An imaging method for a semiconductor dual-channel shared microscopic imaging device

Abstract

The invention discloses an imaging method of a semiconductor dual-channel shared microscopic imaging device, comprising a frame, a platform and a column, wherein the platform is arranged on the frame, the column is provided with a Z-axis movable frame and a second X-axis movable frame arranged on the Z-axis movable frame, the second X-axis movable frame is provided with a fixed seat extending toward the platform, and the fixed seat is located above a bearing seat; a pivotally arranged turntable is provided on the lower wall of the fixed seat, the turntable is arranged horizontally, and the turntable is provided with a plurality of microscope objective lenses arranged at intervals, a DD motor for driving the turntable to rotate is provided in the middle of the fixed seat, the fixed seat is provided with a fixed tower plate arranged opposite to the turntable, and the optical axis of the microscope objective lens, the optical axis of a black-and-white camera module and the optical axis of a color camera module are all arranged vertically; when the DD motor rotates, the turntable drives a predetermined microscope objective lens to rotate, and makes the optical axis of the predetermined microscope objective lens coincide with the optical axis of the black-and-white camera module and / or the optical axis of the color camera module.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor detection equipment, and in particular to an imaging method of a semiconductor dual-channel shared microscopic imaging device. Background Art

[0002] With the rapid development of semiconductor integrated circuits, wafer defects generally need to be detected after wafer production is completed. After the wafer defect detection is completed, if a defective wafer is found, a color camera needs to be used to take pictures of the detected defects to obtain the corresponding defect color photos, which are generally called reshoots, to facilitate the operator to re-judge the defect type.

[0003] However, the number of retakes during inspection will increase as the number of defects increases, the time spent will also increase accordingly, and the corresponding efficiency will also decrease, thus affecting the semiconductor production capacity.

[0004] Among them, the main factor affecting wafer detection is the switching efficiency between the microscope objective lens and the camera. For example, the existing Chinese patent CN202110989155.2, the existing practice (including the current imported detection equipment) mainly rotates the microscope objective lens converter, and then sends the detection image to the predetermined camera through the spectroscope, thereby realizing further detection of the wafer.

[0005] Correspondingly, its structure is also relatively complex. There is a base point between the microscope objective and the camera, so the accuracy requirement is high, and its rotation rate will be reduced accordingly. At the same time, it is also necessary to cooperate with the locking structure to ensure that the optical axis between the microscope objective and the camera is consistent. At the same time, the setting of the microscope objective converter also makes part of the detection mechanism larger in size, which affects the transportation and installation of the equipment, so the requirements for post-debugging are generally high.

[0006] At the same time, the existing microscope objective lens is generally tilted, so a spectroscope is also needed to refract the image signal (for example, Chinese patent CN202211058132.0) to achieve the reception of the image. In the actual production process, the signal attenuation (i.e., image formation) and positioning accuracy are also higher, so the debugging procedure is more complicated, which causes the problem of high cost of this type of detection equipment.

[0007] This is especially true for the back-end inspection of the tiny semiconductor chips on the wafer, that is, the wafer after processing is actually composed of semiconductor chips arranged in a matrix.

[0008] Specifically, after each exposure of the chip particles, the photolithography patterns and circuits need to be inspected in multiple dimensions to detect scratches, glue overflow, damage, and defects of the chip particles. Strictly control the flow of defective products into the next process, which affects the chip quality and generates production waste.

[0009] During the visual inspection process, there are several core technical challenges that need to be overcome:

[0010] 1. In addition to diverse lighting sources, a complex and diverse microscopic imaging system is also required to meet the following requirements: rapid scanning and searching → positioning → re-judgment → confirmation of marking;

[0011] 2. A variety of optical imaging systems, with the ability to take photos in color and black and white, which requires two independent optical microscopic imaging systems;

[0012] 3. Both imaging systems must have optical imaging microscope objective lenses of different magnifications that can be switched to meet actual application requirements;

