Communication device and communication system

Abstract

A communication device and a communication system belong to the technical field of communication. The communication equipment comprises a frame body and a back plate. The frame body is provided with a panel side and a back plate side, the frame body comprises a plurality of service slot positions, inlets of the service slot positions are located on the panel side, the bottoms of the service slot positions are located on the back plate side, and the service slot positions are used for installing line cards or net plates. The back plate is located on the back plate side and comprises a back plate body and a protruding part protruding towards the panel side relative to the back plate body, the back plate body is provided with back plate connectors corresponding to the service slot positions, the back plate connectors are located at the bottoms of the corresponding service slot positions, and the protruding part is provided with a network plate connector. The first end of the screen connector is connected with the backboard connector, the second end of the screen connector is used for being connected with a screen, and the second end of the screen connector is located on the side, away from the backboard body, of the protruding part. The communication equipment provided by the invention supports single-stage switching and can flexibly and conveniently support a single-frame working mode.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to a communication device and a communication system. Background Art

[0002] Cluster routers are an important part of communication networks. According to the number of switching levels, communication networks include three-level switching networks and single-level switching networks, and cluster routers include cluster routers designed for three-level switching networks and cluster routers designed for single-level switching networks. For the sake of convenience, cluster routers designed for three-level switching networks are called three-level switching cluster routers, and cluster routers designed for single-level switching networks are called single-level switching cluster routers. Three-level switching cluster routers have the advantages of low chip switching scale requirements, good compatibility with multi-rate line cards, support for single-frame working mode, dual-frame back-to-back working mode, and multi-frame cluster working mode. They are mainstream cluster routers. Compared with three-level switching cluster routers, single-level switching cluster routers have lower power consumption, but single-level switching cluster routers are difficult to support single-frame working mode.

[0003] As the capacity of cluster routers continues to increase, the power consumption of cluster routers continues to increase, and the proportion of power consumption factors in the commercial use of cluster routers continues to increase. Under this development trend, single-stage switching cluster routers may become the future evolution direction due to their low power consumption, so it is necessary to solve the problem that single-stage switching cluster routers are difficult to support single-frame working mode. Summary of the invention

[0004] The present application provides a communication device and a communication system, wherein the communication device is a single-stage switching communication device (eg, a single-stage switching cluster router) and the communication device can flexibly and conveniently support a single-frame working mode. The technical solution of the present application is as follows.

[0005] In a first aspect, a communication device is provided, including: a frame and a backplane.

[0006] The frame has a panel side and a back panel side, and includes a plurality of service slots. The entrance of the service slot is located on the panel side, and the bottom of the service slot is located on the back panel side. The service slot is used to install a line card or a network board.

[0007] The backplane is located on the backplane side, and the backplane includes a backplane body and a raised portion raised toward the panel side relative to the backplane body. The backplane body has a backplane connector corresponding to each of the multiple service slots, different service slots correspond to different backplane connectors, and each backplane connector is located at the bottom of the corresponding service slot. The raised portion has a mesh board connector, the first end of the mesh board connector is connected to the backplane connector, the second end of the mesh board connector is used to connect the mesh board, and the second end of the mesh board connector is located on the side of the raised portion away from the backplane body.

[0008] Wherein, when at least one line card and at least one network board are installed in the plurality of service slots, the at least one line card is connected to the backplane connector at the bottom of the corresponding service slot, the at least one network board is connected to the network board connector, and any two network processor (NP) chips in the at least one line card are connected to a switching chip in the at least one network board. The any two NP chips are on the same line card, or the any two NP chips are on different line cards. The network board is also called a switching network board.

[0009] The technical solution provided by the present application is that in the communication equipment, the backplane includes a backplane body and a protruding portion protruding toward the panel side relative to the backplane body, the protruding portion has a mesh board connector and one end of the mesh board connector for connecting the mesh board (that is, the second end of the mesh board connector) is located on the side of the protruding portion away from the backplane body. Therefore, the mesh board connector is used to connect the mesh board on the panel side, and the corresponding mesh board can be called an outward-facing mesh board. When the communication device provided by the present application is in use, at least one line card can be installed in some service slots, so that the at least one line card is connected to the backplane connector at the bottom of the service slot where it is located, and at least one mesh board can be installed in other service slots, and the at least one mesh board can be connected to the second end of the mesh board connector on the raised portion of the backplane on the panel side, so that the at least one line card is connected to the at least one mesh board through the backplane connector and the mesh board connector to realize a single-frame working mode; in addition, the signal output by any NP chip in the at least one line card is transmitted to another NP chip in the at least one line card after passing through a switching chip in the at least one mesh board, and the any NP chip is connected to the one switching chip with the other NP chip, thereby realizing a single-stage switching. It can be seen that the present application adopts a backplane including a raised portion combined with an outward mesh board to realize a single-stage switching communication device that can flexibly and conveniently support a single-frame working mode.

[0010] Optionally, the backplane includes a first cross unit, the first cross unit is located at the raised portion of the backplane, the mesh connector is located on a side of the first cross unit away from the backplane body, and the first end of the mesh connector is connected to the backplane connector through the first cross unit. For example, the backplane has a cavity, the first cross unit is located in the cavity, the mesh connector is located in an opening on the cavity wall of the cavity, the first end of the mesh connector is located in the cavity, and the second end of the mesh connector is located outside the cavity.

[0011] Optionally, the backplane includes a first cross unit, and the communication device further includes a second cross unit, the first cross unit is located on the raised portion of the backplane, the second cross unit is plugged into a side of the first cross unit away from the backplane body, the mesh board connector is located on a side of the second cross unit away from the first cross unit, the first end of the mesh board connector is connected to the backplane connector through the second cross unit and the first cross unit, and the second end of the mesh board connector is located on a side of the second cross unit away from the first cross unit. For example, the backplane has a cavity, the first cross unit is located in the cavity, the first cross unit has a plug-in on a side away from the backplane body, the plug-in is located in an opening on the cavity wall of the cavity, the second cross unit is located outside the cavity, the second cross unit is plugged into the plug-in, and thus the second cross unit is plugged into the side of the first cross unit away from the backplane body through the plug-in.

[0012] Optionally, the cross granularity of the second cross unit is smaller than the cross granularity of the first cross unit. The cross granularity is also called the cross granularity. The cross granularity is represented by the number of lanes supported by a single NP chip. For example, the cross granularity can be represented as X Lane / NP chip, indicating that one NP chip supports X Lanes. Lane is a unit, and 1 Lane is also called 1 lane.

[0013] The technical solution provided by the present application, since the cross granularity of the second cross unit is smaller than the cross granularity of the first cross unit, the minimum number of network boards supported by the communication device including the first cross unit but not including the second cross unit is smaller, and the scale of line cards supported by the communication device is smaller (that is, the number of line cards supported by the communication device is smaller), which is convenient for reducing the basic configuration of the network boards of the communication device, the capacity of the communication device is smaller, and the communication device is more suitable for single-frame working mode. The minimum number of network boards supported by the communication device including the first cross unit and the second cross unit is larger, the scale of line cards supported by the communication device is larger, the capacity of the communication device is larger, and the communication device is more suitable for cluster working mode.

[0014] Optionally, the first cross unit is an electrical cross unit, an optical cross unit or an optoelectronic hybrid cross unit, and correspondingly, the backplane including the first cross unit is an electrical backplane, an optical backplane or an optoelectronic hybrid backplane. The electrical backplane may be a printed circuit board (PCB) backplane.

[0015] Optionally, the second cross unit is an electrical cross unit, an optical cross unit, or an optoelectronic hybrid cross unit.

[0016] Optionally, the entrance ends of the plurality of service slots are flush, and the second end of the mesh board connector is recessed toward the backplane relative to the entrance end of the service slot. The entrance end of the service slot is also the end where the entrance of the service slot is located. For example, the entrance ends of the service slot are in the same plane, and the same plane is parallel to the height direction of the communication device.

[0017] The technical solution provided by the present application is that since the second end of the mesh board connector is recessed toward the backplane side relative to the entrance end of the service slot, the service slot and the second end of the mesh board connector form a groove on the panel side, which can be used for laying cables to improve the neatness of the communication equipment.

[0018] Optionally, the raised portion is located in the middle of the backplane body, and the multiple service slots are distributed on both sides of the raised portion. For example, the multiple service slots are evenly distributed on both sides of the raised portion. For example, the number of service slots on both sides of the raised portion is equal, and the service slots on either side of the raised portion are evenly distributed.

[0019] Optionally, the communication device includes a plurality of back panels, each of which is strip-shaped, and a length direction of the back panel is parallel to a height direction of the frame. The plurality of back panels are arranged along a first direction, and the first direction is perpendicular to the height direction of the frame.

[0020] Optionally, the multiple back plates are independent of each other, and the distances between the raised portions of the multiple back plates and the bottom surface of the frame are equal.

[0021] The technical solution provided by the present application is that since the communication device includes multiple backplanes, the multiple backplanes are independent of each other, so the multiple backplanes can be independently installed or removed, the scale of the backplane is small, which is conducive to production and manufacturing, and the number of backplanes of the communication device can be configured as needed, reducing the cost of the communication device and facilitating the on-demand expansion of the communication device. For example, a communication device with a larger capacity can include more backplanes to support more line cards, and a communication device with a smaller capacity can include fewer backplanes to support fewer line cards.

[0022] Optionally, the communication device includes a backplane.

[0023] Optionally, each service slot is used to install a network board, or each service slot is used to install one or more line cards.

[0024] Optionally, the communication device further includes at least one line card and / or at least one network board.

[0025] Optionally, the at least one line card includes at least one of an electric line card, an optical line card, and an optoelectronic hybrid line card; the at least one network board includes at least one of an electric network board, an optical network board, and an optoelectronic hybrid network board. For example, the first cross-unit is an electric cross-unit, the at least one line card is an electric line card, and the at least one network board is an electric network board. For another example, the first cross-unit is an optical cross-unit, the at least one line card is an optical line card, and the at least one network board is an optical network board. For another example, the first cross-unit is an optoelectronic hybrid line card, the at least one line card includes at least one of an electric line card, an optical line card, and an optoelectronic hybrid line card, and the at least one network board includes at least one of an electric network board, an optical network board, and an optoelectronic hybrid network board.

[0026] Optionally, the communication device is a cluster communication device, for example, the communication device is a cluster router.

[0027] Optionally, the communication device supports a single-frame working mode and a multi-frame working mode, wherein the multi-frame working mode includes at least one of a dual-frame back-to-back working mode and a multi-frame cluster working mode, wherein the multi-frame working mode is also called a cluster working mode.

[0028] Optionally, the communication device is a frame-type communication device.

[0029] By way of example, the communication device is a frame-type cluster router, and the communication device is a single-stage switching cluster router.

