A package substrate, a signal optimization method thereof and a related device

Abstract

The application discloses a packaging substrate, a signal optimization method thereof and related equipment, and comprises the following steps: in response to a signal optimization instruction, performing signal quality evaluation on a model of a packaging substrate to obtain a signal quality evaluation result; based on the signal quality evaluation result, determining a signal transmission channel in which the signal quality does not meet a preset requirement as a target signal transmission channel; and setting a first target area of a reference layer adjacent to a target signal via in the target signal transmission channel as a hollowed-out area, so as to increase the impedance of the target signal via by increasing the spacing between the target signal via and the reference layer, optimize the quality of the signal in the target signal transmission channel, and optimize the quality of the signal in the model of the packaging substrate and the packaging substrate manufactured according to the model of the packaging substrate. The target signal via is a signal via that penetrates a core layer of the model of the packaging substrate, and the first target area of the reference layer is an area of the reference layer that covers the target signal via in orthographic projection.

Description

Technical Field

[0001] The present application relates to the technical field of integrated circuit design, and in particular to a packaging substrate, a signal optimization method thereof, and related equipment. Background Art

[0002] The package substrate includes multiple signal transmission channels, which are used to transmit signals between the die and the printed circuit board. These channels are typically composed of signal lines, signal vias, and signal pads. However, due to the different structures of these signal lines, signal vias, and signal pads, the impedances of these signal lines, signal vias, and signal pads within the same signal transmission channel may vary. This results in impedance discontinuity in the signal transmission channel, affecting the quality of the signals transmitted through the signal transmission channel.

[0003] Although when designing a package substrate, the impedance of the signal lines, signal vias, or signal pads in the package substrate model can be adjusted by adjusting basic items such as the material and size of the signal lines, signal vias, or signal pads in the package substrate model to ensure the impedance continuity of each signal transmission channel in the package substrate model, for signal transmission channels that transmit high-frequency signals, the above impedance adjustment method still cannot guarantee the signal quality of the signal transmission channel. Summary of the Invention

[0004] The present application discloses a packaging substrate and a signal optimization method and related equipment thereof, so as to optimize the signal quality of a signal transmission channel in the packaging substrate.

[0005] In a first aspect, the present application discloses a signal optimization method for a packaging substrate, comprising: in response to a signal optimization instruction, performing a signal quality evaluation on a model of the packaging substrate to obtain a signal quality evaluation result; the model of the packaging substrate is a model constructed by simulating the structure of the packaging substrate to be manufactured; the model of the packaging substrate includes a plurality of signal transmission channels, each of the signal transmission channels includes a signal line, a signal via and a signal pad; the signal via is used to realize the electrical connection of the signal lines of different layers, or to realize the electrical connection between the signal line and the signal pad; based on the signal quality evaluation result, a target signal transmission channel among the multiple signal transmission channels is determined; the target signal transmission channel is a target signal transmission channel among the multiple signal transmission channels A signal transmission channel whose signal quality does not meet preset requirements; setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area to increase the impedance of the target signal via by increasing the distance between the target signal via and the reference layer, thereby optimizing the signal quality of the target signal transmission channel and optimizing the signal quality of the packaging substrate made according to the model of the packaging substrate; wherein the target signal via is a signal via that passes through the core layer of the model of the packaging substrate; the reference layer is a conductive layer that is electrically connected to a power supply or ground among multiple conductive layers of the model of the packaging substrate; the first target area of ​​the reference layer is an area in the reference layer whose orthographic projection covers the target signal via.

[0006] In this way, by increasing the distance between the target signal via and the reference layer in the target signal transmission channel, the impedance of the target signal via can be increased, the impedance continuity of the target signal transmission channel can be optimized, and then the signal quality of the target signal transmission channel can be optimized, so that the signal quality of each signal transmission channel in the packaging substrate model and the packaging substrate made according to the model can meet the preset requirements.

[0007] In some embodiments of the present application, setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area includes: performing a hollowing-out evaluation on the first target area of ​​any reference layer adjacent to the target signal via in the target signal transmission channel to obtain a hollowing-out evaluation result; the hollowing-out evaluation result is used to indicate whether setting the first target area of ​​the reference layer as the hollowed-out area affects the signal quality of other signal transmission channels; and based on the hollowing-out evaluation result, determining whether to set the first target area of ​​the reference layer as the hollowed-out area.

[0008] In this way, it is possible to avoid setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed area, thereby preventing the signal quality of other signal transmission channels from being affected.

[0009] In some embodiments of the present application, setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area includes: setting the first target areas of multiple reference layers adjacent to the target signal via in the target signal transmission channel as hollowed-out areas; the multiple reference layers are located on the same side of the target signal via, or the multiple reference layers are respectively located on opposite sides of the target signal via.

