Semiconductor water-blocking binding tape containing water-blocking powder and preparation device thereof

Abstract

The present invention discloses a semiconductive water-blocking binding tape containing water-blocking powder and a preparation device thereof, and specifically relates to the technical field of cable materials. The preparation equipment includes a raw material supply system, a coating system, a powdering system, and a drying and curing system. The coating system includes a coating frame, on which a base material roll, a coating head, and a support roller group are arranged. The conveying pipeline of the raw material supply system is connected to the coating head. The powdering system is used to apply a water-blocking filler to the base. The preparation device also includes a hair-smoothing component, which is used to form an airflow that penetrates the base on the base. The present invention can greatly reduce the problem of the protrusion of tiny villi structures affecting the quality of the coating layer, and the binding product prepared by the present invention has strong hygroscopicity, large expansion rate, reliable water-blocking effect, and low product resistance. It has good semiconductive properties. After being applied to the cable, it can effectively weaken the electric field strength, with low production cost and stable technical performance.

Description

Technical Field

[0001] The invention relates to the technical field of cable materials, and more specifically to a semiconductive water-blocking binding tape containing water-blocking powder and a preparation device thereof. Background Art

[0002] The invention relates to the technical field of cable materials, in particular to a device for preparing a semi-conductive water-tight binding tape for waterproof medium, high and extra-high voltage power cables and other control, communication, signal and instrument cables with shielding requirements.

[0003] In traditional cable waterproofing technology, the binding tapes used have problems such as insufficient waterproof performance, high material cost, and complex preparation process. The importance of semiconductor waterproof materials as protective layers in high-voltage cables urgently needs to be improved, especially in the actual production process of binding tapes. The key to determining their production quality is the coating process, which requires them to provide good coating quality assurance to ensure that the coating layer is fully coated, the coating layer thickness is uniform, and the coating layer adhesion is stable.

[0004] Among them, during the coating process, when the base is stored and loaded, the base continuously leaves the base material roll, and the inner and outer layers of the base are separated. The compressed fluff structure originally caused by the rolling and squeezing is pulled apart again, resulting in a tiny raised fluff structure on the surface of the base. When the coating layer is relatively thick during the coating process, the tiny fluff structure can be pressed down and covered to maintain the integrity of the coating layer. However, if the coating layer is relatively thin and the base material used itself has more and larger fluff structures, it is difficult for the coating layer to completely press down the fluff structure, which will affect the actual coating effect and reduce product quality. When the product is used in cables in the later stage, it will affect the actual protection effect of the cable and the cable quality cannot be effectively guaranteed. Summary of the invention

[0005] The present invention provides a semi-conductive water-blocking binding tape containing water-blocking powder and a preparation device thereof, and aims to solve the problem that the tiny fuzz structure on the substrate affects the actual coating effect and reduces the product quality, so that when the product is used in the cable in the later stage, it will affect the actual protection effect of the cable and cannot effectively guarantee the quality of the cable.

[0006] To achieve the above object, the present invention provides the following technical solutions: a preparation device for a semiconductor water-blocking binding tape containing water-blocking powder, comprising a raw material supply system, a coating system, a powder spreading system and a drying and curing system, wherein the raw material supply system is used to provide the coating raw material to the coating system, the coating system is used to coat the coating raw material to the surface of the substrate, and the drying and curing system is used to heat and dry the coated coating layer and accelerate the curing of the material;

[0007] The coating system includes a coating frame, on which a substrate roll, a coating head and a supporting roller group are arranged, a conveying pipeline of a raw material supply system is connected to the coating head, and a powder spreading system is used to apply a water-blocking filler to the substrate;

[0008] The preparation device further comprises a hair-smoothing component, which is used for forming an airflow penetrating the substrate on the substrate.

[0009] In a preferred embodiment, the smoothing component is arranged on a coating frame, and the smoothing component includes an exhaust hood. The two ends of the exhaust hood are fixedly connected to the coating frame through mounting plates, and an exhaust pipe is fixedly connected to the bottom of the exhaust hood. The exhaust pipe is connected to an exhaust device. The exhaust hood is located at the bottom of the substrate, and the exhaust hood is located at the position of the substrate before the coating process, and the opening of the exhaust hood is set corresponding to the substrate.

[0010] In a preferred embodiment, guide sealing plates are fixedly connected to both ends of the exhaust hood, and the guide sealing plates are in contact with the edge of the substrate. The guide sealing plates block both ends of the exhaust hood to form an air inlet opening at the top of the exhaust hood, and the guide sealing plates extend to the coating support roller and are provided with an arc-shaped groove structure that is compatible with the outer circumference of the coating support roller. The two groups of guide sealing plates and the exhaust hood form a group of roller-contacting openings outside the coating support roller.

