A diode lead processing device

Abstract

The present invention belongs to the technical field of diode processing, and in particular to a processing device for diode leads, comprising a base, a support ring is installed at the inner bottom wall of the base, a material discharge seat is arranged on the top of the base, a plurality of material discharge seats are arranged, a driving part is installed at the bottom of the material discharge seat, the driving part is used for rotating the material discharge seat, a support rod is installed at the inner wall of the base, an adjusting piece 1 is installed on the surface of the support rod, and the adjusting piece 1 is used for cutting the workpiece at the material discharge seat; the present invention uses automated processing and precise servo motor control, and the device can efficiently complete the cutting and polishing of diode leads, and the combined use of the servo motor and the hydraulic cylinder ensures the precise movement of the cutting blade and the accurate control of the cutting depth, thereby improving the processing accuracy, and at the same time, the automated operation process reduces manual intervention and significantly improves the processing efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of diode processing, and in particular to a processing device for diode leads. Background Art

[0002] In the diode manufacturing industry, lead processing is a crucial link, which directly affects the performance, reliability and quality of the final product of the diode. Traditional diode lead processing usually relies on manual operation or semi-automatic equipment. These methods have many shortcomings, such as low processing efficiency, difficult to ensure accuracy, poor working environment and great safety hazards. Although the diode lead processing equipment currently available on the market has achieved automated processing to a certain extent, it still faces many technical bottlenecks. First, during the cutting and polishing process, traditional equipment often has difficulty in meeting high standards for processing accuracy due to inaccurate mechanical structure or delayed response of the control system, which affects the final quality of the product. Secondly, the debris generated by these equipment during the processing process often needs to be manually cleaned, which not only increases the labor intensity, but also easily causes safety hazards and environmental pollution problems. In addition, traditional equipment often ignores the convenience of operation and maintenance in design and manufacturing, which makes the equipment in practical applications There are many inconveniences. Summary of the invention

[0003] In order to solve the above problems, the present invention provides a diode lead processing device to more accurately solve the problems raised in the above background technology.

[0004] The present invention is achieved through the following technical solutions:

[0005] The present invention proposes a processing device for diode leads, comprising a base, a support ring is installed at the inner bottom wall of the base, a material discharge seat is arranged on the top of the base, and a plurality of material discharge seats are arranged, a driving part is installed at the bottom of the material discharge seat, and the driving part is used for rotating the material discharge seat, a support rod is installed at the inner wall of the base, an adjusting piece 1 is installed on the surface of the support rod, and the adjusting piece 1 is used for cutting the workpiece at the material discharge seat, an adjusting piece 2 is installed on the surface of the support rod relative to the other side of the adjusting piece 1, a removing part is installed at the adjusting piece 2, and the removing part is used for polishing the cut material, a notch 2 is opened at the support ring, and the notch 2 is used for the material discharge seat to tilt inward, and a notch 1 is opened at the base, and the notch 1 is used for the material discharge seat to tilt outward.

[0006] Preferably, a support plate 1 and a support plate 2 are installed on the surface of the support rod, the support plate 1 is used to support the adjustment member 1, and the support plate 2 is used to support the adjustment member 2.

[0007] Preferably, the adjusting member 1 includes a mounting plate 1 installed at a place on the supporting plate, a servo motor 1 is mounted on the surface of the mounting plate 1, a threaded rod 1 is mounted on the output end of the servo motor 1, a threaded seat is threadedly connected to the surface of the threaded rod 1, a hydraulic cylinder is mounted at the threaded seat, a mounting strip is mounted at the bottom of the hydraulic cylinder, a cutting blade is mounted at the bottom of the mounting strip, and the cutting blade is used for cutting the workpiece.

[0008] Preferably, the second adjusting member includes a second mounting plate installed at a second support plate, a second servo motor is installed at the second mounting plate, a second threaded rod is threadedly connected to the surface of the second servo motor, a removal portion is provided at the second threaded rod, and the removal portion is used to grind the end of the workpiece after cutting at the discharge seat.

