Extended substrate processing systems and methods with additional processing chamber

Abstract

The substrate processing system has an extended substrate processing capability. In some examples, this may be accomplished by providing an inner substrate handling chamber (e.g., with six faces or sidewalls) and an outer substrate handling chamber (e.g., with five faces or sidewalls). The inner substrate handling chamber may be connected with an additional substrate processing chamber. The inboard substrate handling chamber may be connected to the outboard substrate handling chamber by an additional outboard load lock module. These features enable manufacturers to increase the number of substrate processing chambers in a substrate processing system or production line.

Description

Technical Field

[0001] The present disclosure generally relates to a substrate processing system with expanded substrate processing capabilities. Some more specific aspects of the technology relate to a substrate processing system that includes an inner substrate handling chamber and an outer substrate handling chamber interconnected by an additional outer load lock module. This arrangement and these additional components increase the number of substrate processing chambers in the system and the substrate processing capabilities. Background Art

[0002] During the manufacture of semiconductor devices, such as integrated circuits and electronic devices, material layers are typically deposited onto a substrate. Material layer deposition is typically accomplished by supporting the substrate within a substrate processing chamber apparatus, heating the substrate to a desired deposition temperature, and flowing one or more material layer precursors through the chamber apparatus and across the substrate. As the precursors flow through the substrate, a material layer is gradually formed on the substrate surface, typically based on the temperature of the substrate and environmental conditions within the chamber apparatus.

[0003] The conventional substrate processing system 100 includes Figure 1 A "cluster-type" system of the type generally shown. Such a substrate processing system 100 includes a substrate handling chamber 102 operatively connected to two to four substrate processing chambers 104 via gate valves 106. Each substrate processing chamber 104 is equipped to receive a substrate on a substrate support 108 that holds the substrate during processing (e.g., during deposition of a material layer as described above).

[0004] The substrate handling chamber 102 includes a robot 110 for moving substrates into and out of various substrate processing chambers 104 through gate valves 106. In use, the gate valves 106 are opened, and the end effector 110A of the robot 110 extends through the open gate valves 106 to insert a substrate into or remove a substrate from the interior chamber of the substrate processing chamber 104 (e.g., place a substrate on or remove a substrate from a substrate support 108). Once the robot 110 is retracted from the substrate processing chamber 104, the gate valves 106 are closed, thereby sealing the substrate processing chamber 104 from the substrate handling chamber 102. Other desired actions may then be performed in the substrate processing chamber 104 and / or the substrate handling chamber 102.

[0005] Figure 1The substrate processing system 100 is further shown to include a load lock module 112. The load lock module 112 is connected to the substrate handling chamber 102 through a gate valve 116. The load lock module 112 includes a substrate holding member 114 for holding the substrate on its way into the substrate handling chamber 102 for further processing and on its way out of the substrate handling chamber 102 (after processing is completed). The end effector 110A of the robot 110 moves through the gate valve 116 (when open) to move the substrate from the load lock module 112 into the substrate handling chamber 102 (for layer deposition and other processing), and from the substrate handling chamber 102 into the load lock module 112 (after processing is completed). The load lock module 112 and the gate valve 116 keep the substrate isolated from the environment of the substrate handling chamber 102 until the conditions (e.g., temperature, pressure, atmospheric content, etc.) within the substrate handling chamber 102 are ready for the insertion of the substrate.

[0006] The load lock module 112 is also coupled to the equipment front end module 120 through another gate valve 118. The equipment front end module 120 includes a robot 122. The end effector 122A of the robot 122 moves through the gate valve 118 (when open) to move substrates from the equipment front end module 120 into the load lock module 112 (for layer deposition and other processing), and from the load lock module 112 into the equipment front end module 120 (after processing is completed). The robot 122 of the equipment front end module 120 also picks up new substrates for processing from one of the load ports 124A-124C and returns processed substrates to one of the load ports 124A-124C, for example, to be transferred to another location for further processing.

[0007] Conventional semiconductor production systems and methods of this type are generally acceptable for their intended purposes, but there is room for improvement. Improvements that reduce manufacturing costs, decrease processing time, and / or increase manufacturing efficiency would be a welcome advancement in the art. Summary of the invention

[0008] Various aspects of the present technology relate to substrate processing systems and methods with expanded substrate processing capabilities. As described above, some more specific aspects of the present technology relate to substrate processing systems and methods that include and use an inner substrate handling chamber and an outer substrate handling chamber interconnected by an additional outer load lock module. This arrangement and these additional components increase the number of substrate processing chambers and substrate processing capabilities in the overall substrate processing system.

[0009] A semiconductor or other substrate processing system according to at least some examples of the present technology may include a first substrate handling chamber having: (a) a first face, (b) a second face extending at an oblique angle relative to the first face, (c) a third face extending at an oblique angle relative to the first face, (d) a fourth face extending at an oblique angle relative to the second face, (e) a fifth face extending at an oblique angle relative to the third face, and (f) a sixth face connected between the fourth face and the fifth face. A first loading lock module is connected to the first face, and the first loading lock module includes one or more first substrate supports for holding a substrate through the first face and moving it into and out of the first substrate handling chamber. A second loading lock module is connected to the sixth face. The system also includes a second substrate handling chamber having: (a) a seventh face connected to the second loading lock module, (b) an eighth face extending at an oblique angle relative to the seventh face, (c) a ninth face extending at an oblique angle relative to the seventh face, (d) a tenth face extending at an oblique angle relative to the eighth face, and (e) an eleventh face extending at an oblique angle relative to the ninth face. The second load lock module includes one or more second substrate supports for holding a substrate for transfer between the first substrate handling chamber and the second substrate handling chamber through the sixth surface and the seventh surface.

[0010] In addition to or as an alternative to one or more of the features described above, the eleventh face may extend at an oblique angle relative to the tenth face.

[0011] In addition to or in lieu of one or more of the above features, each of the second side, the third side, the eighth side, the ninth side, the tenth side, and the eleventh side can be connected to a gate valve configured to be connected to a corresponding substrate processing module.

[0012] In addition to or instead of one or more of the features described above, examples of substrate processing systems according to the present technology may include: (i) a first substrate processing chamber releasably connected to the second side; (ii) a second substrate processing chamber releasably connected to the third side; (iii) a third substrate processing chamber releasably connected to the eighth side; (iv) a fourth substrate processing chamber releasably connected to the ninth side; (v) a fifth substrate processing chamber releasably connected to the tenth side; and / or (vi) a sixth substrate processing chamber releasably connected to the eleventh side.

[0013] In addition to one or more of the features described above, or as an alternative, one or more (optionally each) of the first substrate processing chamber, the second substrate processing chamber, the third substrate processing chamber, the fourth substrate processing chamber, the fifth substrate processing chamber and / or the sixth substrate processing chamber may include at least four substrate supports.

[0014] In addition to one or more of the features described above, or as an alternative, one or more (optionally each) of the first substrate processing chamber, the second substrate processing chamber, the third substrate processing chamber, the fourth substrate processing chamber, the fifth substrate processing chamber and / or the sixth substrate processing chamber may include at least two substrate supports.