[0011] In a preferred embodiment, a glue overflow area is provided on the side of the coating head away from the moving direction of the substrate, and when the coating head outputs the coating material, the excess coating material is accumulated in the glue overflow area.

[0012] In a preferred embodiment, the hair smoothing component also includes a blowing hood, which is arranged at a position above the base corresponding to the exhaust hood, the opening of the blowing hood is arranged corresponding to the base, the two ends of the blowing hood are fixedly connected to the mounting plate, and the blowing hood is provided with a blowing pipe, which is connected to the blowing equipment.

[0013] In a preferred embodiment, a heating structure is provided in the blowing hood, and the heating structure is formed by a plurality of groups of electric heating wires fixedly connected to the blowing hood, and the plurality of groups of electric heating wires are distributed in a mesh shape.

[0014] In a preferred embodiment, a microporous plate is arranged in the vacuum hood, the microporous plate is detachably connected to the vacuum hood, and the substrate is slidably fitted to the microporous plate.

[0015] A semi-conductive water-blocking binding tape containing water-blocking powder comprises a base and a coating layer, wherein the coating layer comprises two layers, and the two coating layers are respectively a first coating layer and a second coating layer;

[0016] The first coating layer and the second coating layer are respectively arranged on the front and back surfaces of the substrate, and the textile gaps of the substrate are filled with water-blocking fillers.

[0017] In a preferred embodiment, the substrate is polyester fabric, the water-blocking filler is water-blocking powder, and the water-blocking powder is semi-conductive resistive water-blocking powder.

[0018] In a preferred embodiment, the first coating layer is formed by coating a semiconductive adhesive on one surface of the substrate, and the second coating layer is formed by coating a semiconductive rubber water-blocking adhesive on the other surface of the substrate.

[0019] The beneficial effects of the present invention are as follows: the preparation equipment of the present invention can use the hair-smoothing component to draw air under the base, so that an airflow is formed in the base that passes through the base textile gap from top to bottom, thereby allowing the tiny hair structure on the textile material to enter the textile gap, and then before the base reaches the top of the coating support roller for coating, it can greatly reduce the problem of the tiny hair structure protruding and affecting the quality of the coating layer, thereby effectively ensuring the actual quality of the product and the protective effect of the product on the cable when it is used in the cable. The binding belt prepared by the present invention has strong hygroscopicity, large expansion rate, fast expansion rate, reliable water-blocking effect, low product resistance, and good semi-conductive performance. After being applied to the cable, it can effectively weaken the electric field strength and eliminate the local corona discharge phenomenon of the cable when it is in use. The product has high overall mechanical strength and good heat resistance, and the production process is simple, the production cost is low, the technical performance is stable, and the practicability is strong. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The present invention is a schematic diagram of the structural composition of a semiconductive water-blocking binding tape containing water-blocking powder.

[0021] Figure 2 The present invention is a flow chart of a method for preparing a semiconductive water-blocking binding tape containing water-blocking powder.

[0022] Figure 3 This is a system diagram for preparing the semiconductive water-blocking binding tape containing water-blocking powder of the present invention.

[0023] Figure 4 The present invention is a schematic structural diagram of a coating system and a drying and curing system used in preparing a semiconductive water-blocking binding tape containing water-blocking powder.

[0024] Figure 5 It is a schematic diagram of the overall structure of the coating system of the present invention.

[0025] Figure 6 It is a simplified view of the hair smoothing component of the present invention.

[0026] Figure 7 It is a schematic diagram of the state in which the fluff on the base textile material is blown into the textile gap under the action of the airflow of the present invention.

[0027] Figure 8The figure is a schematic diagram of the structure of the improved hair-smoothing component of the present invention.

[0028] Fig. 9 It is a schematic diagram of the installation of the mounting plate of the present invention.

[0029] Fig.10 It is a schematic diagram of the working state of the exhaust hood of the present invention.

[0030] Fig.11 It is a schematic diagram of the airflow effect at the opening of the pasting roller during the coating operation of the present invention.

[0031] Fig.12 It is a schematic diagram of the contact state between the edge of the substrate and the guide blocking plate of the present invention.

[0032] Fig.13 It is a schematic diagram of the cooperation of the guide sealing plate on the coating support roller of the present invention.

[0033] Fig.14 The schematic diagram of the structure after adding the blowing hood and the edge pulling assembly to the present invention.

