Packaging structure and digital loudspeaker

Abstract

The invention discloses a packaging structure and a digital loudspeaker, and relates to the technical field of loudspeakers, the packaging structure comprises a packaging shell body, the packaging shell body comprises an anti-reflection surface deviating from one side of a substrate, the anti-reflection surface extends to a digital sound production chip, the anti-reflection surface is a continuous and smooth arc-shaped surface, the arc center of the anti-reflection surface is located on one side of the substrate, and the arc center of the anti-reflection surface is located on the other side of the substrate; and the distance between the anti-reflection surface and the substrate is gradually reduced along the extension direction from the anti-reflection surface to the digital sounding chip. According to the packaging structure provided by the invention, after the digital sound production chip generates sound waves, the sound waves can be diffused outwards along the continuous and smooth anti-reflection surface, so that mutual interference and superposition after the sound waves are reflected back are reduced, random high-frequency signals are remarkably reduced, and the sound quality of the digital sound production chip is further improved.

Description

Technical Field

[0001] The present invention relates to the technical field of loudspeakers, and in particular to a packaging structure and a digital loudspeaker. Background Art

[0002] The digital sound chip is composed of a number of sound units, which radiate sound pulses outward. According to the sound waveform required, different numbers of sound units are driven so that the generated sound waves are superimposed on each other to form a sound signal of the required amplitude. In order to ensure the accuracy of the amplitude of the superimposed sound waves, the sound pulse signal radiated in a single cycle cannot interfere with the sound pulses in the subsequent cycles. Therefore, it is necessary to reduce the oscillation duration and oscillation amplitude of the pulse signal as much as possible. However, the existing packaging structure reflects the sound signal on the wall, resulting in the interference and superposition of the radiated sound pulses and the sound pulses reflected from the previous cycle, generating random high-frequency sound signals, which in turn affects the sound quality of the digital sound chip.

[0003] Therefore, how to improve the sound quality of digital sound chips is a technical problem that technical personnel in this field currently need to solve. Summary of the invention

[0004] The purpose of the present invention is to provide a packaging structure and a digital speaker. The packaging structure provided by the present invention is used to improve the sound quality of a digital sound chip.

[0005] In order to achieve the above object, the present invention provides the following technical solutions:

[0006] A packaging structure, comprising:

[0007] The packaging shell body includes an anti-reflection surface on the side facing away from the substrate, the anti-reflection surface extends to the digital sound chip, the anti-reflection surface is a continuous and smooth arc surface, the arc center of the anti-reflection surface is located on one side of the substrate, and along the extension direction of the anti-reflection surface to the digital sound chip, the distance between the anti-reflection surface and the substrate gradually decreases.

[0008] Optionally, in the above-mentioned packaging structure, an angle α is set between a tangent line at the intersection of the anti-reflection surface and the digital sound chip and a horizontal plane, and a value range of the angle α is 10°<α<60°.

[0009] Optionally, in the above packaging structure, the curve forming the continuous smooth arc-shaped surface of the anti-reflection surface may be a polynomial interpolation curve, a cubic spline curve or a Bezier curve.

[0010] Optionally, in the above-mentioned packaging structure, a plurality of anti-reflection surfaces are provided, and the plurality of anti-reflection surfaces are arranged around the digital sound chip, and the anti-reflection surfaces are connected in sequence along the surrounding direction.

[0011] Optionally, in the above packaging structure, the anti-reflection surface extends along the circumferential direction of the digital sound chip to form a smooth and continuous circular surface.

[0012] Optionally, in the above-mentioned packaging structure, the packaging shell body also includes a supporting portion and a connecting portion, the supporting portion is connected to the anti-reflection surface through the connecting portion, and one end of the supporting portion is connected to the substrate, and the other end of the supporting portion extends away from the substrate, so that the packaging shell body and the substrate form a accommodating cavity.

[0013] Optionally, in the above-mentioned packaging structure, the surface of the connecting portion located on the same side as the anti-reflection surface extends away from the anti-reflection surface to form an extended boss, and the extended boss and the anti-reflection surface surround to form a sound-transmitting membrane mounting groove.

[0014] Optionally, in the above packaging structure, the diameter of the digital sound chip is L1, the maximum distance between the anti-reflection surface and the substrate is L2, and the value range of L2 is 0.1×L1 <L2<L1;

[0015] The distance from the end of the anti-reflection surface away from the digital sound chip to the digital sound chip is L3, and the value range of L3 is L1 <L3<5×L1。

[0016] Optionally, in the above packaging structure, the packaging shell body is an integrated structure.

