Display device

Abstract

The display device may include: a display panel including a plurality of non-bending areas and a bending area disposed between the plurality of non-bending areas; a first protective member disposed on the display panel in the bending area; a second protective member disposed on the first protective member; and a third protective member disposed on the second protective member.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to Korean Patent Application No. 10-2023-0084417 filed on Jun. 29, 2023, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Embodiments of the present disclosure relate to a display device, and more particularly, to a display device including a protection member. Background Art

[0004] Modern display devices capable of displaying various information and interacting with a user viewing the information are required to have various sizes, various shapes, and various functions.

[0005] Such display devices include a liquid crystal display device (LCD), an electrophoretic display device (FPD), or a light emitting diode display device (LED).

[0006] As display devices are used in various ways, designs of display devices have become more diverse in order to reduce the area of ​​a non-display region where no image is displayed for the aesthetic feeling of a user.

[0007] To this end, research is being conducted to apply flexible materials to substrates of display devices, thereby allowing various portions of the display device to be bent using the flexible characteristics of the flexible substrate.

[0008] There is a problem that cracking and delamination of a display panel occurs in a bent region of a flexible substrate due to an external impact applied to the bent region thereof.

[0009] The cracking and delamination of the display panel may interfere with the image driving of the display area, thereby causing abnormal image display problems. Although various studies are being conducted to prevent cracking and delamination in the bending area where the display panel of the display device is bent, these studies are still insufficient, and thus development is urgently needed. Summary of the invention

[0010] One object to be achieved by the present disclosure is to provide a display device comprising a plurality of protective members disposed at least on an outer portion of a curved region of a display panel of the display device to minimize or at least reduce damage to the display device due to external impact.

[0011] Another object to be achieved by the present disclosure is to provide a display device including a plurality of protection members made of different materials to minimize changes in physical properties that may occur during a process of curing each protection member.

[0012] Yet another object to be achieved by the present disclosure is to provide a display device which ensures that a signal is normally transmitted by preventing or at least reducing cracking and delamination of a display panel of the display device, thereby having improved reliability.

[0013] It should be noted that the objects of the present disclosure are not limited to those described above, and other objects of the present disclosure will be apparent to those skilled in the art from the following description.

[0014] A display device according to an embodiment of the present disclosure may include: a display panel, which includes a plurality of non-bending areas and a bending area arranged between the plurality of non-bending areas; a first protective member, which is arranged on the display panel at least in the bending area; a second protective member, which is arranged on the first protective member; and a third protective member, which is arranged on the second protective member.

[0015] In the display device according to the embodiment of the present disclosure, since a plurality of protective members are provided at least on the outer portion of the curved region of the display panel of the display device, breakage of the display device due to external impact can be minimized or at least reduced.

[0016] Since the display device according to an embodiment of the present disclosure includes a plurality of protection members made of different materials, changes in physical properties that may occur during a process of curing each protection member may be minimized or at least reduced.

[0017] In the display device according to the embodiment of the present disclosure, since a signal can be normally transmitted by preventing cracking and delamination of a display panel of the display device, a display device having improved reliability and capable of low power consumption (or energy consumption) can be provided.

[0018] It should be noted that the effects of the present disclosure are not limited to the above-described effects, and other effects of the present disclosure will be apparent to those skilled in the art from the description of the claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other objects, features and advantages of the present disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0020] Figure 1 is a view showing a display device according to an embodiment of the present disclosure.

[0021] Figure 2 is a plan view of a display panel according to an embodiment of the present disclosure.

[0022] Figure 3 According to an embodiment of the present disclosure Figure 2 A cross-sectional view taken along line II′.

[0023] Figure 4 is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0024] Figure 5 2 is a view showing a manufacturing process of a protection member according to an embodiment of the present disclosure.

[0025] Figure 6 is a plan view showing components provided in a display panel according to an embodiment of the present disclosure.

[0026] Figure 7 is a plan view showing a pixel configuration according to an embodiment of the present disclosure.

[0027] Figure 8 is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0028] Fig. 9 is a cross-sectional view of a light emitting portion according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0029] The advantages and features of the present disclosure and their implementation methods will be explained by the following embodiments described with reference to the accompanying drawings. However, the present disclosure can be implemented in different forms and should not be interpreted as being limited to the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure will be thorough and complete, and will fully convey the scope of the present disclosure to those skilled in the art. In addition, the present disclosure is limited only by the scope of the claims.

[0030] In addition, the shapes, sizes, ratios, angles, quantities, etc. illustrated in the drawings for describing the embodiments of the present disclosure are merely examples, and therefore, the present disclosure is not limited thereto. Throughout the present disclosure, identical (or similar) reference numerals represent identical (or similar) elements. In the following description, when the detailed description of the related known technology is determined to be unnecessary to obscure the main points of the present disclosure, the detailed description will be omitted. Terms such as "including (or comprising)", "having", "containing" and "consisting of..." used herein are generally intended to allow the addition of other components, unless these terms are used together with the term "only". The singular form used herein is intended to include the plural form, unless the context clearly indicates otherwise.

[0031] When explaining any element or feature of the embodiments of the present disclosure, any dimensions and relative sizes of layers, regions (or areas), and areas should be considered to include a tolerance or error range, even when not specifically described.

[0032] Spatially relative terms used in this document to describe the relationship of one element or feature to another element or feature, such as "on", "above", "above", "below", "below", "lower", "upper", "near", "close", "adjacent", etc., are generally intended to allow one or more additional elements to be inserted between the elements, unless terms such as "directly", "close", etc. are used.

[0033] Time-related terms used in this document to describe the temporal relationship between events, operations, etc., such as "after", "following", "next", "before", etc., are generally intended to include events, situations, operations, etc. that occur discontinuously, unless terms such as "directly", "immediately", etc. are used.

[0034] When using terms such as "first", "second", etc. to describe various elements or components in this article, it should be considered that these elements or components are not limited thereto. These terms are only used in this article to distinguish one element from other elements. Therefore, the first element mentioned below can be the second element in the technical concept of this disclosure.

[0035] Terms such as "first", "second", "A", "B", "(A)" or "(B)" may be used herein to describe one or more elements of the present disclosure. Each of the terms is not used to limit the nature, order, sequence or quantity of an element, but is merely used to distinguish the corresponding element from another element. When referring to an element being "connected" or "coupled" or "in contact with" another element, it should be understood that additional elements may be inserted between the elements, or the elements may be indirectly connected, coupled or in contact with each other, and one element is directly connected, coupled or in contact with another element, unless the context clearly indicates otherwise.

[0036] It should be understood that the term "at least one" used herein can include all combinations obtained by combining one or more associated elements. For example, "at least one of a first element, a second element, and a third element" can include all combinations obtained by combining two or more of the first element, the second element, and the third element as well as the first element, the second element, or the third element.

[0037] The term "device" as used herein may include display devices, such as liquid crystal modules (LCMs), organic light emitting display modules (OLED modules), etc., which include a display panel and a driver for driving the display panel. Display devices may include laptop computers, televisions, computer monitors, vehicle devices, automotive devices, equipment devices (equipment instruments, parts) including one or more components or parts for vehicles, complete sets of electronic devices (or complete sets of equipment or complete sets of devices) including mobile electronic devices such as smart phones, electronic notes, etc., which are finished products or final products including LCMs, OLED modules, etc.

[0038] Therefore, the display device used herein may include the display device itself, such as LCM, OLED module, etc., and an application product including the LCM, OLED module, etc., or a complete device as a device for an end consumer.

[0039] In some embodiments or examples, an LCM or OLED module including a display panel, a driver, etc. may be referred to as a "display device", and an electronic device including an LCM or OLED module as a finished product may be referred to as a "set device". For example, a display device may include a display panel of a liquid crystal display (LCD) or an organic light emitting display (OLED), and a source PCB as a controller for driving the display panel. The set device may also include a set PCB, which is a set controller for controlling the entire set device and is electrically connected to the source PCB.

[0040] All types of display panels, such as liquid crystal display panels, organic light emitting diode (OLED) display panels, electroluminescent display panels, etc., can be used as the display panel used in this article. The embodiments of the present disclosure are not limited thereto. The shape or size (size) of the display panel applied to the display device according to the embodiments of the present disclosure is not limited.

[0041] The features of the various embodiments of the present disclosure may be coupled (coupled) or combined with each other in part or in whole, and may be driven technically and interoperate with each other in various ways as can be fully understood by those skilled in the art. The embodiments of the present disclosure may be implemented independently of each other, or may be implemented together in a mutually dependent relationship.

[0042] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings. For ease of description, the scale of each element shown in the drawings is different from the actual scale, and therefore is not limited to the scale shown in the drawings.

[0043] Hereinafter, various embodiments of the present disclosure are described in detail with reference to the accompanying drawings.

[0044] Figure 1 is a view showing a display device according to an embodiment of the present disclosure.

[0045] Figure 1 is a view showing a state in which the display panel 1 of the display device 1000 according to an embodiment of the present disclosure is in a bent state.

[0046] The display panel 1 may include a bending area BA and a non-bending area NBA. The non-bending area NBA may include at least two areas according to the area of ​​the substrate. For example, the substrate may have a bending area BA between two non-bending areas NBA.

[0047] The bending area BA is an area in which a portion of the display panel 1 is bent. Alternatively (or alternatively), the bending area BA is a substrate 110 (eg, see Figure 6 ) is bent. For example, the bending area BA is an area in which a portion of the substrate 110 is bent to set a pad portion and an external module coupled (or bonded) to the pad portion on the rear surface of the substrate 110. For example, as the bending area BA is bent toward the rear surface of the substrate 110, the external module coupled to the pad portion of the substrate 110 moves toward the rear surface of the substrate 110 and cannot be seen when the substrate 110 is observed from the top. In addition, as the bending area BA is bent, the size of the non-display area NA visible when the substrate 110 is observed from the top can be reduced, thereby achieving a narrow bezel.

[0048] The non-bending area NBA is an area where a portion of the substrate 110 is not bent and is flat. In the present disclosure, the non-bending area NBA may include two areas. For example, the non-bending area NBA may include a first non-bending area NBA1 and a second non-bending area NBA2, wherein a plurality of sub-pixels are disposed at the first non-bending area NBA1 to display an image, and a pad portion connected or bonded to the flexible film 2 is disposed at the second non-bending area NBA2.

[0049] As the bending area BA is bent, the first non-bending area NBA1 and the second non-bending area NBA2 may face each other.

[0050] In other words, the first non-bending area NBA1 and the second non-bending area NBA2 may face each other in a state in which the bending area BA is bent.

[0051] Figure 2 is a plan view of a display panel according to an embodiment of the present disclosure.

[0052] refer to Figure 2 According to the display device 1000 of the embodiment of the present disclosure (for example, see Figure 1 ) may include a display panel 1 and a flexible film 2.

[0053] Since the display panel 1 is a panel that displays an image, all types of display panels such as, for example, a liquid crystal display panel, an organic light emitting diode (OLED) display panel, and an electroluminescent display panel may be used, and the embodiments of the present disclosure are not limited thereto.

