3D-TOF imaging method and system

Abstract

The invention provides a 3D-TOF imaging method and system, and the method comprises the steps: carrying out the shooting of an environment in each application scene, and obtaining an original image in the environment; the method comprises the following steps: reading the intensity of ambient light, controlling an FB reference voltage fed back by an output voltage by adjusting a PWM duty ratio according to the distance of a target person or object and the intensity of light, and adjusting an output voltage value through the FB reference voltage, thereby adjusting and controlling the LED voltage of a lighting system, achieving the adjustment of the LED lighting intensity, and carrying out the compensation processing of an original image. And the image data subjected to compensation processing is wirelessly transmitted and sent to a user terminal. The imaging system is subjected to multifunctional optimization, high speed, high performance and optimal real-time response are achieved, the system is suitable for a low-power-consumption, high-sensitivity and multi-scene imaging system, high performance, high reliability and long service life are achieved in cooperation with a high-capacity battery and solar charging, and the increasing experience requirement is met.

Description

Technical Field

[0001] The present invention relates to the technical field of TOF imaging, and in particular to a 3D-TOF imaging method and system. Background Art

[0002] With the rapid development of the Internet of Things, the Internet of Everything has entered thousands of households. The Internet of Things refers to the interconnection of various physical devices, sensors and electronic devices to achieve data interaction and intelligent control through the Internet. IoT products not only need to have high-definition imaging, but also require functional requirements such as motion capture, temperature and humidity monitoring, and data transmission.

[0003] ToF is the abbreviation of Time of Flight, also known as time-of-flight 3D imaging. This imaging technology emits continuous infrared light pulses of a specific wavelength to the target, receives the light signal sent back by the object to be measured through a specific sensor, calculates the round-trip flight time or phase difference of the light to obtain the 3D depth information of the object to be measured, and the brightness image of the ToF camera can be quickly connected through the model.

[0004] However, the existing ToF imaging devices on the market worldwide generally have a shorter measuring distance than conventional measuring instruments: generally not more than 10 meters; the measurement results are affected by the properties of the object being measured; the measurement results of most ToF imaging machines are significantly affected by the external environment, especially by external light sources; the resolution is relatively low, and the systematic error and random error have a significant impact on the results, requiring post-data processing, etc. Therefore, the existing 3D-ToF imaging systems inevitably have defects such as single function, poor performance, low reliability, high power consumption, and short service life, and the user experience is relatively low. Summary of the invention

[0005] In view of this, the purpose of the present invention is to design a 3D-TOF imaging method and system, to optimize the multi-function of the imaging system, to use the MCU main control chip to control the image sensor to capture images in the environment, to use synchronous dynamic random access memory SDRAM as a memory, to use a 3D-TOF imaging chip to output imaging data, and to combine it with Bluetooth transmission, so that not only can the sensor be read but also data can be transmitted, achieving high speed, high performance, and optimal real-time response, which is suitable for low-power, high-sensitivity, and multi-scenario imaging systems, achieving high-performance, high-reliability, and long-life product performance, and meeting users' growing experience needs.

[0006] The present invention provides a 3D-TOF imaging method, comprising the following steps: Photograph the environment in each application scenario to obtain the original image in the environment; Specifically, the MCU main control chip transmits and controls data with the imaging chip through DDR high-speed signals, and the MCU main control chip reads storage content with the imaging chip through the I2C integrated circuit bus.

[0007] Read the intensity of ambient light, and according to the distance of the target person or object and the intensity of light, adjust the FB reference voltage of the output voltage feedback by adjusting the PWM duty cycle, adjust the output voltage value by the FB reference voltage, thereby adjusting the LED voltage of the control lighting system, and adjusting the LED lighting intensity, and compensating the original image, and wirelessly transmitting the compensated image data to the user terminal; Preferably, the imaging chip includes three working modes, which can achieve low power consumption in different environments, mainly including: illumination modulation mode, distance measurement mode and non-distance measurement mode.

[0008] Among them, the lighting adjustment mode includes: reading the ambient light intensity through the ambient light sensor, and the MCU main control chip adjusts the output voltage (PSU_VSEL) through the PWM duty cycle to feedback to the FB reference voltage of the buck DCDC chip, and adjusts the output voltage value (VDD_LED) of the buck DCDC chip, thereby adjusting the control LED voltage to adjust the LED lighting intensity. Make corresponding lighting compensation according to the specific environment.