[0009] Preferably, the removal portion includes a fixing plate threadedly connected to the threaded rod at two locations, a rotating motor is installed on the side of the fixing plate, a grinding head is installed at the output end of the rotating motor, and the grinding head is inserted into the discharge seat to contact the end of the workpiece.

[0010] Preferably, the driving part includes a transmission motor installed on the surface of the support ring, a gear is installed on the output end of the transmission motor, a rotating plate is installed at the bottom of the discharge seat, the bottom of the rotating plate is rotatably connected to a rotating seat via a rotating shaft, a rotating ring is installed at the bottom of the rotating seat, the surface of the rotating ring is rotatably connected to the base via a bearing, a gear ring is installed on the inner wall of the rotating ring, and the gear ring is meshingly connected to the gear.

[0011] Preferably, the support plate has a material extraction portion at one place, and the material extraction portion is used to collect the debris after grinding in the discharge seat.

[0012] Preferably, the material extraction part includes a material storage box installed on a support plate, a material extraction pump is installed on the top of the support plate, a material guide pipe is installed between the material storage box and the material storage box, a material extraction pipe is installed at the bottom of the material extraction pump, a material extraction hopper is installed at the bottom of the material extraction pipe, and the material extraction hopper is arranged on the top of the material discharge seat.

[0013] Preferably, a plug hole is provided on the surface of the material discharging seat, and the plug hole is used for inserting the workpiece. A cutting opening is provided on the top of the material discharging seat, and the cutting opening is used for inserting cutting blades at different positions. A scale bar is installed on the top of the material discharging seat, and the scale bar is used for measuring the distance.

[0014] Preferably, a discharge pipe is installed on the surface of the material storage box, and a valve is installed at the discharge pipe.

[0015] Compared with the prior art, the present invention provides a diode lead processing device, which has the following beneficial effects:

[0016] The diode lead processing equipment can efficiently complete the cutting and polishing of diode leads through automated processing and precise servo motor control. The combined use of the servo motor and the hydraulic cylinder ensures the precise movement of the cutting blade and the accurate control of the cutting depth, thereby improving the processing accuracy. At the same time, the automated operation process reduces manual intervention and significantly improves processing efficiency.

[0017] The diode lead processing equipment can automatically collect and clean the debris generated during the processing through the built-in extraction part of the equipment, keeping the working environment clean and tidy. This not only improves the working environment of the workers, but also reduces the manual labor and time costs required for cleaning the debris. In addition, the automated operation process also reduces the physical burden of the workers and improves the working comfort.

[0018] The diode lead processing equipment can operate in a stable state through precise mechanical structure and electrical control, reducing safety accidents caused by mechanical failure or operational errors. At the same time, each component of the equipment adopts high-quality materials and manufacturing technology to ensure the durability and long-term stability of the equipment.

[0019] The diode lead processing equipment achieves precise control of the workpiece processing position and depth through precise scale bar and cutting port design. This precise control enables each workpiece to obtain consistent processing results during the processing, thereby improving the quality and consistency of the product. In addition, the addition of the polishing process further improves the surface quality of the workpiece and enhances the overall quality of the product. These advantages make the equipment have broad application prospects and market demand in the field of diode lead processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A schematic diagram of the structure of a diode lead processing device proposed by the present invention from a first perspective;

[0021] Figure 2 A schematic diagram of the structure of a diode lead processing device proposed by the present invention from a second viewing angle;

[0022] Figure 3 A top-sectional view of the structure of a diode lead processing device proposed by the present invention;

[0023] Figure 4 A front cross-sectional view of the structure of a diode lead processing device proposed by the present invention;

[0024] Figure 5 A schematic diagram of the structure of an adjusting component 1 of a diode lead processing device proposed by the present invention;

[0025] Figure 6A schematic diagram of the structure of a material extraction part of a diode lead processing device proposed by the present invention;

[0026] Figure 7 A diode lead processing device proposed by the present invention Figure 4 A magnified schematic diagram of area A in the middle.

