Biomimetic surface heat dissipation device
By employing a biomimetic surface heat dissipation device in electronic components, and utilizing the design of porous capillary structures and drainage holes, adaptive heat dissipation capacity adjustment under different operating conditions is achieved, solving the heat dissipation problem of electronic components under varying operating conditions on ships, and ensuring a balance between heat dissipation capacity and size.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- CHINA STATE SHIPBUILDING CORP LTD RESEARCH INSTITUTE 719
- Filing Date
- 2024-10-22
- Publication Date
- 2026-05-29
AI Technical Summary
Existing heat dissipation devices for electronic components are difficult to balance the requirements of small size and strong heat dissipation capacity under the changing operating conditions of ships, and are prone to failure, especially under extreme conditions.
A biomimetic surface heat dissipation device is adopted. By setting a cavity and a heat dissipation medium in the cavity within the substrate, and utilizing a porous capillary structure and drainage holes, combined with the porous capillary structure of the heat dissipation component, the heat dissipation medium is made to evaporate on the surface of the heat dissipation component by capillary force, thus carrying away heat. This mimics the heat dissipation principle of human skin and achieves adaptive adjustment of heat dissipation capacity.
It automatically adjusts its heat dissipation capacity under different operating conditions to meet the heat dissipation needs of ships under varying operating conditions, taking into account both the requirements of small size and strong heat dissipation capacity of the heat dissipation device, and adapting to thermal shock under extreme operating conditions.
Smart Images
Figure CN119277730B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of electronic device cooling technology, and in particular to a biomimetic surface heat dissipation device. Background Technology
[0002] Conventional heat dissipation methods for electronic devices include surface fins and air cooling. However, as the power and size of electronic devices increase, and power density increases significantly, the demand for heat exchange technology is also growing. Traditionally, increasing the heat dissipation capacity of heat dissipation devices involves adding fins or heat sinks to increase the heat dissipation area.
[0003] However, in the marine industry, variable operating conditions exist, especially extreme conditions, which can easily lead to thermal shock, significantly impacting electronic components and potentially causing them to fail. Therefore, existing heat dissipation devices cannot meet the heat dissipation requirements of electronic components under variable operating conditions. However, extreme operating conditions account for a relatively small portion of the overall operating time. Designing heat dissipation devices based on extreme conditions would result in large devices that are unsuitable for the space-constrained environment of ships. Therefore, there is an urgent need for an adaptive heat dissipation technology that simultaneously addresses the requirements of small size and high heat dissipation capacity. Summary of the Invention
[0004] This invention provides a biomimetic surface heat dissipation device to solve the problem that the heat dissipation devices of electronic devices in the prior art cannot meet the heat dissipation requirements under the changing operating conditions of ships.
[0005] This invention provides a biomimetic surface heat dissipation device, comprising:
[0006] A substrate having a heat dissipation surface and a cavity disposed inside the substrate, wherein the heat dissipation surface is provided with a plurality of drainage holes and the drainage holes are connected to the cavity;
[0007] A heat dissipation medium, which is contained within the cavity;
[0008] A heat sink has a first end and a second end facing away from each other, the second end being connected to the heat dissipation surface, and the heat sink has a porous capillary structure extending from the second end to the first end.
[0009] The porous capillary structure is connected to the drain hole, and the heat dissipation medium in the cavity can be discharged from the porous capillary structure to the surface of the heat dissipation component under the action of capillary force.
[0010] According to the present invention, in a biomimetic surface heat dissipation device, the pore size of the porous capillary structure gradually increases from the second end to the first end.
[0011] According to the present invention, the porosity of the first end is the porosity under a set permeability, and the porosity of the second end is the porosity under a set capillary force.
[0012] According to the present invention, a biomimetic surface heat dissipation device is provided, wherein the porosity distribution of the heat dissipation component from the first end to the second end is as follows:
[0013] =-( - ) / h×L + ;
[0014] in, The porosity of the first end is... Let L be the porosity of the second end, and L be the distance between any point between the first end and the second end and the second end. Let h be the porosity at a distance L from the second end on the heat sink, and h be the distance between the first end and the second end.
[0015] According to the present invention, a biomimetic surface heat dissipation device is provided, wherein the porous capillary structure is a three-period minimal curved surface structure.
[0016] According to the present invention, a biomimetic surface heat dissipation device is provided, wherein the heat dissipation component is a heat dissipation pin, and a plurality of drainage holes are provided in a one-to-one correspondence with a plurality of heat dissipation pins.