[0017] In the packaging structure provided by the present invention, an anti-reflection surface is provided on the side away from the substrate, the anti-reflection surface extends to the digital sound chip and fits with the side of the digital sound chip, the anti-reflection surface is a continuous and smooth arc surface, the arc center of the anti-reflection surface is located on one side of the substrate, that is, the anti-reflection surface is convex in the direction away from the substrate, and at the same time, along the extension direction of the anti-reflection surface to the digital sound chip, the distance between the anti-reflection surface and the substrate gradually decreases, forming a smooth concave horn-shaped structure in the direction of the digital sound chip. Therefore, after the digital sound chip generates sound waves, the sound waves can diffuse outward along the continuous and smooth anti-reflection surface, thereby reducing the mutual interference and superposition of the sound waves after being reflected back, significantly reducing the generation of random high-frequency signals, and thus improving the sound quality of the digital sound chip.

[0018] The present invention also provides a digital speaker, comprising a sound-transmitting membrane, a substrate, an ASIC chip, a digital sound chip, and a packaging structure as described in any one of the above items.

[0019] The digital speaker provided by the present invention has all the technical effects of the above-mentioned packaging structure due to its packaging structure, which will not be described in detail herein. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0021] Figure 1 A schematic diagram of the structure of the packaging structure disclosed in an embodiment of the present invention;

[0022] Figure 2 A schematic diagram of the dimensions of the packaging structure disclosed in an embodiment of the present invention;

[0023] Figure 3 A schematic diagram of a structure in which a plurality of anti-reflection surfaces are arranged in a packaging structure disclosed in an embodiment of the present invention;

[0024] Figure 4 A schematic diagram of the anti-reflection surface structure of a packaging structure disclosed in another embodiment of the present invention;

[0025] Figure 5 A sound pressure-time comparison diagram of an anti-reflection structure with an anti-reflection surface and a structure without an anti-reflection surface disclosed in an embodiment of the present invention;

[0026] Figure 6 It is a contrast cloud diagram of the sound pressure of the anti-reflection structure with an anti-reflection surface disclosed in an embodiment of the present invention and the structure without an anti-reflection surface at a certain moment when a pulse is emitted.

[0027] Reference numerals:

[0028] 100 is a package shell body, 110 is an anti-reflection surface, 120 is a supporting portion, and 130 is a connecting portion;

[0029] 200 is a digital sound chip;

[0030] 300 is ASIC chip;

[0031] 400 is a substrate;

[0032] 500 is a sound-permeable membrane;

[0033] 600 is a housing of an earphone;

[0034] 700 for earmuffs;

[0035] 800 is the speaker housing. DETAILED DESCRIPTION

[0036] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0037] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it can be directly on the other element or indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined. The meaning of "several" is one or more, unless otherwise clearly and specifically defined.

[0039] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by the terms "up", "down", "front", "back", "left", "right", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0040] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0041] The core of the present invention is to provide a packaging structure for improving the sound quality of a digital sound chip;

[0042] Another core of the present invention is to provide a digital speaker having the above packaging structure.

[0043] like Figure 1As shown, an embodiment of the present invention discloses a packaging structure, including a packaging shell body 100. An anti-reflection surface 110 is provided on the side of the packaging shell body 100 away from the substrate 400, and the anti-reflection surface 110 extends toward the digital sound chip 200 and fits with the side of the digital sound chip 200. The anti-reflection surface 110 is a continuous and smooth arc surface, and the arc center of the arc surface is located on one side of the substrate 400, that is, the anti-reflection surface 110 protrudes away from the substrate 400. At the same time, the distance between the anti-reflection surface 110 and the substrate 400 gradually decreases in the extension direction of the anti-reflection surface 110 toward the digital sound chip 200, forming a smooth concave horn-shaped structure toward the digital sound chip 200. Therefore, after the digital sound chip 200 generates sound waves, the sound waves can diffuse outward along the continuous and smooth anti-reflection surface 110, thereby reducing the mutual interference and superposition of the sound waves after being reflected back, and significantly reducing the generation of random high-frequency signals, such as Figure 5 In the sound pressure-time comparison diagram of the anti-reflection structure with an anti-reflection surface and the structure without an anti-reflection surface, the curve with the anti-reflection surface of this embodiment has relatively reduced fluctuations and has better linearity, while Figure 6 In the sound pressure comparison cloud diagram of the anti-reflection structure with an anti-reflection surface and the structure without an anti-reflection surface at a certain moment when the pulse is emitted, the sound pressure in the anti-reflection structure provided in this embodiment presents a relatively flat peak and is relatively mild. From the above comparison results, it can be seen that the packaging structure provided in this embodiment significantly improves the sound quality of the digital sound chip 200.