[0009] Exemplarily, the adjustment gears of the PWM duty cycle include: 0%, 20%, 40%, 60%, 80%, 100%, the gears for controlling the output voltage (PSU_VSEL) include: 0V, 0.12V, 0.24V, 0.36V, 0.48V, 0.6V, and the gears for adjusting and controlling the LED voltage (VDD_LED) include: 4.98V, 4.7028V, 4.4256V, 4.1484V, 3.8712V, 3.594V, as shown in Table 2: Table 2

[0010] .

[0011] Distance measurement modes include full pixel field measurements at the following resolution rates: (1) 39 fps 3D TOF, 4x DCS frames, full pixel field; (2) 79 fps 3D TOF with 2x DCS frames, full pixel field; (3) 158 fps 3D TOF, rolling readout 4x DCS frames, full pixel field; Ultra-fast measurements can be achieved by reducing the ROI of the pixel field; The SHUTTER release allows precise start / stop and single / continuous measurement control.

[0012] The distance measurement can be checked by checking the DCS value, which contains not only the distance information but also the quality and validity (confidence) of the received light signal. The higher the signal amplitude of the received signal, the better and more accurate the distance measurement. Each distance measurement for each pixel has its own validity and quality. The main quality indicator of the data for measuring the distance is the amplitude of the received modulated light ATOF, which is directly related to the distance noise.

[0013] For example, the amplitude can be calculated as follows (as shown in Table 1): Table 1

[0014] In Table 1, AmplitudeA TOF is the amplitude, Classification is the classification, and Action is the action.

[0015] Non-distance measurement modes (grayscale modes) include: Ambient light measurement (grayscale image without illumination), or, grayscale image with active illumination; Grayscale mode allows the imaging chip epc660 to be used as a grayscale imager, which can be used for ambient-light measurements without LED / LD illumination or for active illumination of the scene with LED / LD. Grayscale measurements are performed using differential coulomb spectroscopy DCS measurements, using the global illumination algorithm MGA through differential readings, the MGA keeps all integration times, and the data output format is a signed integer 12 bits: ± 2'047 LSB. The valid data range is 0 ... +2'047. As the system noise is close to zero, the readings may show small negative numbers. As the distance measurement results are affected by ambient light, the grayscale measurement without illumination can be used as an important quality and correction parameter for the distance measurement.

[0016] In grayscale mode, the irradiance EBW of the grayscale signal on the pixel surface can be calculated based on the DC sensitivity SBW (using the integration time) to calculate the white balance tINT-BW, the reference white balance tINT-REF-BW and the DCS0 of the grayscale signal, and then the irradiance EBW can be calculated: EBW = SBW⋅(t INT-REF-BW / t INT-BW )⋅DCS0.

[0017] Furthermore, when the ambient temperature and humidity, acceleration, and external power supply change, the environmental data change information is sent to the user terminal in real time for inspection and image processing, so that the image imaging maintains high-definition timeliness requirements.

[0018] Exemplarily, when the ambient temperature changes (such as caused by changes in external power supply, etc.), the MCU main control chip transmits the data change information to the low-power Bluetooth BLE chip, and the data change information is sent to the user terminal through the low-power Bluetooth BLE chip for viewing and maintenance, so that the imaging meets the high-definition timeliness requirements.

[0019] Preferably, the devices in the 3D-TOF imaging system can also be connected via a USB interface, a JTAG interface and a 3.3V serial port to inspect and process the image of the entire 3D-TOF imaging system.

[0020] The present invention also provides a 3D-TOF imaging system, which executes the 3D-TOF imaging method as described above, including: a sensor system, an imaging chip, a power system (powering the system), an MCU main control chip, a low-power Bluetooth BLE chip, and an SDRAM memory; the power system is electrically connected to the sensor system, the imaging chip, the MCU main control chip, and the low-power Bluetooth BLE chip respectively; the MCU main control chip and the low-power Bluetooth BLE chip are respectively connected to the SDRAM memory signal; Preferably, the imaging chip adopts an epc660 chip, and the MCU main control chip adopts an Arm Cortex_M7 chip.

[0021] Preferably, the power supply system includes three power supplies, which are: a main power supply, a solar charging power supply, and a battery. The present invention adopts three power supplies, and even in the working condition where there is no main power supply, the system can be powered by a battery alone, or the solar charging power supply can be used to power the system and charge the battery, thereby realizing the use of clean energy and reducing carbon dioxide emissions.