[0027] In the figure: 1, base; 11, notch 1; 2, support ring; 21, notch 2; 3, discharge seat; 31, plug hole; 32, cutting opening; 33, scale bar; 34, rotating plate; 35, rotating seat; 36, rotating ring; 4, support rod; 41, support plate 1; 42, support plate 2; 43, slide; 5, adjustment piece 1; 51, mounting plate 1; 52, servo motor 1; 53, threaded rod 1; 54, threaded seat; 55, hydraulic cylinder; 56. Mounting strip; 57. Cutting blade; 6. Second adjusting piece; 61. Second mounting piece; 62. Second servo motor; 63. Second threaded rod; 7. Removal part; 71. Fixing plate; 72. Rotating motor; 73. Grinding head; 8. Extraction part; 81. Storage box; 811. Discharge pipe; 82. Extraction pump; 83. Material guide pipe; 84. Extraction pipe; 85. Extraction hopper; 9. Driving part; 91. Transmission motor; 92. Gear; 93. Gear ring. DETAILED DESCRIPTION

[0028] In order to more clearly and completely illustrate the technical solution of the present invention, the present invention is further described below in conjunction with the accompanying drawings.

[0029] Example

[0030] like Figure 1-Figure 7 As shown, a diode lead processing device proposed by an embodiment of the present invention includes a base 1, a support ring 2 is installed at the inner bottom wall of the base 1, a discharge seat 3 is arranged on the top of the base 1, and a plurality of discharge seats 3 are arranged. A driving part 9 is installed at the bottom of the discharge seat 3, and the driving part 9 is used for rotating the discharge seat 3. A support rod 4 is installed on the inner wall of the base 1, and an adjusting member 5 is installed on the surface of the support rod 4. The adjusting member 5 is used for cutting the workpiece at the discharge seat 3. An adjusting member 2 6 is installed on the surface of the support rod 4 relative to the other side of the adjusting member 1 5. A removing part 7 is installed at the adjusting member 2 6, and the removing part 7 is used for polishing the cut material. A notch 2 21 is opened at the support ring 2, and the notch 21 is used for the discharge seat 3 to tilt inward. A notch 11 is opened at the base 1, and the notch 11 is used for the discharge seat 3 to tilt outward.

[0031] In the present invention, the base 1 serves as the basic support of the equipment, and a support ring 2 is fixedly installed on the inner bottom wall thereof. A plurality of discharge seats 3 are arranged on the top of the base 1, and a driving part 9 is installed at the bottom of each discharge seat 3, and the rotation of the discharge seat 3 is realized by the driving part 9. A support rod 4 is installed on the inner wall of the base 1, and an adjusting member 1 5 and an adjusting member 2 6 are respectively installed on the support rod 4. The former is used for cutting the workpiece, and the latter is equipped with a removing part 7 for polishing. The notch 21 opened on the support ring 2 allows the discharge seat 3 to tilt inward, while the notch 11 on the base 1 allows the discharge seat 3 to tilt outward, which is convenient for processing the processed workpiece. The equipment realizes the automated processing of the diode leads, including two main steps of cutting and polishing. Through the rotation of the driving part 9, the workpiece can be evenly processed on the discharge seat 3, and the notch design facilitates the dumping and collection of the workpiece, thereby improving the work efficiency.

