Method for manufacturing display device

Abstract

A method of manufacturing a display device according to one embodiment of the present invention comprises the steps of: providing a substrate including a display area and first and second peripheral areas defined outside the display area and facing each other across the display area; forming a circuit layer on the substrate; forming an element layer on the display area; and forming an encapsulation layer so as to cover the element layer, the step of forming the encapsulation layer including: disposing a first deposition mask including a first center portion and a first branch portion extending in a first direction from the first center portion so as to overlap a part of the first peripheral region; arranging a second deposition mask so as to overlap a part of the second peripheral region, the second deposition mask including a second center portion and a second branch portion extending from the second center portion in a direction opposite to the first direction; and depositing a first encapsulation film on the element layer using the first deposition mask and the second deposition mask.

Description

[0001] This application is a divisional application of the invention patent application with application number CN201810842483.8, application date July 27, 2018, and invention name “Method for manufacturing display device”. Technical Field

[0002] The present invention relates to a method for manufacturing a display device, and more particularly, to a method for manufacturing a display device, wherein a sealing layer is deposited using a deposition mask having steps, thereby reducing color difference when the display device is driven. Background Art

[0003] Generally, an organic light emitting display apparatus may be used in a mobile device such as a smart phone, a tablet personal computer, a laptop computer, a digital camera, a camcorder, or a portable information terminal, or an electronic device such as an ultra-thin television or a billboard.

[0004] The organic light emitting display device is provided with an organic light emitting layer between an anode and a cathode, and includes a thin film encapsulation (TFE) for protecting the organic light emitting layer.

[0005] Thin film packaging can be formed by thin film deposition processes, including chemical vapor deposition (CVD) and physical vapor deposition (PVD). Summary of the invention

[0006] The present invention relates to a method for manufacturing a display device, and more particularly, to a method for manufacturing a display device, wherein a sealing layer is deposited using a deposition mask having steps, thereby reducing color difference when the display device is driven.

[0007] A method for manufacturing a display device according to an embodiment of the present invention comprises the following steps: providing a substrate comprising a display area and a first peripheral area and a second peripheral area, wherein the first peripheral area and the second peripheral area are defined outside the display area and are opposite to each other across the display area; forming a circuit layer on the substrate; forming a component layer on the display area; and forming a packaging layer in a manner covering the component layer, wherein the steps of forming the packaging layer comprise: configuring a first deposition mask to overlap with a portion of the first peripheral area, wherein the first deposition mask comprises a first central portion and a first branch portion extending from the first central portion along a first direction; configuring a second deposition mask to overlap with a portion of the second peripheral area, wherein the second deposition mask comprises a second central portion and a first branch portion extending from the second central portion along a first direction A second branch portion extending in a direction opposite to the first direction; and using the first deposition mask and the second deposition mask to deposit a first packaging film on the element layer, in the step of configuring the first deposition mask, the first deposition mask is configured in a manner that the first branch portion faces the display area side, and in the step of configuring the second deposition mask, the second deposition mask is configured in a manner that the second branch portion faces the display area side, the thickness of the first branch portion is smaller than the thickness of the first center portion, the thickness of the second branch portion is smaller than the thickness of the second center portion, and the distance between the first deposition mask and the second deposition mask in the first direction is greater than the width of the first deposition mask or the second deposition mask in the first direction.

[0008] The substrate further includes: a third peripheral area for connecting the first peripheral area and the second peripheral area; and a fourth peripheral area opposite to the third peripheral area across the display area, and the step of forming the encapsulation layer further includes: configuring a third deposition mask to overlap with the third peripheral area, the third deposition mask including a third center portion and a third branch portion extending from the third center portion in a second direction perpendicular to the first direction; and configuring a fourth deposition mask to overlap with the fourth peripheral area, the fourth deposition mask including a fourth center portion and a third branch portion extending from the fourth center portion in a direction opposite to the second direction. A fourth branch portion extends, in the step of configuring the third deposition mask, the third deposition mask is configured in a manner that the third branch portion faces the display area side, and in the step of configuring the fourth deposition mask, the fourth deposition mask is configured in a manner that the fourth branch portion faces the display area side, the thickness of the third branch portion is smaller than the thickness of the third center portion, the thickness of the fourth branch portion is smaller than the thickness of the fourth center portion, and the distance between the third deposition mask and the fourth deposition mask in the second direction is greater than the width of the third deposition mask or the fourth deposition mask in the second direction.

