Headset

Abstract

The invention provides a headphone, which comprises a head top fitting part and earmuff parts, and is characterized in that the head top fitting part is used for fitting the head of a user; the earmuff parts are connected to the two ends of the head top attaching part respectively, each earmuff part comprises an earmuff shell, a loudspeaker assembly and a sponge assembly, each earmuff shell comprises a frame body, a frame bottom plate and a frame panel, the frame bodies, the frame bottom plates and the frame panels jointly define a containing space, the loudspeaker assemblies are arranged in the containing spaces, and the sponge assemblies are arranged in the containing spaces. The sponge assembly is connected with the frame bottom plate; wherein the frame bottom plate comprises a bottom plate main body and an annular side wall which protrudes out of the bottom plate main body and is provided with a notch, the annular side wall is provided with a plurality of mounting parts used for mounting the wave beads at intervals, the outer wall of the loudspeaker assembly is provided with a plurality of grooves corresponding to the mounting parts, and when the loudspeaker assembly is arranged in the annular side wall, steel balls of the wave beads abut against the grooves. According to the headphone, when the loudspeaker assembly needs to be replaced, the loudspeaker assembly can be directly taken out, and convenience and rapidness are achieved.

Description

Technical Field

[0001] The present application relates to the technical field of earphones, and in particular to a headset. Background Art

[0002] Headphones are a pair of conversion units that receive electrical signals from a media player or receiver and convert them into audible sound waves using speakers close to the ears. Headphones can be separated from the media player and connected using only one plug, so you can listen to the audio without disturbing others. They can also isolate the sounds of the surrounding environment, which is very helpful for people who use them in noisy environments such as recording studios, travel, and sports.

[0003] Among them, headphones are a type of headphones that are different from in-ear headphones. They are composed of two parts, a signal transmitter and headphones with signal receiving and amplifying devices. The transmitter is connected to the signal source, and a preamplifier or headphone amplifier can also be connected in front of the transmitter to improve the sound quality and adjust the timbre. The existing headphone speaker unit is fixed in the ear shell and cannot be replaced, and can only play one style of music. To better play different styles of music, headphones with different styles of speaker units are needed. Such headphones are expensive and inconvenient to carry. Or when the speaker is damaged, the speaker cannot be replaced alone, which makes the maintenance cost high. Summary of the invention

[0004] In order to solve the above technical problems, the present application provides a headset to solve the problem that the speaker unit cannot be replaced in the prior art. The present application provides a headset, comprising: A top fitting portion, used to fit the user's head; There are two earmuff parts, which are respectively connected to the two ends of the top of the head fitting part. The earmuff parts include an earmuff shell, a speaker assembly and a sponge assembly. The earmuff shell includes a frame body, a frame bottom plate and a frame panel. The frame body, the frame bottom plate and the frame panel together enclose a receiving space. The speaker assembly is arranged in the receiving space, and the sponge assembly is connected to the frame bottom plate. Among them, the frame bottom plate includes a bottom plate body and an annular side wall with a notch protruding from the bottom plate body, a plurality of mounting parts for installing wave beads are arranged at intervals on the annular side wall, and a plurality of grooves corresponding to the mounting parts are arranged on the outer wall of the speaker assembly. When the speaker assembly is arranged in the annular side wall, the steel ball of the wave beads abuts against the grooves.

[0005] In one embodiment, the speaker assembly includes a speaker inner wall, a speaker outer wall and a speaker side wall. The speaker inner wall is provided with multiple sound holes, the frame bottom plate is provided with openings corresponding to the sound holes, and the speaker outer wall and the speaker side wall are respectively provided with more than one through hole group.

[0006] In one embodiment, the outer wall of the speaker is provided with two through hole groups, which are respectively located at two opposite ends of the outer wall of the speaker; the side wall of the speaker is provided with two through hole groups, which are respectively located at two opposite ends of the side wall of the speaker; the connecting line of the through hole groups of the outer wall of the speaker and the connection line of the through hole groups of the side wall of the speaker are cross-arranged.

[0007] In one embodiment, the frame body includes a body side wall and a body top wall connected to the body side wall, the body top wall is provided with a through hole to expose the speaker assembly, the body top wall and the speaker outer wall are provided with a plurality of first magnets forming a ring shape, and the frame panel is magnetically connected to the frame body through the first magnet.

[0008] In one embodiment, the outer wall of the speaker is flush with the top wall of the main body.

