Fault detection device for pneumoconiosis electronic nose chip

Abstract

A pneumoconiosis electronic nose chip fault detection device disclosed by the present invention comprises a chip main body, a sensor array, a hardware detection module and a circuit detection module, the chip main body is electrically connected with the sensor array, the chip main body is provided with the hardware detection module, and the hardware detection module comprises a structure detection module and a temperature detection module. The chip is electrically connected with a circuit detection module; according to the invention, the structure scanning detection module is used for detecting the possibility of faults caused by chip process defects, the temperature detection module is used for detecting the possibility of chip faults caused by temperature, and the sensor detection module is used for detecting the possibility of sensor and chip algorithm faults; the voltage detection module is used for detecting the possibility of faults caused by unstable voltage of the chip, so that the fault reasons of the chip are detected from multiple aspects, and the fault reasons of the chip are quickly found.

Description

Technical Field

[0001] The present invention relates to the technical field of equipment chip fault detection, and in particular to a pneumoconiosis electronic nose chip fault detection device. Background Art

[0002] The application of electronic nose technology in the field of medical diagnosis is gradually expanding to the detection of various diseases, including pneumoconiosis. Pneumoconiosis is a lung fibrosis disease caused by long-term inhalation of dust, and its diagnosis mainly relies on medical imaging examinations. However, as a new detection tool, the electronic nose shows potential application value in assisting the diagnosis of pneumoconiosis. The working principle of the electronic nose is to capture and analyze the odor molecules in the gas sample through a gas sensor array, and then identify specific odor patterns. In the context of pneumoconiosis, the electronic nose may be used to analyze the patient's respiratory gas sample, because certain specific compounds or odors may be associated with the development of pneumoconiosis. For example, the electronic nose may detect specific odor markers associated with lung inflammation or infection, which can be used as auxiliary indicators for diagnosing pneumoconiosis. The failure of the electronic nose chip may be caused by a variety of factors, including but not limited to process defects, excessive temperature, unstable voltage, external shock, electrostatic discharge, and mechanical damage. In view of these possible causes of failure, we can take a series of measures to troubleshoot and solve the faults. Therefore, the present invention proposes a pneumoconiosis electronic nose chip fault detection device to solve the problems existing in the prior art. Summary of the invention

[0003] In view of the above problems, the purpose of the present invention is to propose a pneumoconiosis electronic nose chip fault detection device, which detects the possibility of chip process defects causing faults through a structure scanning detection module, detects the possibility of chip failures caused by temperature through a temperature detection module, detects the possibility of sensor and chip algorithm failures through a sensor detection module, and detects the possibility of chip failures caused by unstable voltage through a voltage detection module, thereby realizing detection of chip failure causes from multiple aspects and quickly finding the chip failure causes.

[0004] To achieve the purpose of the present invention, the present invention is implemented through the following technical solutions: a pneumoconiosis electronic nose chip fault detection device, including a chip body, a sensor array, a hardware detection module, and a circuit detection module. The chip body is electrically connected with a sensor array, and a hardware detection module is provided on the chip body. The hardware detection module is used to detect defects in chip hardware. The hardware detection module includes a structure detection module and a temperature detection module. The structure detection module is used to scan and check the internal structure of the chip. The temperature detection module is used to detect the temperature of the chip during operation. The chip is electrically connected with a circuit detection module, and the circuit detection module is used to detect abnormal conditions in data collection and circuit voltage.

[0005] A further improvement is that the structure scanning detection module includes a scanning unit, an image storage unit and an image comparison unit, the scanning unit is used to scan and collect the chip structure, the image storage unit is used to save the scanned chip image, and the image comparison unit is used to compare the scanned chip structure image with the standard chip structure image to quickly find the location of the process defects in the faulty chip.

[0006] A further improvement is that the scanning unit includes a scanning electron microscope and a spectrometer for observing the structure and defects of the chip.