[0009] The first deposition mask to the fourth deposition mask are integrated.

[0010] The first deposition mask and the second deposition mask extend along the second direction, and the third deposition mask and the fourth deposition mask extend along the first direction.

[0011] The first packaging film contains an inorganic substance.

[0012] The thickness of the first branch portion is equal to or smaller than the width of the first branch portion in the first direction, and the thickness of the second branch portion is equal to or smaller than the width of the second branch portion in the first direction.

[0013] The thickness of the first branch portion is equal to or less than 60 um, and the thickness of the second branch portion is equal to or less than 60 um.

[0014] The width of the first branch portion in the first direction is equal to or greater than 700 um, and the width of the second branch portion in the first direction is equal to or greater than 700 um.

[0015] The thickness of the first branch portion is less than 0.8 times the thickness of the first central portion, and the thickness of the second branch portion is less than 0.8 times the thickness of the second central portion.

[0016] The first branch portion includes a first sub-branch portion and a second sub-branch portion, the first sub-branch portion is used to connect the first central portion and the second sub-branch portion, and the thickness of the first sub-branch portion is greater than the thickness of the second sub-branch portion.

[0017] The thickness of the first branch portion decreases continuously along the first direction.

[0018] The separation distance between the first deposition mask and the second deposition mask in the first direction is equal to or greater than 1 mm.

[0019] In the step of depositing a first packaging film on the device layer, the first packaging film is deposited by CVD (chemical vapor deposition).

[0020] The lower surface of the first central portion and the lower surface of the first branch portion are connected to form a plane, and the lower surface of the second central portion and the lower surface of the second branch portion are connected to form a plane. In the step of configuring the first deposition mask, the lower surface of the first central portion is configured to be closer to the component layer than the upper surface of the first central portion. In the step of configuring the second deposition mask, the lower surface of the second central portion is configured to be closer to the component layer than the upper surface of the second central portion.

[0021] The step of forming the encapsulation layer includes: forming a second encapsulation film on the first encapsulation film; and depositing a third encapsulation film on the second encapsulation film, wherein the second encapsulation film includes an organic substance and the third encapsulation film includes an inorganic substance.

[0022] In the step of depositing the first packaging film, a thicker first packaging film is deposited on the display area than on the first peripheral area and the second peripheral area.

[0023] The smaller the thickness of the first branch portion and the second branch portion, the smaller the difference between the thickness of the first packaging film deposited on the first peripheral area and the second peripheral area and the thickness of the first packaging film deposited on the display area.

[0024] In the present invention, by depositing the encapsulation film using a deposition mask with steps, the phenomenon that the first encapsulation film is not deposited with a uniform thickness due to the attraction generated by the deposition mask and the like hindering the movement of the deposition material can be improved. By improving this phenomenon, the color difference phenomenon of the image output by each area of ​​the display device can be alleviated. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a top view for schematically illustrating a method for manufacturing a display device according to an embodiment of the present invention.

[0026] Figure 2a is along Figure 1 The cross-sectional view is taken along the AA' cutting line.

[0027] Figure 2b It is a cross-sectional view for explaining the formation of a sealing layer using a deposition mask according to an embodiment of the present invention.

[0028] Figure 3 It is a sequence diagram for explaining a method for manufacturing a display device according to an embodiment of the present invention.

[0029] Figure 4 It is a sequence diagram for explaining a method for forming a sealing layer according to an embodiment of the present invention.

[0030] Figure 5 It is a schematic cross-sectional view of a first deposition mask and a second deposition mask for explaining an embodiment of the present invention.

[0031] Figure 6a and Figure 6b This is a graph for explaining the effect of the method for manufacturing a display device according to one embodiment of the present invention.

[0032] Figure 7 FIG. 4 is a cross-sectional view of a packaging layer according to an embodiment of the present invention.

[0033] Figure 8a and Figure 8b is a cross-sectional view of a first deposition mask according to another embodiment of the present invention.

