pads in front of the power pads (in the card insertion direction). Therefore, the signal pads of the memory card 300 will never contact any power pads of the host during card insertion or removal, thereby avoiding any conflict in the case of hot plug / unplug (i.e., insertion or removal of the card 300 while the host is providing power to the card).

[0090] Fig.47 and Fig.49 An alternative pad layout of another memory card 400 of one embodiment is presented (other views of this memory card 400 may be the same as the memory card 300 discussed above). In this embodiment, instead of having three VDD1 pads and three VDD2 pads on either side of the back row, a single larger VDD pad is located on either side of the back row. In one specific implementation, the single larger VDD pad is approximately 1.5 mm x 2.5 mm. Other alternatives are possible, such as using additional (e.g., fourth / back) rows containing additional VDD pads.

[0091] These embodiments have some advantages.For example, the disclosed form factor allows a relatively large number of pads to be matched in a row, which contrasts with the memory card with less pads in each row using a smaller pad and / or a narrower distance between the pads to increase the number of rows.By increasing pad width and / or the distance between the pads, these embodiments can reduce the complexity of connector design, reduce production costs due to the required accuracy of the reduction, and avoid the signal integrity problem that other designs may run into.In addition, reducing the complexity of connector design by reducing the number of rows can be useful in relatively small memory cards, and can reduce the risk of signal conflict when carrying out the hot insertion / removal of memory card.In addition, these embodiments can be useful for the side insertion of the memory card with pads of similar size and similar number and / or using four PCIe channels of similar (or larger) pad size.

[0092] It is intended that the foregoing detailed description be understood as an illustration of selected forms that the invention may take, rather than as a definition of the invention. It is intended that only the following claims (including all equivalents) define the scope of the invention as claimed. Finally, it should be noted that any aspect of any embodiment described herein may be used alone or in combination with each other.

Claims

1. A memory card, comprising: top surface; and a bottom surface opposite the top surface, wherein the bottom surface includes a plurality of pads; in: A first row of pads positioned toward the front of the memory card includes a plurality of pads, None of the pads are power pads; a last row of pads positioned toward the rear of the memory card including at least one power pad; The at least one power pad is positioned on the memory card such that no other non-power pads exist between the at least one power pad and the front of the memory card; and The width of the memory card is greater than the length of the memory card, wherein the width of the memory card corresponds to a rear edge of the memory card in a direction of insertion into a host. 2 . The memory card of claim 1 , wherein the width of the memory card is approximately 18 mm, and the length of the memory card is approximately 14 mm. 3 . The memory card of claim 1 , wherein the width of the memory card is approximately 18 mm, and the length of the memory card is approximately 16 mm.

4. The memory card of claim 1, wherein a portion of the memory card has a thickness between about 1.0 mm and about 1.4 mm.

5. The memory card of claim 1, wherein a portion of the memory card has a thickness between about 1.4 mm and about 2 mm.

6. The memory card according to claim 1, wherein: The first portion of the memory card has a thickness between about 1.0 mm and about 1.4 mm; and The second portion of the memory card has a thickness between about 1.4 mm and about 2 mm. 7 . The memory card of claim 1 , wherein the at least one power pad comprises one or more power pads located at a first end of the last row and one or more power pads located at a second end of the last row.

8. The memory card according to claim 7, wherein: The one or more power pads located at the first end of the last row include three power pads; and The one or more power pads located at the second end of the last row include three power pads.

9. The memory card according to claim 7, wherein: The one or more power pads at the first end of the last row include a single power pad; and The one or more power pads located at the second end of the last row include a single power pad.

10. The memory card of claim 9, wherein the single power pad at the first end of the last row and / or the single power pad at the second end of the last row is larger than any other pad of the plurality of pads.

11. The memory card of claim 9, wherein the single power pad at the first end of the last row and / or the single power pad at the second end of the last row is about 1.5 mm x about 2.5 mm. 12 . The memory card of claim 1 , wherein the plurality of pads includes at least one pad having a length of about 1.6 mm to about 1.65 mm.

13. The memory card of claim 12, wherein the plurality of pads includes at least one additional pad having a length of approximately 1.35 mm.

14. The memory card of claim 1, wherein the plurality of pads includes at least one pad having a width of about 0.70 mm to about 0.72 mm. 15 . The memory card of claim 1 , wherein a distance between two adjacent pads among the plurality of pads is about 0.15 mm.

16. The memory card according to claim 1, further comprising a microSD TM Card locking mechanism.

17. A memory card, comprising: top surface; and a bottom surface opposite the top surface, wherein the bottom surface includes a plurality of pads; in: a first row of pads positioned toward the front of the memory card including a plurality of pads, none of which are power pads; a last row of pads positioned toward the rear of the memory card including at least one power pad; the at least one power pad being positioned on the memory card such that no other non-power pads are present between the at least one power pad and the front portion of the memory card; The at least one power pad includes one or more power pads located at a first end of the last row and one or more power pads located at a second end of the last row; and The width of the memory card is about 18 mm and the length of the memory card is about 14 mm, wherein the width of the memory card corresponds to a rear edge of the memory card in a direction of insertion into a host.

18. The memory card of claim 17, wherein: The one or more power pads located at the first end of the last row include three power pads; and The one or more power pads located at the second end of the last row include three power pads.

19. The memory card of claim 17, wherein: The one or more power pads at the first end of the last row include a single power pad; and The one or more power pads located at the second end of the last row include a single power pad.

20. A memory card, comprising: top surface; a bottom surface opposite the top surface, wherein the bottom surface includes a plurality of pads; and means for preventing a signal pad of the plurality of pads from contacting a power pad of a host during insertion and removal of the memory card; The width of the memory card is about 18 mm and the length of the memory card is about 16 mm, wherein the width of the memory card corresponds to a rear edge of the memory card in a direction of insertion into a host.

Images