[0010] In this way, the hollowing area can be set flexibly to improve the hollowing effect.

[0011] In some embodiments of the present application, setting the first target area of ​​multiple reference layers adjacent to the target signal via in the target signal transmission channel as a hollowed-out area includes: setting the first target area of ​​the reference layer close to the target signal via in the multiple reference layers adjacent to the target signal via in the target signal transmission channel as a hollowed-out area; if the signal quality of the target signal transmission channel still does not meet the preset requirements, setting the first target area of ​​the reference layer far from the target signal via in the multiple reference layers adjacent to the target signal via in the target signal transmission channel as a hollowed-out area.

[0012] In this way, the knockout area can be precisely set according to the quality evaluation results to ensure the signal quality optimization effect.

[0013] In some embodiments of the present application, the method further includes: providing a ground via adjacent to the target signal via in the core layer of the package substrate model.

[0014] In this way, the signal crosstalk between the target signal via and other signal vias can be reduced, the crosstalk value of the target signal transmission channel can be reduced, and the signal quality of the target signal transmission channel can be improved, so that the signal quality of the packaging substrate model and each signal transmission channel in the packaging substrate manufactured according to the model can meet the preset requirements.

[0015] In some embodiments of the present application, after setting a ground via adjacent to the target signal via in the core layer of the packaging substrate model, it also includes: setting the spacing between the target signal via and the ground via to a preset spacing; the preset spacing at least includes a spacing equal to the aperture of the target signal via.

[0016] In this way, the distance between the target signal via and the ground via can be avoided from being too large or too small, which affects the impedance continuity of the target signal transmission channel, and the model of the packaging substrate and the signal quality of each signal transmission channel in the packaging substrate manufactured according to the model can be optimized.

[0017] In some embodiments of the present application, the second target area of ​​the reference layer adjacent to the target signal pad in the target signal transmission channel is set as a hollowed-out area to increase the impedance of the target signal pad by increasing the distance between the target signal pad and the reference layer, thereby optimizing the signal quality of the target signal transmission channel; wherein the target signal pad includes a signal pad for outputting a signal in the target signal transmission channel; the second target area of ​​the reference layer includes an area in the reference layer whose orthographic projection at least partially covers the target signal pad.

[0018] In this way, by increasing the distance between the target signal pad and the reference layer, the impedance of the target signal pad can be increased, the impedance continuity of the target signal transmission channel can be optimized, and the signal quality of the target signal transmission channel can be optimized, so that the signal quality of the packaging substrate model and each signal transmission channel in the packaging substrate made according to the model can meet the preset requirements.

[0019] In a second aspect, the present application further discloses a computer device comprising a memory and a processor; the memory is used to store instructions; the processor is used to execute the signal optimization method for the packaging substrate as described in any one of the above items according to the instructions stored in the memory.

[0020] In a third aspect, the present application further discloses a computer-readable storage medium storing instructions for executing the signal optimization method for a packaging substrate as described in any one of the above items.

[0021] In a fourth aspect, the present application also discloses a packaging substrate, comprising a plurality of conductive layers and a plurality of dielectric layers stacked together, with a dielectric layer between any two conductive layers; each of the conductive layers comprises a signal line, and the signal lines of at least two of the conductive layers are electrically connected through a signal via that passes through the dielectric layer between the two, and the signal lines, the signal vias and the signal pads located on at least one side of the packaging substrate constitute a signal transmission channel; at least one of the signal transmission channels is a signal transmission channel that has been optimized using the signal optimization method described in any of the above items.

[0022] In this way, the signal quality of the signal transmission channel of the packaging substrate can be improved by setting the first target area of ​​the reference layer adjacent to the target signal via in the packaging substrate as a hollowed-out area, and / or setting one or more ground vias around the target signal via, and / or setting the spacing between the target signal via and the ground via to a preset spacing, and / or setting the second target area of ​​the reference layer adjacent to the target signal pad as a hollowed-out area. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0024] Figure 1 This is a schematic diagram of the cross-sectional structure of a chip packaging module disclosed in an embodiment of the present application.

[0025] Figure 2 This is a schematic diagram of the cross-sectional structure of a packaging substrate disclosed in an embodiment of the present application.

[0026] Figure 3 This is a flow chart of a signal optimization method for a packaging substrate disclosed in an embodiment of the present application.

[0027] Figure 4 This is a schematic cross-sectional structure diagram of a model of a packaging substrate disclosed in an embodiment of the present application.

[0028] Figure 5 This is a schematic cross-sectional structure diagram of a model of another packaging substrate disclosed in an embodiment of the present application.