[0034] Fig. 9 is a cross-sectional view of a first deposition mask according to another embodiment of the present invention. DETAILED DESCRIPTION

[0035] Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In this specification, when a structural element (or region, layer or part, etc.) is mentioned as being "located", "connected to" or "coupled to" "above" another structural element, this means that it can be directly connected / coupled to the other structural element or a third structural element can be arranged between them.

[0036] The same reference numerals refer to the same structural elements. In addition, in the drawings, the thickness, ratio and size of the structural elements are exaggerated in order to effectively illustrate the technical content. "And / or" includes all combinations that can be defined by the associated structures.

[0037] Although the terms first, second, etc. can be used to illustrate a variety of structural elements, the structural elements are not limited by the terms. The terms can be used to distinguish one structural element from other structural elements. For example, without departing from the scope of the present invention, the first structural element can be named as the second structural element, and similarly the second structural element can also be named as the first structural element. Regarding the expression in the singular form, if the meaning in the article does not clearly indicate other meanings, the expression in the singular form also includes the meaning of the plural form.

[0038] In addition, the terms “below”, “on the lower side”, “above”, and “on the upper side” are used to explain the relationship between the structures shown in the drawings. These terms are relative concepts and are explained based on the directions shown in the drawings.

[0039] It should be understood that the terms "including" or "having" are intended to specify the existence of the features, numbers, steps, operations, structural elements, components or their combinations recorded in the specification, and are not intended to exclude in advance the existence or additional possibility of one or more other features or numbers, steps, operations, structural elements, components or their combinations.

[0040] Figure 1 It is a top view for schematically illustrating a method for manufacturing a display device according to an embodiment of the present invention. Figure 2a is along Figure 1 The cross-sectional view is taken along the AA' cutting line. Figure 2b It is a cross-sectional view for explaining the formation of a sealing layer using a deposition mask according to an embodiment of the present invention. Figure 3 It is a sequence diagram for explaining a method for manufacturing a display device according to an embodiment of the present invention. Figure 4 It is a sequence diagram for explaining a method for forming a sealing layer according to an embodiment of the present invention. Figure 5 1 is a schematic cross-sectional view for explaining a first deposition mask 150 and a second deposition mask 160 according to an embodiment of the present invention. Figure 6a and Figure 6b This is a graph for explaining the effect of the method for manufacturing a display device according to one embodiment of the present invention.

[0041] Reference Figures 1 to 4 In order to manufacture a display device according to an embodiment of the present invention, a substrate 201 may be provided (S701). The substrate 201 may have a plate shape. The substrate 201 may be a crystalline silicon (LTPS) substrate, a glass substrate, or a plastic substrate.

[0042] The substrate 201 may include a display area AA and a peripheral area NA. The peripheral area NA may include a first peripheral area NA1, a second peripheral area NA2, a third peripheral area NA3, and a fourth peripheral area NA4. The first peripheral area NA1 may be configured from the display area AA in a direction opposite to the first direction D1. The second peripheral area NA2 may be configured from the display area AA in the first direction D1. The display area AA may be configured between the first peripheral area NA1 and the second peripheral area NA2. The third peripheral area NA3 may be configured from the display area AA in a direction opposite to the second direction D2. The fourth peripheral area NA4 may be configured from the display area AA in the second direction D2. The display area AA may be configured between the third peripheral area NA3 and the fourth peripheral area NA4.

[0043] A circuit layer may be formed on the substrate 201 (S702). The circuit layer may include a thin film transistor 300 for driving a plurality of pixels PX described later.

[0044] Reference Figure 1 and Figure 2a , a component layer may be formed on the circuit layer. The component layer may include a plurality of pixels PX. Each of the plurality of pixels PX may include sub-pixels P1 to P3. As an example of the present invention, the sub-pixels P1 to P3 may include a red sub-pixel P1 emitting red light, a green sub-pixel P2 emitting green light, and a blue sub-pixel P3 emitting blue light.

[0045] Each sub-pixel ( P1 - P3 ) may include a first electrode 130 , a light emitting layer ( 200R, 200G, 200B) and a second electrode 131 .

[0046] The first electrode 130 may be a reflective electrode. The first electrode 130 may include a laminated structure of a reflective layer and a transparent electrode layer with a high work function. The first electrode 130 may be a single layer or a multilayer structure, and may be variously deformed. The first electrode 130 may function as an anode electrode.

