Embedded touch OLED display panel

Abstract

This application provides an embedded touch OLED display panel, comprising: a substrate; a pixel defining layer located on one side of the substrate; a touch device layer located on the side of the pixel defining layer away from the substrate; a first electrode located on the side of the touch device layer away from the substrate, the first electrode being used to emit electrons; and an encapsulation layer located on the side of the first electrode away from the substrate; wherein the thickness of the touch device layer is greater than the thickness of the first electrode, so that the first electrode is disconnected at its position on the touch device layer. This application sets the touch function-related film layer within the encapsulation layer of the OLED display panel, realizing the application of In-cell technology in the OLED display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to an embedded touch OLED display panel. Background Technology

[0002] Initially, touch and display were two separate technologies, known as Out Cell Touch. Touch-enabled displays required bonding the touch panel and the display panel together, resulting in complex manufacturing processes and excessively thick displays. This led to the development of two touch technologies: On Cell and In Cell. These two technologies significantly reduced the complexity of the manufacturing process.

[0003] With the emergence and development of OLED technology, On-cell technology can also be applied to OLED display panels. However, its low-temperature manufacturing process and low-water content limit the applicability of touch control, and product yield and performance are also affected. In-cell technology can compensate for the shortcomings of On-cell to some extent, but due to certain conflicts between the In-cell process and OLED technology, it is difficult to realize the application of In-cell technology in OLED display panels. Therefore, how to apply In-cell technology to OLED display panels has become an urgent problem to be solved. Summary of the Invention

[0004] The embodiments of this application provide an embedded touch OLED display panel to solve the problem in the related art that it is difficult to apply Incell technology to OLED display panels.

[0005] To solve the above problems, the technical solution provided in this application is as follows:

[0006] This application provides an embedded touch OLED display panel, including:

[0007] substrate;

[0008] A pixel defining layer is located on one side of the substrate;

[0009] The touch device layer is located on the side of the pixel defining layer away from the substrate;

[0010] A first electrode is located on the side of the pixel defining layer away from the substrate, and the first electrode is used to emit electrons;

[0011] An encapsulation layer is located on the side of the first electrode away from the substrate;

[0012] The thickness of the touch device layer is greater than the thickness of the first electrode, so that the first electrode is disconnected at the position of the touch device layer.

[0013] In one embodiment of this application, the touch device layer includes:

[0014] A touch metal layer is located on the side of the pixel defining layer away from the substrate;

[0015] A negative photoresist layer is located on the side of the touch metal layer or the pixel defining layer away from the substrate;

[0016] The thickness of the negative photoresist layer is greater than the thickness of the first electrode.

[0017] In one embodiment of this application, the touch metal layer has a mesh structure in the horizontal direction of the display panel, and the touch metal layer in the mesh structure is partially broken.

[0018] In one embodiment of this application, the thickness of the touch metal layer is less than the thickness of the first electrode.

[0019] In one embodiment of this application, the upper surface area of ​​the touch metal layer is smaller than the lower surface area of ​​the touch metal layer.

[0020] In one embodiment of this application, the upper surface area of ​​the negative photoresist layer is larger than the lower surface area of ​​the negative photoresist layer.

[0021] In one embodiment of this application, the minimum width of the touch metal layer is greater than the maximum width of the first electrode.

[0022] In one embodiment of this application, the resistivity of the touch metal layer is less than the resistivity of the first electrode.

[0023] In one embodiment of this application, the display panel further includes:

[0024] A driving device layer is located on one side of the substrate;

[0025] The second electrode is located on the side of the driving device layer away from the substrate;

[0026] The pixel defining layer is located on the side of the second electrode away from the substrate, and the pixel defining layer has a plurality of spaced pixel openings through which the second electrode is exposed;

[0027] An organic light-emitting layer is located within the pixel opening and connected to the second electrode;

[0028] The first electrode is also located on the side of the organic light-emitting layer and the touch device layer away from the substrate.

[0029] In one embodiment of this application, the driving device layer includes:

[0030] Contact the metal and connect it to the second electrode;

[0031] The grounding signal line layer is disposed on the same layer as the contact metal;

[0032] In the horizontal direction of the display panel, the contact metal and the ground signal line layer together form a mesh structure.

