Server chassis and server

Abstract

The present application relates to the field of computer technology, and in particular to a server chassis and a server. The server chassis includes: a shell, a limit assembly and a power supply connection assembly; the shell includes a housing cavity, the housing cavity includes a first opening and a second opening, for passing the component modules of the server; the limit assembly includes a central backplane, the central backplane is arranged in the housing cavity; the power supply connection assembly includes a plurality of connectors arranged on the central backplane, the connector arranged on the central backplane faces the first opening or the second opening, and is used for detachable connection with a connector arranged on the surface of the component module; when the connector and the connector are assembled, the two are electrically connected. Through the above method, the present application can decouple the component modules inside the server, realize blind insertion and quick disassembly of the component modules, and thus help to improve the assembly and operation and maintenance efficiency of the server component modules.

Description

Technical Field

[0001] The present application relates to the field of computer technology, and in particular to a server chassis and a server. Background Art

[0002] The server usually includes components such as CPU (Central Processing Unit), GPU (Graphics Processing Unit), heat dissipation module, power supply module, etc. The components are usually interconnected, that is, there are many cables and coupling structures directly interconnecting the components. The components are tightly coupled, making it difficult to operate and maintain one of the components separately, resulting in serious waste of time cost and operation and maintenance cost. Summary of the invention

[0003] Based on this, it is necessary to provide a server chassis and a server to address the above technical problems, which can decouple the various component modules inside the server, realize blind insertion and quick disassembly of the component modules, and thus help improve the assembly and operation and maintenance efficiency of the server component modules.

[0004] On the one hand, a server chassis is provided, which includes: a shell, a limit assembly and a power supply connection assembly; the shell includes a accommodating cavity, the accommodating cavity includes a first opening and a second opening, and is used to pass the component module of the server; the limit assembly includes a central backplane, and the central backplane is arranged in the accommodating cavity; the power supply connection assembly includes a plurality of connectors arranged on the central backplane, and the connector arranged on the central backplane faces the first opening or the second opening, and is used to be detachably connected with a connector arranged on the surface of the component module; when the connector and the connector are assembled, the two are electrically connected; wherein the detachable connection means that when the non-connector part of the component module is subjected to a force along a reference direction, the component module moves relative to the central backplane, so that the connector of the component module and the corresponding connector are coaxially assembled or separated, without distinguishing the positive and negative directions, up and down, left and right positions of the connector and the connector; the reference direction is parallel to the relative direction of the first opening and the second opening.

[0005] In one embodiment of the present application, the server chassis also includes a transit connector; wherein the component modules include a first module and a second module, and the transit connector is used to be detachably connected to the first module and the second module respectively, and when the first module and the second module are both connected to the transit connector, the first module is electrically connected to the second module through the transit connector.

[0006] In one embodiment of the present application, the limit assembly also includes a limit member, which is arranged on the side of the central back panel facing the first opening; the transit connector is arranged on the side of the limit member facing the first opening; the transit connector includes a first connection part and a second connection part, and the relative direction of the first connection part and the second connection part is perpendicular to the reference direction; the first connection part is used to be detachably connected to the connection part on the side surface of the first module facing it; the second connection part is used to be detachably connected to the connection part on the side surface of the second module facing it; wherein the first module and the second module are movably arranged on the side of the transit connector facing the first opening, and the movable directions of the two are parallel to the reference direction; the relative direction of the first module and the second module is perpendicular to the reference direction.

[0007] In one embodiment of the present application, the server chassis also includes an in-chassis heat dissipation component and a heat dissipation connection component, both of which are arranged in the accommodating cavity; the in-chassis heat dissipation component is connected to the heat dissipation connection component, and the heat dissipation connection component is used to connect to the component module to be cooled, so that the in-chassis heat dissipation component is detachably connected to the component module to be cooled through the heat dissipation connection component.

[0008] In one embodiment of the present application, the server chassis also includes a liquid pipeline and a heat dissipation connection assembly; the heat dissipation connection assembly includes a first pipeline connector and a second pipeline connector arranged at both ends of the liquid pipeline; wherein the first pipeline connector is arranged in the shell for connecting to an external liquid source; the second pipeline connector is arranged in the accommodating cavity for detachably connecting to the liquid channel constituting the module.

[0009] In one embodiment of the present application, at least one connector of the power supply connection assembly includes a blind plug connector; and / or, at least one pipe connector in the heat dissipation connection assembly includes a quick-release blind plug connector; and / or, the server chassis also includes a transit connector for connecting to the first module and the second module of the server respectively to transfer the electrical signal between the two; the transit connector includes a blind plug connector.

[0010] In one embodiment of the present application, the server chassis also includes a movable channel, which is arranged in the accommodating cavity, and one side opening of the movable channel faces the first opening or the second opening, and the other side opening faces the central backplane, which is used to allow the component module to move along the movable channel.

[0011] On the other hand, a server is provided, the server comprising: a server chassis of a component module; the component module comprises a heat dissipation module, a graphics processor module, a central processing unit module, and a power supply module; the component module is arranged in the server chassis; the server chassis comprises a shell, a limit assembly and a power supply connection assembly; the shell comprises a receiving cavity, the receiving cavity comprises a first opening and a second opening, and is used for passing the component module of the server; the limit assembly comprises a central backplane, and the central backplane is arranged in the receiving cavity; the power supply connection assembly comprises a plurality of connectors arranged on the central backplane, the connector arranged on the central backplane faces the first opening or the second opening, and is used for detachable connection with a connector arranged on the surface of the component module; when the connector and the connector are assembled, the two are electrically connected; wherein the detachable connection means that when the non-connector part of the component module is subjected to a force along a reference direction, the component module moves relative to the central backplane, so that the connector of the component module and the connector corresponding thereto are coaxially assembled or separated, without distinguishing the positive and negative directions, up and down, left and right positions of the connector and the connector; the reference direction is parallel to the relative direction of the first opening and the second opening.

[0012] In one embodiment of the present application, at least one component module includes: a module shell, a module functional body and a plurality of connecting parts; the connecting parts are arranged on the surface of the module shell; the module functional body is arranged inside the module shell; the connecting parts are electrically connected to the module functional body, and are also used for detachable connection with the connector arranged on the central backplane.

[0013] In one embodiment of the present application, the limit assembly includes a limit member, which is arranged on the side of the central back panel facing the first opening; a transfer connector is provided on the side of the limit member facing the first opening; the graphics processor module and the central processing unit module are respectively detachably connected to the transfer connector through the connecting member, and the interactive signal between the graphics processor module and the central processing unit module is transmitted via the transfer connector.

[0014] In one embodiment of the present application, the graphics processor module includes a first shell, and the graphics processor is arranged inside the first shell; a first connecting piece is provided on the surface of the first shell facing the transfer connector, which is used to be detachably connected to the transfer connector, and is connected to the graphics processor through a first connecting line in the first shell; when the graphics processor module is moved, the graphics processor, the first connecting line and the first connecting piece move with the first shell.

[0015] In one embodiment of the present application, the CPU module includes a second shell, and the CPU is arranged inside the second shell; a second connecting piece is provided on the surface of the second shell facing the transit connector, which is used for detachable connection with the transit connector, and is connected to the CPU via a second connecting line in the second shell; when the CPU module is moved, the CPU, the second connecting line and the second connecting piece move with the second shell.

[0016] In one embodiment of the present application, the graphics processor module is arranged on the side of the center back panel facing the first opening; the power supply connection assembly includes a power supply connector, which is arranged on the side of the center back panel facing the first opening; a third connecting piece is provided on the surface of the graphics processor module facing the center back panel, which is detachably connected to the power supply connector provided on the center back panel.

[0017] In one embodiment of the present application, the graphics processor module includes a graphics processor and a power input component; the third connector is arranged on the side of the power input component facing the center backplane; the graphics processor is arranged on the side of the power input component away from the center backplane, and the graphics processor is electrically connected to the power input component for receiving power input through the center backplane and the power input component.

[0018] In one embodiment of the present application, the power supply input component includes an abutment portion and a main body; the server chassis includes a limit piece; a third connecting piece is arranged on the abutment portion; a side of the main body away from the abutment portion is connected to the graphics processor; the main body is surrounded to form an avoidance groove, and the limit piece is arranged in the avoidance groove; the graphics processor module also includes a first connecting piece, which is detachably connected to the first connecting part of the transit connector arranged on the limit piece, and the third connecting piece is also electrically connected to the graphics processor.

[0019] In one embodiment of the present application, the graphics processor module also includes a cooling component; the cooling component is arranged on the graphics processor to dissipate heat from the graphics processor, and when the graphics processor module is moved, the graphics processor, the power input component and the cooling component are linked.

[0020] In one embodiment of the present application, a server chassis includes a liquid pipeline and a first pipeline connector and a second pipeline connector arranged at both ends of the liquid pipeline; the cooling assembly includes a liquid cooling connector, a plurality of cooling plates, a liquid channel and a liquid separator; the cooling plate abuts against a graphics processor; the liquid cooling connector is arranged on a surface of the graphics processor facing the second pipeline connector; the two ends of the liquid channel are respectively connected to the liquid cooling connector and the cooling plate, and the liquid cooling connector and the second pipeline connector are detachably connected to allow the coolant to flow through the liquid pipeline, the liquid channel and the cooling plate; the liquid channel is connected to the cooling plate through the liquid separator; the coolant flows into the liquid separator through the liquid channel and is diverted to each cooling plate to dissipate heat for the graphics processor.

[0021] In one embodiment of the present application, the central processing unit module is arranged on the side of the central back plate facing the first opening; a second connecting member is provided on the surface of the central processing unit module facing the central back plate, the second connecting member is connected to the central processing unit, and is also detachably connected to the transfer connector.

[0022] In one embodiment of the present application, the transit connector includes a first connecting portion and a second connecting portion; wherein the first direction is parallel to the relative direction between the central processing unit module and the graphics processing unit module, and the first direction is also perpendicular to the reference direction; wherein the first direction is the relative direction between the first connecting portion and the second connecting portion; the connector of the first connecting portion is detachably connected to the first connecting piece of the graphics processing unit module, and the connector of the first connecting portion is electrically connected to the graphics processor through the first connecting piece; the connector of the second connecting portion is detachably connected to the second connecting piece, and the connector of the second connecting portion is electrically connected to the central processing unit through the second connecting piece.

[0023] In one embodiment of the present application, the central processing unit outputs a graphics management signal, which is used to manage the working status of the graphics processor module; the graphics management signal is transmitted to the relay connector via the first connecting member, and is transmitted to the second connecting member via the relay connector to be transmitted to the graphics processor module.

[0024] In one embodiment of the present application, the heat dissipation module is arranged on the side of the central processing unit module facing the second opening; a fourth connecting member is provided on the surface of the heat dissipation module facing the central processing unit module, and a fifth connecting member is provided on the surface of the central processing unit module facing the heat dissipation module; the fourth connecting member and the fifth connecting member are detachably connected; so that the central processing unit module and the heat dissipation module can interact with each other through the fourth connecting member and the fifth connecting member.