[0022] The sensor system includes: an image sensor, an acceleration sensor, and a temperature and humidity sensor; the image sensor is connected to the imaging chip signal; the acceleration sensor and the temperature and humidity sensor are connected to the MCU main control chip and the low-power Bluetooth BLE chip signal through the I2C integrated circuit bus respectively.

[0023] Specifically, the acceleration sensor and temperature and humidity sensor transmit the collected environmental information data to the MCU main control chip and the low-power Bluetooth BLE chip through the I2C integrated circuit bus; the imaging chip is set to sleep under specific circumstances where image acquisition is not required, which can achieve low power consumption and thus extend battery life, and can transmit information to the terminal for use via Bluetooth devices, so that users can monitor the camera information at any time.

[0024] Preferably, the MCU main control chip transmits and controls data with the imaging chip through DDR high-speed signals, and reads storage content with the imaging chip through the I2C integrated circuit bus; the imaging chip includes three working modes, which can achieve low power consumption in different environments, and the three working modes include: lighting modulation mode, distance measurement mode and non-distance measurement mode.

[0025] Specifically, under normal use, the MCU main control chip communicates data with the imaging chip to shoot in various scenes, and compensates based on distance, light intensity, etc., and can wirelessly transmit via Bluetooth to obtain the current environmental status and portrait collection information; in sleep mode, the system is in a low-power state, and the acceleration sensor and other sensors are also in low-power mode rather than shutdown.

[0026] Furthermore, the 3D-TOF imaging system includes: a battery management chip, the low-power Bluetooth BLE chip is signal-connected to the battery management chip via an I2C integrated circuit bus, and the battery management chip is electrically connected to the main power supply, the solar charging power supply, and the battery.

[0027] Specifically, a low-power Bluetooth BLE chip is used to determine and select the main power supply and battery power supply of the battery management chip through I2C, and to control the battery charging, and output a system voltage of 4.5V (main power supply) or 4.2V (battery) to improve power utilization efficiency; Furthermore, the 3D-TOF imaging system further includes: a low voltage difference linear voltage regulator LDO chip, a buck-type DCDC chip, and a buck-boost DCDC chip; the low voltage difference linear voltage regulator LDO chip is electrically connected to the battery management chip, the buck-type DCDC chip is electrically connected to the battery management chip; the buck-boost DCDC chip is electrically connected to the imaging chip; The system voltage is reduced to 3.3V through LDO (low dropout linear regulator) for use by 3D acceleration sensor, ambient light sensor, temperature and humidity sensor, and Bluetooth; Use a step-down DCDC chip to reduce the system voltage to 5.3V, and use a DCDC step-up / step-down power supply chip to generate a ±10V voltage to power the imaging chip, and convert the 5.3V voltage into a 3.3V voltage to power the MCU main control chip and SDRAM memory; The low-dropout linear regulator LDO chip, step-down DCDC chip, and buck-boost DCDC chip all have enable pins. By enabling the MCU, low-power mode and low-power sleep state can be achieved, which can turn off the power when not in use.

[0028] Furthermore, the 3D-TOF imaging system is configured with a lighting system that can be adjusted according to ambient light, and the lighting system includes two paths: one is an ambient light sensor, and the ambient light sensor is connected to the MCU main control chip signal. According to the intensity of the ambient light, the MCU main control chip controls the voltage of the lighting lamp to achieve changes in the intensity of the light, thereby meeting the lighting adjustment requirements under different ambient lights; the other is a lighting compensator, and an imaging glass chip is arranged inside the lighting compensator, and the imaging glass chip achieves high-definition and smooth imaging.

[0029] Furthermore, the 3D-TOF imaging system is configured with a USB interface, a JTAG interface, and a 3.3V serial port. The USB interface and the JTAG interface are electrically connected to the MCU main control chip; the 3.3V serial port is electrically connected to the low-power Bluetooth BLE chip.

[0030] Specifically, the MCU's main control chip is debugged through the USB interface, and JTAG is used for software download, which is safe and stable. Preferably, the USB interface can be adapted to various types of USB2.0 and USB3.0 to improve stability and reliability. The BLE chip uses the serial port 3.3V for debugging and the JTAG interface for software download; preferably, the antenna is adjusted with the Nodic antenna adjustment chip, which can achieve the best performance such as high power and long signal propagation distance.