[0033] In one embodiment of this application, the embedded touch OLED display panel further includes:

[0034] A dielectric layer is located on the side of the driving device layer away from the substrate, and the dielectric layer is located between and connected to the two second electrodes.

[0035] In one embodiment of this application, the thickness of the dielectric layer is greater than the thickness of the second electrode.

[0036] In one embodiment of this application, the embedded touch OLED display panel further includes:

[0037] A dielectric layer is located on the side of the pixel defining layer away from the substrate, and the touch device layer is located on the side of the dielectric layer away from the substrate.

[0038] The beneficial effects of this application are as follows: This application applies In-cell technology to OLED display panels, allowing the POL-less structure to be closer to the organic light-emitting layer, which facilitates improved light extraction efficiency of the display panel while reducing the thickness of the thin film layer, thus benefiting the bending of the OLED structure. Furthermore, this application simultaneously incorporates a high-conductivity metal design that isolates the first electrode (i.e., cathode) connection, enabling the display panel to transmit VSS and DOT signals in time segments within a single frame, which helps reduce the power consumption of the display screen. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Appendix Figure 1 This is a schematic diagram of the planar structure of an Oncell touch display panel in related technologies;

[0041] Appendix Figure 2 This is a schematic diagram of the cross-sectional structure of an Oncell touch display panel in related technologies;

[0042] Appendix Figure 3This is a schematic cross-sectional view of an optional Incell touch display panel in an embodiment of this application.

[0043] Appendix Figure 4 This is a schematic cross-sectional view of another optional Incell touch display panel in this application embodiment;

[0044] Appendix Figure 5 This is a schematic diagram showing the distribution of the touch metal layer in an optional Incell touch display panel according to an embodiment of this application;

[0045] Appendix Figure 6 Based on Figure 3 A schematic diagram of the cross-sectional structure of an Incell touch display panel with a dielectric layer;

[0046] Appendix Figure 7 Based on Figure 4 A schematic diagram of the cross-sectional structure of an Incell touch display panel with a dielectric layer;

[0047] Appendix Figure 8 Based on Figure 3 A cross-sectional structural diagram of another Incell touch display panel with a dielectric layer;

[0048] Appendix Figure 9 Based on Figure 4 A cross-sectional structural diagram of another Incell touch display panel with a dielectric layer.

[0049] Explanation of markings in the attached diagram:

[0050] 100. Display panel; 101. Contact metal; 102. Planarization layer; 103. Second electrode; 104. Pixel confinement layer; 105. Organic light-emitting layer; 106. First electrode; 107. Negative photoresist layer; 108. Encapsulation layer; 109. Touch metal layer; 110. Ground signal line layer; 111. Dielectric layer; 112. First inorganic encapsulation layer; 113. Organic encapsulation layer; 114. Second inorganic encapsulation layer. Detailed Implementation

[0051] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0052] Reference Figure 1 and Figure 2The diagram shows a plan view and a cross-sectional view of an OLED display panel employing a Self-Capacitance Direct Once-Touch (S-DOT) structure, a surface-mount touchscreen design. This design utilizes a DOT process fabricated on a thin-film encapsulation (TFE) layer, employing a dual-mask structure: a touch metal mask (TP Metal Mask) and a passivation mask (PAS Mask). The touch metal mask is disposed on the encapsulation layer 108 of the OLED display panel, while the passivation mask is disposed on and covers the encapsulation layer 108, forming a self-capacitance structure. In this structure, each capacitive node (also known as a sensing electrode) independently senses touch input. When a user touches the screen, only the capacitive node corresponding to the touch position changes, while other capacitive nodes remain stable. Although surface-mount touch OLEDs can achieve relatively sensitive operation, the touch-related structures are located above the thin-film encapsulation. When integrating POL-less (polarizer-free) technology into the OLED display panel, the POL-less structure can only be fabricated above the touch-related structures, thus affecting the light extraction efficiency of the display panel. Furthermore, in surface-mount OLED display panels, the deposition and coating of the touch layer, while of moderate technical difficulty and relatively easy to manufacture, suffers from low adhesion between the touch layer and the encapsulation layer 108, leading to cracking issues and water / oxygen intrusion.