[0032] Among them, a diode lead processing equipment includes a base 1, a support ring 2 is installed at the inner bottom wall of the base 1, a discharge seat 3 is arranged on the top of the base 1, and multiple discharge seats 3 are arranged. A driving part 9 is installed at the bottom of the discharge seat 3, and the driving part 9 is used for rotating the discharge seat 3. A support rod 4 is installed on the inner wall of the base 1, and an adjusting member 5 is installed on the surface of the support rod 4. The adjusting member 5 is used for cutting the workpiece at the discharge seat 3. An adjusting member 2 6 is installed on the surface of the support rod 4 relative to the other side of the adjusting member 5. A removing part 7 is installed at the adjusting member 2 6, and the removing part 7 is used for polishing the cut material. A notch 21 is opened at the support ring 2, and the notch 21 is used for the discharge seat 3 to tilt inward. A notch 11 is opened at the base 1, and the notch 11 is used for the discharge seat 3 to tilt outward. A support plate 41 and a support plate 2 42 are installed on the surface of the support rod 4, and the support plate 41 is used to support the adjusting member 5, and the support plate 2 42 is used to support the adjusting member 2 6.

[0033] In the present invention, support plate 1 41 and support plate 2 42 are respectively installed on the support rod 4. Support plate 1 41 is used to support adjusting member 1 5 to ensure its stable operation, and support plate 2 42 is used to support adjusting member 2 6, that is, the fixed part of the removal part 7. The design of support plate 1 41 and support plate 2 42 enhances the stability of adjusting member 1 5 and adjusting member 2 6 and reduces vibration and displacement during operation.

[0034] Among them, a diode lead processing device includes a base 1, a support ring 2 is installed at the inner bottom wall of the base 1, a discharge seat 3 is arranged on the top of the base 1, and a plurality of discharge seats 3 are arranged. A driving part 9 is installed at the bottom of the discharge seat 3, and the driving part 9 is used for rotating the discharge seat 3. A support rod 4 is installed on the inner wall of the base 1, and an adjusting member 5 is installed on the surface of the support rod 4. The adjusting member 5 is used for cutting the workpiece at the discharge seat 3. An adjusting member 2 6 is installed on the surface of the support rod 4 relative to the other side of the adjusting member 5. A removing part 7 is installed at the adjusting member 2 6, and the removing part 7 is used for polishing the cut material. The support ring 2 is A notch 21 is provided, and the notch 21 is used for the material discharging seat 3 to tilt inward. A notch 11 is provided at the base 1, and the notch 11 is used for the material discharging seat 3 to tilt outward. The adjusting member 5 includes a mounting plate 51 installed at the supporting plate 41, and a servo motor 52 is installed on the surface of the mounting plate 51, and a threaded rod 53 is installed at the output end of the servo motor 52. A threaded seat 54 is threadedly connected to the surface of the threaded rod 53, and a hydraulic cylinder 55 is installed at the threaded seat 54, and a mounting strip 56 is installed at the bottom of the hydraulic cylinder 55, and a cutting blade 57 is installed at the bottom of the mounting strip 56, and the cutting blade 57 is used for cutting the workpiece.

[0035] In the present invention, the adjusting member 5 is fixed on the supporting plate 41 through the mounting plate 51, and a servo motor 52 is installed on the mounting plate 51, and the output end of the servo motor 52 is connected to the threaded rod 53. The threaded seat 54 on the threaded rod 53 can move up and down through a threaded connection. A hydraulic cylinder 55 is installed at the bottom of the threaded seat 54. The extension and retraction of the hydraulic cylinder 55 drives the mounting bar 56 and the cutting blade 57 to cut the workpiece. The combination of the servo motor 52 and the hydraulic cylinder 55 realizes the precise control and depth adjustment of the cutting blade 57, ensuring the accuracy and efficiency of the cutting.