[0044] At the same time, an angle α is set between the tangent at the intersection of the anti-reflection surface 110 and the digital sound chip 200 and the horizontal plane, and the value range of the angle α is 10°<α<60°. In a specific embodiment, the angle α can be set to 12°, 15°, 30° or 50°, so that the sound waves can smoothly diffuse along the anti-reflection surface 110. If α is set to a small value, such as the value of α is less than 10°, the guiding effect of the anti-reflection surface 110 on the sound waves emitted by the digital sound chip 200 will be significantly reduced, and the sound waves cannot diffuse well along the anti-reflection surface 110. When α is set to a large value, such as the value of α is greater than 60°, the anti-reflection surface 110 may block the sound waves, causing more sound waves to be repeatedly reflected, generating more random high-frequency sound signals, and being more detrimental to the sound quality of the digital sound chip 200.

[0045] In a specific embodiment, the curve forming the anti-reflection surface 110 may be a polynomial interpolation curve, a cubic spline curve, a Bezier curve, or a B-spline curve, etc., to form a continuous and smooth arc surface, wherein the polynomial interpolation curve has the characteristics of simplicity, continuity, smoothness, and low computational cost, and the characteristics of the cubic spline curve include continuity, smoothness, and good local controllability. Alternatively, those skilled in the art may design the anti-reflection surface 110 in other ways according to actual needs, which will not be described in detail herein.

[0046] In a specific embodiment, the package shell body 100 is provided with a plurality of anti-reflection surfaces 110, which are sequentially arranged along the circumference of the digital sound chip 200, surrounding the edge of the digital sound chip 200 and connected in sequence along the surrounding direction to guide the emitted sound waves in multiple directions, improve the uniformity of the sound wave diffusion along the anti-reflection surface 110, and further ensure that the digital sound chip 200 has a good sound quality. Figure 3 As shown, four anti-reflection surfaces 110 provided in this embodiment are arranged around the digital sound chip 200 in the earphone, and the anti-reflection surface 110 is integrally injection-molded with the earphone shell 600. The waterproof and dustproof sound-permeable membrane 500 is located in the earphone hole of the earmuff 700. When the earmuff 700 is attached to the earphone shell 600, the sound-permeable membrane 500 covers and protects the digital sound chip 200. In another specific embodiment, the anti-reflection surface 110 extends along the circumferential direction of the digital sound chip 200 to form an overall smooth and continuous circular surface. The overall structure is simple, which not only improves the overall structural strength, but also facilitates the production and processing of the packaging shell body 100, which is beneficial to improving production efficiency and reducing production costs. Figure 4 As shown, an anti-reflection surface 110 with an overall smooth continuous circular surface provided in this embodiment is provided in the audio device. The anti-reflection surface 110 and the audio housing 800 can also be integrally formed by injection molding, so that the overall structural strength is high and the stability is good.

[0047] like Figure 1As shown, the encapsulation shell body 100 further includes a support portion 120 and a connection portion 130. The support portion 120 is connected to the anti-reflection surface 110 through the connection portion 130. One end of the support portion 120 can be fixedly connected to the substrate 400 by bonding. The other end of the support portion 120 extends away from the substrate 400 and is connected to the connection portion 130. The connection portion 130 extends along the extension direction of the substrate 400 towards the digital sound chip 200 and is connected to the anti-reflection surface 110. Thus, a receiving cavity is formed between the encapsulation shell body 100 and the substrate 400, which can accommodate and protect the ASIC chip 300 (Application Specific Integrated Circuit) fixed on the substrate 400.

[0048] As Figure 1 shown, the surface of the connection portion 130 on the same side as the anti-reflection surface 110 extends away from the anti-reflection surface 110, forming an extension boss higher than the anti-reflection surface 110, so that a stepped structure is formed between the connection portion 130 and the anti-reflection surface. A sound transmission film installation groove is formed around between the protruding boss and the anti-reflection surface 110, and the sound transmission film 500 of the digital speaker is installed in the sound transmission film installation groove, which plays a good role in protecting the sound transmission film 500.