[0031] Furthermore, the battery adopts a 5200mAh rechargeable lithium manganese battery. With a high-capacity 5200mAh battery and solar charging, multiple functions of outdoor automatic charging and charger charging can be realized. 5200mAh rechargeable lithium manganese battery has high energy density. Compared with other rechargeable batteries, lithium manganese battery can provide longer use time; long life, because lithium manganese oxide is used as the positive electrode material, it is not easy to expand and dissolve, so the battery life is long; low self-discharge rate, even if it is not used for a long time, it can maintain power for a long time; excellent environmental performance, does not contain heavy metals and other harmful substances, and is environmentally friendly; low price, the positive electrode active material uses electrolytic manganese dioxide, which is a relatively cheap positive electrode active material in lithium batteries, and can be widely promoted and applied; excellent electrical performance: its specific energy is 5 to 10 times that of dry batteries, the load voltage is 2.8V, the discharge voltage is relatively stable, and it can work in the range of -40 to +50℃; long storage life: under normal temperature conditions, the battery storage life exceeds 10 years, and the annual capacity decrease is about 1%; safe and reliable, no gas precipitation during storage and discharge, good safety.

[0032] Furthermore, the 3D-TOF imaging system is provided with a load power interface, and the load power interface is connected to a required load according to actual needs, thereby achieving richer product functions and application forms.

[0033] Furthermore, a plurality of (preferably 4) fixed connection holes are provided on the housing of the 3D-TOF imaging system, and the 3D-TOF imaging system is fixedly connected to the corresponding use area by a plurality of (preferably 4) screws, which greatly improves the convenience of use, and the installation operation is simple, and motion monitoring can be performed. The use of an acceleration sensor can dynamically adjust the camera state and machine performance under motion or stationary conditions.

[0034] Furthermore, a shell is provided on the outside of the 3D-TOF imaging system, and the structure of the shell is fully enclosed as a whole, preferably reaching IP67 level of waterproof, dustproof and anti-static. Preferably, the temperature and humidity sensor is connected to the battery management chip signal. The temperature and humidity sensor is used to monitor the ambient temperature and humidity, including monitoring the charging temperature. For example, if the ambient temperature is higher than 45°C, charging will not be performed. If it is lower than 45°C, charging will be resumed. If the temperature is higher than 85°C, the system will actively power off and not work, to protect the system and equipment and improve the reliability and life of the equipment.

[0035] The service life of the 3D-TOF imaging system of the present invention can reach 10 years. Based on the excellent chip processing performance, the service life of the equipment is effectively extended, and the power supply environment can be adjusted according to the needs, with high reliability, and it is suitable for most high and low temperature and global use scenarios. And according to the user's use needs, the transmission rate and access dynamic settings can be customized, the transmission rate can reach at least 600 MHz, and different power supply environments can be applied according to the user's status.

[0036] The 3D-TOF imaging system of the present invention can be applied to scenarios where real-time detection of the environment is achieved through Internet of Things control. It is rechargeable, easy to operate, and has the advantages of high performance, high rate, high efficiency, and long life.

[0037] The present invention also provides a computer-readable storage medium having a computer program stored thereon, wherein the program, when executed by a processor, implements the steps of the 3D-TOF imaging method as described above.

[0038] The present invention also provides a computer device, which includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor implements the steps of the 3D-TOF imaging method as described above when executing the program.

[0039] Compared with the prior art, the present invention has the following beneficial effects: The 3D-TOF imaging method and system provided by the present invention optimizes the multi-functions of the imaging system, uses the MCU main control chip to control the image sensor to capture images in the environment, adopts the synchronous dynamic random access memory SDRAM as the storage device which can be matched with high-speed small signals, adopts the imaging chip to output the imaging data, can be matched with high-speed signals for data transmission, and can be matched with Bluetooth transmission, so that not only the sensor can be read but also the data can be transmitted, so as to realize the imaging system with high speed, high performance, best real-time response, low power consumption, high sensitivity and applicable to multiple scenes; can be matched with a high-capacity 5200mAh battery and solar charging, can realize multiple functions of outdoor automatic charging and charger charging, realize the usability of high-performance, high-reliability and long-life products, and meet the growing experience needs of users; and the development is simple and efficient, the configuration is flexible, the applicability to multiple application scenes is wider, the system maintainability and stability are good, and it has broad prospects for promotion and application. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Various other advantages and benefits will become apparent to those of ordinary skill in the art by reading the following detailed description of the preferred embodiment.The drawings are only for the purpose of illustrating the preferred embodiments and are not to be construed as limiting the invention.