[0053] Reference Figure 3 This application provides an embedded OLED touch display panel, comprising: a substrate, a driving device layer, a contact metal 101, a planarization layer 102, a second electrode 103, a pixel defining layer 104, an organic light-emitting layer 105, a touch device layer, a first electrode 106, and an encapsulation layer 108. Each of the above layers may be composed of a single layer or multiple layers, and another layer may be further disposed between the various layers.

[0054] In each of the above layers, the substrate (not shown in the figure) is used to support each layer disposed on the substrate. The substrate has insulating properties and can be a rigid substrate or a flexible substrate that can be bent, folded, rolled, etc. The material used for the flexible substrate may include, but is not limited to, polyimide.

[0055] A driving device layer (not shown in the figure) is formed on the substrate. The driving device layer includes a barrier layer, a buffer layer, a semiconductor, a gate insulating layer, a gate electrode, a first interlayer insulating layer, a source electrode, and a drain electrode. The semiconductor is divided into a channel region and source and drain regions formed on both sides of the channel. The channel region of the semiconductor is undoped polysilicon, i.e., an intrinsic semiconductor. The source and drain regions are polysilicon doped with conductive impurities, i.e., impurity semiconductors. The impurities doped in the source and drain regions can be either P-type or N-type impurities.

[0056] Contact metal 101 (SD) is formed on the driving device layer. It should be noted that, in one embodiment of this application, contact metal 101 can be a metal connected to the drain electrode through a contact hole for electrically connecting the drain electrode and the anode of the display panel; alternatively, contact metal 101 can also be the drain electrode, that is, contact metal 101 can also be part of the driving device layer, formed together with the source electrode on the first interlayer insulating layer, with the source electrode passing through a source contact hole and connecting to the source region, and the drain electrode passing through a drain contact hole and connecting to the drain region. The source electrode and drain electrode can be formed as multiple layers or a single layer of low-resistance materials such as Al, Ti, Mo, Cu, Ni or their alloys, or materials with high corrosion resistance. For example, the source electrode and drain electrode can be a triple layer of Ti / Cu / Ti, Ti / Ag / Ti, Ti / Al / Ti, or Mo / Al / Mo, or others. In the driving device layer, the gate electrode, source electrode, and drain electrode are respectively the control electrode, input electrode, and output electrode of the thin-film transistor in the display panel driving circuit, and together with the semiconductor, they form a thin-film transistor. The semiconductor of the thin-film transistor includes a channel located between the source electrode and the drain electrode.

[0057] A planarization layer 102 (PLN) is formed on the drive device layer and covers the contact metal 101. The planarization layer 102 has through-holes through which the contact metal 101 is exposed. The planarization layer 102 may be formed as a plurality of layers or a single layer, for example, of tetraethyl orthosilicate (TEOS), silicon nitride, or silicon oxide, and may be formed of an organic material with a low dielectric constant (e.g., polyimide).

[0058] A second electrode 103 is formed on the planarization layer 102. The second electrode 103 passes through the through-hole and is connected to the contact metal 101. The second electrode 103 can be the anode (ANO) of the organic light-emitting diode (OLED) of the display panel. The second electrode 103 comprises a material with a high work function, such as one of indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), etc. These conductive materials have relatively high work functions and are transparent. When the organic light-emitting display device is a top-emitting organic light-emitting display device, in addition to the conductive materials listed above, the second electrode 103 may also comprise reflective materials such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), palladium (Pb), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or combinations thereof. Therefore, the second electrode 103 may have a single-layer structure of the conductive and reflective materials listed above, or it may have a multi-layer structure in which individual layers are stacked on top of each other.

[0059] A pixel defining layer 104 (PDL&PS) is formed on the second electrode 103. The pixel defining layer 104 includes an opening that exposes at least a portion of the second electrode 103. The pixel defining layer 104 may comprise an organic or inorganic material. In an exemplary embodiment, the pixel defining layer 104 comprises a material such as a photoresist, a polyimide resin, an acrylic resin, a silicone compound, or a polyacrylic resin.