[0036] Among them, a diode lead processing device includes a base 1, a support ring 2 is installed at the inner bottom wall of the base 1, a discharge seat 3 is arranged on the top of the base 1, and a plurality of discharge seats 3 are arranged. A driving part 9 is installed at the bottom of the discharge seat 3, and the driving part 9 is used for rotating the discharge seat 3. A support rod 4 is installed on the inner wall of the base 1, and an adjusting member 5 is installed on the surface of the support rod 4. The adjusting member 5 is used for cutting the workpiece at the discharge seat 3. The surface of the support rod 4 is opposite to the other side of the adjusting member 5. The adjusting member 6 is installed at the adjusting member 6 to remove Part 7, the removal part 7 is used for polishing the material after cutting, a notch 21 is provided at the support ring 2, the notch 21 is used for the material discharge seat 3 to tilt inward, a notch 11 is provided at the base 1, the notch 11 is used for the material discharge seat 3 to tilt outward, the adjustment member 6 includes a mounting piece 61 installed at the support plate 42, a servo motor 62 is installed at the mounting piece 61, a threaded rod 63 is threadedly connected to the surface of the servo motor 62, a removal part 7 is provided at the threaded rod 63, and the removal part 7 is used for grinding the end of the workpiece after cutting at the material discharge seat 3.

[0037] In the present invention, the adjusting member 6 is fixed on the supporting plate 42 through the mounting plate 61, and a servo motor 62 is mounted on the mounting plate 61, whose output end is connected to the threaded rod 63, and a removing portion 7 is mounted on the threaded rod 63. The position is adjusted by the drive of the servo motor 62. The precise control of the servo motor 62 enables the removing portion 7 to accurately grind the end of the workpiece after cutting, thereby improving the polishing effect.

[0038] Among them, a diode lead processing device includes a base 1, a support ring 2 is installed at the inner bottom wall of the base 1, a discharge seat 3 is arranged on the top of the base 1, and a plurality of discharge seats 3 are arranged. A driving part 9 is installed at the bottom of the discharge seat 3, and the driving part 9 is used for rotating the discharge seat 3. A support rod 4 is installed on the inner wall of the base 1, and an adjusting member 5 is installed on the surface of the support rod 4. The adjusting member 5 is used for cutting the workpiece at the discharge seat 3. The surface of the support rod 4 is opposite to the other side of the adjusting member 5. The adjusting member 6 is installed. A removal part 7 is installed at the second section 6, and the removal part 7 is used for polishing the cut material. A notch 21 is opened at the support ring 2, and the notch 21 is used for the material discharge seat 3 to tilt inward. A notch 11 is opened at the base 1, and the notch 11 is used for the material discharge seat 3 to tilt outward. The removal part 7 includes a fixed plate 71 threadedly connected to the threaded rod 2 at 63, and a rotating motor 72 is installed on the side of the fixed plate 71. A grinding head 73 is installed at the output end of the rotating motor 72, and the grinding head 73 is inserted into the material discharge seat 3 and contacts with the end of the workpiece.

[0039] In the present invention, the removal part 7 includes a fixed plate 71 threadedly connected to the threaded rod 63, and a rotating motor 72 is installed on the side of the fixed plate 71, and its output end is connected to a grinding head 73. The grinding head 73 is inserted into the discharge seat 3 and contacts with the end of the workpiece to achieve polishing. The rotating motor 72 drives the grinding head 73 to rotate at a high speed, effectively removing burrs and unevenness at the end of the workpiece, thereby improving product quality.

[0040] Among them, a diode lead processing device includes a base 1, a support ring 2 is installed at the inner bottom wall of the base 1, a discharge seat 3 is arranged on the top of the base 1, and a plurality of discharge seats 3 are arranged. A driving part 9 is installed at the bottom of the discharge seat 3, and the driving part 9 is used for rotating the discharge seat 3. A support rod 4 is installed on the inner wall of the base 1, and an adjusting member 5 is installed on the surface of the support rod 4. The adjusting member 5 is used for cutting the workpiece at the discharge seat 3. An adjusting member 2 6 is installed on the surface of the support rod 4 relative to the other side of the adjusting member 5. A removing part 7 is installed at the adjusting member 2 6, and the removing part 7 is used for polishing the cut material. The support ring 2 is opened A notch 21 is provided, and the notch 21 is used for the discharge seat 3 to tilt inward. A notch 11 is provided at the base 1, and the notch 11 is used for the discharge seat 3 to tilt outward. The driving part 9 includes a transmission motor 91 installed on the surface of the support ring 2, and a gear 92 is installed at the output end of the transmission motor 91. A rotating piece 34 is installed at the bottom of the discharge seat 3, and the bottom of the rotating piece 34 is rotatably connected to a rotating seat 35 through a rotating shaft. A rotating ring 36 is installed at the bottom of the rotating seat 35. The surface of the rotating ring 36 is rotatably connected to the base 1 through a bearing, and a gear ring 93 is installed on the inner wall of the rotating ring 36. The gear ring 93 and the gear 92 are meshed and connected.