[0013] 4. After switching between the color and black and white imaging systems and imaging microscopes (when the system is scanning defective products, it may be necessary to repeatedly determine, for example, the same microscope, different cameras or adjust different microscopes to improve the image resolution of a single image, thereby improving the judgment rate, such as in post-processing, to determine whether the process still has defects), it is necessary to quickly and accurately locate the same selected target;

[0014] In order to solve the above usage requirements and technical difficulties, the current method is:

[0015] Generally, a set of 5-hole "turret" arm wheel + 5-magnification metallographic microscope objective lens is used, which is connected to a large-array black-and-white CCD for imaging;

[0016] Another set of 5-hole "turret" arm wheel + 5-magnification metallographic microscope objective lens (same), connected to the small array color CCD imaging, is mechanically parallel superimposed and combined. Its disadvantage is obvious - the same configuration is used, but the cost is high;

[0017] The mechanical combination and superposition doubles the equipment space occupied, increases the difficulty of equipment production, and reduces the accuracy; the optical center distance of the color and black and white 5-hole optical imaging systems is far, the switching time is long (that is, it also includes focusing, the longer the center distance, the slower the switching of the distance adjustment), and the production efficiency is low. Summary of the invention

[0018] The main purpose of the present invention is to propose an imaging method for a semiconductor dual-channel shared microscopic imaging device, which aims to set a high-precision rotation drive device on the turret, and use the rotation drive device to cooperate with the turntable to drive a 5-hole microscope objective lens. At the same time, two sets of imaging devices, color and black and white, are integrated on the upper end of the turret. The 5 microscope objective lenses can be used in combination with the imaging devices at will. The repeated positioning accuracy of the optical center after switching the magnification is high. At the same time, the center distance of the two sets of optical microscope objective lenses is close, the equipment structure is compact, the moving distance is short, and the accuracy is high. At the same time, the production cost and debugging cost of the equipment are lower, which effectively improves the market competitiveness.

[0019] To achieve the above object, the present invention proposes a semiconductor dual-channel shared microscopic imaging device, comprising:

[0020] frame;

[0021] A platform, the platform is arranged on the frame, the platform comprises a Y-axis moving frame, a first X-axis moving frame arranged on the Y-axis moving frame, and a bearing seat arranged on the Y-axis moving frame, the bearing seat is used to place the product;

[0022] The column is extended upward from the frame, and the column is provided with a Z-axis movable frame and a second X-axis movable frame arranged on the Z-axis movable frame,

[0023] The second X-axis movable frame is provided with a fixed seat extending toward the platform, and the fixed seat is located above the bearing seat;

[0024] The lower wall of the fixed seat is provided with a pivotally arranged turntable, the turntable is arranged horizontally, and the turntable is provided with a plurality of microscope objective lenses arranged at intervals, and a DD motor for driving the turntable to rotate is provided in the middle of the fixed seat.

[0025] The rotation accuracy of the DD motor is ±1.5 arc seconds, and the DD motor is used to drive the turntable to rotate 360 ​​degrees;

[0026] The fixing seat is provided with a fixing tower plate arranged opposite to the rotating disk, and the fixing tower plate is provided with two sets of imaging modules arranged at intervals, and the imaging module comprises a barrel provided with an imaging channel, a camera module arranged at the upper end of the barrel, and a light source arranged at the barrel, and the light source is used to illuminate the focusing object surface;

[0027] The two imaging modules include a black and white camera module and a color camera module;

[0028] The optical axis of the microscope objective lens, the optical axis of the black and white camera module and the optical axis of the color camera module are all arranged vertically;

[0029] When the DD motor rotates, the turntable drives the predetermined microscope objective lens to rotate to match the black and white camera module and / or the color camera module, and makes the optical axis of the predetermined microscope objective lens coincide with the optical axis of the black and white camera module and / or the color camera module.