[0041] In the attached picture: Figure 1Schematic diagram of the 3D-TOF imaging system architecture of an embodiment of the present invention; Figure 2 This is a schematic diagram of the 3D-TOF imaging system architecture of an embodiment of the present invention; Figure 3 A schematic diagram of a power management architecture according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the architecture connection of the imaging chip epc660, the MCU main control chip Arm Cortex_M7, and the SDRAM memory in an embodiment of the present invention; Figure 5 This is a schematic diagram of the architecture connection of a low-power Bluetooth BLE chip and a lighting system according to an embodiment of the present invention; Figure 6 Flow chart of the 3D-TOF imaging method according to an embodiment of the present invention; Figure 7 The figure is a schematic diagram of the structure of a computer device according to an embodiment of the present invention. DETAILED DESCRIPTION

[0042] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0043] The terms used in this disclosure are for the purpose of describing specific embodiments only and are not intended to limit the disclosure. The singular forms of "a", "said" and "the" used in this disclosure and the appended claims are also intended to include plural forms unless the context clearly indicates otherwise. It should also be understood that the term "and / or" used herein refers to and includes any or all possible combinations of one or more associated listed items.

[0044] It should be understood that although the terms first, second, and third may be used in the present disclosure to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present disclosure, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".

[0045] Example The present invention provides a 3D-TOF imaging method. Figure 6 As shown, the following steps are included: S1. Photograph the environment in each application scenario to obtain the original image in the environment; In this embodiment, the MCU main control chip performs data transmission and control with the imaging chip through DDR high-speed signals, and the MCU main control chip reads storage content with the imaging chip through the I2C integrated circuit bus.

[0046] S2, reading the intensity of ambient light, and adjusting the FB reference voltage of the output voltage feedback by adjusting the PWM duty cycle according to the distance of the target person or object and the intensity of the light, and adjusting the output voltage value by the FB reference voltage, thereby adjusting the LED voltage of the lighting system to adjust the LED lighting intensity, and compensating the original image, and wirelessly transmitting the compensated image data to the user terminal.

[0047] In this embodiment, the imaging chip adopts the epc660 chip, and the imaging chip epc660 adopts three working modes: illumination modulation mode, distance measurement mode and non-distance measurement mode; Among them, the lighting modulation mode is: the ambient light intensity is read by the ambient light sensor, and the MCU main control chip ArmCortex_M7 adjusts the output voltage (PSU_VSEL) through the PWM duty cycle to feedback the FB reference voltage of the buck DCDC chip (SIC437AED-T1-GE3), adjusts the output voltage value (VDD_LED) of the buck DCDC chip, thereby adjusting the control LED voltage to adjust the LED lighting intensity.

[0048] In this embodiment, the adjustment gears of the PWM duty cycle include: 0%, 20%, 40%, 60%, 80%, 100%, the gears of controlling the output voltage (PSU_VSEL) include: 0V, 0.12V, 0.24V, 0.36V, 0.48V, 0.6V, and the gears of adjusting and controlling the LED voltage (VDD_LED) include: 4.98V, 4.7028V, 4.4256V, 4.1484V, 3.8712V, 3.594V, as shown in Table 2: Table 2

[0049] .

[0050] The distance measurement mode uses 39 fps 3D TOF, 4x DCS frames, and full pixel field for measurement. Ultra-fast measurement is achieved by reducing the ROI of the pixel field. Precise start / stop and single / continuous measurement control is achieved through SHUTTER shutter release.

[0051] The distance measurement is detected by checking the DCS value, which contains not only the distance information, but also the quality and validity (confidence) of the received light signal. The higher the signal amplitude of the received signal, the better and more accurate the distance measurement. Each distance measurement of each pixel has its own validity and quality. The main quality indicator of the data measuring the distance is the amplitude of the received modulated light ATOF, which is directly related to the distance noise. In this embodiment, the amplitude is calculated as follows (as shown in Table 1): Table 1

[0052] Non-distance measurement mode (grayscale mode) uses the imaging chip epc660 as a grayscale imager for ambient-light measurements without LED / LD illumination or with active illumination of the scene with LED / LD. Grayscale measurements are performed using differential coulomb spectroscopy DCS measurements, using the global illumination algorithm MGA via differential readings, the MGA keeps all integration times, and the data output format is a signed integer 12 bit: ± 2'047 LSB. The valid data range is 0 ... +2'047. The system noise is close to zero. Grayscale measurements without illumination can be used as an important quality and correction parameter for distance measurements.

[0053] In grayscale mode, the irradiance EBW of the grayscale signal on the pixel surface can be calculated based on the DC sensitivity SBW (using the integration time) to calculate the white balance tINT-BW, the reference white balance tINT-REF-BW and the DCS0 of the grayscale signal, and then the irradiance EBW can be calculated: EBW = SBW⋅(t INT-REF-BW / t INT-BW )⋅DCS0.