[0029] Figure 6 This is a schematic cross-sectional structure diagram of a model of another packaging substrate disclosed in an embodiment of the present application.

[0030] Figure 7 This is a schematic cross-sectional structure diagram of a model of another packaging substrate disclosed in an embodiment of the present application.

[0031] Figure 8 This is a schematic cross-sectional structure diagram of a model of another packaging substrate disclosed in an embodiment of the present application.

[0032] Figure 9 This is a schematic diagram of the three-dimensional structure of a target signal via and a conductive layer before a hollowed-out area is set, as disclosed in an embodiment of the present application.

[0033] Figure 10 This is a schematic diagram of the three-dimensional structure of a target signal via and a conductive layer after a hollowed-out area is set according to an embodiment of the present application.

[0034] Figure 11 This is a schematic diagram of another three-dimensional structure of a target signal via and a conductive layer after setting a hollowed-out area according to an embodiment of the present application.

[0035] Figure 12 This is a schematic diagram of the via distribution of a core layer disclosed in an embodiment of the present application.

[0036] Figure 13 This is a schematic cross-sectional structure diagram of a model of another packaging substrate disclosed in an embodiment of the present application. DETAILED DESCRIPTION

[0037] The following will describe the technical solutions in the embodiments of this application in conjunction with the accompanying drawings. Based on the embodiments in this application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0038] like Figure 1 As shown, Figure 1 This is a schematic cross-sectional structure diagram of a chip packaging module disclosed in an embodiment of the present application. The chip packaging module includes a packaging substrate 11, a bare chip 12 and a packaging cover 13 located on one side of the packaging substrate 11, and a printed circuit board 14 located on the other side of the packaging substrate 11.

[0039] like Figure 2 As shown, Figure 2 This is a schematic cross-sectional view of a package substrate disclosed in an embodiment of the present application. The package substrate 11 includes multiple conductive layers 111 and multiple dielectric layers 112 stacked together, with a dielectric layer 112 disposed between any two conductive layers 111. The core layer is the dielectric layer located at the core of the package substrate 11.

[0040] Each conductive layer 111 includes a signal line 1110. The signal lines 1110 in any two conductive layers 111 are electrically connected via signal vias 1111 that penetrate the dielectric layer 112 between them. Furthermore, the signal lines 1110, signal vias 1111, and first and second signal pads 113, 114 located on either side of the package substrate 11 form a signal transmission channel between the die 12 and the printed circuit board 14.

[0041] The package substrate 11 includes multiple signal transmission channels, which are used to transmit power signals, ground signals, high-frequency signals, etc. However, because the signal lines 1110 and signal vias 1111 differ in structure from the first signal pads 113 and the second signal pads 114, the impedances of the signal lines 1110 and signal vias 1111 differ from those of the first signal pads 113 and the second signal pads 114. This results in impedance discontinuity in the signal transmission channels, affecting the quality of the signals transmitted through the signal transmission channels.

[0042] It should be noted that impedance continuity means that the impedance of the transmission line in different sections of the electrical transmission path is consistent. Among them, the impedance of the transmission line is related to factors such as the environment in which the transmission line is located, changes in the cross-section of the transmission line, and changes in the direction of the transmission line. For example, changes in the line width and line spacing of the signal line will cause its impedance to change, and changes in the reference layer of the signal line will also cause its impedance to change. Generally speaking, for the same metal transmission medium, the larger the cross-section, the smaller the impedance. In other words, because the cross-section of the signal via and the signal pad is larger than the cross-section of the signal line, the impedance of the signal via and the signal pad is smaller than the impedance of the signal line, resulting in discontinuous impedance of the signal transmission channel. The discontinuous impedance of the signal transmission channel will cause the signal quality to not meet the requirements, for example, causing the signal insertion loss, return loss, crosstalk, etc. to not meet the requirements.

[0043] Based on this, the present application discloses a signal optimization method for a packaging substrate. By performing signal quality evaluation on a model of the packaging substrate, a target signal transmission channel whose signal quality does not meet preset requirements is obtained. Then, by adjusting the structure of the target signal vias and target signal pads in the target signal transmission channel, the impedance of the target signal vias and target signal pads is increased to optimize the signal quality of the target signal transmission channel.

[0044] As an optional implementation of the disclosure of this application, the embodiment of this application discloses a signal optimization method for a packaging substrate, such as Figure 3 As shown, Figure 3 This is a flow chart of a signal optimization method for a package substrate disclosed in an embodiment of the present application, the method comprising:

[0045] S101: In response to a signal optimization instruction, perform signal quality evaluation on a model of a package substrate to obtain a signal quality evaluation result.