[0030] In a second aspect, a communication system is provided, including a first communication device and a second communication device, the first communication device and the second communication device are communicatively connected, and the first communication device and the second communication device are both communication devices provided in the first aspect or any optional manner of the first aspect.

[0031] Optionally, the first communication device includes at least one network board, and the second communication device includes at least one line card, and the at least one network board is connected to the network board connector in the second communication device. For example, the first communication device includes a network board but does not include a line card, and the second communication device includes a line card but does not include a network board. The first communication device and the second communication device are both frame-type communication devices. The first communication device can be called a switching frame, and the second communication device can be called a line card frame. The communication device provided in this application supports a multi-frame working mode of a switching frame + a line card frame.

[0032] Optionally, the first communication device and the second communication device respectively include at least one mesh board and at least one line card, and the first communication device and the second communication device satisfy at least one of the following: all or part of the mesh boards in the first communication device are connected to the mesh board connector in the second communication device; all or part of the mesh boards in the second communication device are connected to the mesh board connector in the first communication device. For example, all mesh boards in the first communication device are connected to the mesh board connector in the first communication device, and all mesh boards in the first communication device are connected to the mesh board connector in the second communication device, and all mesh boards in the second communication device are connected to the mesh board connector in the second communication device, and all mesh boards in the second communication device are connected to the mesh board connector in the first communication device. Optionally, both the first communication device and the second communication device are frame-type communication devices. Since both the first communication device and the second communication device include mesh boards and line cards, the first communication device and the second communication device can be called hybrid frames. The communication device provided in this application supports a multi-frame working mode of a hybrid frame.

[0033] The technical effects of the above-mentioned second aspect can refer to the technical effects of the first aspect and the optional implementation method of the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a schematic diagram of a three-stage switching architecture;

[0035] Figure 2 It is a schematic diagram of a single-stage switching architecture;

[0036] Figure 3 is a front view of a communication device provided by an embodiment of the present application;

[0037] Figure 4 yes Figure 3 a side view of the communication device shown;

[0038] Figure 5 is a front view of another communication device provided in an embodiment of the present application;

[0039] Figure 6 yes Figure 5 a side view of the communication device shown;

[0040] Figure 7 yes Figures 3 to 6 A front view of a back panel in the communication device shown;

[0041] Figure 8 is a front view of another communication device provided in an embodiment of the present application;

[0042] Fig. 9 yes Figure 8 A front view of a back panel in the communication device shown;

[0043] Fig.10 is a front view of another communication device provided in an embodiment of the present application;

[0044] Fig.11 yes Fig.10 a left side view of the communication device shown;

[0045] Fig.12 yes Fig.10 and Fig.11 A front view of a back panel in the communication device shown;

[0046] Fig.13 is a front view of a back plate provided in an embodiment of the present application;

[0047] Fig.14 is a schematic diagram of a first cross unit provided in an embodiment of the present application;

[0048] Fig.15 is a schematic diagram of another first cross unit provided in an embodiment of the present application;

[0049] Fig.16 is a schematic diagram of another first cross unit provided in an embodiment of the present application;

[0050] Fig.17 is a front view of another communication device provided in an embodiment of the present application;

[0051] Fig.18 is a schematic diagram of a wire card provided in an embodiment of the present application;

[0052] Fig.19 is a schematic diagram of a light ray card provided in an embodiment of the present application;

[0053] Fig. 20 is a schematic diagram of an optoelectronic hybrid line card provided in an embodiment of the present application;

[0054] Fig.21 Yes Fig.18 or Fig. 20 A schematic diagram of an electric wire card obtained by segmenting the line card shown;

[0055] Fig. 22 Yes Fig.19 or Fig. 20 A schematic diagram of a light card obtained by segmenting the line card shown;

[0056] Fig.23 Yes Fig.18 A schematic diagram of an electric wire card obtained by segmenting the line card shown;

[0057] Fig.24 Yes Fig.19A schematic diagram of a light card obtained by segmenting the line card shown;

[0058] Fig.25 Yes Fig. 20 A schematic diagram of a line card obtained by segmenting the line card shown;

[0059] Fig.26 is a schematic diagram of a power grid board provided in an embodiment of the present application;

[0060] Fig. 27 is a schematic diagram of an optical network board provided in an embodiment of the present application;

[0061] Fig.28 is a schematic diagram of an optoelectronic hybrid screen provided in an embodiment of the present application;

[0062] Fig.29 is a schematic diagram of a communication system provided in an embodiment of the present application;

[0063] Fig.30 It is a schematic diagram of another communication system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0064] The implementation methods of the present application will be further described below in conjunction with the accompanying drawings.

[0065] Cluster routers are an important part of the communication system. According to the number of switching levels, the communication system includes a three-stage switching network and a single-stage switching network. Correspondingly, cluster routers include cluster routers designed for the three-stage switching network and cluster routers designed for the single-stage switching network. For example, the three-stage switching network is a CLOS network or a fat tree network, and the single-stage switching network is a mesh network. Among them, the "CLOS network" is a network named after a researcher at Bell Labs, and the "CLOS" in the "CLOS network" is the abbreviation of the researcher's name "Charles Clos".

[0066] Typically, a cluster router includes at least one line card and / or at least one network board, each line card includes at least one NP chip, and each network board includes at least one switch chip. Three-stage switching means that a signal (such as a switching network signal) needs to undergo three switching processes from one NP chip to another NP chip. Single-stage switching means that a signal (such as a switching network signal) needs to undergo only one switching process from one NP chip to another NP chip. Among them, single-stage switching is completed by one switching chip, and three-stage switching is completed by at least two switching chips. For example, the three switching processes in the three-stage switching are completed in sequence by the first-stage switching (switch1, S1) chip, the second-stage switching (switch2, S2) chip, and the third-stage switching (switch3, S3) chip. The S1 chip and the S3 chip can be the same switching chip, different switching chips in the same network board, or switching chips in different network boards. If the S1 chip and the S3 chip are switching chips in different network boards, the network board where the S1 chip is located and the network board where the S3 chip is located can be in the same cluster router or different cluster routers. The S2 chip and the S1 chip are different switching chips, and the S2 chip and the S3 chip are different switching chips. The S2 chip and the S1 chip are in different network boards of the same cluster router or in network boards of different cluster routers. The S2 chip and the S3 chip are in different network boards of the same cluster router or in network boards of different cluster routers. The above-mentioned one NP chip and another NP chip can be in the same line card, in different line cards of the same cluster router, or in line cards of different cluster routers.

[0067] In one example, Figure 1 The schematic diagram of a three-level switching architecture is shown. The three-level switching architecture includes a line card 1, a network board 1, and a network board 2. The line card 1 includes NP chips 11-13, optical modules 11-16, and multiple line card connectors. The NP chip 11 is connected to the optical modules 11-12, the NP chip 12 is connected to the optical modules 13-14, the NP chip 13 is connected to the optical modules 15-16, each of the NP chips 11-13 is connected to at least one of the multiple line card connectors, and different NP chips are connected to different line card connectors ( Figure 1 Take each NP chip connected to two line card connectors as an example). The network board 1 includes switching chips 21-23, optical modules 21-24 and multiple network board connectors. Each of the switching chips 21-23 is connected to the optical modules 21-24, and each of the switching chips 21-23 is connected to the multiple network board connectors. The network board 2 includes switching chips 31-32 and optical modules 31-34. The switching chip 31 is connected to the optical modules 31-32, and the switching chip 32 is connected to the optical modules 33-34. Figure 1 As shown, each line card connector in the line card 1 is connected to at least one mesh board connector in the mesh board 1 ( Figure 1Taking the connection between each mesh board connector in the mesh board 1 and two line card connectors in the line card 1 as an example, the optical modules 21-24 are connected to the optical modules 31-34 in a one-to-one correspondence.

[0068] Wherein, mesh board 1 is an S1 mesh board and / or an S3 mesh board, mesh board 2 is an S2 mesh board, and correspondingly, the switching chip in mesh board 1 includes an S1 chip and / or an S3 chip, and the switching chip in mesh board 2 is an S2 chip. The switching chip in mesh board 1 is used to perform first-level switching and / or third-level switching of signals (such as switching network signals), and the switching chip in mesh board 2 is used to perform second-level switching of signals (such as switching network signals). Line card 1, mesh board 1, and mesh board 2 can be in the same cluster router or in different cluster routers. Take mesh board 1 as an example, which is an S1 mesh board and an S3 mesh board. Figure 1 The exemplary switching process of the three-level switching architecture shown includes: the first signal received by the optical module 11 in the line card 1 is sequentially subjected to the photoelectric conversion processing of the optical module 11 (i.e., converting the optical signal into an electrical signal), the processing of the NP chip 11, the switching processing of the switching chip 21, the electro-optical conversion processing of the optical module 21 (i.e., converting the electrical signal into an optical signal), the photoelectric conversion processing of the optical module 31, the switching processing of the switching chip 31, the electro-optical conversion processing of the optical module 32, the photoelectric conversion processing of the optical module 22, the switching processing of the switching chip 22, the processing of the NP chip 12, and the electro-optical conversion processing of the optical module 13, and then is sent out from the optical module 13. In the above process, the first signal undergoes three switching processes from the NP chip 11 to the NP chip 12.

[0069] In one example, Figure 2 It is a schematic diagram of a single-stage switching architecture. The single-stage switching architecture includes a line card 1 and a network board 1. The line card 1 and the network board 1 can be in the same cluster router or in different cluster routers. The line card 1 includes NP chips 11-13, optical modules 11-16 and multiple line card connectors. The NP chip 11 is connected to the optical modules 11-12, the NP chip 12 is connected to the optical modules 13-14, the NP chip 13 is connected to the optical modules 15-16, each of the NP chips 11-13 is connected to at least one of the multiple line card connectors, and different NP chips are connected to different line card connectors ( Figure 2 Take the example of each NP chip being connected to two line card connectors. The network board 1 includes switching chips 21-23 and multiple network board connectors. Each switching chip in the switching chips 21-23 is connected to the multiple network board connectors. Each line card connector in the line card 1 is connected to at least one network board connector in the network board 1 ( Figure 2 Take the connection between each mesh board connector in mesh board 1 and two line card connectors in line card 1 as an example for explanation). Figure 2The exemplary switching process of the single-stage switching architecture shown includes: the first signal received by the optical module 11 in the line card 1 is sequentially subjected to the photoelectric conversion processing of the optical module 11, the processing of the NP chip 11, the switching processing of the switching chip 21, the processing of the NP chip 12, and the electro-optical conversion processing of the optical module 13, and then is sent out from the optical module 13. In the above process, the first signal undergoes a switching process from the NP chip 11 to the NP chip 12.

