Method and device for improving strain loading accuracy of high temperature strain gauge parameter calibration device

Abstract

The present application proposes a method and device for improving the strain loading accuracy of a high-temperature strain gauge parameter calibration device, the method comprising: determining the target mechanical strain of the calibration beam and other strain segments; determining the linear expansion coefficient of the calibration beam and the fixture material at high temperature, and calculating the corrected calibration beam support length and calibration beam thickness according to the linear expansion coefficient; calculating the length and height of the side pull arm after thermal expansion of the material according to the linear expansion coefficient of the fixture material, and calculating the deformation of the loading point based on the calibration beam loading point position and deflection curve method; calculating the distance between the loading point and the support point of the corrected calibration beam according to the length, height and loading point deformation of the side pull arm after thermal expansion of the material; obtaining the corrected target deflection value according to the target mechanical strain and the corrected calibration beam support length, calibration beam thickness and the distance between the loading point and the support point of the calibration beam, and using the target deflection value as feedback to control loading. The present application can effectively improve the high-temperature strain measurement accuracy.

Description

Technical Field

[0001] The present application relates to the field of high-temperature strain gauge measurement, and in particular to a method and device for improving the strain loading accuracy of a high-temperature strain gauge parameter calibration device. Background Art

[0002] The structure of the high temperature strain gauge parameter calibration device refers to GB / T 13992-2010 "Metal Bonded Resistance Strain Gauge", which is mainly composed of a four-point bending equal strain calibration beam, a support and a loading connecting rod. The calibration beam is placed in a high temperature furnace in a simply supported form. The size and loading method are as follows Figure 1 As shown. During calibration, a symmetrical and equal load is applied to it, with the left and right ends as support points, and the equal strain area between the two loading points. Through the material mechanics deflection curve equation, the relationship between the equal strain segment strain of the calibration beam and the relative deformation of the midpoint and its dimensional parameters can be obtained. The loading action is controlled according to the target deformation value obtained by theoretical strain calculation. Since the elastic modulus and other parameters of the material will change with temperature under high temperature conditions, the deformation loading method can be used to propose the impact of the change in elastic modulus on the mechanical strain loading, ensuring that an accurate strain value is generated on the calibration beam, thereby improving the accuracy of calibration.

[0003] However, the existing high-temperature strain gauge parameter calibration device sets the parameters in the material mechanics deflection curve equation to constant values ​​when calculating the true strain, measures the deflection of the calibration beam midpoint through the displacement sensor, and calculates the mechanical strain of the calibration beam. However, in actual loading, there are two errors that cause errors in the calculation of mechanical strain by the material mechanics deflection curve equation: First, due to the influence of thermal expansion, the distance from the loading point to the support point on the same side in the material mechanics deflection curve equation at different temperatures, the thickness of the calibration beam, and the width of the calibration beam will change; second, during the loading process, the loading position changes due to the constraint of the loading roller by the connecting parts, that is, the distance from the force loading point to the support point on the same side changes, such as Figure 2 and Figure 3 As shown in the figure, the loading points A1 and A2 are constrained by the connecting parts, and their motion trajectory is an arc with R1 and R2 as the center, causing the loading points to become A1' and A2', making the distance from the force loading point to the support point on the same side changes have occurred.

[0004] Therefore, combined with the reasons mentioned above, the theoretical mechanical strain value calculated by calibrating the midpoint deflection of the beam produces an error, which in turn makes it impossible to guarantee the accuracy of the high-temperature strain result, affecting the accuracy of the key parameter precision compensation of the high-temperature strain gauge. Summary of the invention

[0005] The present application aims to solve one of the technical problems in the related art at least to some extent.

[0006] To this end, the first purpose of the present application is to propose a method and device for improving the strain loading accuracy of a high-temperature strain gauge parameter calibration device. For mechanical components used under high temperature conditions, the thermal expansion coefficient and material deformation of their materials are considered to avoid measurement errors caused by dimensional changes due to temperature changes.