[0034] Fig.15 The present invention is based on Fig.14 A magnified view of the middle pull edge assembly.

[0035] Fig.16 It is a top view of the edge pulling assembly of the present invention.

[0036] Fig.17 It is a schematic diagram of the inclined structure formed by the side pull assembly of the present invention cooperating with two sets of guide wheels.

[0037] The accompanying drawings are marked as follows: 1. substrate; 11. first coating layer; 12. second coating layer; 13. water-blocking filler; 2. raw material supply system; 3. coating system; 31. coating frame; 32. coating head; 321. glue overflow area; 33. support roller group; 331. guide roller; 332. coating support roller; 34. substrate roll; 35. winding roller; 4. drying and curing system; 5. powder spreading system; 6. hair smoothing component; 61. exhaust hood; 611. exhaust pipe; 612. roller opening; 613. microporous plate; 62. mounting plate; 63. guide sealing plate; 64. blowing hood; 641. blowing pipe; 642. heating structure; 7. edge pulling component; 71. flexible belt; 711. guide slot; 72. guide wheel; 721. guide convex ring; 73. needle. DETAILED DESCRIPTION

[0038] The present application is further described in detail below in conjunction with the accompanying drawings. It is necessary to point out here that the following specific implementation methods are only used to further illustrate the present application and cannot be understood as limiting the scope of protection of the present application. Technical personnel in this field can make some non-essential improvements and adjustments to the present application based on the above application content.

[0039] Example 1, see the attached specification Figure 1 A semiconductive water-blocking binding tape containing water-blocking powder includes a substrate 1 and a coating layer. The coating layer has two layers, namely a first coating layer 11 and a second coating layer 12. The first coating layer 11 and the second coating layer 12 are respectively arranged on the front and back surfaces of the substrate 1.

[0040] The base 1 is a polyester fabric (such as polyester cloth), and the textile gaps of the base 1 are filled with a water-blocking filler 13, which is a water-blocking powder. The water-blocking powder can be sprinkled on the polyester cloth and filled into the fabric gaps by vibration.

[0041] The first coating layer 11 is formed by coating a semi-conductive adhesive on one side of the substrate 1 , and the second coating layer 12 is formed by coating a semi-conductive rubber water-blocking adhesive on the other side of the substrate 1 .

[0042] The water-blocking powder is a semi-conductive water-blocking powder, for example, SAP (super) water-absorbent resin is used.

[0043] Among them, semi-conductive adhesive is a special adhesive material that not only has good bonding properties, but also has certain conductivity or semi-conductivity. This material is widely used in the electronics, electrical, automotive and other industries, especially in applications where bonding and conductivity functions need to be achieved simultaneously. The main components and characteristics are as follows:

[0044] Matrix resin: usually a polymer material such as epoxy resin, polyurethane, acrylic resin, etc., which provides bonding properties and mechanical strength.

[0045] Conductive fillers: Common conductive fillers include carbon black, metal powder (such as silver powder, copper powder), conductive polymers, etc. These fillers give the adhesive conductivity or semi-conductivity.

[0046] Plasticizer: Used to improve the flexibility and processing properties of adhesives.

[0047] Curing agent: Promotes the curing of the base resin and ensures that the adhesive can harden quickly during use.

[0048] Other additives: such as antioxidants, moisture-proofing agents, lubricants, etc., are used to improve the comprehensive properties of adhesives.

[0049] Semi-conductive rubber water-blocking adhesive is a special material that combines conductivity, rubber flexibility and waterproof properties. This adhesive is widely used in the electronics, electrical, communications and automotive industries, especially in situations where bonding, conductivity and waterproofing are required. Its main components and characteristics are as follows:

[0050] Base rubber: Common base rubbers include silicone rubber, nitrile rubber (NBR), chloroprene rubber (CR), butyl rubber, cross-linked semi-conductive polyacrylate, etc. These rubbers have good flexibility and weather resistance and can adapt to various environmental conditions.

[0051] Conductive fillers: Conductive fillers usually include carbon black, graphite, metal powder (such as silver powder, copper powder, etc.). These fillers can give the adhesive conductivity or semi-conductivity.

[0052] Waterproofing agent: Waterproofing agents such as silane coupling agents, hydrophobic silica, etc. can improve the waterproof performance of adhesives and prevent moisture intrusion.

[0053] Plasticizers: Plasticizers such as phthalates, phosphates, etc. are used to improve the flexibility and processing properties of adhesives.