[0017] According to the present invention, a biomimetic surface heat dissipation device is provided, wherein the heat dissipation component is a heat dissipation fin, and the porous capillary structure in the heat dissipation fin is correspondingly arranged with a plurality of drainage holes.
[0018] According to the present invention, a biomimetic surface heat dissipation device is provided on the substrate on the side opposite to the heat dissipation surface, and the groove is used to embed a heat dissipation chip.
[0019] A biomimetic surface heat dissipation device according to the present invention further includes:
[0020] A liquid replenishment device is connected to the cavity and is used to replenish the heat dissipation medium into the cavity.
[0021] The present invention also provides an electronic device, comprising: a heat dissipation chip and any of the above-described biomimetic surface heat dissipation devices, wherein the heat dissipation chip and the substrate are thermally connected.
[0022] The biomimetic surface heat dissipation device provided by this invention comprises a cavity within a substrate, a heat dissipation medium within the cavity, and drainage holes and corresponding heat dissipation components on the heat dissipation surface of the substrate. A porous capillary structure is incorporated within the heat dissipation component. The capillary force generated by the heat dissipation medium within the porous capillary structure facilitates the discharge of the heat dissipation medium from the cavity to the surface of the heat dissipation component, accelerating heat dissipation from the substrate. This heat dissipation device mimics the heat dissipation principle of human skin. Under high heat dissipation demands, skin removes heat through sweating and evaporation, thus providing the substrate with adjustable heat dissipation capacity. This allows the heat dissipation capacity to be adjusted according to changing operating conditions, meeting the heat dissipation requirements of electronic devices under varying operating conditions on ships, thus balancing the need for a small size and high heat dissipation capacity. Attached Figure Description
[0023] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0024] Figure 1 This is a schematic diagram of the structure of the biomimetic surface heat dissipation device provided by the present invention.
[0025] Figure 2 This is a schematic diagram of the internal structure of the heat dissipation component in the biomimetic surface heat dissipation device provided by the present invention.
[0026] Figure 3 This is a schematic diagram of the porous capillary structure in the biomimetic surface heat dissipation device provided by the present invention.
[0027] Figure 4 This is a top view of the biomimetic surface heat dissipation device provided by the present invention.
[0028] Figure label:
[0029] 1. Substrate; 11. Heat dissipation surface; 12. Cavity; 13. Drain hole; 14. Groove; 2. Heat dissipation medium; 3. Heat dissipation component; 31. First end; 32. Second end; 33. Porous capillary structure; 34. Liquid channel; 4. Heat dissipation chip. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this invention. All other embodiments obtained by those skilled in the art based on the embodiments of this invention without creative effort are within the scope of protection of this invention.
[0031] In the description of the embodiments of the present invention, it should be noted that, unless otherwise expressly specified and limited, the terms "first" and "second" are numbered for the purpose of clearly identifying product components and do not represent any substantial difference. The terms "installed," "connected," and "linked" should be interpreted broadly; for example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of the present invention according to the specific circumstances. Furthermore, "multiple" means two or more.
[0032] The following is combined with Figures 1-4 The present invention describes a biomimetic surface heat dissipation device.
[0033] like Figure 1 As shown, the biomimetic surface heat dissipation device provided in this embodiment of the invention includes a substrate 1, a heat dissipation medium 2, and a heat dissipation component 3. The substrate 1 has a heat dissipation surface 11 and a cavity 12 disposed inside the substrate 1. The heat dissipation surface 11 is provided with a plurality of drainage holes 13, which are connected to the cavity 12. The heat dissipation medium 2 is contained within the cavity 12. The heat dissipation component 3 has a first end 31 and a second end 32 facing away from each other. The second end 32 is connected to the heat dissipation surface 11. The heat dissipation component 3 has a porous capillary structure 33 extending from the second end 32 to the first end 31. The porous capillary structure 33 is connected to the drainage holes 13, and the heat dissipation medium 2 in the cavity 12 can be discharged from the porous capillary structure 33 to the surface of the heat dissipation component 3 under the action of capillary force.
[0034] See Figure 1 The intelligent biomimetic surface heat dissipation device provided in this embodiment of the invention is used to dissipate heat for the heat dissipation chip 4 of an electronic device. The substrate 1 is thermally connected to the heat dissipation chip 4. At least one heat dissipation component, such as heat dissipation fins, heat dissipation ribs, or heat dissipation studs, can be disposed on the heat dissipation surface 11. The heat dissipation component 3 can be connected to the heat dissipation surface 11 by welding. The heat dissipation medium 2 is a safe cooling liquid, usually water. The second end 32 of the heat dissipation component 3 is correspondingly disposed with the drain hole 13, so that the drain hole 13 is opposite to the inlet of the porous capillary structure 33, and the porous capillary structure 33 constitutes a liquid channel 34 within the heat dissipation component 3.