[0007] To achieve the above-mentioned purpose, the first embodiment of the present application proposes a method for improving the strain loading accuracy of a high-temperature strain gauge parameter calibration device, comprising:

[0008] Determine the target mechanical strain of the equal strain segment of the calibration beam;

[0009] Determine the linear expansion coefficient of the calibration beam and the fixture material at high temperature, and calculate the corrected calibration beam support length and calibration beam thickness according to the linear expansion coefficient;

[0010] The length and height of the side pull arm after thermal expansion of the material are calculated according to the linear expansion coefficient of the fixture material, and the deformation of the loading point is calculated based on the calibration beam loading point position and deflection curve method;

[0011] According to the length and height of the side pull arm after thermal expansion of the material and the deformation of the loading point, calculate the distance between the loading point and the supporting point of the corrected calibration beam;

[0012] According to the target mechanical strain and the corrected calibration beam support length, calibration beam thickness and the distance between the loading point and the support point of the calibration beam, a corrected target deflection value is obtained, and the target deflection value is used as feedback to control the loading.

[0013] Optionally, determining the target mechanical strain of the equal strain segment of the calibration beam includes:

[0014] The deflection of the midpoint of the calibration beam is measured by a displacement sensor, and the length of the fulcrum of the calibration beam, the thickness of the calibration beam, and the distance between the loading point and the support point of the calibration beam are obtained;

[0015] According to the deflection of the midpoint of the calibration beam, the length of the fulcrum of the calibration beam, the thickness of the calibration beam and the distance between the loading point and the support point of the calibration beam, the target mechanical strain of the equal strain segment of the calibration beam is calculated, and the expression is:

[0016]

[0017] in, represents the target mechanical strain of the equal strain segment of the calibration beam, represents the deflection of the midpoint of the calibrated beam when loaded, It represents the distance between the two supporting points of the calibration beam, that is, the supporting point length of the calibration beam. Indicates the distance from the force loading point to the support point on the same side. Indicates the nominal beam thickness.

[0018] Optionally, determining the linear expansion coefficient of the calibration beam and the fixture material at high temperature, and calculating the corrected calibration beam support length and calibration beam thickness according to the linear expansion coefficient, comprises:

[0019]

[0020]

[0021] in, is the linear expansion coefficient of the fixture material at high temperature, is the linear expansion coefficient of the beam calibrated at high temperature, is the support distance constraint coefficient, is the temperature, is the corrected length of the calibrated beam support, is the corrected nominal beam thickness.

[0022] Optionally, the calculating the length and height of the side pull arm after thermal expansion of the material according to the linear expansion coefficient of the fixture material includes:

[0023]

[0024]

[0025] in, is the length of the side pull arm after thermal expansion, is the height of the side pull arm after thermal expansion.

[0026] Optionally, the method of calculating the deformation of the loading point based on the calibration beam loading point position and the deflection curve method includes:

[0027]

[0028] in, To calibrate the deformation of the beam loading point, is a coefficient, which represents the fixed coefficient relationship between the deformation at the loading point of the calibration beam and the deformation at the midpoint of the calibration beam.

[0029] Optionally, the calculating the distance between the loading point and the supporting point of the corrected calibration beam according to the length and height of the side pull arm after thermal expansion of the material and the deformation of the loading point includes:

[0030]

[0031] in, It is the distance between the loading point and the support point of the calibrated beam after correction.

[0032] Optionally, obtaining a corrected target deflection value according to the target mechanical strain and the corrected calibration beam support length, calibration beam thickness, and the distance between the loading point and the support point of the calibration beam includes:

[0033]

[0034] in, is the corrected target deflection value.