[0060] An organic light-emitting layer 105 is formed in an opening in the pixel defining layer 104 and connected to the second electrode 103. Specifically, the organic light-emitting layer 105 is formed of multiple layers including one or more emitter layers, a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). When the organic emitter layer includes all of the above layers, the hole injection layer (HIL) may be located on the second electrode 103 (i.e., the anode), and the hole transport layer (HTL), emitter layer, electron transport layer (ETL), and electron injection layer (EIL) may be sequentially laminated on the hole injection layer (HIL).

[0061] A first electrode 106, used for emitting electrons, is formed on the pixel defining layer 104 and the organic light-emitting layer 105. The first electrode 106 is the cathode of the organic light-emitting diode (OLED). Therefore, the second electrode, the organic light-emitting layer 105, and the first electrode 106 form an organic light-emitting element. Depending on the direction of the light emitted by the organic light-emitting element, the organic light-emitting diode display can have any of the following structures: top display type, bottom display type, and dual display type.

[0062] An encapsulation layer 108 is formed on the first electrode 106. Specifically, the encapsulation layer 108 can be formed by alternately stacking one or more organic layers and one or more inorganic layers. The organic layers are formed of polymers and may include, for example, monomer compositions comprising monomers based on monoacrylates. Furthermore, the monomer composition may include known photoinitiators such as TPO, but the monomer composition is not limited thereto. The inorganic layers may be laminates or monolayers comprising metal oxides or metal nitrides. For example, the inorganic layers may include any one of SiNx, Al2O3, SiO2, and TiO2. The uppermost layer of the encapsulation layer 108 exposed to the outside may be formed of an inorganic layer to prevent moisture from being transported into the organic light-emitting diode display. The encapsulation layer 108 may include at least one sandwich structure in which at least one organic layer is interposed between at least two inorganic layers. Furthermore, the encapsulation layer 108 may include at least one sandwich structure in which at least one inorganic layer is interposed between at least two organic layers. In one embodiment of this application, the encapsulation layer 108 includes: a first inorganic encapsulation layer 112 formed on the first electrode 106 and covering the second electrode 103; an organic encapsulation layer 113 formed on and covering the first inorganic encapsulation layer 112; and a second inorganic encapsulation layer 114 formed on and covering the organic encapsulation layer 113.

[0063] The touch device layer of this application is formed on the pixel defining layer 104 and does not overlap with the organic light-emitting layer 105 in the thickness direction of the display panel. Figure 4 As shown, the touch device layer is disposed at a non-opening position on the pixel defining layer 104, and the first electrode 106 is formed on the touch device layer. The thickness of the touch device layer is greater than the thickness of the first electrode 106, so that the first electrode 106 is in an open state at the location of the touch device layer. It should be noted that the touch device layer includes a touch metal layer 109 and a negative photoresist layer 107, as shown in the figure. Figure 3 and Figure 4 As shown, the touch metal layer 109 is located on the side of the pixel defining layer 104 away from the substrate, and the negative photoresist layer 107 is located on the side of the touch metal layer 109 or the pixel defining layer 104 away from the substrate. That is, the lower surface of the touch metal layer 109 is connected to the pixel defining layer 104, and the upper surface of the touch metal layer 109 is connected to the lower surface of the negative photoresist layer 107; alternatively, there is no touch metal layer under the negative photoresist layer, and the negative photoresist layer is directly connected to the pixel defining layer. It should be noted that, referring to... Figure 1 The sensor in the middle contains many patterned touch metal layers, as shown in the reference. Figure 5 As shown, in the horizontal direction of the display panel, the touch metal layer has a mesh structure. To improve the touch performance of the display panel, the touch metal layer in the mesh structure is partially broken (see reference). Figure 5(In the dashed box section), only a negative photoresist layer needs to be set in the disconnected part, and no touch metal is needed. Therefore, in order to disconnect the cathode, the thickness of the negative photoresist layer is greater than the thickness of the first electrode, so that the cathode material can be disconnected when the cathode is prepared, that is, the touch sensing circuit can be embedded.

[0064] Reference Figure 3 and Figure 4 As shown, in some embodiments of this application, in order to make the cathode material easier to break, the area of ​​the upper surface of the negative photoresist layer 107 is larger than the area of ​​the lower surface of the negative photoresist layer 107 in the thickness direction of the display panel. Optionally, in one embodiment of this application, the cross-sectional shape of the negative photoresist layer 107 is made into an inverted trapezoid, the second electrode 103 only covers the upper surface of the negative photoresist layer 107, and the side surface of the negative photoresist layer 107 is covered by the encapsulation layer 108 and the upper and lower layers of the second electrode 103.