[0035] By setting appropriate pore sizes and porosity in the porous capillary structure 33, capillary forces can be generated at the interface between the heat dissipation medium 2 and the substrate 1. Under the action of these capillary forces, the heat dissipation medium 2 enters the heat sink 3 from the cavity 12, and then continues to flow from the second end 32 to the surface of the heat sink 3 under the action of capillary forces. The surface of the heat sink 3 includes the surface of the first end 31 and the peripheral surface connecting the first end 31 and the second end 32.
[0036] Each drain hole 13 can be associated with a heat sink 3, for example, one drain hole 13 can be associated with one heat sink pillar. Of course, multiple drain holes 13 can also be associated with one heat sink 3, for example, multiple drain holes 13 can be associated with one heat sink fin.
[0037] Under normal operating conditions, i.e. when the heat dissipation chip 4 generates relatively little heat, the temperature of the substrate 1 is low. The heat generated by the heat dissipation chip 4 is conducted through the substrate 1 to the heat dissipation surface 11 and the heat dissipation component 3, and the heat is dissipated through the solid part of the heat dissipation surface 11 and the heat dissipation component 3.
[0038] Under extreme high-temperature conditions, i.e., when the heat dissipation chip 4 generates a large amount of heat, the temperature of the substrate 1 rises rapidly and is transferred to the heat sink 3. The temperature of the solid part of the heat sink 3 increases, causing the liquid evaporation rate inside the liquid channel 34 and on the surface of the heat sink 3 to accelerate, thereby carrying away heat. At the same time, mimicking the heat dissipation principle of human skin, after the heat dissipation medium 2 reaches the surface of the heat sink 3, a greater negative pressure is generated due to the liquid evaporation effect. This drives the heat dissipation medium 2 to flow from the cavity 12 through the porous capillary structure 33 to the surface of the heat sink 3, thereby continuously supplying the surface with evaporation and enhancing the surface heat dissipation capacity of the heat dissipation device.
[0039] The biomimetic surface heat dissipation device provided in this embodiment of the invention comprises a cavity 12 within a substrate 1, a heat dissipation medium 2 within the cavity 12, and a drain hole 13 communicating with the cavity 12 and a heat dissipation component 3 corresponding to the drain hole 13 on the heat dissipation surface 11 of the substrate 1. A porous capillary structure 33 is provided within the heat dissipation component 3. The capillary force formed by the heat dissipation medium 2 in the porous capillary structure 33 causes the heat dissipation medium 2 within the cavity 12 to be discharged to the surface of the heat dissipation component 3, accelerating the dissipation of heat from the substrate 1. This heat dissipation device mimics the heat dissipation principle of human skin. Under high heat dissipation demands, the skin removes heat through sweating and sweat evaporation, giving the substrate 1 the function of adjusting its heat dissipation capacity. This allows the heat dissipation capacity to be adjusted according to changes in operating conditions, meeting the heat dissipation requirements of electronic devices under varying operating conditions on ships, thus balancing the requirements of small size and strong heat dissipation capacity.
[0040] In the design of porous capillary structures, two parameters need to be considered: permeability and capillary force. The highly interconnected liquid channels 34 formed by the porous capillary structure 33 within the heat sink 3 have a dual function: supplying heat to the extended phase change interface and transporting the liquid-gas two-phase flow. On the one hand, for the spontaneous liquid absorption process of evaporation, a high capillary force is required, and a smaller pore size can provide a greater capillary force. On the other hand, during capillary-driven evaporation, the porous capillary structure 33 replenishes the heat dissipation medium 2 to the surface of the heat sink 3 through capillary force. Simultaneously, vapor escapes along the porous capillary structure 33 from the second end 32 towards the surface of the heat sink. During the transport of the liquid-gas two-phase flow from the second end 32 to the surface of the heat sink 3, a high permeability is required, i.e., a low resistance is needed. In this case, a larger pore size is beneficial for liquid permeation and transport.
[0041] In this regard, such as Figure 2 As shown in the embodiment of the present invention, the pore size of the porous capillary structure 33 near the second end 32 of the heat sink 3 is larger than the pore size of the porous capillary structure 33 near the first end 31 of the heat sink 3. This ensures that the capillary force is large enough to automatically draw in liquid and replenish the first end 31 of the heat sink 3, while also ensuring that the heat dissipation medium 2 flows smoothly from the second end 32 to the first end 31 through the porous capillary structure 33.