[0054] The flexible film 2 may electrically connect the display panel 1 and a printed circuit board that generates a pixel driving signal and outputs the pixel driving signal to the display panel 1 .

[0055] Alternatively, the flexible film 2 may transmit a signal output from the printed circuit board to the display panel 1 and / or transmit a signal from the display panel 1 (printed circuit board) to the printed circuit board.

[0056] The flexible film 2 may be made of a material having flexibility. For example, the flexible film 2 may be made of a plastic material such as polyimide (PI).

[0057] The first non-bending area NBA1 of the substrate 110 may include a display area (active area) AA and a non-display area (non-active area) NA surrounding the display area AA. The non-display area NA of the substrate 110 may be adjacent to the display area AA and may be disposed outside the display area AA.

[0058] The display area AA is an area in which pixels P are arranged to display an image, and may include a plurality of sub-pixels (eg, Figure 6 The first, second and third sub-pixels SP1, SP2 and SP3 are shown, but not limited thereto), and in each of the plurality of sub-pixels, a light emitting element layer for displaying an image and a thin film transistor for driving the light emitting element layer may be provided.

[0059] The non-display area NA is an area where no image is displayed, and may be an area where various wirings (or wirings) and driving circuits for driving the plurality of sub-pixels disposed in the display area AA are disposed. Since the non-display area NA is not an area for displaying an image, a portion of the non-display area NA of the substrate 110 may be bent to reduce the non-display area NA, such as a frame area.

[0060] The pad portion 114 may be disposed on one side of the second non-bending area NBA2 of the substrate 110. The pad portion 114 may be a metal pattern to which an external module such as a flexible printed circuit board (FPCB) or a chip on film (COF) may be bonded (or adhered). Although the pad portion 114 is shown as being disposed on one side of the substrate 110, the type and arrangement of the pad portion 114 are not limited thereto.

[0061] The connection wiring 116 may be disposed in a portion of the non-display area NA. The connection wiring 116 may be disposed in the bending area BA of the display device and first and second non-bending areas NBA1 and NBA2 adjacent to the bending area BA.

[0062] The connection wiring 116 may be a component for transmitting a signal (e.g., a voltage) from an external module coupled to the pad portion 114 to the display area AA or a circuit unit such as a gate driver. For example, various signals and voltages such as various gate signals, data signals, high potential voltages, and low potential voltages may be transmitted through the connection wiring 116.

[0063] The connection wiring 116 may be divided into a power connection wiring and / or a signal connection wiring according to a voltage and / or an image signal to be transmitted.

[0064] The power connection wiring may transmit a voltage supplied from an external module to the display area AA. The power connection wiring may be connected to a low potential voltage wiring (VSS), a high potential voltage wiring (VDD), and a gate low voltage wiring and / or a gate high voltage wiring included in a gate driver, but is not limited thereto.

[0065] The signal connection wiring may transmit a signal supplied from an external module to the display area AA. The signal connection wiring may be connected to a scan line and / or a data line, but is not limited thereto.

[0066] Figure 3 is a view showing a display device according to an embodiment of the present disclosure before being bent. Figure 3 According to an embodiment of the present disclosure, Figure 2 A cross-sectional view of the display device taken along line II′ of the display panel.

[0067] refer to Figure 3 , the display device according to an embodiment of the present disclosure may include a display panel 1 , a first protective member 8 , and a second protective member 9 .

[0068] The display panel 1 may display an image or a picture in a display device. The display panel 1 according to an embodiment of the present disclosure may include a light emitting diode display device (or device). Figure 8 and Fig. 9 Components of the display panel 1 are described.

[0069] The polarizer 6 , the first protective member 8 , the second protective member 9 , and the flexible film 2 may be disposed on the display panel 1 .

[0070] The polarizer 6 may be disposed in the first non-bending area NBA1.

[0071] The polarizer 6 may selectively transmit light to reduce reflection of external light incident on the display device 1000. For example, the display device 1000 includes various metal materials to be applied to thin film transistors, light emitting element layers, and wiring. External light incident on the display device 1000 may be reflected from the metal material, and the visibility of the display device 1000 may be reduced due to the reflection of the external light. Therefore, by arranging the polarizer 6 on one surface of the display device 1000, the reflection of external light can be prevented, and the outdoor visibility of the display device 1000 can be increased.

[0072] Depending on the structure of the display device 1000 or the like, the polarizer 6 may be omitted.

[0073] The polarizer 6 may be attached to the display panel 1 using an adhesive member 10 .

[0074] The adhesive member 10 may be made of a material having an adhesive property. For example, the adhesive member 10 may be made of an optically clear adhesive (OCA), an optically clear resin (OCR), or a pressure sensitive adhesive (PSA), but is not limited thereto.

[0075] The first protective member 8 may be disposed in the bending area BA. Alternatively, the first protective member 8 may also be disposed in the first non-bending area NBA1 and / or the second non-bending area NBA2 adjacent to the bending area BA.

[0076] The first protective member 8 may prevent or at least reduce problems such as cracking and external moisture penetration that occur when the display panel 1 is bent. Alternatively, the first protective member 8 may prevent or at least reduce problems such as disconnection of the connection wiring 116 or penetration of external moisture and / or oxygen into the display panel 1 due to external impact applied to the bending area BA after bending.

[0077] The first protective member 8 may be disposed to cover at least a portion of the display panel 1 disposed in the bending area BA.

[0078] The first protective member 8 may include resin. Ultraviolet (UV)-curable acrylic resin or epoxy resin may be used, but the embodiments of the present disclosure are not limited thereto.

[0079] The first protective member 8 may be formed of a curing resin material that has undergone a curing process after being applied. If a UV curable resin is used as the resin, curing may be performed by UV curing.

[0080] The second protective member 9 may be provided on the first protective member 8 .

[0081] The second protective member 9 may be disposed in the bending area BA. Alternatively, the second protective member 9 may be disposed in the first non-bending area NBA1 and / or the second non-bending area NBA2 adjacent to the bending area BA.

[0082] The second protective member 9 may prevent or at least reduce the problem that the physical properties of the first protective member 8 change due to the curing process for the third protective member 11 .

[0083] Reference together Figure 4 and Figure 5 , the first protective member 8 , the second protective member 9 and the third protective member 11 may be disposed in sequence from the inside to the outside of the display device.

[0084] The third protective member 11 may be formed using a resin having a high tensile modulus. During the process of forming the third protective member 11, light may be irradiated to cure the material 11a of the third protective member 11. For example, when the material 11a of the third protective member 11 is cured using ultraviolet rays, the third protective member 11 may be formed.

[0085] During the manufacturing process of the third protective member 11, ultraviolet rays may penetrate not only the third protective member 11 but also the first protective member 8, so the physical properties of the first protective member 8 change. This may cause over-curing of the first protective member 8, thereby causing cracking or disconnection of the display panel 1. Therefore, by providing the second protective member 9 between the first protective member 8 and the third protective member 11, changes in the physical properties of the first protective member 8 that may occur due to the processing of the third protective member 11 during the process in which the first protective member 8 is cured can be minimized. In addition, since a plurality of protective members are provided, the breakage of the display device due to external impact can be minimized, and since cracking and delamination of the display panel are prevented, signals can be transmitted normally, thereby providing a display device with improved reliability and capable of low power consumption.

[0086] The second protective member 9 may be provided to cover at least a portion of the first protective member 8. The second protective member 9 may cover one end (or one end portion) of the first protective member 8. One end of the second protective member 9 may at least partially contact the display panel 1.

[0087] The other end of the second protective member 9 may at least partially contact the polarizer 6 or an adhesive member 10 attaching (or bonding) the polarizer 6 and the front surface member 7 .

[0088] An upper surface of the second protective member 9 may at least partially contact the front surface member 7 .

[0089] The second protective member 9 may include a black material. The second protective member 9 may be an adhesive member having an adhesive property. For example, the second protective member 9 may be made of a pressure sensitive adhesive (PSA) including a black material and having an adhesive property at the same time, but is not limited thereto. The second protective member 9 may block ultraviolet rays from irradiating the first protective member 8.

[0090] The second protective member 9 may include an ultraviolet blocking material, and the third protective member 11 may include an ultraviolet transmitting material.

[0091] The flexible film 2 may be disposed in the second non-bending area NBA2.

[0092] The flexible film 2 may be attached to the display panel 1 using an adhesive member 10. The adhesive member 10 may be made of a material having adhesive properties. For example, the adhesive member 10 may be made of an optically clear adhesive (OCA) or a pressure sensitive adhesive (PSA), but is not limited thereto.

[0093] The front surface member 7 may be disposed on the polarizer 6, the first protective member 8, and the second protective member 9. The front surface member 7 may be disposed in the first non-bending area NBA1 and the bending area BA.

[0094] The front surface member 7 can protect the display panel 1 and other components located below or above the front surface member 7 from external impact, moisture, heat, etc. The front surface member 7 can be made of a material having impact resistance and light transmittance. For example, the front surface member 7 can be a substrate made of glass or a film made of a plastic material such as polymethyl methacrylate (PMMA), polyimide (PI) and polyethylene terephthalate (PET), but is not limited thereto. The front surface member 7 can be referred to as various names, such as a cover window, a window cover or a cover glass, and the embodiments of the present disclosure are not limited thereto.

[0095] The front surface member 7 may be formed to be transparent so that light emitted from the display panel 1 can be transmitted to the outside of the display device and a user can view an image provided by the display device.

[0096] The blocking portion may be provided at the end of the front surface member 7. The blocking portion may be provided to surround a portion of the end of the display panel 1. The blocking portion may be formed to be opaque so that the user cannot see the wiring, driving circuits, and various components formed below or above the front surface member 7 in the display device.

[0097] The blocking portion may include a light blocking material (or light shielding material) such as a pigment, a dye, and carbon black. For example, the blocking portion may be formed of black ink or applied to the front surface member 7. Alternatively, the blocking portion may be formed as a separate portion on the edge of the rear surface of the front surface member 7 and may be attached to the front surface member 7.

[0098] The blocking portion may be disposed to overlap a portion of at least one of the display panel 1, the first plate 3a, the support member 4, and the heat dissipation member 5. When the display panel 1 is bent, the blocking portion may be disposed to overlap a portion of at least one of the second plate 3b and the flexible film 2.

[0099] A plate may be provided on the rear surface of the display panel 1. The plate may support and protect the display panel 1 on the rear surface of the display panel 1. The plate may be made of a material that is rigid and has high thermal conductivity. For example, the plate may be made of a metal such as aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), SUS (stainless steel), and Invar alloy, or a material such as plastic, and the embodiments of the present disclosure are not limited thereto.

[0100] In the present disclosure, the board may include a first board 3a and a second board 3b. The first board 3a may be disposed in the first non-bending area NBA1 and may support the display panel 1 having a flexible feature corresponding to the display area AA of the display panel 1 so that the display panel 1 may maintain a flat state. The second board 3b may be disposed in the second non-bending area NBA2 and may support the display panel 1 having a flexible feature and the flexible film 2.

[0101] The first plate 3 a and the second plate 3 b may be attached to the display panel 1 using an adhesive member 10 .