[0046] The model of the package substrate is a model constructed by simulating the structure of the package substrate to be manufactured. In other words, the model of the package substrate has the same structure as the package substrate to be manufactured. Figure 2 The package substrate model includes multiple signal transmission channels, each of which includes a signal line 1110, a signal via 1111, and a signal pad. The signal pad includes a first signal pad 113 and a second signal pad 114. The signal pad can be a pad including a solder ball. The signal via 1111 is used to electrically connect signal lines 1110 on different layers, or to electrically connect signal line 1110 to a signal pad, namely, the first signal pad 113 or the second signal pad 114.

[0047] In the embodiment of the present application, the signal quality of the package substrate model can be evaluated by simulating the package substrate model to obtain a signal quality evaluation result of the package substrate model. It is understood that the signal quality evaluation result can also indicate the signal quality of each signal transmission channel of the package substrate to be manufactured.

[0048] S102: Determine a target signal transmission channel among multiple signal transmission channels based on the signal quality evaluation result.

[0049] The target signal transmission channel includes signal transmission channels among the multiple signal transmission channels whose signal quality does not meet the preset requirements. The signal quality evaluation result can indicate which of the multiple signal transmission channels do not meet the preset requirements and which do. Specifically, the signal quality can be characterized by the crosstalk value, insertion loss value, and return loss value of the signal. For example, if the crosstalk value of the signal of any signal transmission channel is better than -30dB, the insertion loss value is better than 1dB, and the return loss value is better than 20dB, then the signal quality of the signal transmission channel meets the preset requirements.

[0050] In some embodiments of the present application, a signal transmission channel whose signal quality does not meet the preset requirements can be set as a target signal transmission channel. Of course, the present application is not limited to this. In other embodiments, a signal transmission channel whose signal quality meets the preset requirements can also be set as a target signal transmission channel to further optimize the signal quality of the signal transmission channel.

[0051] S103: Setting a first target area of ​​the reference layer adjacent to the target signal via hole in the target signal transmission channel as a hollowed area.

[0052] The target signal via comprises a signal via extending through a core layer of the package substrate model. The reference layer comprises a planar conductive structure electrically connected to a power source or ground in multiple conductive layers of the package substrate model. The first target region of the reference layer comprises a region of the reference layer whose orthographic projection at least partially covers the target signal via.

[0053] like Figure 4 As shown, Figure 4 This is a schematic cross-sectional structure diagram of a package substrate model disclosed in an embodiment of the present application. Taking the target signal transmission channel as the signal transmission channel within the dotted box as an example, the first target area of ​​the reference layer adjacent to the target signal via 1111a, such as the third conductive layer 111a arranged from top to bottom, is set as the hollowed-out area A. Alternatively, Figure 5 As shown, Figure 5This is a schematic cross-sectional structure diagram of a model of another packaging substrate disclosed in an embodiment of the present application, in which the first target area of ​​the reference layer adjacent to the target signal via 1111a, such as the sixth conductive layer 111b arranged from top to bottom, is set as the hollowed-out area A.

[0054] Based on this, the impedance of the target signal via such as 1111a can be increased by increasing the distance between the target signal via such as 1111a and the reference layer, for example, increasing the distance between the target signal via such as 1111a and the reference layer from d1 to d2, thereby optimizing the impedance continuity of the target signal transmission channel and optimizing the signal quality of the target signal transmission channel, for example, optimizing the return loss value or insertion loss value of the signal of the target signal transmission channel, thereby ensuring that the package substrate model and the signal quality of each signal transmission channel in the package substrate manufactured according to the model can meet the preset requirements.

[0055] It should be noted that the impedance of signal line 1110, signal via 1111, or signal pad refers to the impedance encountered by signal transmission relative to the reference layer. The greater the distance between signal line 1110, signal via 1111, or signal pad and the reference layer, the greater the impedance of signal line 1110, signal via 1111, or signal pad; the smaller the distance between signal line 1110, signal via 1111, or signal pad and the reference layer, the smaller the impedance of signal line 1110, signal via 1111, or signal pad.

[0056] It should also be noted that because the target signal vias penetrating the core layer are larger than the signal vias penetrating other dielectric layers, adjusting the impedance of the target signal vias is more conducive to adjusting the signal quality of the target signal transmission channel. Of course, in other embodiments, the target signal vias may also include signal vias penetrating other dielectric layers, which will not be further described here.

[0057] It should also be noted that setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed area needs to ensure that the signal quality of other signal transmission channels is not affected. For example, the integrity of the reference layer of other signals needs to be guaranteed.

[0058] In some embodiments of the present application, before setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed area, it is necessary to determine whether the target signal transmission channel has undergone basic impedance optimization, wherein basic impedance optimization is used to optimize the basic items of the signal lines, signal vias, and signal pads in the target signal transmission channel, and the basic items include at least material, size, and spacing. If basic impedance optimization has been performed, the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel is set as a hollowed area; if basic impedance optimization has not been performed, basic impedance optimization is performed.