[0047] A pixel defining film 132 may be disposed on the first electrode 130. The pixel defining film 132 covers the edge of the first electrode 130 and includes a predetermined opening for exposing the center of the first electrode 130. The pixel defining film 132 may be formed of an organic material such as polyimide.

[0048] The light-emitting layers 200R, 200G, and 200B may be disposed on the first electrode 130. The light-emitting layers 200R, 200G, and 200B may include an organic light-emitting layer (not shown) for outputting light. The light-emitting layers 200R, 200G, and 200B may use low-molecular organic matter or high-molecular organic matter. In the organic light-emitting layer, a hole transport layer (HTL) and a hole injection layer (HIL) may be disposed toward the first electrode 130 with the organic light-emitting layer of a low-molecular organic layer formed of a low-molecular organic matter as the center, and an electron transport layer (ETL) and an electron injection layer (EIL) may be disposed toward the second electrode 131. Of course, in addition to the hole injection layer, the hole transport layer, the electron transport layer, and the electron injection layer, other functional layers may be laminated.

[0049] The light emitting layers 200R, 200G, and 200B may overlap with the display area AA, and may not overlap with the peripheral area NA. By outputting light from the light emitting layers 200R, 200G, and 200B, an image can be displayed to the outside.

[0050] The second electrode 131 may be formed of a transmissive electrode. The second electrode 131 may be a semi-transmissive film formed of a metal and / or a metal compound having a small work function such as Li, Ca, LiF / Ca, LiF / Al, Al, Mg, or Ag in a relatively thin thickness. The second electrode 131 may function as a cathode.

[0051] A packaging layer 20 may be formed on the element layer (on Figure 7 (shown in) (S704).

[0052] In order to form the encapsulation layer 20 , first to fourth deposition masks 150 , 160 , 170 , and 180 may be disposed ( S811 , S812 ).

[0053] The first deposition mask 150 may include a first central portion 151 and first branch portions 152, the second deposition mask 160 may include a second central portion 161 and second branch portions 162, the third deposition mask 170 may include a third central portion 171 and third branch portions 172, and the fourth deposition mask 180 may include a fourth central portion 181 and fourth branch portions 182.

[0054] Reference Figure 1, the first to fourth deposition masks 150, 160, 170, 180 may not overlap with the display area AA, and partially overlap with the peripheral area NA. As an example of the present invention, the first deposition mask 150 may partially overlap with the first peripheral area NA1, and the second deposition mask 160 may partially overlap with the second peripheral area NA2. The third deposition mask 170 may partially overlap with the third peripheral area NA3, and the fourth deposition mask 180 may partially overlap with the fourth peripheral area NA4. The first deposition mask 150 and the second deposition mask 160 may be configured to extend along the second direction D2, and the third deposition mask 170 and the fourth deposition mask 180 may be configured to extend along the first direction D1. The first to fourth branch portions 152, 162, 172, 182 may be configured to face the display area AA side.

[0055] In one example of the present invention, Figure 1 As shown, one opening may be integrally formed by the first deposition mask 150 , the second deposition mask 160 , the third deposition mask 170 , and the fourth deposition mask 180 .

[0056] The encapsulation layer 20 may be formed through the openings formed by the first to fourth deposition masks 150, 160, 170, and 180. Next, a process of forming the encapsulation layer 20 will be described.

[0057] Reference Figure 5 The first deposition mask 150 may be formed by an etching process so that the thickness TH2 of the first branch portion 152 is smaller than the thickness TH1+TH2 of the first central portion 151. As an example of the present invention, the thickness TH2 of the first branch portion 152 may be less than 0.8 times the thickness TH1+TH2 of the first central portion 151.

[0058] The thickness TH2 of the first branch portion 152 may be less than the width PD1 of the first branch portion 152 in the first direction D1. As an example of the present invention, the thickness TH2 of the first branch portion 152 may be 60um, and the width PD1 of the first branch portion 152 in the first direction D1 may be 700um. However, the present invention is not limited thereto, and the thickness TH2 of the first branch portion 152 may be less than 60um, and the width PD1 of the first branch portion 152 in the first direction D1 may be greater than 700um.