[0009] In one embodiment, the frame panel includes a panel body and a panel support portion connected to the panel body, a plurality of first magnet accommodating portions are arranged at the edge of the panel support portion, a second magnet is arranged in the first magnet accommodating portion, and the first magnet and the second magnet are magnetically attracted to connect the frame panel and the frame body.

[0010] In one embodiment, the headset further includes a peripheral circuit, which is disposed adjacent to the speaker assembly, and the wires of the peripheral circuit pass through the notch to form an electrical connection with the speaker assembly.

[0011] In one embodiment, there are three mounting portions evenly distributed on the annular side wall.

[0012] In one embodiment, the annular side wall is further provided with a structural reinforcement portion connected to the mounting portion.

[0013] In one embodiment, the sponge assembly includes a sponge body and a sponge support body connected to the sponge body, a plurality of second magnet accommodating portions are arranged on the edge of the sponge support body, a third magnet is arranged in the second magnet accommodating portion, and a plurality of fourth magnets forming a ring are arranged on the frame bottom plate. The third magnet and the fourth magnet are magnetically attracted to connect the sponge assembly and the frame bottom plate.

[0014] Beneficial effects of the present application: The present invention provides a headphone, whose frame bottom plate includes a bottom plate body and an annular side wall with a notch protruding from the bottom plate body, the annular side wall is provided with a plurality of mounting portions for mounting wave beads at intervals, and the outer wall of the speaker assembly is provided with a plurality of grooves corresponding to the mounting portions. When the speaker assembly is arranged in the annular side wall, the steel balls of the wave beads abut against the grooves, and the speaker assembly is fixed as a whole by the wave beads. When the speaker assembly needs to be replaced, the speaker assembly can be directly taken out, which is convenient and quick. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the application, the drawings required for use in the description of the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative work, among which: Figure 1 This is a schematic diagram of the three-dimensional structure of an embodiment of the headphone of the present application; Figure 2 for Figure 1 A schematic diagram of a stereoscopic structure of an earmuff portion of a headset from a one-view perspective; Figure 3 for Figure 2 A schematic diagram of the stereoscopic structure of the earmuff portion of the headset from another viewing angle is shown; Figure 4 for Figure 1 A schematic diagram of the exploded structure of the earmuff portion of the headset shown; Figure 5 for Figure 1 A one-view stereoscopic structural diagram of a speaker assembly of a headset is shown; Figure 6 for Figure 5 Another perspective perspective schematic diagram of the speaker assembly shown; Figure 7 for Figure 1 A schematic diagram of a stereoscopic structure of a frame body of the headset from one perspective is shown; Figure 8 for Figure 1 A schematic diagram of a stereoscopic structure of a frame bottom plate of the headset from a one-view perspective is shown; Fig. 9 for Figure 8 Another perspective structural schematic diagram of the frame base plate shown. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other alternative implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0017] Please refer to Figure 1-Figure 9 , Figure 1 This is a schematic diagram of the three-dimensional structure of an embodiment of the headphone of the present application; Figure 2 for Figure 1 A schematic diagram of a stereoscopic structure of an earmuff portion of a headset from a one-view perspective; Figure 3 for Figure 2 A schematic diagram of the stereoscopic structure of the earmuff portion of the headset from another viewing angle is shown; Figure 4 for Figure 1 A schematic diagram of the exploded structure of the earmuff portion of the headset shown; Figure 5 for Figure 1 A one-view stereoscopic structural diagram of a speaker assembly of a headset is shown; Figure 6 for Figure 5 Another perspective perspective schematic diagram of the speaker assembly shown; Figure 7 for Figure 1 A schematic diagram of a stereoscopic structure of a frame body of the headset from one perspective is shown; Figure 8 for Figure 1 A schematic diagram of a stereoscopic structure of a frame bottom plate of the headset from a one-view perspective is shown; Fig. 9 for Figure 8 Another perspective structural diagram of the frame bottom plate is shown. The present application provides a headset, which includes: a top fitting portion 1 and an earmuff portion 2, the top fitting portion 1 is used to fit the user's head; there are two earmuff portions 2, which are respectively connected to the two ends of the top fitting portion 1, the earmuff portion 2 includes an earmuff shell 21, a speaker assembly 22 and a sponge assembly 23, the earmuff shell 21 includes a frame body 211, a frame bottom plate 212 and a frame panel 213, the frame body 211, the frame bottom plate 212 and the frame panel 213 together enclose a accommodating space, the speaker assembly 22 is arranged in the accommodating space, and the sponge assembly 23 is connected to the frame bottom plate 212; The frame bottom plate 212 includes a bottom plate body 2121 and an annular side wall 2122 with a notch 2123 protruding from the bottom plate body 2121. The annular side wall 2122 is provided with a plurality of mounting portions 2124 for mounting wave beads at intervals. The outer wall of the speaker assembly 22 is provided with a plurality of grooves 221 corresponding to the mounting portions 2124. When the speaker assembly 22 is arranged in the annular side wall 2122, the steel ball of the wave beads abuts against the grooves 221. The speaker assembly 22 is fixed as a whole by the wave beads. When the speaker assembly 22 needs to be replaced, the speaker assembly 22 can be directly taken out, which is convenient and quick.

