A metal packaging method for module power supply

Abstract

The present invention relates to the field of electronic packaging technology, and in particular to a metal packaging method for a module power supply, the method comprising determining a working environment temperature range based on a historical working environment temperature of a model of the module power supply to be packaged, and determining a temperature change trend curve to be packaged; determining whether to add a buffer layer based on a maximum matching degree between a temperature change trend curve of a metal material thermal expansion coefficient and a temperature change trend curve of a thermal expansion coefficient of the module power supply to be packaged; determining a preset power threshold for judging a metal packaging method for packaging the module power supply to be packaged based on whether a buffer layer is required to be added to the module power supply to be packaged; determining a packaging method for the module power supply to be packaged based on a maximum operating power of the module power supply to be packaged; and obtaining a temperature change characteristic of the module power supply after packaging at different working environment temperatures and a maximum change amplitude to determine whether to adjust parameters of a metal packaging process of the module power supply.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic packaging, and in particular to a metal packaging method for a module power supply. Background Art

[0002] In the field of modern electronic technology, module power supplies, as key power supply components, are widely used in various electronic devices and systems. As electronic equipment continues to develop towards miniaturization, high performance and high reliability, higher and higher requirements are placed on the packaging technology of module power supplies. Traditional module power supply packaging methods often use materials such as plastics or resins. Although these materials have certain insulation and cost advantages, they are insufficient in heat dissipation performance. Metal packaging has many advantages and can better meet the needs of modern electronic devices for module power supplies.

[0003] Chinese patent application publication number: CN104810360A discloses a power module package and a method for manufacturing the power module package. According to a preferred embodiment of the invention, the power module package includes: a lead frame, on which a power supply device and a control integrated circuit electrically connected to and controlling the power supply device are mounted; and a heat conductive sheet, which is bonded to one surface of the lead frame, wherein the heat conductive sheet includes a first resin layer and a second resin layer and a heat dissipation device, the first resin layer and the second resin layer include a thermally conductive inorganic filler and are added with a mixture of phenyl glycidyl ether (PGE) and alkyl glycidyl ether (alkyl (C12-C14) glycidyl ether), and the heat dissipation device of the metal material is arranged at the bonding interface formed between the first resin layer and the second resin layer; therefore, the heat dissipation effect caused by the heat dissipation device can easily improve the thermal performance of the power module package.

[0004] It can be seen that the existing technology cannot effectively analyze the change of the thermal expansion coefficient of the module power supply with the change of the working environment temperature, resulting in the mismatch between the selected metal packaging material and the thermal expansion coefficient of the module power supply, and the module power supply packaging process is not accurately controlled, resulting in poor heat dissipation of the packaged module power supply. Summary of the invention

[0005] To this end, the present invention provides a metal packaging method for a module power supply, so as to overcome the problems in the prior art that the thermal expansion coefficient of the module power supply cannot be effectively analyzed as the thermal expansion coefficient of the module power supply changes with the working environment temperature, resulting in the mismatch between the selected metal packaging material and the thermal expansion coefficient of the module power supply, and the module power supply packaging process is not accurately controlled, resulting in poor heat dissipation of the packaged module power supply.

[0006] To achieve the above object, the present invention provides a metal packaging method for a module power supply, comprising:

[0007] Identify the model of the module power supply to be packaged, and determine the working environment temperature range based on the historical working environment temperature of the module power supply to be packaged, and determine the temperature change trend curve of the thermal expansion coefficient of the module power supply to be packaged according to the working environment temperature range;

[0008] Determining whether to add a buffer layer based on the maximum matching degree between the temperature variation trend curve of the thermal expansion coefficient of the metal material and the temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged;

[0009] Determine a preset power threshold of the metal packaging method of the module power package to be packaged based on whether the module power package to be packaged needs to add a buffer layer, and the preset power threshold includes a buffer preset power threshold and a natural preset power threshold;

[0010] Determine whether to package the module power supply to be packaged in a natural packaging method or a forced cooling packaging method based on a comparison result of the maximum operating power of the module power supply to be packaged and a preset power threshold;

[0011] The temperature variation characteristics and the maximum variation range of the module power supply after packaging are obtained at different working environment temperatures to determine whether to adjust the metal packaging process parameters of the module power supply, wherein the metal packaging process parameters of the module power supply include a preset matching degree and a preset power threshold.