[0025] In one embodiment of the present application, the heat dissipation module is electrically connected to the power supply module for receiving the power supply energy output by the power supply module; when the fourth connector is connected to the fifth connector, part of the power supply energy is input to the central processing unit module through the fourth connector and the fifth connector for supplying power to the central processing unit module.

[0026] In one embodiment of the present application, the central processing unit of the central processing unit module outputs a heat dissipation management signal, and the heat dissipation management signal is used to manage the working state of the heat dissipation module; the heat dissipation management signal is transmitted to the heat dissipation module via the fifth connecting member and the fourth connecting member.

[0027] In one embodiment of the present application, the heat dissipation module includes a heat dissipation fan, a fan power supply assembly and a sixth connecting member; the heat dissipation fan is arranged on the side of the fan power supply assembly facing the second opening, and the heat dissipation fan and the fan power supply assembly are detachably connected; the fan power supply assembly is provided with a fourth connecting member; the sixth connecting member is arranged on the surface of the heat dissipation module facing the central backplane side; the sixth connecting member is electrically connected to the fourth connecting member, and the sixth connecting member is also electrically connected to the power supply module.

[0028] In one embodiment of the present application, the power supply connection assembly also includes a heat dissipation connector, which is arranged on the side of the center back panel facing the second opening; the heat dissipation connector is detachably connected to the sixth connecting piece; the center back panel is also electrically connected to the power supply module, and the power supply energy output by the power supply module is transmitted to the heat dissipation module through the center back panel, the heat dissipation connector and the sixth connecting piece.

[0029] In one embodiment of the present application, the power module is arranged on the side of the central back panel facing the second opening; the power module is provided with a seventh connecting piece; the power supply connection assembly also includes a power connector, which is arranged on the side of the central back panel facing the second opening; the seventh connecting piece is detachably connected to the power connector.

[0030] In one embodiment of the present application, the power supply module outputs power supply energy to the center backplane, and part of the power supply energy is transmitted to the graphics processor module via the center backplane; part of the power supply energy is transmitted to the heat dissipation module via the center backplane, and the heat dissipation module transmits part of the received power supply energy to the central processing unit module.

[0031] In one embodiment of the present application, the central processing unit module is electrically connected to the heat dissipation module, and the heat dissipation module is electrically connected to the center backplane; the central processing unit of the central processing unit module outputs a power management signal, and the power management signal is transmitted to the center backplane via the heat dissipation module, and is transmitted to the power module via the power connector and the seventh connector, so as to manage the working status of the power module through the power management signal.

[0032] The above-mentioned server chassis and server, the server chassis has a central backplane inside the accommodating cavity, and the central backplane is provided with a power supply connection component. The component modules of the server are decoupled. In this way, in at least one component module, a detachable connection between the component module and the central backplane can be achieved through a detachable connection between a connector provided on the component module and a connector provided on the central backplane. In other words, the present application can achieve blind insertion and rapid disassembly of at least one component module, which is beneficial to improving the assembly and operation and maintenance efficiency of the server component modules. It also achieves blind insertion of the power supply link in the server chassis, and at the same time, it can also achieve blind insertion of the data / signal link between the graphics processor module, the central backplane, the power module, and the heat dissipation module through the central backplane.

[0033] The transfer connector can transfer the signals between the CPU module and the GPU module, so that a high-speed signal connection can be formed between the CPU module and the GPU module. In addition, the CPU module and the GPU module are decoupled to reduce the impact of loading and unloading or operating one of them separately on the other. In other words, while ensuring high-speed signal transmission between the CPU module and the GPU module, the signal link between the two can also be blindly plugged.

[0034] Furthermore, during the assembly process of component modules that have heat dissipation requirements, such as a graphics processor module, the liquid cooling-related connectors of the graphics processor module can be detachably connected to the heat dissipation components and heat dissipation connectors in the box, thereby achieving blind insertion of liquid cooling in the server chassis and improving the loading and unloading efficiency of the liquid cooling part in the server chassis.

[0035] At the same time, in this application, the heat dissipation module of the server receives the power supply energy emitted by the power supply module, and transmits part of the power supply energy to the central processing unit module to realize the power supply of the central processing unit module. The heat dissipation module can also receive the power management signal, heat dissipation management signal, etc. generated by the central processing unit module, update its working state based on the received heat dissipation management signal, and forward the power management signal to the power supply module through the central backplane. While ensuring the blind insertion of the component modules in the server of this application, the internal signal link and power supply link can also be reasonably planned. In addition, as explained above, in this embodiment, the heat dissipation of the component modules inside the server chassis is also blindly plugged in, which further improves the degree of decoupling between the component modules inside the server, and is also conducive to improving the performance of the server. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 It is a structural schematic diagram of an embodiment of a server chassis of the present application;

[0037] Figure 2 It is a structural schematic diagram of an embodiment of the server chassis of the present application in which the housing and the movable channel are omitted;

[0038] Figure 3 It is a structural diagram of an embodiment of the server of the present application;

[0039] Figure 4 yes Figure 3 The server shown is a schematic structural diagram of an embodiment in which the housing is omitted;

[0040] Figure 5 It is a structural schematic diagram of an embodiment of a graphics processor module, a central processing unit module, a stopper and a transfer connector of the present application;

[0041] Figure 6 It is a structural schematic diagram of an embodiment of the limiter, the transfer connector, the first connecting member and the second connecting member of the present application;

[0042] Figure 7 It is a structural schematic diagram of a liquid cooling related structure and a central backplane embodiment of the present application;

[0043] Figure 8a It is a structural schematic diagram of an embodiment of the assembly of a limit assembly, a transfer processor and a graphics processor module of the present application;

[0044] Figure 8byes Figure 8a The schematic diagram shown is a structural schematic diagram of an embodiment of a separated graphics processor module;

[0045] Fig. 9 It is a structural schematic diagram of an embodiment of a fan power supply assembly and a central processing unit of the present application;

[0046] Fig.10 It is a structural schematic diagram of an embodiment of the heat dissipation module of the present application;

[0047] Fig.11 It is a structural schematic diagram of an embodiment of the heat dissipation module and the central backplane of the present application;

[0048] Fig.12a This is a schematic diagram of a flow chart of an embodiment of transmitting power supply energy of the present application;

[0049] Figure 12b This is a flow chart of an embodiment of transmitting a heat dissipation management signal of the present application;

[0050] Fig.12c It is a flowchart of an embodiment of transmitting a power management signal of the present application. DETAILED DESCRIPTION

[0051] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0052] As the Internet's requirements for AI (Artificial Intelligence) computing, big data applications, reasoning training, etc. continue to increase, the demand for AI servers is also growing. Generally speaking, the core components of AI servers are GPUs and the corresponding CPUs. Among them, GPUs are used to implement computing, reasoning and other services. The GPU and CPU are usually directly connected through a bus such as PCIe (Peripheral Component Interconnect Express, a high-speed serial computer expansion bus standard), so that the two are interconnected to achieve CPU management of the GPU and the delivery of business flows.

[0053] Taking the GPU in the form of a PCIe standard card as an example, in order to achieve the maximum efficiency of the computing power of a single server, as many GPUs as possible are usually installed in the AI ​​server. Therefore, compared with conventional general-purpose servers, the size of AI servers will be larger and the height will often be higher, such as AI servers with server chassis sizes such as 4U and 8U. Among them, U is a unit that represents the external size of the server, which is an abbreviation of unit, and 1U is 4.445cm.

[0054] In AI servers of related technologies, the interconnection between component modules, such as GPU module and CPU module, GPU module and power module, CPU module and power module, CPU module and heat dissipation module, etc., is often transferred through PCIe SW (Switch) chips, or directly connected through cables to directly connect the ports between the component modules to achieve interconnection.

[0055] Taking the GPU and CPU of an 8U server as an example, the GPU module and CPU module can occupy 4U of chassis height respectively. The server chassis is designed with power supply, heat dissipation, high-speed signal interconnection, etc. for each component group, which are uniformly provided to the GPU module and CPU module. Therefore, each component module in the server is usually treated as a whole, and its power supply, heat dissipation, and signal interconnection are designed as a whole, resulting in a tight coupling design between the two 4U of the GPU module and the CPU module.

[0056] Specifically, the GPU module and the CPU module can occupy the upper and lower 4U spaces of the server chassis respectively. Among them, the power supply, heat dissipation of the GPU module and the high-speed interconnection between the GPU and the CPU all need to span the upper and lower 4U. Each peripheral card, motherboard, PSU (PC Power Supply Unit), power supply board, and fan board are also usually directly coupled, resulting in a single move affecting the entire body. In other words, there are many coupling structures in the cables and pipes that directly interconnect the component modules, making it difficult to separately operate and maintain the component modules that need to be maintained.

[0057] Specifically, when the internal components of the server need to be maintained, the lower space is usually not accessible for direct maintenance due to the relatively high height of the 8U chassis. Therefore, the upper structure and boards need to be completely disassembled, and the interconnected cables and pipes between the upper and lower parts need to be further removed before the lower components can be maintained. In addition, the height of the entire server chassis is about 35cm. Even after the upper structure has been removed, due to mechanical structural limitations, the operation and maintenance personnel may still need to extend their entire arm into the server chassis to reach the components at the bottom of the server chassis, making the maintenance process very difficult.

[0058] Therefore, during the actual operation and maintenance of the server, the server chassis may need to be removed from the cabinet and returned to the operation and maintenance center so that the entire server system can be disassembled using special tools before operation and maintenance can be performed, which causes serious waste in terms of time cost and operation and maintenance cost.

[0059] In order to solve the technical problem that the internal structure of the server is complex and difficult to assemble and maintain in the related art, the present application provides a server chassis and a server. The server chassis includes a shell, a limit assembly and a power supply connection assembly; the shell includes a housing cavity, the housing cavity includes a first opening and a second opening, which is used to pass the component module of the server; the limit assembly includes a central backplane, and the central backplane is arranged in the housing cavity; the power supply connection assembly includes a plurality of connectors arranged on the central backplane, and the connector arranged on the central backplane faces the first opening or the second opening, and is used to be detachably connected with the connector arranged on the surface of the component module; when the connector and the connector are assembled, the two are electrically connected; wherein, the detachable connection means that when the non-connector part of the component module is subjected to a force along the reference direction, the component module moves relative to the central backplane, so that the connector of the component module and the corresponding connector are coaxially assembled or separated, without distinguishing the positive and negative directions, up and down, left and right positions of the connector and the connector; the reference direction is parallel to the relative direction of the first opening and the second opening. The detailed structure and working principle of the present application are described by example below.