[0102] The adhesive member 10 may be made of a material having an adhesive property. For example, the adhesive member 10 may be made of an optically clear adhesive (OCA) or a pressure sensitive adhesive (PSA), but is not limited thereto.

[0103] The support member 4 may be disposed on the rear surface of the first plate 3 a in the first non-bending area NBA1 .

[0104] The support member 4 may support at least one of the rear surface and the side surface of the display panel 1 , and may have a plate shape.

[0105] The support member 4 may be made of a material having high rigidity and high thermal conductivity. For example, the support member 4 may be made of a metal such as aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), SUS (stainless steel), and Invar alloy, or a material such as plastic, and the embodiments of the present disclosure are not limited thereto.

[0106] The supporting member 4 may be attached to the first plate 3 a using an adhesive member 10 .

[0107] The adhesive member 10 may be made of a material having an adhesive property. For example, the adhesive member 10 may be made of an optically clear adhesive (OCA) or a pressure sensitive adhesive (PSA), but is not limited thereto.

[0108] The heat dissipation member 5 may be disposed on the rear surface of the support member 4 .

[0109] The heat dissipation member 5 may dissipate the heat transmitted from the display panel 1. The heat dissipation member 5 may include a material having excellent thermal conductivity. The heat dissipation member 5 may disperse and dissipate the heat transmitted from the display panel 1. For example, the heat dissipation member 5 may be made of a metal such as aluminum (Al), copper (Cu), zinc (Zn), silver (Ag), gold (Au), iron (Fe), SUS (stainless steel), invar alloy, and graphite or a material such as plastic, and may include at least one of the above materials, alloys thereof, or a combined structure thereof, and the embodiments of the present disclosure are not limited thereto.

[0110] Figure 4 is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0111] refer to Figure 4 , the display device according to the embodiment of the present disclosure may include a first protective member 8, a second protective member 9 and a third protective member 11. Figure 4 In addition to the configuration (or shape) after bending, Figure 4 Basically Figure 3 The same, so the repeated description will be omitted.

[0112] exist Figure 4 In the embodiment, after attaching the display panel and the components provided on the rear and front surfaces of the display panel, a bending process may be performed. After the bending process, the first non-bending area NBA1 and the second non-bending area NBA2 may face each other. Through the bending process, the second plate 3b and the heat dissipation member 5 may be attached using the adhesive member 10.

[0113] The curved display device may further include a frame 13 . The frame 13 is a component that protects the display panel 1 from external impact and mounts the display panel 1 and components of the display panel 1 , and may be disposed under the flexible film 2 and the second protective member 9 .

[0114] Hereinafter, the first protective member 8 , the second protective member 9 , and the third protective member 11 will be described in detail.

[0115] The first protective member 8 disposed in the bending area BA may be disposed on the display panel 1 , the second protective member 9 may be disposed on the first protective member 8 , and the third protective member 11 may be disposed on the second protective member 9 .

[0116] The first protective member 8 and the second protective member 9 may be disposed along the bending area BA. For example, the first protective member 8 and the second protective member 9 may be formed on the display panel 1 in the bending area BA before the bending process, and may be bent together with the display panel 1 during the bending process to be disposed along the bending area BA.

[0117] The third protective member 11 may cover the side surface of the bending area BA. The frame 13 formed to reinforce the side surface of the display panel 1 after the bending process may be provided to cover the side surface of the display device. The third protective member 11 may also cover the lower surface of the bending area BA.

[0118] The second protective member 9 and the third protective member 11 may be made of different materials.

[0119] The second protective member 9 may be made of a pressure sensitive adhesive (PSA) including a black material and having adhesive properties, but is not limited thereto. The second protective member 9 may include an ultraviolet blocking material. Therefore, the second protective member 9 may block ultraviolet rays from irradiating the first protective member 8.

[0120] The third protective member 11 may include resin, but is not limited thereto. The third protective member 11 may include a material that transmits ultraviolet rays. Therefore, as ultraviolet rays are irradiated to the material 11a of the third protective member 11, the third protective member 11 may be cured.

[0121] The tensile modulus of the first protective member 8 may be different from the tensile modulus of the third protective member 11. The tensile modulus of the third protective member 11 may be equal to or less than the tensile modulus of the first protective member 8.

[0122] The connection wiring 116 disposed in the bending area BA may be susceptible to impact and may be disconnected, resulting in a problem that the display device is not driven. Although the first protective member 8 is disposed in the bending area BA, in order to more effectively reduce the impact applied to the side surface of the display device, a third protective member 11 having a tensile modulus greater than that of the first protective member 8 may be disposed.

[0123] The third protective member 11 having a high tensile modulus protects the connection wiring 116 disposed in the bending area BA to prevent or at least reduce the connection wiring 116 from being disconnected due to external impact. In addition, the third protective member 11 has an effect of preventing the display panel 1 from being broken or damaged, such as being crushed or deformed.

[0124] Figure 5 2 is a view illustrating a manufacturing process of a third protective member according to an embodiment of the present disclosure.

[0125] The curing container 14 may be disposed at a position where the bending area BA of the display device 1000 is disposed. The curing container 14 has a closed structure except for an upper surface, and the bending area BA of the display device 1000 may be disposed in the curing container 14.

[0126] Thereafter, the material 11a of the third protective member 11 is placed in the curing container 14. Since the material 11a of the third protective member 11 is made of a resin having high viscosity and low fluidity, the material 11a requires a certain amount of time to flow.

[0127] The third protective member 11 may be cured by irradiating light to the material 11 a of the third protective member 11 using the curing device 15 on the side surface and the lower surface of the curing container 14 .

[0128] The light of the curing device 15 may be ultraviolet light.

[0129] Figure 6 is a plan view showing components provided in a display panel according to an embodiment of the present disclosure.

[0130] refer to Figure 6 , the substrate 110 may include a display area (active area) AA and a non-display area (non-active area) NA surrounding the display area AA. The non-display area NA of the substrate 110 may be adjacent to the display area AA and may be disposed outside the display area AA.

[0131] The display area AA is an area in which pixels P are arranged and an image is displayed.

[0132] Each pixel P disposed in the display area AA may include a plurality of sub-pixels (e.g., first, second, and third sub-pixels SP1, SP2, and SP3, but not limited thereto). The plurality of sub-pixels are separate units that emit light. The plurality of sub-pixels may emit red, green, blue, and / or white (light), and the embodiments of the present disclosure are not limited thereto.

[0133] The display area AA may include an organic light emitting diode. Alternatively, the display area AA may include a light emitting diode (LED) or a micro light emitting diode (micro LED) including an inorganic material, but the embodiments of the present disclosure are not limited thereto.

[0134] In each of the plurality of sub-pixels, a light emitting element layer for displaying an image and a thin film transistor for driving the light emitting element layer may be provided.

[0135] One sub-pixel may include a plurality of transistors T, a capacitor C, and a plurality of (or a plurality of) wirings. For example, one sub-pixel may be a structure 2T1C including two transistors and one capacitor, but is not limited thereto. One sub-pixel may be a structure such as 3T1C, 4T1C, 5T1C, 6T1C, 7T1C, 3T2C, 4T2C, 5T2C, 6T2C, 7T2C, and 8T2C, and may be implemented according to the structure and type of the thin film transistor.

[0136] The non-display area NA, which is an area where no image is displayed, is an area where various wirings and driving circuits are arranged to drive the plurality of sub-pixels arranged in the display area AA. Since the non-display area NA is not an area for displaying an image, a portion of the non-display area NA of the substrate 110 may be bent to reduce the non-display area NA, such as a frame area.

[0137] like Figure 6 As shown, the non-display area NA may be disposed around the display area AA. For example, the non-display area NA may be an area surrounding the display area AA. The non-display area NA may be an area extending from the display area AA. Alternatively, the non-display area NA may be an area where the plurality of sub-pixels are not disposed, but is not limited thereto.

[0138] Figure 6 The non-display area NA is shown to surround the display area AA in a quadrilateral shape. However, the shape of the display area AA and the shape and configuration of the non-display area NA adjacent to the display area AA are not limited to Figure 6 The display area AA and the non-display area NA may have a shape suitable for the design of an electronic device equipped with the display device 1000. In the case of a display device of a device that can be worn by a user, the display device may have a circular shape such as a wrist watch, and the concept of the embodiments of the present disclosure may also be applied even to a free-form display device that may be applied to a dashboard of a vehicle, etc. For example, the display area AA may have a pentagonal, hexagonal, circular, or elliptical shape, but is not limited thereto.

[0139] The non-display area NA is an area where various wirings and driving circuits for driving the plurality of sub-pixels provided in the display area AA are provided. For example, various ICs and driving circuits such as a gate driver and a data driver may be provided in the non-display area NA. The non-display area NA may be a frame area and is not limited to this term.

[0140] The display device 1000 according to an embodiment of the present disclosure may include various additional elements for generating various signals or driving the multiple sub-pixels in the display area AA. For example, the driving circuit for controlling (or driving) the multiple sub-pixels may include a gate driver 112, a data signal line, a multiplexer (MUX), an electrostatic discharge (ESD) circuit, a power wiring, an inverter circuit, and a connection wiring 116. The power wiring may be a high potential voltage wiring and / or a low potential voltage wiring, but the embodiments of the present disclosure are not limited thereto. The display device 1000 may also include additional elements having functions other than the functions for driving the multiple sub-pixels. For example, the display device 1000 may include additional elements that provide a touch detection function, a user authentication function (e.g., fingerprint recognition), a multi-level pressure detection function, and a tactile feedback function, and the embodiments of the present disclosure are not limited thereto. The above-mentioned additional elements may be located in the non-display area NA or in an external circuit connected to the connection interface, and the embodiments of the present disclosure are not limited thereto.

[0141] The pad portion 114 may be disposed on one side of the non-display area NA. The pad portion 114 may be a metal pattern to which an external module such as a flexible printed circuit board (FPCB) or a chip on film (COF) is bonded. Although the pad portion 114 is shown as being disposed on one side of the substrate 110, the type and configuration of the pad portion 114 are not limited thereto.

[0142] The gate driver 112 that provides a gate signal to the thin film transistor may be disposed on one side and the other side of the non-display area NA. The gate driver 112 may include various gate driving circuits, and the gate driving circuits may be directly formed on the substrate 110. In this case, the gate driver 112 may be a gate in panel (GIP), and is not limited to this term.

[0143] The gate driver 112 may be disposed between the display area AA and the dam portion 117. Between the display area AA and the pad portion 114 of the non-display area NA, a high potential voltage wiring (VDD), a low potential voltage wiring (VSS), a multiplexer (MUX), an electrostatic discharge (ESD) circuit, and a connection wiring 116 may be disposed, but the embodiments of the present disclosure are not limited thereto.

[0144] The high potential voltage wiring (VDD), the low potential voltage wiring (VSS), the multiplexer (MUX), and the connection wiring 116 may be disposed between the display area AA and the bending area BA. The high potential voltage wiring (VDD), the low potential voltage wiring (VSS), the multiplexer (MUX), and the connection wiring 116 may be disposed in a non-bending area adjacent to the display area AA.