[0065] In some embodiments of this application, it is necessary to ensure the connection between the touch metal layer and the first electrode, and also to ensure that the first electrode is blocked by negative light. Therefore, the thickness of the touch metal layer is less than the thickness of the first electrode, and the area of ​​the lower surface of the negative photoresist layer 107 is less than the area of ​​the upper surface of the touch metal layer 109, so that the first electrode 106 covers the side surfaces on both sides and part of the upper surface of the touch metal layer 109, and contacts the negative photoresist layer 107. (Refer to...) Figure 3 As shown, in the array process of the display panel, after the pixel defining layer 104 is prepared, physical vapor deposition (PVD), photolithography (also known as photolithography process), dry etching, and stripping of excess material are performed on the touch metal layer 109 to achieve patterning of the touch metal layer 109. In the thickness direction of the display panel, the area of ​​the upper surface of the patterned touch metal layer 109 is smaller than that of the lower surface. Generally speaking, the cross-sectional shape of the touch metal layer 109 is a trapezoid, which enables better connection between the first electrode and the touch metal layer. On this basis, a negative photoresist layer 107 is then covered on the touch metal layer 109. After exposure and development, an inverted trapezoidal structure is formed. During the subsequent evaporation of organic light-emitting materials, the inverted trapezoidal negative photoresist layer 107 will cause the material of the first electrode 106 (cathode) to be disconnected, thereby realizing the patterning of the first electrode 106. At the same time, the disconnected first electrode 106 will overlap with the touch metal layer 109.

[0066] With the above settings, during the display phase of one frame, the TP touch signal and the VSS signal can be time-division multiplexed to achieve [the desired effect]. Figure 1For example, the sensor and connecting traces include a double-layer structure of touch metal and first electrode, while the blank part only contains the first electrode. In the double-layer structure, the touch metal layer 109 and the patterned first electrode 106 connected to it flow with TP touch signal for a very short time. For a longer period of time remaining in one frame, the touch metal layer 109 and the first electrode 106 flow with VSS signal. It should be noted that both of these periods are very short and do not affect the normal driving of the display panel. In the place where only the first electrode is set, the VSS signal is supplied through the peripheral circuit or the internal circuit of the pixel.

[0067] It should be noted that the resistivity of the touch metal layer 109 is less than that of the first electrode 106. The touch metal layer 109 can be made of Ti / Al / Ti, with a thickness of approximately 400 nm and a surface resistivity of approximately 0.1 Ω / mm. 2 The first electrode 106 is typically made of an extremely thin Mg / Ag alloy, with a surface resistivity usually of 8 Ω / mm². 2 Since the resistivity of the touch metal layer 109 is lower than that of the first electrode 106, by overlapping the two and transmitting the VSS signal in different time periods, the drop of the VSS signal can be reduced to a certain extent, thereby reducing the power consumption of the display panel.

[0068] In addition, the driving device layer is provided with a plurality of contact metals 101, and the planarization layer 102 is also provided with a ground signal line layer 110 (VSS). In addition to connecting the anode for OLED display, the contact metals 101, together with the plurality of contact metals 101 and the ground signal line layer 110, form a mesh structure to reduce the power consumption of the VSS. The ground signal line layer 110 and the second electrode 103 both pass through constant signals, which can largely shield the AC signals of the TFT below, etc., and reduce the coupling interference of the AC signals in the array substrate to the TP touch signal.

[0069] To further ensure the signal shielding effect of the display panel, the display panel also includes a dielectric layer 111 (IL1) to enhance the shielding effect against AC signals. The dielectric layer 111 can be made of silicon oxide material and is disposed on the planarization layer 102. The dielectric layer 111 can be prepared in the following ways:

[0070] Reference Figure 6 and Figure 7 As shown, the process of dielectric layer 111 can be placed after the process of second electrode 103 and before the process of pixel defining layer 104. That is, the dielectric layer 111 is located between the two second electrodes 103 and connected to the two second electrodes 103, and the thickness of the dielectric layer 111 is greater than the thickness of the second electrode 103.