[0070] Figure 1 and Figure 2 For example, an NP chip in the signal input direction (e.g., NP chip 1) and an NP chip in the signal output direction (e.g., NP chip 2) are in the same line card. In other embodiments, the NP chip in the signal input direction and the NP chip in the signal output direction are in different line cards, which may be in the same cluster router or in different cluster routers. Figure 1 and Figure 2 The structure of the line card 1 and the connection relationship between the NP chip in the line card 1 and the network board 1 are only shown by way of example. In actual applications, a part of the NP chips in the line card 1 are connected to the network board 1, and the other part is connected to other network boards outside the network board 1. Figure 1 For simplicity, the NP chip in line card 1 connected to other network boards other than network board 1 is not shown. Figure 1 and Figure 2 In the switching architecture shown, line card 1 is a wire card, line card connector is a wire card connector, mesh board 1 is a mesh board, and mesh board connector is a mesh board connector. In other embodiments, line card 1 is a fiber card, line card connector is a fiber card connector, mesh board 1 is an optical mesh board, mesh board connector is an optical mesh board connector, an optical module is further connected between the NP chip and the fiber card connector, and an optical module is further connected between the switching chip and the optical mesh board connector. In this field, line card is also called interface board or service board, mesh board is also called switching mesh board, and in Figure 1 and Figure 2 In the switching architecture shown, the optical modules 11 to 16 may be referred to as service optical modules, and the optical modules 21 to 24 and the optical modules 31 to 34 may be referred to as cluster optical modules, which is not limited in the embodiments of the present application.

[0071] For the sake of convenience, the cluster router designed for the three-level switching network is called the three-level switching cluster router, and the cluster router designed for the single-level switching network is called the single-level switching cluster router. In the development history of cluster routers, the three-level switching cluster router is the mainstream cluster router. The three-level switching cluster router has the advantages of low chip switching scale requirements, good compatibility of multi-rate line cards, support for single-frame working mode, dual-frame back-to-back working mode, and multi-frame cluster working mode. Compared with the three-level switching cluster router, the single-level switching cluster router has lower power consumption, but the single-level switching cluster router is difficult to support the single-frame working mode, which limits the commercial use of the single-level switching cluster router.

[0072] For example, in order for a single-stage switching cluster router to support a single-frame working mode, it is currently necessary to configure a single-frame network board that supports a single-frame working mode and a cluster network board that supports a cluster working mode for the single-stage switching cluster router. If the single-stage switching cluster router is required to implement a single-frame working mode, the cluster network board is removed from the single-stage switching cluster router, and the single-frame network board is installed in the single-stage switching cluster router. If the single-stage switching cluster router is required to implement a cluster working mode, the single-frame network board is removed from the single-stage switching cluster router, and the cluster network board is installed in the single-stage switching cluster router. Since it is necessary to configure a single-frame network board and a cluster network board for the single-stage switching cluster router, and when the single-stage switching cluster router is required to implement a single-frame working mode, the user is required to manually remove the cluster network board and install the single-frame network board, so it is difficult for the single-stage switching cluster router in this solution to support a single-frame working mode, the implementation cost is high, and the maintenance difficulty is high.

[0073] As the capacity of cluster routers continues to increase, the power consumption of cluster routers continues to increase, and the proportion of power consumption factors in the commercial use of cluster routers continues to increase. Under this development trend, single-stage switching cluster routers may become the future evolution direction due to their low power consumption, so it is necessary to solve the problem that single-stage switching cluster routers are difficult to support single-frame working mode.

[0074] The embodiments of the present application provide a communication device and a communication system, wherein the communication device may be a cluster communication device and the communication device may be a frame communication device, for example, the communication device is a frame cluster router. The communication device supports single-stage switching, and the communication device can flexibly and conveniently support a single-frame working mode and flexibly and conveniently implement switching between a single-frame working mode and a cluster working mode (that is, a multi-frame working mode). For example, the communication device only requires one network board to implement a single-frame working mode and a cluster working mode, and the communication device does not need to disassemble and install the network board when switching between a single-frame working mode and a cluster working mode, so the implementation cost is low and the maintenance difficulty is low. In addition, in the cluster working mode, the communication device can flexibly adapt to different cluster frame numbers (that is, adapt to scenarios including different numbers of the communication device).

[0075] The following is an introduction to the technical solution of this application. Figure 3 and Figure 4 , Figure 3 is a front view of a communication device provided in an embodiment of the present application, Figure 4 yes Figure 3 The communication device is a side view of the communication device shown in FIG. The communication device may be a cluster communication device, and the communication device may be a frame communication device, for example, the communication device is a frame cluster router. The communication device is a single-stage switching device. The communication device can flexibly and conveniently support a single-frame working mode and a multi-frame working mode (ie, a cluster working mode). Figure 3 and Figure 4 As shown, the communication device includes a frame 11 and a back panel 12 .

[0076] Among them, the frame 11 has a panel side and a backplane side, and the frame 11 includes multiple service slots (the embodiment of the present application takes the frame 11 including 16 service slots 1 to 16 as an example), the entrances of the multiple service slots are all located on the panel side of the frame 11, and the bottoms of the multiple service slots are all located on the backplane side of the frame 11. The multiple service slots are used to install line cards and / or mesh boards. That is, the service slots in the embodiment of the present application can be used to install both line cards and mesh boards. The service slots are common service slots for line cards and mesh boards, and line cards and mesh boards share service slots. For example, each service slot is used to install a mesh board or one or more line cards. Among them, the panel side of the frame 11 is also the side where the front of the frame 11 is located, the back panel side of the frame 11 is also the side where the back of the frame 11 is located, the front of the frame 11 is opposite to the back of the frame 11, the front of the frame 11 and the front of the communication device are located on the same side, and the back of the frame 11 and the back of the communication device are located on the same side.

[0077] The backplane 12 is located on the backplane side of the frame 11, and the backplane 12 includes a backplane body 121 and a protrusion 122 protruding toward the panel side of the frame 11 relative to the backplane body 121, and the backplane body 121 has a backplane connector 123 corresponding to each of the multiple service slots, and different service slots in the multiple service slots correspond to different backplane connectors 123, and the backplane connector 123 corresponding to each service slot is located at the bottom of the corresponding service slot, and the protrusion 122 has multiple mesh board connectors 13, the first end of the mesh board connector 13 is connected to the backplane connector 123, and the second end of the mesh board connector 13 is used to connect the mesh board, and the second end of the mesh board connector 13 is located on the side of the protrusion 122 away from the backplane body 121. Since the backplane 12 includes the protrusion 122, the backplane 12 can also be called a convex backplane, which is not limited in the embodiment of the present application.

[0078] Wherein, when at least one line card and at least one network board are installed in the multiple service slots, the at least one line card is connected to the backplane connector 123 at the bottom of the corresponding service slot, the at least one network board is connected to the second end of the multiple network board connectors 13, and different NP chips in the at least one line card are connected to a switching chip in the at least one network board. Wherein, each line card in the at least one line card includes at least one NP chip, each network board in the at least one network board includes at least one switching chip, the line card and the network board are installed in different service slots, the at least one network board is installed in at least one service slot in a one-to-one correspondence, the at least one line card is installed in at least one service slot in a one-to-one correspondence, or all or part of the line cards in the at least one line card are installed in one service slot.

[0079] Optional, such as Figure 3 and Figure 4 As shown, the backplane 12 further includes a first cross unit 124, the first cross unit 124 is located on the protrusion 122, the mesh connector 13 is located on a side of the first cross unit 12 away from the backplane body 121, the first cross unit 124 is connected to the backplane connector 123, the first end of the mesh connector 13 is connected to the backplane connector 123 through the first cross unit 124, and the second end of the mesh connector 13 is located on a side of the protrusion 122 away from the backplane body 121. For example, the backplane 12 has a cavity Q, the first cross unit 124 is located in the cavity Q, and the cavity wall of the cavity Q has a plurality of openings ( Figure 3 and Figure 4The plurality of mesh connectors 13 are located in the plurality of openings one by one, the first end of each mesh connector 13 of the plurality of mesh connectors 13 is located in the cavity Q, and the second end of each mesh connector 13 of the plurality of mesh connectors 13 is located outside the cavity Q. Optionally, the first cross unit 124 is connected to the backplane connector 123 via a cable, and the cable includes an optical cable (also called an optical fiber) and / or an electrical cable (also called an electrical cable). Figure 3 and Figure 4 In the communication device shown, the network board connector 13 is a switching network interface on the first cross unit 12 .

[0080] Optional, Figure 5 is a front view of another communication device provided in an embodiment of the present application, Figure 6 yes Figure 5 A side view of the communication device shown. Figure 5 and Figure 6 As shown, the backplane 12 also includes a first cross unit 124, which is connected to the backplane connector 123. The communication device also includes a second cross unit 14, which is located on the protruding portion 122, and the second cross unit 14 is plugged into a side of the first cross unit 124 away from the backplane body 121. The mesh board connector 13 is located on a side of the second cross unit 14 away from the first cross unit 124. The first end of the mesh board connector 13 is connected to the backplane connector 123 through the second cross unit 14 and the first cross unit 124, and the second end of the mesh board connector 13 is located on a side of the second cross unit 14 away from the first cross unit 124. For example, the backplane 12 has a cavity Q, the first cross unit 124 is located in the cavity Q, the first cross unit 124 has a connector 125 on a side away from the backplane body 121, the cavity wall of the cavity Q has an opening corresponding to the connector 125, the connector 125 is located in the opening on the cavity wall of the cavity Q, the second cross unit 14 is located outside the cavity Q, the second cross unit 14 is plugged into the connector 125, so that the second cross unit 14 is plugged into the side of the first cross unit 124 away from the backplane body 121 through the connector 125. Optionally, the first cross unit 124 is connected to the backplane connector 123 through a cable, and the cable includes an optical fiber and / or an electrical cable. Figure 5 and Figure 6 In the communication device shown, the connector 125 is a switching network interface on the first cross unit 12 .

[0081] Optional, such as Figures 3 to 6As shown, the backplane 12 has a cavity Q, and the backplane connector 123 and the cable for connecting the first cross unit 124 and the backplane connector 123 are all located in the cavity Q. Therefore, it is possible to avoid laying the cable for connecting the first cross unit 124 and the backplane connector 123 outside the backplane 12, thereby improving the neatness of the communication equipment.

[0082] Optional, such as Figures 3 to 6 As shown, the entrance ends of the multiple service slots (the entrance end of each service slot is the end of each service slot away from the backplane body 121) are flush, and the second end of the mesh connector 13 (that is, the end of the mesh connector 13 away from the backplane body 121) is recessed toward the backplane side of the frame 11 relative to the entrance ends of the multiple service slots, thereby, the multiple service slots and the mesh connector 13 form a groove on the panel side of the frame 11, and the groove can be used for laying cables, such as laying cables for connecting the mesh connector 13 and the mesh, so as to improve the neatness of the communication equipment. In one embodiment, the entrance ends of the multiple service slots are in a first plane, and the second ends of the multiple mesh connectors 13 are in a second plane, and the first plane and the second plane are both parallel to the height direction y of the frame 11, and the first plane is parallel to the second plane, and the second plane is closer to the backplane body 121 than the first plane, that is, the second plane is located between the first plane and the backplane body 121.