[0018] The ball bearing screw may also be called a ball bearing screw, which includes a main body and a spring and a steel ball at least partially arranged inside the main body. The outer surface of the main body may be provided with knurling.

[0019] Among them, in other embodiments, an adjustment component can also be used to connect the earmuff part 2 and the top of the head fitting part 1 to adjust the head circumference and rotation angle of the headset. The specific structure can refer to the existing technology and will not be described here.

[0020] In one embodiment, the speaker assembly 22 includes a speaker inner wall 222, a speaker outer wall 223, and a speaker side wall 224. The speaker inner wall 222 is provided with a plurality of sound holes 225, the frame bottom plate 212 is provided with openings 226 corresponding to the sound holes 225, and the speaker outer wall 223 and the speaker side wall 224 are respectively provided with one or more through hole groups 227. By providing the through hole group 227 on the speaker assembly 22, the sound effect can be enhanced.

[0021] In one embodiment, the speaker outer wall 223 is provided with two through hole groups 227, which are respectively located at two opposite ends of the speaker outer wall 223; the speaker side wall 224 is provided with two through hole groups 227, which are respectively located at two opposite ends of the speaker side wall 224; the connection line of the through hole groups 227 of the speaker outer wall 223 and the connection line of the through hole groups 227 of the speaker side wall 224 are arranged in a cross. Compared with the through hole groups 227 arranged in a scattered and irregular manner, the sound effect can be greatly enhanced by the cross-arranged through hole groups 227.

[0022] In one embodiment, the frame body 211 includes a body side wall 2111 and a body top wall 2112 connected to the body side wall 2111, the body top wall 2112 is provided with a through hole 2213 to expose the speaker assembly 22, the body top wall 2112 and the speaker outer wall 223 are provided with a plurality of first magnets 2214 forming a ring shape, and the frame panel 213 is magnetically connected to the frame body 211 through the first magnets 2214. Further, the frame panel 213 and the frame body 211 are connected by magnetic attraction, which can make it more convenient to replace the speaker assembly 22 compared to fixed connections such as screws or buckles.

[0023] In one embodiment, the speaker outer wall 223 is flush with the main body top wall 2112. This arrangement can reduce the volume of the entire earmuff portion 2, and the speaker outer wall 223 is flush with the main body top wall 2112, which facilitates the arrangement of the first magnet 2214.

[0024] In one embodiment, the frame panel 213 includes a panel body 2131 and a panel support portion 2132 connected to the panel body 2131, a plurality of first magnet receiving portions 2133 are arranged at the edge of the panel support portion 2132, a second magnet receiving portion 233 is arranged inside the first magnet receiving portion 2133, and the first magnet 2214 is magnetically attracted to the second magnet receiving portion 233 to connect the frame panel 213 and the frame body 211. The arrangement of the panel support portion 2132 can enhance the structural strength of the frame panel 213, and the reasonable and ingenious arrangement of the first magnet receiving portion 2133 between the panel body 2131 and the panel support portion 2132 can form a buffer for the panel body 2131.

[0025] In one embodiment, the headset further includes a peripheral circuit 3 , which is disposed adjacent to the speaker assembly 22 , and the wires of the peripheral circuit 3 pass through the notch 2123 to form an electrical connection with the speaker assembly 22 .

[0026] In one embodiment, there are three mounting portions 2124 evenly distributed on the annular side wall 2122 .

[0027] In one embodiment, the annular side wall 2122 is further provided with a structural reinforcement portion 2125 connected to the mounting portion 2124 .