[0012] Further, determining the operating environment temperature range based on the historical operating environment temperature of the module power supply model to be packaged includes determining the operating environment temperature range according to a minimum value and a maximum value of the historical operating environment temperature of the module power supply model to be packaged.

[0013] Furthermore, the temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged is determined according to the working environment temperature range, including:

[0014] In the working environment temperature range, several temperature points are evenly selected as data collection points;

[0015] For each selected temperature point, measuring the size of the module power supply to be packaged at the selected temperature point;

[0016] According to the measured dimensional change data, the thermal expansion coefficient at each temperature point is calculated using the thermal expansion coefficient calculation formula;

[0017] The temperature change trend curve is drawn with temperature as the horizontal axis and thermal expansion coefficient as the vertical axis.

[0018] Further, the determining whether to add a buffer layer includes:

[0019] The maximum matching degree of the temperature variation trend curve of the thermal expansion coefficient of the metal material and the temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged is compared with a preset matching degree, wherein:

[0020] If the maximum matching degree between the temperature variation trend curve of the thermal expansion coefficient of the metal material and the temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged is greater than the preset matching degree, it is determined that no buffer layer needs to be added;

[0021] If the maximum matching degree between the temperature variation trend curve of the thermal expansion coefficient of the metal material and the temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged is less than or equal to the preset matching degree, it is determined that a buffer layer needs to be added.

[0022] Further, the determining of a preset power threshold of the metal packaging method of the power supply package of the module to be packaged includes:

[0023] If the module power supply to be packaged needs to add a buffer layer, determine that a preset power threshold of the metal packaging method of the module power supply to be packaged is a buffer preset power threshold;

[0024] If the module power supply to be packaged does not need to add a buffer layer, it is determined that the preset power threshold of the metal packaging method of the module power supply to be packaged is a natural preset power threshold.

[0025] Furthermore, the buffer preset power threshold is determined based on the average power when the thermal stress generated when several module power supplies with the same material buffer layer added during operation damage the module power supplies, and the natural preset power threshold is determined based on the historical average power when the thermal stress generated when the same module power supply is operated damages the module power supplies.

[0026] Further, the determining whether to package the module power supply to be packaged in a natural packaging manner or a forced cooling packaging manner includes:

[0027] The maximum operating power of the module power supply to be packaged is compared with a preset power threshold, wherein:

[0028] If the maximum operating power of the module power supply to be packaged is less than a preset power threshold, determining to package the module power supply to be packaged in a natural packaging manner;

[0029] If the maximum operating power of the module power supply to be packaged is greater than or equal to a preset power threshold, it is determined to package the module power supply to be packaged in a strong cooling packaging manner.

[0030] Furthermore, the strong cooling packaging method includes a liquid cooling packaging method or a fan cooling packaging method.

[0031] Further, the determining whether to adjust the metal packaging process parameters of the module power supply includes:

[0032] If the temperature change characteristics of the module power supply after packaging at different working environment temperatures are nonlinear or the maximum temperature change amplitude of the module power supply after packaging at different working environment temperatures is greater than or equal to the preset change amplitude, it is determined that the metal packaging process parameters of the module power supply need to be adjusted.

[0033] Furthermore, the adjustment amount of the preset matching degree is positively correlated with the maximum change range of the module power supply temperature after packaging at different working environment temperatures, and the adjustment amount of the preset power threshold is negatively correlated with the maximum change range of the module power supply temperature after packaging at different working environment temperatures.

[0034] Compared with the prior art, the beneficial effect of the present invention lies in that the historical working environment temperature based on the module power supply of this model in the present invention can accurately reflect the temperature change range experienced by the power supply in actual use. By considering the extreme values ​​of the historical working environment temperature, the packaging design can better cope with possible extreme temperature conditions, which helps to improve the reliability of the module power supply and reduce the risk of failure caused by temperature changes beyond expectations. Metal packaging materials with a high degree of matching with the thermal expansion coefficient of the module power supply can be selected according to the temperature range, avoiding the use of materials that are too expensive or have excess performance, and avoiding the phenomenon that the selected metal packaging material does not match the thermal expansion coefficient of the module power supply due to the inability to effectively analyze the change of the thermal expansion coefficient of the module power supply with the change of the working environment temperature.