[0059] In some embodiments of the present application, a knockout assessment can be performed on a first target area of ​​any reference layer adjacent to a target signal via in a target signal transmission channel to obtain a knockout assessment result. The knockout assessment result indicates whether setting the first target area of ​​the reference layer as a knockout area affects the signal quality of other signal transmission channels. Then, based on the knockout assessment result, a determination is made as to whether to set the first target area of ​​the reference layer as a knockout area.

[0060] Taking a packaging substrate with 20 conductive layers as an example, these 20 conductive layers are arranged in sequence from top to bottom, and the core layer is between the 10th conductive layer and the 11th conductive layer. The reference layer in the 9th conductive layer or the 12th conductive layer is first evaluated for the hollowing out of the first target area. If the hollowing out evaluation result indicates that it does not affect the signal quality of other signal transmission channels, the first target area of ​​the reference layer in the 9th conductive layer and / or the 12th conductive layer is set as the hollowing out area; if the hollowing out evaluation result indicates that it affects the signal quality of other signal transmission channels, the reference layer in the 8th conductive layer or the 13th conductive layer is first evaluated for the hollowing out of the first target area, and so on, until a conductive layer in which a hollowing out area can be set is found, or until the evaluation of all conductive layers is completed.

[0061] It should be noted that before performing hollowing evaluation of the first target area on any reference layer, it is necessary to determine whether the reference layer has the first target area, that is, determine whether the reference layer has an area whose orthographic projection covers the orthographic projection of the target signal via.

[0062] In some embodiments of the present application, Figure 4 or Figure 5 As shown, the first target area of ​​a reference layer, such as the third conductive layer 111a, adjacent to the target signal via 1111a in the target signal transmission channel can be set as a hollow area. Of course, the present application is not limited to this. In other embodiments, the first target areas of multiple reference layers adjacent to the target signal via in the target signal transmission channel can also be set as hollow areas. Figure 6 As shown, Figure 6This is a schematic cross-sectional view of another package substrate model disclosed in an embodiment of the present application. A first target region of multiple reference layers adjacent to a target signal via 1111a in a target signal transmission channel, such as a reference layer in the third conductive layer 111a and a reference layer in the sixth conductive layer 111b, can be set as a hollowed region. This allows for flexible hollowing region configuration, improving the hollowing effect.

[0063] Furthermore, in some embodiments of the present application, Figure 6 As shown, the first target area is set as a plurality of reference layers of the hollowed area, such as the reference layer in the third conductive layer 111a and the reference layer in the sixth conductive layer 111b, which can be respectively located on opposite sides of the target signal via hole 1111a. Of course, the present application is not limited to this. In other embodiments, such as Figure 7 As shown, Figure 7 This is a schematic cross-sectional structure diagram of another package substrate model disclosed in an embodiment of the present application. The first target area is set as a plurality of reference layers in the hollowed area, such as the reference layer in the third conductive layer 111a and the reference layer in the second conductive layer 111c, which can be located on the same side of the target signal via such as 1111a. Or, as Figure 8 As shown, Figure 8 This is a schematic cross-sectional structure diagram of a model of another packaging substrate disclosed in an embodiment of the present application. Multiple reference layers, such as the reference layer in the sixth conductive layer 111b and the reference layer in the seventh conductive layer 111d, can be located on the same side of a target signal via, such as 1111a.

[0064] In order to more clearly illustrate the hollowed area, the following is a diagram of the three-dimensional structure of the target signal via and the conductive layer. Figure 9 and Figure 10 As shown, Figure 9 This is a schematic diagram of a three-dimensional structure of a target signal via and a conductive layer before a hollowed-out area is provided, as disclosed in an embodiment of the present application. Figure 10 This is a schematic diagram of the three-dimensional structure of a target signal via and a conductive layer after a hollowed-out area is set according to an embodiment of the present application. The first target area is set as a plurality of reference layers of the hollowed-out area, such as the second conductive layer 111c, the third conductive layer 111a, the sixth conductive layer 111b, and the seventh conductive layer 111d, and the reference layers are respectively located on opposite sides of the target signal via such as 1111a. The shapes of the hollowed-out areas located on opposite sides of the target signal via such as 1111a can be the same, for example, the same as the shape of the target signal via such as 1111a. Figure 11 As shown, Figure 11This is a schematic diagram of the three-dimensional structure of another target signal via and conductive layer after setting a hollowed-out area disclosed in an embodiment of the present application. The first target area is set as multiple reference layers in the hollowed-out area, such as the second conductive layer 111c and the third conductive layer 111a, and the reference layers are only located on one side of the target signal via such as 1111a.