[0060] Please refer to Figures 1 to 4 , Figure 1 It is a structural diagram of an embodiment of a server chassis of the present application, Figure 2 This is a structural diagram of an embodiment of the server chassis of the present application in which the housing and the movable channel are omitted. Figure 3 is a schematic diagram of the structure of an embodiment of the server of this application, Figure 4 yes Figure 3 The server shown is a schematic structural diagram of an embodiment in which the housing is omitted.

[0061] In one embodiment, the server chassis 10 includes a housing 11 , a limiting assembly 12 and a power supply connection assembly 13 .

[0062] The shell 11 serves as the basic carrier of the server chassis 10 and the server, and can carry and protect the server chassis 10 and various components of the server. The shell 11 may include a receiving cavity 111 for storing the internal structure of the server chassis 10 and the component modules of the server.

[0063] The accommodating cavity 111 may include a first opening 112 and a second opening 113 .

[0064] The first opening 112 and the second opening 113 are used to pass the component modules of the server. In layman's terms, the component modules of the server can be put into the accommodating cavity 111 or taken out from the accommodating cavity 111 through the first opening 112 and the second opening 113. For example, when the shell 11 of the server chassis 10 is a relatively regular appearance structure such as a cuboid, a cylinder, a cube, etc., the first opening 112 and the second opening 113 can be respectively arranged on opposite sides of the accommodating cavity 111.

[0065] The limiting assembly 12 may include a middle backplane 121. The middle backplane 121 may be, for example, an MBP (backplane board), which is not limited here.

[0066] The connector disposed on the middle back plate 121 faces the first opening 112 or the second opening 113. For example, the middle back plate 121 is disposed in the accommodating cavity 111 and is located on the relative path between the first opening 112 and the second opening 113. When the component module is sent into the accommodating cavity 111 through the first opening 112 or the second opening 113, the middle back plate 121 can be located on the moving path of the component module, so that the component module extending from the first opening 112 or the second opening 113 can be assembled on the middle back plate 121, so that the component module can be taken out through the first opening 112 or the second opening 113.

[0067] The power connection assembly 13 includes a plurality of connectors disposed on the central backplane 121 .

[0068] The connector provided on the central back plate 121 is used to be detachably connected with the connector provided on the surface of the component module. The detachable connection means that when the non-connector part of the component module is subjected to a force along the reference direction X, the component module moves relative to the central back plate 121, so that the connector of the component module and the connector corresponding thereto can be coaxially assembled or separated, and there is no need to distinguish the positive and negative directions, up and down, left and right positions of the connector and the connector, that is, the detachable connection in this embodiment means that the connector and the connector can be blindly plugged; the reference direction X is parallel to the relative direction of the first opening 112 and the second opening 113.

[0069] Among them, the number of component modules that can be detachably connected to the center backplane 121 in this embodiment is at least one. For example, at least one of the graphics processor module 20, the central processing unit module 30, the heat dissipation module 40 and the power supply module 50 can be detachably connected to the center backplane 121. Alternatively, some component modules such as the central processing unit module 30 are not detachably connected to the center backplane 121, and the remaining component modules are detachably connected to the center backplane 121. In this way, when the operation and maintenance personnel assemble the component modules detachably connected to the center backplane 121, they can assemble the component modules with the center backplane 121 by, for example, roughly evaluating the moving direction and the limiting structure of the component modules, without directly controlling the moving direction of the connectors of the component modules and manually assembling them with the connectors provided on the center backplane 121. Furthermore, when disassembling the component module that is detachably connected to the center back plate 121 , force can be applied to the non-connecting member portion of the component module to separate the component module from the center back plate 121 .

[0070] Furthermore, in this embodiment, the center backplane 121 can be connected to a power source. The power source can refer to the power module 50 inside the server, or it can be an external power source, which is not limited here. In this way, the component module connected to the center backplane 121 can be powered by the center backplane 121 and the power supply connection assembly 13. In other words, when the connector provided on the center backplane 121 is assembled with the connecting piece provided on the component module, the assembled connector and the connecting piece are electrically connected, thereby realizing the electrical connection between the center backplane 121 and the component module, so that the component module can be powered by the center backplane 121.

[0071] In this embodiment, a central backplane 121 is provided inside the accommodating cavity 111 of the server chassis 10, and the central backplane 121 is provided with a power supply connection component 13. The component modules of the server are decoupled. As such, in at least one component module, a detachable connection between the component module and the central backplane 121 can be achieved through a detachable connection between a connector provided on the component module and a connector provided on the central backplane 121. In other words, the present application can achieve blind insertion and quick disassembly of at least one component module, which is beneficial to improving the assembly and operation and maintenance efficiency of the server component modules.

[0072] Optionally, at least one connector of the power connection assembly 13 includes a blind plug connector. Accordingly, the connector of the component module connected to the power connection assembly 13 may also include a blind plug connector, so that when assembling the component module, the tedious work of carefully distinguishing the interface and aligning the interface can be reduced, and the component module can be quickly assembled or disassembled.

[0073] Please continue to refer to Figures 1 to 4 In one embodiment, the server chassis 10 further includes a transit connector 14 .

[0074] The server usually includes multiple component modules, one of which can be used as the first module and another component module as the second module, that is, the component modules include the first module and the second module. Figure 4 As shown in the example, the first module may be a graphics processor module 20, and the second module may be a central processing unit module 30, which is not limited here.

[0075] The transfer connector 14 can be detachably connected to the first module and the second module, respectively, so that the first module and the second module are connected to each other through the transfer connector 14. The transfer connector 14 can transfer and transmit the signal between the first module and the second module, so that a high-speed signal connection can be formed between the first module and the second module. In addition, the first module and the second module are decoupled to reduce the impact of loading and unloading or operating one of them separately on the other.

[0076] Specifically, when the first module and the second module are both connected to the transit connector 14 , the first module is electrically connected to the second module via the transit connector 14 , and signals between the first module and the second module can be transmitted via the transit connector 14 .

[0077] Furthermore, the limiting assembly 12 may also include a limiting member 122. The limiting member 122 may be disposed on the side of the central back panel 121 facing the first opening 112. The transit connector 14 is disposed on the side of the limiting member 122 facing the first opening 112. The limiting member 122 can limit the position of the transit connector 14 in the accommodating cavity 111. The first module and / or the second module may extend into the accommodating cavity 111 through the first opening 112, and the connecting member on its surface may correspond to the transit connector 14 on its travel path, and when the connecting member abuts against the transit connector 14 and is further subjected to force, the connecting member may be assembled on the transit connector 14, thereby realizing the assembly of the first module and / or the second module with the transit connector 14.

[0078] Furthermore, the transit connector 14 may include a first connection portion 141 and a second connection portion 142. The relative direction of the first connection portion 141 and the second connection portion 142 is perpendicular to the reference direction X.

[0079] The first connection portion 141 is used to be detachably connected to a connection piece on one side of the first module facing the first module. The second connection portion 142 is used to be detachably connected to a connection piece on one side of the second module facing the second module.

[0080] When the server chassis 10 is correctly placed, the relative direction of the first module and the second module can be parallel to the gravity direction, and the reference direction X is perpendicular to the gravity direction. The first module and the second module are movably arranged on the side of the transfer connector 14 facing the first opening 112, and the movable directions of the two are parallel to the reference direction X. The relative direction of the first module and the second module is perpendicular to the reference direction X.

[0081] Alternatively, transit connector 14 may include a blind-mate connector.

[0082] As such, at least one of the first connection portion 141 and the second connection portion 142 may be provided with a blind plug connector. For example, both the first connection portion 141 and the second connection portion 142 may be provided with a blind plug connector to achieve blind plugging with the first module and the second module respectively through the blind plug connector.

[0083] The first module and the second module will be exemplified in the following text in combination with specific component modules of the server, and will not be described in detail here.

[0084] Please continue to refer to Figures 1 to 4 In one embodiment, the server chassis 10 further includes an internal heat dissipation component and a heat dissipation connection component 16 , both of which are disposed in the accommodating cavity 111 .

[0085] The heat dissipation component in the box is connected to the heat dissipation connection component 16.

[0086] The heat dissipation connection assembly 16 is used to connect with the component module to be cooled. In this way, in this embodiment, the heat dissipation assembly in the box can be detachably connected with the component module to be cooled through the heat dissipation connection assembly 16.

[0087] Specifically, the heat dissipation component in the box may include a liquid pipeline.

[0088] The heat dissipation connection assembly 16 may include a first pipeline connector 161 and a second pipeline connector 162 disposed at both ends of the liquid pipeline.

[0089] The first pipe connector 161 is provided in the housing 11 for connecting to an external liquid source. The second pipe connector 162 is provided in the accommodating cavity 111 for detachably connecting to the liquid channel 242 of the component module. In this way, the component module can be cooled by liquid cooling, and during the assembly process of the component module, the liquid cooling-related connectors of the component module can be detachably connected to the second pipe connector 162, thereby improving the loading and unloading efficiency of the liquid cooling part in the server chassis 10.

[0090] Optionally, at least one pipe connector in the heat dissipation connection assembly 16 includes a quick-release blind plug connector to achieve blind plugging of the liquid cooling part, thereby facilitating further improving the loading and unloading efficiency of the liquid cooling part.

[0091] Please continue to refer to Figures 1 to 4 In one embodiment, the server chassis 10 further includes a moving channel 17 .

[0092] The moving channel 17 can be provided in the accommodating cavity 111, with one side opening of the moving channel 17 facing the first opening 112 or the second opening 113, and the other side opening facing the middle back plate 121, so as to allow the component module to move along the moving channel 17. That is to say, the component module that can be detachably connected to the middle back plate 121 can be moved through the moving channel 17. At the same time, the moving channel 17 can limit the position of the component module. In the process of the component module extending into the accommodating cavity 111, the connector on the surface of the component module can correspond to the connector provided on the middle back plate 121, and / or the connector of the first module and the second module can correspond to the transfer connector 14, and / or the liquid cooling related connector of the component module can correspond to the second pipeline connector 162. It can reduce the tedious work of manually aligning the connector and the connector, which is conducive to reducing the difficulty of production and assembly, blindly inserting the component module into the server chassis 10, omitting the process of interconnection and assembly between the component modules, and significantly improving the production and processing efficiency.

[0093] The specific structure of the server of the present application is described below by way of example, and the internal power supply transmission path of the server, the management signal transmission path, etc. will be described in detail later.

[0094] Please continue to refer to Figures 2 to 4 In one embodiment, the server includes a component module and a server chassis 10 .

[0095] As described above by way of example, the component modules may include a heat dissipation module 40 , a graphics processor module 20 , a central processing unit module 30 and a power supply module 50 .

[0096] The server chassis 10 can be as described in any of the above embodiments, and will not be described in detail here. The following will be combined with the specific component modules of the server to describe the cooperation between each component module and the server chassis 10 structure and between the component modules.

[0097] Please refer to Figures 2 to 5 , Figure 5 It is a structural schematic diagram of an embodiment of the graphics processor module, central processing unit module, limiter and transfer connector of the present application.