[0035] Furthermore, in the present invention, when the thermal expansion coefficient of the metal material and the module power supply to be packaged are greatly different, a large thermal stress will be generated during the temperature change process. The module power supply may experience different working environment temperatures. The mismatch of thermal expansion coefficients may cause the packaging structure to become unstable when the temperature changes. At this time, adding a buffer layer can effectively reduce thermal stress and improve the reliability of the package. The above method improves the accuracy of the control of the module power supply packaging process and thereby improves the heat dissipation of the module power supply after packaging.

[0036] Furthermore, in the present invention, due to the presence of a buffer layer during the installation process, the heat dissipation and power characteristics of the power supply will change. By setting a buffer preset power threshold specifically for it, a suitable metal packaging method can be selected more accurately to ensure that the package can effectively cope with thermal stress and other potential problems, improve the reliability and stability of the package, and make the package design more fitting. By accurately determining the preset power threshold, the most suitable metal packaging method can be selected, thereby improving the energy conversion efficiency of the module power supply. The above method improves the accuracy of the control of the module power supply packaging process and thereby improves the heat dissipation of the packaged module power supply.

[0037] Furthermore, the present invention can accurately determine the power demand of the module power supply by comparing the maximum operating power with the preset power threshold. For low power situations, selecting a natural packaging method can meet the heat dissipation and protection requirements while avoiding the increased cost and complexity caused by excessive packaging. For high power situations, a strong cooling packaging method can effectively cope with the large amount of heat generated by high power and ensure the stable operation of the module power supply. Selecting a packaging method based on power requirements can avoid using overly complex and expensive strong cooling packaging methods in low power situations, thereby reducing costs. The above method improves the accuracy of the control of the module power supply packaging process and thereby improves the heat dissipation of the packaged module power supply.

[0038] Furthermore, the present invention can accurately understand the heat dissipation performance of the packaging structure by monitoring the temperature changes of the module power supply under different working environment temperatures. If it is found that the temperature changes greatly or exceeds the safety range, the packaging process parameters can be adjusted in time. Different working environment temperatures have different effects on the module power supply. By analyzing the temperature change characteristics, the adaptability of the packaging structure in different environments can be determined. If it is found that the temperature change of the module power supply is abnormal or the maximum change amplitude is greater than the preset change amplitude at certain specific ambient temperatures, the preset matching degree is improved by the first adjustment coefficient and the preset power threshold is reduced by the second adjustment coefficient. The above method improves the accuracy of the control of the module power supply packaging process and thus improves the heat dissipation of the packaged module power supply. BRIEF DESCRIPTION OF THE DRAWINGS

[0039] Figure 1 This is a working flow chart of a metal packaging method for a module power supply according to an embodiment of the present invention;

[0040] Figure 2 A flowchart for determining whether a buffer layer needs to be added in a metal packaging method for a module power supply according to an embodiment of the present invention;

[0041] Figure 3 The present invention is a flowchart of a process for determining a packaging method in a metal packaging method for a module power supply according to an embodiment of the present invention. DETAILED DESCRIPTION

[0042] In order to make the objects and advantages of the present invention more clearly understood, the present invention is further described below in conjunction with embodiments; it should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0043] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present invention and are not intended to limit the protection scope of the present invention.

[0044] It should be noted that, in the description of the present invention, terms such as "up", "down", "left", "right", "inside" and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it cannot be understood as a limitation on the present invention.

[0045] In addition, it should be noted that in the description of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0046] See also Figure 1-Figure 3 As shown, Figure 1 This is a working flow chart of a metal packaging method for a module power supply according to an embodiment of the present invention; Figure 2 A flowchart for determining whether a buffer layer needs to be added in a metal packaging method for a module power supply according to an embodiment of the present invention; Figure 3 The present invention is a flowchart of a process for determining a packaging method in a metal packaging method for a module power supply according to an embodiment of the present invention.