[0015] In addition to or in lieu of one or more of the above features: (a) the fourth surface may have an edge-to-edge dimension that is shorter than the edge-to-edge dimension of each of the first surface, the second surface, the third surface, and the sixth surface, and / or (b) the fifth surface may have an edge-to-edge dimension that is shorter than the edge-to-edge dimension of each of the first surface, the second surface, the third surface, and the sixth surface.

[0016] In addition to or in lieu of one or more of the above features, the edge-to-edge dimensions of the fourth surface and the fifth surface may be substantially equal, and / or the edge-to-edge dimensions of the first, second, third, and sixth surfaces may be substantially equal.

[0017] In addition to or in lieu of one or more of the features described above, the edge-to-edge dimension of the sixth face may be substantially equal to the edge-to-edge dimension of the seventh face.

[0018] In addition to or in lieu of one or more of the features described above, an edge-to-edge dimension of each of the eighth, ninth, tenth, and eleventh faces may be substantially equal to an edge-to-edge dimension of the seventh face.

[0019] In addition to one or more of the above features, or as an alternative, the inclination angle defined between the first face and the second face may be substantially equal to the inclination angle defined between the first face and the third face; and / or the inclination angle defined between the seventh face and the eighth face may be substantially equal to the inclination angle defined between the seventh face and the ninth face.

[0020] In addition to or in lieu of one or more of the features described above, the inclination angle defined between the first face and the second face may be substantially equal to the inclination angle defined between the seventh face and the eighth face.

[0021] In addition to or instead of one or more of the features described above, a perimeter of the second substrate handling chamber extending around the seventh, eighth, ninth, tenth, and eleventh faces forms a regular pentagon.

[0022] In addition to or instead of one or more of the above features, a perimeter of the first substrate handling chamber extending around the first, second, third, fourth, fifth and sixth sides forms a hexagon having four sides of a first length and two sides of a second length shorter than the first length.

[0023] In addition to or in lieu of one or more of the features described above, the first load lock module and the second load lock module may be interchangeable with one another.

[0024] In addition to or in lieu of one or more of the features described above, each of the first load lock module and the second load lock module may include substrate transfer ports arranged in a 2×2 matrix.

[0025] In addition to or as an alternative to one or more of the features described above, the fourth side and / or the fifth side may constitute a completely closed and sealed wall.

[0026] In addition to or as an alternative to one or more of the features described above, the fourth side may include at least one substrate transfer groove, and / or the fifth side may include at least one substrate transfer groove.

[0027] Semiconductor or other substrate processing methods may use a substrate processing system having any of the features and / or combinations of features described above.

[0028] Semiconductor or other substrate processing methods according to at least some examples of the present technology may include moving a first substrate from a first loading lock module into a first substrate handling chamber, wherein the first substrate handling chamber includes: (a) a first surface, (b) a second surface extending at an oblique angle relative to the first surface, (c) a third surface extending at an oblique angle relative to the first surface, (d) a fourth surface extending at an oblique angle relative to the second surface, (e) a fifth surface extending at an oblique angle relative to the third surface, and (f) a sixth surface connected between the fourth surface and the fifth surface, and wherein the first substrate is moved from the first loading lock module into the first substrate handling chamber through the first surface. The method may also include: (i) moving the first substrate from the first substrate handling chamber into a first substrate processing module, wherein the first substrate processing module is connected to one of the second surface or the third surface; (ii) performing a first processing process on the first substrate in the first substrate processing module; (iii) moving the first substrate from the first substrate processing module into the first substrate handling chamber; (iv) moving the first substrate from the first substrate handling chamber through the sixth surface into a second loading lock module connected to the sixth surface; and (v) moving the first substrate from the second loading lock module into the second substrate handling chamber. The second substrate handling chamber may include: (a) a seventh surface connected to the second loading and locking module, (b) an eighth surface extending at an inclined angle relative to the seventh surface, (c) a ninth surface extending at an inclined angle relative to the seventh surface, (d) a tenth surface extending at an inclined angle relative to the eighth surface, and (e) an eleventh surface extending at an inclined angle relative to the ninth surface. In the method, the first substrate is moved from the second loading and locking module to the second substrate handling chamber through the seventh surface. The method may also include: (i) moving the first substrate from the second substrate handling chamber to a second substrate processing module, wherein the second substrate processing module is connected to one of the eighth surface, the ninth surface, the tenth surface, or the eleventh surface; and (ii) performing a second processing process on the first substrate in the second substrate processing module.

[0029] In addition to or instead of one or more of the features described above, at least some example methods according to the present technology may include: (a) moving a first substrate from a second substrate processing module into a second substrate handling chamber; (b) moving the first substrate from the second substrate handling chamber through a seventh surface and into a second loading lock module; (c) moving the first substrate from the second loading lock module through a sixth surface and into the first substrate handling chamber; and (d) moving the first substrate from the first substrate handling chamber through the first surface and into the first loading lock module.

[0030] In addition to or in lieu of one or more of the features described above, methods according to at least some examples of the present technology may use a semiconductor or other substrate processing system having any of the features and / or combinations of features described above.

[0031] The present invention is provided to introduce some concepts related to the technology in a simplified form. These concepts are further described in detail in the detailed description of the examples of the following disclosure. The present invention is not intended to identify the key features or essential features of the claimed subject matter, nor is it intended to be used to limit the scope of the claimed subject matter. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] These and other features, aspects and advantages of the present invention disclosed herein are described below with reference to the accompanying drawings of certain embodiments, which are intended to illustrate rather than to limit the present invention.

[0033] Figure 1 is a schematic diagram of a basic prior art cluster-type substrate processing system;

[0034] Figure 2 is a schematic diagram of a substrate processing system according to some examples and aspects of the present technology;

[0035] Figure 3A is an enlarged view showing a first substrate handling chamber according to some examples and aspects of the present technology;

[0036] Figure 3B is an enlarged view showing a second substrate handling chamber according to some examples and aspects of the present technology;

[0037] Figure 3C A diagram comparing a first substrate handling chamber and a second substrate handling chamber according to some examples and aspects of the present technology is provided;

[0038] Figure 4 is a schematic diagram of another substrate processing system according to some examples and aspects of the present technology;

[0039] Figure 5 A schematic diagram of a substrate transfer slot in a load lock module according to some examples and aspects of the present technology is provided; and

[0040] Figure 6 A view of another example first substrate handling chamber according to some examples and aspects of the present technology is provided.

[0041] It should be understood that the elements in the drawings are shown for simplicity and clarity and are not necessarily drawn to scale. For example, the relative sizes of some elements in the drawings may be exaggerated relative to other elements to help improve the understanding of the illustrated embodiments of the present disclosure. DETAILED DESCRIPTION

[0042] Reference will now be made to the drawings, wherein like reference numerals represent similar structural features or aspects of the subject disclosure.