[0049] As Figure 2 shown, the diameter size of the digital sound chip 200 is L1. Along the direction perpendicular to the plane where the substrate 400 is located, the maximum distance between the anti-reflection surface 110 and the substrate 400 is L2. At this time, the value range of L2 is 0.1×L1 < L2 < L1. The distance from the end of the anti-reflection surface 110 far from the digital sound chip 200 to the digital sound chip 200 is L3, and the value range of L3 is L1 < L3 < 5×L1. Thus, while satisfying the overall compact structure, the anti-reflection surface 110 maintains an optimal arc length, which is beneficial for sound waves to diffuse along the anti-reflection surface 110, reducing the mutual interference and superposition caused by sound wave reflection, and improving the sound quality of the digital sound chip 200.

[0050] In a specific embodiment, the encapsulation shell body 100 can be integrally formed by an injection molding process, so that the encapsulation shell body 100 is an integral structure, which not only improves the overall structural strength, but also facilitates production and processing, improves production and processing efficiency, and is also beneficial to improving the surface smoothness of the encapsulation shell body 100 and promoting the outward diffusion of sound waves along the anti-reflection surface 110.

[0051] The embodiment of the present invention also discloses a digital speaker, including a dustproof and waterproof sound-permeable membrane 500, a substrate 400, an ASIC chip 300, a digital sound chip 200, and the above-mentioned packaging structure. The digital sound chip 200 and the ASIC chip 300 are both fixed on the substrate 400, the ASIC chip 300 is located in a receiving cavity formed by the packaging shell body 100 and the substrate 400, the dustproof and waterproof sound-permeable membrane 500 is installed in the sound-permeable membrane installation groove, and the substrate 400 can be a PCB (Printed Circuit Board) or a structural board. Since the digital speaker has the above-mentioned packaging structure, it has all the technical effects of the above-mentioned packaging structure, which will not be repeated here.

[0052] In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0053] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A packaging structure, characterized in that: include: The packaging shell body includes an anti-reflection surface on the side facing away from the substrate, the anti-reflection surface extends to the digital sound chip, the anti-reflection surface is a continuous and smooth arc surface, the arc center of the anti-reflection surface is located on one side of the substrate, and along the extension direction of the anti-reflection surface to the digital sound chip, the distance between the anti-reflection surface and the substrate gradually decreases.

2. The packaging structure according to claim 1, characterized in that: An angle α is set between a tangent line at the intersection of the anti-reflection surface and the digital sound chip and a horizontal plane, and a value range of the angle α is 10°<α<60°.

3. The packaging structure according to claim 1, characterized in that: The curve forming the continuous and smooth arc-shaped surface of the anti-reflection surface may be a polynomial interpolation curve, a cubic spline curve or a Bezier curve.

4. The packaging structure according to claim 1, characterized in that: There are multiple anti-reflection surfaces, which are arranged around the digital sound chip, and the anti-reflection surfaces are connected in sequence along the surrounding direction.

5. The packaging structure according to claim 1, characterized in that: The anti-reflection surface extends along the circumferential direction of the digital sound chip to form a smooth and continuous circular surface.

6. The packaging structure according to claim 1, characterized in that: The packaging shell body also includes a supporting portion and a connecting portion, wherein the supporting portion is connected to the anti-reflection surface via the connecting portion, and one end of the supporting portion is connected to the substrate, and the other end of the supporting portion extends away from the substrate, so that the packaging shell body and the substrate surround a receiving cavity.

7. The packaging structure according to claim 6, characterized in that: The surface of the connecting portion located on the same side as the anti-reflection surface extends away from the anti-reflection surface to form an extended boss, and the extended boss and the anti-reflection surface surround to form a sound-transmitting membrane installation groove.

8. The packaging structure according to claim 1, characterized in that: The diameter of the digital sound chip is L1, the maximum distance between the anti-reflection surface and the substrate is L2, and the value range of L2 is 0.1×L1 <L2<L1; The distance from the end of the anti-reflection surface away from the digital sound chip to the digital sound chip is L3, and the value range of L3 is L1 <L3<5×L1。 9. The packaging structure according to any one of claims 1 to 8, characterized in that: The packaging shell body is an integrated structure.

10. A digital speaker, characterized in that: It comprises a sound-transmitting membrane, a substrate, an ASIC chip, a digital sound chip, and a packaging structure as described in any one of claims 1 to 9.

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