A buried base modification material for a flexible perovskite solar cell and a preparation method and application thereof
By introducing a mercapto-containing polymer substrate modification material into flexible perovskite solar cells, the problems of perovskite film cracking and interface delamination were solved, thereby improving the photoelectric efficiency and mechanical stability of flexible perovskite solar cells.
Patent Information
- Application Number
- CN202411376098.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-29
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2044-09-29
AI Technical Summary
Flexible perovskite solar cells are susceptible to stress from tension, shearing, and bending during service, which can lead to cracking of the perovskite film and interface detachment. Furthermore, the brittleness of the hole transport material and insufficient interfacial bonding can affect photoelectric efficiency and mechanical stability.
A thiol-containing polymer is used as the buried substrate modification material. The polymer buried substrate modification material is generated through a cross-linking reaction, which enhances the interfacial bonding force between the hole transport layer and the perovskite layer, passivates interfacial defects, and improves the efficiency and mechanical stability of flexible perovskite solar cells.
By introducing a thiol-containing polymer substrate modification material, interlayer stress was reduced, interfacial bonding was enhanced, and the photoelectric performance and mechanical durability of flexible perovskite solar cells were improved.