[0054] When the ambient temperature changes, the MCU main control chip Arm Cortex_M7 transmits the data change information to the low-power Bluetooth BLE chip, and then sends the data change information to the user terminal through the low-power Bluetooth BLE chip for viewing and maintenance, so that the imaging meets the high-definition timeliness requirements; or connect the device through the USB interface, JTAG interface and 3.3V serial port to inspect and process the image of the entire 3D-TOF imaging system.

[0055] The embodiment of the present invention further provides a 3D-TOF imaging system, which executes the 3D-TOF imaging method as described above, see Figure 1 , 2As shown, the power system is connected to the sensor system, imaging chip epc660, MCU main control chip ArmCortex_M7, and low-power Bluetooth BLE chip respectively; the MCU main control chip Arm Cortex_M7 and low-power Bluetooth BLE chip are connected to the SDRAM memory (see Figure 4 shown); The power supply system is set to three power supplies: main power supply, solar charging power supply, and 5200mAh rechargeable lithium-manganese battery. By adopting three power supplies, even under the working conditions where there is no main power supply, the system can be powered by a 5200mAh rechargeable lithium-manganese battery alone, or the solar charging power supply can be used to power the system and charge the 5200mAh rechargeable lithium-manganese battery, thereby realizing the use of clean energy and reducing carbon dioxide emissions.

[0056] Connect the low-power Bluetooth BLE chip to the battery management chip signal through the I2C integrated circuit bus, and connect the main power supply (DC_IN 5-12V), solar charging power supply (SOLAR 9v), and battery (BATTERY 3.7V_5200mAh) to the battery management chip (POWER), such as Figure 2 As shown. Figure 3 As shown, a low-power Bluetooth BLE chip (Nordic) is used to determine and select the main power supply and battery power supply of the battery management chip through the I2C integrated circuit bus, and to control the battery charging, and output a system voltage of 4.5V (main power supply) or 4.2V (battery) to improve power utilization efficiency; Connect the low-voltage difference linear voltage regulator LDO chip to the battery management chip, and connect the buck-type DCDC chip to the battery management chip; connect the buck-boost DCDC chip to the imaging chip epc660; use LDO (low-voltage difference linear regulator) to reduce the system voltage to 3.3V for use by 3D acceleration sensor, ambient light sensor, temperature and humidity sensor, and Bluetooth; use the buck-type DCDC chip to reduce the system voltage to 5.3V, and use the DCDC buck-boost power chip to generate ±10V voltage to power the imaging chip epc660, and convert the 5.3V voltage into 3.3V voltage to power the MCU main control chip Arm Cortex_M7 and SDRAM memory; the low-voltage difference linear voltage regulator LDO chip, buck-type DCDC chip, and buck-boost DCDC chip all have enable pins, and the low-power mode and low-power sleep state that are turned off when not in use are realized by enabling the MCU.

[0057] The image sensor is connected to the imaging chip epc660; the acceleration sensor and temperature and humidity sensor are connected to the MCU main control chip Arm Cortex_M7 and the low-power Bluetooth BLE chip through the I2C integrated circuit bus. Figure 4As shown, the acceleration sensor and the temperature and humidity sensor transmit the collected environmental information data to the MCU main control chip Arm Cortex_M7 and the low-power Bluetooth BLE chip through the I2C integrated circuit bus; the imaging chip epc660 is set to sleep in specific circumstances where image acquisition is not required to achieve low power consumption, thereby extending battery life, and transmits information to the terminal through the Bluetooth device, so that the user can monitor the camera information at any time.

[0058] The MCU main control chip Arm Cortex_M7 communicates with the imaging chip epc660 for data transmission and control through DDR high-speed signals, and reads storage content with the imaging chip epc660 through the I2C integrated circuit bus; the imaging chip epc660 includes three working modes: lighting modulation mode, distance measurement mode and non-distance measurement mode, to achieve low-power operation in different environments.

[0059] In actual application of this embodiment, under normal use conditions, the MCU main control chip Arm Cortex_M7 communicates data with the imaging chip epc660 to perform shooting in various scenes, and compensates through the lighting compensator of the lighting system according to the distance, light intensity, etc., and can be wirelessly transmitted through the low-power Bluetooth BLE chip (Nordic), such as Figure 5 As shown, the current environment status and portrait collection information are obtained; in the sleep state, the system is in a low power consumption state, and the acceleration sensor and other sensors are also in a low power consumption mode and not shut down.