[0041] In the present invention, the driving part 9 includes a transmission motor 91 installed on the support ring 2, and its output end is connected to the gear 92. The bottom of the discharge seat 3 is connected to the base 1 through the rotating plate 34, the rotating seat 35 and the rotating ring 36. The gear ring 93 is installed on the inner wall of the rotating ring 36. The gear ring 93 is meshed with the gear 92. The transmission motor 91 drives the gear 92 to rotate, thereby driving the discharge seat 3 to rotate. The transmission motor 91 is driven by the meshing transmission of the gear 92 and the gear ring 93, thereby realizing the smooth rotation of the discharge seat 3, so that the workpiece can be evenly cut and polished, thereby improving the processing quality and efficiency.

[0042] Among them, a diode lead processing device includes a base 1, a support ring 2 is installed at the inner bottom wall of the base 1, a discharge seat 3 is arranged on the top of the base 1, and a plurality of discharge seats 3 are arranged. A driving part 9 is installed at the bottom of the discharge seat 3, and the driving part 9 is used to rotate the discharge seat 3. A support rod 4 is installed on the inner wall of the base 1, and an adjusting member 5 is installed on the surface of the support rod 4. The adjusting member 5 is used to cut the workpiece at the discharge seat 3. An adjusting member 2 6 is installed on the surface of the support rod 4 relative to the other side of the adjusting member 5. A removing part 7 is installed at the adjusting member 2 6, and the removing part 7 is used to polish the cut material. A notch 21 is opened at the support ring 2, and the notch 21 A notch 11 is provided at the base 1 for tilting the discharge seat 3 inward, and the notch 11 is used for tilting the discharge seat 3 outward. A drawing portion 8 is provided at the support plate 41, and the drawing portion 8 is used for collecting the debris after grinding in the discharge seat 3. The drawing portion 8 includes a storage box 81 installed at the support plate 41, a drawing pump 82 is installed on the top of the support plate 41, a material guide pipe 83 is installed between the storage box 81 and the storage box 81, a drawing pipe 84 is installed at the bottom of the drawing pump 82, a drawing hopper 85 is installed at the bottom of the drawing pipe 84, and the drawing hopper 85 is arranged on the top of the discharge seat 3, a discharge pipe 811 is installed on the surface of the storage box 81, and a valve is installed at the discharge pipe 811.

[0043] In the present invention, a storage box 81 is installed at the support plate 41 to collect the debris generated during the processing. A pump 82 is installed on the top of the support plate 41. The pump 82 is connected to the storage box 81 through a guide pipe 83. The bottom of the pump 82 is connected to a pump pipe 84. A hopper 85 is installed at the bottom of the pump pipe 84. The hopper 85 is arranged on the top of the discharge seat 3 and directly aligned with the processing area. The suction part 8 uses the suction force of the pump 82 to suck the debris generated during the grinding process in the discharge seat 3 into the hopper 85, and then sends it into the storage box 81 through the guide pipe 83, so as to realize the automatic collection and cleaning of the debris and keep the working environment clean. A discharge pipe 811 is installed on the surface of the storage box 81. A valve is installed at the outlet of the discharge pipe 811 to control the discharge of the debris. When the debris in the storage box 81 accumulates to a certain extent, the valve can be opened to discharge the debris through the discharge pipe 811, which is convenient for subsequent cleaning and processing. The valve setting makes the discharge process more convenient and controllable.