[0065] It should be noted that if Figure 9 As shown, the target signal via is electrically connected to signal lines or signal vias in other conductive layers through a via pad in an adjacent conductive layer. An anti-pad is provided between the via pad and other structures in the same conductive layer to ensure insulation between the via pad and other structures in the same conductive layer. Preferably, the center of the hollowed-out area is the same as the center of the target signal via, and the orthographic projection of the hollowed-out area overlaps and exceeds the orthographic projection of the target signal via, its via pad, and its anti-pad to ensure the hollowing effect.

[0066] In some embodiments of the present application, the first target area of ​​the reference layer close to the target signal via in the target signal transmission channel among the multiple reference layers adjacent to the target signal via in the target signal transmission channel can be set as a hollowed area, and then the signal quality evaluation of the model of the package substrate can be performed. If the signal quality of the target signal transmission channel still does not meet the preset requirements, the first target area of ​​the reference layer far from the target signal via in the multiple reference layers adjacent to the target signal via in the target signal transmission channel can be set as a hollowed area. In this case, the multiple reference layers with hollowed areas are continuously set in the package substrate model. Based on this, the hollowed area can be accurately set according to the quality evaluation results to ensure the signal quality optimization effect.

[0067] Of course, the present application is not limited to this. In other embodiments, the first target areas of multiple reference layers adjacent to the target signal vias in the target signal transmission channel can also be directly set as hollow areas, which will not be repeated here.

[0068] In some embodiments of the present application, before setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollow area, a ground via adjacent to the target signal via may be further set in the core layer of the package substrate model.

[0069] like Figure 12 As shown, Figure 12This is a schematic diagram of the via distribution of a core layer disclosed in an embodiment of the present application. One or more ground vias 1111b can be set around the target signal via 1111a to reduce the signal crosstalk between the target signal via 1111a and other signal vias through the ground vias 1111b, reduce the crosstalk value of the target signal transmission channel, and improve the signal quality of the target signal transmission channel, so that the signal quality of the packaging substrate model and each signal transmission channel in the packaging substrate manufactured according to the model can meet the preset requirements.

[0070] Of course, the present application is not limited to this. In other embodiments, after setting the first target area of ​​the reference layer adjacent to the target signal via in the target signal transmission channel as a hollowed-out area, a ground via adjacent to the target signal via can be set in the core layer of the packaging substrate model. This will not be repeated here.

[0071] In some embodiments of the present application, after a ground via adjacent to a target signal via is provided in the core layer of the package substrate model, as shown in FIG. Figure 12 As shown, the distance D between the target signal via and the ground via can also be set to a preset distance, which at least includes a distance equal to the aperture L of the target signal via, that is, the preset distance is at least equal to the aperture L of the target signal via.

[0072] It is understandable that although the crosstalk between the target signal via and other signal vias can be optimized after setting the ground via adjacent to the target signal via in the core layer of the packaging substrate model, if the spacing between the target signal via and the ground via is too small, the impedance of the target signal via will be too small. If the spacing between the target signal via and the ground via is too large, the impedance of the target signal via will be too large. Therefore, in order to ensure the impedance continuity of the target signal transmission channel, optimize the model of the packaging substrate and the signal quality of each signal transmission channel in the packaging substrate manufactured according to the model, the spacing between the target signal via and the ground via needs to be set to an appropriate spacing.

[0073] In some embodiments of the present application, the second target area of ​​the reference layer adjacent to the target signal pad in the target signal transmission channel can also be set as a hollowed-out area to increase the impedance of the target signal pad by increasing the distance between the target signal pad and the reference layer, thereby optimizing the impedance continuity of the target signal transmission channel and the signal quality of the target signal transmission channel, so that the signal quality of the packaging substrate model and each signal transmission channel in the packaging substrate manufactured according to the model can meet the preset requirements.

[0074] The target signal pad includes a signal pad for outputting a signal in a target signal transmission channel. Specifically, the target signal pad includes a signal pad electrically connected to a printed circuit board in a model of a package substrate. The second target region of the reference layer includes a region of the reference layer whose orthographic projection at least partially covers the target signal pad.

[0075] like Figure 13 As shown, Figure 13 This is a schematic diagram of the cross-sectional structure of a model of another packaging substrate disclosed in an embodiment of the present application. Taking the target signal transmission channel as the signal transmission channel in the dotted box as an example, the second target area of ​​the reference layer adjacent to the target signal pad 114a is set as a hollow area, such as the second target area of ​​the reference layer in the sixth conductive layer 111b is set as a hollow area B.