[0028] In one embodiment, the sponge assembly 23 includes a sponge body and a sponge support body 232 connected to the sponge body 231, a plurality of second magnet accommodating parts 233 are arranged at the edge of the sponge support body 232, a third magnet 234 is arranged in the second magnet accommodating part 233, a plurality of fourth magnets 235 forming a ring are arranged on the frame bottom plate 212, and the third magnet 234 and the fourth magnet 235 are magnetically attracted to connect the sponge assembly 23 and the frame bottom plate 212. Through this magnetic attraction setting mode, the sponge assembly 23 can also be replaced conveniently and quickly.

[0029] Beneficial effects of the present application: The present invention provides a headphone, whose frame bottom plate includes a bottom plate body and an annular side wall with a notch protruding from the bottom plate body, the annular side wall is provided with a plurality of mounting portions for mounting wave beads at intervals, and the outer wall of the speaker assembly is provided with a plurality of grooves corresponding to the mounting portions. When the speaker assembly is arranged in the annular side wall, the steel balls of the wave beads abut against the grooves, and the speaker assembly is fixed as a whole by the wave beads. When the speaker assembly needs to be replaced, the speaker assembly can be directly taken out, which is convenient and quick.

[0030] Finally, it should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0031] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or suggesting their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by this application.

[0032] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly used in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A headset, characterized in that: include: A top fitting portion, used to fit the user's head; There are two earmuffs, which are respectively connected to the two ends of the top of the head fitting part, and the earmuffs include an earmuff shell, a speaker assembly and a sponge assembly. The earmuff shell includes a frame body, a frame bottom plate and a frame panel. The frame body, the frame bottom plate and the frame panel together enclose a receiving space. The speaker assembly is arranged in the receiving space, and the sponge assembly is connected to the frame bottom plate. Among them, the frame bottom plate includes a bottom plate body and an annular side wall with a notch protruding from the bottom plate body, the annular side wall is provided with a plurality of mounting portions for installing wave beads at intervals, the outer wall of the speaker assembly is provided with a plurality of grooves corresponding to the mounting portions, and when the speaker assembly is arranged in the annular side wall, the steel ball of the wave beads abuts against the grooves.

2. The headset according to claim 1, characterized in that: The speaker assembly includes a speaker inner wall, a speaker outer wall and a speaker side wall. The speaker inner wall is provided with a plurality of sound holes, the frame bottom plate is provided with openings corresponding to the sound holes, and the speaker outer wall and the speaker side wall are respectively provided with more than one through hole group.

3. The headset according to claim 2, characterized in that: The outer wall of the speaker is provided with two through hole groups, which are respectively located at the opposite ends of the outer wall of the speaker; the side wall of the speaker is provided with two through hole groups, which are respectively located at the opposite ends of the side wall of the speaker; the connecting line of the through hole groups of the outer wall of the speaker and the connection of the through hole groups of the side wall of the speaker are cross-arranged.

4. The headset according to claim 3, characterized in that: The frame body includes a body side wall and a body top wall connected to the body side wall, the body top wall is provided with a through hole to expose the speaker assembly, the body top wall and the speaker outer wall are provided with a plurality of first magnets forming a ring shape, and the frame panel is magnetically connected to the frame body through the first magnet.

5. The headset according to claim 4, characterized in that: The outer wall of the speaker is flush with the top wall of the main body.

6. The headset according to claim 4, characterized in that: The frame panel includes a panel body and a panel support portion connected to the panel body, a plurality of first magnet accommodating portions are arranged at the edge of the panel support portion, a second magnet is arranged in the first magnet accommodating portion, and the first magnet and the second magnet are magnetically attracted to connect the frame panel and the frame body.

7. The headset according to any one of claims 1 to 6, characterized in that: The headset also includes a peripheral circuit, which is arranged adjacent to the speaker assembly. The wires of the peripheral circuit pass through the gap to form an electrical connection with the speaker assembly.

8. The headset according to any one of claims 1 to 6, characterized in that: There are three mounting parts, which are evenly distributed on the annular side wall.

9. The headset according to any one of claims 1 to 6, characterized in that: The annular side wall is also provided with a structural reinforcement portion connected to the mounting portion.

10. The headset according to any one of claims 1 to 6, characterized in that: The sponge assembly includes a sponge body and a sponge support body connected to the sponge body, a plurality of second magnet accommodating parts are arranged at the edge of the sponge support body, a third magnet is arranged in the second magnet accommodating part, and a plurality of fourth magnets forming a ring are arranged on the frame bottom plate, and the third magnet and the fourth magnet are magnetically attracted to connect the sponge assembly and the frame bottom plate.

Images