[0098] In one embodiment, the position limiting assembly 12 as described above includes a position limiting member 122. In this embodiment, the graphics processor module 20 can be used as a first module, and the central processing unit module 30 can be used as a second module.

[0099] The GPU module 20 can be detachably connected to the relay connector 14 through a connector provided on its surface. The CPU module 30 can be detachably connected to the relay connector 14 through a connector provided on its surface. In this way, when the GPU module 20 and the CPU module 30 are both assembled on the relay connector 14, the interactive signals between the two can be transmitted via the relay connector 14.

[0100] In one embodiment, at least one component module includes a module housing, a module functional body, and a plurality of connectors. As the name implies, the module functional body is a component device that can realize the relevant functions of the component module. For example, the module functional body of the graphics processor module 20 is the graphics processor 21, the module functional body of the central processing unit module 30 is the central processing unit 31, and so on. The module functional bodies of other component modules will not be described in detail here.

[0101] The connecting piece is arranged on the surface of the module shell; the module functional body is arranged inside the module shell; the connecting piece is electrically connected to the module functional body and is also used for detachable connection with the connector arranged on the central backplane.

[0102] The data transmission related structure of the graphics processor module 20 of the present application is described below.

[0103] Please continue to refer to Figures 2 to 5 In one embodiment, the graphics processor module 20 may include a first housing, a graphics processor 21 and a first connection line 22 .

[0104] A first connector 201 is disposed on the surface of the first housing facing the intermediate connector 14. The first connector 201 is a connector for detachably connecting with the intermediate connector 14.

[0105] The graphics processor 21 and the first connection line 22 may be disposed inside the first housing. The first connection member 201 is connected to the graphics processor 21 via the first connection line 22 inside the first housing.

[0106] In this way, when the graphics processor module 20 is installed or removed, the first housing can be moved by force to achieve the movement of the graphics processor module 20, and the graphics processor 21, the first connecting wire 22 and the first connecting member 201 can move along with the movement of the first housing. In other words, when the first housing is moved by force, the first connecting member 201 moves in conjunction with the movement of the first housing, so the force on the first connecting wire 22 inside the first housing during the process of injecting and removing the graphics processor module 20 can be reduced, which is conducive to protecting the first connecting wire 22.

[0107] Optionally, the graphics processor module 20 may include a plurality of graphics processors 21. Figures 3 to 6 As shown in the example, Figure 6 It is a structural schematic diagram of an embodiment of a limit member, a transfer connector, a first connecting member and a second connecting member of the present application.

[0108] The graphics processor module 20 includes N GPU (Graphics Processing Unit, graphics processor 21) implementations, namely GPU_0, GPU_1, ..., GPU_N; accordingly, the number of transit connectors 14 can be N, namely C0, C1, ..., CN; the number of first connectors 201 provided on the surface of the first shell can be N, namely D0, D1, ..., DN.

[0109] In layman's terms, the GPU 21 leads out a signal cable, namely the first connection line 22, through the first connection member 201. One end of the first connection line 22 is connected to the first connection member 201, and the other end of the first connection line 22 is connected to the GPU 21, thereby achieving electrical connection between the GPU 21 and the first connection member 201.

[0110] like Figure 6The first connectors 201 such as D0, D1, ..., DN shown in the figure can be fixed on the first shell. When the graphics processor module 20 performs blind plugging and pulling and other actions, the first shell can be pulled or pushed, and the first connectors 201 such as D0, D1, ..., DN, the graphics processor 21, and the first connecting line 22 and other structures can be formed by the movement of the graphics processor module 20, so as to realize the assembly or separation of the first connectors 201 such as D0, D1, ..., DN and the transit connectors 14 such as C0, C1, ..., CN. In this process, the plugging and unplugging force required by the first connector 201 can be guaranteed by the first shell to which it is fixed. In this way, when assembling or disassembling the graphics processor module 20, the body of the first connecting line 22 can be free from the corresponding plugging and unplugging force, which is beneficial to protect the first connecting line 22 and reduce the loss of the first connecting line 22.

[0111] There are high-speed and low-speed signals interconnected between the graphics processor 21 and the central processing unit 31 to achieve high-speed communication and corresponding management functions. Therefore, the relevant structures of the central processing unit module 30 of the present application through the transfer connector 14 and the graphics processor module 20 are described here.

[0112] Please continue to refer to Figures 3 to 6 In one embodiment, the CPU module 30 is disposed on a side of the center back plate 121 facing the first opening 112 . As the name implies, the CPU module 30 may include a plurality of CPUs 31 .

[0113] The surface of the CPU module 30 facing the center back plate 121 is provided with a second connector 301, which is connected to the CPU 31 and is also detachably connected to the relay connector 14. In this way, when the GPU module 20 and the CPU module 30 are both connected to the relay connector 14, the CPU module 30 can be electrically connected to the GPU module 20 through the relay connector 14.

[0114] Further, as described above, the transit connector 14 may include a first connection portion 141 and a second connection portion 142, and the first connection portion 141 and the second connection portion 142 may be internally interconnected inside the transit connector 14 by means of pins or the like. The first direction is the relative direction of the first connection portion 141 and the second connection portion 142. In this embodiment, the first direction is parallel to the relative direction of the CPU module 30 and the GPU module 20, and the first direction is also perpendicular to the reference direction X. In other words, when the server is correctly placed, the relative direction of the GPU module 20 and the CPU module 30, and the relative direction of the first connection portion 141 and the second connection portion 142, may be parallel to the direction of gravity and perpendicular to the movable direction of the two. Among them, the movable directions of the GPU module 20 and the CPU module 30 are parallel to the reference direction X.

[0115] The connector of the first connection part 141 is detachably connected to the first connection member 201 of the graphics processor module 20, and the connector of the first connection part 141 is electrically connected to the graphics processor 21 through the first connection member 201. The connector of the second connection part 142 is detachably connected to the second connection member 301, and the connector of the second connection part 142 is electrically connected to the central processing unit 31 through the second connection member 301. This realizes blind insertion of the graphics processor module 20 and the central processing unit module 30 with the transfer connection part.

[0116] In this way, when disassembling one of the graphics processor module 20 and the central processing unit module 30, it can be achieved by separating it from the transit connector 14, which has little impact on the cable connection of the other one. When reinstalling the disassembled one, there is no need to distinguish and manually connect the specific connection correspondence, cable correspondence, etc. between the graphics processor module 20 and the central processing unit module 30, so as to achieve decoupling of the graphics processor module 20 and the central processing unit module 30, which can significantly reduce the burden of loading and unloading.

[0117] Alternatively, if Figure 6 As shown in the example, the second connector 301 may include F0, F1, ..., FN, which are respectively connected to the transfer connectors 14 such as C0, C1, ..., CN, so that the second connectors 301 such as F0, F1, ..., FN can be electrically connected to the first connectors 201 such as D0, D1, ..., DN, and then realize the electrical connection between the graphics processor 21 and the central processor 31. The second connectors 301 such as F0, F1, ..., FN can be relatively fixed with the central processor module 30, that is, they can be combined with or detached from the transfer connector 14 as the central processor module 30 is pulled out. Among them, the second connector 301 can be a blind plug high-speed connector, etc., to realize high-speed signal transmission between the graphics processor 21 and the central processor 31.

[0118] That is to say, the respective blind-plug connectors such as D0, D1, ..., DN and F0, F1, ..., FN between the graphics processor module 20 and the central processor module 30 are transferred through the limiter 122 relatively fixed to the server chassis 10 and the transfer connector 14, so that the high-speed cable between the graphics processor 21 and the central processor 31 is decoupled, and the blind-plug interconnection of the signals between the graphics processor 21 and the central processor 31 is realized. In this way, when performing relevant operation and maintenance, it is possible to operate and maintain the graphics processor module 20 and / or the central processor module 30 without opening the cover to manually plug and unplug the cables, which is conducive to releasing the coupling relationship between the upper and lower 4U cables of the server.

[0119] In view of this, in this embodiment, when the central processor 31 manages the graphics processor 21, the central processor 31 can output a graphics management signal. The graphics management signal is used to manage the working state of the graphics processor module 20. The graphics management signal is transmitted to the relay connector 14 via the first connector 201, and is transmitted to the second connector 301 via the relay connector 14, so as to be transmitted to the graphics processor module 20.

[0120] The power transmission related structure of the graphics processor module 20 of the present application is described below.

[0121] Please continue to refer to Figures 2 to 5 In one embodiment, the power connection assembly 13 may include a power connector 131 .

[0122] The power connector 131 is disposed on a side of the middle back plate 121 facing the first opening 112 , and the power connector 131 is electrically connected to the middle back plate 121 . The graphics processor module 20 is disposed on a side of the middle back plate 121 facing the first opening 112 .

[0123] A third connector is provided on the surface of the graphics processor module 20 facing the center back plate 121. The third connector is detachably connected to the power connector 131 provided on the center back plate 121. In this way, the power supply energy can be transmitted to the graphics processor module 20 via the center back plate 121, the power connector 131 and the third connector to supply power to the graphics processor module 20.

[0124] Furthermore, the graphics processor module 20 may include a graphics processor 21 and a power supply input component 23. The power supply input component 23 may be a busbar, etc., which is not limited here.

[0125] The third connection member is disposed on a side of the power input assembly 23 facing the middle back plate 121 .

[0126] The graphics processor 21 is disposed on a side of the power input component 23 away from the middle back plate 121 . The graphics processor 21 is electrically connected to the power input component 23 for receiving power input via the middle back plate 121 and the power input component 23 .

[0127] That is, the power supply energy is transmitted to the power supply connector 131 through the middle backplane 121, and the power supply connector 131 is connected to the third connection member, so that the power supply energy is transmitted from the power supply connector 131 to the third connection member, and then transmitted to the power supply input component 23 provided with the third connection member. The power supply input component 23 is connected to the graphics processor 21, so that the power supply energy can be transmitted to the graphics processor 21 via the power supply input component 23. In this way, in this embodiment, the power supply energy and the graphics management signal of the graphics processor module 20 can be transmitted through different transmission paths, so as to facilitate the performance of the graphics processor module 20.

[0128] Furthermore, the power input assembly 23 may include an abutting portion 231 and a main body portion 232 .

[0129] The third connecting member is disposed on the abutting portion 231. The side of the main body 232 away from the abutting portion 231 is connected to the graphics processor 21. This increases the contact area between the power input assembly 23 and the middle back plate 121, facilitates reliable connection between the graphics processor module 20 and the middle back plate 121, and also helps reduce the thickness of the main body 232.

[0130] The main body 232 is surrounded to form an escape groove 233 , and the limiting member 122 is disposed in the escape groove 233 .

[0131] The graphics processor module 20 further includes a first connecting member 201 detachably connected to the first connecting portion 141 of the intermediate connector 14 disposed on the limiting member 122 , and the third connecting member is also electrically connected to the graphics processor 21 .