[0043] Figure 2 Schematically illustrates a top view of a substrate processing system 200 (eg, a cluster-type semiconductor processing system) with expanded substrate processing capabilities according to some examples of the present technology. Figure 1 Compared to the basic substrate processing system 100 shown, the substrate processing system 200 expands substrate processing capabilities by adding at least one additional substrate handling chamber and one or more additional substrate processing chambers.

[0044] More specifically, Figure 2 The illustrated substrate processing system 200 includes: (a) a first substrate handling chamber 300 ("inside" substrate handling chamber) including a first robot 320 having an end effector 320A; (b) a first load lock module 400 ("inside" load lock module) connected to one edge or face of the first substrate handling chamber 300; (c) a second load lock module 500 ("outside" load lock module) connected to the opposite edge or face of the first substrate handling chamber 300; and (d) a second substrate handling chamber 600 ("outside" substrate handling chamber) including a second robot 620 having an end effector 620A. The second load lock module 500 extends between and connects the first substrate handling chamber 300 and the second substrate handling chamber 600. The first load lock module 400 of this example is also connected to an equipment front end module 700, which includes a third robot 720 having an end effector 720A. The equipment front end module 700 may include or be connected to a nitrogen source for providing a nitrogen atmosphere within the equipment front end module 700. The equipment front end module 700 receives new substrates for processing into the substrate processing system 200 and discharges processed substrates from the substrate processing system 200 via one or more load ports 800A-800D (using the robot 720 to move substrates between the load ports 800A-800D and the first load lock module 400). Figure 2Four loadports 800A-800D are shown in the example of FIG. 8 , but more or fewer loadports may be provided in other examples of the technology.

[0045] Each of the first substrate handling chamber 300 and the second substrate handling chamber 600 is connected to a plurality of substrate processing chambers 900. Substrates are transferred into the substrate processing chambers 900, where one or more layers of material are deposited onto the surface of the substrate and / or other desired substrate processing is performed. Figure 2 Each substrate processing chamber 900 is shown to include four substrate supports 902, onto which substrates may be placed during processing. More or fewer substrate supports 902 may be provided in each substrate processing chamber 900 (e.g., the substrate processing chamber 900 may be a dual chamber module (DCM) or a quad chamber module (QCM)). A substrate processing chamber 900 according to some examples of the technology may include an additional four substrate supports 902 located Figure 2 902. Each substrate processing chamber 900 may have the same structure, or one or more substrate processing chambers 900 may have a different structure than other substrate processing chambers 900 that exist.

[0046] Each of the first substrate handling chamber 300 and the second substrate handling chamber 600 is connected to its corresponding substrate processing chamber 900 through one or more gate valves 1000. Although two gate valves 1000 are shown to connect the substrate handling chambers 300, 600 to each of their corresponding substrate processing chambers 900, in other examples of the technology, each substrate processing chamber 900 may be provided with more or fewer gate valves 1000. The substrate processing chambers 900 according to some examples of the present technology may be connected to their corresponding substrate handling chambers 300, 600 through two additional gate valves 1000, for example, located at Figure 2 600. When closed, the gate valves 1000 sealably separate the substrate handling chambers 300, 600 from their respective substrate processing chambers 900 (so that independent atmosphere conditions can be maintained in each chamber). When open, the gate valves 1000 provide openings (e.g., substrate transfer slots) through which the end effectors 320A, 620A of the robot arms 320, 620 can extend to move substrates into and out of the substrate processing chambers 900. The openings through the gate valves 1000 are aligned with the substrate transfer slots provided in the substrate processing chambers 900 and the substrate handling chambers 300, 600 so that the substrates can be moved between the substrate processing chambers 900 and the substrate handling chambers 300, 600 through the gate valves 1000. Each gate valve 1000 may have the same structure, or one or more gate valves 1000 may have a different structure than other gate valves 1000 present.

[0047] One face of the first load lock module 400 is closed by one or more gate valves 1100A ( Figure 2 The first loading lock module 400 is connected to the equipment front end module 700, and the opposite side of the first loading lock module 400 is connected to the first substrate handling chamber 300 through one or more gate valves 1100B. The first loading lock module 400 also includes one or more substrate supports 402 ( Figure 2 The gate valves 1100A and 1100B are used to hold substrates while they are waiting to be moved into the equipment front end module 700 or the first substrate handling chamber 300. When closed, the gate valves 1100A and 1100B sealably separate the load lock module 400 from the equipment front end module 700 and the substrate handling chamber 300 (so that independent atmosphere conditions can be maintained in each chamber). When opened, the gate valve 1100A provides an opening (e.g., a substrate transfer slot) through which the end effector 720A of the robot 720 can extend to move substrates into and out of the equipment front end module 700. The opening through the gate valve 1100A is aligned with the substrate transfer slot provided in the equipment front end module 700 and the first load lock module 400 so that the substrate can be moved between the equipment front end module 700 and the first load lock module 400 through the gate valve 1100A. When opened, the gate valve 1100B provides an opening (e.g., a substrate transfer slot) through which the end effector 320A of the robot 320 can extend to move a substrate into and out of the substrate handling chamber 300. The opening through the gate valve 1100B is aligned with a substrate transfer slot provided in the substrate handling chamber 300 and the first load lock module 400 to enable the substrate to be moved between the substrate handling chamber 300 and the first load lock module 400 through the gate valve 1100B. Each of the gate valves 1100A, 1100B may have the same structure, or one or more of the gate valves 1100A, 1100B may have a different structure than other gate valves 1100A, 1100B that exist.

[0048] exist Figure 2 In the substrate processing system 200, one side of the second load lock module 500 is closed by one or more gate valves 1200A ( Figure 2 The second loading lock module 500 further includes one or more substrate supports 502 (two are shown in FIG. 1 ) connected to the first substrate handling chamber 300, and the opposite side of the second loading lock module 500 is connected to the second substrate handling chamber 600 through one or more gate valves 1200B. Figure 2The gate valves 1200A and 1200B are used to hold substrates while they are waiting to be moved between the two substrate handling chambers 300 and 600. When closed, the gate valves 1200A and 1200B sealably separate the second load lock module 500 from the two substrate handling chambers 300 and 600 (so that independent atmosphere conditions can be maintained in each chamber). When open, the gate valve 1200A provides an opening (e.g., a substrate transfer slot) through which the end effector 320A of the robot 320 can extend to move substrates into and out of the first substrate handling chamber 300. The opening through the gate valve 1200A is aligned with the substrate transfer slot provided in the first substrate handling chamber 300 and the second load lock module 500 so that the substrate can be moved between the substrate handling chamber 300 and the second load lock module 500 through the gate valve 1200A. When opened, the gate valve 1200B provides an opening (e.g., a substrate transfer slot) through which the end effector 620A of the robot 620 can extend to move a substrate into and out of the second substrate handling chamber 600. The opening through the gate valve 1200B is aligned with a substrate transfer slot provided in the second substrate handling chamber 600 and the second load lock module 500 so that the substrate can be moved between the second substrate handling chamber 600 and the second load lock module 500 through the gate valve 1200B. Each of the gate valves 1200A, 1200B can have the same structure, or one or more of the gate valves 1200A, 1200B can have a different structure from the other gate valves 1200A, 1200B. The gate valves 1200A and / or 1200B can also have the same or different structure as the gate valves 1100A and / or 1100B.

