A hollow micro gaming computer host with efficient heat dissipation

Abstract

The present invention relates to the technical field of computer hosts, and specifically to a hollow-type micro-game computer host with high efficiency in heat dissipation, comprising a main frame, both ends of the main frame are equipped with side mounting structures for connecting wire harnesses, one side of the main frame is an open structure, the inner wall of the main frame is slidably connected with an active box, the outer wall of the active box is provided with heat dissipation holes, and the inner wall of the active box is fixedly connected with a reciprocating drive structure perpendicular to the active box. The present invention adopts a piston-like structure, which not only increases the air intake and ensures stable air intake, but also increases the internal space during heat dissipation, which promotes the circulation of internal air. Even if the internal integration is high and the components and the mainboard occupy almost all the space, the heat dissipation effect of all internal components can be guaranteed, and the noise of the heat dissipation method is lower than the noise generated by the air sliding through the fan when the fan rotates.

Description

Technical Field

[0001] The present invention relates to the technical field of computer hosts, and in particular to a hollow micro gaming computer host with high-efficiency heat dissipation. Background Art

[0002] The so-called microcomputer is a mini version of an ordinary PC, with the internal chips and structures reduced or deleted. It is also called a "thin client". With the current popularity of computers and people's demand for compact computers, major manufacturers have developed their own microcomputers, which are very portable. However, the internal accessories of the mini computer host chassis are very compact, and components such as hard drives and memory sticks are integrated on the motherboard, which generates concentrated heat. Even if a cooling fan is added, the heat dissipation effect is still not ideal. The host will generate serious heat after running for a long time, which is easy to affect the computer's operating speed and reduce the service life of the host. This needs to be improved.

[0003] The prior art discloses a mini computer host with an authorization announcement number of CN115268603B. In order to solve the problem of heat dissipation, the CPU arranged on the front of the mainboard generates the most heat, and the heat dissipation component mainly dissipates heat for the CPU, so the heat dissipation component is arranged on the front side of the mainboard to ensure the heat dissipation efficiency. The hard disk has a smaller power and generates less heat, and is arranged on the back side of the mainboard to reduce the heat generated by the CPU from being transferred to the hard disk.

[0004] However, when it is in use, it mainly relies on the cooling fan for heat dissipation. When the cooling fan is used for heat dissipation, there are the following problems. First, the internal components of the mini computer are relatively full, the air flow is poor, and the air intake is difficult to increase. In addition, to have a higher heat dissipation efficiency, a high-power motor is required to drive the fan, but the heat dissipation efficiency brought by the higher-power motor is smaller, and the heat generated by the higher-power motor itself will affect the heat dissipation effect, and the noise will also be huge. Summary of the invention

[0005] In order to solve the problems in the background technology, the present invention proposes a hollow micro gaming computer host with high efficiency in heat dissipation.

[0006] In order to achieve the above object, the present invention adopts the following technical solutions:

[0007] A hollow micro-game computer host with high-efficiency heat dissipation comprises a main frame, both ends of the main frame are equipped with side mounting structures for connecting a wiring harness, one side of the main frame is an open structure, the inner wall of the main frame is slidably connected to an active box, the outer wall of the active box is provided with heat dissipation holes, the inner wall of the active box is fixedly connected to a reciprocating drive structure perpendicular to the active box, the end of the reciprocating drive structure away from the active box is fixedly connected to the inner wall of the main frame, the inner wall of the active box is fixedly connected to a one-way air guide structure, the one-way air guide structure wraps the heat dissipation holes, one side outer wall of the active box is fixedly connected to a heat dissipation structure, one end of the heat dissipation structure is connected to the outside of the main frame when the active box slides in a direction away from the main frame, and the other side of the active box is provided with a heat dissipation slot.

[0008] Preferably, the heat dissipation slot hole includes a first heat dissipation slot and three second heat dissipation slots, the first heat dissipation slot is located above the second heat dissipation slot, a third heat dissipation slot is provided on a side of the movable box away from the heat dissipation slot hole, the first heat dissipation slot is flush with the third heat dissipation slot, and the three second heat dissipation slots are flush with each other.