[0030] An imaging method of a semiconductor dual-channel shared microscopic imaging device, using the semiconductor dual-channel shared microscopic imaging device;

[0031] include:

[0032] S1, determining a first reference position for detection, the black-and-white camera module acquires a first black-and-white microscopic image, acquires a defect position, and marks a first position of the defect position;

[0033] S2: After obtaining the first position, the second X-axis moving frame drives the color camera module to move to the first reference position. At the same time, the microscope objective lens of the color camera module is adjusted to adjust the magnification of the color camera module to perform more precise imaging and magnification photography;

[0034] The color camera module acquires a second color microscopic image and marks the first position as a second position;

[0035] S3: According to the size and data of the defective position, the control device controls the Y-axis moving frame and the first X-axis moving frame to drive the bearing seat to move, and moves the defective position to the focus center;

[0036] S4: The black and white camera module or / the color camera module adjusts the objective lens magnification, and further obtains a second black and white microscopic image or a second color microscopic image of the defective position.

[0037] The device has the following advantages:

[0038] 1. It is simpler and smoother to obtain the reference position, and the switching efficiency is higher; in specific use, when the wafer is placed on the supporting seat, the Y-axis moving frame and the first X-axis moving frame drive the fixed seat to move the reference position of the wafer. After the predetermined image is obtained, the image finds a defect at the predetermined position of the wafer (the control device marks the first reference position). Then, according to the position of the defect, the first reference position can be moved to the image center of the black and white camera module or the color camera module through the first X-axis moving frame and the first Y-axis moving frame and the microscope objective lens is adjusted. Then, the black and white camera module or the color camera module marks the second reference position on the magnified first reference position;

[0039] Then, through the cooperation of the dual X-axis, Y-axis and Y-axis, the rapid cooperation of the product and the microscopic imaging equipment can be achieved, thereby achieving high-speed movement and high-speed image acquisition, thereby effectively improving the detection efficiency;

[0040] This avoids the need to adjust the microscope objective lens, beam splitter and other steps (i.e., two steps, and only one camera can obtain images at the same time) in existing equipment, thereby improving the detection efficiency. When the beam splitter is adjusted, the camera also needs to refocus. Although the time interval is short, when the number of products is large, the cumulative time will also increase, thereby reducing the detection efficiency;

[0041] 2. The image acquisition system is lower in height, which includes an imaging module and a microscope objective lens. The gap between the imaging module and the microscope objective lens is smaller. At the same time, the microscope objective lens is embedded in the turntable. Compared with the existing turret, it is thinner and does not need to be equipped with a beam splitter, so the size of the equipment is effectively reduced and the space occupied is smaller. Therefore, the position adjustment of the fixed seat and the bearing seat is smoother. First, the bearing capacity of the fixed seat is smaller, so the travel accuracy can be higher, so the image acquisition accuracy is more stable;

[0042] 3. The light source is formed in one piece in the barrel, which avoids the problem of complicated light source setting in existing microscope equipment, which is generally set in the beam splitter or in conjunction with the beam splitter;

[0043] 4. As the core driving component of the zoom device (i.e., the microscope objective lens combination), the DD motor has a physical subdivision capability of more than 1 million lines within a 360-degree rotation angle (it can be understood that the smaller the rotation angle of each frame, the higher the overlap between the optical axes, the higher the focusing accuracy and the higher the image acquisition clarity), and can reach an absolute precision of ±1.5 arc seconds and a radial and axial runout accuracy of ≤3UM;

[0044] Then, no positioning structure is required between the turntable and the fixed tower plate to achieve the coincidence of the optical axis of the microscope objective lens and the optical axis of the camera module, thereby ensuring the accuracy of the microscopic image, and making the optical focal length of the camera change faster, thereby improving the detection efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] Figure 1 It is a three-dimensional schematic diagram of the present invention;

[0046] Figure 2 It is a cross-sectional view of the present invention;

[0047] Figure 3 A three-dimensional diagram of the microscopic imaging mechanism Figure 1 ;

[0048] Figure 4 A three-dimensional diagram of the microscopic imaging mechanism Figure 2 ;

[0049] Figure 5 A half-section diagram of the microscopic imaging mechanism Figure 1 ;

[0050] Figure 6A half-section diagram of the microscopic imaging mechanism Figure 2 ;

[0051] Figure 7 This is a schematic diagram of the coordination between the Z-axis moving frame and the second X-axis moving frame;

[0052] Figure 8 Exploded view of the Z-axis moving frame and the second X-axis moving frame;

[0053] Fig. 9 It is a top view of the microscopic imaging mechanism;

[0054] Fig.10 This is an exploded view of the microscopic imaging mechanism;

[0055] Fig.11 It is a top view of the microscopic imaging mechanism;

[0056] Fig.12 It is a cross-sectional view of the microscopic imaging mechanism;

[0057] Fig.13 This is a cross-sectional view of the light source.