[0076] Similarly, a knockout evaluation can be performed on the second target area of ​​any reference layer adjacent to a target signal pad in a target signal transmission channel to obtain a knockout evaluation result. The knockout evaluation result indicates whether setting the second target area of ​​the reference layer as a knockout area affects the signal quality of other signal transmission channels. Then, based on the knockout evaluation result, a determination is made as to whether the second target area of ​​the reference layer should be set as a knockout area.

[0077] Taking a packaging substrate with 20 conductive layers as an example, these 20 conductive layers are arranged in sequence from top to bottom, and the conductive layer where the target signal pad is located is the 20th conductive layer. The reference layer in the 19th conductive layer is first evaluated for the hollowing-out area of ​​the second target area. If the hollowing-out evaluation result indicates that it does not affect the signal quality of other signal transmission channels, the second target area of ​​the reference layer in the 19th conductive layer is set as the hollowing-out area; if the hollowing-out evaluation result indicates that it affects the signal quality of other signal transmission channels, the reference layer in the 18th conductive layer is evaluated for the second target area, and so on, until a conductive layer in which a hollowing-out area can be set is found, or until the evaluation of all conductive layers is completed.

[0078] As another optional implementation of the disclosure of this application, the embodiment of this application further discloses a packaging substrate, which is manufactured according to the model of the packaging substrate disclosed in any of the above embodiments. Figure 2 The packaging substrate includes a plurality of conductive layers 111 and a plurality of dielectric layers 112 stacked together, and there is a dielectric layer 112 between any two conductive layers 111 .

[0079] Each conductive layer 111 includes a signal line 1110, and the signal lines 1110 of at least two conductive layers 111 are electrically connected through a signal via 1111 that passes through the dielectric layer 112 therebetween. The signal line 1110, the signal via 1111, and the signal pads located on at least one side of the packaging substrate, such as the first signal pad 113 and the second signal pad 114, constitute a signal transmission channel.

[0080] At least one signal transmission channel is a signal transmission channel optimized using the signal optimization method disclosed in any of the above embodiments. In other words, at least one signal transmission channel has the same structure as the target signal transmission channel of the package substrate model disclosed in any of the above embodiments.

[0081] That is, the first target area of ​​the reference layer adjacent to the target signal via in at least one signal transmission channel is a hollowed area, and / or the target signal via in at least one signal transmission channel is surrounded by one or more ground vias, and / or the spacing between the target signal via and the ground via in at least one signal transmission channel is a preset spacing, and / or the second target area of ​​the reference layer adjacent to the target signal pad in at least one signal transmission channel is a hollowed area. Based on this, the signal quality of at least one signal transmission channel of the package substrate can be improved.

[0082] As another optional implementation of the contents disclosed in the present application, an embodiment of the present application further discloses a computer device, including a memory and a processor; the memory is used to store instructions; the processor is used to execute the signal optimization method of the packaging substrate disclosed in any of the above embodiments according to the instructions stored in the memory.

[0083] As another optional implementation of the contents disclosed in the present application, an embodiment of the present application further discloses a computer-readable storage medium storing instructions for executing the signal optimization method for the packaging substrate disclosed in any of the above embodiments.

[0084] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, the processes of the above-mentioned embodiments of the methods can be included. Any reference to memory, storage, databases, or other media in each embodiment provided in the specification can include non-volatile and / or volatile memory. Non-volatile memory can include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM), or flash memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration but not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDR SDRAM), enhanced SDRAM (ESDRAM), synchronous link (Synchlink) DRAM (SLDRAM), memory bus (Rambus) direct RAM (RDRAM), direct memory bus dynamic RAM (DRDRAM), and memory bus dynamic RAM (RDRAM), etc.

[0085] As another optional implementation of the disclosure, the embodiment of the present application further discloses a computer program product comprising computer program instructions, which, when executed by a processor, cause the processor to perform the signal optimization method of the packaging substrate as disclosed in any of the above embodiments.

[0086] The computer program product can be written in any combination of one or more programming languages to perform the operations of the embodiments of the present application, including object-oriented programming languages, such as Java, C++, etc., and conventional procedural programming languages, such as "C" language or similar programming languages. The program code can be executed entirely on a user computing device, partially on a user device, as an independent software package, partially on a user computing device and partially on a remote computing device, or entirely on a remote computing device or server.

[0087] The technical features of the above embodiments can be combined in any way. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described, but as long as the combinations of the technical features do not exist, they should be considered as the scope of the present disclosure.

[0088] The above embodiments merely represent several implementation methods of this specification. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of this specification, and these modifications and improvements fall within the scope of protection of this specification. Therefore, the scope of protection of the patent in this specification shall be based on the appended claims.