[0132] In layman's terms, the power input component 23 may have a middle space, and the limiter 122 may be disposed in the middle space. The limiter 122 may be fixed relative to the server chassis 10, and when the graphics processor module 20 is moved, the limiter 122 may not move with the component modules such as the graphics processor module 20 and the central processing unit module 30. For example, when the graphics processor module 20 and / or the central processing unit module 30 are pulled out, the limiter 122 may maintain its original position, and even when the graphics processor module 20 drives the power input component 23 to move, the power input component 23 may not interfere with the fixed structures of the server chassis 10 such as the limiter 122 and the middle backplane 121, and thus the limiter 122 and the transit connector 14 disposed on the limiter 122 can be relatively fixed to the server chassis 10, and may not interfere with the movement of the component modules.

[0133] Optionally, the main body 232 may include a first side 2321 , a second side 2322 and a third side 2323 , and two ends of the second side 2322 are respectively connected to the first side 2321 and the third side 2323 to form an avoidance groove 233 .

[0134] The graphics processor 21 is disposed on the second side 2322. The first side 2321 and the third side 2323 are connected to the abutting portion 231 at a side away from the second side 2322, so as to rationalize the internal structure layout of the graphics processor module 20 and improve the structural compactness of the graphics processor module 20.

[0135] The heat dissipation related structure of the graphics processor module 20 of the present application is described below.

[0136] Please refer to Figure 3 , Figure 4 as well as Figure 7 , Figure 7 It is a structural schematic diagram of the liquid cooling related structure and an embodiment of the central backplane of the present application.

[0137] In one embodiment, the GPU module 20 further includes a cooling assembly 24 .

[0138] The cooling assembly 24 is disposed on the graphics processor 21 to dissipate heat from the graphics processor 21. When the graphics processor module 20 is moved, the graphics processor 21, the power input assembly 23 and the cooling assembly 24 are linked.

[0139] In this embodiment, considering that the power consumption of the graphics processor 21 is relatively high, an independent heat dissipation structure is used to dissipate heat for the graphics processor 21, such as a cold plate type, immersion type or other liquid cooling method.

[0140] Please continue to refer to Figure 3 , Figure 4 as well as Figure 7 In one embodiment, the cooling assembly 24 includes a liquid cooling connector 241, a cooling plate, and a liquid channel 242. The cooling assembly 24 can cooperate with the liquid pipeline and the heat dissipation connection assembly 16 described above to dissipate heat from the graphics processor module 20 by liquid cooling. The heat dissipation connection assembly 16 includes a first pipeline connector 161 and a second pipeline connector 162.

[0141] That is, in this embodiment, a cold plate liquid cooling method can be used to dissipate heat from the GPU 21, and a cold plate structure such as a cooling plate can be attached to the GPU 21 to absorb the heat transferred by the GPU 21, and the cooling liquid can be circulated to continuously dissipate heat. In other words, the cooling plate can abut against the GPU 21.

[0142] The liquid cooling connector 241 may be disposed on a surface of the GPU 21 facing the second pipe connector 162 .

[0143] The two ends of the liquid channel 242 are respectively connected to the liquid cooling connector 241 and the cooling plate, and the liquid cooling connector 241 is detachably connected to the second pipe connector 162 to allow the coolant to flow through the liquid pipe, the liquid channel 242 and the cooling plate. In other words, the coolant used for liquid cooling and heat dissipation flows to the cooling assembly 24 through the liquid cooling pipe 15 and the heat dissipation connection assembly 16, flows into the liquid channel 242 through the liquid cooling connector 241 and then flows to the cooling plate, absorbs the heat of the graphics processor 21 in the cooling plate, and carries the absorbed heat out of the cooling plate.

[0144] Further, the first pipeline connector 161 includes a first sub-channel 1611 and a second sub-channel 1612, and the second pipeline connector 162 includes a third sub-channel 1621 and a fourth sub-channel 1622. The liquid pipeline includes a first liquid inlet pipe 151 and a first liquid outlet pipe 152, and the liquid channel 242 includes a second liquid inlet pipe 2421 and a second liquid outlet pipe 2422.

[0145] The first sub-channel 1611, the first liquid inlet pipe 151, the third sub-channel 1621, and the second liquid inlet pipe 2421 are connected in sequence to enable the coolant to flow to the cooling component 24; the second sub-channel 1612, the first liquid outlet pipe 152, the fourth sub-channel 1622, and the second liquid outlet pipe 2422 are connected in sequence to discharge the coolant after absorbing heat.

[0146] Specifically, the coolant flows into the first liquid inlet pipe 151 through the first sub-channel 1611, and then flows through the third sub-channel 1621, the liquid cooling connector 241, and the second liquid inlet pipe 2421 in sequence, and then flows into the cooling plate to absorb the heat emitted by the graphics processor 21. The coolant after absorbing heat flows to the second liquid outlet pipe 2422, and then flows through the liquid cooling connector 241, the fourth sub-channel 1622, and the first liquid outlet pipe 152 in sequence, and then is discharged through the second sub-channel 1612. Among them, the liquid cooling connector 241 may include two channels, which are respectively used to circulate the coolant flowing to the cooling plate and the coolant after absorbing heat, which will not be repeated here.

[0147] Optionally, there may be multiple cooling plates, so the cooling assembly 24 may further include a liquid separator 243 (omitted and not shown in the figure). The liquid separator 243 may be a Manifold (water collector), etc., which is not limited here.

[0148] The liquid channel 242 is connected to the cooling plate through the liquid separator 243; the coolant flows into the liquid separator 243 through the liquid channel 242 and is distributed to each cooling plate to dissipate heat for the GPU 21. The liquid cooling connectors of each GPU 21 can be plugged into the liquid separator 243 for unified liquid separation.

[0149] Furthermore, the liquid separator 243 and the cooling plate can be connected by a conventional quick connector, that is, one end of the liquid channel 242 can be plugged into the liquid separator 243 by a conventional quick connector. The other end of the liquid channel 242 is connected to the liquid cooling connector 241, and the liquid cooling connector 241 can be a quick-release blind plug connector. The quick-release blind plug connector can be relatively fixed with the graphics processor module 20 to move together with the movement of the graphics processor module 20, and the installation force required for the blind plug quick connection can be provided by a fixed structure such as the first shell.

[0150] Please continue to refer to Figure 3 , Figure 4 as well as Figure 7 . In one embodiment, a liquid cooling positioning member 163 may be provided in the server chassis 10, and the liquid cooling positioning member 163 may remain relatively fixed with the server chassis 10, that is, the liquid cooling positioning member 163 may not move with the movement of the component module. The liquid cooling positioning member 163 faces the second pipe connector 162 on one side of the graphics processor module 20 to achieve blind plugging with the liquid cooling pipeline 15 related to the graphics processor module 20. In addition, as the graphics processor module 20 is pushed into the accommodating cavity 111 or pulled out from the accommodating cavity 111, the liquid cooling connector 241 relatively fixed to the graphics processor module 20 can be docked with or pulled out of the second pipe connector 162 to achieve blind plugging of the liquid cooling pipeline 15 of the graphics processor module 20.

[0151] Furthermore, the server chassis 10 may further include a chassis positioning member 164 disposed on the shell 11 of the server chassis 10, and the first pipe connector 161 is disposed on the chassis positioning member 164. In this way, the liquid cooling pipeline 15 may be fixedly connected between the liquid cooling positioning member 163 and the chassis positioning member 164, so as to lead the liquid channel 242 of the graphics processor module 20 out of the server chassis 10 through the liquid cooling pipeline 15. Furthermore, a quick-release blind plug connector may be provided on the side of the chassis positioning member 164 away from the accommodating cavity 111, leading out of the server chassis 10 to blindly plug and dock with the water distributor on the external cabinet, so as to realize cabinet-level liquid cooling blind plug.

[0152] Combined with Figures 8a to 8b As shown in the example, Figure 8a It is a structural schematic diagram of an embodiment of the assembly of the limit assembly, the transfer processor and the graphics processor module of the present application. Figure 8b yes Figure 8a The schematic diagram shown is a structural schematic diagram of an embodiment of separating the graphics processor module. The process of installing and removing the graphics processor module 20 is described below with examples.

[0153] Specifically, as described in the foregoing examples, the non-connector portion of the graphics processor module 20 may be subjected to force to drive the graphics processor module 20 to move, thereby achieving a detachable connection of the graphics processor module 20, namely, blind insertion.

[0154] The graphics processor module 20 can be inserted into the accommodating cavity 111 through the first opening 112 to install the graphics processor module 20. In this process, the non-connecting part of the graphics processor module 20 is subjected to thrust, and the first connecting part 201 connected to the transfer connector 14, the second connecting part 301 connected to the middle back plate 121, the first shell, the graphics processor 21, the first connecting line 22, the power input component 23, the cooling component 24, etc., are extended into the accommodating cavity 111 along with the thrust received by the graphics processor module 20.

[0155] In detail, under the action of thrust, the end of the power input component 23 perpendicular to the server chassis 10, i.e., the abutment portion 231, can be plugged into the central backplane 121 through a third connector such as a blind plug column connector, so as to obtain power from the central backplane 121 to supply the graphics processor 21, for example, the 12V (volt) power input from the power module 50 can be obtained. At the same time, the liquid cooling connector 241 of the cooling component 24 moves with the graphics processor module 20 and docks with the second pipe connector 162 to achieve connectivity of the liquid cooling passage. The first connector 201 of the graphics processor module 20 is plugged into the transfer connector 14 located at the limiter 122 of the server chassis 10 as the graphics processor module 20 moves. In this way, full blind insertion of power supply, liquid cooling, and signals of the graphics processor module 20 can be achieved.

[0156] The GPU module 20 can be pulled out of the accommodating chamber 111 through the first opening 112 to disassemble the GPU module 20. In this process, the non-connecting parts of the GPU module 20 are subjected to a thrust, and the first connecting part 201 connected to the transfer connector 14, the second connecting part 301 connected to the middle back plate 121, the first shell, the GPU 21, the first connecting line 22, the power input component 23, the cooling component 24, etc. are pulled out of the accommodating chamber 111 along with the pulling force on the GPU module 20.

[0157] In detail, since the power input component 23 can be relatively fixed with other parts of the graphics processor module 20, the third connector such as a blind plug column connector can be disconnected from the central backplane 121 under the action of tension. At the same time, the liquid cooling connector 241 of the cooling component 24 is also subjected to the fixing force of the graphics processor module 20 and is disconnected from the second pipe connector 162 located in the server chassis 10. In addition, during this process, the liquid channel 242 of the graphics processor module 20 can remain in a state of not being directly subjected to tension to avoid the tension being concentrated on the liquid channel 242 such as the liquid cooling hose, thereby significantly reducing the risk of the liquid pipe channel being broken. The first connector 201 of the graphics processor module 20 can also be relatively fixed with the graphics processor module 20, so as the graphics processor module 20 moves, the first connector 201 can be disconnected from the transfer connector 14 installed on the limiter 122. Furthermore, since the power input assembly 23 forms the avoidance groove 233 through the structure, it can provide travel space for the limiter 122 and the transfer connector 14, and no interference will occur when the graphics processor module 20 is pulled out.