[0054] Curing agent: Curing agents such as amines, anhydrides, etc. are used to promote the cross-linking reaction of the base rubber to ensure that the adhesive can harden quickly during use.

[0055] Other additives: such as antioxidants, moisture-proofing agents, lubricants, etc., are used to improve the comprehensive properties of adhesives.

[0056] Example 2, based on the semiconductive water-blocking adhesive tape containing water-blocking powder provided in Example 1, the present invention also provides a preparation process of the semiconductive water-blocking adhesive tape containing water-blocking powder, refer to the attached manual Figure 2 , including the following steps:

[0057] Step 1: Prepare a base 1. According to the product specifications, select polyester fabric to make a base 1 that meets the requirements;

[0058] Step 2: Clean the surface of the substrate 1 to remove debris, for example, by using an air blowing device to blow air, with the air blowing direction away from the output direction of the fabric substrate to reduce the possibility of impurities being blown to the gluing position;

[0059] Step 3: applying the first coating layer 11, coating the semi-conductive adhesive onto the substrate 1 through the coating system 3 (line speed 10-30 m / min), and then drying through the drying and curing system 4 (drying temperature 120-200° C.), to form the first coating layer 11;

[0060] Step 4: applying a water-blocking filler 13, applying a water-blocking filler 13 (i.e., water-blocking powder) to the substrate 1 obtained in step 3 through a powder spreading system 5, wherein the water-blocking filler 13 is applied from the uncoated side of the substrate 1, so that the water-blocking filler 13 is integrated into the textile gaps of the substrate 1 (a vibrating device may be used during application to drive the substrate to vibrate so that the water-blocking powder is better integrated into the textile gaps of the substrate);

[0061] Step 5: applying the second coating layer 12, coating the substrate 1 with a semi-conductive rubber water-blocking adhesive (line speed 10-30 m / min) through the coating system 3, and then drying it through a drying and curing system (drying temperature 120-200° C.) to form the second coating layer 12;

[0062] Step 6: Test the waterproof and high pressure resistance performance of the binding tape product.

[0063] It should be noted that the binding tape prepared by the present invention has strong hygroscopicity, large expansion ratio, fast expansion rate, reliable water-blocking effect, low product resistance and good semi-conductive performance because it is provided with a semi-conductive adhesive coating layer and a semi-conductive rubber water-blocking adhesive coating layer. After being applied to the cable, it can effectively weaken the electric field strength and eliminate the local corona discharge phenomenon of the cable when in use. Moreover, the product has high overall mechanical strength, good heat resistance, simple production process, stable technical performance and strong practicality.

[0064] Based on the above embodiment, the present invention also provides a preparation device for a semi-conductive water-blocking binding tape containing water-blocking powder, Figure 3 , mainly including a raw material supply system 2, a coating system 3, a powder spreading system 5 and a drying and curing system 4. The raw material supply system 2 is used to provide coating raw materials to the coating system 3. For example, based on the above steps three and five, the semi-conductive adhesive and the semi-conductive rubber water-blocking adhesive are provided to the coating system 3 through the raw material supply system 2 respectively; the coating system 3 is used to apply the above coating raw materials (semi-conductive adhesive or semi-conductive rubber water-blocking adhesive) to the surface of the substrate 1, and the drying and curing system 4 is used to heat and dry the coated coating layer and accelerate the curing of the material.

[0065] The raw material supply system 2 includes a coating raw material storage tank, a conveying pipeline (with its own heating), a conveying drive device and a flow control valve.

[0066] The coating system 3 includes a coating frame 31, on which a base material roll 34, a coating head 32 and a support roller group 33 are arranged. The conveying pipeline of the above-mentioned raw material supply system 2 is connected to the coating head 32 to provide coating raw materials to the coating head 32. The coating raw materials are driven by the conveying drive device to circulate and convey, so as to provide the coating raw materials (a pump can be used for pumping, or the height of the coating raw material storage tank can be increased, and the coating raw materials can be made to flow by gravity), so that the coating head 32 coats the corresponding material on the surface of the base, and then conveys it to the drying and curing system 4 for drying and heating to accelerate the curing of the material, and finally reels it.

[0067] The powder spreading system 5 is used to apply a water-blocking filler 13 (ie, water-blocking powder) onto the substrate, wherein a powder spreading machine may be used to spread the powder so that the water-blocking powder is integrated into the textile gaps of the substrate.

[0068] The preparation device of the present invention improves the production efficiency of the water-blocking binding tape, reduces the production cost, improves the waterproof and electrical properties of the product, and is conducive to ensuring the uniform coating of the water-blocking powder.