[0049] The first load lock module 400 may have the same structure as the second load lock module 500, and / or the first and second load lock modules 400, 500 may be interchangeable (e.g., such that the load lock modules 400, 500 may switch positions and / or have a modular structure). In other examples, the first load lock module 400 and the second load lock module 500 may have different structures and / or may not be interchangeable (e.g., such that the load lock modules 400, 500 may not switch positions in the substrate processing system 200). Either or both of the load lock modules 400, 500 may be a multi-station cooling type and / or a path-through type.

[0050] The following will be combined Figures 3A to 3C Other aspects of the substrate processing system 200 are discussed in greater detail. Figure 3A Provided by Figure 2 is an enlarged view of the first substrate handling chamber 300, and Figure 3B Provided by Figure 2 An enlarged view of the second substrate handling chamber 600 (with Figure 2 The appearance of these components is "magnified" compared to the original). Figure 3C A diagram comparing features of the first substrate handling chamber 300 and the second substrate handling chamber 600 in the example substrate processing system 200 is provided. Figures 3A to 3C Use with Figure 2 When the same drawing mark is used throughout, the same or similar parts are referenced, and many repeated descriptions may be omitted.

[0051] Figure 3A A first substrate handling chamber 300 is shown having multiple "faces" (i.e., exposed exterior surfaces to which other substrate processing system 200 components may be connected, such as gate valves 1000, 1100B, 1200A). Although it may be an entire side or face of the first substrate handling chamber 300, a "face" need not extend the entire vertical height and / or the entire horizontal width of the side of the first substrate handling chamber 300. Rather, a "face" may simply provide a mounting surface for connecting the side or face of the first substrate handling chamber 300 to another component. The exemplary first substrate handling chamber 300 includes: (a) a first surface 301, (b) a second surface 302 extending at an inclination angle A(1,2) relative to the first surface 301, (c) a third surface 303 extending at an inclination angle A(1,3) relative to the first surface 301, (d) a fourth surface 304 extending at an inclination angle A(2,4) relative to the second surface 302, (e) a fifth surface 305 extending at an inclination angle A(3,5) relative to the third surface 303, and (f) a sixth surface 306 connected between the fourth surface 304 and the fifth surface 305. Each of the angles A(4,6) and A(5,6) (the angle of the sixth surface 306 relative to the fourth surface 304 and the angle of the sixth surface 306 relative to the fifth surface 305) is also an inclination angle. Figure 3A As shown, the periphery of the first substrate handling chamber 300 may have a substantially hexagonal shape (and / or at least its faces 301-306 may be arranged in a substantially hexagonal shape). However, in this specifically shown example, the first face 301, the second face 302, the third face 303, and the sixth face 306 have the same size and are larger than the fourth face 304 and the fifth face 305. The fourth face 304 and the fifth face 305 may also be the same size.

[0052] As described above, the first load lock module 400 is connected to the first substrate handling chamber 300, and the connection is made at the first face 301 (through the gate valve 1100B). Therefore, the first face 301 may have substrate transfer slots that correspond to the positions of the gate valve 1100B and the substrate transfer slots provided in the load lock module 400. In some examples, the first face 301 may have substrate transfer slots arranged in a 2×2 matrix, for example similar to Figure 5The substrate transfer port 412 location in the load lock modules 400, 500 is shown (and discussed in more detail below). Substrates are moved into and out of the first substrate handling chamber 300 through the first face 301 and the gate valve 1100B.

[0053] As also described above, the first substrate handling chamber 300 is connected to the second load lock module 500, and the connection is made at the sixth face 306 (through the gate valve 1200A). The sixth face 306 may extend parallel to the first face 301 and may be located on the side of the first substrate handling chamber 300 opposite to the first face 301. The sixth face 306 may have substrate transfer slots that correspond to the positions of the substrate transfer slots provided in the gate valve 1200A and the load lock module 500. In some examples, the sixth face 306 may have substrate transfer slots arranged in a 2×2 matrix, for example similar to Figure 5 The substrate transfer port 412 locations in the load lock modules 400, 500 are shown (and discussed in more detail below). Substrates are moved into and out of the first substrate handling chamber 300 and into and out of the second load lock module 500 through the sixth face 306 and gate valve 1200A.

[0054] Figure 3B A second substrate handling chamber 600 is shown, which also has a plurality of "faces" (i.e., exposed exterior surfaces to which other substrate processing system 200 components may be connected, such as gate valves 1000, 1200B). Although it may be an entire side or face of the second substrate handling chamber 600, a "face" need not extend the entire vertical height and / or the entire horizontal width of the side of the second substrate handling chamber 600. Rather, a "face" may simply provide a mounting surface for connecting the side or face of the second substrate handling chamber 600 to another component. The exemplary second substrate handling chamber 600 includes: (a) a seventh surface 607 (which is connected to the second loading lock module 500 via a gate valve 1200B); (b) an eighth surface 608, which extends at an inclination angle A(7,8) relative to the seventh surface 607; (c) a ninth surface 609, which extends at an inclination angle A(7,9) relative to the seventh surface 607; (d) a tenth surface 610, which extends at an inclination angle A(8,10) relative to the eighth surface 608; and (e) an eleventh surface 611 extending at an inclination angle A(9,11) relative to the ninth surface 609. The tenth surface 610 may also extend at an inclination angle A(10,11) relative to the eleventh surface 611. Figure 3B As shown, the outer periphery of the second substrate handling chamber 600 may have a substantially pentagonal shape (and / or at least its faces 607-611 may be arranged in a substantially pentagonal shape). In the specifically shown example, the seventh face 607, the eighth face 608, the ninth face 609, the tenth face 610, and the eleventh face 611 have the same size. Therefore, Figure 3BThe pentagonal shape of the second substrate handling chamber 600 is shown to be a regular pentagonal shape, and all angles A(7,8), A(7,9), A(8,10), A(9,11), and A(10,11) have the same size (eg, about 108 degrees).

[0055] As described above, the second loading and locking module 500 is connected to the second substrate handling chamber 600, and the connection is made at the seventh face 607 (through the gate valve 1200B). The substrate moves between the second substrate handling chamber 600 and the first substrate handling chamber 300, passes through the second loading and locking module 500, passes through the gate valves 1200A and 1200B, and passes through the sixth face 306 and the seventh face 607. The sixth face 306 and the seventh face 607 can extend parallel to each other (and parallel to the first face 301) and are connected to opposite sides of the second loading and locking module 500. The seventh face 607 can have substrate transfer slots that correspond to the positions of the substrate transfer slots provided in the gate valve 1200B and the loading and locking module 500. In some examples, the seventh face 607 can have substrate transfer slots arranged in a 2×2 matrix, for example similar to Figure 5 The location of the substrate transfer port 412 in the load lock modules 400, 500 is shown (and discussed in more detail below).