[0042] In some alternative embodiments, see Figure 2 The pore size of the porous capillary structure 33 gradually increases from the second end 32 to the first end 31. For example, the pore size of the porous capillary structure 33 increases uniformly or in a gradient from the second end 32 to the first end 31.
[0043] To further ensure sufficient capillary force for automatic liquid absorption and replenishment at the first end 31 of the heat sink 3, and to ensure the smooth flow of the heat dissipation medium 2 from the second end 32 to the first end 31 through the porous capillary structure 33, considering that the liquid-gas two-phase flow in the evaporation process mainly occurs at the first end 31 of the heat sink 3, and the self-absorption process mainly occurs at the second end 32 of the heat sink 3, and that capillary force and permeability are directly related to porosity, in this embodiment of the invention, the porosity of the first end 31 is the porosity under a set permeability, and the porosity of the second end 32 is the porosity under a set capillary force. The set permeability and set capillary force can be given according to actual needs.
[0044] The porosity distribution of the heat sink 3 from the first end 31 to the second end 32 is as follows:
[0045] =-( - ) / h×L + (1)
[0046] In equation (1) The porosity of the first end 31 is... Let L be the porosity of the second end 32, and L be the distance between any position between the first end 31 and the second end 32 and the second end 32. Let h be the porosity at a distance L from the second end 32 on the heat sink 3, and h be the distance between the first end 31 and the second end 32.
[0047] According to Darcy's law, the relationship between permeability and porosity is as follows:
[0048] (2)
[0049] In equation (2), K is the permeability. It is the average aperture. It is the average porosity. The porosity under a set permeability can be obtained according to equation (2).
[0050] The relationship between capillary force and porosity is as follows:
[0051] (3)
[0052] In equation (3) It's penetration rate. It is the dynamic viscosity of heat dissipation medium 2. Where is porosity, K is permeability, h is the length from the first end 31 to the second end 32 of the heat sink 3, and dh / dt is the capillary rise velocity, which can be given according to requirements. The porosity under the set capillary force can be obtained according to equation (3).
[0053] In this embodiment of the invention, the heat generated by the heat dissipation chip 4 is transferred to the substrate 1, then to the solid portion of the heat sink 3, and finally to the heat dissipation medium 2 through the channels inside the heat sink 3, causing the heat dissipation medium 2 to evaporate and carry away the heat. During this process, to improve the heat dissipation capacity of the heat sink 3, the heat exchange area of the channels inside the heat sink 3 needs to be greatly increased. However, with traditional porous media, increasing the heat exchange area increases the flow resistance of the liquid, affecting evaporation.
[0054] In this regard, such as Figure 3 As shown, in this embodiment of the invention, the porous capillary structure is configured as a three-period minimal surface structure, and the mathematical expression based on the implicit function of this structure is:
[0055] + + -C(4)
[0056] In equation (4) The structural parameters represent the shape of the channels within the heat sink 3. C represents the porosity parameter that controls the overall size of the voids in the heat sink 3. The porosity corresponding to different porosity parameters is statistically analyzed. The relationship between porosity and pore parameters is obtained as C=f( ).
[0057] An initial model of the heat sink 3 is constructed based on the aforementioned implicit function mathematical expression, selected structural parameters, and void parameters. In this initial model, the minimum curvature of any surface is zero, and there are no flow inflection points, resulting in low resistance to fluid flow. Moreover, the initial model has a large specific surface area, which greatly increases the heat exchange area and significantly improves the heat dissipation efficiency of the heat sink 3, while reducing the resistance to upward flow of the liquid.
[0058] In some alternative embodiments, the heat sink 3 can also be a heat sink fin, with the porous capillary structure 33 in the heat sink fin corresponding to a plurality of drain holes 13.
[0059] like Figure 4 As shown, in some optional embodiments, the heat sink 3 is a heat sink pin, with multiple drain holes 13 corresponding one-to-one with multiple heat sink pins. The heat sink pins can increase the heat dissipation area of the heat dissipation device and can turbulent the airflow through the heat dissipation device, increasing the contact area and contact time between the air and the surface of the heat dissipation device, thereby improving heat dissipation efficiency. For the same volume, heat sink pins have a stronger heat dissipation capacity than heat dissipation fins.