[0007] A further improvement is that the temperature detection module includes an infrared temperature measuring unit and a local temperature measuring unit. The infrared temperature measuring unit is used to display the overall temperature of the chip after converting the infrared radiation emitted by the chip into an electrical signal, and the local temperature measuring unit is used to measure the temperature of a specified position on the chip.

[0008] A further improvement is that: the infrared temperature measurement unit includes an infrared detector and a converter, the infrared detector is used to receive the infrared radiation emitted by the chip, the converter is used to convert the received infrared radiation signal into an electrical signal, and then display the temperature of the chip according to the change of the electrical signal; the local temperature measurement unit includes a temperature measuring probe and a wire, the temperature measuring probe is used to contact the specified position of the chip to collect temperature data and convert it into an electrical signal, and the wire is used to transmit the measured temperature data to the temperature display unit.

[0009] Further improvements are: the sensor detection module includes an odor release unit, a data collection unit and a parameter comparison unit. The odor release unit is used to release gas with a specified odor as needed during the detection process to facilitate the sensor array to receive and process it through the chip. The data collection unit is used to collect key parameters such as sensor sensitivity, response time and recovery time. The parameter comparison unit is used to compare the data generated by the chip after analyzing the released specific odor with the standard data, to detect whether the chip algorithm accurately performs the odor identification and classification tasks, and to quickly compare and filter out abnormal data.

[0010] Further improvements are: the voltage detection module includes a wiring unit, a power supply unit and a voltage detection unit, the wiring unit is used to provide a stable electrical connection between the chip and the voltage detection unit to avoid the detection result being affected by an unstable connection, the power supply unit is used to provide stable power to the chip to facilitate the simulation of the working environment of the chip, and the voltage detection unit is used to detect whether there is a voltage fluctuation when the chip is working.

[0011] The beneficial effects of the present invention are as follows: the present invention detects the possibility of chip failure caused by chip process defects through a structural scanning detection module, detects the possibility of chip failure caused by temperature through a temperature detection module, detects the possibility of sensor and chip algorithm failure through a sensor detection module, and detects the possibility of chip failure caused by unstable voltage through a voltage detection module, thereby realizing detection of the cause of chip failure from multiple aspects and quickly finding the cause of chip failure. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 is a system architecture diagram of the present invention;

[0013] Figure 2 This is a diagram of the hardware detection module architecture of the present invention;

[0014] Figure 3 This is a circuit detection module architecture diagram of the present invention. DETAILED DESCRIPTION

[0015] In order to deepen the understanding of the present invention, the present invention will be further described in detail below in conjunction with examples. The examples are only used to explain the present invention and do not constitute a limitation on the protection scope of the present invention.

[0016] according to Figure 1 , Figure 2 , Figure 3 As shown, this embodiment provides a pneumoconiosis electronic nose chip fault detection device, including a chip body, a sensor array, a hardware detection module, and a circuit detection module. The chip body is electrically connected to a sensor array, and a hardware detection module is provided on the chip body. The hardware detection module is used to detect defects in chip hardware. The hardware detection module includes a structure detection module and a temperature detection module. The structure detection module is used to scan and check the internal structure of the chip, and the temperature detection module is used to detect the temperature of the chip during operation. The chip is electrically connected to a circuit detection module, and the circuit detection module is used to detect abnormal conditions in data collection and circuit voltage.

[0017] The structure scanning detection module includes a scanning unit, an image storage unit and an image comparison unit. The scanning unit is used to scan and collect the chip structure. The scanning unit includes a scanning electron microscope and a spectrometer for observing the structure and defects of the chip. The image storage unit is used to save the scanned chip image. The image comparison unit is used to compare the scanned chip structure image with the standard chip structure image to quickly find the location of the process defect in the faulty chip. When it is suspected that the chip failure is caused by a process defect and is tested, the chip is unsealed and placed under the scanning unit to be scanned and observed by the scanning electron microscope and spectrometer and converted into an image. The image storage unit receives and saves the image, and the image comparison unit compares the scanned image with the standard chip image to identify defect areas such as metal layer corrosion or transistor offset and misalignment on the chip.