[0058] In the figure,

[0059] 1 is the rack,

[0060] 2 is a platform, 21 is a Y-axis moving frame, 22 is a first X-axis moving frame, 23 is a bearing seat,

[0061] 3 is a column, 31 is a Z-axis moving frame, 32 is a second X-axis moving frame, 31a is a counterweight balance rod,

[0062] 4 is a fixed seat, 41 is a turntable, 42 is a fixed tower plate,

[0063] 5 is an imaging module, 5a is a barrel, 5b is an imaging channel, 51 is a black and white camera module, 52 is a color camera module,

[0064] 6 is a microscope objective lens, 6a is a first angle, 6b is a second angle,

[0065] 7 is a DD motor, 71 is a positioning hole, 72 is a convex part, 73 is a groove,

[0066] 8 is a light source, 81 is a tube body, 82 is a light guide channel, 83 is a transfer tube, 84 is a refraction channel, 85 is a light guide mirror, and 85 is a coaxial light source. DETAILED DESCRIPTION

[0067] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0068] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back, top, bottom, inside, outside, vertical, horizontal, longitudinal, counterclockwise, clockwise, circumferential, radial, axial...), then the directional indication is only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0069] In addition, if there are descriptions involving "first" or "second" etc. in the embodiments of the present invention, the descriptions of "first" or "second" etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0070] like Figures 1 to 13 As shown, a semiconductor dual-channel shared microscopic imaging device comprises:

[0071] Rack 1;

[0072] Platform 2, the platform 2 is arranged on the frame 1, the platform 2 includes a Y-axis moving frame 21, a first X-axis moving frame 22 arranged on the Y-axis moving frame 21, and a bearing seat 23 arranged on the Y-axis moving frame 21, the bearing seat 23 is used to place the product;

[0073] The column 3 is extended upward from the frame 1, and the column 3 is provided with a Z-axis moving frame 31 and a second X-axis moving frame 32 provided on the Z-axis moving frame 31.

[0074] The second X-axis moving frame 32 is provided with a fixed seat 4 extending toward the platform 2, and the fixed seat 4 is located above the bearing seat 23;

[0075] The lower wall of the fixed seat 4 is provided with a pivoting turntable 41, the turntable 41 is arranged horizontally, and the turntable 41 is provided with a plurality of microscope objective lenses 6 arranged at intervals. The middle part of the fixed seat 4 is provided with a DD motor 7 for driving the turntable 41 to rotate.

[0076] The rotation accuracy of the DD motor 7 is ±1.5 arc seconds, and the DD motor 7 is used to drive the turntable 41 to rotate 360 ​​degrees;

[0077] The fixing seat 4 is provided with a fixing tower plate 42 arranged opposite to the rotating disk 41, and the fixing tower plate 42 is provided with two groups of imaging modules 5 arranged at intervals, and the imaging module 5 includes a cylinder body provided with an imaging channel 5b, a camera module arranged at the upper end of the cylinder body, and a light source 8 arranged at the cylinder body, and the light source 8 is used to illuminate the focusing object surface;

[0078] The two imaging modules 5 include a black and white camera module 51 and a color camera module 52;

[0079] The optical axis of the microscope objective lens 6, the optical axis of the black and white camera module 51 and the optical axis of the color camera module 52 are all arranged vertically;

[0080] When the DD motor 7 rotates, the turntable 41 drives the predetermined microscope objective lens 6 to rotate to match the black and white camera module 51 and / or the color camera module 52, and makes the optical axis of the predetermined microscope objective lens 6 coincide with the optical axis of the black and white camera module 51 and / or the optical axis of the color camera module 52.