[0056] Figures 2 to 3B It is further shown that each of the second face 302, the third face 303, the eighth face 608, the ninth face 609, the tenth face 610 and the eleventh face 611 is connected to one or more gate valves 1000. The gate valves 1000 are also configured to be connected to the corresponding substrate processing chambers 900. More specifically, as Figure 2 As shown: (a) the first substrate processing chamber 900 can be releasably coupled to the second face 302 via the gate valve 1000; (b) the second substrate processing chamber 900 can be releasably coupled to the third face 303 via the gate valve 1000; (c) the third substrate processing chamber 900 can be releasably coupled to the eighth face 608 via the gate valve 1000; (d) the fourth substrate processing chamber 900 can be releasably coupled to the ninth face 609 via the gate valve 1000; (e) the fifth substrate processing chamber 900 can be releasably coupled to the tenth face 610 via the gate valve 1000; and (f) the sixth substrate processing chamber 900 can be releasably coupled to the eleventh face 611 via the gate valve 1000. Each substrate processing chamber 900 can include at least one substrate support 902 (and in some examples, at least two substrate supports 902, at least four substrate supports 902, or even up to 8 (or more) substrate supports 902).

[0057] Back to Figure 3AAt least some portions of the sides or faces of the first substrate handling chamber 300 may have a substantially hexagonal shape (or at least its faces 301-306 may be arranged along the sides of a substantially hexagonal shape), but it need not be a regular hexagonal shape. Figure 3A As shown, the first face 301 may have a width W1, the second face 302 may have a width W2, the third face 303 may have a width W3, the sixth face 306 may have a width W6, and these widths (W1, W2, W3, W6) may be substantially equal. The term "substantially equal" used in the context of this article means that the two widths being compared are equal or within 5% of each other (e.g., W1 = W2 ± (W2 × 0.05)). In addition, the fourth face 304 may have a width W4, the fifth face 305 may have a width W5, and these widths W4 and W5 may be substantially equal. However, in this example, the widths W4 and W5 are less than (shorter than) the widths W1, W2, W3, and W6, and are not substantially equal to these widths. These "widths" constitute the edge-to-edge dimensions of the faces 301-306 (which may correspond to the edge-to-edge dimensions of the entire side or face of the substrate handling chamber 300, or the edge-to-edge dimensions of a portion of a side or face connected to another component).

[0058] Similarly, if Figure 3B As shown, the seventh face 607 can have a width W7, the eighth face 608 can have a width W8, the ninth face 609 can have a width W9, the tenth face 610 can have a width W10, and the eleventh face 611 can have a width W11, and these widths (W7, W8, W9, W10, and W11) can be substantially equal (as described above). These "widths" constitute the edge-to-edge dimensions of the faces 607-611 (which can correspond to the edge-to-edge dimensions of the entire side or face of the substrate processing chamber 600, or the edge-to-edge dimensions of a portion of a side or face connected to another component). In addition, in at least some examples of the technology, the sixth face 306 can have a width W6 (edge-to-edge dimension), which is substantially equal to the width W7 (edge-to-edge dimension) of the seventh face 607. Thus, in at least some examples of the technology, the first side 301, the second side 302, the third side 303, the sixth side 306, the seventh side 607, the eighth side 608, the ninth side 609, the tenth side 610 and the eleventh side 611 can be substantially equal (e.g., having substantially equal edge-to-edge dimensions).

[0059] exist Figure 2 and 3A In the example configuration shown, the angles defined by the faces of the first substrate handling chamber 300 are not all substantially equal (the term "substantially equal" as used herein means that the two angles being compared are equal or within 5 degrees of each other (e.g., Angle 1 = Angle 2 ± 5 degrees)). In at least some examples of the technology (and in Figure 2 and 3A, (i) angle A(1,2) may be substantially equal to angle A(1,3); (ii) angle A(2,4) may be substantially equal to angle A(3,5); and (iii) angle A(4,6) may be substantially equal to angle A(5,6). In addition, if desired, angles A(2,4), A(3,5), A(4,6), and A(5,6) may be substantially equal to one another. In this illustrated example, angles A(1,2) and A(1,3) may be less than (and optionally not substantially equal to) angles A(2,4), A(3,5), A(4,6), and A(5,6).

[0060] Figure 3C The size and shape of the pentagonal structure of the second substrate handling chamber 600 is shown in dashed lines, which is overlaid on the hexagonal size and shape of the first substrate handling chamber 300 to compare the size and shape in this example. As shown in the figure: (i) widths W1, W2 and W3 are substantially equal to widths W7, W8 and W9, respectively, and (ii) angles A(1,2) and A(1,3) are substantially equal to angles A(7,8) and A(7,9), respectively. In a more specific example, these angles A(1,2), A(1,3), A(7,8) and A(7,9) can be about 108 degrees. Angles A(2,4), A(3,5), A(4,6) and A(5,6) are slightly larger and can be substantially equal, for example, about 126 degrees.

[0061] From the above discussion, it is obvious that Figures 2 to 3C The described substrate processing system 200 has increased substrate processing capabilities based on at least one or more additional substrate processing chambers 900 connected to the second side 302 and / or the third side 303 of the first (inner) substrate handling chamber 300. In some examples of the technology, the fourth side 304 and the fifth side 305 of the substrate handling chamber 300 can form a completely closed and sealed wall. In this structure, the fourth side 304 and / or the fifth side 305 can be empty to provide space, for example, for access to the first substrate handling chamber 300, the second load lock module 500 and / or some of the substrate processing chambers 900 for maintenance, repair, etc.

[0062] However, in other examples of the technology, the fourth surface 304 and / or the fifth surface 305 may provide structures that can further expand the substrate processing capabilities of the substrate processing system. Figure 2 and 3A As shown by the dashed lines in FIG. 3 , the fourth side 304 and / or the fifth side 305 may be provided with at least one substrate transfer groove 252. The substrate transfer groove 252 (when present) may be sealed (e.g., by a removable sealing plate) at Figure 2In the illustrated type of substrate processing system 200 arrangement, no substrate processing chamber 900 is attached to the fourth face 304 and / or the fifth face 305. The substrate transfer slots 252 in the fourth face 304 and / or the fifth face 305 may also be smaller than corresponding slots in the other faces 301, 302, 303, 306, 607, 608, 609, 610, 611 (although this need not be the case in all examples of the technology).