[0009] Preferably, the heat dissipation structure includes a heat conducting plate, which is mounted on the CPU via mounting ears; an air guide duct is fixedly connected to the top of the heat conducting plate, one end of the air guide duct is fixedly connected to a bellows, and when the movable box slides in a direction away from the main frame, the end of the bellows away from the heat conducting plate is connected to the outside of the main frame via a third heat dissipation groove; a plurality of heat pipes are fixedly connected to the top of the heat conducting plate, a plurality of heat fins are fixedly connected to the outside of the heat pipes, and the heat fins are located on the inner side of the air guide duct.

[0010] Preferably, a plurality of oblique channels are fixedly connected to the inner side of the movable box, and the oblique channels are communicated with the ends of the corresponding first heat dissipation slots and the second heat dissipation slots.

[0011] Preferably, the one-way air guide structure includes a mounting frame and an insulation shell, the mounting frame is fixedly connected to the inner wall of the movable box, there is a gap between the insulation shell and the mounting frame, an annular strip is fixedly connected to the inner side of the insulation shell, an elastic sealing ring is fixedly connected to the side of the mounting frame close to the insulation shell, the outer wall of the elastic sealing ring is in contact with the outer wall of the annular strip, and the insulation shell is fixedly connected to the inner wall of the movable box via the mounting strip.

[0012] Preferably, the inner wall of the heat-insulating shell is fixedly connected to a driving motor, and the output shaft of the driving motor is fixedly connected to a connecting rod.

[0013] Preferably, the reciprocating drive structure includes a mounting seat, one end of the mounting seat is fixedly connected to a sleeve, the inner wall of the sleeve is slidably connected to a slip ring, the middle part of the slip ring is threadedly connected to a threaded rod, both ends of the threaded rod are rotatably connected to the sleeve, one end of the threaded rod passes through the mounting seat and extends to the interior of the mounting seat, the ends of the connecting rod and the threaded rod are fixedly connected to helical gears, the connecting rod is transmission-connected to the threaded rod through meshing helical gears, the end of the slip ring is fixedly connected to a limit strip, the end of the limit strip away from the slip ring is fixedly connected to a mounting block, and the mounting block is fixedly connected to the inner wall of the main frame.

[0014] Preferably, a plurality of sealing strips are fixedly connected to the outer wall of the movable box.

[0015] Compared with the existing technology, the present invention has the following beneficial effects:

[0016] The present invention adopts a piston-like structure, which not only increases the air intake and ensures stable air intake, but also increases the internal space during heat dissipation, which promotes the circulation of internal air. Even if the internal integration is high and the components and the mainboard occupy almost all the space, the heat dissipation effect of all internal components can be guaranteed. Overall, the noise of this heat dissipation method is lower than the noise generated by the air sliding through when the fan rotates. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the present invention;

[0018] Figure 2 It is a three-dimensional structural schematic diagram of the present invention in another direction;

[0019] Figure 3 It is a schematic cross-sectional view of the structure of the present invention;

[0020] Figure 4 It is a three-dimensional structural schematic diagram of the activity box of the present invention;

[0021] Figure 5 It is a schematic diagram of the three-dimensional structure of the movable box of the present invention in another direction;

[0022] Figure 6 It is a schematic diagram of the internal structure of the heat dissipation structure of the present invention;

[0023] Figure 7 is a structural cross-sectional view of the reciprocating drive structure of the present invention;

[0024] Figure 8 The present invention Figure 7 A schematic diagram of the enlarged structure at point A in the middle.