[0081] The device has the following advantages:

[0082] 1. It is simpler and smoother to obtain the reference position, and the switching efficiency is higher; in specific use, when the wafer is placed on the supporting seat 23, the Y-axis moving frame and the first X-axis moving frame drive the fixed seat 4 to move the reference position of the wafer. After the predetermined image is obtained, the image finds a defect at the predetermined position of the wafer (the control device marks the first reference position). Then, according to the position of the defect, the first reference position can be moved to the image center of the black and white camera module 51 or the color camera module 52 by the first X-axis moving frame 22 and the first Y-axis moving frame 21 and the microscope objective 6 is adjusted, and then the black and white camera module 51 or the color camera module 52 marks the second reference position on the magnified first reference position;

[0083] Then, through the cooperation of the dual X-axis, Y-axis and Y-axis, the rapid cooperation of the product and the microscopic imaging equipment can be achieved, thereby achieving high-speed movement and high-speed image acquisition, thereby effectively improving the detection efficiency;

[0084] The existing equipment avoids the need to adjust the microscope objective lens 6, the beam splitter and other steps (i.e. two steps, and only one camera can obtain an image at the same time), thereby improving the detection efficiency. When the beam splitter is adjusted, the camera also needs to refocus. Although the time interval is short, when the number of products is large, the cumulative time will also increase, thereby reducing the detection efficiency;

[0085] 2. The image acquisition system has a lower height, which includes an imaging module 5 and a microscope objective lens 6. The gap between the imaging module 5 and the microscope objective lens 6 is smaller. At the same time, the microscope objective lens 6 is embedded in the turntable 41. Compared with the existing turret, it is thinner and does not need to be provided with a beam splitter, so the volume of the device is effectively reduced and the occupied space is smaller. Therefore, the fixed seat 4 and the bearing seat 23 are smoother when adjusting their positions. First, the bearing capacity of the fixed seat 4 is smaller, so the travel accuracy can be higher, so the image acquisition accuracy is more stable;

[0086] 3. The light source 8 is formed integrally in the barrel, which avoids the problem of complicated setting of the light source 8 in the existing microscope equipment, which is generally set in the beam splitter or in conjunction with the beam splitter;

[0087] 4. DD motor 7, as the core driving component of the zoom device (i.e., the microscope objective lens 6 combination), has a physical subdivision capability of more than 1 million lines within a 360-degree rotation angle (it can be understood that the smaller the rotation angle of each frame, the higher the overlap between the optical axes, the higher the focusing accuracy and the image acquisition clarity), and can reach an absolute positioning accuracy of ±1.5 arc seconds and a radial and axial runout accuracy of ≤3UM;

[0088] Then, no positioning structure is required between the turntable 41 and the fixed tower plate 42 to achieve the coincidence of the optical axis of the microscope objective lens 6 and the optical axis of the camera module, thereby ensuring the accuracy of the microscopic image, and making the optical focal length of the camera change faster, thereby improving the detection efficiency.

[0089] Specifically, the DD motor 7 is provided with a recorder for recording the stroke position; the rotation accuracy of the DD motor 7 is ≤3UM radial and axial runout accuracy, and the position of the microscope objective lens 6 can be accurately recorded by the recorder, thereby realizing rapid switching of the microscope objective lens 6.

[0090] Specifically, a first angle 6a is provided between the optical axes of two adjacent microscope objective lenses 6, a second angle 6b is provided between the optical axes of the black-and-white camera module 51 and the color camera module 52, and the first angle 6a and the second angle 6b are the same; a first mirror position is provided below the black-and-white camera module 51, and a second mirror position is provided below the color camera module 52, and both the first mirror position and the second mirror position are provided with microscope objective lenses 6.

[0091] In the actual design, the black and white camera module 51 and the color camera module 52 can simultaneously acquire images, and acquire the first black and white microscopic image and the first color microscopic image in real time, thereby achieving defect comparison, thereby improving the detection accuracy and detection effect. Of course, there is a position difference and color difference between the first black and white microscopic image and the first color microscopic image.

[0092] The efficiency of detection can also be further improved by marking the defect location.