[0069] Example 3. In the above embodiment, for the production process of the semiconductive water-blocking binding tape of the water-blocking powder provided by the present invention, the key equipment that determines its production quality is the coating system 3, which is required to provide good quality assurance to ensure that the coating layer is fully coated, the coating layer thickness is uniform, and the coating layer adhesion is stable, etc. In the production of corresponding water-blocking binding tapes in the prior art, in order to ensure the product quality of the water-blocking binding tape, the thickness of the coating layer itself is relatively large, but the semiconductive water-blocking binding tape provided by the present invention itself has higher performance. Therefore, compared with ordinary water-blocking binding tapes, the thickness of the outer coating layer of the product of the present invention can be relatively thin.

[0070] The polyester fabric used in the base 1 forms a cloth with more fluff structures, which is inevitable for textiles. In the preparation process provided by the present invention, although the blowing device is used to effectively clean the surface of the base 1 and can remove most of the thread ends and other debris, some of the tiny fluff connected to the base 1 (directly connected to the textile itself) cannot be removed, especially when the base 1 is stored and loaded by the base material roll 34, during the loading process, the base 1 continuously leaves the base material roll 34, and the inner and outer layers of the base 1 are separated, which is originally due to the storage. The compressed fluff structure caused by the rolling and squeezing is then pulled apart, resulting in the appearance of tiny raised fluff structures on the surface of the base 1. When the coating layer is relatively thick during the coating process, the tiny fluff structure can be pressed down and formed into a cover, thereby maintaining the integrity of the coating layer. However, if the coating layer is relatively thin and the base 1 material used itself has more and larger fluff structures, it is difficult for the coating layer to completely press down the fluff structure, which will affect the actual coating effect and reduce product quality. When the product is used in the cable in the later stage, it will affect the actual protection effect of the cable and cannot effectively guarantee the quality of the cable.

[0071] To this end, the present invention also provides the following technical solutions, specifically, refer to the attached specification Figures 4 to 14The drying and curing system 4 is arranged at the output end of the coating system 3. The support roller group 33 includes a guide roller 331 and a coating support roller 332. The coating support roller 332 is located below the coating head 32 and cooperates with the coating head 32 to coat the surface of the substrate 1. The substrate 1 on the substrate roll 34 is guided and transported by the guide roller 331 and guided to the area between the coating support roller 332 and the coating head 32. The raw material supply system 2 provides the coating head 32 with the corresponding coating raw material and outputs it to the surface of the substrate 1. As the substrate 1 is transported, the coating operation is completed by the coating head 32. The coated substrate 1 is directly guided by the corresponding guide roller 331 and transported to the drying and curing system 4 for Heating and curing, wherein a smoothing component 6 is arranged on the side of the coating support roller 332 away from the coating conveying direction of the substrate 1, and the smoothing component 6 includes an exhaust hood 61, and both ends of the exhaust hood 61 are fixedly connected to the coating frame 31 through mounting plates 62, and an exhaust pipe 611 is fixedly connected to the bottom of the exhaust hood 61, and the exhaust pipe 611 is connected to an exhaust device (such as an exhaust pump). The exhaust hood 61 is located at the bottom of the substrate 1 and is located at the position of the substrate 1 before the coating process. The opening of the exhaust hood 61 is arranged corresponding to the substrate 1, and then during the processing, the exhaust hood 61 can exhaust air below the substrate 1, so that an airflow is formed in the substrate 1 from top to bottom through the textile gap of the substrate 1, refer to the attached manual Figure 6 and Figure 7 The airflow can cause the tiny fluff structure on the textile material to deform downward and enter into the textile gap, and then before the substrate 1 reaches the top of the coating support roller 332 for coating, it can greatly reduce the problem of the tiny fluff structure protruding and affecting the quality of the coating layer, thereby effectively ensuring the actual quality of the product and ensuring the protective effect of the product on the cable when used in the cable.

[0072] Furthermore, in the above embodiment, a winding roller 35 is also provided on the coating frame 31. The substrate 1 that is dried in the drying and curing system 4 after being coated by the coating head 32 is then led to the winding roller 35 for winding to facilitate subsequent operations. Through the above arrangement, the coated substrate 1 can form a double-layer structure in the drying and curing system 4, thereby improving the drying efficiency, reducing the equipment volume, and saving the space occupied by the equipment.