[0044] Among them, a diode lead processing device includes a base 1, a support ring 2 is installed at the inner bottom wall of the base 1, a discharge seat 3 is arranged on the top of the base 1, and a plurality of discharge seats 3 are arranged. A driving part 9 is installed at the bottom of the discharge seat 3, and the driving part 9 is used for rotating the discharge seat 3. A support rod 4 is installed on the inner wall of the base 1, and an adjusting member 5 is installed on the surface of the support rod 4. The adjusting member 5 is used for cutting the workpiece at the discharge seat 3. The surface of the support rod 4 is opposite to the other side of the adjusting member 5. An adjusting member 2 6 is installed at the adjusting member 2 6. A removal portion 7 is provided, which is used for polishing the material after cutting. A notch 21 is provided at the support ring 2, and the notch 21 is used for the material discharge seat 3 to tilt inward. A notch 11 is provided at the base 1, and the notch 11 is used for the material discharge seat 3 to tilt outward. A plug hole 31 is provided on the surface of the material discharge seat 3, and the plug hole 31 is used for inserting the workpiece. A cutting opening 32 is provided on the top of the material discharge seat 3, and the cutting opening 32 is used for inserting the cutting blade 57 at different positions. A scale bar 33 is installed on the top of the material discharge seat 3, and the scale bar 33 is used for measuring the distance.

[0045] In the present invention, a plurality of insertion holes 31 are provided on the surface of the material discharging seat 3 for inserting the diode leads or other workpieces to be processed, a cutting opening 32 is provided on the top of the material discharging seat 3, and the design of the cutting opening 32 allows the cutting blades 57 at different positions to be inserted so as to realize cutting at different positions of the workpiece, a scale bar 33 is also installed on the top of the material discharging seat 3, and the scale bar 33 is used to accurately measure and locate the insertion depth of the workpiece or the cutting position, the design of the insertion hole 31 enables the workpiece to be firmly placed on the material discharging seat 3 to avoid movement or offset during the processing, and the coordinated use of the cutting opening 32 and the scale bar 33 realizes the precise control of the cutting position and depth of the workpiece, thereby improving the processing accuracy and consistency.

[0046] Finally, it should be noted that the basic concepts have been described above. Obviously, for those skilled in the art, the above detailed disclosure is only an example and does not constitute a limitation of this specification. Although it is not explicitly stated here, those skilled in the art may make various modifications, improvements and corrections to this specification. Such modifications, improvements and corrections are suggested in this specification, so such modifications, improvements and corrections still belong to the spirit and scope of the exemplary embodiments of this specification. At the same time, this specification uses specific words to describe the embodiments of this specification. For example, "one embodiment", "one embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of this specification. Therefore, it should be emphasized and noted that "one embodiment" or "one embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, certain features, structures or characteristics in one or more embodiments of this specification can be appropriately combined. In addition, unless explicitly stated in the claims, the order of processing elements and sequences described in this specification, the use of alphanumeric characters, or the use of other names are not used to limit the order of the processes and methods of this specification.