[0093] The problem of switching the beam splitter for the marking position in the existing microscopic imaging and the problem of position movement are avoided, and the switching of the microscope objective lens 6 is faster.

[0094] In actual design, the black and white camera module 51 and the color camera module 52 can acquire images simultaneously or intermittently.

[0095] Specifically, the optical axis of the black and white camera module 51 and the optical axis of the color camera module 52 are on the same X-axis line.

[0096] Therefore, in actual focusing, the black and white camera module 51 and the color camera module 52 may be translated to achieve consistency of the image acquisition reference point;

[0097] The existing practice is to switch the beam splitter through the same microscope objective lens 6 to determine the same reference point, so that the black and white camera module 51 and the color camera module 52 can obtain the image of the same reference point.

[0098] The black-and-white camera module 51 is a large-surface black-and-white CCD camera, and the color camera module 52 is a large-pixel color CCD camera.

[0099] Specifically, there are five microscope objective lenses 6, and the first angle 6a is 72 degrees. Among the microscope objective lenses 6, five microscope objective lenses 6 with different magnifications can realize the detection of most microstructures, and the switching efficiency is the highest, so the detection efficiency can also be effectively improved.

[0100] Specifically, the light source 8 includes a vertically arranged tube body 81 provided with a light guide channel 82, a coaxial light source 85 provided at the upper end of the tube body, and a transfer tube 83 provided at the lower end of the tube body. The transfer tube 83 is provided with a refraction channel 84. One end of the refraction channel 84 is connected to the light guide channel 82, and the other end is connected to the imaging channel 5b.

[0101] The refraction channel 84 is provided with a light guide mirror. The light guide mirror is used to refract light, and then illuminate the focusing surface with a coaxial light source, thereby improving the image acquisition accuracy and image acquisition effect of the camera module for the product;

[0102] Specifically, coaxial light sources provide more uniform illumination than traditional light sources while avoiding reflections from objects, thereby improving the accuracy and reproducibility of machine vision.

[0103] Specifically, a positioning hole 71 is provided in the middle of the fixing seat 4, and the DD motor 7 is fixedly installed in the positioning hole 71, and the driving end of the DD motor 7 is located at the lower part thereof, and the driving end of the DD motor 7 extends out of the lower wall of the fixing seat 4 and is connected to the turntable 41;

[0104] The upper wall of the turntable 41 is provided with an annular protrusion 72 , and the lower wall of the fixed tray 42 is provided with a groove 8 matched with the protrusion 72 , and a gap is provided between the protrusion 72 and the groove 8 .

[0105] Specifically, the convex portion 72 and the turntable 41 are integrally formed and a stepped groove is formed, thereby facilitating the installation of the microscope objective lens 6. At the same time, the setting of the convex portion 72 can also effectively protect the microscope objective lens 6.

[0106] At the same time, the cooperation between the convex portion 72 and the groove 8 can also effectively ensure that the microscope objective lens 6 is not contaminated by foreign matter, thereby improving the stability of the use of the microscope objective lens 6. At the same time, the cooperation between the groove 8 and the convex portion 72 can also effectively ensure the stable rotation of the turntable 41.

[0107] The cooperation between the positioning hole 71 and the DD motor 7 can ensure the stable rotation of the turntable 41, and at the same time can reduce the influence of the height on the fixing base 4, thereby reducing the overall volume;

[0108] The driving end of the DD motor 7 is preferably arranged on the outer peripheral wall of the lower end of the DD motor 7, so as to ensure the torque and coaxiality, that is, the larger the installation area, the higher the rotation stability and precision of the turntable 41.

[0109] Specifically, the Y-axis moving frame 21 includes a Y-axis guide rail, a Y-axis slider slidably mounted on the Y-axis guide rail, and a Y-axis precision screw pair for driving the Y-axis slider to move.

[0110] The first X-axis moving frame 22 includes a first X-axis guide rail provided on the Y-axis slider, a first X-axis slider slidably mounted on the first X-axis guide rail, and a first precision X-axis lead screw pair for driving the first X-axis slider;

[0111] The first X-axis slider is provided with a bearing seat 23, thereby realizing precise movement of the wafer.