[0018] The temperature detection module includes an infrared temperature measuring unit and a local temperature measuring unit. The infrared temperature measuring unit is used to display the overall temperature of the chip after converting the infrared radiation emitted by the receiving chip into an electrical signal. The local temperature measuring unit is used to measure the temperature of a specified position on the chip. The infrared temperature measuring unit includes an infrared detector and a converter. The infrared detector is used to receive the infrared radiation emitted by the chip. The converter is used to convert the received infrared radiation signal into an electrical signal, and then display the temperature of the chip according to the change of the electrical signal. The local temperature measuring unit includes a temperature measuring probe and a wire. The temperature measuring probe is used to contact the specified position of the chip to collect temperature data and convert it into an electrical signal. The wire is used to transmit the measured temperature data to the temperature display unit. When it is suspected that the chip failure is related to the temperature, the infrared detector is aimed at the chip in the working state, and the infrared radiation emitted by the chip is received. The measured chip temperature is displayed after being converted into an electrical signal by the converter. When it is necessary to detect the temperature of the specified position of the chip, the end of the temperature measuring probe is attached to the corresponding position of the chip and the temperature change is converted into an electrical signal, which is then connected to the display device by the wire to display the temperature.

[0019] The sensor detection module includes an odor release unit, a data collection unit and a parameter comparison unit. The odor release unit is used to release gas with a specified odor as needed during the detection process so that the sensor array can receive it and then process it. The data collection unit is used to collect key parameters such as sensor sensitivity, response time and recovery time. The parameter comparison unit is used to compare the data generated by the chip after analyzing the released specific odor with the standard data, detect whether the chip algorithm accurately performs the odor identification and classification tasks, and quickly compare and filter out abnormal data. When it is suspected that the chip failure is caused by a sensor or chip analysis function failure, the odor release unit is placed next to the sensor array to release a specific odor. The sensor array receives the odor and converts it into an electrical signal. The data collection unit collects the status parameters of the sensor array to determine whether the sensor array has a fault. After receiving the parameter signal sent by the sensor array, the chip identifies and classifies the odor and outputs the data of the odor. After receiving the data, the parameter comparison unit compares it with the standard parameters corresponding to the odor, and compares the abnormal data output of the chip to determine the cause of the fault.

[0020] The voltage detection module includes a wiring unit, a power supply unit and a voltage detection unit. The wiring unit is used to provide a stable electrical connection between the chip and the voltage detection unit to avoid the detection result being affected by unstable connection. The power supply unit is used to provide stable power to the chip to facilitate the simulation of the working environment of the chip. The voltage detection unit is used to detect whether there is voltage fluctuation when the chip is working. When it is suspected that the chip failure is caused by unstable voltage, the wiring unit connects the chip, the power supply unit and the voltage detection unit, and the power supply unit provides a stable power supply to the chip. The voltage detection unit detects the voltage value on the chip to find the abnormal voltage area and determine the cause of the failure.

[0021] When the pneumoconiosis electronic nose chip fault detection device performs detection, the detection method is selected according to different chip fault causes. When it is suspected that the chip fault is caused by a chip process defect, the chip is opened and placed under the scanning unit for scanning to generate an image, which is stored by the image storage unit. The image comparison unit compares the stored image with the standard chip scanning image to find out the possible chip process defect area to determine the fault cause. When it is suspected that the chip fault is related to temperature, the infrared temperature measurement unit is aimed at the chip in the working state to receive the infrared radiation emitted by the chip for temperature measurement, and it is determined whether it is caused by temperature failure according to the overall temperature of the chip. When it is necessary to measure the temperature of a specific position of the chip, the temperature measurement probe in the local temperature measurement unit is contacted with the specified position of the chip for temperature measurement to determine whether the temperature is abnormal. When it is suspected that the chip fault is caused by a sensor failure and a chip analysis error, the odor release unit is placed next to the sensor array to release a specified odor. After receiving the specified odor, the sensor array converts the odor into an electrical signal. The data collection unit receives the converted electrical signal to determine whether the sensor is faulty. After receiving the electrical signal, the chip performs odor recognition and classification and outputs odor data. The parameter comparison unit compares the output odor data with the standard data of the corresponding odor to find out the abnormal data and determine the fault cause.