[0047] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A diode lead processing device, comprising a base (1), characterized in that: A support ring (2) is installed on the inner bottom wall of the base (1); a material discharge seat (3) is arranged on the top of the base (1); a plurality of material discharge seats (3) are arranged; a driving part (9) is installed on the bottom of the material discharge seat (3); the driving part (9) is used for rotating the material discharge seat (3); a support rod (4) is installed on the inner wall of the base (1); an adjusting member (5) is installed on the surface of the support rod (4); the adjusting member (5) is used for cutting a workpiece at the material discharge seat (3); the surface of the support rod (4) is relative to the adjusting member The other side of the first (5) is provided with an adjusting member 2 (6), the adjusting member 2 (6) is provided with a removal portion (7), the removal portion (7) is used for polishing the cut material, the support ring (2) is provided with a notch 2 (21), the notch 2 (21) is used for the material discharge seat (3) to tilt inward, the base (1) is provided with a notch 1 (11), the notch 1 (11) is used for the material discharge seat (3) to tilt outward, the surface of the support rod (4) is provided with a support plate 1 (41) and a support plate 2 (42), the support plate 1 (4 1) used for supporting an adjusting member 1 (5), the supporting plate 2 (42) is used for supporting an adjusting member 2 (6), the adjusting member 1 (5) comprises a mounting plate 1 (51) mounted on the supporting plate 1 (41), a servo motor 1 (52) is mounted on the surface of the mounting plate 1 (51), a threaded rod 1 (53) is mounted on the output end of the servo motor 1 (52), a threaded seat (54) is threadedly connected to the surface of the threaded rod 1 (53), a hydraulic cylinder (55) is mounted on the threaded seat (54), and the hydraulic cylinder (55) A mounting strip (56) is installed at the bottom, a cutting blade (57) is installed at the bottom of the mounting strip (56), and the cutting blade (57) is used to cut the workpiece; a plug hole (31) is provided on the surface of the material discharging seat (3), and the plug hole (31) is used to insert the workpiece; a cutting opening (32) is provided on the top of the material discharging seat (3), and the cutting opening (32) is used to insert the cutting blade (57) at different positions; a scale bar (33) is installed on the top of the material discharging seat (3), and the scale bar (33) is used to measure the distance.

2. The diode lead processing equipment according to claim 1, characterized in that: The second adjusting member (6) comprises a second mounting plate (61) mounted on the second supporting plate (42), a second servo motor (62) being mounted on the second mounting plate (61), a second threaded rod (63) being threadedly connected to the surface of the second servo motor (62), a removal portion (7) being arranged on the second threaded rod (63), and the removal portion (7) being used for grinding the end of the workpiece after cutting at the discharge seat (3).

3. The diode lead processing equipment according to claim 2, characterized in that: The removing portion (7) comprises a fixing plate (71) threadedly connected to the second threaded rod (63); a rotating motor (72) is installed on the side of the fixing plate (71); a grinding head (73) is installed at the output end of the rotating motor (72); and the grinding head (73) is inserted into the discharge seat (3) to contact the end of the workpiece.

4. The diode lead processing equipment according to claim 1, characterized in that: The driving part (9) comprises a transmission motor (91) mounted on the surface of the support ring (2), a gear (92) being mounted on the output end of the transmission motor (91), a rotating plate (34) being mounted on the bottom of the material discharging seat (3), the bottom of the rotating plate (34) being rotatably connected to a rotating seat (35) via a rotating shaft, a rotating ring (36) being mounted on the bottom of the rotating seat (35), the surface of the rotating ring (36) being rotatably connected to the base (1) via a bearing, a toothed ring (93) being mounted on the inner wall of the rotating ring (36), the toothed ring (93) being meshingly connected to the gear (92).

5. The diode lead processing equipment according to claim 1, characterized in that: The support plate (41) is provided with a material extraction portion (8), and the material extraction portion (8) is used to collect the debris after grinding in the discharge seat (3).

6. The diode lead processing equipment according to claim 5, characterized in that: The material extraction part (8) comprises a material storage box (81) installed at the support plate (41), a material extraction pump (82) is installed on the top of the support plate (41), a material guide pipe (83) is installed between the material storage box (81) and the material storage box (81), a material extraction pipe (84) is installed at the bottom of the material extraction pump (82), and a material extraction hopper (85) is installed at the bottom of the material extraction pipe (84), and the material extraction hopper (85) is arranged on the top of the material discharge seat (3).

7. The diode lead processing equipment according to claim 6, characterized in that: A discharge pipe (811) is installed on the surface of the material storage box (81), and a valve is installed at the discharge pipe (811).

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