[0047] The metal packaging method for a module power supply according to an embodiment of the present invention includes:

[0048] Step S1, identifying the model of the module power supply to be packaged, and determining the working environment temperature range based on the historical working environment temperature of the module power supply to be packaged, and determining the temperature change trend curve of the thermal expansion coefficient of the module power supply to be packaged according to the working environment temperature range;

[0049] Step S2, determining whether to add a buffer layer based on the maximum matching degree between the temperature variation trend curve of the thermal expansion coefficient of the metal material and the temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged;

[0050] Step S3, determining a preset power threshold of a metal packaging method for packaging the module power supply to be packaged based on whether a buffer layer is required to be added to the module power supply to be packaged, wherein the preset power threshold includes a buffer preset power threshold and a natural preset power threshold;

[0051] Step S4, based on the comparison result of the maximum operating power of the module power supply to be packaged and the preset power threshold, determine whether to package the module power supply to be packaged in a natural packaging method or a forced cooling packaging method;

[0052] Step S5, obtaining the temperature variation characteristics and maximum variation range of the module power supply after packaging at different working environment temperatures to determine whether to adjust the metal packaging process parameters of the module power supply, wherein the metal packaging process parameters of the module power supply include a preset matching degree and a preset power threshold.

[0053] Specifically, in step S1, determining the working environment temperature range based on the historical working environment temperature of the module power supply model to be packaged includes taking the minimum value of the historical working environment temperature of the module power supply model to be packaged as the minimum value of the working environment temperature range, and taking the maximum value of the historical working environment temperature of the module power supply model to be packaged as the maximum value of the working environment temperature range.

[0054] Specifically, in step S1, determining the temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged according to the working environment temperature range includes:

[0055] In the working environment temperature range, several temperature points are evenly selected as data collection points;

[0056] For each selected temperature point, measuring the size of the module power supply to be packaged at the selected temperature point;

[0057] According to the measured dimensional change data, the thermal expansion coefficient at each temperature point is calculated using the thermal expansion coefficient calculation formula;

[0058] The temperature change trend curve is drawn with temperature as the horizontal axis and thermal expansion coefficient as the vertical axis.

[0059] In the embodiment of the present invention, if the working environment temperature range of the module power supply to be packaged is 0°C to 100°C; first, ten temperature points are uniformly selected within this temperature range, namely 0°C, 10°C, 20°C, 30°C, 40°C, 50°C, 60°C, 70°C, 80°C, 90°C, and 100°C as data collection points; for each selected temperature point, the module power supply to be packaged is placed in a constant temperature box, and the temperature of the constant temperature box is adjusted to the selected temperature point until the module power supply to be packaged stabilizes to the target temperature, and then the size of the module power supply to be packaged is measured using a high-precision measuring instrument (such as a laser interferometer); for example, at 0°C, the length is measured to be L0. When the temperature rises to 10°C, the length is measured again to be L1. Similarly, the size data at each temperature point is recorded; then according to the calculation formula of the thermal expansion coefficient α=(L1-L0) / L0*(T1-T0), where α is the thermal expansion coefficient, and L1 and L0 are the lengths at temperatures T1 and T0 respectively. The thermal expansion coefficient at each temperature point is calculated. For example, in the range from 0°C to 10°C, α1=(L1-L0) / L0*(10-0); finally, with temperature as the horizontal axis and thermal expansion coefficient as the vertical axis, draw the temperature change trend curve on the coordinate paper.

[0060] The present invention is based on the historical working environment temperature of the module power supply of this model, and can accurately reflect the temperature change range experienced by the power supply in actual use. By considering the extreme values ​​of the historical working environment temperature, the packaging design can better cope with possible extreme temperature conditions, which helps to improve the reliability of the module power supply and reduce the risk of failure due to temperature changes beyond expectations. Metal packaging materials with a high degree of matching with the thermal expansion coefficient of the module power supply can be selected according to the temperature range, avoiding the use of materials that are too expensive or have excess performance, and avoiding the phenomenon that the selected metal packaging material does not match the thermal expansion coefficient of the module power supply due to the inability to effectively analyze the change of the thermal expansion coefficient of the module power supply with the change of the working environment temperature.