[0145] The connection wiring 116 may be disposed in a portion of the non-display area NA. The connection wiring 116 may be disposed in the bending area BA of the display device and a non-bending area adjacent to the bending area BA.

[0146] The connection wiring 116 may be a component for transmitting a signal (e.g., a voltage) from an external module coupled to the pad portion 114 to the display area AA or a circuit unit such as the gate driver 112. For example, various signals and voltages, such as various gate signals, data signals, high potential voltages, and low potential voltages, may be transmitted through the connection wiring 116.

[0147] The connection wiring 116 may be divided into a power connection wiring and / or a signal connection wiring according to a voltage and / or an image signal to be transmitted.

[0148] The power connection wiring may transmit a voltage supplied from an external module to the display area AA. The power connection wiring may be connected to a low potential voltage wiring (VSS), a high potential voltage wiring (VDD), and a gate low voltage wiring and / or a gate high voltage wiring included in a gate driver, but is not limited thereto.

[0149] The signal connection wiring may transmit a signal supplied from an external module to the display area AA. The signal connection wiring may be connected to a scan line and / or a data line, but is not limited thereto.

[0150] The dam 117 may be disposed in the non-display area NA to surround the entirety or a portion of the display area AA. The dam 117 may be adjacent to the display area AA, and may be disposed outside the display area AA.

[0151] The dam 117 may be disposed along the periphery of the display area AA to control the flow of a layer including an organic material in an encapsulation portion disposed on the light emitting element layer. The number of the dam 117 may be one or more, and the embodiments of the present disclosure are not limited thereto.

[0152] The panel crack detector 118 may be further disposed in a portion of the non-display area NA of the substrate 110 .

[0153] The panel crack detector 118 may be disposed between an end point (or end portion) of the substrate 110 and the dam portion 117. Alternatively, the panel crack detector 118 may be disposed below the dam portion 117 and may at least partially overlap the dam portion 117.

[0154] The panel crack detector 118 may be disposed at an external portion of the display device, and may detect defects, such as cracks, that may occur on the external portion of the display device.

[0155] The hole H may be further included inside the display area AA. The hole H may be disposed between the plurality of sub-pixels in the display area AA. The hole H may be an area in which an optical part such as a camera or an optical sensor is disposed. The optical sensor may include a proximity sensor, an infrared sensor, an ultraviolet sensor, etc., but the embodiments of the present disclosure are not limited thereto. Since the hole H includes a hole H that penetrates a specific part of the display device 1000 to dispose the optical part, a space in which the optical part is disposed may be ensured.

[0156] Figure 7 is a plan view showing a pixel configuration of a display device according to an embodiment of the present disclosure.

[0157] The display area AA of the substrate 110 may include a light emitting portion EA (eg, see Figure 8 ) and a non-light emitting portion NEA disposed between the light emitting portions EA.

[0158] The light emitting portion EA is a region that emits light from the light emitting element layer in the sub-pixel, and each sub-pixel may include the light emitting portion EA. A plurality of light emitting portions EA may be disposed on the substrate to be spaced apart from each other. The non-light emitting portion NEA may be disposed to surround the light emitting portion EA.

[0159] The light emitting portion EA is a region that emits light from the light emitting layer to the outside. Figure 8 , the light emitting portion EA may be a region in which the bank 520 is not provided.

[0160] The non-light emitting area NEA is an area where light is not emitted from the light emitting layer to the outside. Figure 8 , the non-light emitting area NEA may be a region in which the bank 520 is disposed.

[0161] A plurality of light emitting parts emitting different colors (light) may be located in the light emitting part EA. For example, a first light emitting part EA1 emitting red light, a second light emitting part EA2 emitting green light, and a third light emitting part EA3 emitting blue light may be included. In addition, a light emitting part emitting white light may be included, but the embodiments of the present disclosure are not limited thereto.

[0162] like Figure 7As shown, each light-emitting part EA is formed in a specific shape and arranged in a specific pattern, but the light-emitting part EA of the display device 1000 according to an embodiment of the present disclosure may not be formed and arranged only in a specific shape and pattern, but may be formed and arranged in various shapes and patterns. For example, each light-emitting part EA may have a quadrilateral, pentagon, hexagon, octagon, circular or elliptical shape, but is not limited thereto. For example, the first light-emitting part EA1 and the third light-emitting part EA3 may have the same shape. The second light-emitting part EA2 may have a different shape from the first light-emitting part EA1. The second light-emitting part EA2 may have a different shape from the third light-emitting part EA3. For example, the second light-emitting part EA2 may have a different shape from the first light-emitting part EA1 and the third light-emitting part EA3.

[0163] like Figure 6 As shown, in one pixel P, a plurality of sub-pixels or light-emitting parts may emit the same color (light). For example, at least two second sub-pixels SP2 or second light-emitting parts EA2 may be provided in one pixel P. At least two second light-emitting parts EA2 emitting green (light) may be provided in one pixel P, but the embodiments of the present disclosure are not limited thereto.

[0164] The third light-emitting portion EA3 may have a larger area than the other light-emitting portions. For example, the area of ​​the third light-emitting portion EA3 may be larger than the area of ​​the first light-emitting portion EA1. The area of ​​the third light-emitting portion EA3 that emits blue (light) may be larger than the area of ​​the first light-emitting portion EA1 that emits red (light). For example, the area of ​​the third light-emitting portion EA3 may be larger than the area of ​​the second light-emitting portion EA2. The area of ​​the third light-emitting portion EA3 that emits blue (light) may be larger than the area of ​​the second light-emitting portion EA2 that emits green (light). The third light-emitting portion EA3 may be arranged above (or on) the other light-emitting portions. For example, the third light-emitting portion EA3 may overlap at least partially with the first light-emitting portion EA1 and the second light-emitting portion EA2.

[0165] The spacer 530 may be arranged to have a preset distance (or separation distance) from the plurality of sub-pixels. For example, the spacer 530 may be arranged to be spaced apart from the plurality of sub-pixels at a set distance and to be surrounded (or surrounded) by the plurality of sub-pixels. Figure 7 As shown, four sub-pixels may surround one spacer, but the embodiments of the present disclosure are not limited thereto. Depending on the structure and type of the display device, five, six, seven or eight sub-pixels may be used to surround one spacer.

[0166] The spacer 530 may be disposed substantially at the center between a plurality of sub-pixels emitting at least one same color (light). For example, the spacer 530 may be disposed at the center between two second light emitting parts EA2 emitting green (light).

[0167] The spacer 530 may buffer the light emitting element layer 500 (eg, see Figure 8 ) and an empty space between the substrate 110 and the upper substrate to minimize damage of the display device 1000 due to external impact.

[0168] In addition, the spacer 530 can protect the light emitting element layer 500. For example, when forming the light emitting element layer 500, a fine metal mask (FMM) can be used. The fine metal mask may sag due to its weight during its processing. Therefore, by providing the spacer 530 so that the fine metal mask (FMM) and the spacer 530 contact each other, the fine metal mask can be prevented from directly contacting the embankment 520 to deform or damage the embankment 520.

[0169] Figure 8 is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0170] Figure 8 1 is a view showing a portion of a cross-sectional structure of a sub-pixel provided in a display area for displaying an image, in which a light emitting element layer 500 for displaying an image and a first thin film transistor 200 and a second thin film transistor 300 for driving the light emitting element layer 500 may be provided.

[0171] The substrate 110 may support various components of the display device and may be made of glass or a flexible plastic material.

[0172] For example, the substrate 110 may be formed of at least one of polyimide (PI), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), polyethersulfone, and polycarbonate (PC), but is not limited thereto.

[0173] When the substrate 110 is made of polyimide, the substrate 110 may be configured with two polyimide layers. An inorganic layer may be further provided between the two polyimide layers, but the embodiments of the present disclosure are not limited thereto.

[0174] The substrate 110 can be referred to as a concept including elements and functional layers formed on the substrate 110 (for example, a switching thin film transistor, a driving thin film transistor connected to the switching thin film transistor, an organic light-emitting element connected to the driving thin film transistor, a protective layer, etc.), but is not limited thereto.

[0175] The first insulating layer 120 may be disposed over (or on) the entire substrate 110. For example, the first insulating layer 120 may be disposed on the entire surface of the substrate 110.

[0176] The first insulating layer 120 may be formed on the substrate 110 to prevent materials inside the substrate 110 from moving to the thin film transistor or the semiconductor layer during a deposition process.

[0177] The first insulating layer 120 may be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and further, may be formed of an insulating organic material, but is not limited thereto.

[0178] The first insulating layer 120 may be made of (or composed of) a single layer or multiple layers of silicon nitride (SiNx) and / or silicon oxide (SiOx), but the embodiments of the present disclosure are not limited thereto. When the first insulating layer 120 is made of multiple layers, silicon oxide (SiOx) and silicon nitride (SiNx) may be alternately formed, but the embodiments of the present disclosure are not limited thereto.

[0179] The first insulating layer 120 may be a buffer layer or a first buffer layer, but the embodiments of the present disclosure are not limited thereto.

[0180] The first insulating layer 120 may be omitted depending on the type and material of the substrate 110 , the structure and type of the thin film transistor, etc.

[0181] The first thin film transistor 200 and the second thin film transistor 300 may be disposed on the first insulating layer 120. The first thin film transistor 200 may be a switching thin film transistor, and the second thin film transistor 300 may be a driving thin film transistor, but the embodiments of the present disclosure are not limited thereto.

[0182] The first thin film transistor 200 may include a first semiconductor layer 210 , a first gate electrode 230 , a first source electrode 250 , and a first drain electrode 270 . The second thin film transistor 300 may include a second semiconductor layer 310 , a second gate electrode 330 , a second source electrode 350 , and a second drain electrode 370 .

[0183] For the convenience of explanation, only two thin film transistors among various thin film transistors are shown, but other thin film transistors may also be included in the display device 1000. In addition, for the convenience of explanation, a top gate structure in which a gate electrode configuring a thin film transistor is located above a semiconductor layer has been described, but the embodiments of the present disclosure are not limited to this structure. A bottom gate structure in which a gate electrode is located below a semiconductor layer or a double gate structure in which gate electrodes are located above and below a semiconductor layer may be adopted.

[0184] The first semiconductor layer 210 of the first thin film transistor 200 and the second semiconductor layer 310 of the second thin film transistor 300 may be disposed on the first insulating layer 120 .

[0185] The first semiconductor layer 210 and the second semiconductor layer 310 may be made of a polycrystalline semiconductor. For example, the polycrystalline semiconductor may include low temperature polycrystalline silicon (LTPS) having high mobility, but is not limited thereto. When the first semiconductor layer 210 and the second semiconductor layer 310 are made of a polycrystalline semiconductor, energy consumption power is low and reliability is excellent.

[0186] The first semiconductor layer 210 and the second semiconductor layer 310 may be made of an oxide semiconductor. For example, the first semiconductor layer 210 and the second semiconductor layer 310 may be made of any one of IGZO (Indium Gallium Zinc Oxide), IZO (Indium Zinc Oxide), IGTO (Indium Gallium Tin Oxide), and IGO (Indium Gallium Oxide), but are not limited thereto. When the first semiconductor layer 210 and the second semiconductor layer 310 are made of an oxide semiconductor, the effect of blocking leakage current is excellent, and therefore, the brightness change of the sub-pixel during low-speed driving can be minimized.