[0035] To achieve the above-mentioned purpose, the second embodiment of the present application proposes a device for improving the strain loading accuracy of a high-temperature strain gauge parameter calibration device, comprising:

[0036] A determination module, used for determining a target mechanical strain of an equal strain segment of a calibration beam;

[0037] A first calculation module is used to determine the linear expansion coefficient of the calibration beam and the fixture material at high temperature, and calculate the corrected calibration beam support length and calibration beam thickness according to the linear expansion coefficient;

[0038] The second calculation module is used to calculate the length and height of the side pull arm after thermal expansion of the material according to the linear expansion coefficient of the fixture material, and calculate the deformation of the loading point based on the calibration beam loading point position and deflection curve method;

[0039] The third calculation module is used to calculate the distance between the loading point and the support point of the corrected calibration beam according to the length and height of the side pull arm after thermal expansion of the material and the deformation of the loading point;

[0040] The fourth calculation module is used to obtain a corrected target deflection value based on the target mechanical strain and the corrected calibration beam support point length, calibration beam thickness and the distance between the loading point and the support point of the calibration beam, and use the target deflection value as feedback to control the loading.

[0041] To achieve the above-mentioned purpose, the third aspect of the present application provides an electronic device, including: a processor, and a memory communicatively connected to the processor;

[0042] The memory stores computer-executable instructions;

[0043] The processor executes the computer-executable instructions stored in the memory to implement the method as described in any one of the first aspects above.

[0044] To achieve the above-mentioned purpose, the fourth aspect embodiment of the present application proposes a computer-readable storage medium, in which computer execution instructions are stored. When the computer execution instructions are executed by a processor, they are used to implement the method as described in any one of the above-mentioned first aspects.

[0045] The technical solution provided by the embodiments of the present application brings at least the following beneficial effects:

[0046] Applied to the existing high-temperature strain gauge parameter calibration device, the influence of the thermal expansion coefficient of the calibration beam and supporting fixture materials on the deformation measurement results under high-temperature environment is considered on the original basis, and the geometric relationship between the strain of the equal strain section of the calibration beam during high-temperature loading and the required loading target deformation value is corrected, thereby improving the strain loading accuracy of the high-temperature strain gauge parameter calibration device, enabling it to calibrate the high-temperature strain gauge more accurately, thereby effectively improving the high-temperature strain measurement accuracy.

[0047] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0049] Figure 1 is a structural schematic diagram of a high temperature strain gauge parameter calibration device according to an embodiment of the present application;

[0050] Figure 2 is a schematic diagram of position changes during actual loading of a high-temperature strain gauge parameter calibration device according to an embodiment of the present application;

[0051] Figure 3 Schematic diagram of position change of a high temperature strain gauge parameter calibration device during actual loading according to an embodiment of the present application

[0052] Figure 4 It is a text calculation flow chart of a method for improving the strain loading accuracy of a high-temperature strain gauge parameter calibration device according to an embodiment of the present application;

[0053] Figure 5 It is a parameter calculation flow chart of a method for improving the strain loading accuracy of a high-temperature strain gauge parameter calibration device according to an embodiment of the present application;

[0054] Figure 6 It is a block diagram of a device for improving the strain loading accuracy of a high-temperature strain gauge parameter calibration device according to an embodiment of the present application;

[0055] Figure 7 It is a block diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0056] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present application, and should not be construed as limiting the present application.

[0057] The measurement error of contact high-temperature strain gauges due to the unknown characteristic parameters of their temperature changes often reaches or even exceeds the measured strain itself. The results of direct use in high-temperature measurements are bound to be inaccurate, so it is necessary to calibrate its key parameters through a calibration device.

[0058] At present, the structure of the high temperature strain gauge parameter calibration device refers to GB / T 13992-2010 "Metal Bonded Resistance Strain Gauge", which is mainly composed of a four-point bending equal strain calibration beam, a support and a loading connecting rod. The calibration beam is placed in a high temperature furnace in a simply supported form. The size and loading method are as follows Figure 1 As shown. During calibration, a symmetrical and equal load is applied to it, with the left and right ends as support points, and the equal strain area between the two loading points. Through the material mechanics deflection curve equation, the relationship between the equal strain segment strain of the calibration beam and the relative deformation of the midpoint and its dimensional parameters can be obtained. The loading action is controlled according to the target deformation value obtained by theoretical strain calculation. Since the elastic modulus and other parameters of the material will change with temperature under high temperature conditions, the deformation loading method can be used to propose the impact of the change in elastic modulus on the mechanical strain loading, ensuring that an accurate strain value is generated on the calibration beam, thereby improving the accuracy of calibration.