[0083] Optionally, the raised portion 122 is located in the middle of the backplane body 121, and the plurality of service slots are distributed on both sides of the raised portion 122. For example, the plurality of service slots are evenly distributed on both sides of the raised portion 122. For example, Figures 3 to 6 As shown, the frame 11 includes 16 service slots, and the 16 service slots are evenly distributed on both sides of the raised portion 122, and the two sides of the raised portion 122 include 8 service slots respectively.

[0084] In the embodiment of the present application, the communication device includes a backplane 12, or the communication device includes a plurality of independent backplanes 12, each of the plurality of backplanes 12 is in a strip shape, and the plurality of strip backplanes 12 may be sub-backplanes obtained by dividing the one backplane 12. Optionally, the first cross unit 124 in each strip backplane 12 is connected to the backplane connector 123 in each strip backplane 12, and the first cross unit 124 in each strip backplane 12 is not connected to the backplane connectors 123 in other strip backplanes 12.

[0085] In the first embodiment of the present application, Figures 3 to 6 As shown, the communication device includes a plurality of backplanes 12 ( Figures 3 to 6Take 4 backplanes 12 as an example), the multiple backplanes 12 are independent of each other, the multiple backplanes 12 are strip-shaped, the length directions of the multiple backplanes 12 are parallel to the height direction y of the frame 11, and the multiple backplanes 12 are arranged along the first direction x, and the first direction x is perpendicular to the height direction y of the frame 11. Each backplane 12 of the multiple backplanes 12 includes a backplane body 121, a protruding portion 122 protruding toward the panel side of the frame 11 relative to the backplane body 121, and a first cross unit 124 located in the cavity Q of the backplane 12, and the distances between the protruding portions 122 of the multiple backplanes 12 and the bottom surface of the frame 11 are equal. The plurality of service slots are evenly distributed on both sides of the raised portion 122 of the plurality of backplanes 12. The backplane body 121 of each backplane 12 of the plurality of backplanes 12 has at least one backplane connector 123 corresponding to each service slot of the plurality of service slots. Different service slots correspond to different backplane connectors 123. The raised portion 122 of each backplane 12 of the plurality of backplanes 12 has at least one mesh board connector 13. In one example, Figure 7 yes Figures 3 to 6 A front view of a back panel 12 in the communication device shown, with reference to Figures 3 to 7 The backplane 12 includes a backplane body 121, a protrusion 122 protruding toward the panel side of the frame 11 relative to the backplane body 121, and a first cross unit 124 located in the cavity Q of the backplane 12. The backplane body 121 has two backplane connectors 123 corresponding to each of the service slots 1 to 16. The first cross unit 124 has a plurality of switching network interfaces R on a side away from the backplane body 121. The plurality of switching network interfaces R are connected to the two backplane connectors 123 corresponding to each of the service slots 1 to 16. For example, for Figure 3 and Figure 4 In the communication device shown in the figure, the switching network interface R on the side of the first cross unit 124 away from the backplane body 121 is a network board connector 13; Figure 5 and Figure 6 In the communication device shown, the switching network interface R on the side of the first cross unit 124 away from the backplane body 121 is a plug-in connector 125 .

[0086] In the second embodiment of the present application, Figure 8 is a front view of another communication device provided in an embodiment of the present application, Figure 8 The side view of the communication device shown is the same as Figure 4 ,like Figure 4 and Figure 8 As shown, the communication device includes a backplane 12, which includes a backplane body 121, a protrusion 122 protruding toward the panel side of the frame body 11 relative to the backplane body 121, and at least one first cross unit 124 ( Figure 8Taking the backplane 12 including four first cross units 124 as an example, the backplane body 121 has at least one backplane connector 123 corresponding to each of the multiple service slots, different service slots correspond to different backplane connectors 123, and the protrusion 122 has multiple mesh board connectors 13. In one example, Fig. 9 yes Figure 8 A front view of the back panel 12 in the communication device shown in FIG. Figure 4 , Figure 8 and Fig. 9 The backplane 12 includes a backplane body 121, a protrusion 122 protruding toward the panel side of the frame 11 relative to the backplane body 121, and four first cross units 124 located in the cavity Q of the backplane 12. The backplane body 121 has eight backplane connectors 123 corresponding to each of the service slots 1 to 16. Each first cross unit 124 has a plurality of switching network interfaces R on a side away from the backplane body 121. The plurality of switching network interfaces R are connected to the eight backplane connectors 123 corresponding to each of the service slots 1 to 16. Figure 8 In the communication device shown in FIG. 1 , the switching network interface R on the side of the first cross unit 124 away from the backplane body 121 is a network board connector 13. In some embodiments, Figure 8 The first cross unit 124 of the communication device shown is plugged with the second cross unit on a side away from the backplane body 121 . In this embodiment, the switching network interface R is a connector on the first cross unit 124 for plugging with the second cross unit.

[0087] The above second embodiment is described by taking the backplane 12 including a plurality of first cross units 124 as an example. In other embodiments, the backplane 12 includes a first cross unit 124, and the first cross unit 124 extends along the first direction x. In the above first embodiment, the communication device includes a plurality of independent backplanes 12, and the plurality of backplanes 12 can be independently installed or removed. Therefore, the backplane 12 provided by the first embodiment is relatively small in scale, which is conducive to production and manufacturing. The number of backplanes 12 can be configured as needed, reducing the cost of the communication device and facilitating on-demand expansion of the communication device. For example, a communication device with a larger capacity can include more backplanes to support more line cards, and a communication device with a smaller capacity can include fewer backplanes to support fewer line cards. The backplane 12 provided by the above second embodiment is relatively large in scale, can support more line cards, is convenient for improving the capacity of the communication device, and can save the structural overhead of splicing multiple backplanes, saving frame space.

[0088] The above embodiments are described by taking the service slot in the communication device as a horizontal service slot as an example. In some embodiments, the communication device includes a longitudinal service slot (or referred to as a vertical service slot). For example, the service slots in the communication device are all longitudinal service slots. Optionally, the shape of the entrance surface of the service slot is rectangular, the entrance surface of the service slot is perpendicular to the depth direction z of the service slot, and the length direction (for example, the length direction) of the entrance surface of the horizontal service slot is Figure 3 , Figure 5 and Figure 8 The first direction x) is perpendicular to the height direction y of the frame 11, and the length direction of the entrance surface of the longitudinal service slot is parallel to the height direction y of the frame 11. For example, Fig.10 is a front view of another communication device provided in an embodiment of the present application, Fig.11 yes Fig.10 The left side view of the communication device shown in FIG. Fig.10 and Fig.11 As shown, the communication device includes a frame 11 and a plurality of back panels 12 ( Fig.10 and Fig.11 Taking the communication device including 8 backplanes 12 as an example, the frame 11 includes service slots 1 to 16, and the service slots 1 to 16 are all longitudinal service slots. The 8 backplanes 12 are arranged on the backplane side of the frame 11 along the first direction x. The front view of each backplane 12 of the 8 backplanes 12 is as shown in Fig.12 See Figures 10 to 12 Each of the eight backplanes 12 is in a strip shape, and each of the eight backplanes 12 includes a backplane body 121, a protruding portion 122 protruding toward the panel side of the frame body 11 relative to the backplane body 121, and a first cross unit 124 located in the cavity Q of the backplane 12. Each of the eight backplanes 12 corresponds to two service slots on both sides of the protruding portion 122 of each backplane 12, and the first cross unit 124 in each backplane 12 is connected to the backplane connector 123 in each backplane 12. For example, the first cross unit 124 between service slot 1 and service slot 9 corresponds to service slot 1 and service slot 9, and the first cross unit 124 is connected to the backplane connector 123 corresponding to service slot 1 and service slot 9, and the first cross unit 124 is used to provide cross connection for service slot 1 and service slot 9. The first cross unit 124 between service slot 2 and service slot 10 corresponds to service slot 2 and service slot 10. The first cross unit 124 is connected to the backplane connector 123 corresponding to service slot 2 and service slot 10. The first cross unit 124 is used to provide cross connection for service slot 2 and service slot 10, and so on. Each first cross unit 124 has a switching network interface R on one side away from the backplane body 121. Fig.10 and Fig.11In the communication device shown, the switching network interface R is a network board connector 13. In other embodiments, Fig.10 and Fig.11 The first cross unit 124 of the communication device shown is plugged into the second cross unit on a side away from the backplane body 121. In this embodiment, the switching network interface R is a connector on the first cross unit 124 for plugging into the second cross unit, which is not limited in this embodiment of the present application.

[0089] Fig.12 Taking the example that the multiple backplane connectors 123 corresponding to each service slot are evenly distributed on one side of the raised portion 122 of the backplane 12 along the length direction of the backplane 12, in some embodiments, the multiple backplane connectors 123 are concentrated near the raised portion 122, thereby shortening the length of the cable used to connect the multiple backplane connectors 123 and the first cross unit 124 in the backplane 12. In addition, Fig.10 and Fig.11 The communication device shown includes 6 rows of mesh connectors 13 arranged along the height direction y of the frame 11. The 1st to 3rd rows of backplane connectors 123 in the 6 rows of mesh connectors 13 are close to service slots 9 to 16, and the 4th to 6th rows of backplane connectors 123 are close to service slots 1 to 8. The 1st to 3rd rows of backplane connectors 123 can be connected to the backplane connectors 123 corresponding to service slots 9 to 16, and the 4th to 6th rows of backplane connectors 123 can be connected to the backplane connectors 123 corresponding to service slots 1 to 8. Fig.10 and Fig.11 In the communication device shown, the first cross unit 124 in each backplane 12 is used to provide cross-connection for the two service slots on both sides of the first cross unit 104. The cross-connection granularity of the first cross unit 104 is relatively coarse. Therefore, in some embodiments, a cable can be used instead of the first cross unit 104 to implement the cross-connection function, which helps to reduce the cost of the communication equipment.

[0090] Fig.10 and Fig.11 Taking the communication device including a plurality of backplanes 12 as an example, in some embodiments, the communication device includes a plurality of longitudinal service slots and a backplane. For example, the communication device includes a plurality of longitudinal service slots and a backplane. Fig.13 The back plate 12 shown, Fig.13 The backplane 12 shown includes eight first cross units 124, each of which corresponds to two service slots on both sides of the first cross unit 124, and the backplane connector 123 corresponding to each service slot is connected to the first cross unit 124 corresponding to each service slot. In addition, Fig.13Taking the example that the back plate 12 includes a plurality of first intersection units 124 , in other embodiments, the back plate 12 includes one first intersection unit 124 , and the one first intersection unit 124 extends along the first direction x, which is not limited in the embodiments of the present application.