[0059] The second deposition mask 160 may be formed by etching so that the thickness TH2 of the second branch portion 162 is smaller than the thickness TH1+TH2 of the second central portion 161. As an example of the present invention, the thickness TH2 of the second branch portion 162 may be less than 0.8 times the thickness TH1+TH2 of the second central portion 161.

[0060] The thickness TH2 of the second branch portion 162 may be less than the width PD1 of the second branch portion 162 in the first direction D1. As an example of the present invention, the thickness TH2 of the second branch portion 162 may be 60um, and the width PD1 of the second branch portion 162 in the first direction D1 may be 700um. However, the present invention is not limited thereto, and the thickness TH2 of the second branch portion 162 may be less than 60um, and the width PD1 of the second branch portion 162 in the first direction D1 may be greater than 700um.

[0061] The distance PD2 between the first deposition mask 150 and the second deposition mask 160 in the first direction D1 may be greater than the width of the first deposition mask 150 or the second deposition mask 160 in the first direction D1. As an example of the present invention, the distance PD2 between the first deposition mask 150 and the second deposition mask 160 in the first direction D1 may be greater than 1 mm.

[0062] In the first deposition mask 150, the lower surface of the first central portion 151 and the lower surface of the first branch portion 152 may be connected to form a plane. That is, the lower surface of the first central portion 151 and the lower surface of the first branch portion 152 may be part of the same plane. The lower surface of the first central portion 151 may be configured to be closer to the element layer than the upper surface of the first central portion 151. That is, the distance between the lower surface of the first central portion 151 and the substrate 201 may be smaller than the distance between the upper surface of the first central portion 151 and the substrate 201.

[0063] In the second deposition mask 160, the lower surface of the second central portion 161 and the lower surface of the second branch portion 162 may be connected to form a plane. That is, the lower surface of the second central portion 161 and the lower surface of the second branch portion 162 may be part of the same plane. The lower surface of the second central portion 161 may be configured to be closer to the element layer than the upper surface of the second central portion 161. That is, the distance between the lower surface of the second central portion 161 and the substrate 201 may be smaller than the distance between the upper surface of the second central portion 161 and the substrate 201.

[0064] exist Figure 5 For the convenience of explanation, the circuit layer and the element layer are omitted, and only the substrate 201 and the first deposition mask 150 and the second deposition mask 160 are shown. Figure 5 The process of forming the encapsulation layer 20 using the first deposition mask 150 and the second deposition mask 160 is described in detail, and the same content can also be applied to the third deposition mask 170 and the fourth deposition mask 180. Figure 1, the third deposition mask 170 may be formed by an etching process so that the thickness of the third branch portion 172 is smaller than the thickness of the third central portion 171, and the fourth deposition mask 180 may be formed by an etching process so that the thickness of the fourth branch portion 182 is smaller than the thickness of the fourth central portion 181. In addition, the distance between the third deposition mask 170 and the fourth deposition mask 180 in the second direction D2 may be greater than the width of the third deposition mask 170 or the fourth deposition mask 180 in the second direction D2. Other contents of the third deposition mask 170 and the fourth deposition mask 180 are the same as those described in the first deposition mask 150 and the second deposition mask 160, so the description is omitted below.

[0065] Reference Figure 2b , Figure 4 and Figure 5 , the first encapsulation film 230 can be deposited through the opening formed by the first deposition mask 150 and the second deposition mask 160 (S813). More specifically, the first encapsulation film 230 can be formed by deposition in the portion of the element layer that does not overlap with the first deposition mask 150 and the second deposition mask 160 (i.e., the display area AA and the portion that overlaps with a portion of the peripheral area NA). As an example of the present invention, the first encapsulation film 230 can be deposited by CVD (chemical vapor deposition).