[0059] The equation of the material mechanics deflection curve is as follows:

[0060]

[0061] in, represents the target mechanical strain of the equal strain segment of the calibration beam, represents the deflection of the midpoint of the calibrated beam when loaded, It represents the distance between the two supporting points of the calibration beam, that is, the supporting point length of the calibration beam. Indicates the distance from the force loading point to the support point on the same side. Indicates the nominal beam thickness.

[0062] In addition, the strain of the calibrated beam iso-strain segment Distance from the support point of the calibration beam , the distance from the force loading point to the support point on the same side , calibrate beam thickness And the relative deformation of the midpoint of the calibration beam Related, among them , , Through machining accuracy assurance, Substituting the measurement results into the material mechanics deflection curve equation shown above can obtain the true strain of the calibration beam.

[0063] The existing high temperature strain gauge parameter calibration device sets the parameters in the material mechanics deflection curve equation to constant values ​​when calculating the true strain, and measures the deflection of the midpoint of the calibration beam through a displacement sensor. , calculate the mechanical strain of the calibration beam However, in actual loading, there are two errors that cause errors in the calculation of mechanical strain by the material mechanics deflection curve equation: First, due to the influence of thermal expansion, the material mechanics deflection curve equation at different temperatures , , will change; secondly, during the loading process, the loading position changes due to the constraint of the loading roller by the connecting parts, that is, Produce changes, such as Figure 2 and Figure 3 As shown in the figure, the loading points A1 and A2 are constrained by the connecting parts, and their motion trajectory is an arc with R1 and R2 as the center, causing the loading points to become A1' and A2', making the distance from the force loading point to the support point on the same side changes have occurred.

[0064] In order to solve the above problems, the present application proposes a method and device for improving the strain loading accuracy of a high-temperature strain gauge parameter calibration device. The method can more accurately simulate actual working conditions and effectively improve the strain loading accuracy of a high-temperature strain gauge parameter calibration device.

[0065] It is understandable that the thermal expansion of materials in high temperature environments may have a certain impact on their engineering applications. Therefore, for mechanical components used under high temperature conditions, it is necessary to consider the thermal expansion coefficient and material deformation of their materials to avoid measurement errors caused by dimensional changes due to temperature changes. This application is directed to a high-temperature strain gauge parameter calibration device, in which important calibration beams and support fixtures and other components are placed in a high-temperature furnace. The working temperature can reach up to 1200°C, and the target deformation load applied to the midpoint of the calibration beam is determined based on the theoretical strain. On the basis of the material mechanics deflection curve equation, this application considers the material deformation caused by thermal expansion of the calibration beam and the support fixture in a high temperature environment, and the change in loading position due to the movement of the connecting rod, determines the thermal expansion coefficient of the material at high temperature, and corrects the parameters such as the calibration beam size and the distance between the loading point and the support point according to the temperature and load. According to the target mechanical strain Calculate the target deformation value applied at the midpoint of the calibration beam

[0066] The following describes a method and device for improving the strain loading accuracy of a high-temperature strain gauge parameter calibration device according to an embodiment of the present application with reference to the accompanying drawings.

[0067] Figure 4 is a flow chart of a method for improving the strain loading accuracy of a high temperature strain gauge parameter calibration device according to an embodiment of the present application. Figure 1 As shown, the method comprises the following steps:

[0068] Step 101, determining the target mechanical strain of the equal strain segment of the calibration beam.