[0061] Specifically, in step S2, the determination of whether to add a buffer layer based on the maximum matching degree between the temperature change trend curve of the thermal expansion coefficient of the metal material and the temperature change trend curve of the thermal expansion coefficient of the power supply of the module to be packaged includes determining the need to add a buffer layer based on a comparison result that the maximum matching degree between the temperature change trend curve of the thermal expansion coefficient of the metal material and the temperature change trend curve of the thermal expansion coefficient of the power supply of the module to be packaged is less than or equal to a preset matching degree, or determining that the buffer layer does not need to be added based on a comparison result that the maximum matching degree between the temperature change trend curve of the thermal expansion coefficient of the metal material and the temperature change trend curve of the thermal expansion coefficient of the power supply of the module to be packaged is greater than a preset matching degree.

[0062] The maximum matching degree between the temperature change trend curve of the thermal expansion coefficient of the metal material in the embodiment of the present invention and the temperature change trend curve of the thermal expansion coefficient of the module power supply to be packaged is the maximum similarity between the temperature change trend curve of the thermal expansion coefficient in the selected metal material and the temperature change trend curve of the thermal expansion coefficient of the module power supply to be packaged. The maximum similarity can be obtained by selecting several identical temperature points and calculating the variance of the thermal expansion coefficient at the several identical temperature points.

[0063] In the present invention, when the thermal expansion coefficient of the metal material and the module power supply to be packaged are greatly different, a large thermal stress will be generated during the temperature change process. The module power supply may experience different working environment temperatures. The mismatch of thermal expansion coefficients may cause the packaging structure to become unstable when the temperature changes. At this time, adding a buffer layer can effectively reduce thermal stress and improve the reliability of the packaging. The above method improves the accuracy of the control of the module power supply packaging process and thereby improves the heat dissipation of the module power supply after packaging.

[0064] Specifically, in step S3, the preset power threshold of the metal packaging method for packaging the module power supply to be packaged is determined based on whether the module power supply to be packaged needs to add a buffer layer, including determining that the preset power threshold of the metal packaging method for packaging the module power supply to be packaged is a buffer preset power threshold under the condition that the module power supply to be packaged needs to add a buffer layer; and determining that the preset power threshold of the metal packaging method for packaging the module power supply to be packaged is a natural preset power threshold under the condition that the module power supply to be packaged does not need to add a buffer layer.

[0065] The preset power threshold in the embodiment of the present invention includes a buffer preset power threshold and a natural preset power threshold; the buffer preset power threshold is the average power when the thermal stress generated when several module power supplies with the same material buffer layer added are running causes damage to the module power supply, and the natural preset power threshold is the historical average power when the thermal stress generated when the same module power supply is running causes damage to the module power supply, but the above values ​​are not limited to this, and technical personnel in this field can also adjust the values ​​according to actual needs.

[0066] In the present invention, due to the presence of a buffer layer during the installation process, the heat dissipation and power characteristics of the power supply will change. By setting a buffer preset power threshold specifically for it, a suitable metal packaging method can be selected more accurately to ensure that the package can effectively cope with thermal stress and other potential problems, improve the reliability and stability of the package, and make the package design more fitting. By accurately determining the preset power threshold, the most suitable metal packaging method can be selected, thereby improving the energy conversion efficiency of the module power supply. The above method improves the accuracy of the control of the module power supply packaging process and thereby improves the heat dissipation of the packaged module power supply.

[0067] Specifically, in step S4, based on the comparison result of the maximum operating power of the module power supply to be packaged and the preset power threshold, determining whether to package the module power supply to be packaged in a natural packaging manner or a forced cooling packaging manner includes determining that the module power supply to be packaged is packaged in a natural packaging manner based on the comparison result that the maximum operating power of the module power supply to be packaged is less than the preset power threshold; or determining that the module power supply to be packaged is packaged in a forced cooling packaging manner based on the comparison result that the maximum operating power of the module power supply to be packaged is greater than or equal to the preset power threshold.

[0068] The natural packaging method described in the embodiment of the present invention is that no cooling device needs to be added when a metal packaging shell is selected. The strong cooling packaging method includes a liquid cooling packaging method or a fan cooling packaging method. The liquid cooling packaging method is to add a liquid circulation pipeline in the shell to assist heat dissipation when a metal packaging shell is selected. The fan cooling packaging method is to add a fan device in the shell to assist heat dissipation when a metal packaging shell is selected.