[0158] That is to say, a quick-release blind plug connector, i.e., a first pipe connector 161, may be provided on one side of the server chassis 10 close to the second opening 113. The first pipe connector 161 may be relatively fixed to the housing 11 by means of a chassis positioning member 164, and when the server chassis 10 is installed in a server cabinet, the first pipe connector 161 may correspond to a corresponding liquid cooling connector in the server mechanism. In this way, the server chassis 10 may be directly pushed into the server cabinet or unplugged from the server cabinet to achieve blind plugging of liquid cooling of the entire machine, thereby reducing the need for manual docking and installation of liquid cooling pipes during operation and maintenance, thereby improving the convenience of operation and maintenance. Among them, a number of server chassis 10 may be installed in the server cabinet.

[0159] It should be noted that the descriptions of being able to remain relatively fixed, relatively fixed to, etc. in the present application mean that the component module can remain relatively fixed during the movement process, and when the component module has been taken out of the accommodating cavity 111, the relevant components can be disassembled, etc., which is not limited here.

[0160] The relevant structure of the CPU module 30 of the present application is described in detail below.

[0161] Please continue to refer to Figure 3 as well as Figure 4 In one embodiment, the CPU module 30 includes a second housing, a CPU 31 and a second connection line 32 .

[0162] A second connecting member 301 is provided on a surface of the second shell facing the relay connector 14 , and is used for detachable connection with the relay connector 14 .

[0163] The central processing unit 31 is arranged inside the second shell. The second connecting member 301 is connected to the central processing unit 31 through the second connecting line 32 of the second shell. When the central processing unit module 30 is moved, the central processing unit 31, the second connecting line 32 and the second connecting member 301 move with the movement of the second shell. In other words, the central processing unit 31, the second connecting line 32, the second connecting member 301 and the second shell can be pulled out as a whole from the first opening 112 to facilitate the replacement of the central processing unit 31, memory sticks and other components in the lower layer. Optionally, the central processing unit 31 can be a CPU, etc., and the central processing unit 31 described in the present application can also carry a motherboard of the CPU, etc., which is not strictly limited here.

[0164] In layman's terms, one end of the second connection line 32 can be plugged into the central processor 31, and the other end of the second connection line 32 can be connected to a blind-plug high-speed signal connector, namely, the second connection member 301. Figure 6 The F0, F1, ..., FN shown in the example can be relatively fixed to the surface of the second housing. When the CPU module 30 performs blind plugging and pulling and other plugging and unplugging actions, the second connector 301 can be formed by synchronously executing the movement with the CPU module 30, and assembled or separated with the transfer connectors 14 such as C0, C1, ..., CN, and then connected or disconnected with the graphics processor module 20 through the transfer of the transfer connector 14.

[0165] Of course, the CPU module 30 may also include other structures, such as a tray, a storage component 60, a network card, and other structural parts. The storage component 60 may include a storage component 61 and a storage backplane, and the storage component 61 may be a NVMe (Non Volatile Memory Host Controller Interface Specification) hard disk.

[0166] Thus, the storage component 60, the network card and the corresponding structure interconnected with the central processor 31, together with the second housing, the central processor 31, the second connecting wire 32, the second connecting member 301 and the fifth connecting member 302, constitute the central processor module 30. The second connecting wire 32 is an internal cable of the central processor module 30. During the blind insertion process of the central processor module 30, the central processor module 30 is inserted or removed as a whole, and the internal cables such as the second connecting wire 32 will not affect the insertion and removal of the entire central processor module 30.

[0167] The heat dissipation related structure of the CPU module 30 of the present application is described in detail below.

[0168] Please refer to Figure 3 , Figure 4 as well as Fig. 9 , Fig. 9 This is a schematic diagram of the structure of a fan power supply assembly and a central processing unit of an embodiment of the present application. It should be noted that: Fig. 9 The figure only shows, by way of example, the docking structure for transmitting power and signals between the central processing unit 31 and a part of the structure of the heat dissipation module 40 (i.e., the fan power supply assembly 42), and other structures are omitted, which does not mean that the central processing unit module 30 and the heat dissipation module 40 only include the structures shown in the figure.

[0169] In one embodiment, the heat dissipation module 40 is disposed on a side of the CPU module 30 facing the second opening 113 , so that the heat dissipation module 40 is used to dissipate heat from the CPU module 30 .

[0170] It can be seen that in the present application, the heat dissipation module 40 and the cooling assembly 24 can be used to dissipate heat for the CPU module 30 and the GPU module 20 respectively.

[0171] Optionally, in this embodiment, the heat dissipation module 40 can dissipate heat for the CPU module 30 through a physical structure such as a heat dissipation fan 41. In this embodiment, the design is based on the consideration that the heat dissipation power consumption of the CPU module 30 is less than that of the GPU module 20, so the heat dissipation methods adopted by the two are designed separately to reasonably allocate the heat dissipation capacity while ensuring the heat dissipation effect. In addition, in this embodiment, the server chassis 10 can also be designed to have only one set of liquid cooling interfaces to the outside. If the CPU module 30 also adopts the liquid cooling heat dissipation method, the CPU module 30 and the GPU module 20 will be connected in parallel. There may be a problem that the liquid cooling pipeline 15 is coupled and cannot be decoupled between the two component modules, which leads to the inability to achieve blind insertion of all component modules. Therefore, in this embodiment, the heat dissipation of the CPU module 30 adopts air cooling, and the heat dissipation fan 41 can be used to dissipate the heat from the direction of the second opening 113, which can also reduce the heat dissipation complexity of the CPU module 30.

[0172] The power supply transmission related structure of the CPU module 30 of the present application is described in detail below.

[0173] Please refer to Figure 3 , Figure 4 , Fig. 9 as well as Fig.10 , Fig.10 It is a structural schematic diagram of an embodiment of the heat dissipation module of the present application.

[0174] In one embodiment, a fourth connector 401 may be provided on a surface of the heat dissipation module 40 facing the CPU module 30 . A fifth connector 302 may be provided on a surface of the CPU module 30 facing the heat dissipation module 40 .

[0175] The fourth connector 401 and the fifth connector 302 are detachably connected so that the CPU module 30 and the heat dissipation module 40 can interact with each other through the fourth connector 401 and the fifth connector 302. The specific contents of signal transmission and power transmission will be described in detail later and will not be repeated here.

[0176] Furthermore, the heat dissipation module 40 may be electrically connected to the power module 50 , so that the heat dissipation module 40 can be used to receive the power supply energy output by the power module 50 .

[0177] In layman's terms, a fifth connector 302 may be provided on a side surface of the CPU module 30 facing the second opening 113, and a fourth connector 401 may be provided on a side surface of the heat dissipation module 40 facing the CPU module 30, and the fourth connector 401 corresponds to the position of the fifth connector. Therefore, the CPU module 30 and the heat dissipation module 40 may be plugged in along the reference direction X, that is, the fourth connector 401 and the fifth connector 302 may be plugged in and out along the moving direction of the two. In this way, when the fourth connector 401 is connected to the fifth connector 302, part of the power supply energy is input to the CPU module 30 through the fourth connector 401 and the fifth connector 302, and is used to supply power to the CPU module 30, that is, the power supply module 50 can provide power supply energy such as 12V power supply to the CPU 31 via the heat dissipation module 40 to drive the CPU 31 to work.

[0178] The fourth connector 401 can be relatively fixed to the heat dissipation module 40 through the structural frame of the heat dissipation module 40, so as to achieve the plugging and unplugging of the fourth connector 401 as the heat dissipation module 40 moves. Optionally, the fourth connector 401 includes a first quick connector. The fifth connector 302 includes a second quick connector, both of which can be blind plug connectors.

[0179] One of the fourth connector 401 and the fifth connector 302 further includes a guide member 43, and the other further includes a guide groove (omitted and not shown in the figure). The number of the guide member 43 and the guide groove can be one or more. When the number of the guide members 43 is multiple, they can be arranged on both sides or more sides of the blind plug connector.

[0180] When the first quick connector is connected to the second quick connector, the guide member 43 extends into the guide groove, which is conducive to the reliable connection between the fourth connector 401 and the fifth connector 302. While relatively fixing the fourth connector 401 or the fifth connector 302, it can also play a role in blind plugging guidance, thereby helping to reduce the risk of deviation between the heat dissipation module 40 and the central processing unit module 30 during the plug-in process. Fig.10 As shown in the example, the guide member 43 can be arranged on the fourth connecting member 401.

[0181] In addition, there may also be a guiding structure between other connectors and connecting parts in the present application, which will not be described in detail here.

[0182] In detail, when the CPU module 30 is assembled independently, the CPU module 30 can be pushed into the accommodating cavity 111 along the reference direction X. During the movement of the CPU module 30 , the second connector 301 corresponds to the second connector 142 of the transfer connector 14 , and the fifth connector 302 corresponds to the fourth connector 401 of the heat dissipation module 40 . When the second connector 301 abuts against the second connector 142 and the fifth connector 302 abuts against the fourth connector 401, the CPU module 30 is further pushed, so that the second connector 301 can be installed with the second connector 142 and the fifth connector 302 can be installed with the fourth connector 401, so that the CPU module 30 can be assembled with the intermediate connector 14 and the heat dissipation module 40, so that the CPU module 30 can interact with the graphics processor module 20 through the intermediate connector 14, and can also interact with the heat dissipation module 40, and can also interact with the power module 50 through the heat dissipation module 40 and the middle back plate 121. Similarly, when the CPU module 30 is disassembled, the CPU module 30 can be subjected to a force in the direction of the first opening 112 to remove the CPU module 30. In this process, the second connector 301 can be separated from the second connector 142, and the fifth connector 302 can be separated from the fourth connector 401.

[0183] In the present application, a heat dissipation module 40 and a power module 50 may be provided on one side of the accommodating cavity 111 relatively close to the second opening 113. Taking an 8U server as an example, when the server is properly placed, the power module 50 and the heat dissipation module 40 may occupy the upper and lower 4U spaces respectively. As the name implies, the power module 50 can provide power supply and can provide power for the entire server.

[0184] The relevant structure of the heat dissipation module of the present application is described in detail below.

[0185] Please refer to Figure 3 , Figure 4 , Fig.10 as well as Fig.11 , Fig.11 It is a structural schematic diagram of an embodiment of the heat dissipation module and the central backplane of the present application.

[0186] In one embodiment, the heat dissipation module 40 includes a heat dissipation fan 41 , a fan power supply assembly 42 and a sixth connecting member 402 .