[0069] like Figure 5 As shown, due to the application of the target mechanical strain Calculate the target deflection value applied at the midpoint of the calibration beam Therefore, in this step, the deflection of the midpoint of the calibration beam is measured by the displacement sensor, and the length of the calibration beam support, the thickness of the calibration beam, and the distance between the loading point and the support point of the calibration beam are obtained. Then, according to the deflection of the midpoint of the calibration beam, the length of the calibration beam support, the thickness of the calibration beam, and the distance between the loading point and the support point of the calibration beam, the target mechanical strain of the equal strain segment of the calibration beam is calculated, and the expression is:

[0070]

[0071] in, represents the target mechanical strain of the equal strain segment of the calibration beam, represents the deflection of the midpoint of the calibrated beam when loaded, It represents the distance between the two supporting points of the calibration beam, that is, the supporting point length of the calibration beam. Indicates the distance from the force loading point to the support point on the same side. Indicates the nominal beam thickness.

[0072] Step 102, determining the linear expansion coefficient of the calibration beam and the fixture material at high temperature, and calculating the corrected calibration beam support length and calibration beam thickness according to the linear expansion coefficient.

[0073] It can be understood that the calibration beam support length and the calibration beam thickness are only affected by temperature changes. Therefore, in this application, the corrected calibration beam support length and calibration beam thickness can be calculated according to the thermocouple measured temperature of the high-temperature strain gauge parameter calibration device. The expression is:

[0074]

[0075]

[0076] in, is the linear expansion coefficient of the fixture material at high temperature, is the linear expansion coefficient of the beam calibrated at high temperature, is the support distance constraint coefficient, the default value is 1, is the temperature, is the corrected length of the calibrated beam support, is the corrected nominal beam thickness.

[0077] Step 103, calculating the length and height of the side pull arm after thermal expansion of the material according to the linear expansion coefficient of the fixture material, and calculating the deformation of the loading point based on the calibration beam loading point position and deflection curve method.

[0078] In the embodiment of the present application, Affected by the movement of the connecting rod and temperature changes, such as Figure 2 As shown, the loading point and Constrained by the connector, its motion trajectory is an arc with R1 and R2 as the center, causing the loading point to become and , so that the distance from the force loading point to the support point on the same side Changes. Figure 3 As shown in the figure, since the loading direction is downward tensile loading, the calibration beam bends downward after being loaded, and the distance from the force loading point to the support point on the same side is Therefore, the distance between the loading point and the support point of the corrected calibration beam needs to be calculated based on the length and height of the side pull arm after thermal expansion of the material and the deformation of the loading point.

[0079] Therefore, in this step, the length, height and deformation of the side pull arm after thermal expansion of the material are calculated.

[0080] first, and Affected by temperature changes, the length and height of the side pull arm after thermal expansion of the material can be calculated according to the actual temperature measured by the thermocouple of the high-temperature strain gauge parameter calibration device in this application. The expression is:

[0081]

[0082]

[0083] in, is the length of the side pull arm after thermal expansion, is the height of the side pull arm after thermal expansion.

[0084] In addition, the deformation of the loading point is further calculated based on the calibration beam loading point position and deflection curve method, including:

[0085]

[0086] in, To calibrate the deformation of the beam loading point, is a coefficient, which represents the fixed coefficient relationship between the deformation at the loading point of the calibration beam and the deformation at the midpoint of the calibration beam.

[0087] Step 104, calculating the distance between the loading point and the support point of the corrected calibration beam according to the length and height of the side pull arm after thermal expansion of the material and the deformation of the loading point.

[0088] In this step, based on the length, height and deformation of the side pull arm after thermal expansion of the material obtained in step 103, the distance between the loading point and the support point of the corrected calibration beam is calculated, and the expression is:

[0089]

[0090] in, It is the distance between the loading point and the support point of the calibrated beam after correction.

[0091] Step 105, obtaining a corrected target deflection value according to the target mechanical strain and the corrected calibration beam support length, calibration beam thickness and the distance between the loading point and the support point of the calibration beam, and using the target deflection value as feedback to control loading.

[0092] In the embodiment of the present application, after obtaining the target mechanical strain and the corrected calibration beam support length, calibration beam thickness, and the distance between the loading point and the support point of the calibration beam, the corrected target deflection value can be obtained according to the following formula, which is expressed as follows:

[0093]

[0094] in, is the corrected target deflection value.