[0069] In an embodiment of the present invention, when it is determined to select a liquid cooling packaging method or a fan cooling packaging method, the packaging method can be selected according to the installation space. When the installation space meets the requirements for installing a liquid circulation pipeline, the liquid cooling packaging method is selected. When the installation space does not meet the requirements for installing a liquid circulation pipeline, the fan cooling packaging method is selected.

[0070] The present invention can accurately determine the power demand of the module power supply by comparing the maximum operating power with the preset power threshold. For low power situations, selecting a natural packaging method can meet the heat dissipation and protection requirements while avoiding the increased cost and complexity caused by excessive packaging. For high power situations, a strong cooling packaging method can effectively cope with the large amount of heat generated by high power and ensure the stable operation of the module power supply. Selecting a packaging method according to power requirements can avoid using an overly complex and expensive strong cooling packaging method in low power situations, thereby reducing costs. The above method improves the accuracy of the control of the module power supply packaging process and thereby improves the heat dissipation of the packaged module power supply.

[0071] Specifically, in step S5, when determining whether to adjust the metal packaging process parameters of the module power supply, it is determined whether to adjust the metal packaging process parameters of the module power supply according to the change characteristics of the module power supply temperature after packaging at different working environment temperatures and the maximum change range of the module power supply temperature after packaging at different working environment temperatures;

[0072] When the change characteristics of the module power supply temperature after packaging at different working environment temperatures are nonlinear, or the maximum change amplitude of the module power supply temperature after packaging at different working environment temperatures is greater than or equal to the preset change amplitude, it is determined that the metal packaging process parameters of the module power supply need to be adjusted;

[0073] When the temperature variation characteristics of the module power supply after packaging at different working environment temperatures are linear and the maximum temperature variation range of the module power supply after packaging at different working environment temperatures is less than the preset variation range, it is determined that there is no need to adjust the metal packaging process parameters of the module power supply.

[0074] The change characteristics of the module power supply temperature after packaging at different working environment temperatures in the embodiment of the present invention include linear characteristics and nonlinear characteristics. The preset change amplitude is the average value of the change amplitudes of several identical module power supplies packaged with the same packaging method at the same ambient temperature, but the above value is not limited to this. Those skilled in the art can also adjust the value according to actual needs.

[0075] Specifically, in step S5, when it is determined that the metal packaging process parameters of the module power supply need to be adjusted, it is determined to adjust the preset matching degree with a first adjustment coefficient and to adjust the preset power threshold with a second adjustment coefficient. The value range of the first adjustment coefficient is preferably 1.02-1.21, and the first adjustment coefficient is positively correlated with the maximum change range of the module power supply temperature after packaging is completed at the different working environment temperatures. The value range of the second adjustment coefficient is preferably 0.85-0.98, and the second adjustment coefficient is negatively correlated with the maximum change range of the module power supply temperature after packaging is completed at the different working environment temperatures.

[0076] By monitoring the temperature change of the module power supply under different working environment temperatures, the present invention can accurately understand the heat dissipation performance of the packaging structure. If it is found that the temperature change is large or exceeds the safety range, the packaging process parameters can be adjusted in time. Different working environment temperatures have different effects on the module power supply. By analyzing the temperature change characteristics, the adaptability of the packaging structure in different environments can be determined. If it is found that the temperature change of the module power supply is abnormal or the maximum change amplitude is greater than the preset change amplitude at certain specific ambient temperatures, the preset matching degree is improved by the first adjustment coefficient and the preset power threshold is reduced by the second adjustment coefficient. The above method improves the accuracy of the control of the module power supply packaging process and thus improves the heat dissipation of the module power supply after packaging.