[0025] In the figure: 1. main frame; 2. side mounting structure; 3. movable box; 4. heat dissipation hole; 5. driving motor; 6. one-way air guide structure; 7. reciprocating driving structure; 8. heat dissipation structure; 9. heat dissipation slot hole; 10. first heat dissipation slot; 11. second heat dissipation slot; 12. sealing strip; 13. third heat dissipation slot; 14. oblique channel; 15. heat conduction plate; 16. air guide duct; 17. heat pipe; 18. heat dissipation fin; 19. bellows; 20. mounting frame; 21. heat insulation shell; 22. annular strip; 23. elastic sealing ring; 24. connecting rod; 25. bevel gear; 26. mounting seat; 27. sleeve; 28. slip ring; 29. ​​threaded rod; 30. limit strip; 31. mounting block. DETAILED DESCRIPTION

[0026] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.

[0027] In the description of the present invention, it is necessary to understand that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside" and "outside" etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0028] Reference Figure 1 - Figure 8 , a hollow-type micro-game computer host with high-efficiency heat dissipation, comprising a main frame 1, both ends of the main frame 1 are equipped with side mounting structures 2 for connecting a wiring harness, one side of the main frame 1 is an open structure, the inner wall of the main frame 1 is slidably connected with an active box 3, the outer wall of the active box 3 is provided with a hollow heat dissipation hole 4, the inner wall of the active box 3 is fixedly connected with a reciprocating drive structure 7 perpendicular to the active box 3, the reciprocating drive structure 7 is fixedly connected to the inner wall of the main frame 1 at one end away from the active box 3, the inner wall of the active box 3 is fixedly connected with a one-way air guide structure 6, the one-way air guide structure 6 wraps the heat dissipation hole 4, a heat dissipation structure 8 is fixedly connected to the outer wall of one side of the active box 3, one end of the heat dissipation structure 8 is connected to the outside of the main frame 1 when the active box 3 slides in a direction away from the main frame 1, a heat dissipation slot 9 is provided on the other side of the active box 3, a plurality of sealing strips 12 are fixedly connected to the outer wall of the active box 3, the heat dissipation slot 9 is opened on the side, and will be stored when not in use, which can be well dustproof.

[0029] The present invention discloses a heat dissipation method for a mini computer. When dissipating heat, the reciprocating driving structure 7 is driven to make the movable box 3 slide reciprocatingly and linearly along the inner wall of the main frame 1. When the movable box 3 slides in a direction away from the main frame 1, the space between the main frame 1 and the movable box 3 increases, and the heat dissipation slots 9 and the ends of the heat dissipation structure 8 on the outside of the movable box 3 are also exposed. External gas quickly flows in from the heat dissipation structure 8 and the heat dissipation slots 9. The high-speed airflow flowing through the heat dissipation structure 8 will quickly cool down the CPU. The airflow flowing in from the heat dissipation slots 9 will cool down the main board and other components inside the main frame 1. Under the action of the two airflows, The air inside the main frame 1 is stirred evenly to ensure the overall heat dissipation effect. When the movable box 3 is driven by the reciprocating drive structure 7 to shrink toward the inside of the main frame 1, the hot air inside is discharged again, and the heat is dissipated in this cycle. Since the present invention adopts a piston-like structure, it not only increases the air intake volume and ensures the stability of the air intake, but also increases the internal space during heat dissipation, which promotes the circulation of internal air. Even if the internal integration is high and the components and the mainboard occupy almost all the space, the heat dissipation effect of all internal components can be guaranteed. Compared with the noise generated by the air sliding through the fan when the fan rotates, the noise of this heat dissipation method is also lower.

[0030] Preferably, the heat dissipation slot hole 9 includes a first heat dissipation slot 10 and three second heat dissipation slots 11, the first heat dissipation slot 10 is located above the second heat dissipation slot 11, and a third heat dissipation slot 13 is provided on the side of the movable box 3 away from the heat dissipation slot hole 9, the first heat dissipation slot 10 is flush with the third heat dissipation slot 13, and the three second heat dissipation slots 11 are flush, and a plurality of inclined channels 14 are fixedly connected to the inner side of the movable box 3, and the inclined channels 14 are connected to the ends of the corresponding first heat dissipation slot 10 and the second heat dissipation slot 11. As a preferred embodiment of the present invention, the interiors of the first heat dissipation slot 10, the second heat dissipation slot 11 and the third heat dissipation slot 13 can also adopt a one-way air intake structure to prevent the hot air flow from being discharged from the air intake hole.