[0091] In the embodiment of the present application, the cross granularity of the second cross unit 14 is smaller than the cross granularity of the first cross unit 124. For a communication device including the first cross unit 124 and not including the second cross unit 14, since the cross granularity of the first cross unit 124 is larger, the minimum number of network boards that the communication device can support is smaller, and the number of basic network boards of the communication device is smaller. For a communication device including the first cross unit 124 and the second cross unit 14, since the cross granularity of the second cross unit 14 is smaller, the minimum number of network boards that the communication device can support is larger, and the number of basic network boards of the communication device is larger. The cross granularity is also called the cross granularity, which is expressed by the number of Lanes supported by a single NP chip. For example, the cross granularity can be expressed as X Lane / NP chip, indicating that one NP chip supports X Lanes, and Lane is a unit.

[0092] As an example, Table 1 shows the relationship between the cross-granularity of a communication device, the minimum number of network boards that the communication device can support (minimum number of network boards), the number of line cards corresponding to the minimum number of network boards (i.e., the minimum number of line cards), the maximum number of network boards that the communication device can support (maximum number of network boards), and the number of line cards corresponding to the maximum number of network boards (i.e., the maximum number of line cards).

[0093] Table 1

[0094]

[0095] As shown in Table 1, as the cross-granularity increases, the minimum number of network boards, the minimum number of line cards (that is, the number of line cards corresponding to the minimum number of network boards), the maximum number of network boards, and the maximum number of line cards (that is, the number of line cards corresponding to the maximum number of network boards) supported by the communication device decrease in turn, which means that the larger the cross-granularity of the communication device, the fewer the minimum number of network boards that the communication device can support, and the fewer the number of basic network boards of the communication device. The larger the cross-granularity of the communication device, the more the minimum number of network boards that the communication device can support, and the more the number of basic network boards of the communication device. For example, as shown in Table 1, when the cross-granularity of the communication device is 4Lane / NP chip, the minimum number of network boards that the communication device can support is 4, the minimum number of line cards is 6, the maximum number of network boards is 16, and the maximum number of line cards is 24. When the cross-connect granularity of the communication device is 1Lane / NP chip, the maximum number of network boards that the communication device can support is 64, and the maximum number of line cards is 96. However, the minimum number of network boards that the communication device can support is also relatively large (the minimum number of network boards is 12). The number of basic network boards of the communication device is not less than 12, which is not suitable for small-capacity clusters.

[0096] For example, in an embodiment of the present application, the communication device includes a plurality of backplanes 12, and the first cross unit 124 in the g-th backplane 12 of the plurality of backplanes 12 provides cross connection for the g-th NP chip in each service slot 1 to 16 of the service slots 1 to 16, and the first cross unit 124 in the g-th backplane 12 provides cross connection for a total of 16 NP chips. Assuming that the cross connection granularity of the first cross unit 124 is 4 Lanes / NP chip, and each backplane 12 includes 16 switching network interfaces, the 16 switching network interfaces include a total of 16×4=64 Lanes. Further, a second cross unit 14 is provided on a side of the first cross unit 124 away from the backplane body 121, and the cross connection granularity of the second cross unit 14 is smaller than that of the first cross unit 124, which can further reduce the cross connection granularity of the communication device and increase the number of base distribution network boards of the communication device. For example, the cross granularity of the first cross unit 124 is 4 Lanes / NP chip, and the cross granularity of the second cross unit 14 is 1 Lane / NP chip.

[0097] The single-stage switching cluster router that currently provides fine-grained cross-connection can support more line cards and larger cluster capacity, but cannot support fewer line cards and smaller cluster capacity. For example, when the cross-connection granularity is 1Lane / NP chip, even if only one line card is working in the current single-stage switching cluster router, 12 network boards need to be configured for the single-stage switching cluster router (for example, as shown in Table 1, when the cross-connection granularity is 1Lane / NP chip, the minimum number of network boards is 12). The embodiment of the present application solves the problem that the single-stage switching cluster router that currently provides fine-grained cross-connection cannot support fewer line cards and smaller cluster capacity by setting a second cross-connection unit 14. For example, in a small-capacity scenario, the communication device provided by the embodiment of the present application is provided to include a first cross-connection unit and not include a second cross-connection unit, thereby providing a communication device with a coarser cross-connection granularity to support fewer line cards and smaller cluster capacity; in a large-capacity scenario, the communication device provided by the embodiment of the present application is provided to include a first cross-connection unit and a second cross-connection unit, thereby providing a communication device with a finer cross-connection granularity to support more line cards and larger cluster capacity. For example, when the cluster capacity is expanded to a certain extent, a second cross unit is plugged into a side of the first cross unit away from the backplane body to support more line cards and a larger cluster capacity.

[0098] In the embodiment of the present application, the first cross unit 124 includes a first cross connector and a second cross connector, the first cross connector and the second cross connector are located on two opposite surfaces of the first cross unit 124, the second cross connector is located on a surface of the first cross unit 124 away from the backplane body 121, the first cross connector is connected to the second cross connector, the first cross connector is used to connect to the backplane connector 123, and the second cross connector is used to connect to the network board. For example, the first cross connector is a cable on the first cross unit 124 for connecting to the backplane connector 123, and the second cross connector is a switching network interface R on the first cross unit 124. Figure 3 , Figure 4 , Figure 8 , Fig.10 and Fig.11 In the communication device shown, the second cross-connector is a web connector 13; Figure 5 and Figure 6In the communication device shown, the second cross-connector is a plug-in connector 125. The first cross unit 124 is an electrical cross unit, an optical cross unit or an optoelectronic hybrid cross unit, so that the communication device including the first cross unit 124 supports at least one of an electric line card, an optical line card and an optoelectronic hybrid line card, and supports at least one of an electric network board, an optical network board and an optoelectronic hybrid network board. In the case where the first cross unit 124 is an electrical cross unit, the first cross connector and the second cross connector on the first cross unit 124 are both electrical cross connectors, the backplane connector 123 on the backplane body 121 are both electrical backplane connectors, and the backplane 12 can be called an electrical backplane. In the case where the first cross unit 124 is an optical cross unit, the first cross connector and the second cross connector on the first cross unit 124 are both optical cross connectors, the backplane connector 123 on the backplane body 121 are both optical backplane connectors, and the backplane 12 can be called an optical backplane or an optical fiber backplane. In the case where the first cross unit 124 is an optoelectronic hybrid cross unit, the first cross connector and the second cross connector on the first cross unit 124 include an optical cross connector and an electrical cross connector, the backplane connector 123 on the backplane body 121 includes an optical backplane connector and an electrical backplane connector, and the backplane 12 can be called an optoelectronic hybrid backplane. Optionally, in the case where the communication device includes a second cross unit 14, the second cross unit 14 can also be an electrical cross unit, an optical cross unit, or an optoelectronic hybrid cross unit. The following is divided into three embodiments, taking the first cross unit 124 as an optical cross unit, an electrical cross unit, and an optoelectronic hybrid cross unit as examples for explanation.

[0099] In one embodiment, Fig.14 1 is a schematic diagram of a first cross unit 124 provided in an embodiment of the present application. The first cross unit 124 is an electrical cross unit. The first cross unit 124 includes a plurality of first cross connectors and a plurality of second cross connectors. The plurality of first cross connectors and the plurality of second cross connectors are both electrical cross connectors. Each of the plurality of first cross connectors is connected to the plurality of second cross connectors via a cable. In this embodiment, the backplane connectors 123 on the backplane body 121 are all electrical backplane connectors. The backplane connectors 123 are used to connect to the wire cards installed in the corresponding service slots. The first cross connectors are used to connect to the backplane connectors 123. The second cross connectors are used to connect to the grid board. The communication device including the first cross unit 124 supports the wire cards and the grid board.

[0100] In another embodiment, Fig.15It is a schematic diagram of another first cross unit 124 provided in an embodiment of the present application. The first cross unit 124 is an optical cross unit. The first cross unit 124 includes a plurality of first cross connectors and a plurality of second cross connectors. The plurality of first cross connectors and the plurality of second cross connectors are both optical cross connectors. Each of the first cross connectors in the plurality of first cross connectors is connected to the plurality of second cross connectors through an optical fiber. In this embodiment, the backplane connectors 123 on the backplane body 121 are all optical backplane connectors. The backplane connectors 123 are used to connect to the optical fiber card installed in the corresponding service slot. The first cross connector is used to connect to the backplane connector 123. The second cross connector is used to connect to the optical network board. The communication device including the first cross unit 124 supports the optical fiber card and the optical network board.

[0101] In yet another embodiment, Fig.16 It is a schematic diagram of another first cross unit 124 provided in an embodiment of the present application. The first cross unit 124 is an optoelectronic hybrid cross unit. The first cross unit 124 includes a plurality of first cross connectors and a plurality of second cross connectors. The plurality of first cross connectors include an optical cross connector and an electrical cross connector. The plurality of second cross connectors include an optical cross connector and an electrical cross connector. The optical cross connector as the first cross connector is connected to the optical cross connector as the second cross connector through optical fibers, and the electrical cross connector as the first cross connector is connected to the electrical cross connector as the second cross connector through cables. In this embodiment, the backplane connector 123 on the backplane body 121 includes an optical backplane connector and an electrical backplane connector, the optical backplane connector is used to connect with the optical fiber card installed in the corresponding service slot, the electrical backplane connector is used to connect with the electric wire card installed in the corresponding service slot, the optical cross-connector as the first cross-connector is used to connect with the optical backplane connector, the electrical cross-connector as the first cross-connector is used to connect with the electrical backplane connector, the optical cross-connector as the second cross-connector is used to connect with the optical network board, the electrical cross-connector as the second cross-connector is used to connect with the network board, and the communication device including the first cross unit 124 supports the electric wire card, the optical fiber card, the optoelectronic hybrid line card, the optical network board, the network board and the optoelectronic hybrid network board. Among them, the ratio of the optical cross-connector and the electrical cross-connector in the optoelectronic hybrid cross unit can be set according to actual needs, so that the communication device provided in the embodiment of the present application supports the electric wire card, the optical fiber card, the optoelectronic hybrid line card, the optical network board, the network board and the optoelectronic hybrid network board at the same time.