[0063] Figure 4 A schematic diagram of another example substrate processing system 250 having further expanded processing capabilities utilizing the fourth side 304 and / or the fifth side 305 in the manner described above is provided. Figure 4 Use with Figure 2-3C Where the same reference numerals are used, the same or similar parts are referenced, and many repeated descriptions may be omitted. Figure 4 As shown, in this example substrate processing system 250, the fourth face 304 is coupled to the substrate processing chamber 950 via one or more gate valves 940, and / or the fifth face 305 is coupled to the substrate processing chamber 950 via one or more gate valves 940. The substrate processing chamber 950 coupled to the fourth face 304 and / or the fifth face 305 can be made slightly smaller (for example, if the fourth face 304 and / or the fifth face 305 are smaller than the other faces), such as Figure 4 As shown. Alternatively, the size, shape and / or equipment of the substrate processing chamber 950 can be the same as any one or more of the substrate processing chambers 900. As another option, if desired, the fourth face 304 and / or the fifth face 305 can be sized, shaped and equipped in the same manner as the second face 302 and / or the third face 303. The gate valve 940 can have the same structure as any one of the gate valves 1000, 1100A, 1100B, 1200A and / or 1200B, or they can have different structures.

[0064] Figure 5 Example load lock modules 400, 500 that may be used according to some examples of the present technology are schematically shown. Load lock module 400 includes opposing faces 400A and 400B, and load lock module 500 includes opposing faces 500A and 500B (see also FIG. Figure 4 Each of these opposing faces 400A, 400B, 500A, 500B has four substrate transfer ports 412 arranged in a 2×2 matrix ( Figure 54 and 500B are shown with dotted lines). When used as the first loading lock module 400: (a) the surface 400A can be engaged with the four-gate valve 1100A arrangement that seals the surface 400A and the equipment front-end module 700, and (b) the surface 400B can be engaged with the four-gate valve 1100B arrangement that seals the surface 400B and the first surface 301 of the first substrate handling chamber 300. When used as the second loading lock module 500: (a) the surface 500A can be engaged with the four-gate valve 1200A arrangement that seals the surface 500A and the sixth surface 306 of the first substrate handling chamber 300, and (b) the surface 500B can be engaged with the four-gate valve 1200B arrangement that seals the surface 500B and the seventh surface 607 of the second substrate handling chamber 600. Each of the equipment front-end module 700, the first face 301 of the first substrate handling chamber 300, the sixth face 306 of the first substrate handling chamber 300, and the seventh face 607 of the second substrate handling chamber 600 may include substrate transfer slots arranged in a 2×2 matrix, which are aligned with the corresponding four substrate transfer ports 412 on the faces 400A, 400B, 500A, 500B. Similar 2×2 matrix substrate transfer slots may be provided in one or more substrate processing chambers 900, the second face 302, the third face 303, the eighth face 608, the ninth face 609, the tenth face 610, and the eleventh face 611.

[0065] Figures 2 to 4 The faces 301-306 and 607-611 are shown flush with, corresponding to, and / or spanning the entire width of a corresponding side or face of a substrate handling chamber 300, 600. However, the faces 301-306 and 607-611 need not have those properties, e.g., as described above, the faces 301-306 and 607-611 need not span the entire width (and / or height) of a side or face of a substrate handling chamber 300, 600. Figure 6 An example is shown. Figure 6 Use with Figures 2 to 5 Where the same figure marks are used, the same or similar parts are referenced, and many repeated descriptions are omitted.

[0066] Figure 6 Shows something like Figure 3A The substrate processing chamber 350 is shown, but in Figure 6 In the example of FIG. 3 , the first face 301 , the second face 302 , the third face 303 and the sixth face 306 are respectively disposed on protruding members 351 , 352 , 353 and 356 extending outwardly from a major main side or face 360 ​​of the substrate processing chamber 350 . Figure 6As shown, the first face 301, the second face 302, the third face 303, and the sixth face 306 do not extend the entire width of their corresponding major side or face 360 ​​(e.g., the width W1 of face 301 is less than the width WS of the major side or face 360 ​​on which the protruding member 351 for the first face 301 is disposed). Similarly, although they can, one or more protruding members 351, 352, 353, and / or 356 need not extend the entire vertical height of the side or face 360 ​​of the substrate processing chamber 350. Instead, if desired, the protruding members 351, 352, 353, and 356 comprising the faces 301, 302, 303, and 306 may constitute outwardly extending features (e.g., mounting surfaces) located only on a portion of their corresponding major side or face 360, such as configured to engage one or more gate valves 1000, 1100B, 1200A. The faces (eg, at least 301 , 302 , 303 , and 306 ) may include a metal plate (eg, aluminum or an aluminum alloy) that forms a surface for engaging a surface of one of the gate valves 1000 , 1100B, 1200A.

[0067] However, Figure 6 The example substrate processing chamber 350 still includes: (a) a first face 301, (b) a second face 302 extending at an inclination angle A(1,2) relative to the first face 301, (c) a third face 303 extending at an inclination angle A(1,3) relative to the first face 301, (d) a fourth face 304 extending at an inclination angle A(2,4) relative to the second face 302, (e) a fifth face 305 extending at an inclination angle A(3,5) relative to the third face 303, and (f) a sixth face 306 connected between the fourth face 304 and the fifth face 305. Each of the angles A(4,6) and A(5,6) (the angle of the sixth face 306 relative to the fourth face 304 and the angle of the sixth face 306 relative to the fifth face 305) is also an inclination angle. In addition, in the specifically shown example, the first face 301, the second face 302, the third face 303, and the sixth face 306 have the same size and are larger than the fourth face 304 and the fifth face 305. The fourth side 304 and the fifth side 305 may also be the same size. As described above, the sides 301, 302, 303 and 306 may also include one or more substrate transfer slots.

[0068] Similarly, one or more faces 607-611 of the second substrate handling chamber 600 may be disposed on protruding members similar to protruding members 351, 352, 353, and 356. In this manner, one or more faces 607-611 of the second substrate handling chamber 600 may not span the entire width and / or vertical height of a major major side or face of the second substrate handling chamber 600 on which the face is disposed.

[0069] Back to Figure 2-3B, some operating methods of the substrate processing system 200 (and 250) according to aspects of the present technology will be described below. First, a substrate for processing in the substrate processing system 200, 250 will be loaded into the substrate processing system 200, 250 through one of the load ports 800A-800D. The robot arm 720 of the equipment front end module 700 picks up the substrate from its load port 800A-800D and moves it to the internal chamber of the equipment front end module 700. The substrate can be kept in the equipment front end module 700 for any desired period of time.

[0070] To start processing, one of the gate valves 1100A is opened, the robot 720 of the equipment front end module 700 picks up the substrate from its holding position in the equipment front end module 700 (if necessary), and the robot 720 moves the substrate through the gate valve 1100A to the substrate support 402 in the first load lock module 400. The robot 720 is retracted into the equipment front end module 700, and the gate valve 1100A is closed. The substrate can be held on the substrate support 402 for any desired amount of time.

[0071] When further processing is scheduled, the gate valve 1100B can be opened. The substrate can be picked up from the substrate support 402 in the first load lock module 400 by the robot arm 320 of the first substrate handling chamber 300 and moved to the interior of the first substrate handling chamber 300 through the first face 301 of the first substrate handling chamber 300. The substrate can be maintained within the first substrate handling chamber 300 for any desired amount of time (e.g., placed on a support within the substrate handling chamber 300, if desired).