[0071] Reference Figure 8 and Figure 9 As shown, the process of dielectric layer 111 can also be set after the process of pixel defining layer 104 and before the process of touch metal layer 109, that is, dielectric layer 111 is set on pixel defining layer 104 and covered by first electrode 106 and touch metal layer 109.

[0072] The in-cell design of this application places the touch layer below the screen encapsulation layer 108, which not only simplifies the OLED display panel manufacturing process and saves costs, but also avoids problems such as cracks and water / oxygen intrusion. Integrating the touch function into the array substrate manufacturing process allows the POL-less structure to be closer to the organic light-emitting film layer, facilitating improved light extraction efficiency of the POL-less structure while also reducing the film layer thickness, thus benefiting the bending of the OLED structure.

[0073] In summary, although the present application has disclosed the preferred embodiments as described above, the above preferred embodiments are not intended to limit the present application. Those skilled in the art can make various modifications and refinements without departing from the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be determined by the scope defined in the claims.

Claims

1. An embedded touch-sensitive OLED display panel, characterized in that, include: substrate; A pixel defining layer is located on one side of the substrate; The touch device layer is located on the side of the pixel defining layer away from the substrate; The first electrode is located on the side of the touch device layer away from the substrate, and the first electrode is used to emit electrons; An encapsulation layer is located on the side of the first electrode away from the substrate; The thickness of the touch device layer is greater than the thickness of the first electrode, so that the first electrode is disconnected at the position of the touch device layer. The touch device layer includes: A touch metal layer is located on the side of the pixel defining layer away from the substrate; A negative photoresist layer is located on the side of the touch metal layer or the pixel defining layer away from the substrate; The thickness of the touch-sensitive metal layer is less than the thickness of the first electrode.

2. The embedded touch OLED display panel according to claim 1, characterized in that, The thickness of the negative photoresist layer is greater than the thickness of the first electrode.

3. The embedded touch OLED display panel according to claim 2, characterized in that, In the horizontal direction of the display panel, the touch metal layer has a mesh structure, and the touch metal layer in the mesh structure is partially broken.

4. The embedded touch OLED display panel according to claim 1, characterized in that, The upper surface area of ​​the touch metal layer is smaller than the lower surface area of ​​the touch metal layer.

5. The embedded touch OLED display panel according to claim 4, characterized in that, The upper surface area of ​​the negative photoresist layer is greater than the lower surface area of ​​the negative photoresist layer.

6. The embedded touch OLED display panel according to claim 5, characterized in that, The minimum width of the touch-sensitive metal layer is greater than the maximum width of the first electrode.

7. The embedded touch OLED display panel according to claim 6, characterized in that, The resistivity of the touch-sensitive metal layer is less than that of the first electrode.

8. The embedded touch OLED display panel according to claim 1, characterized in that, The display panel also includes: A driving device layer is located on one side of the substrate; The second electrode is located on the side of the driving device layer away from the substrate; The pixel defining layer is located on the side of the second electrode away from the substrate, and the pixel defining layer has a plurality of spaced pixel openings through which the second electrode is exposed; An organic light-emitting layer is located within the pixel opening and connected to the second electrode; The first electrode is also located on the side of the organic light-emitting layer and the touch device layer away from the substrate.

9. The embedded touch OLED display panel according to claim 8, characterized in that, The driving device layer includes: Contact the metal and connect it to the second electrode; The grounding signal line layer is disposed on the same layer as the contact metal; In the horizontal direction of the display panel, the contact metal and the ground signal line layer together form a mesh structure.

10. The embedded touch OLED display panel according to any one of claims 1 to 9, characterized in that, The embedded touch OLED display panel also includes: A driving device layer is located on one side of the substrate; A dielectric layer is located on the side of the driving device layer away from the substrate, and the dielectric layer is located between and connected to the two second electrodes.

11. The embedded touch OLED display panel according to claim 10, characterized in that, The thickness of the dielectric layer is greater than the thickness of the second electrode.

12. The embedded touch OLED display panel according to any one of claims 1 to 9, characterized in that, The embedded touch OLED display panel also includes: A dielectric layer is located on the side of the pixel defining layer away from the substrate, and the touch device layer is located on the side of the dielectric layer away from the substrate.

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