[0066] In this way, by using the deposition mask 150, 160, 170, 180 with steps to deposit the first encapsulation film 230, it is possible to improve the phenomenon that the first encapsulation film 230 is not deposited with a uniform thickness due to the attraction generated by the deposition mask and the like hindering the movement of the deposition material. More specifically, by forming the deposition mask with steps, it is possible to improve the phenomenon that the first encapsulation film 230 is deposited thicker in the display area AA than in the peripheral area. Figure 6a and Figure 6b It can be confirmed that the thickness of the first packaging film 230 decreases from the center toward the edge, and the deviation when using the deposition mask with steps is smaller than when using the deposition mask without steps (from -10.4% to -7.1% and from -9.6% to -6.7%, respectively). Figure 6a and Figure 6b In the graph of FIG. 1 , the X axis represents the position on the substrate in the cross section, and the Y axis represents the thickness of the first packaging film 230 . As a result, by improving this phenomenon, the color difference phenomenon of the image output by the display device in each area can be alleviated.

[0067] Below, in Figure 7 The first packaging film 230 is described in detail in FIG.

[0068] Figure 7 FIG. 2 is a cross-sectional view of the encapsulation layer 20 according to an embodiment of the present invention.

[0069] like Figure 7 As shown, the first encapsulation film 230, the second encapsulation film 240 and the third encapsulation film 250 can be formed by the aforementioned process of forming the encapsulation layer 20. The first encapsulation film 230 can include an inorganic substance. As an example of the present invention, the first encapsulation film 230 can include silicon nitride (SiN x ). The first packaging film 230 can block moisture or air from the outside. As mentioned above, the first packaging film 230 can be deposited by CVD.

[0070] The second encapsulation film 240 may be formed on the first encapsulation film 230. The second encapsulation film 240 may include an organic substance. The second encapsulation film 240 may include a polymer substance including a monomer. As an example of the present invention, the second encapsulation film 240 may include polyimide (PI). The second encapsulation film 240 may planarize the lower layer. The thickness of the second encapsulation film 240 may be greater than the thickness of the first encapsulation film 230 and the third encapsulation film 250 described later.

[0071] A third packaging film 250 may be formed on the second packaging film 240. The third packaging film 250 may include an inorganic substance. As an example of the present invention, the third packaging film 250 may include silicon oxide (SiO x The third packaging film 250 can block moisture or air from the outside. Like the first packaging film 230, the third packaging film 250 can be deposited on the second packaging film 240 by CVD.

[0072] The encapsulation layer 20 is not limited to Figure 7 The encapsulation layer 20 may be modified in various ways, such as in the structure shown. For example, the encapsulation layer 20 may have a structure in which films containing organic substances and films containing inorganic substances are alternately arranged.

[0073] Figure 8a , Figure 8b and Fig. 9 1 is a cross-sectional view of a first deposition mask 150 ′, 150 ″, 150 ′″ according to another embodiment of the present invention.

[0074] Below, although Figure 8a , Figure 8b and Fig. 9 Detailed description is given of the structures of the first deposition masks 150 ′, 150 ″, and 150 ′″, but this description can of course also be applied to the second deposition mask 160 , the third deposition mask 170 , and the fourth deposition mask 180 .

[0075] Reference Figure 8aIn the first deposition mask 150', the first branch portion 152' may include a first sub-branch portion 1521 and a second sub-branch portion 1522. The first sub-branch portion 1521 may be disposed between the first central portion 151 and the second sub-branch portion 1522. The thickness of the first sub-branch portion 1521 may be greater than the thickness of the second sub-branch portion 1522. That is, the first sub-branch portion 1521 and the second sub-branch portion 1522 may form a step. The rest of the content is the same as Figure 3 The contents are the same, so the description is omitted.

[0076] Figure 8b The first deposition mask 150" may be Figure 8a The structure further includes a third sub-branch 1523. A second sub-branch 1522 may be disposed between the third sub-branch 1523 and the first sub-branch 1521. The thickness of the third sub-branch 1523 may be smaller than the thickness of the first sub-branch 1521 and the thickness of the second sub-branch 1522. That is, two steps may be formed by the first sub-branch 1521, the second sub-branch 1522, and the third sub-branch 1523. Figure 3 The contents are the same, so the description is omitted.

[0077] Although in Figure 8a and Figure 8b The first branch portion 152 is shown to have one step and two steps, respectively. However, the first branch portion 152 is not limited thereto and may have three or more steps.