[0022] The above shows and describes the basic principles, main features and advantages of the present invention. It should be understood by those skilled in the art that the present invention is not limited to the above embodiments. The above embodiments and descriptions are only for explaining the principles of the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A pneumoconiosis electronic nose chip fault detection device, characterized by: It includes a chip body, a sensor array, a hardware detection module, and a circuit detection module. The chip body is electrically connected to a sensor array. The chip body is provided with a hardware detection module. The hardware detection module is used to detect defects in chip hardware. The hardware detection module includes a structure detection module and a temperature detection module. The structure detection module is used to scan and inspect the internal structure of the chip. The temperature detection module is used to detect the temperature of the chip during operation. The chip is electrically connected to a circuit detection module. The circuit detection module is used to detect abnormal conditions in data collection and circuit voltage.

2. A pneumoconiosis electronic nose chip fault detection device according to claim 1, characterized in that: The structure scanning detection module includes a scanning unit, an image storage unit and an image comparison unit. The scanning unit is used to scan and collect chip structures, the image storage unit is used to save the scanned chip image, and the image comparison unit is used to compare the scanned chip structure image with the standard chip structure image to quickly find the location of the process defects in the faulty chip.

3. A pneumoconiosis electronic nose chip fault detection device according to claim 2, characterized in that: The scanning unit includes a scanning electron microscope and a spectrometer for observing the structure and defects of the chip.

4. A pneumoconiosis electronic nose chip fault detection device according to claim 1, characterized in that: The temperature detection module includes an infrared temperature measurement unit and a local temperature measurement unit. The infrared temperature measurement unit is used to display the overall temperature of the chip after converting the infrared radiation emitted by the chip into an electrical signal, and the local temperature measurement unit is used to measure the temperature of a specified position on the chip.

5. A pneumoconiosis electronic nose chip fault detection device according to claim 4, characterized in that: The infrared temperature measurement unit includes an infrared detector and a converter. The infrared detector is used to receive infrared radiation emitted by the chip. The converter is used to convert the received infrared radiation signal into an electrical signal, and then display the temperature of the chip according to the change of the electrical signal. The local temperature measurement unit includes a temperature measurement probe and a wire. The temperature measurement probe is used to contact a specified position of the chip to collect temperature data and convert it into an electrical signal. The wire is used to transmit the measured temperature data to the temperature display unit.

6. A pneumoconiosis electronic nose chip fault detection device according to claim 1, characterized in that: The sensor detection module includes an odor release unit, a data collection unit and a parameter comparison unit. The odor release unit is used to release gas with a specified odor as needed during the detection process to facilitate the sensor array to receive and process it through the chip. The data collection unit is used to collect key parameters such as sensor sensitivity, response time and recovery time. The parameter comparison unit is used to compare the data generated by the chip after analyzing the released specific odor with the standard data, to detect whether the chip algorithm accurately performs the odor identification and classification tasks, and to quickly compare and filter out abnormal data.

7. The pneumoconiosis electronic nose chip fault detection device according to claim 1, characterized in that: The voltage detection module includes a wiring unit, a power supply unit and a voltage detection unit. The wiring unit is used to provide a stable electrical connection between the chip and the voltage detection unit to avoid the detection result being affected by an unstable connection. The power supply unit is used to provide stable power to the chip to facilitate the simulation of the working environment of the chip. The voltage detection unit is used to detect whether there is a voltage fluctuation when the chip is working.

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