[0095] Furthermore, the target deflection value is used as feedback to control loading.

[0096] In summary, the present invention is applied to the existing high-temperature strain gauge parameter calibration device. On the original basis, the influence of the thermal expansion coefficient of the calibration beam and the supporting fixture and other materials on the deformation measurement results in a high-temperature environment is considered, and the geometric relationship between the strain of the equal strain section of the calibration beam during the high-temperature loading process and the required loading target deformation value is corrected, thereby improving the strain loading accuracy of the high-temperature strain gauge parameter calibration device, so that it can calibrate the high-temperature strain gauge more accurately, thereby effectively improving the high-temperature strain measurement accuracy.

[0097] Figure 6 1 is a block diagram of a device 10 for improving the strain loading accuracy of a high temperature strain gauge parameter calibration device according to an embodiment of the present application, comprising:

[0098] A determination module 100 is used to determine the target mechanical strain of the calibration beam iso-strain segment;

[0099] A first calculation module 200 is used to determine the linear expansion coefficient of the calibration beam and the fixture material at high temperature, and calculate the corrected calibration beam support length and calibration beam thickness according to the linear expansion coefficient;

[0100] The second calculation module 300 is used to calculate the length and height of the side pull arm after thermal expansion of the material according to the linear expansion coefficient of the fixture material, and calculate the deformation of the loading point based on the calibration beam loading point position and deflection curve method;

[0101] The third calculation module 400 is used to calculate the distance between the loading point and the support point of the corrected calibration beam according to the length and height of the side pull arm after thermal expansion of the material and the deformation of the loading point;

[0102] The fourth calculation module 500 is used to obtain a corrected target deflection value based on the target mechanical strain and the corrected calibration beam support point length, calibration beam thickness and the distance between the loading point and the support point of the calibration beam, and use the target deflection value as feedback to control the loading.

[0103] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0104] Figure 7 A schematic block diagram of an example electronic device 700 that can be used to implement an embodiment of the present application is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processing, cellular phones, smart phones, wearable devices, and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the present application described and / or required herein.

[0105] like Figure 6 As shown, the device 700 includes a computing unit 701, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 702 or a computer program loaded from a storage unit 708 into a random access memory (RAM) 703. In the RAM 703, various programs and data required for the operation of the device 700 can also be stored. The computing unit 701, the ROM 702, and the RAM 703 are connected to each other via a bus 704. An input / output (I / O) interface 705 is also connected to the bus 704.

[0106] A number of components in the device 700 are connected to the I / O interface 705, including: an input unit 706, such as a keyboard, a mouse, etc.; an output unit 707, such as various types of displays, speakers, etc.; a storage unit 708, such as a disk, an optical disk, etc.; and a communication unit 709, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 709 allows the device 700 to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks.

[0107] The computing unit 701 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 701 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various dedicated artificial intelligence (AI) computing chips, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 701 performs the various methods and processes described above, such as the voice instruction response method. For example, in some embodiments, the voice instruction response method may be implemented as a computer software program, which is tangibly contained in a machine-readable medium, such as a storage unit 708. In some embodiments, part or all of the computer program may be loaded and / or installed on the device 700 via the ROM 702 and / or the communication unit 709. When the computer program is loaded into the RAM 703 and executed by the computing unit 701, one or more steps of the voice instruction response method described above may be performed. Alternatively, in other embodiments, the computing unit 701 may be configured to perform the voice instruction response method in any other appropriate manner (e.g., by means of firmware).

[0108] Various implementations of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field programmable gate arrays (FPGAs), application specific integrated circuits (ASICs), application specific standard products (ASSPs), systems on chips (SOCs), load programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various implementations can include: being implemented in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which can be a special purpose or general purpose programmable processor that can receive data and instructions from a storage system, at least one input device, and at least one output device, and transmit data and instructions to the storage system, the at least one input device, and the at least one output device.