[0073] Further, in order to improve the effect of airflow passing through the substrate 1, refer to the attached Figures 8 to 13The two ends of the exhaust hood 61 are also fixedly connected with guide blocking plates 63, which fit the edge of the substrate 1. The guide blocking plates 63 block the two ends of the exhaust hood 61, so that an air inlet opening is formed on the top of the exhaust hood 61, thereby improving the efficiency of the air flow passing through the substrate 1 during exhaust. The guide blocking plates 63 extend to the coating support roller 332 and are provided with an arc-shaped groove structure that matches the outer circumference of the coating support roller 332, so that the guide blocking plates 63 can also be clamped on the coating support roller 332. When the rotation of the coating support roller 332 is affected, it can form a contact block with the two edges of the substrate 1, and at the same time, the exhaust hood 61 slides and fits with the coating support roller 332 on one side corresponding to the coating support roller 332, and the two groups of guide blocking plates 63 and the exhaust hood 61 form a group of roller openings 612 outside the coating support roller 332, and the roller openings 612 correspond to the triangular area formed between the substrate 1 and the coating support roller 332, thereby maximizing the ventilation area on the surface of the substrate 1 and extending the area to the coating point as much as possible, wherein , a glue overflow area 321 is provided on the side of the coating head 32 away from the moving direction of the substrate 1. When the coating head 32 outputs the coating material, the excess coating material is accumulated in the glue overflow area 321, that is, the glue overflow area 321 is used to accommodate the excess coating material, so that the coating material can form a pre-cover on the surface of the substrate 1, and the coating head 32 forms a scraper to ensure that the coating material can fully contact with the substrate 1. At the same time, the coating material accumulated in the glue overflow area 321 is close to the roller opening 612, and the vacuum hood 61 will also form a negative pressure in the triangular area formed between the coating support roller 332 and the substrate 1 due to the air flow during the vacuuming process. The negative pressure can cause the coating material accumulated above the triangular area to form a downward pressure, that is, increase the ability of the coating material to penetrate into the textile gap of the substrate 1, thereby increasing the bonding effect between the coating layer and the substrate 1, and improving the bonding strength of the coating layer. At the same time, it can also enhance the effect of the coating material penetrating to press down the tiny villi, and avoid the tiny villi structure from warping outward to the greatest extent to affect the quality of the coating layer.

[0074] It should be noted that in addition to limiting the exhaust space, the guide sealing plate 63 can also guide the substrate 1 to ensure that it passes through the coating area accurately. Under the restriction of the guide sealing plate 63, it can ensure that the coating material can fully contact the edge of the substrate 1 without overflowing, thereby improving the coating effect.

[0075] Further, in order to improve the processing efficiency of the above-mentioned micro-fluff, refer to the attached manual Fig.14, this embodiment also provides the following technical solutions. Specifically, the hair smoothing component 6 also includes a blowing hood 64, which is arranged at a position above the base 1 corresponding to the exhaust hood 61, and the opening of the blowing hood 64 is arranged corresponding to the base 1. The two ends of the blowing hood 64 are fixedly connected to the mounting plate 62, and the blowing hood 64 is provided with a blowing pipe 641, and the blowing pipe 641 is connected to a blowing device (such as a blowing pump). A heating structure 642 is provided in the blowing hood 64, and the heating structure 642 is formed by a plurality of groups of electric heating wires fixedly connected to the blowing hood 64, and the plurality of groups of electric heating wires are fixedly connected to the blowing hood 64. It is distributed in a mesh shape, and then cooperates with the suction of the exhaust hood 61 and the blowing of the blowing hood 64 to make the airflow passing through the base 1 stronger. At the same time, the heating of the air by the heating structure 642 can shape the fluff after it is deformed by blowing, avoiding subsequent warping, thereby improving the treatment effect of the fluff. At the same time, through the above-mentioned arrangement, the debris existing in the textile gap of the base 1 can also be blown away downwards, solving the problem that tiny debris attached to the textile gap of the base 1 is not easy to blow away during the above-mentioned cleaning process, further improving the cleanliness of the base 1, and further improving the product quality.