[0031] Among them, the first heat dissipation groove 10, the second heat dissipation groove 11 and the third heat dissipation groove 13 are arranged so that when the movable box 3 extends out of the main frame 1 to inhale air, the third heat dissipation groove 13 and the first heat dissipation groove 10 will first inhale air. Since the air intake cross-sectional area is small, the air intake flow rate will increase, so that the main internal parts can be quickly cooled. As the movable box 3 rises, the airflow blown out of the first heat dissipation groove 10 will also change position under the guidance of the inclined channel 14, so that the main board inside the main frame 1 can be evenly cooled. As the movable box 3 continues to extend, the second heat dissipation groove 11 is also exposed to the air intake, the air intake cross-sectional area increases, and the flow rate decreases, which is more conducive to the mixed circulation of cold and hot air gases inside the main frame 1, and the large-area inclined channel 14 blowing can have a better heat dissipation effect on the main board inside the main frame 1.

[0032] Preferably, the heat dissipation structure 8 includes a heat conducting plate 15, which is mounted on the CPU through a mounting ear. An air duct 16 is fixedly connected to the top of the heat conducting plate 15, and one end of the air duct 16 is fixedly connected to a bellows 19. When the movable box 3 slides in a direction away from the main frame 1, the end of the bellows 19 away from the heat conducting plate 15 is connected to the outside of the main frame 1 through a third heat dissipation groove 13. A plurality of heat pipes 17 are fixedly connected to the top of the heat conducting plate 15, and a plurality of heat fins 18 are fixedly connected to the outside of the heat pipes 17. The heat fins 18 are located on the inner side of the air duct 16, and one end of the air duct 16 is in an upwardly bent state, so as to promote air circulation and mixing inside the main frame 1 during air intake.

[0033] The heat conducting plate 15 directly contacts the CPU for heat conduction, and the heat is dissipated to the heat dissipation fins 18 through the heat pipes 17. The cold air flow flowing through the air guide duct 16 at high speed takes away the heat, thereby having a strong heat dissipation effect.

[0034] Preferably, the one-way air guide structure 6 includes a mounting frame 20 and an insulation shell 21, the mounting frame 20 is fixedly connected to the inner wall of the movable box 3, there is a gap between the insulation shell 21 and the mounting frame 20, an annular strip 22 is fixedly connected to the inner side of the insulation shell 21, an elastic sealing ring 23 is fixedly connected to the side of the mounting frame 20 close to the insulation shell 21, the outer wall of the elastic sealing ring 23 contacts the outer wall of the annular strip 22, the insulation shell 21 is fixedly connected to the inner wall of the movable box 3 through the arranged mounting strip, the inner wall of the insulation shell 21 is fixedly connected to the driving motor 5, and the output shaft of the driving motor 5 is fixedly connected to the connecting rod 24.

[0035] The setting of the heat insulating shell 21 prevents the heat emitted by the driving motor 5 during operation from being directly discharged into the interior of the main frame 1. In addition, due to the setting of the heat insulating shell 21, when inhaling, the elastic sealing ring 23 will seal tightly against the annular strip 22, and when exhausting, the gas will push open the elastic sealing ring 23, so that the air flow can be discharged from between the elastic sealing ring 23 and the annular strip 22, thereby realizing one-way exhaust, and with side air intake and front exhaust, the air inlet and the exhaust port are isolated to prevent the exhausted hot air from being inhaled again, thereby ensuring that the heat dissipation effect is maximized.