[0187] The cooling fan 41 is disposed on the side of the fan power assembly 42 facing the second opening 113, and the cooling fan 41 is detachably connected to the fan power assembly 42. The fan power assembly 42 is provided with a fourth connector 401, that is, the fourth connector 401 for connecting with the central processing unit module 30 is disposed on the fan power assembly 42, and the cooling module 40 is interconnected with the central processing unit module 30 through the fan power assembly 42.

[0188] Specifically, the sixth connector 402 is disposed on the surface of the heat dissipation module 40 facing the central back plate 121 ; the sixth connector 402 is electrically connected to the fourth connector 401 , and the sixth connector 402 is also electrically connected to the power module 50 .

[0189] In layman's terms, the cooling fan 41 can be arranged on one side of the cooling module 40 close to the second opening 113, and the cooling fan 41 can be plugged into the fan power supply assembly 42. Optionally, the cooling fan 41 and the fan power supply assembly 42 can support blind plugging, so that the cooling fan 41 can be plugged and unplugged separately, and the cooling fan 41 can be operated and maintained separately.

[0190] Furthermore, the power supply connection assembly 13 further includes a heat dissipation connector 132 . The heat dissipation connector 132 is disposed on a side of the central back plate 121 facing the second opening 113 .

[0191] The heat dissipation connector 132 is detachably connected to the sixth connection member 402 .

[0192] The central backplane 121 is also electrically connected to the power module 50 , and the power supply energy output by the power module 50 is transmitted to the heat dissipation module 40 through the central backplane 121 , the heat dissipation connector 132 and the sixth connecting member 402 .

[0193] That is to say, the cooling fan 41, the fan power supply assembly 42 and other structural parts together constitute the cooling module 40, so that when the cooling module 40 is loaded and unloaded, the cooling fan 41, the fan power supply assembly 42, the fourth connecting member 401 and the sixth connecting member 402, etc., can move along with the movement of the frame-type mechanical structure of the cooling module 40, thereby realizing the overall loading and unloading of the cooling module 40.

[0194] In detail, Fig.11As shown in the example, the heat dissipation module 40 can support blind plugging between the heat dissipation module 40 and the central processing unit module 30 along the reference direction X, thereby realizing blind plugging of the heat dissipation module 40 as a whole, thereby reducing the difficulty of manually docking cables, interfaces, etc. during assembly, and improving the loading and unloading efficiency of the heat dissipation module 40.

[0195] A sixth connector 402 is also provided on the side surface of the heat dissipation module 40 facing the center backplane 121 and relatively close to the power module 50. The sixth connector 402 can support the transmission of power supply and management signals. The specific transmission path will be described by example later and will not be repeated here. The sixth connector 402 is connected to the fan power supply assembly 42 through structures such as cables, plug connector structures, pins, etc. The sixth connector 402 is also connected to the heat dissipation connector 132 provided on the center backplane 121 and electrically connected to the center backplane 121 to realize the power supply and signal path between the central processor 31, the fan power supply assembly 42 and the center backplane 121.

[0196] The sixth connector 402 can be relatively fixed to the mechanical structure of the heat dissipation module 40 to be relatively fixed to the heat dissipation module 40. Optionally, the sixth connector 402 can also be provided with a guide structure to assist in blind insertion guidance between the sixth connector 402 and the heat dissipation connector 132.

[0197] The relevant structure of the power module of the present application is described in detail below.

[0198] Please refer to Figure 3 as well as Figure 4 In one embodiment, the power module 50 is disposed on a side of the central back plate 121 facing the second opening 113. The power module 50 is provided with a seventh connector (omitted and not shown in the figure). Optionally, the power module 50 may include a plurality of PSUs, which is not limited here.

[0199] The power connection assembly 13 also includes a power connector, which is disposed on a side of the middle back plate 121 facing the second opening 113. The seventh connector is detachably connected to the power connector, thereby realizing blind insertion of the power module 50, and when the power module 50 is plugged into the power connector of the middle back plate 121, the power module 50 can provide power to other component modules through the middle back plate 121.

[0200] The following is an illustrative example of the internal power supply transmission path of the server of this application, some management signal transmission paths, etc.

[0201] Please refer to Figure 3 , Figure 4 as well as Figure 12a-Figure 12c , Fig.12a This is a flow chart of an embodiment of transmitting power supply energy in the present application. Figure 12bis a flow chart of an embodiment of transmitting a heat dissipation management signal of the present application, Fig.12c It is a flowchart of an embodiment of transmitting a power management signal of the present application.

[0202] In one embodiment, the middle backplane 121 can be relatively fixed to the shell 11 of the server chassis 10, so the middle backplane 121 can be used as a reference for the entire server system. The graphics processor module 20, the heat dissipation module 40 and the power supply module 50 can be blindly plugged with it to transmit power supply energy and management signals. The central processing unit module 30 can indirectly draw power from the middle backplane 121 through the fan power supply component 42 of the heat dissipation module 40, and can transmit management signals to the fan power supply component 42 and the middle backplane 121.

[0203] Specifically, Figure 3 , Figure 4 as well as Fig.12a As shown in the example, the power module 50 outputs power supply energy to the central backplane 121, and part of the power supply energy is transmitted to the graphics processor module 20 via the central backplane 121; part of the power supply energy is transmitted to the heat dissipation module 40 via the central backplane 121, and the heat dissipation module 40 transmits part of the received power supply energy to the central processing unit module 30.

[0204] For example, the power module 50 can input 12V power as power supply energy to the middle backplane 121 through the seventh connector and the power connector, and after the shunting of the middle backplane 121, the power supply energy is transmitted to the graphics processor module 20 and the heat dissipation module 40 through the power connector 131 and the heat dissipation connector 132 provided on the middle backplane 121. That is, the power supply energy can be transmitted to the power input component 23 through the power connector 131 to supply power to the graphics processor module 20. The power supply energy can also be transmitted to the fan power supply component 42 through the heat dissipation connector 132, so that the power supply energy is transmitted to the heat dissipation fan 41 through the fan power supply component 42. The power supply energy can also be transmitted to the central processing unit module 30 through the fourth connector 401 of the fan power supply component 42 and the fifth connector 302 of the central processing unit module 30 to supply power to the central processing unit 31 and other components.

[0205] The management path of the whole machine can be considered to start from the central processor 31, and the central processor 31 can output management signals to manage other component modules. Among them, the management signal can include at least one of the graphics management signal, heat dissipation management signal, and power management signal as described above. The transmission path of the graphics management signal has been described above and will not be repeated here.

[0206] like Figure 3 , Figure 4 as well as Figure 12bAs shown in the example, the CPU 31 of the CPU module 30 outputs a heat dissipation management signal, and the heat dissipation management signal is used to manage the working state of the heat dissipation module 40. The heat dissipation management signal is transmitted to the heat dissipation module 40 via the fifth connector 302 and the fourth connector 401. In layman's terms, the heat dissipation management signal output by the CPU 31 can be transmitted to the fan power supply component 42 via the fifth connector 302 and the fourth connector 401, which are detachably connected to the CPU 31 and the fan power supply component 42, so as to manage and control the heat dissipation fan 41.

[0207] like Figure 3 , Figure 4 as well as Fig.12c As shown in the example, the CPU module 30 is electrically connected to the heat dissipation module 40, and the heat dissipation module 40 is electrically connected to the middle backplane 121. The CPU 31 of the CPU module 30 outputs a power management signal, which is transmitted to the middle backplane 121 via the heat dissipation module 40, and is transmitted to the power module 50 via the power connector and the seventh connection member, so as to manage the working state of the power module 50 through the power management signal.

[0208] For example, the power management signal output by the central processor 31 can be transmitted to the fan power component 42 through the connected fifth connector 302 and the fourth connector 401. As described above, the fan power component 42 can be connected to the heat dissipation connector 132 provided on the middle backplane 121 through the sixth connector 402, so the power management signal can be transmitted to the middle backplane 121 through the sixth connector 402 and the heat dissipation connector 132. The middle backplane 121 is connected to the seventh connector of the power module 50 through the power connector provided thereon, so the power management signal can be finally transmitted to the power module 50 through the power connector and the seventh connector, so that the central processor 31 can manage and control the power module 50.

[0209] In summary, in this application, a server chassis and a server are provided to solve the problems of complex internal structure design of large AI servers such as 8U, close coupling between each component module, and difficulty in shelf maintenance, so the server can only be transported to a special maintenance center for disassembly maintenance. The server architecture has been redesigned for the server chassis and server in this application, so that each component module can be independently maintained. In addition, each component module can be blindly plugged in, which is conducive to the maintenance of the server chassis without taking it off the shelf, significantly improving the simplicity of server operation and maintenance, and effectively reducing the cumbersome steps of transporting the server to the maintenance center for opening the cover and disassembly operation and maintenance. At the same time, during the production and assembly process, each component module can be assembled separately, and then blindly inserted into the server chassis to complete the installation of the component module, which can omit the cumbersome assembly process of interconnection and assembly between the component modules, and can also significantly reduce the difficulty of server production and assembly, and effectively improve production and processing efficiency.

[0210] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0211] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application.

Claims

1. A server chassis, characterized in that: The server chassis comprises: The housing comprises a housing cavity, wherein the housing cavity comprises a first opening and a second opening for passing a component module of the server; A limiting assembly, comprising a central back plate, wherein the central back plate is arranged in the accommodating cavity; A power supply connection assembly, comprising a plurality of connectors disposed on the middle backplane, the connector disposed on the middle backplane facing the first opening or the second opening, and used for being detachably connected to a connection piece disposed on a surface of a component module; when the connector and the connection piece are assembled, the two are electrically connected; and signal transmission between the component modules connected to the middle backplane is realized via the middle backplane; The detachable connection means that when the non-connector part of the component module is subjected to a force in a reference direction, the component module moves relative to the central backplane, so that the connector of the component module and the connector corresponding thereto are coaxially assembled or separated without distinguishing the positive and negative directions, up and down, left and right positions of the connector and the connector; the reference direction is parallel to the relative direction of the first opening and the second opening; The transfer connector comprises a first connection portion and a second connection portion, wherein the relative direction of the first connection portion and the second connection portion is perpendicular to the reference direction; The component module includes a first module and a second module, which are movably arranged on a side of the transfer connector away from the central backplane, and the relative direction of the two modules is perpendicular to the reference direction, and the movable direction is parallel to the reference direction; The first connection portion is used for detachably connecting with the first module, and the second connection portion is used for detachably connecting with the second module; When both the first module and the second module are connected to the transfer connector, the first module is electrically connected to the second module via the transfer connector, and the transfer connector transfers the signal between the first module and the second module.