[0076] Based on the above embodiment, it is more suitable for applying the water-blocking filler 13 and performing the first coating on the substrate 1. In order to reduce the subsequent processing steps, this embodiment also provides the following technical solutions. For details, refer to the attached manual. Fig.14 A microporous plate 613 is provided in the exhaust hood 61, and the microporous plate 613 is detachably connected to the exhaust hood 61 (for example, installed with screws), and the substrate 1 and the microporous plate 613 are slidably fitted, thereby ensuring that a through-airflow can be formed in the substrate 1 while preventing the fluff at the lower part of the substrate 1 from deforming downward, thereby ensuring the flatness of the lower surface of the substrate 1. At the same time, if the substrate 1 is pre-filled with a water-blocking filler 13, then during the first coating, the water-blocking filler 13 will not be separated from the substrate 1 through the support and filtration of the microporous plate 613, thereby ensuring the stability of the processing. After the first coating, a first coating layer 11 has been formed on the surface of the substrate 1. During the second coating, when the material is separated from the material roll, since there is already a first coating layer 11 separating it, and the first coating layer 11 is relatively smooth relative to the substrate 1, the fluff will not be brought up when the two layers of material are separated from each other. Therefore, the above-mentioned hair-smoothing component 6 does not need to be used during the second coating.

[0077] Furthermore, in the above-mentioned embodiment, the guide blocking plate 63 not only has a limiting effect on the substrate 1, but also plays a role in blocking the roller opening 612. Among them, the material of part of the substrate 1 is relatively soft, thin as a whole, and has high elasticity. At this time, when the substrate 1 passes through the hair-smoothing component 6, it is easy to produce fluctuations, which leads to the phenomenon that the edge of the substrate 1 is separated from the guide blocking plate 63, thereby affecting the blocking effect of the airflow space. For this reason, refer to the attached manual Figures 14 to 17This embodiment also provides the following technical solution: two groups of pull-edge components 7 are arranged on the inner side of the guide sealing plate 63, and the two groups of pull-edge components 7 are respectively arranged on the upper and lower sides of the base 1. Each group of pull-edge components 7 includes a group of flexible belts 71 and two groups of guide wheels 72. The flexible belts 71 are sleeved on the outside of the two groups of guide wheels 72 to form a crawler structure, and multiple groups of needles 73 are fixedly connected to the surface of the flexible belts 71.

[0078] Among them, the edge of the substrate 1 cooperates with the flexible belt 71, so that the needle 73 can penetrate into the surface of the substrate 1, forming a certain supporting effect on the substrate 1, and while the substrate 1 is being conveyed, the flexible belt 71 can move like a track, without affecting the conveying of the substrate 1, and thus can form effective support for the edge of the substrate 1 with the help of the flexible belt 71, so that the edge of the substrate 1 is as close to the guide sealing plate 63 as possible, thereby reducing the gap between the substrate 1 and the guide sealing plate 63.

[0079] It should be noted that the edge pulling assembly 7 can be set near the exhaust hood 61 according to the length of the guide sealing plate 63 and the conveying trajectory of the substrate 1. Multiple groups of structures can be set to reasonably set the corresponding positions and quantities of the edge pulling assembly 7 without affecting the operation of the exhaust hood 61 and the blowing hood 64.

[0080] For further information, please refer to the attached manual. Fig.16 and 17 The length direction of the flexible belt 71 is inclined relative to the conveying direction of the substrate 1, that is, the flexible belt 71 is gradually arranged close to the guide blocking plate 63 along the conveying direction of the substrate 1. Specifically, in the two groups of guide wheels 72 in each group of edge pulling components 7, the distance between the guide wheel 72 on the side away from the conveying direction of the substrate 1 and the guide blocking plate 63 is greater than the distance between the other group of guide wheels 72 and the guide blocking plate 63, that is, one group of the two groups of guide wheels 72 is farther from the guide blocking plate 63, and the other group is closer to the guide blocking plate 63, and the surface of the guide wheel 72 is fixedly connected with a guide convex ring 721, and the inner side wall of the flexible belt 71 is provided with a guide groove 711, and the guide convex ring 721 is connected to the guide The slots 711 are engaged with each other, and the flexible belt 71 is an elastic material, such as a rubber belt, which can produce adaptive deformation, so that the flexible belt 71 supported by the two sets of guide wheels 72 is relatively tilted (for ease of viewing, the tilt angle in the figure is relatively large). After the substrate 1 contacts the needle 73, in the process of moving forward, due to the tilt of the flexible belt 71, a pulling force can be formed on both sides of the substrate 1, thereby further improving the contact effect between the edge of the substrate 1 and the guide sealing plate 63, ensuring the airflow effect in the vacuum hood 61, and at the same time, it can also make the substrate 1 pass through the vacuum hood 61 more smoothly, thereby improving the processing effect and the coating effect of the coating head 32.