[0102] Optionally, the communication device provided in the embodiment of the present application includes at least one line card and at least one network board. The at least one network board is installed in at least one service slot in a one-to-one correspondence. The at least one line card is installed in at least one service slot in a one-to-one correspondence, or, the at least one line card is a plurality of line cards, and at least two of the plurality of line cards are installed in the same service slot. The line card and the network board are installed in different service slots. Each of the at least one network board is connected to the second end of the network board connector 13, for example, each network board is connected to the second end of the network board connector 13 via a cable, and each of the at least one line card is connected to the backplane connector 123 corresponding to the service slot where the line card is located. In one embodiment, the communication device is as follows: Fig.17 As shown, in Figure 4 On the basis of the communication device shown, the communication device also includes line cards A1~A6 and network boards B1~B4, line cards A1~A6 are installed in service slots 1~6, each line card in line cards A1~A6 is connected to the backplane connector 123 corresponding to the service slot where each line card is located, network boards B1~B4 are installed in service slots 7~10, each network board in network boards B1~B4 is connected to the second end of the network board connector 13 through a cable (that is, each network board in network boards B1~B4 is connected to the network board connector 13 on the panel side), thereby, each line card in line cards A1~A6 is connected to at least one network board in network boards B1~B4. Fig.17 The service slots 10 to 16 in the communication device shown are vacant, and the 16 service slots in the communication device are not all filled. Fig.17 The capacity of the communication device shown is relatively small. In actual applications, line cards and network boards can be installed in proportion in the service slots 10 to 16 to increase the capacity of the communication device.

[0103] In an embodiment of the present application, the at least one line card includes at least one of an electric line card, an optical line card, and an optoelectronic hybrid line card, and the at least one network board includes at least one of a power network board, an optical network board, and an optoelectronic hybrid network board.

[0104] In one example, the communication device includes a first cross unit 124 and does not include a second cross unit 14, the first cross unit 124 is an electrical cross unit, the at least one line card is an electrical line card, and the at least one network board is a network board.

[0105] In another example, the communication device includes the first cross unit 124 and does not include the second cross unit 14, the first cross unit 124 is an optical cross unit, the at least one line card is an optical fiber card, and the at least one network board is an optical network board.

[0106] In another example, the communication device includes a first cross unit 124 and does not include a second cross unit 14, the first cross unit 124 is an optoelectronic hybrid cross unit, the at least one line card includes at least one of an electrical line card, an optical fiber card, and an optoelectronic hybrid line card, and the at least one network board includes at least one of a network board, an optical network board, and an optoelectronic hybrid network board.

[0107] In another example, the communication device includes a first cross unit 124 and a second cross unit 14, the first cross unit 124 and the second cross unit 14 are both electrical cross units, the at least one line card is an electrical line card, and the at least one network board is a network board.

[0108] In another example, the communication device includes a first cross unit 124 and a second cross unit 14, the first cross unit 124 and the second cross unit 14 are both optical cross units, the at least one line card is an optical fiber card, and the at least one network board is an optical network board.

[0109] In another example, the communication device includes a first cross unit 124 and a second cross unit 14, both of which are optoelectronic hybrid cross units, the at least one line card includes at least one of an electrical line card, an optical fiber card, and an optoelectronic hybrid line card, and the at least one network board includes at least one of a network board, an optical network board, and an optoelectronic hybrid network board.

[0110] In an embodiment of the present application, the line card includes at least one NP chip, multiple service optical modules and multiple line card connectors, each of the at least one NP chip is connected to at least one service optical module of the multiple service optical modules, different NP chips are connected to different service optical modules, each of the at least one NP chip is connected to at least one line card connector of the multiple line card connectors, different NP chips are connected to different line card connectors, the service optical module is used to send and receive optical signals and convert optical signals and electrical signals, the NP chip is used to process electrical signals, and the line card connector is used to send and receive signals. The line card connector in the wire card is a wire card connector, which is used to output electrical signals processed by the NP chip and receive electrical signals to be processed by the line card. The line card connector in the optical card is an optical card connector, and the optical card also includes an optical engine (OE) connected between the NP chip and the optical card connector, the OE is used to convert optical signals and electrical signals between the NP chip and the optical card connector, and the optical card connector is used to output optical signals processed by the NP chip and converted by the OE and receive optical signals to be processed by the line card. The multiple line card connectors in the optoelectronic hybrid line card include an optical card connector and an electrical wire card connector. The optoelectronic hybrid line card also includes an OE connected between the NP chip and the optical card connector. The electrical wire card connector is used to output the electrical signal processed by the NP chip and receive the electrical signal to be processed by the line card. The OE is used to convert the optical signal and the electrical signal between the NP chip and the optical card connector. The optical card connector is used to output the optical signal processed by the NP chip and converted by the OE and receive the optical signal to be processed by the line card. Among them, the optical engine is also called an on-board optical module or a board-mounted optical module.

[0111] The following three embodiments introduce the wire card, optical fiber card and optoelectronic hybrid line card.

[0112] In one embodiment, Fig.18: This is a schematic diagram of an electric wire card provided in an embodiment of the present application. The electric wire card includes k NP chips, k×m service optical modules and k×p line card connectors, where k, m, and p are all positive integers, for example, k=4 and p=2. The k×p line card connectors are all electric wire card connectors. Each of the k NP chips is connected to m service optical modules in the k×m service optical modules, and different NP chips are connected to different service optical modules. Each of the k NP chips is connected to p line card connectors in the k×p line card connectors, and different NP chips are connected to different line card connectors. In one example, each of the k×m service optical modules is used to convert an optical signal received by each service optical module from outside the electric wire card into an electrical signal, and transmit the electrical signal to a corresponding NP chip, which is used to process the electrical signal and output the processed electrical signal through a corresponding line card connector. In another example, each of the k×p line card connectors is used to receive an electrical signal from outside the line card and transmit the electrical signal to a corresponding NP chip. The NP chip is used to process the electrical signal and transmit the processed electrical signal to a corresponding service optical module. The service optical module is used to convert the electrical signal into an optical signal and emit it.

[0113] In another embodiment, Fig.19: This is a schematic diagram of a fiber optic card provided in an embodiment of the present application. The fiber optic card includes k NP chips, k×m business optical modules, k×p OEs and k×p line card connectors, where k, m, and p are all positive integers, for example, k=4 and p=2. The k×p line card connectors are all fiber optic card connectors. Each of the k NP chips is connected to m business optical modules in the k×m business optical modules, and different NP chips are connected to different business optical modules. Each of the k NP chips is connected to p OEs in the k×p OEs, and different NP chips are connected to different OEs. The k×p OEs are connected to the k×p line card connectors in a one-to-one correspondence. In one example, each of the k×m service optical modules is used to convert an optical signal received by each service optical module from outside the optical fiber card into an electrical signal, and transmit the electrical signal to a corresponding NP chip, and the NP chip is used to process the electrical signal, and transmit the processed electrical signal to a corresponding OE, and the OE is used to convert the processed electrical signal into an optical signal, and output the optical signal through a corresponding line card connector. In another example, each of the k×p line card connectors is used to receive an optical signal from outside the optical fiber card, and transmit the optical signal to a corresponding OE, and the OE is used to convert the optical signal into an electrical signal, and transmit the electrical signal to a corresponding NP chip, and the NP chip is used to process the electrical signal, and transmit the processed electrical signal to a corresponding service optical module, and the service optical module is used to convert the electrical signal into an optical signal and output it.

[0114] In yet another embodiment, Fig. 20 : This is a schematic diagram of an optoelectronic hybrid line card provided in an embodiment of the present application. The optoelectronic hybrid line card includes k NP chips, k×m service optical modules, q×p OEs and k×p line card connectors, where k, m, q, and p are all positive integers, and q is less than k, for example, k=4 and p=2. The k×p line card connectors include q×p optical fiber card connectors and (kq)×p wire card connectors. Each of the k NP chips is connected to m service optical modules in the k×m service optical modules, and different NP chips are connected to different service optical modules. Each of the NP chips 1 to q is connected to p of the q×p OEs, and different NP chips are connected to different OEs. The q×p OEs are connected to the q×p optical fiber card connectors in a one-to-one correspondence. Each of the NP chips q+1 to k is connected to p of the (kq)×p wire card connectors, and different NP chips are connected to different wire card connectors. The working process of the optoelectronic hybrid line card can refer to the working process of the above-mentioned electric line card and the working process of the above-mentioned optical line card, which will not be described in detail here.

[0115] Figures 18 to 20There are many NP chips in the line card shown, and the specifications of the line card are large. Each service slot in the embodiment of the present application is used to install Figures 18 to 20 In some embodiments, due to Figures 18 to 20 Each NP chip in the line card and its connected service optical module, line card connector, etc. are independent of each other and do not cross each other. Figures 18 to 20 The line card shown is divided into line cards with smaller specifications. Each line card obtained by division includes fewer NP chips. Each service slot in the embodiment of the present application can be installed with multiple line cards obtained by division. Fig.18 or Fig. 20 The wire cards obtained by dividing the wire cards shown in FIG. Fig.21 As shown, Fig.19 or Fig. 20 The light card obtained by dividing the line card shown in Fig. 22 shown. Fig.21 and Fig. 22 The power module and control module of the line card shown ( Fig.21 and Fig. 22 In some embodiments, the power modules and control modules of the multiple line cards obtained by segmentation can be set on a shared board independent of the multiple line cards, so that Fig.18 The wire card shown in the figure is divided into the wire card Fig.23 As shown, Fig.19 The light card shown in the figure is divided into the light card Fig.24 As shown, Fig. 20 The line cards obtained by dividing the optical-electric hybrid line card shown in FIG. Fig.25 shown. Figure 23 to Figure 25 The scenarios shown all include a shared board and k line cards. The shared board is independent of the k line cards. The power modules and control modules of the k line cards are included on the shared board. The k line cards can be independently plugged into the shared board. In actual applications, the shared board can be set in a service slot and located at the bottom of the service slot. When at least one line card is installed in the service slot, the line card connector on the at least one line card is connected to the backplane connector at the bottom of the service slot through the shared board. In addition, Fig.17 The line card in the communication device shown may be Figures 18 to 25 The present application provides a smaller-scale line card, which is beneficial to reducing manufacturing costs, reducing the capacity of the line card sold to users, and facilitating users to invest on demand.

[0116] In an embodiment of the present application, the mesh board includes at least one switching chip and a plurality of mesh board connectors, each of the at least one switching chip is connected to at least one mesh board connector of the plurality of mesh board connectors, different switching chips are connected to different mesh board connectors, the mesh board connector is used to send and receive signals, and the switching chip is used to exchange and process electrical signals. The mesh board connector in the power grid board is a power grid board connector, and the power grid board connector is used to send and receive electrical signals (for example, receiving electrical signals from outside the mesh board and sending electrical signals processed by the switching chip to the outside of the mesh board). The mesh board connector in the optical mesh board is an optical mesh board connector, and the optical mesh board connector is used to receive and receive optical signals. The optical mesh board also includes an OE connected between the switching chip and the optical mesh board connector, and the OE is used to convert optical signals and electrical signals between the switching chip and the optical mesh board connector. The multiple mesh board connectors in the optoelectronic hybrid mesh board include an optical mesh board connector and a grid board connector. The optoelectronic hybrid mesh board also includes an OE connected between the switching chip and the optical mesh board connector. The optical mesh board connector is used to send and receive optical signals, and the grid board connector is used to send and receive electrical signals. The OE is used to convert optical signals and electrical signals between the switching chip and the optical mesh board connector.