[0187] When the first semiconductor layer 210 and the second semiconductor layer 310 are made of a polycrystalline semiconductor or an oxide semiconductor, partial regions of the first semiconductor layer 210 and the second semiconductor layer 310 may have a conductive region.

[0188] The first semiconductor layer 210 and the second semiconductor layer 310 may be made of amorphous silicon (a-Si), or may be made of various organic semiconductor materials such as pentacene, but are not limited thereto.

[0189] The second insulating layer 130 may be disposed on the first semiconductor layer 210 and the second semiconductor layer 310 over the entire area of ​​the substrate 110 .

[0190] The second insulating layer 130 may be disposed between the first semiconductor layer 210 and the first gate electrode 230 to isolate (or insulate) the first semiconductor layer 210 from the first gate electrode 230. The second insulating layer 130 may be disposed between the second semiconductor layer 310 and the second gate electrode 330 to isolate the second semiconductor layer 310 from the second gate electrode 330.

[0191] The second insulating layer 130 may be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and further, may be formed of an insulating organic material, but the embodiments of the present disclosure are not limited thereto.

[0192] The second insulating layer 130 may have a hole to electrically connect each of the first source electrode 250 and the first drain electrode 270 with the first semiconductor layer 210. The second insulating layer 130 may have a hole to electrically connect each of the second source electrode 350 and the second drain electrode 370 with the second semiconductor layer 310.

[0193] The first gate electrode 230 of the first thin film transistor 200 and the second gate electrode 330 of the second thin film transistor 300 may be disposed on the second insulating layer 130. The first gate electrode 230 may be disposed to overlap the first semiconductor layer 210. The second gate electrode 330 may be disposed to overlap the second semiconductor layer 310.

[0194] The storage capacitor 400 may be disposed on the second insulating layer 130. The storage capacitor 400 may include a first capacitor electrode 410 and a second capacitor electrode 420. The storage capacitor 400 may store a data voltage applied through the data line for a predetermined period and then may provide the data voltage to the first electrode 510.

[0195] The first capacitor electrode 410 of the storage capacitor 400 may be disposed on the second insulating layer 130 .

[0196] The first gate electrode 230 , the second gate electrode 330 , and the first capacitor electrode 410 may be disposed at the same layer. For example, the first gate electrode 230 , the second gate electrode 330 , and the first capacitor electrode 410 may be disposed on the second insulating layer 130 .

[0197] The first gate electrode 230 , the second gate electrode 330 , and the first capacitor electrode 410 may be formed through the same process (or process).

[0198] The first gate electrode 230, the second gate electrode 330, and the first capacitor electrode 410 may be formed as a single layer or a multilayer made of any one or an alloy of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W), and a transparent conductive oxide (TCO), but the embodiments of the present disclosure are not limited thereto.

[0199] The third insulating layer 140 may be disposed on the first gate electrode 230 , the second gate electrode 330 , and the first capacitor electrode 410 over the entire area of ​​the substrate 110 .

[0200] The third insulating layer 140 may be disposed between the first gate electrode 230, the first source electrode 250, and the first drain electrode 270 to isolate the first gate electrode 230, the first source electrode 250, and the first drain electrode 270. The third insulating layer 140 may be disposed between the second gate electrode 330, the second source electrode 350, and the second drain electrode 370 to isolate the second gate electrode 330, the second source electrode 350, and the second drain electrode 370.

[0201] The third insulating layer 140 may have a hole to electrically connect each of the first source electrode 250 and the first drain electrode 270 with the first semiconductor layer 210. The third insulating layer 140 may have a hole to electrically connect each of the second source electrode 350 and the second drain electrode 370 with the second semiconductor layer 310.

[0202] The third insulating layer 140 may be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and further, may be formed of an insulating organic material, but the embodiments of the present disclosure are not limited thereto.

[0203] The second capacitor electrode 420 of the storage capacitor 400 may be disposed on the third insulating layer 140. The second capacitor electrode 420 may be disposed to overlap the first capacitor electrode 410.

[0204] The second capacitor electrode 420 may be formed as a single layer or a multilayer made of any one or an alloy of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W), and a transparent conductive oxide (TCO), but the embodiments of the present disclosure are not limited thereto.

[0205] The fourth insulating layer 150 may be disposed on the second capacitor electrode 420 over the entire area of ​​the substrate 110 .

[0206] The fourth insulating layer 150 may be disposed between the first gate electrode 230, the first source electrode 250, and the first drain electrode 270 to isolate the first gate electrode 230, the first source electrode 250, and the first drain electrode 270. The fourth insulating layer 150 may be disposed between the second gate electrode 330, the second source electrode 350, and the second drain electrode 370 to isolate the second gate electrode 330, the second source electrode 350, and the second drain electrode 370.

[0207] The fourth insulating layer 150 may have a hole to electrically connect each of the first source electrode 250 and the first drain electrode 270 with the first semiconductor layer 210. The fourth insulating layer 150 may have a hole to electrically connect each of the second source electrode 350 and the second drain electrode 370 with the second semiconductor layer 310.

[0208] The fourth insulating layer 150 may be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and further, may be formed of an insulating organic material, but the embodiments of the present disclosure are not limited thereto.

[0209] The first source electrode 250 and the first drain electrode 270 may be disposed on the fourth insulating layer 150. The second source electrode 350 and the second drain electrode 370 may be disposed on the fourth insulating layer 150.

[0210] Each of the first source electrode 250 and the first drain electrode 270 may be electrically connected to the first semiconductor layer 210 through the holes of the second insulating layer 130, the third insulating layer 140, and the fourth insulating layer 150. Each of the second source electrode 350 and the second drain electrode 370 may be electrically connected to the second semiconductor layer 310 through the holes of the second insulating layer 130, the third insulating layer 140, and the fourth insulating layer 150.

[0211] The first source electrode 250, the first drain electrode 270, the second source electrode 350, and the second drain electrode 370 may be formed as a single layer or multiple layers made of any one or alloy of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W), and a transparent conductive oxide (TCO), but the embodiments of the present disclosure are not limited thereto. For example, the first source electrode 250, the first drain electrode 270, the second source electrode 350, and the second drain electrode 370 may be made of a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) as a conductive metal material, but the embodiments of the present disclosure are not limited thereto.

[0212] The fifth insulating layer 160 may be disposed on the first source electrode 250 , the first drain electrode 270 , the second source electrode 350 , and the second drain electrode 370 , over the entire area of ​​the substrate 110 .

[0213] The fifth insulating layer 160 may protect the first and second thin film transistors 200 and 300. The fifth insulating layer 160 may be formed of an insulating inorganic material such as silicon nitride (SiNx) or silicon oxide (SiOx), and may also be formed of an insulating organic material, but the embodiments of the present disclosure are not limited thereto.

[0214] The fifth insulating layer 160 may have a hole to electrically connect the second thin film transistor 300 and the connection electrode 180 or the first electrode 510. The fifth insulating layer 160 may be omitted according to the structure, type, etc. of the thin film transistor.

[0215] The protective layer 170 may be disposed on the fifth insulating layer 160. For example, the protective layer 170 may be an insulating layer or a planarization layer, but the embodiments of the present disclosure are not limited thereto. The protective layer 170 may protect the thin film transistor disposed below the protective layer 170, and may reduce or planarize the steps caused by various patterns. For example, the protective layer 170 may isolate (or insulate) the components disposed on and below the protective layer 170. For example, the protective layer 170 may be disposed as a single layer, but may be disposed as a multilayer (i.e., at least two layers), and the embodiments of the present disclosure are not limited thereto.

[0216] As the display device 1000 evolves to a higher resolution, the number of various signal wirings increases. Therefore, since it is difficult to arrange all wirings at one layer while ensuring a minimum gap, an additional layer can be configured. Because the margin for configuring the wiring is ensured due to the presence of the additional layer, the design of configuring the wiring / electrode can be more easily performed. Since the dielectric material is used as a planarization layer configured with multiple layers, the protective layer 170 can be used to form a capacitor between metal layers.

[0217] When the protective layer 170 is provided as two layers, the protective layer 170 may include a first protective layer 171 and a second protective layer 172. For example, the first protective layer 171 may be a sixth insulating layer, but the embodiments of the present disclosure are not limited thereto. For example, the second protective layer 172 may be a seventh insulating layer, but the embodiments of the present disclosure are not limited thereto. For example, a hole may be formed in the first protective layer 171, and the connecting electrode 180 may be provided in the hole. The second protective layer 172 having a hole may be provided on the first protective layer 171 and the connecting electrode 180. The first electrode 510 may be provided in the hole of the second protective layer 172. Therefore, the first thin film transistor 300 and the first electrode 510 may be electrically connected through the connecting electrode 180.

[0218] One end (a portion or one side) of the connection electrode 180 may be connected to the second thin film transistor 300 , and the other end (another portion or another side) of the connection electrode 180 may be connected to the first electrode 510 .

[0219] The connection electrode 180 may be further disposed on the first protective layer 171 .

[0220] The connection electrode 180 may be formed as a single layer or multiple layers made of any one or alloy of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W), and a transparent conductive oxide (TCO), but the embodiments of the present disclosure are not limited thereto. For example, the connection electrode 180 may be made of a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) as a conductive metal material.

[0221] The connection electrode 180 may be a first connection electrode, but the embodiments of the present disclosure are not limited thereto. The connection electrode 180 may be omitted according to the structure, type, etc. of the display device 1000 .

[0222] The second protective layer 172 may be disposed on the first protective layer 171 and the connection electrode 180 .

[0223] The first and second protective layers 171 and 172 may be formed of at least one material among organic insulating materials such as benzocyclobutene (BCB), acrylic resin, epoxy resin, phenol resin, polyamide resin, and polyimide resin, but the embodiments of the present disclosure are not limited thereto.

[0224] Considering the configuration (or arrangement) of the electrodes, the protective layer 170 of the display device 1000 may be provided as three layers, but the embodiments of the present disclosure are not limited thereto.

[0225] The light emitting element layer 500 may be disposed on the protective layer 170 or the second protective layer 172. The light emitting element layer 500 may include a first electrode 510, an organic layer 540, and a second electrode 550.

[0226] The first electrode 510 may be disposed on the protective layer 170. The first electrode 510 may supply holes to the organic layer 540 and may be made of a conductive material having a high work function. The first electrode 510 may be an anode electrode, but the embodiments of the present disclosure are not limited thereto.

[0227] When the display device 1000 is a top emission type, the first electrode 510 as a reflective electrode for reflecting light can be provided using an opaque conductive material. The first electrode 510 can be formed of at least one of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr) and alloys thereof, but the embodiments of the present disclosure are not limited thereto. For example, the first electrode 510 can be made of (or constituted of) a three-layer structure of silver (Ag) / lead (Pd) / copper (Cu), but is not limited thereto. Alternatively, the first electrode 510 may further include a transparent conductive material layer having a high work function, such as indium tin oxide (ITO).