[0081] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A preparation device for a semi-conductive water-blocking binding tape containing water-blocking powder, characterized in that: It comprises a raw material supply system (2), a coating system (3), a powder spreading system (5) and a drying and curing system (4), wherein the raw material supply system (2) is used to provide the coating raw material to the coating system (3), the coating system (3) is used to apply the coating raw material to the surface of the substrate (1), and the drying and curing system (4) is used to heat and dry the coated coating layer and accelerate the curing of the material; The coating system (3) comprises a coating frame (31), on which a substrate roll (34), a coating head (32) and a support roller group (33) are arranged, the conveying pipeline of the raw material supply system (2) is connected to the coating head (32), and the powder spreading system (5) is used to apply a water-blocking filler (13) to the substrate; The preparation device further comprises a hair-smoothing component (6), wherein the hair-smoothing component (6) is used to form an airflow on the substrate (1) that penetrates the substrate (1); The hair smoothing component (6) is arranged on a coating frame (31), and the hair smoothing component (6) comprises an exhaust hood (61). The two ends of the exhaust hood (61) are fixedly connected to the coating frame (31) via mounting plates (62), respectively. The bottom of the exhaust hood (61) is fixedly connected to an exhaust pipe (611), and the exhaust pipe (611) is connected to an exhaust device. The exhaust hood (61) is located at the bottom of the substrate (1), and the exhaust hood (61) is located at the position of the substrate (1) before coating processing, and the opening of the exhaust hood (61) is arranged corresponding to the substrate (1).

2. The device for preparing a semi-conductive water-blocking binding tape containing water-blocking powder according to claim 1, characterized in that: The two ends of the exhaust hood (61) are also fixedly connected to guide blocking plates (63), the guide blocking plates (63) are in contact with the edge of the base (1), the guide blocking plates (63) block the two ends of the exhaust hood (61), so that an air inlet opening is formed at the top of the exhaust hood (61), and the guide blocking plates (63) extend to the coating support roller (332) and are provided with an arc-shaped slot structure that is mutually compatible with the outer circumference of the coating support roller (332), and the two groups of guide blocking plates (63) and the exhaust hood (61) form a group of roller-contacting openings (612) outside the coating support roller (332).

3. The device for preparing a semi-conductive water-blocking binding tape containing water-blocking powder according to claim 2, characterized in that: A glue overflow area (321) is provided on the side of the coating head (32) facing away from the movement direction of the substrate (1); when the coating head (32) outputs the coating material, the excess coating material is accumulated in the glue overflow area (321).

4. The device for preparing a semi-conductive water-blocking binding tape containing water-blocking powder according to claim 3 is characterized in that: The hair smoothing component (6) further comprises an air blowing hood (64), wherein the air blowing hood (64) is arranged at a position above the base (1) corresponding to the exhaust hood (61), an opening of the air blowing hood (64) is arranged corresponding to the base (1), two ends of the air blowing hood (64) are fixedly connected to the mounting plate (62), and an air blowing pipe (641) is arranged on the air blowing hood (64), and the air blowing pipe (641) is connected to an air blowing device.

5. The device for preparing a semi-conductive water-blocking binding tape containing water-blocking powder according to claim 4, characterized in that: A heating structure (642) is provided in the air blowing hood (64), and the heating structure (642) is formed by a plurality of groups of electric heating wires fixedly connected to the air blowing hood (64), and the plurality of groups of electric heating wires are distributed in a mesh shape.

6. The device for preparing a semi-conductive water-blocking binding tape containing water-blocking powder according to claim 5, characterized in that: A microporous plate (613) is arranged in the vacuum hood (61); the microporous plate (613) is detachably connected to the vacuum hood (61); and the base (1) is slidably fitted to the microporous plate (613).

7. A semi-conductive water-blocking binding tape containing water-blocking powder prepared by the preparation device as claimed in claim 6, characterized in that: It comprises a substrate (1) and a coating layer, wherein the coating layer comprises two layers, and the two coating layers are respectively a first coating layer (11) and a second coating layer (12); The first coating layer (11) and the second coating layer (12) are respectively arranged on the front and back surfaces of the substrate (1), and the textile gaps of the substrate (1) are filled with a water-blocking filler (13).

8. The semi-conductive water-blocking binding tape containing water-blocking powder according to claim 7, characterized in that: The base (1) is polyester fabric, and the water-blocking filler (13) is water-blocking powder, which is a semi-conductive resistive water-blocking powder.

9. The semi-conductive water-blocking binding tape containing water-blocking powder according to claim 8, characterized in that: The first coating layer (11) is formed by coating a semi-conductive adhesive on one surface of the substrate (1), and the second coating layer (12) is formed by coating a semi-conductive rubber water-blocking adhesive on the other surface of the substrate (1).

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