[0117] The following three embodiments introduce the power grid board, optical grid board and optoelectronic hybrid grid board.

[0118] In one embodiment, Fig.26 : This is a schematic diagram of a power grid board provided in an embodiment of the present application. The power grid board includes w switching chips and w×v grid board connectors, where w and v are both positive integers. The w×v grid board connectors are all power grid board connectors. Each of the w switching chips is connected to v grid board connectors among the w×v grid board connectors, and different switching chips are connected to different grid board connectors. For example, each of the w×v grid board connectors is used to receive an electrical signal from outside the power grid board, and transmit the electrical signal to a corresponding switching chip, which is used to perform switching processing on the electrical signal, and transmit the switched electrical signal to a corresponding grid board connector, which is used to output the switched electrical signal.

[0119] In another embodiment, Fig. 27It is a schematic diagram of an optical mesh board provided in an embodiment of the present application. The optical mesh board includes w switching chips, w×v OEs and w×v mesh board connectors, where w and v are both positive integers. The w×v mesh board connectors are all optical mesh board connectors. Each of the w switching chips is connected to v OEs in the w×v OEs, and different switching chips are connected to different OEs. The w×v OEs are connected to the w×v mesh board connectors in a one-to-one correspondence. For example, each of the w×v mesh board connectors is used to receive an optical signal from outside the grid board, and transmit the optical signal to the corresponding OE, the OE is used to convert the optical signal into an electrical signal, and transmit the electrical signal to the corresponding switching chip, the switching chip is used to perform switching processing on the electrical signal, and transmit the switched electrical signal to the corresponding OE, the OE is used to convert the switched electrical signal into an optical signal, and transmit the optical signal to the corresponding mesh board connector, and the mesh board connector is used to output the optical signal.

[0120] In yet another embodiment, Fig.28 : This is a schematic diagram of an optoelectronic hybrid grid board provided in an embodiment of the present application. The optoelectronic hybrid grid board includes w switching chips, w×v grid board connectors and multiple OEs, where w and v are both positive integers. The w×v grid board connectors include an optical grid board connector and a grid board connector (for example, the w×v grid board connectors include v grid board connectors corresponding to each of the w switching chips, and the v grid board connectors corresponding to each switching chip include an optical grid board connector and a grid board connector). Each of the w switching chips is connected to the v grid board connectors corresponding to each switching chip, and an OE is connected between each switching chip and the optical grid board connector corresponding to each switching chip. The working process of the optoelectronic hybrid grid board can refer to the working process of the grid board and the working process of the optical grid board.

[0121] It should be noted that Fig.28 Taking the example that the v mesh board connectors corresponding to each switching chip include optical mesh board connectors and grid board connectors, in the optoelectronic hybrid mesh boards provided in other embodiments, the mesh board connectors corresponding to some switching chips are optical mesh board connectors, and / or, the mesh board connectors corresponding to other switching chips are grid board connectors, and / or, the mesh board connectors corresponding to some other switching chips include optical mesh board connectors and grid board connectors. Figure 26 to Figure 28 Only part of the structure of the mesh board is shown exemplarily. The mesh board also includes other structures. For example, the mesh board also includes a power module for powering the mesh board, a control module for controlling the operation of the mesh board, etc. The embodiments of the present application do not limit this.

[0122] In an optional embodiment, if Figures 3 to 6 , Figure 8 , Fig.10 , Fig.11 , Fig.17 As shown in any one of the embodiments of the present application, in the communication device provided, the frame 11 also includes a plurality of other functional slots ( Figures 3 to 6 , Figure 8 , Fig.10 , Fig.11 , Fig.17 Taking two functional slots as an example), the multiple other functional slots are used to install other functional modules. For example, the multiple other functional slots include a main control board slot, and the main control board slot is used to install the main control board. In addition, the communication device also includes a power module 15, a heat dissipation component ( Figures 3 to 6 , Figure 8 , Fig.10 , Fig.11 , Fig.17 The power module 15 is used to supply power to the communication device, and the heat dissipation component is used to dissipate heat for the communication device, for example, the heat dissipation component is a fan. In addition to the structures listed in the above embodiments, the communication device also includes other structures, such as the basic hardware structure of the cluster router. Regarding other basic hardware structures in the communication device, the embodiments of the present application will not be described in detail here.

[0123] To summarize, in the communication device provided in the embodiment of the present application, the backplane includes a backplane body and a protruding portion protruding toward the panel side relative to the backplane body, the protruding portion has a mesh board connector and the end of the mesh board connector for connecting the mesh board is located on the side of the protruding portion away from the backplane body. Therefore, the mesh board connector is used to connect the mesh board on the panel side, and the corresponding mesh board can be called an outward-facing mesh board. When the communication device provided by the embodiment of the present application is in use, at least one line card can be installed in some service slots, so that the at least one line card is connected to the backplane connector at the bottom of the service slot where it is located, and at least one mesh board can be installed in other service slots, and the at least one mesh board can be connected to the second end of the mesh board connector on the raised part of the backplane on the panel side, so that the at least one line card is connected to the at least one mesh board through the backplane connector and the mesh board connector to realize the single-frame working mode; in addition, the signal transmitted by any NP chip in the at least one line card is transmitted to another NP chip in the at least one line card after passing through a switching chip in the at least one mesh board, and the any NP chip is connected to the one switching chip with the other NP chip, thereby realizing single-stage switching. The embodiment of the present application adopts a convex backplane combined with an outward mesh board to realize a single-stage switching communication device that can flexibly and conveniently support a single-frame working mode, and the communication device can flexibly and conveniently realize the switching between the single-frame working mode and the multi-frame working mode. The communication device only needs one network board to realize the single-frame working mode and the cluster working mode. When switching between the single-frame working mode and the cluster working mode, there is no need to disassemble and install the network board, so the implementation cost is low and the maintenance difficulty is small.

[0124] In addition, the convex backplane provided in the embodiment of the present application can reduce the depth of the communication device (the depth direction of the communication device is parallel to the depth direction of the service slot, and the depth of the communication device is also called thickness). Figure 4 As shown, if the backplane in the communication device is set to a traditional I-shaped backplane (a backplane excluding a raised portion, and the thickness of different positions of the I-shaped backplane is equal), in order to set the first cross unit 124 in the cavity of the I-shaped backplane, the thickness of the I-shaped backplane needs to be at least equal to the thickness of the position where the raised portion 122 of the convex I-shaped backplane is located, for example, the thickness of the I-shaped backplane needs to be greater than 150 mm, then the depth of the communication device is at least equal to the sum of the thickness of the I-shaped backplane and the depth of the service slot, and the depth of the communication device is relatively large; the present application sets the backplane 12 as a convex I-shaped backplane, so that the depth of the communication device is equal to the sum of the thickness of the backplane body 122 of the backplane 12 and the depth of the service slot, compared with the thickness of the position where the raised portion 122 of the convex I-shaped backplane is located, the thickness of the backplane body 122 is smaller, for example, the thickness of the backplane body 122 is about 60 mm, so the depth of the communication device is relatively small.

[0125] In the communication device provided in the embodiment of the present application, the mesh board is connected to the mesh board connector in the communication device on the panel side of the communication device, and the mesh board does not need to be connected to the communication device on the backplane side, which can reduce the insertion loss on the backplane side. In addition, the communication device supports optical communication mode and electrical communication mode. In a scenario with a small communication capacity, a wire card and a network board can be configured in the communication device to support the electrical communication mode of the communication device to reduce the power consumption of the communication device; in a scenario with a large communication capacity, a light card and an optical network board can be configured in the communication device to support the optical communication mode of the communication device to increase the communication distance of the communication device.

[0126] The communication device provided in the embodiment of the present application may be a frame-type communication device, and the communication device is a single-stage switching communication device, for example, the communication device is a single-stage switching cluster router. The communication device supports a single-frame working mode and a multi-frame working mode. In the single-frame working mode and the multi-frame working mode, the network boards supported by the communication device are the same, and the line cards supported by the communication device are the same. The communication device can flexibly and conveniently support the single-frame working mode and the multi-frame working mode, flexibly and conveniently switch between the single-frame working mode and the multi-frame working mode, and flexibly and conveniently support a variety of cluster frame numbers. There is no need to configure a single-frame network board and a cluster network board for the communication device to support the single-frame working mode and the multi-frame working mode. The implementation cost of the communication device is low and the maintenance difficulty is relatively low.

[0127] For example, in the single-frame working mode, the physical form of the communication device is as follows Fig.17As shown, the signal transmitted by any NP chip in the communication device is transmitted to another NP chip in the communication device after passing through a switching chip in the communication device, and the any NP chip and the other NP chip are connected to the switching chip, thereby realizing single-stage switching and a single-frame working mode. For example, Fig.17 As shown, a signal transmitted by an NP chip (eg, NP chip 1) in line card A1 is transmitted to another NP chip (eg, NP chip 2) in line card A1 after passing through a switching chip in network board B1, and the NP chip 1 and the NP chip 2 are connected to the switching chip.

[0128] Based on the same inventive concept as the above embodiment, the embodiment of the present application provides a communication system, the communication system includes at least two communication devices as provided in the above embodiment, the at least two communication devices are in communication connection, the at least two communication devices are in cluster working mode, and the communication system can also be called a device cluster. For example, the communication system includes a first communication device and a second communication device, the first communication device and the second communication device are in communication connection, and the first communication device and the second communication device are both the communication devices provided in the above embodiment.

[0129] The cluster working mode is described below in two embodiments in conjunction with a communication system.