2. The server chassis according to claim 1, characterized in that: The limiting assembly further includes a limiting member, and the limiting member is arranged on a side of the middle back plate facing the first opening; The transfer connector is arranged on a side of the limiting member facing the first opening; The first connection portion is used to be detachably connected to a connection piece on a side surface of the first module facing it; the second connection portion is used to be detachably connected to a connection piece on a side surface of the second module facing it; The first module and the second module are movably disposed on a side of the transfer connector facing the first opening.

3. The server chassis according to claim 1, characterized in that: The server chassis also includes an in-chassis heat dissipation component and a heat dissipation connection component, both of which are arranged in the accommodating cavity; The heat dissipation component in the box is connected to the heat dissipation connection component, and the heat dissipation connection component is used to connect with the component module to be cooled, so that the heat dissipation component in the box is detachably connected to the component module to be cooled through the heat dissipation connection component.

4. The server chassis according to claim 3, characterized in that: The heat dissipation assembly in the box includes a liquid pipeline; The heat dissipation connection assembly includes a first pipeline connector and a second pipeline connector provided at both ends of the liquid pipeline; Wherein, the first pipeline connector is arranged on the shell body for connecting with an external liquid source; the second pipeline connector is arranged on the accommodating cavity for detachably connecting with the liquid channel constituting the module.

5. The server chassis according to claim 4, characterized in that: At least one connector of the power connection assembly comprises a blind-mate connector; and / or, At least one pipe connector in the heat dissipation connection assembly comprises a quick-release blind plug connector; and / or, The server chassis also includes a transfer connector for connecting to the first module and the second module of the server respectively to transfer the electrical signal between the two; the transfer connector includes a blind plug connector.

6. The server chassis according to claim 1, characterized in that: The server chassis also includes a moving channel, which is arranged in the accommodating cavity, with one side opening of the moving channel facing the first opening or the second opening, and the other side opening facing the central backplane, for allowing the component modules to move along the moving channel.

7. A server, characterized in that: The server comprises: The module consists of a heat dissipation module, a graphics processor module, a central processing unit module, and a power supply module; A server chassis, wherein the component module is arranged in the server chassis; the server chassis comprises a shell, a limit assembly and a power supply connection assembly; The housing includes a receiving cavity, wherein the receiving cavity includes a first opening and a second opening for passing a component module of the server; The limiting assembly includes a central back plate, and the central back plate is arranged in the accommodating cavity; The power supply connection assembly includes a plurality of connectors disposed on the middle backplane, the connector disposed on the middle backplane faces the first opening or the second opening, and is used to be detachably connected to a connection piece disposed on the surface of a component module; when the connector and the connection piece are assembled, the two are electrically connected; and the component modules connected to the middle backplane realize signal transmission between each other via the middle backplane; The detachable connection means that when the non-connector part of the component module is subjected to a force in a reference direction, the component module moves relative to the central backplane, so that the connector of the component module and the connector corresponding thereto are coaxially assembled or separated without distinguishing the positive and negative directions, up and down, left and right positions of the connector and the connector; the reference direction is parallel to the relative direction of the first opening and the second opening; The limiting assembly includes a limiting member, which is arranged on a side of the central back plate facing the first opening; a transfer connector is arranged on a side of the limiting member facing the first opening; The graphics processor module and the central processing unit module are arranged on one side of the transfer connector facing the first opening, and the relative direction of the two is perpendicular to the reference direction. The graphics processor module and the central processing unit module are detachably connected to the transfer connector through connecting pieces, and the interactive signal between the graphics processor module and the central processing unit module is transmitted via the transfer connector; The transfer connector includes a first connection portion and a second connection portion, the relative direction of the first connection portion and the second connection portion are perpendicular to the reference direction, and are detachably connected to the graphics processor module and the central processing unit module respectively.

8. The server according to claim 7, characterized in that: At least one of the component modules comprises: a module housing, a module functional body and a plurality of connecting parts; The connecting piece is arranged on the surface of the module shell; the module functional body is arranged inside the module shell; the connecting piece is electrically connected to the module functional body, and is also used for detachable connection with the connector arranged on the central backplane.

9. The server according to claim 8, characterized in that: The graphics processor module includes a first shell, and the graphics processor is arranged inside the first shell; A first connecting piece is provided on a surface of the first shell facing the transfer connector, and is used for detachably connecting with the transfer connector. The first connecting piece is connected to the graphics processor via a first connecting line in the first shell; When the graphics processor module is moved, the graphics processor, the first connecting line and the first connecting member move along with the first shell.

10. The server according to claim 8, characterized in that: The central processing unit module includes a second housing, and the central processing unit is arranged inside the second housing; A second connecting piece is provided on a surface of the second shell facing the transfer connector, which is used for detachable connection with the transfer connector and is connected to the central processing unit via a second connecting line in the second shell; When the central processing unit module is moved, the central processing unit, the second connecting line and the second connecting member move along with the second shell.

11. The server according to claim 7, characterized in that: The graphics processor module is arranged on a side of the central back plate facing the first opening; the power supply connection assembly includes a power supply connector, which is arranged on a side of the central back plate facing the first opening; A third connecting piece is provided on the surface of the graphics processor module facing the center back plate, and is detachably connected to a power supply connector provided on the center back plate.

12. The server according to claim 11, characterized in that The graphics processor module includes a graphics processor and a power input component; The third connecting member is arranged on a side of the power supply input component facing the middle back plate; The graphics processor is arranged on a side of the power supply input component away from the central backplane. The graphics processor is electrically connected to the power supply input component and is used to receive power supply energy input through the central backplane and the power supply input component.

13. The server according to claim 12, characterized in that: The power input assembly includes an abutment portion and a main body; the server chassis includes a limiter; The third connecting member is disposed on the abutting portion; a side of the main body away from the abutting portion is connected to the graphics processor; The main body is surrounded to form an avoidance groove, and the limiting member is arranged in the avoidance groove; The graphics processor module also includes a first connecting member that is detachably connected to a first connecting portion of a transfer connector disposed on the limiting member, and the third connecting member is also electrically connected to the graphics processor.

14. The server according to claim 12, characterized in that: The graphics processor module also includes a cooling assembly; The cooling component is arranged on the graphics processor and is used for dissipating heat from the graphics processor. When the graphics processor module is moved, the graphics processor, the power input component and the cooling component are linked.

15. The server according to claim 14, characterized in that: The server chassis includes a liquid pipeline and a first pipeline connector and a second pipeline connector provided at both ends of the liquid pipeline; the cooling assembly includes a liquid cooling connector, a plurality of cooling plates, a liquid channel and a liquid separator; The cooling plate abuts against the graphics processor; The liquid cooling connector is disposed on a surface of the graphics processor facing the second pipe connector; The two ends of the liquid channel are respectively connected to the liquid cooling connector and the cooling plate, and the liquid cooling connector is detachably connected to the second pipeline connector to allow the coolant to flow through the liquid pipeline, the liquid channel and the cooling plate; The liquid channel is connected to the cooling plate through the liquid separator; the coolant flows into the liquid separator through the liquid channel and is distributed to each of the cooling plates to dissipate heat from the graphics processor.

16. The server according to claim 7, characterized in that: The central processing unit module is arranged on one side of the central back plate facing the first opening; A second connecting piece is provided on the surface of the central processing unit module facing the center backplane. The second connecting piece is connected to the central processing unit and is also detachably connected to the transfer connector.

17. The server according to claim 16, characterized in that The first direction is parallel to the relative direction between the CPU module and the GPU module, and the first direction is also perpendicular to the reference direction; wherein the first direction is the relative direction between the first connecting portion and the second connecting portion; The connector of the first connection part is detachably connected to the first connection piece of the graphics processor module, and the connector of the first connection part is electrically connected to the graphics processor through the first connection piece; The connector of the second connecting part is detachably connected to the second connecting member, and the connector of the second connecting part is electrically connected to the central processing unit through the second connecting member.

18. The server according to claim 17, characterized in that: The central processing unit outputs a graphics management signal, and the graphics management signal is used to manage the working state of the graphics processing unit module; The graphics management signal is transmitted to the relay connector via the first connection member, and is transmitted to the second connection member via the relay connector, so as to be transmitted to the graphics processor module.

19. The server according to claim 16, characterized in that The heat dissipation module is arranged on a side of the CPU module facing the second opening; A fourth connector is provided on the surface of the heat dissipation module facing the central processing unit module, and a fifth connector is provided on the surface of the central processing unit module facing the heat dissipation module; the fourth connector and the fifth connector are detachably connected; so that the central processing unit module and the heat dissipation module can interact with each other through the fourth connector and the fifth connector.

20. The server according to claim 19, characterized in that The heat dissipation module is electrically connected to the power supply module and is used to receive the power supply energy output by the power supply module; When the fourth connection member is connected to the fifth connection member, part of the power supply energy is input to the central processing unit module through the fourth connection member and the fifth connection member to supply power to the central processing unit module.

21. The server according to claim 20, characterized in that The central processing unit of the central processing unit module outputs a heat dissipation management signal, and the heat dissipation management signal is used to manage the working state of the heat dissipation module; The heat dissipation management signal is transmitted to the heat dissipation module via the fifth connecting member and the fourth connecting member.

22. The server according to claim 7, characterized in that: The heat dissipation module includes a heat dissipation fan, a fan power supply component and a sixth connecting member; The heat dissipation fan is arranged on a side of the fan power supply assembly facing the second opening, and the heat dissipation fan is detachably connected to the fan power supply assembly; the fan power supply assembly is provided with a fourth connecting member; The sixth connecting member is arranged on the surface of the heat dissipation module facing the central back plate; the sixth connecting member is electrically connected to the fourth connecting member, and the sixth connecting member is also electrically connected to the power supply module.

23. The server according to claim 22, characterized in that The power supply connection assembly also includes a heat dissipation connector, which is arranged on a side of the central back plate facing the second opening; The heat dissipation connector is detachably connected to the sixth connecting member; The center backplane is also electrically connected to the power module, and the power supply energy output by the power module is transmitted to the heat dissipation module through the center backplane, the heat dissipation connector and the sixth connecting member.

24. The server according to claim 7, characterized in that The power module is arranged on one side of the central back plate facing the second opening; the power module is provided with a seventh connecting member; The power supply connection assembly also includes a power connector, which is arranged on a side of the central back plate facing the second opening; the seventh connecting member is detachably connected to the power connector.

25. The server according to claim 24, characterized in that The power module outputs power supply energy to the central backplane; Part of the power supply energy is transmitted to the graphics processor module via the central backplane; Part of the power supply energy is transmitted to the heat dissipation module via the central backplane, and the heat dissipation module transmits part of the received power supply energy to the central processing unit module.

26. The server according to claim 24, characterized in that The central processing unit module is electrically connected to the heat dissipation module, and the heat dissipation module is electrically connected to the middle backplane; The central processing unit of the central processing unit module outputs a power management signal; The power management signal is transmitted to the central backplane via the heat dissipation module, and is transmitted to the power module via the power connector and the seventh connecting member, so as to manage the working state of the power module through the power management signal.

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