[0036] Preferably, the reciprocating drive structure 7 includes a mounting seat 26, one end of which is fixedly connected to a sleeve 27, an inner wall of the sleeve 27 is slidably connected to a slip ring 28, a middle part of the slip ring 28 is threadedly connected to a threaded rod 29, both ends of the threaded rod 29 are rotatably connected to the sleeve 27, one end of the threaded rod 29 passes through the mounting seat 26 and extends to the interior of the mounting seat 26, ends of the connecting rod 24 and the threaded rod 29 are fixedly connected to a bevel gear 25, the connecting rod 24 is transmission-connected to the threaded rod 29 through the meshing bevel gears 25, the end of the slip ring 28 is fixedly connected to a limit strip 30, the end of the limit strip 30 away from the slip ring 28 is fixedly connected to a mounting block 31, and the mounting block 31 is fixedly connected to the inner wall of the main frame 1.

[0037] The drive motor 5 drives the threaded rod 29 to rotate under transmission, wherein the threaded rod 29 can be a bidirectional screw, and the threaded rod 29 always rotates in one direction. After the slip ring 28 moves to the end of the threaded rod 29, the internal teeth slide into the thread groove on the other side, thereby realizing the reciprocating motion of the slip ring 28; the threaded rod 29 can also be a normal unidirectional screw, and the drive motor 5 is a forward and reverse motor controlled by a PLC. After the threaded rod 29 drives the slip ring 28 to move to one end, the drive motor 5 immediately controls the reverse rotation, and then drives the slip ring 28 to move in the reverse direction. Each implementation method is acceptable as long as the reciprocating motion of the slip ring 28 can be realized.

[0038] Working principle: When dissipating heat, the reciprocating driving structure 7 drives the movable box 3 to slide back and forth along the inner wall of the main frame 1. When the movable box 3 slides in a direction away from the main frame 1, the space between the main frame 1 and the movable box 3 increases, and the heat dissipation slots 9 and the ends of the heat dissipation structure 8 on the outside of the movable box 3 are also exposed. The external gas quickly flows in from the heat dissipation structure 8 and the heat dissipation slots 9. The high-speed airflow flowing through the heat dissipation structure 8 will quickly cool down the CPU. The airflow flowing in from the heat dissipation slots 9 will cool down the main board and other components inside the main frame 1. Under the action of the two airflows, the heat inside the main frame 1 is cooled. The air inside is stirred evenly, thereby ensuring the overall heat dissipation effect. When the movable box 3 is driven by the reciprocating drive structure 7 to shrink toward the inside of the main frame 1, the hot air inside is discharged again, and the heat is dissipated in this cycle. Since the present invention adopts a piston-like structure, it not only increases the air intake volume and ensures the stability of the air intake, but also increases the internal space during heat dissipation, which will promote the circulation of internal air. Even if the internal integration is high and the components and the mainboard occupy almost all the space, the heat dissipation effect of all internal components can be guaranteed. Compared with the noise generated by the air sliding through the fan when the fan rotates, the noise of this heat dissipation method is also lower.

[0039] It is further explained that the above-mentioned fixed connection should be understood in a broad sense unless otherwise clearly specified and limited. For example, it can be welding, gluing, or one-piece molding, etc., which are conventional means well known to those skilled in the art.