Claims

1. A signal optimization method for a packaging substrate, characterized in that: include: In response to the signal optimization instruction, performing a signal quality evaluation on the model of the package substrate to obtain a signal quality evaluation result; The package substrate model is a model constructed to simulate the structure of the package substrate to be manufactured; the package substrate model includes multiple signal transmission channels, each of which includes a signal line, a signal via, and a signal pad; the signal via is used to achieve electrical connection between the signal lines of different layers, or to achieve electrical connection between the signal line and the signal pad; determining a target signal transmission channel among the multiple signal transmission channels based on the signal quality evaluation result; The target signal transmission channel includes a signal transmission channel whose signal quality does not meet the preset requirement among the multiple signal transmission channels; Setting a first target area of ​​the reference layer adjacent to a target signal via in the target signal transmission channel as a hollowed-out area, thereby increasing the impedance of the target signal via by increasing the distance between the target signal via and the reference layer, thereby optimizing the signal quality of the target signal transmission channel, and thus optimizing the signal quality of the package substrate manufactured according to the package substrate model; Among them, the target signal via includes a signal via that passes through the core layer of the model of the packaging substrate; the reference layer includes a planar conductive structure that is electrically connected to the power supply or ground in multiple conductive layers of the model of the packaging substrate; the first target area of ​​the reference layer includes an area in the reference layer whose orthographic projection at least partially covers the target signal via.

2. The method according to claim 1, characterized in that The step of setting a first target area of ​​the reference layer adjacent to the target signal via hole in the target signal transmission channel as a hollowed area includes: performing a knockout evaluation of a first target area on any reference layer adjacent to a target signal via in the target signal transmission channel to obtain a knockout evaluation result; the knockout evaluation result is used to indicate whether setting the first target area of ​​the reference layer as the knockout area affects signal quality of other signal transmission channels; Based on the hollowing evaluation result, it is determined whether to set the first target area of ​​the reference layer as a hollowing area.

3. The method according to claim 1 or 2, characterized in that The step of setting a first target area of ​​the reference layer adjacent to the target signal via hole in the target signal transmission channel as a hollowed area includes: The first target areas of multiple reference layers adjacent to the target signal via in the target signal transmission channel are set as hollowed-out areas; the multiple reference layers are located on the same side of the target signal via, or the multiple reference layers are located on opposite sides of the target signal via.

4. The method according to claim 3, characterized in that The step of setting the first target areas of the plurality of reference layers adjacent to the target signal vias in the target signal transmission channel as hollow areas comprises: setting a first target area of ​​a reference layer close to a target signal via hole in the target signal transmission channel among a plurality of reference layers adjacent to the target signal via hole as a hollowing area; If the signal quality of the target signal transmission channel still does not meet the preset requirements, a first target area of ​​a reference layer away from the target signal via in multiple reference layers adjacent to the target signal via in the target signal transmission channel is set as a hollowed area.

5. The method according to claim 1, wherein Also includes: A ground via adjacent to the target signal via is provided in the core layer of the package substrate model.

6. The method according to claim 5, characterized in that After providing a ground via adjacent to the target signal via in the core layer of the package substrate model, the method further includes: The distance between the target signal via and the ground via is set to a preset distance; the preset distance at least includes a distance equal to the aperture of the target signal via.

7. The method according to claim 1, characterized in that Also includes: Setting a second target area of ​​the reference layer adjacent to the target signal pad in the target signal transmission channel as a hollowed area, so as to increase the impedance of the target signal pad by increasing the distance between the target signal pad and the reference layer, thereby optimizing the signal quality of the target signal transmission channel; The target signal pad includes a signal pad for outputting a signal in the target signal transmission channel; and the second target area of ​​the reference layer includes an area of ​​the reference layer whose orthographic projection at least partially covers the target signal pad.

8. A computer device, characterized in that: including memory and processor; The memory is used to store instructions; The processor is used to execute the signal optimization method for the packaging substrate according to any one of claims 1 to 7 according to the instructions stored in the memory.

9. A computer-readable storage medium, characterized in that Instructions for executing the signal optimization method for the packaging substrate according to any one of claims 1 to 7 are stored thereon.

10. A packaging substrate, characterized in that: It includes multiple conductive layers and multiple dielectric layers stacked together, with a dielectric layer between any two conductive layers; Each of the conductive layers includes a signal line, and the signal lines of at least two of the conductive layers are electrically connected via a signal via hole penetrating a dielectric layer therebetween, and the signal line, the signal via hole, and a signal pad located on at least one side of the package substrate constitute a signal transmission channel; At least one of the signal transmission channels is a signal transmission channel that has been signal optimized using the signal optimization method according to any one of claims 1 to 7.

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