[0060] In practice, different heat sinks 3 can be combined and arranged on the heat dissipation surface 11 according to the different heat dissipation amounts in different areas of the electronic device. That is, different heat sinks 3 can be arranged in different areas of the heat dissipation surface 11. For example, heat dissipation fins can be arranged in areas with low heat dissipation and heat dissipation pins can be arranged in areas with high heat dissipation. This can make the heat dissipation of the entire electronic device more uniform and reduce thermal stress.
[0061] Based on the above embodiment, a groove 14 is provided on the side of the substrate 1 opposite to the heat dissipation surface 11. The groove 14 is used to embed the heat dissipation chip 4. By embedding the heat dissipation chip 4 in the groove 14 of the substrate 1, the contact area between the heat dissipation chip 4 and the substrate 1 can be increased, thereby improving the heat dissipation efficiency.
[0062] Based on the above embodiments, the intelligent biomimetic surface heat dissipation device provided in this embodiment of the invention further includes a liquid replenishment device (not shown in the figure). The liquid replenishment device is connected to the cavity 12 and is used to replenish the heat dissipation medium into the cavity 12. Specifically, the substrate 1 is provided with a liquid inlet, which is connected to the liquid replenishment device through a pipe. The liquid replenishment device can replenish the heat dissipation medium 2 to the cavity 12 in a timely manner to ensure the normal function of the heat dissipation device.
[0063] This invention also provides an electronic device. The electronic device includes a heat dissipation chip 4 and the intelligent biomimetic surface heat dissipation device described in any of the above embodiments. The heat dissipation chip 4 and the substrate 1 are thermally connected. The heat dissipation chip 4 can be thermally connected to the substrate 1 by being embedded in a groove 14 of the substrate 1. Alternatively, the heat dissipation chip 4 can be thermally connected to the substrate 1 by means of thermally conductive adhesive, thermally conductive pad, soldering, or snap-fitting; this embodiment does not specifically limit the specific method used.
[0064] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A biomimetic surface heat dissipation device, characterized in that, include: A substrate having a heat dissipation surface and a cavity disposed inside the substrate, wherein the heat dissipation surface is provided with a plurality of drainage holes and the drainage holes are connected to the cavity; A heat dissipation medium, which is contained within the cavity; A heat sink has a first end and a second end facing away from each other, the second end being connected to a heat dissipation surface, and a porous capillary structure extending from the second end to the first end within the heat sink; the porous capillary structure connects the first end and the surface of the heat sink, the surface of the heat sink including the surface of the first end and the peripheral surface connecting the first end and the second end. The porous capillary structure is connected to the drain hole, and the heat dissipation medium in the cavity can be discharged from the porous capillary structure to the surface of the heat dissipation component under the action of capillary force.
2. The biomimetic surface heat dissipation device according to claim 1, characterized in that, The pore size of the porous capillary structure gradually increases from the second end to the first end.
3. The biomimetic surface heat dissipation device according to claim 2, characterized in that, The porosity of the first end is the porosity under a set permeability, and the porosity of the second end is the porosity under a set capillary force.
4. The biomimetic surface heat dissipation device according to claim 3, characterized in that, The porosity distribution of the heat sink from the first end to the second end is as follows: x L =-(ξ2-ξ1) / h×L+ξ1; Where ξ1 is the porosity of the first end, ξ2 is the porosity of the second end, and L is the distance between any position between the first end and the second end and the second end. L Let h be the porosity at a distance L from the second end on the heat sink, and h be the distance between the first end and the second end.
5. The biomimetic surface heat dissipation device according to claim 1, characterized in that, The porous capillary structure is a three-period minimal surface structure.
6. The biomimetic surface heat dissipation device according to claim 1, characterized in that, The heat sink is a heat sink pin, and a plurality of drainage holes are provided in a one-to-one correspondence with a plurality of heat sink pins.
7. The biomimetic surface heat dissipation device according to claim 1, characterized in that, The heat sink is a heat sink fin, and the porous capillary structure in the heat sink fin is correspondingly arranged with a plurality of drainage holes.
8. The biomimetic surface heat dissipation device according to claim 1, characterized in that, A groove is provided on the side of the substrate opposite to the heat dissipation surface, and the groove is used to embed the heat dissipation chip.
9. The biomimetic surface heat dissipation device according to claim 1, characterized in that, Also includes: A liquid replenishment device is connected to the cavity and is used to replenish the heat dissipation medium into the cavity.
10. An electronic device, characterized in that, include: The heat dissipation chip and the biomimetic surface heat dissipation device as described in any one of claims 1-9, wherein the heat dissipation chip and the substrate are thermally connected.