[0109] The program code for implementing the method of the present application can be written in any combination of one or more programming languages. These program codes can be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the program code, when executed by the processor or controller, implements the functions / operations specified in the flow chart and / or block diagram. The program code can be executed entirely on the machine, partially on the machine, partially on the machine and partially on a remote machine as a stand-alone software package, or entirely on a remote machine or server.

[0110] In the context of the present application, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or equipment. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable medium may include, but is not limited to, an electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, device, or device, or any suitable combination of the foregoing. A more specific example of a machine-readable storage medium may include an electrical connection based on one or more lines, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disk read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.

[0111] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user can provide input to the computer. Other types of devices can also be used to provide interaction with the user; for example, the feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including acoustic input, voice input, or tactile input).

[0112] The systems and techniques described herein may be implemented in a computing system that includes backend components (e.g., as a data server), or a computing system that includes middleware components (e.g., an application server), or a computing system that includes frontend components (e.g., a user computer with a graphical user interface or a web browser through which a user can interact with implementations of the systems and techniques described herein), or a computing system that includes any combination of such backend components, middleware components, or frontend components. The components of the system may be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include: a local area network (LAN), a wide area network (WAN), the Internet, and a blockchain network.

[0113] A computer system may include a client and a server. The client and the server are generally remote from each other and usually interact through a communication network. The relationship between the client and the server is generated by computer programs running on the corresponding computers and having a client-server relationship with each other. The server may be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system to solve the defects of difficult management and weak business scalability in traditional physical hosts and VPS services ("Virtual Private Server", or "VPS" for short). The server may also be a server of a distributed system, or a server combined with a blockchain.

[0114] It should be understood that the various forms of processes shown above can be used to reorder, add or delete steps. For example, the steps recorded in this application can be executed in parallel, sequentially or in different orders, as long as the expected results of the technical solution of this application can be achieved, and this document is not limited here.

[0115] The above specific implementations do not constitute a limitation on the protection scope of this application. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of this application should be included in the protection scope of this application.

Claims

1. A method for improving the strain loading accuracy of a high temperature strain gauge parameter calibration device, characterized in that: include: Determine the target mechanical strain of the equal strain segment of the calibration beam; Determine the linear expansion coefficient of the calibration beam and the fixture material at high temperature, and calculate the corrected calibration beam support length and calibration beam thickness according to the linear expansion coefficient; The length and height of the side pull arm after thermal expansion of the material are calculated according to the linear expansion coefficient of the fixture material, and the deformation of the loading point is calculated based on the calibration beam loading point position and deflection curve method; According to the length and height of the side pull arm after thermal expansion of the material and the deformation of the loading point, calculate the distance between the loading point and the supporting point of the corrected calibration beam; According to the target mechanical strain and the corrected calibration beam support length, calibration beam thickness and the distance between the loading point and the support point of the calibration beam, a corrected target deflection value is obtained, and the target deflection value is used as feedback control loading; Determining the linear expansion coefficient of the calibration beam and the fixture material at high temperature, and calculating the corrected calibration beam support length and calibration beam thickness according to the linear expansion coefficient, including: in, is the linear expansion coefficient of the fixture material at high temperature, is the linear expansion coefficient of the beam calibrated at high temperature, is the support distance constraint coefficient, is the temperature, is the corrected length of the calibrated beam support, is the corrected calibration beam thickness, It represents the distance between the two supporting points of the calibration beam, that is, the supporting point length of the calibration beam. Indicates the nominal beam thickness; The method of calculating the length and height of the side pull arm after thermal expansion of the material according to the linear expansion coefficient of the fixture material comprises: in, is the length of the side pull arm after thermal expansion, is the height of the side pull arm after thermal expansion; The method of calculating the deformation of the loading point based on the calibration beam loading point position and the deflection curve method includes: in, represents the deflection of the midpoint of the calibrated beam when loaded, To calibrate the deformation of the beam loading point, is a coefficient, which represents the fixed coefficient relationship between the deformation of the loading point of the calibration beam and the deformation of the midpoint of the calibration beam; The method of calculating the distance between the loading point and the supporting point of the corrected calibration beam according to the length and height of the side pull arm after thermal expansion of the material and the deformation of the loading point comprises: in, It is the distance between the loading point and the support point of the calibrated beam after correction.