[0040] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A hollow micro gaming computer host with high efficiency heat dissipation, comprising a main frame (1), both ends of the main frame (1) are equipped with side mounting structures (2) for connecting a wiring harness, characterized in that: One side of the main frame (1) is an open structure, the inner wall of the main frame (1) is slidably connected to a movable box (3), the outer wall of the movable box (3) is provided with a heat dissipation hole (4), the inner wall of the movable box (3) is fixedly connected to a reciprocating drive structure (7) perpendicular to the movable box (3), one end of the reciprocating drive structure (7) away from the movable box (3) is fixedly connected to the inner wall of the main frame (1), the inner wall of the movable box (3) is fixedly connected to a one-way air guide structure (6), the one-way air guide structure (6) wraps the heat dissipation hole (4), one side of the outer wall of the movable box (3) is fixedly connected to a heat dissipation structure (8), one end of the heat dissipation structure (8) is connected to the outside of the main frame (1) when the movable box (3) slides in a direction away from the main frame (1), and the other side of the movable box (3) is provided with a heat dissipation slot hole (9); The heat dissipation slot hole (9) comprises a first heat dissipation slot (10) and three second heat dissipation slots (11); the first heat dissipation slot (10) is located above the second heat dissipation slot (11); a third heat dissipation slot (13) is provided on a side of the movable box (3) away from the heat dissipation slot hole (9); the first heat dissipation slot (10) is flush with the third heat dissipation slot (13); and the three second heat dissipation slots (11) are flush with each other; The heat dissipation structure (8) comprises a heat conducting plate (15), wherein the heat conducting plate (15) is mounted on the CPU via a mounting ear, wherein the top of the heat conducting plate (15) is fixedly connected to an air guide duct (16), wherein one end of the air guide duct (16) is fixedly connected to a bellows (19), wherein the end of the bellows (19) away from the heat conducting plate (15) is connected to the outside of the main frame (1) via a third heat dissipation slot (13) when the movable box (3) slides in a direction away from the main frame (1), wherein the top of the heat conducting plate (15) is fixedly connected to a plurality of heat pipes (17), wherein the outer sides of the heat pipes (17) are fixedly connected to a plurality of heat dissipation fins (18), wherein the heat dissipation fins (18) are located on the inner side of the air guide duct (16).

2. The hollow-out micro gaming computer host with high efficiency heat dissipation according to claim 1, characterized in that: A plurality of oblique channels (14) are fixedly connected to the inner side of the movable box (3), and the oblique channels (14) are connected to the ends of the corresponding first heat dissipation slots (10) and second heat dissipation slots (11).

3. The hollow-out micro gaming computer host with high efficiency heat dissipation according to claim 1, characterized in that: The one-way air guide structure (6) comprises a mounting frame (20) and a heat-insulating shell (21); the mounting frame (20) is fixedly connected to the inner wall of the movable box (3); a gap exists between the heat-insulating shell (21) and the mounting frame (20); an annular strip (22) is fixedly connected to the inner side of the heat-insulating shell (21); an elastic sealing ring (23) is fixedly connected to the side of the mounting frame (20) close to the heat-insulating shell (21); the outer wall of the elastic sealing ring (23) contacts the outer wall of the annular strip (22); and the heat-insulating shell (21) is fixedly connected to the inner wall of the movable box (3) via the provided mounting strip.

4. The hollow-out micro gaming computer host with high efficiency heat dissipation according to claim 3, characterized in that: The inner wall of the heat-insulating shell (21) is fixedly connected to a driving motor (5), and the output shaft of the driving motor (5) is fixedly connected to a connecting rod (24).

5. The hollow-out micro gaming computer host with high efficiency heat dissipation according to claim 4, characterized in that: The reciprocating drive structure (7) comprises a mounting seat (26), one end of the mounting seat (26) is fixedly connected to a sleeve (27), the inner wall of the sleeve (27) is slidably connected to a slip ring (28), the middle part of the slip ring (28) is threadedly connected to a threaded rod (29), both ends of the threaded rod (29) are rotatably connected to the sleeve (27), one end of the threaded rod (29) passes through the mounting seat (26) and extends into the interior of the mounting seat (26), the ends of the connecting rod (24) and the threaded rod (29) are both fixedly connected to a bevel gear (25), the connecting rod (24) is transmission-connected to the threaded rod (29) through the meshing bevel gears (25), the end of the slip ring (28) is fixedly connected to a limit strip (30), the end of the limit strip (30) away from the slip ring (28) is fixedly connected to a mounting block (31), and the mounting block (31) is fixedly connected to the inner wall of the main frame (1).

6. The hollow-out micro gaming computer host with high efficiency heat dissipation according to claim 1, characterized in that: A plurality of sealing strips (12) are fixedly connected to the outer wall of the movable box (3).

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