[0112] Specifically, the Z-axis moving frame 31 includes a Z-axis guide rail provided on the column 3, a Z-axis slider slidably mounted on the Z-axis guide rail, and a Z-axis precision screw pair for driving the Z-axis slider to move;

[0113] The second X-axis moving frame includes a second X-axis guide rail provided on the Z-axis slider, a second X-axis slider slidably mounted on the second X-axis guide rail, and a second precision X-axis lead screw pair for driving the second X-axis slider;

[0114] The fixed seat 4 is arranged on the second X-axis slider;

[0115] The Z-axis slider is also provided with a counterweight balance rod 31a, which is arranged on the column 3. The connecting end of the counterweight balance rod 31a is connected to the Z-axis slider, thereby ensuring the stable movement of the fixing seat 4 and reducing mechanical errors.

[0116] An imaging method of a semiconductor dual-channel shared microscopic imaging device, using the semiconductor dual-channel shared microscopic imaging device;

[0117] include:

[0118] S1, determining to detect a first reference position, the black and white camera module 51 acquires a first black and white microscopic image, acquires a defect position, and marks a first position of the defect position;

[0119] S2: After acquiring the first position, the second X-axis moving frame drives the color camera module 52 to move to the first reference position. At the same time, the microscope objective lens of the color camera module 52 is adjusted to adjust the magnification of the color camera module 52.

[0120] The color camera module 52 acquires a second color microscopic image and marks the first position a second time for more precise imaging and magnification photography of the second position;

[0121] S3: According to the size and data of the defective part, the control device controls the Y-axis moving frame 21 and the first X-axis moving frame 22 to drive the bearing seat 23 to move, and move the defective part to the focus center;

[0122] S4: the black and white camera module 51 or / the color camera module 52 adjusts the objective lens magnification, and further obtains a second black and white microscopic image or a second color microscopic image of the defective position.

[0123] In S4, the objective lens magnification can be directly adjusted to achieve accurate positioning of defects and precise image acquisition.

[0124] In actual detection, the above-mentioned method of use is not limited, and this method is not a factor that limits the logic and process of using the device.

[0125] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. An imaging method of a semiconductor dual-channel shared microscopic imaging device, the semiconductor dual-channel shared microscopic imaging device comprising: frame; A platform, the platform is arranged on the frame, the platform comprises a Y-axis moving frame, a first X-axis moving frame arranged on the Y-axis moving frame, and a bearing seat arranged on the Y-axis moving frame, the bearing seat is used to place the product; The column is extended upward from the frame, and the column is provided with a Z-axis movable frame and a second X-axis movable frame arranged on the Z-axis movable frame, The second X-axis movable frame is provided with a fixed seat extending toward the platform, and the fixed seat is located above the bearing seat; The lower wall of the fixed seat is provided with a pivotally arranged turntable, the turntable is arranged horizontally, and the turntable is provided with a plurality of microscope objective lenses arranged at intervals, and a DD motor for driving the turntable to rotate is provided in the middle of the fixed seat. The rotation accuracy of the DD motor is ±1.5 arc seconds, and the DD motor is used to drive the turntable to rotate 360 ​​degrees; The fixing seat is provided with a fixing tower plate arranged opposite to the rotating disk, and the fixing tower plate is provided with two sets of imaging modules arranged at intervals, and the imaging module comprises a barrel provided with an imaging channel, a camera module arranged at the upper end of the barrel, and a light source arranged at the barrel, and the light source is used to illuminate the focusing object surface; The two imaging modules include a black and white camera module and a color camera module; The optical axis of the microscope objective lens, the optical axis of the black and white camera module and the optical axis of the color camera module are all arranged vertically; When the DD motor rotates, the turntable drives the predetermined microscope objective lens to rotate to match the black and white camera module and / or the color camera module, and makes the optical axis of the predetermined microscope objective lens coincide with the optical axis of the black and white camera module and / or the optical axis of the color camera module; It is characterized in that An imaging method using a semiconductor dual-channel shared microscopic imaging device, comprising: S1, determining a first reference position for detection, the black-and-white camera module acquires a first black-and-white microscopic image, acquires a defect position, and marks a first position of the defect position; S2: After obtaining the first position, the second X-axis moving frame drives the color camera module to move to the first reference position. At the same time, the microscope objective lens of the color camera module is adjusted to adjust the magnification of the color camera module to perform more precise imaging and magnification photography; The color camera module acquires a second color microscopic image and marks the first position as a second position; S3: According to the size and data of the defective position, the control device controls the Y-axis moving frame and the first X-axis moving frame to drive the bearing seat to move, and moves the defective position to the focus center; S4: The black and white camera module or / the color camera module adjusts the objective lens magnification, and further obtains a second black and white microscopic image or a second color microscopic image of the defective position.