2. The method according to claim 1, characterized in that The step of determining the target mechanical strain of the equal strain segment of the calibration beam comprises: The deflection of the midpoint of the calibration beam is measured by a displacement sensor, and the length of the fulcrum of the calibration beam, the thickness of the calibration beam, and the distance between the loading point and the support point of the calibration beam are obtained; According to the deflection of the midpoint of the calibration beam, the length of the fulcrum of the calibration beam, the thickness of the calibration beam and the distance between the loading point and the support point of the calibration beam, the target mechanical strain of the equal strain segment of the calibration beam is calculated, and the expression is: in, represents the target mechanical strain of the equal strain segment of the calibration beam, Indicates the distance from the force loading point to the support point on the same side.

3. The method according to claim 2, characterized in that The method of obtaining a corrected target deflection value according to the target mechanical strain and the corrected calibration beam support length, calibration beam thickness, and the distance between the loading point and the support point of the calibration beam comprises: in, is the corrected target deflection value.

4. A device for improving the strain loading accuracy of a high temperature strain gauge parameter calibration device, characterized in that: include: A determination module, used for determining a target mechanical strain of an equal strain segment of a calibration beam; A first calculation module is used to determine the linear expansion coefficient of the calibration beam and the fixture material at high temperature, and calculate the corrected calibration beam support length and calibration beam thickness according to the linear expansion coefficient; The second calculation module is used to calculate the length and height of the side pull arm after thermal expansion of the material according to the linear expansion coefficient of the fixture material, and calculate the deformation of the loading point based on the calibration beam loading point position and deflection curve method; The third calculation module is used to calculate the distance between the loading point and the support point of the corrected calibration beam according to the length and height of the side pull arm after thermal expansion of the material and the deformation of the loading point; a fourth calculation module, for obtaining a corrected target deflection value according to the target mechanical strain and the corrected calibration beam support length, calibration beam thickness, and the distance between the loading point and the support point of the calibration beam, and using the target deflection value as feedback control loading; Determining the linear expansion coefficient of the calibration beam and the fixture material at high temperature, and calculating the corrected calibration beam support length and calibration beam thickness according to the linear expansion coefficient, including: in, is the linear expansion coefficient of the fixture material at high temperature, is the linear expansion coefficient of the beam calibrated at high temperature, is the support distance constraint coefficient, is the temperature, is the corrected length of the calibrated beam support, is the corrected calibration beam thickness, It represents the distance between the two supporting points of the calibration beam, that is, the supporting point length of the calibration beam. Indicates the nominal beam thickness; The method of calculating the length and height of the side pull arm after thermal expansion of the material according to the linear expansion coefficient of the fixture material comprises: in, is the length of the side pull arm after thermal expansion, is the height of the side pull arm after thermal expansion; The method of calculating the deformation of the loading point based on the calibration beam loading point position and the deflection curve method includes: in, represents the deflection of the midpoint of the calibrated beam when loaded, To calibrate the deformation of the beam loading point, is a coefficient, which represents the fixed coefficient relationship between the deformation of the loading point of the calibration beam and the deformation of the midpoint of the calibration beam; The method of calculating the distance between the loading point and the supporting point of the corrected calibration beam according to the length and height of the side pull arm after thermal expansion of the material and the deformation of the loading point comprises: in, It is the distance between the loading point and the support point of the calibrated beam after correction.

5. An electronic device, characterized in that: include: A processor, and a memory communicatively connected to the processor; The memory stores computer-executable instructions; The processor executes the computer-executable instructions stored in the memory to implement the method according to any one of claims 1 to 3.

6. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores computer-executable instructions, which are used to implement the method according to any one of claims 1 to 3 when executed by a processor.

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