[0078] exist Fig. 9 In the embodiment, the first branch portion 152'' may have an inclined surface. That is, the thickness of the first branch portion 152'' may continuously decrease along the first direction D1. However, the shape of the first branch portion 152''' is not limited thereto, and may be deformed into various shapes.

[0079] The above description is made with reference to the preferred embodiments of the present invention, but it should be understood that a skilled person in the technical field or a person having general knowledge in the technical field can modify and change the present invention in various ways without departing from the scope of the idea and technical field of the present invention as recorded in the attached claims.

[0080] Therefore, the technical scope of the present invention is not limited by the contents described in the detailed description of the specification but should be limited by the scope of the claims.

[0081] Description of Reference Numerals

[0082] 150: First deposition mask 230: First packaging film

[0083] 151: first central portion 240: second packaging film

[0084] 152: first branch portion 250: third packaging film

Claims

1. A method for manufacturing a display device, comprising the following steps: Providing a substrate including a display area and a first peripheral area and a second peripheral area, wherein the first peripheral area and the second peripheral area are defined outside the display area and face each other across the display area; forming a circuit layer on the substrate; forming a device layer on the display area; as well as forming a packaging layer in a manner of covering the element layer, The steps of forming the encapsulation layer include: Disposing a first deposition mask to overlap a portion of the first peripheral region, the first deposition mask comprising a first central portion and a first branch portion extending from the first central portion along a first direction; disposing a second deposition mask to overlap a portion of the second peripheral region, the second deposition mask comprising a second central portion and second branch portions extending from the second central portion in a direction opposite to the first direction; and depositing a first packaging film on the device layer using the first deposition mask and the second deposition mask, In the step of configuring the first deposition mask, the first deposition mask is configured in such a manner that the first branch portion faces the display region side. In the step of configuring the second deposition mask, the second deposition mask is configured so that the second branch portion faces the display area side. The first deposition mask and the second deposition mask are spaced apart from the substrate in a thickness direction of the substrate, The thickness of the first branch portion is less than 0.8 times the thickness of the first central portion, and the thickness of the second branch portion is less than 0.8 times the thickness of the second central portion. The thickness of the first branch portion is equal to or less than 60 um, the thickness of the second branch portion is equal to or less than 60 um, The width of the first branch portion in the first direction is equal to or greater than 700 um, and the width of the second branch portion in the first direction is equal to or greater than 700 um.

2. The method for manufacturing a display device according to claim 1, wherein: The substrate further includes: a third peripheral region for connecting the first peripheral region and the second peripheral region; and a fourth peripheral region opposite to the third peripheral region across the display region. The step of forming the encapsulation layer further comprises: disposing a third deposition mask to overlap the third peripheral region, the third deposition mask comprising a third central portion and third branch portions extending from the third central portion along a second direction perpendicular to the first direction; and A fourth deposition mask is arranged to overlap the fourth peripheral region, the fourth deposition mask including a fourth central portion and fourth branch portions extending from the fourth central portion in a direction opposite to the second direction.

3. The method for manufacturing a display device according to claim 2, wherein: In the step of configuring the third deposition mask, the third deposition mask is configured in such a manner that the third branch portion faces the display region side. In the step of disposing the fourth deposition mask, the fourth deposition mask is disposed so that the fourth branch portions face the display region side.

4. The method for manufacturing a display device according to claim 3, wherein: The thickness of the third branch portion is smaller than the thickness of the third central portion, The thickness of the fourth branch portion is smaller than the thickness of the fourth central portion, A distance between the third deposition mask and the fourth deposition mask in the second direction is greater than a width of the third deposition mask or the fourth deposition mask in the second direction.

5. The method for manufacturing a display device according to claim 4, wherein: The first deposition mask to the fourth deposition mask are integrated.

6. The method for manufacturing a display device according to claim 4, wherein: The first deposition mask and the second deposition mask extend along the second direction, and the third deposition mask and the fourth deposition mask extend along the first direction.

7. The method for manufacturing a display device according to claim 1, wherein: The first packaging film contains an inorganic substance.

8. The method for manufacturing a display device according to claim 1, wherein: The first branch portion includes a first sub-branch portion and a second sub-branch portion, The first sub-branch portion is used to connect the first central portion and the second sub-branch portion, The thickness of the first sub-branch is greater than the thickness of the second sub-branch.

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