[0130] In a first embodiment, the communication system includes a first communication device and a second communication device, both of which are communication devices provided in the above embodiments, the first communication device includes at least one network board, the second communication device includes at least one line card, the at least one network board is connected to the network board connector in the second communication device, so that the at least one line card in the second communication device is connected to the at least one network board in the first communication device, and a signal transmitted by any NP chip in the second communication device is transmitted to another NP chip in the second communication device after passing through a switching chip in the first communication device, and any NP chip is connected to the other NP chip by the switching chip, thereby realizing single-stage switching and cluster working mode. In one example, the communication system is as follows: Fig.29As shown, the first communication device includes network boards B1~B7, and the second communication device includes line cards A1~A6. The network boards B1~B7 are installed in the service slots 5~11 of the first communication device, and the line cards A1~A6 are installed in the service slots 1~6 of the second communication device. Each line card in the line cards A1~A6 is connected to the backplane connector 123 corresponding to the service slot where each line card is located, and the backplane connector 123 corresponding to the service slot where each line card in the line cards A1~A6 is located is connected to the first end of the network board connector 13 in the second communication device, and each network board in the network boards B1~B7 is connected to the second end of the network board connector 13 in the second communication device. For example, a signal transmitted by an NP chip (for example, NP chip 1) in the line card A1 is transmitted to an NP chip (for example, NP chip 2) in the line card A2 after passing through a switching chip in the network board B1. The NP chip 1 and the NP chip 2 are connected to the one switching chip, thereby realizing single-stage switching and cluster working mode. As shown Fig.29 As shown, service slots 1 to 4 and 12 to 16 in the first communication device are vacant, service slots 7 to 16 in the second communication device are vacant, and the 16 service slots in the first communication device and the 16 service slots in the second communication device are not fully populated. Fig.19 The capacity of the communication system shown is relatively small. In practical applications, network boards can be installed in service slots 1 to 4 and 12 to 16 in the first communication device, and line cards can be installed in service slots 7 to 16 in the second communication device to increase the capacity of the communication system.

[0131] In the first embodiment, both the first communication device and the second communication device can be frame-type communication devices, the service slots in the first communication device can be used to install the network board but not to install the line card, and the service slots in the second communication device can be used to install the line card but not to install the network board, therefore, the first communication device is also called a switching frame, and the second communication device is also called a line card frame. In addition, in the first embodiment, since the service slots in the first communication device are used to install the network board but not to install the line card, and the network board is not connected to the backplane connector 123 in the first communication device, in some embodiments, the first communication device can be set not to include the backplane 12 to reduce the cost of the first communication device.

[0132] In a second embodiment, the communication system includes a first communication device and a second communication device, the first communication device and the second communication device are both communication devices as provided in the above embodiment, the first communication device and the second communication device respectively include multiple network boards and at least one line card; the first communication device and the second communication device satisfy at least one of the following: all or part of the network boards in the first communication device are connected to the network board connector in the second communication device; all or part of the network boards in the second communication device are connected to the network board connector in the first communication device. Optionally, all network boards in the first communication device are connected to the network board connector in the first communication device, and all network boards in the first communication device are connected to the network board connector in the second communication device, all network boards in the second communication device are connected to the network board connector in the second communication device, and all network boards in the second communication device are connected to the network board connector in the first communication device. In one example, the communication system is as Fig.30As shown, the first communication device includes line cards A1-A12 and network boards B1-B4, the second communication device includes line cards A13-A14 and network boards B5-B8, the line cards A1-A12 are installed in service slots 1-6 and 11-16 of the first communication device, the network boards B1-B4 are installed in service slots 7-10 of the first communication device, the line cards A13-A14 are installed in service slots 1-2 of the second communication device, the network boards B5-B8 are installed in service slots 7-10 of the second communication device, each of the line cards A1-A12 is connected to the backplane connector 123 corresponding to the service slot where each line card is located, and the service slot where each line card A1-A12 is located corresponds to the backplane connector 123 of ... The backplane connector 123 is connected to the first end of the mesh board connector 13 in the first communication device, each of the line cards A13-A14 is connected to the backplane connector 123 corresponding to the service slot where each line card is located, and the backplane connector 123 corresponding to the service slot where each line card is located in the line cards A13-A14 is connected to the first end of the mesh board connector 13 in the second communication device, the mesh boards B1-B4 are connected to the second end of the mesh board connector 13 in the first communication device and to the second end of the mesh board connector 13 in the second communication device, and the mesh boards B5-B8 are connected to the second end of the mesh board connector 13 in the first communication device and to the second end of the mesh board connector 13 in the second communication device. In one example, a signal transmitted by an NP chip (for example, NP chip 1) in the line card A1 is transmitted to an NP chip (for example, NP chip 2) in the line card A2 after passing through a switching chip in the mesh board B5, and the NP chip 1 is connected to the one switching chip with the NP chip 2, thereby realizing single-stage switching and cluster working mode. In another example, a signal transmitted by an NP chip (e.g., NP chip 1) in line card A1 is transmitted to an NP chip (e.g., NP chip 3) in line card A13 after passing through a switching chip in network board B5. The NP chip 1 and the NP chip 3 are connected to the switching chip, thereby realizing single-stage switching and cluster working mode. Fig.30 As shown, service slots 3 to 6 and 11 to 16 in the second communication device are vacant, and the 16 service slots in the second communication device are not fully populated. In actual applications, line cards and / or network boards can be installed in the service slots 3 to 6 and 11 to 16 to increase the capacity of the communication system.

[0133] In the second embodiment, the first communication device and the second communication device can both be frame-type communication devices, and the service slots in the first communication device and the service slots in the second communication device are both used to install line cards and network boards, so the first communication device and the second communication device are also called hybrid frames.

[0134] The term "at least one" in this application refers to one or more, and "plurality" refers to two or more. The term "and / or" is merely a description of the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, in order to facilitate clear description, in this application, the words "first", "second", "third" and the like are used to distinguish between identical or similar items with substantially the same functions and effects. Those skilled in the art will understand that the words "first", "second", "third" and the like do not limit the quantity and execution order.

[0135] In the corresponding embodiments provided in the present application, it should be understood that the disclosed devices and the like can be implemented by other configuration methods. For example, the device embodiments described above are only illustrative, for example, the division of modules is only a logical function division, and there may be other division methods in actual implementation, for example, multiple modules or components can be combined or integrated into another system, or some features can be ignored.

[0136] The modules described as separate components may or may not be physically separate, and the components described as modules may or may not be physical modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0137] The above is only an exemplary embodiment of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application shall be based on the protection scope of the claims.

Claims

1. A communication device, characterized in that: include: Frame and back panel; The frame has a panel side and a backplane side, the frame includes a plurality of service slots, the entrance of the service slot is located on the panel side, the bottom of the service slot is located on the backplane side, and the service slot is used to install a line card or a network board; The backplane is located at the backplane side, the backplane includes a backplane body and a raised portion raised toward the panel side relative to the backplane body, the backplane body has a backplane connector corresponding to the service slot, different service slots correspond to different backplane connectors, the backplane connector is located at the bottom of the corresponding service slot, the raised portion has a mesh board connector, the first end of the mesh board connector is connected to the backplane connector, the second end of the mesh board connector is used to connect the mesh board, and the second end of the mesh board connector is located on the side of the raised portion away from the backplane body; Wherein, when at least one line card and at least one network board are installed in the multiple service slots, the at least one line card is connected to the backplane connector at the bottom of the corresponding service slot, the at least one network board is connected to the network board connector, and any two network processor NP chips in the at least one line card are connected to a switching chip in the at least one network board.

2. The communication device according to claim 1, characterized in that The backplane includes a first cross unit, the first cross unit is located at the protruding portion, the mesh board connector is located on a surface of the first cross unit away from the backplane body, and the first end of the mesh board connector is connected to the backplane connector through the first cross unit.

3. The communication device according to claim 2, characterized in that The backplane has a cavity, the first cross unit is located in the cavity, the mesh board connector is located in an opening on the cavity wall of the cavity, the first end of the mesh board connector is located in the cavity, and the second end of the mesh board connector is located outside the cavity.

4. The communication device according to claim 1, characterized in that The backplane includes a first cross unit, and the communication device also includes a second cross unit, the first cross unit is located on the raised portion, the second cross unit is plugged into a side of the first cross unit away from the backplane body, the mesh board connector is located on a side of the second cross unit away from the first cross unit, the first end of the mesh board connector is connected to the backplane connector through the second cross unit and the first cross unit, and the second end of the mesh board connector is located on a side of the second cross unit away from the first cross unit.

5. The communication device according to claim 4, characterized in that The backplane has a cavity, the first cross unit is located in the cavity, the first cross unit has a connector on a surface away from the backplane body, the connector is located in an opening on the cavity wall of the cavity, the second cross unit is located outside the cavity, and the second cross unit is plugged into the connector.

6. The communication device according to claim 4 or 5, characterized in that: The cross granularity of the second cross unit is smaller than the cross granularity of the first cross unit.

7. The communication device according to any one of claims 2 to 6, characterized in that: The first cross unit is an electrical cross unit, an optical cross unit or an optoelectronic hybrid cross unit.

8. The communication device according to any one of claims 1 to 7, characterized in that: The entrance ends of the plurality of service slots are flush with each other, and the second end of the mesh board connector is recessed toward the backplane side relative to the entrance end of the service slot.

9. The communication device according to any one of claims 1 to 8, characterized in that: The raised portion is located in the middle of the backplane body, and the plurality of service slots are distributed on both sides of the raised portion.

10. The communication device according to any one of claims 1 to 9, characterized in that: The communication device comprises a plurality of back plates, each of which is strip-shaped, and a length direction of the back plates is parallel to a height direction of the frame. The plurality of back plates are arranged along a first direction, and the first direction is perpendicular to the height direction of the frame.

11. The communication device according to claim 10, characterized in that The plurality of back plates are independent of each other, and the distances between the protruding parts of the plurality of back plates and the bottom surface of the frame are equal.

12. The communication device according to any one of claims 1 to 11, characterized in that: Each of the service slots is used to install a network board, or each of the service slots is used to install one or more line cards.

13. The communication device according to any one of claims 1 to 12, characterized in that: The communication device further includes the at least one line card and / or the at least one network board.

14. The communication device according to any one of claims 1 to 13, characterized in that: The at least one line card includes at least one of an electric line card, an optical line card, and an optoelectronic hybrid line card; The at least one grid board includes at least one of a grid board, an optical grid board and an optoelectronic hybrid grid board.

15. The communication device according to any one of claims 1 to 14, characterized in that: The communication device is a cluster communication device.

16. The communication device according to any one of claims 1 to 15, characterized in that: The communication device supports a single-frame working mode and a multi-frame working mode.

17. A communication system, characterized in that: The invention comprises a first communication device and a second communication device, wherein the first communication device and the second communication device are communicatively connected, and the first communication device and the second communication device are both the communication devices according to any one of claims 1 to 16.

18. The communication system according to claim 17, characterized in that: The first communication device includes at least one network board, and the second communication device includes at least one line card. The at least one network board is connected to a network board connector in the second communication device.

19. The communication system according to claim 17, characterized in that: The first communication device and the second communication device respectively include at least one network board and at least one line card, and the first communication device and the second communication device meet at least one of the following conditions: All or part of the network boards in the first communication device are connected to the network board connector in the second communication device; All or part of the network boards in the second communication device are connected to the network board connector in the first communication device.

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