[0060] The ambient light sensor of the lighting system is connected to the MCU main control chip Arm Cortex_M7. According to the intensity of the ambient light, the MCU main control chip Arm Cortex_M7 controls the voltage of the lighting lamp to change the intensity of the light, thereby meeting the lighting adjustment requirements under different ambient light conditions. The imaging glass chip set inside the lighting compensator achieves high-definition and smooth imaging.

[0061] Connect the USB interface and JTAG interface to the MCU main control chip Arm Cortex_M7; connect the 3.3V serial port to the low-power Bluetooth BLE chip. Debug the MCU's main control chip Arm Cortex_M7 through the USB interface, and use JTAG for software download, which is safe and stable. In this embodiment, the USB interface is compatible with various types of USB2.0 and USB3.0. The BLE chip uses the serial port 3.3V for debugging and the JTAG interface for software download; use Nodic's antenna adjustment chip to adjust the antenna to achieve optimal performance such as high power and long signal propagation distance.

[0062] Connect the temperature and humidity sensor to the battery management chip, and use the temperature and humidity sensor to monitor the ambient temperature and humidity, and monitor the charging temperature. When the ambient temperature is higher than 45°C, charging will not be performed. When the ambient temperature is lower than 45°C, charging will resume. When the temperature is higher than 85°C, the imaging system will actively power off and not work, to protect the imaging system and equipment, and improve the reliability and life of the equipment.

[0063] The 3D-TOF imaging system is fixed to the corresponding use area through the 4 fixed connection holes set on the shell with 4 screws, which greatly improves the convenience of use, is easy to install and operate, and can monitor motion. The acceleration sensor can dynamically adjust the camera status and machine performance under motion or static conditions. The required load is connected through the reserved load power interface to achieve richer product functions and application forms.

[0064] A preferred application example of the 3D-TOF imaging system of this embodiment is to be used in a scenario where real-time detection of the environment is achieved through Internet of Things control. It can be charged and used, is easy to operate, and has the advantages of high performance, high speed, high efficiency, and long life.

[0065] The structure of the 3D-TOF imaging system of this embodiment is fully enclosed as a whole, reaching IP67 level waterproof, dustproof, anti-static, and service life of up to 10 years. Based on the excellent chip processing performance, the use time of the equipment is effectively extended, and the power supply environment can be adjusted according to the needs. It has high reliability and is suitable for most high and low temperature and global use scenarios. It can also customize the settings of transmission rate and access dynamics according to user needs. The transmission rate can reach at least 600 MHz, and different power supply environments can be applied according to the user's status.

[0066] An embodiment of the present invention further provides a computer device, Figure 7 is a schematic diagram of the structure of a computer device provided by an embodiment of the present invention; see the accompanying drawings Figure 7 As shown, the computer device includes: an input device 23, an output device 24, a memory 22 and a processor 21; the memory 22 is used to store one or more programs; when the one or more programs are executed by the one or more processors 21, the one or more processors 21 implement the 3D-TOF imaging method provided in the above embodiment; wherein the input device 23, the output device 24, the memory 22 and the processor 21 can be connected by a bus or other means, Figure 7 The example of connecting through bus is taken in the following.

[0067] The memory 22 is a readable and writable storage medium of a computing device, which can be used to store software programs, computer executable programs, such as program instructions corresponding to the 3D-TOF imaging method described in the embodiment of the present invention; the memory 22 may mainly include a program storage area and a data storage area, wherein the program storage area may store an operating system, at least one application required for a function; the data storage area may store data created according to the use of the device, etc.; in addition, the memory 22 may include a high-speed random access memory, and may also include a non-volatile memory, such as at least one disk storage device, a flash memory device, or other non-volatile solid-state storage device; in some instances, the memory 22 may further include a memory remotely arranged relative to the processor 21, and these remote memories may be connected to the device via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0068] The input device 23 may be used to receive input digital or character information, and to generate key signal input related to user settings and function control of the device; the output device 24 may include a display device such as a display screen.

[0069] The processor 21 executes various functional applications and data processing of the device by running the software programs, instructions and modules stored in the memory 22, that is, realizes the above-mentioned 3D-TOF imaging method.

[0070] The computer device provided above can be used to execute the 3D-TOF imaging method provided in the above embodiment, and has corresponding functions and beneficial effects.