[0228] When the display device 1000 is a bottom emission type, the first electrode 510 may be provided using a transparent conductive material that transmits light. For example, the first electrode 510 may be formed of at least one of indium tin oxide (ITO) and indium zinc oxide (IZO), but the embodiments of the present disclosure are not limited thereto.

[0229] The bank 520 may be disposed on the first electrode 510 and the protective layer 170 .

[0230] The levee 520 can distinguish a plurality of sub-pixels, minimize or at least reduce light blurring, and prevent or at least reduce color mixing that occurs at various viewing angles. The levee 520 can define (or distinguish) a light-emitting portion that emits light and a non-light-emitting portion that does not emit light. The levee 520 can be disposed in the non-light-emitting portion. The levee 520 can have a levee hole that exposes the light-emitting portion and the first electrode 510.

[0231] The embankment 520 may be made of at least one of an inorganic insulating material such as silicon nitride (SiNx) and silicon oxide (SiOx); an organic insulating material such as benzocyclobutene (BCB), acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin; and a photosensitizer including a black pigment, but the embodiments of the present disclosure are not limited thereto.

[0232] The bank 520 may be formed to be black or colored. For example, when the bank 520 includes a black material, external light, internal reflected light, and / or scattered light scattered from the side surface of the first electrode 510 may be prevented from being incident on the thin film transistor, and the problem of reduced brightness of the display device may be solved. The bank 520 may be arranged to cover the end (or partial area) of the first electrode 510.

[0233] At least one spacer 530 may be disposed on the bank 520 .

[0234] The spacer 530 may prevent or at least reduce damage to the organic layer 540 during a processing process of the organic layer 540 , and may minimize or at least reduce breakage of the display device 1000 due to an external impact.

[0235] The spacer 530 may be formed of the same material as the embankment 520, and may be formed simultaneously with the embankment 520, or may be formed by a separate process. For example, the spacer 530 may be formed to be transparent, black, or colored. Alternatively, the spacer 530 may include a transparent material, a black material, or a colored material, but the embodiments of the present disclosure are not limited thereto.

[0236] The thickness of the spacer 530 may be equal to or greater than the thickness of the bank 520. The thickness of the spacer 530 may be 1 μm (micrometer) to 2 μm, but the embodiments of the present disclosure are not limited thereto.

[0237] The organic layer 540 may be disposed on the first electrode 510 and the bank 520. The organic layer 540 may include an emission layer (EML) for emitting light of a specific color in each of the plurality of sub-pixels. The emission layer may be a layer that emits light. For example, holes generated in the first electrode 510 and electrons generated in the second electrode 550 may be injected into the emission layer. The holes and electrons injected into the emission layer may combine to generate excitons. When the generated excitons fall from an excited state to a ground state, light may be generated.

[0238] For example, the emission layer may include one of a red emission layer emitting red (light), a green emission layer emitting green (light), a blue emission layer emitting blue (light), and a white emission layer emitting white (light). When the organic layer 540 includes a white emission layer, a color filter for converting white light from the white emission layer into light of another color may be provided on the organic layer 540. In addition to the emission layer, the organic layer 540 may further include a hole injection layer (HIL), a hole transport layer (HTL), an electron blocking layer (EBL), a hole blocking layer (HBL), an electron transport layer (ETL), and an electron injection layer (EIL), but the embodiments of the present disclosure are not limited thereto.

[0239] The emission layer of the organic layer 540 can be set in each of the multiple sub-pixels, and at least one of the hole injection layer (HIL), the hole transport layer (HTL), the electron blocking layer (EBL), the hole blocking layer (HBL), the electron transport layer (ETL) and the electron injection layer (EIL) of the organic layer 540 can be set in the entire display area.

[0240] The organic layer 540 of the display device 1000 according to an embodiment of the present disclosure may be an emission unit. At least one emission unit may be provided. For example, a stacked structure may be configured by stacking a plurality of emission units between the first electrode 510 and the second electrode 550. In this case, a charge generation layer may be further provided between the plurality of emission units. A plurality of emission units may be provided in each sub-pixel.

[0241] The following will refer to Fig. 9 Describe the transmitting unit in detail.

[0242] The second electrode 550 may be disposed on the organic layer 540. The second electrode 550 may supply electrons to the organic layer 540 and may be made of a conductive material having a low work function. The second electrode 550 may be a cathode electrode, but the embodiments of the present disclosure are not limited thereto.

[0243] When the display device 1000 is a top emission type, the second electrode 550 may be provided using a transparent conductive material that transmits light. For example, the second electrode 550 may be formed of at least one of indium tin oxide (ITO) and indium zinc oxide (IZO), but the embodiments of the present disclosure are not limited thereto. In addition, the second electrode 550 may be provided using a translucent conductive material that transmits light. For example, the second electrode 550 may be formed of at least one of an alloy such as LiF / Al, CsF / Al, Mg:Ag, Ca / Ag, Ca:Ag, LiF / Mg:Ag, LiF / Ca / Ag, and LiF / Ca:Ag, but the embodiments of the present disclosure are not limited thereto.

[0244] When the display device 1000 is a bottom emission type, the second electrode 550 as a reflective electrode reflecting light may be provided using an opaque conductive material. For example, the second electrode 550 may be formed of at least one of silver (Ag), aluminum (Al), gold (Au), molybdenum (Mo), tungsten (W), chromium (Cr) and alloys thereof, but the embodiments of the present disclosure are not limited thereto.

[0245] The encapsulation part 600 may be disposed on the second electrode 550. The encapsulation part 600 may protect the organic layer 540 from external moisture, oxygen, or foreign matter (or foreign substances). For example, in order to prevent oxidation of the light-emitting material and the electrode material, the encapsulation part 600 may prevent oxygen and moisture from penetrating from the outside.

[0246] Encapsulation portion 600 may include first, second, and third encapsulation layers 610, 620, and 630 that block moisture or oxygen penetration. First, second, and third encapsulation layers 610, 620, and 630 may have a structure in which the layers are alternately stacked, but the embodiments of the present disclosure are not limited thereto.

[0247] The encapsulation portion 600 may be made of a transparent material so that light emitted from the emission layer may be transmitted.

[0248] The first encapsulation layer 610 and the third encapsulation layer 630 may be made of at least one inorganic material among silicon nitride (SiNx), silicon oxide (SiOx), and aluminum oxide (AlyOz), but are not limited thereto. The first encapsulation layer 610 and the third encapsulation layer 630 may be formed using a vacuum deposition method such as chemical vapor deposition (CVD) or atomic layer deposition (ALD), but are not limited thereto.

[0249] The first encapsulation layer 610 and the third encapsulation layer 630 may be formed as at least two layers. For example, the first encapsulation layer 610 may be made of a three-layer structure of silicon oxide (SiOx) / silicon nitride (SiNx) / silicon oxide (SiOx), but is not limited thereto. For another example, the first encapsulation layer 610 may be made of a four-layer structure of silicon oxide (SiOx) / silicon nitride (SiNx) / silicon oxide (SiOx) / silicon oxide (SiOx), but is not limited thereto.

[0250] The second encapsulation layer 620 may cover foreign matter or particles that may occur during the manufacturing process of the display device 1000. In addition, the second encapsulation layer 620 may planarize the surface of the first encapsulation layer 610. For example, the second encapsulation layer 620 may be a particle covering layer, but is not limited to this term.

[0251] The second encapsulation layer 620 may be an organic material, for example, a polymer based on silicon oxycarbon (SiOCz), epoxy, polyimide, polyethylene, or acrylate, but is not limited thereto.

[0252] The second encapsulation layer 620 may be made of a thermosetting material or a photocurable material that is cured by heat or light.

[0253] The second encapsulation layer 620 may be formed in various ways such as inkjet coating or slit coating, but the embodiments of the present disclosure are not limited thereto. For example, the second encapsulation layer 620 may be formed on the first encapsulation layer 610 by spraying or dropping a liquid organic material onto the substrate 110 on which the first encapsulation layer 610 is formed in the display area using an inkjet device or a nozzle coating device. As the nozzle moves over the application area (or the nozzle is fixed and the object or target moves), an organic material in a fluid state may be formed in the application area.

[0254] Since the material configuring the second encapsulation layer 620 has a low viscosity characteristic, the material can be in a high-density liquid state until it is solidified. A dam portion can be provided to solve the problem of the second encapsulation layer 620 diffusing (or flowing) to the non-display area.

[0255] The touch portion 700 may be disposed on the encapsulation portion 600 .

[0256] The touch portion 700 may include a first touch electrode 740_R, a first touch connection electrode 720, a second touch electrode, and a second touch connection electrode 740_C.

[0257] Some portions of the first touch electrode 740_R, the first touch connection electrode 720 , the second touch electrode, and the second touch connection electrode 740_C may be disposed to overlap with the bank 520 .

[0258] The first touch electrode 740_R, the second touch electrode, the first touch connection electrode 720, and the second touch connection electrode 740_C may be formed as a mesh pattern formed as metal lines intersect each other. The mesh pattern may have a rhombus shape. In addition, the mesh pattern may have a quadrilateral (or square), pentagon, hexagon, circular, or elliptical shape, but is not limited thereto.

[0259] The first touch electrode 740_R, the second touch electrode, the first touch connection electrode 720, and the second touch connection electrode 740_C may be provided using an opaque conductive material having a low resistance. For example, the first touch electrode 740_R, the second touch electrode, the first touch connection electrode 720, and the second touch connection electrode 740_C may be formed as a single layer or multiple layers made of any one or alloy of molybdenum (Mo), copper (Cu), titanium (Ti), aluminum (Al), chromium (Cr), gold (Au), nickel (Ni), neodymium (Nd), tungsten (W), and a transparent conductive oxide (TCO), but are not limited thereto. For example, the first touch electrode 740_R, the second touch electrode, the first touch connection electrode 720, and the second touch connection electrode 740_C may be made of a three-layer structure of titanium (Ti) / aluminum (Al) / titanium (Ti) as a conductive metal material, but are not limited thereto.

[0260] The first touch electrode 740_R, the second touch electrode, the first touch connection electrode 720, and the second touch connection electrode 740_C may be made of the same material as the first source electrode 250, the first drain electrode 270, the second source electrode 350, and the second drain electrode 370, but the embodiments of the present disclosure are not limited thereto.

[0261] The buffer layer 710 may be disposed on the encapsulation portion 600. The buffer layer 710 may block a chemical solution (e.g., a developer or an etchant) used during the manufacturing process of the touch portion 700 or moisture from the outside from penetrating into the light emitting element layer 500 including an organic material. In addition, the buffer layer 710 may prevent a plurality of touch sensor metals disposed on the buffer layer 710 from being disconnected due to an external impact, and may block interference signals generated when the touch portion 700 is driven. For example, the buffer layer 710 may be a touch buffer layer, a second buffer layer, or an eighth insulating layer, but the embodiments of the present disclosure are not limited thereto.

[0262] The buffer layer 710 may be made of at least one of an inorganic insulating material such as silicon nitride (SiNx) or silicon oxide (SiOx) and an organic insulating material such as benzocyclobutene (BCB), acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin, but is not limited thereto.

[0263] The first touch connection electrode 720 may be disposed on the buffer layer 710 .