2. The imaging method of the semiconductor dual-channel shared microscopic imaging device according to claim 1, characterized in that: The DD motor is provided with a recorder, and the recorder is used to record the stroke position; The rotation accuracy of the DD motor is ≤3UM.

3. The imaging method of the semiconductor dual-channel shared microscopic imaging device according to claim 1, characterized in that: A first angle is set between the optical axes of two adjacent microscope objective lenses, and a second angle is set between the optical axis of the black and white camera module and the optical axis of the color camera module. The first angle and the second angle are the same; a first mirror position is provided below the black and white camera module, and a second mirror position is provided below the color camera module. The first mirror position and the second mirror position are both provided with microscope objective lenses.

4. The imaging method of the semiconductor dual-channel shared microscopic imaging device according to claim 1, characterized in that: The optical axis of the black and white camera module and the optical axis of the color camera module are on the same X-axis line.

5. The imaging method of the semiconductor dual-channel shared microscopic imaging device as claimed in claim 3, characterized in that: There are five microscope objective lenses, and the first angle is 72 degrees.

6. The imaging method of the semiconductor dual-channel shared microscopic imaging device as claimed in claim 3, characterized in that: The light source comprises a vertically arranged tube body provided with a light guide channel, a coaxial light source arranged at the upper end of the tube body, and a transfer tube arranged at the lower end of the tube body, wherein the transfer tube is provided with a refraction channel, one end of the refraction channel is connected to the light guide channel, and the other end is connected to the imaging channel. The refraction channel is provided with a light guide mirror.

7. The imaging method of the semiconductor dual-channel shared microscopic imaging device according to claim 1, characterized in that: A positioning hole is provided in the middle of the fixing seat, the DD motor is fixedly installed in the positioning hole, the driving end of the DD motor is located at the lower part thereof, and the driving end of the DD motor extends out of the lower wall of the fixing seat and is connected to the turntable; The upper wall of the rotating disk is provided with an annular convex part, the lower wall of the fixed tower plate is provided with a groove matched with the convex part, and a gap is provided between the convex part and the groove.

8. The imaging method of the semiconductor dual-channel shared microscopic imaging device according to claim 1, characterized in that: The Y-axis moving frame includes a Y-axis guide rail, a Y-axis slider slidably mounted on the Y-axis guide rail, and a Y-axis precision lead screw pair for driving the Y-axis slider to move. The first X-axis moving frame includes a first X-axis guide rail provided on the Y-axis slider, a first X-axis slider slidably mounted on the first X-axis guide rail, and a first precision X-axis lead screw pair for driving the first X-axis slider; The first X-axis slider is provided with a bearing seat.

9. The imaging method of the semiconductor dual-channel shared microscopic imaging device according to claim 1, characterized in that: The Z-axis moving frame includes a Z-axis guide rail arranged on the column, a Z-axis slider slidably mounted on the Z-axis guide rail, and a Z-axis precision screw pair for driving the Z-axis slider to move; The second X-axis moving frame includes a second X-axis guide rail provided on the Z-axis slider, a second X-axis slider slidably mounted on the second X-axis guide rail, and a second precision X-axis lead screw pair for driving the second X-axis slider; The fixed seat is arranged on the second X-axis slider; The Z-axis slider is also provided with a counterweight balance rod, which is arranged on a column, and a connecting end of the counterweight balance rod is connected to the Z-axis slider.

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