[0071] The embodiment of the present invention also provides a storage medium containing computer executable instructions, which are used to perform the 3D-TOF imaging method provided in the above embodiment when executed by a computer processor, and the storage medium is any of various types of memory devices or storage devices, and the storage medium includes: installation media, such as CD-ROM, floppy disk or tape device; computer system memory or random access memory, such as DRAM, DDRRAM, SRAM, EDORAM, Rambus RAM, etc.; non-volatile memory, such as flash memory, magnetic media (such as hard disk or optical storage); registers or other similar types of memory elements, etc.; the storage medium may also include other types of memory or a combination thereof; in addition, the storage medium may be located in a first computer system in which the program is executed, or may be located in a different second computer system, the second computer system is connected to the first computer system via a network (such as the Internet); the second computer system may provide program instructions to the first computer for execution. The storage medium includes two or more storage media that can reside in different locations (for example, in different computer systems connected via a network). The storage medium can store program instructions (for example, specifically implemented as a computer program) that can be executed by one or more processors.

[0072] Of course, the storage medium containing computer executable instructions provided in an embodiment of the present invention is not limited to the 3D-TOF imaging method described in the above embodiment, and the computer executable instructions can also execute related operations in the 3D-TOF imaging method provided in any embodiment of the present invention.

[0073] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

[0074] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, replacement, and improvement made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A 3D-TOF imaging method, characterized in that: The following steps are involved: Photograph the environment in each application scenario to obtain the original image in the environment; The intensity of ambient light is read, and according to the distance of the target person or object and the intensity of light, the FB reference voltage of the output voltage feedback is controlled by adjusting the PWM duty cycle, and the output voltage value is adjusted by the FB reference voltage, thereby adjusting the LED voltage of the lighting system to adjust the LED lighting intensity, compensate the original image, and wirelessly transmit the compensated image data to the user terminal.

2. The 3D-TOF imaging method according to claim 1, characterized in that: Also includes: When the ambient temperature, humidity, acceleration, and external power supply change, the environmental data change information is sent to the user terminal in real time for inspection and image processing, so that the image imaging maintains high-definition timeliness requirements.

3. A 3D-TOF imaging system, executing the 3D-TOF imaging method according to claim 1 or 2, characterized in that: include: Sensor system, imaging chip, power system, MCU main control chip, low-power Bluetooth BLE chip, SDRAM memory; the power system is electrically connected to the sensor system, the imaging chip, the MCU main control chip, and the low-power Bluetooth BLE chip respectively; the MCU main control chip and the low-power Bluetooth BLE chip are signal-connected to the SDRAM memory respectively.

4. The 3D-TOF imaging system according to claim 3, characterized in that: The sensor system includes: an image sensor, an acceleration sensor, and a temperature and humidity sensor; the image sensor is connected to the imaging chip signal; the acceleration sensor and the temperature and humidity sensor are connected to the MCU main control chip and the low-power Bluetooth BLE chip signal through the I2C integrated circuit bus respectively.

5. The 3D-TOF imaging system according to claim 3, characterized in that: The 3D-TOF imaging system further includes: a battery management chip, the low-power Bluetooth BLE chip is signal-connected to the battery management chip via an I2C integrated circuit bus, and the battery management chip is electrically connected to the power supply system.

6. The 3D-TOF imaging system according to claim 5, characterized in that: The 3D-TOF imaging system also includes: a low voltage difference linear voltage regulator LDO chip, a buck DCDC chip, and a buck-boost DCDC chip; the low voltage difference linear voltage regulator LDO chip is electrically connected to the battery management chip, and the buck DCDC chip is electrically connected to the battery management chip; the buck-boost DCDC chip is electrically connected to the imaging chip.

7. The 3D-TOF imaging system according to claim 3, characterized in that: The 3D-TOF imaging system is equipped with an illumination system that can be adjusted according to the ambient light. The illumination system includes two paths: one is an ambient light sensor, which is connected to the MCU main control chip signal; the other is an illumination compensator, and an imaging glass chip is arranged inside the illumination compensator.

8. The 3D-TOF imaging system according to claim 3, characterized in that: The 3D-TOF imaging system is configured with a USB interface, a JTAG interface, and a 3.3V serial port. The USB interface and the JTAG interface are electrically connected to the MCU main control chip; the 3.3V serial port is electrically connected to the low-power Bluetooth BLE chip.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the program is executed by a processor, the steps of the 3D-TOF imaging method according to claim 1 or 2 are implemented.

10. A computer device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that: When the processor executes the program, the steps of the 3D-TOF imaging method according to claim 1 or 2 are implemented.

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