[0264] For example, the first touch connection electrode 720 may be arranged in a first direction (or Figure 1 The first touch connection electrodes 720 may be electrically connected to each other in the first direction (or the X-axis direction shown in FIG. Figure 1 In the embodiment, a plurality of first touch electrodes 740_R are spaced apart from each other and adjacent to each other in the X-axis direction (as shown in FIG. 1 ), but is not limited thereto.

[0265] The first touch connection electrode 720 may be arranged to overlap with the second touch connection electrode 740_C, which is connected in the second direction (or as Figure 1 The first touch connection electrode 720 and the second touch connection electrode 740_C are adjacent to each other in the Y-axis direction shown in FIG. Since the first touch connection electrode 720 and the second touch connection electrode 740_C are formed at different layers, they can be electrically insulated from each other. For example, the first touch connection electrode 720 can be a connection electrode or a second connection electrode, but the embodiments of the present disclosure are not limited thereto. For example, the second touch connection electrode 740_C can be a third connection electrode, but the embodiments of the present disclosure are not limited thereto.

[0266] The insulating layer 730 may be disposed on the buffer layer 710 and the first touch connection electrode 720. For example, the insulating layer 730 may be a touch insulating layer or a ninth insulating layer, but the embodiments of the present disclosure are not limited thereto.

[0267] The insulating layer 730 may include a hole for electrically connecting the first touch electrode 740_R and the first touch connection electrode 720. For example, the insulating layer 730 may electrically insulate the second touch electrode and the second touch connection electrode 740_C. For example, the insulating layer 730 may be an organic material such as a polymer based on silicon oxycarbon (SiOCz), epoxy resin, polyimide, polyethylene, or acrylate, but is not limited thereto. The insulating layer 730 may be made of a thermosetting material or a photocurable material that is cured by heat or light.

[0268] When the insulating layer 730 is made of an inorganic material, the insulating layer 730 is arranged along the steep steps and curves (or curved parts) of various components arranged below the insulating layer 730. Therefore, such a problem may occur, that is, some internal components of the display device can be seen from the outside because the steep steps and curves (or curved parts) are not covered. This reduces the aesthetics for the user because the user may perceive some internal components as defects such as stains. In addition, the insulating layer made of inorganic materials is not as effective as the insulating layer made of organic materials in blocking moisture and oxygen from penetrating from the outside of the display device. In addition, the insulating layer made of inorganic materials may not cover foreign matter or particles that may be generated during the manufacturing process of the display device. When the insulating layer 730 is made of an organic material, the problem of cracking (or cracks) or disconnection in the wiring due to mechanical stress in the bending area can be solved during the manufacturing process of the display device including the bending area, during or after the bending process of the plate.

[0269] The first touch electrode 740_R, the second touch electrode, and the second touch connection electrode 740_C may be disposed on the insulating layer 730 .

[0270] The first touch electrode 740_R and the second touch electrode may be disposed to be spaced apart from each other by a predetermined distance. Figure 1 Two or more first touch electrodes 740_R adjacent to each other in the first direction (or the X-axis direction shown in FIG. 1 ) may be formed to be spaced apart from each other. Figure 1 Two or more first touch electrodes 740_R adjacent to each other in the X-axis direction (as shown in FIG. 1 ) may be connected to the first touch connection electrode 720 disposed between the plurality of first touch electrodes 740_R. For example, the plurality of first touch electrodes 740_R adjacent to each other may be connected to the first touch connection electrode 720 through holes in the insulating layer 730.

[0271] In the second direction (or Figure 1 The second touch electrodes adjacent to each other (in the Y-axis direction shown in the figure) can be connected by the second touch connection electrode 740_C. The second touch electrode and the second touch connection electrode 740_C can be formed at the same layer. For example, the second touch connection electrode 740_C can be arranged between the plurality of second touch electrodes at the same layer as the second touch electrode. The second touch connection electrode 740_C can be formed to extend from the second touch electrode.

[0272] The first touch electrode 740_R, the second touch electrode, and the second touch connection electrode 740_C may be formed through the same process (or process).

[0273] The protective layer 750 may be disposed on the first touch electrode 740_R, the second touch electrode, and the second touch connection electrode 740_C. For example, the protective layer 750 may be a planarization layer, a touch planarization layer, a tenth insulating layer, or a third protective layer, but the embodiments of the present disclosure are not limited thereto.

[0274] The touch drive circuit may receive a touch detection signal from the first touch electrode 740_R. The touch drive circuit may receive a touch drive signal from the second touch electrode. The touch drive circuit may detect a user's touch using mutual capacitance between the plurality of first touch electrodes 740_R and the second touch electrodes. For example, when a touch is made on the display device 1000, a capacitance change between the first touch electrode 740_R and the second touch electrode may occur. The touch drive circuit may detect the touch coordinates by detecting the capacitance change.

[0275] Fig. 9 is a cross-sectional view of a light emitting portion according to an embodiment of the present disclosure.

[0276] right Fig. 9 The description of the light emitting unit shown can also be applied to Figure 8 .

[0277] A stack structure may be configured by stacking a plurality of light emitting units between the first electrode 510 and the second electrode 550. Fig. 9 Although two light emitting units are shown in FIG. 1 , a plurality of light emitting units of two or more may be configured, and the embodiments of the present disclosure are not limited thereto.

[0278] refer to Fig. 9 , the light emitting unit may include a first light emitting unit 541 and a second light emitting unit 542, and a charge generation layer (CGL) 60 may be additionally disposed between the plurality of light emitting units. For example, the charge generation layer 60 may be disposed between the first light emitting unit 541 and the second light emitting unit 542.

[0279] Compared with a light-emitting element layer configured with one organic layer or one light-emitting unit, a light-emitting element layer configured with multiple light-emitting units can have improved luminous efficiency and longer life. For example, since multiple light-emitting units are connected in series to meet the conditions of light emission amount or light intensity required in the display device, stress and current concentration caused by resistance or degradation of a single organic layer or a single light-emitting unit can be dispersed. Therefore, the reliability of the display device can be improved due to the improvement and increase of the efficiency and life of each light-emitting unit.

[0280] The charge generation layer (CGL) 60 may be disposed between a plurality of light-emitting units to control charge balance. The charge generation layer 60 may include an N-type charge generation layer (N-CGL) and a P-type charge generation layer (P-CGL). The N-type charge generation layer (N-CGL) is used to inject electrons into the light-emitting unit. The N-type charge generation layer (N-CGL) may be made of an organic layer doped with an alkali metal such as lithium (Li), sodium (Na), potassium (K) or cesium (Cs) or an alkaline earth metal such as magnesium (Mg), strontium (Sr), barium (Ba) or radium (Ra), but is not limited thereto. The P-type charge generation layer (P-CGL) is used to inject holes into the light-emitting unit. The P-type charge generation layer (P-CGL) may be made of an organic layer including a P-type dopant, but is not limited thereto.

[0281] In the present disclosure, the pixel P disposed in the display area AA may further include a plurality of sub-pixels (e.g., first, second, and third sub-pixels SP-1, SP-2, and SP-3, but not limited thereto). The first, second, and third sub-pixels SP-1, SP-2, and SP-3 are separate units that emit light. The plurality of sub-pixels may include red, green, blue, and / or white sub-pixels, but not limited thereto.

[0282] The first sub-pixel SP-1, the second sub-pixel SP-2, and the third sub-pixel SP-3 can emit light of different colors. Each of the first sub-pixel SP-1, the second sub-pixel SP-2, and the third sub-pixel SP-3 can emit at least one of red, green, and blue (light). In the present disclosure, it will be described that the first sub-pixel SP-1 emits red (light), the second sub-pixel SP-2 emits green (light), and the third sub-pixel SP-3 emits blue (light).

[0283] The first light emitting unit 541 may be disposed on the first electrode 510. The first light emitting unit 541 may include a first hole transport layer (HTL) 51, a first emission layer (EML) 52, and a first electron transport layer (ETL) 53. The first light emitting unit 541 may further include a hole injection layer (HIL) and / or an electron blocking layer (EBL). The hole injection layer (HIL) and the electron blocking layer (EBL) may be disposed between the first electrode 510 and the first hole transport layer (HTL) 51.

[0284] A hole injection layer (HIL) may be disposed on the first electrode 510. The hole injection layer (HIL) may serve to smoothly inject holes from the first electrode 510 into the first hole transport layer (HTL) 51.

[0285] The first hole transport layer (HTL) 51 may be disposed on the first electrode 510 or the hole injection layer (HIL). The first hole transport layer (HTL) 51 may supply holes from the first electrode 510 or the hole injection layer (HIL) to the first emission layer (EML) 52. The first hole transport layer (HTL) 51 may be configured by applying at least two layers or at least two materials.

[0286] The first emission layer (EML) 52 may be disposed on the first hole transport layer (HTL) 51. In the first emission layer (EML) 52, light may be generated as (or due to) holes supplied through the first hole transport layer (HTL) 51 and electrons supplied through the first electron transport layer (ETL) 53 are recombined. The first emission layer (EML) 52 may further include a first auxiliary emission layer on or below the first emission layer (EML) 52.

[0287] A different emission layer may be provided for each sub-pixel in the first emission layer (EML) 52. For example, the first emission layer (EML) 52 may include a first red emission layer 52-R, a first green emission layer 52-G, and a first blue emission layer 52-B.

[0288] The first red emission layer 52-R disposed in the first sub-pixel SP-1 may emit red (light). A wavelength band of light emitted from the first red emission layer 52-R may be in the range of 640 nm (nanometers) to 700 nm.

[0289] The first green emission layer 52-G disposed in the second sub-pixel SP-2 may emit green (light). A wavelength band of light emitted from the first green emission layer 52-G may be in the range of 510 nm to 580 nm.

[0290] The first blue emission layer 52-B disposed in the third sub-pixel SP-3 may emit blue (light). A wavelength band of light emitted from the first blue emission layer 52-B may be in the range of 440 nm to 480 nm.

[0291] The first emission layer (EML) 52 may be configured with at least one matrix and at least one dopant. Alternatively, the first emission layer (EML) 52 may be configured with a mixed matrix and at least one dopant, wherein in the mixed matrix, at least two matrices are mixed. In the mixed matrix, a matrix having hole transport properties and a matrix having electron transport properties may be included. When the mixed matrix is ​​configured, the charge balance of the emission layer may be controlled, and therefore, the efficiency of the emission layer may be improved. The dopant may be configured with a fluorescent dopant or a phosphorescent dopant.

[0292] The first electron transport layer (ETL) 53 may be disposed on the first emission layer (EML) 52. The first electron transport layer (ETL) 53 may supply electrons received from the charge generation layer 60 to the first emission layer (EML) 52. Therefore, in the first emission layer (EML) 52, as holes supplied through the first hole transport layer (HTL) 51 and electrons supplied through the first electron transport layer (ETL) 53 are recombined, light may be generated.

[0293] The first electron transport layer (ETL) 53 may be configured by applying at least two layers or at least two materials. An electron injection layer (EIL) may be further configured on the first electron transport layer (ETL) 53 .