[0072] From there, the substrate can be moved into one of the substrate processing chambers 900 coupled to the second face 302 or the third face 303. To this end, one of the gate valves 1000 is opened, the robot 320 moves the substrate from the substrate handling chamber 300 into one of the substrate processing chambers 900 via the gate valve 1000, and places the substrate on the substrate support 902. The robot 320 is then retracted from the substrate processing chamber 900, and the gate valve 1000 is closed. A first treatment process (e.g., a layer deposition process) takes place on the substrate, while the substrate processing chamber 900 is sealed and isolated from the substrate handling chamber 300 by the gate valve 1000. In a similar manner, the substrate can be placed in the substrate processing chamber 950 via the gate valve 940, which is coupled to the fourth face 304 and / or the fifth face 305 in the substrate processing system 250 equipped in this manner.

[0073] Once this processing step is completed, the substrate can be arranged for further processing in another substrate processing chamber 900, such as a substrate processing chamber connected to the second substrate handling chamber 600. In this method, the substrate must be moved from the substrate processing chamber 900 that houses it to the second substrate handling chamber 600. To this end, the process includes: (i) opening the gate valve 1000 leading to the substrate processing chamber 900 containing the substrate; (ii) picking up the substrate with the robot 320; (iii) moving the substrate from the substrate processing chamber 900 to the first substrate handling chamber 300; (iv) closing the gate valve 1000; (v) opening the gate valve 1200A; (vi) moving the substrate from the first substrate handling chamber 300 to the second load lock module 500 through the sixth face 306 and the gate valve 1200A; (vii) placing the substrate on the substrate support 502; (viii) retracting the robot 320 into the first substrate handling chamber 300; and (ix) closing the gate valve 1200A. If desired, the substrate may be stored in the first substrate handling chamber 300 for a period of time before being transferred into the second load lock module 500 , and / or may be stored in the second load lock module 500 before being further transferred into the second substrate handling chamber 600 .

[0074] To further transfer the substrate into the second substrate handling chamber 600: (i) one of the gate valves 1200B is opened; (ii) the robot 620 extends through the opened gate valve 1200B and picks up the substrate; (iii) the robot 620 moves the substrate into the second substrate handling chamber 600 through the seventh face 607; and (iv) the gate valve 1200B is closed. Then, the gate valve 1000 connecting one of the eighth face 608, the ninth face 609, the tenth face 610 or the eleventh face 611 to the substrate processing chamber 900 will be opened, and the robot 620 will move the substrate into the substrate processing chamber through the opened gate valve 1000. The robot 620 will then retract through the gate valve 1000 and return to the second substrate handling chamber 600, and the gate valve 1000 will be closed. Another processing process (e.g., another layer deposition process) occurs on the substrate while the substrate processing chamber 900 is sealed and isolated from the substrate processing chamber 600 by the gate valve 1000.

[0075] Once processing in the substrate processing chamber 900 is complete, the substrate can be removed from the substrate processing system 200. This can be accomplished in the general manner described above by moving the substrate: (a) from a substrate processing chamber 900 coupled to one of the faces 608, 609, 610, or 611, (b) into the second substrate handling chamber 600, (c) then into the second load lock module 500, (d) then into the first substrate handling chamber 300, (e) then into the first load lock module 400, (f) then into the equipment front end module 700, and (g) then into one of the load ports 800A. The various gate valves 1000, 1200B, 1200A, 1100B, and 1100A will be opened and closed at the appropriate times in the general manner described above to enable the substrate to be transferred through the various components under the appropriate pressure conditions and the appropriate atmosphere conditions.

[0076] The above process includes processing the substrate in one substrate processing chamber 900 connected to the first substrate handling chamber 300 and in one substrate processing chamber 900 connected to the second substrate handling chamber 600. In other examples of the technology, many other options are possible. As an example, the substrate can be processed in more than one substrate processing chamber 900 connected to the first substrate handling chamber 300 and / or in more than one substrate processing chamber 900 connected to the second substrate handling chamber 600. As another example, for some substrates, it may only be necessary to process in one or more substrate processing chambers 900 connected to the second substrate handling chamber 600. In this case, the substrate can simply "pass through" the first substrate handling chamber 300 (without entering the associated substrate processing chamber 900 connected to the first substrate handling chamber 300) to reach the second load lock module 500 and the second substrate handling chamber 600. As another example, after the substrate has been processed in the substrate processing chamber 900 associated with the second substrate handling chamber 600, the substrate can be processed in the substrate processing chamber 900 associated with the first substrate handling chamber 300. Additionally or alternatively, in the processing method, a single substrate may pass between the first substrate handling chamber 300 and the second substrate handling chamber 600 multiple times through the second load lock module 500 before being fully processed.

[0077] In the above process, the first robot 320 of the first substrate handling chamber 300 is capable of interacting with each of the following: (a) the first loading lock module 400 engaged with the first face 301 (through any gate valve 1100B and engaged with any substrate support 402 in the first loading lock module 400); (b) the substrate processing chamber 900 engaged with the second face 302 and the third face 303 (through any gate valve 1000 present and engaged with any substrate support 902 present in the substrate processing chamber 900); (c) if present, the substrate processing chamber 950 engaged with the fourth face 304 and / or the fifth face 305 (through any gate valve 940 present and engaged with any substrate support present in the substrate processing chamber 950); and (d) the second loading lock module 500 engaged with the sixth face 306 (through any gate valve 1200A and engaged with any substrate support 502 in the second loading lock module 500).

[0078] At least the faces 301, 302, 303, 306, 607, 608, 609, 610 and / or 611; the gate valves 1000, 1100A, 1100B, 1200A and / or 1200B; the load lock modules 400 and / or 500; the substrate processing chambers 900 and / or 950; and / or the structures for connecting these components can have a universal and / or modular type connection structure, for example to maximize interchangeability and modularity. The two load lock modules 400 / 500 can have the same structure, components and / or functions, or they can have some differences (e.g., only one load lock module 400, 500 has a cooling plate and / or heater, neither load lock module 400, 500 has a cooling plate and / or heater; or both load lock modules 400, 500 have a cooling plate and / or heater).

[0079] Although the present disclosure has been provided in the context of certain embodiments and examples, it will be understood by those skilled in the art that the present disclosure extends to other alternative embodiments and / or uses of embodiments beyond the specifically described embodiments and obvious modifications and equivalents thereof. In addition, although various variations of the embodiments of the present disclosure have been shown and described in detail, other modifications within the scope of the present disclosure will be apparent to those skilled in the art based on the present disclosure. It is also contemplated that various combinations or sub-combinations of the specific features and aspects of the embodiments may be made and still fall within the scope of the present disclosure. It should be understood that the various features and aspects of the disclosed embodiments may be combined or replaced with one another to form different modes of embodiments of the present disclosure. Therefore, the scope of the present disclosure should not be limited by the specific embodiments described above.