[0077] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

[0078] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A metal packaging method for a module power supply, characterized in that: include: Identify the model of the module power supply to be packaged, and determine the working environment temperature range based on the historical working environment temperature of the module power supply to be packaged, and determine the temperature change trend curve of the thermal expansion coefficient of the module power supply to be packaged according to the working environment temperature range; Determining whether to add a buffer layer based on the maximum matching degree between the temperature variation trend curve of the thermal expansion coefficient of the metal material and the temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged; Determine a preset power threshold of the metal packaging method of the module power package to be packaged based on whether the module power package to be packaged needs to add a buffer layer, and the preset power threshold includes a buffer preset power threshold and a natural preset power threshold; Determine whether to package the module power supply to be packaged in a natural packaging method or a forced cooling packaging method based on a comparison result of the maximum operating power of the module power supply to be packaged and a preset power threshold; Obtaining the temperature variation characteristics and the maximum variation range of the module power supply after packaging at different working environment temperatures to determine whether to adjust the metal packaging process parameters of the module power supply, wherein the metal packaging process parameters of the module power supply include a preset matching degree and a preset power threshold; Determining whether to add a buffer layer includes: The maximum matching degree of the temperature variation trend curve of the thermal expansion coefficient of the metal material and the temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged is compared with a preset matching degree, wherein: If the maximum matching degree between the temperature variation trend curve of the thermal expansion coefficient of the metal material and the temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged is greater than the preset matching degree, it is determined that no buffer layer needs to be added; If the maximum matching degree between the temperature variation trend curve of the thermal expansion coefficient of the metal material and the temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged is less than or equal to the preset matching degree, it is determined that a buffer layer needs to be added.

2. The metal packaging method for module power supply according to claim 1, characterized in that: Determining the operating environment temperature range based on the historical operating environment temperature of the module power supply model to be packaged includes determining the operating environment temperature range according to the minimum value and the maximum value of the historical operating environment temperature of the module power supply model to be packaged.

3. The metal packaging method for module power supply according to claim 2, characterized in that: The temperature variation trend curve of the thermal expansion coefficient of the module power supply to be packaged is determined according to the working environment temperature range, including: In the working environment temperature range, several temperature points are evenly selected as data collection points; For each selected temperature point, measuring the size of the module power supply to be packaged at the selected temperature point; According to the measured dimensional change data, the thermal expansion coefficient at each temperature point is calculated using the thermal expansion coefficient calculation formula; The temperature change trend curve is drawn with temperature as the horizontal axis and thermal expansion coefficient as the vertical axis.

4. The metal packaging method for module power supply according to claim 3, characterized in that: The step of determining a preset power threshold of the metal packaging method of the power supply package of the module to be packaged comprises: If the module power supply to be packaged needs to add a buffer layer, determine that a preset power threshold of the metal packaging method of the module power supply to be packaged is a buffer preset power threshold; If the module power supply to be packaged does not need to add a buffer layer, it is determined that the preset power threshold of the metal packaging method of the module power supply to be packaged is the natural preset power threshold.

5. The metal packaging method for module power supply according to claim 4, characterized in that: The buffer preset power threshold is determined based on the average power when the thermal stress generated when several module power supplies with the same material buffer layer added during operation damage the module power supplies, and the natural preset power threshold is determined based on the historical average power when the thermal stress generated when the same module power supply is operated damages the module power supplies.

6. The metal packaging method for module power supply according to claim 5, characterized in that: The determining to package the module power supply to be packaged in a natural packaging manner or a forced cooling packaging manner comprises: The maximum operating power of the module power supply to be packaged is compared with a preset power threshold, wherein: If the maximum operating power of the module power supply to be packaged is less than a preset power threshold, determining to package the module power supply to be packaged in a natural packaging manner; If the maximum operating power of the module power supply to be packaged is greater than or equal to a preset power threshold, it is determined to package the module power supply to be packaged in a strong cooling packaging manner.

7. The metal packaging method for module power supply according to claim 6, characterized in that: The strong cooling packaging method includes a liquid cooling packaging method or a fan cooling packaging method.

8. The metal packaging method for module power supply according to claim 7, characterized in that: The determining whether to adjust the metal packaging process parameters of the module power supply comprises: If the temperature change characteristics of the module power supply after packaging at different working environment temperatures are nonlinear or the maximum temperature change amplitude of the module power supply after packaging at different working environment temperatures is greater than or equal to the preset change amplitude, it is determined that the metal packaging process parameters of the module power supply need to be adjusted.

9. The metal packaging method for module power supply according to claim 8, characterized in that: The adjustment amount of the preset matching degree is positively correlated with the maximum change range of the module power supply temperature after packaging at different working environment temperatures, and the adjustment amount of the preset power threshold is negatively correlated with the maximum change range of the module power supply temperature after packaging at different working environment temperatures.

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