[0294] In order to improve the efficiency of the first emission layer (EML) 52, an electron blocking layer (EBL) and a hole blocking layer (HBL) may be further included. The electron blocking layer (EBL) may be disposed between the first hole transport layer (HTL) 51 and the first emission layer (EML) 52, and the hole blocking layer (HBL) may be disposed between the first electron transport layer (ETL) 53 and the first emission layer (EML) 52.

[0295] The charge generation layer 60 may be disposed on the first light emitting unit 541. The charge generation layer 60 may include an N-type charge generation layer (N-CGL) that supplies electrons to the first light emitting unit 541 and a P-type charge generation layer (P-CGL) that supplies holes to the second light emitting unit 542. The N-type charge generation layer (N-CGL) may be disposed adjacent to the first light emitting unit 541, and the P-type charge generation layer (P-CGL) may be disposed adjacent to the second light emitting unit 542. For example, the N-type charge generation layer (N-CGL) may be disposed on the first light emitting unit 541, and the P-type charge generation layer (P-CGL) may be disposed on the N-type charge generation layer (N-CGL).

[0296] The second light emitting unit 542 may be disposed on the charge generation layer 60. The second light emitting unit 542 may include a second hole transport layer (HTL) 54, a second emission layer (EML) 55, and a second electron transport layer (ETL) 56. The second light emitting unit 542 may further include a hole injection layer (HIL) and / or an electron blocking layer (EBL). The hole injection layer (HIL) and the electron blocking layer (EBL) may be disposed between the charge generation layer 60 and the second hole transport layer (HTL) 54.

[0297] The second hole transport layer (HTL) 54 may be disposed on the charge generation layer 60. The second hole transport layer (HTL) 54 may supply holes from the P-type charge generation layer (P-CGL) of the charge generation layer 60 to the second emission layer (EML) 55. The second hole transport layer (HTL) 54 may be configured by applying at least two layers or at least two materials.

[0298] The second emission layer (EML) 55 may be disposed on the second hole transport layer (HTL) 54. In the second emission layer (EML) 55, as (or due to) holes supplied through the second hole transport layer (HTL) 54 and electrons supplied through the second electron transport layer (ETL) 56 are recombined, light may be generated.

[0299] A different emission layer may be provided for each sub-pixel in the second emission layer (EML) 55. For example, the second emission layer (EML) 55 may include a second red emission layer 55-R, a second green emission layer 55-G, and a second blue emission layer 55-B.

[0300] The second red emission layer 55-R disposed in the first sub-pixel SP-1 may emit red (light). A wavelength band of light emitted from the second red emission layer 55-R may be in the range of 600nm to 700nm.

[0301] The second green emission layer 55-G disposed in the second sub-pixel SP-2 may emit green (light). A wavelength band of light emitted from the second green emission layer 55-G may be in the range of 510 nm to 590 nm.

[0302] The second blue emission layer 55-B disposed in the third sub-pixel SP-3 may emit blue (light). The wavelength band of light emitted from the second blue emission layer 55-B may be in the range of 440nm to 480nm. The second emission layer (EML) 55 may further include a second auxiliary emission layer on or below the second emission layer (EML) 55.

[0303] The second emission layer (EML) 55 may be configured with at least one matrix and at least one dopant. Alternatively, the second emission layer (EML) 55 may be configured with a mixed matrix and at least one dopant, wherein in the mixed matrix, at least two matrices are mixed. In the mixed matrix, a matrix having hole transport properties and a matrix having electron transport properties may be included. When the mixed matrix is ​​configured, the charge balance of the emission layer may be controlled, and therefore, the efficiency of the emission layer may be improved. The dopant may be configured with a fluorescent dopant or a phosphorescent dopant.

[0304] The second electron transport layer (ETL) 56 may be disposed on the second emission layer (EML) 55. The second electron transport layer (ETL) 56 may supply electrons received from the second charge generation layer to the second emission layer (EML) 55. Therefore, in the second emission layer (EML) 55, since holes supplied through the second hole transport layer (HTL) 54 and electrons supplied through the second electron transport layer (ETL) 56 are recombined, light may be generated.

[0305] The second electron transport layer (ETL) 56 may be configured by applying at least two layers or at least two materials. An electron injection layer (EIL) may be further configured on the second electron transport layer (ETL) 56 .

[0306] In order to improve the efficiency of the second emission layer (EML) 55, an electron blocking layer (EBL) and a hole blocking layer (HBL) may be further included. The electron blocking layer (EBL) may be disposed between the second hole transport layer (HTL) 54 and the second emission layer (EML) 55, and the hole blocking layer (HBL) may be disposed between the second electron transport layer (ETL) 56 and the second emission layer (EML) 55.

[0307] A display device according to an embodiment of the present disclosure can be described as follows.

[0308] A display device according to an embodiment of the present disclosure may include (or comprise): a display panel, which includes a plurality of non-bending areas and a bending area arranged between the plurality of non-bending areas; a first protective member, which is arranged on the display panel, at least in the bending area; a second protective member arranged on the first protective member; and a third protective member arranged on the second protective member.

[0309] In the display device according to the embodiment of the present disclosure, the second protective member may cover one end of the first protective member.

[0310] In the display device according to the embodiment of the present disclosure, one end of the second protective member may contact at least a portion of the display panel.

[0311] In the display device according to the embodiment of the present disclosure, the first protective member and the second protective member may be disposed along the bending area, and the third protective member may cover a side surface of the bending area.

[0312] In the display device according to the embodiment of the present disclosure, the second protective member and the third protective member may be made of different materials.

[0313] In the display device according to the embodiment of the present disclosure, the second protective member may include an ultraviolet blocking material.

[0314] In the display device according to the embodiment of the present disclosure, the third protective member may include an ultraviolet transmissive material.

[0315] In the display device according to the embodiment of the present disclosure, the first protective member and the third protective member may include resin.

[0316] In the display device according to the embodiment of the present disclosure, the second protective member may include a black material.

[0317] In the display device according to the embodiment of the present disclosure, the second protective member may have an adhesive property.

[0318] In the display device according to the embodiment of the present disclosure, the tensile modulus of the first protective member may be different from the tensile modulus of the third protective member.

[0319] In the display device according to the embodiment of the present disclosure, the tensile modulus of the third protective member may be equal to or smaller than that of the first protective member.

[0320] The display device according to an embodiment of the present disclosure may include a polarizer disposed on the display panel and contacting one end of the first protective member and one end of the second protective member.

[0321] The display device according to an embodiment of the present disclosure may include a flexible film disposed to be spaced apart from one end of the first protective member and one end of the second protective member.

[0322] In the display device according to the embodiment of the present disclosure, the third protective member may cover the bending area and a portion of the plurality of non-bending areas.

[0323] The display device according to the embodiment of the present disclosure may further include a front surface member contacting the third protective member.

[0324] In the display device according to the embodiment of the present disclosure, the second protection member may overlap with the support member disposed on the rear surface of the display panel.

[0325] In the display device according to the embodiment of the present disclosure, the display panel may include a flexible display panel (in other words, the display panel may be a flexible display panel).

[0326] In the display device according to the embodiment of the present disclosure, the display panel may further include a thin film transistor and a light emitting element layer, and the light emitting element layer may include an organic material or an inorganic material.

[0327] In the display device according to the embodiment of the present disclosure, the light emitting element layer may include a plurality of light emitting portions, and the light emitting element layer may include a charge generation layer between the plurality of light emitting portions.

[0328] In the display device according to the embodiment of the present disclosure, the tensile modulus of the third protective member may be greater than that of the first protective member.

[0329] The display device according to one or more embodiments of the present disclosure can be applied to or included in mobile devices, video phones, smart watches, watch phones, wearable devices, foldable devices, rollable devices, bendable devices, flexible devices, curved devices, sliding devices, variable devices, electronic notebooks, electronic books, portable multimedia players (PMP), personal digital assistants (PDAs), MP3 players, mobile medical devices, desktop PCs, laptop PCs, netbook computers, workstations, navigation, vehicle navigation, vehicle display devices, vehicle devices, theater devices, theater display devices, televisions, wallpaper devices, sign devices, gaming devices, laptop computers (notebook computers), monitors, cameras, video cameras, and household appliances. In addition, the display device of one or more embodiments of the present disclosure can be applied to or included in an organic light-emitting lighting device or an inorganic light-emitting lighting device.

[0330] Although the exemplary embodiments of the present disclosure have been described in detail with reference to the accompanying drawings, the present disclosure is not limited thereto and can be implemented in many different forms without departing from the technical concept of the present disclosure. Therefore, the exemplary embodiments of the present disclosure are only for illustrative purposes and are not intended to limit the technical concept of the present disclosure. The scope of the technical concept of the present disclosure is not limited thereto. Therefore, it should be understood that the above exemplary embodiments are illustrative in all aspects and do not limit the present disclosure.

Claims

1. A display device, comprising: A display panel comprising a plurality of non-bending regions and a bending region between the plurality of non-bending regions; A first protective member, which is located at least on a curved area of ​​the display panel; a second protection member, located on the first protection member; as well as A third protection member is located on the second protection member.

2. The display device according to claim 1, wherein: The second protective member covers one end of the first protective member.

3. The display device according to claim 1, wherein: One end of the second protection member contacts at least a portion of the display panel.

4. The display device according to claim 1, wherein: The first protective member and the second protective member are along the bending area, and the third protective member covers a side surface of the bending area.

5. The display device according to claim 1, wherein: The second protection member and the third protection member are made of different materials.

6. The display device according to claim 1, wherein: The second protective member includes an ultraviolet blocking material.

7. The display device according to claim 1, wherein: The third protective member includes an ultraviolet-transmitting material.

8. The display device according to claim 1, wherein: The first protective member and the third protective member include resin.

9. The display device according to claim 1, wherein: The second protection member includes a black material.

10. The display device according to claim 8, wherein: The second protective member has an adhesive property.

11. The display device according to claim 1, wherein: The tensile modulus of the first protective member is different from the tensile modulus of the third protective member.

12. The display device according to claim 11, wherein: The tensile modulus of the third protective member is equal to or smaller than the tensile modulus of the first protective member.

13. The display device according to claim 1, further comprising: A polarizer is located on the display panel, the polarizer contacting one end of the first protection member and one end of the second protection member.

14. The display device according to claim 1, further comprising: A flexible film is spaced apart from one end of the first protective member and one end of the second protective member.

15. The display device according to claim 1, wherein: The third protective member covers the bending region and a portion of the plurality of non-bending regions.

16. The display device according to claim 1, further comprising: A front surface member contacts the third protective member.

17. The display device according to claim 1, wherein: The second protection member overlaps a support member located on a rear surface of the display panel.

18. The display device according to claim 1, wherein: The display panel includes a flexible display panel.

19. The display device according to claim 1, wherein: The display panel further includes a thin film transistor and a light emitting element layer, and the light emitting element layer includes an organic material or an inorganic material.

20. The display device according to claim 19, wherein: The light emitting element layer includes a plurality of light emitting portions and a charge generating layer located between the plurality of light emitting portions.

21. The display device according to claim 11, wherein: The tensile modulus of the third protective member is greater than the tensile modulus of the first protective member.

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