[0080] The headings provided herein, if any, are for convenience only and do not necessarily affect the scope or meaning of the apparatus and methods disclosed herein.

Claims

1. A semiconductor processing system comprising: The first substrate handling chamber comprises: (a) Side 1, (b) a second surface extending at an oblique angle relative to the first surface, (c) a third surface extending at an oblique angle relative to the first surface, (d) a fourth surface extending at an oblique angle relative to the second surface, (e) a fifth surface extending at an oblique angle relative to the third surface, and (f) a sixth surface connected between the fourth surface and the fifth surface; a first load lock module coupled to the first face, wherein the first load lock module includes one or more first substrate supports for holding substrates for movement into and out of the first substrate handling chamber through the first face; a second load lock module coupled to the sixth side; and The second substrate handling chamber comprises: (a) a seventh side connected to a second load lock module, (b) an eighth surface extending at an oblique angle relative to the seventh surface, (c) a ninth surface extending at an oblique angle relative to the seventh surface, (d) a tenth plane extending at an oblique angle relative to the eighth plane, and (e) an eleventh surface extending at an oblique angle relative to the ninth surface, The second loading and locking module includes one or more second substrate supports for holding the substrate for transfer between the first substrate transport chamber and the second substrate transport chamber through the sixth surface and the seventh surface.

2. The semiconductor processing system of claim 1, wherein: The eleventh surface extends at an inclined angle relative to the tenth surface.

3. The semiconductor processing system of claim 1 , wherein: Each of the second surface, the third surface, the eighth surface, the ninth surface, the tenth surface and the eleventh surface is connected to a gate valve, and the gate valve is configured to be connected to a corresponding substrate processing module.

4. The semiconductor processing system of claim 1 , further comprising: a first substrate processing chamber releasably coupled to the second side; a second substrate processing chamber releasably coupled to the third side; a third substrate processing chamber releasably coupled to the eighth side; a fourth substrate processing chamber releasably coupled to the ninth side; a fifth substrate processing chamber releasably coupled to the tenth face; as well as A sixth substrate processing chamber is releasably coupled to the eleventh side.

5. The semiconductor processing system of claim 4, wherein: Each of the first, second, third, fourth, fifth, and sixth substrate processing chambers includes at least four substrate supports.

6. The semiconductor processing system of claim 4, wherein: Each of the first, second, third, fourth, fifth, and sixth substrate processing chambers includes at least two substrate supports.

7. The semiconductor processing system of claim 1, wherein: The fourth face has an edge-to-edge dimension that is shorter than the edge-to-edge dimension of each of the first, second, third, and sixth faces, and wherein the fifth face has an edge-to-edge dimension that is shorter than the edge-to-edge dimension of each of the first, second, third, and sixth faces.

8. The semiconductor processing system of claim 7, wherein: The edge-to-edge dimension of the fourth surface and the edge-to-edge dimension of the fifth surface are substantially equal, and wherein the edge-to-edge dimensions of the first surface, the second surface, the third surface and the sixth surface are substantially equal.

9. The semiconductor processing system of claim 1, wherein: An edge-to-edge dimension of the sixth surface is substantially equal to an edge-to-edge dimension of the seventh surface.

10. The semiconductor processing system of claim 9, wherein: An edge-to-edge dimension of each of the eighth, ninth, tenth and eleventh faces is substantially equal to an edge-to-edge dimension of the seventh face.

11. The semiconductor processing system of claim 1 , wherein: The inclination angle defined between the first face and the second face is substantially equal to the inclination angle defined between the first face and the third face; and wherein the inclination angle defined between the seventh face and the eighth face is substantially equal to the inclination angle defined between the seventh face and the ninth face.

12. The semiconductor processing system of claim 11, wherein: An inclination angle defined between the first face and the second face is substantially equal to an inclination angle defined between the seventh face and the eighth face.

13. The semiconductor processing system of claim 1, wherein: An outer periphery of the second substrate transfer chamber extending around the seventh surface, the eighth surface, the ninth surface, the tenth surface, and the eleventh surface forms a regular pentagon.

14. The semiconductor processing system of claim 1, wherein: An outer periphery of the first substrate transfer chamber extending around the first, second, third, fourth, fifth, and sixth faces forms a hexagon having four sides of a first length and two sides of a second length shorter than the first length.

15. The semiconductor processing system of claim 1, wherein: The first load lock module and the second load lock module are interchangeable with each other.

16. The semiconductor processing system of claim 1, wherein: Each of the first load lock module and the second load lock module includes substrate transfer ports arranged in a 2×2 matrix.

17. The semiconductor processing system of claim 1, wherein: The fourth side and the fifth side form a completely closed and sealed wall.

18. The semiconductor processing system of claim 1, wherein: The fourth side includes at least one substrate transfer slot, and wherein the fifth side includes at least one substrate transfer slot.

19. A semiconductor processing method comprising: Moving a first substrate from a first load lock module into a first substrate handling chamber, wherein the first substrate handling chamber comprises: (a) a first surface, (b) a second surface extending at an oblique angle relative to the first surface, (c) a third surface extending at an oblique angle relative to the first surface, (d) a fourth surface extending at an oblique angle relative to the second surface, (e) a fifth surface extending at an oblique angle relative to the third surface, and (f) a sixth surface connected between the fourth surface and the fifth surface, and wherein the first substrate is moved from the first load lock module into the first substrate handling chamber through the first surface; moving a first substrate from a first substrate handling chamber to a first substrate processing module, wherein the first substrate processing module is connected to one of the second surface or the third surface; performing a first processing procedure on a first substrate in a first substrate processing module; moving a first substrate from a first substrate processing module to a first substrate handling chamber; moving a first substrate from the first substrate handling chamber through the sixth surface into a second load lock module coupled to the sixth surface; moving the first substrate from the second load lock module into a second substrate handling chamber, wherein the second substrate handling chamber comprises: (a) a seventh surface connected to the second load lock module, (b) an eighth surface extending at an oblique angle relative to the seventh surface, (c) a ninth surface extending at an oblique angle relative to the seventh surface, (d) a tenth surface extending at an oblique angle relative to the eighth surface, and (e) an eleventh surface extending at an oblique angle relative to the ninth surface, and wherein the first substrate is moved from the second load lock module into the second substrate handling chamber through the seventh surface; moving the first substrate from the second substrate handling chamber to a second substrate processing module, wherein the second substrate processing module is connected to one of the eighth surface, the ninth surface, the tenth surface, or the eleventh surface; and A second process is performed on the first substrate in the second substrate processing module.

20. The semiconductor processing method according to claim 19, further comprising: moving the first substrate from the second substrate processing module to the second substrate handling chamber; moving the first substrate from the second substrate handling chamber through the seventh surface and into the second load lock module; moving a first substrate from the second load lock module through the sixth surface and into the first substrate handling chamber; as well as A first substrate is moved from a first substrate handling chamber through a first face and into a first load lock module.

Images