Thermal management of computer hardware modules

Abstract

Aspects of the present disclosure include a structure for thermal management of a pluggable hardware module, an optical transceiver, and a method of cooling a pluggable hardware module. One embodiment of the structure may include a slot assembly adapted to receive a hardware module. The socket assembly may include an integrated fluid reservoir containing a thermal interface material (TIM). The slot assembly may also be adapted to define a gap when the hardware module is inserted into the slot assembly. The structure may also include at least one dispensing port in fluid communication with the integrated fluid reservoir and the gap. The at least one dispensing port may be adapted to automatically dispense the TIM from the integrated fluid reservoir into the gap when the hardware module is inserted into the slot assembly.

Description

Technical Field

[0001] The present disclosure relates to thermal management, and more particularly, to thermal management of pluggable hardware modules via self-contained thermal interface materials. Background Art

[0002] The development of the EDVAC system in 1948 is often cited as the beginning of the computer age. Since that time, computer systems have evolved into extremely complex devices. Today's computer systems typically include a combination of complex hardware and software components, applications, operating systems, processors, buses, memory, input / output devices, etc. As advances in semiconductor processing and computer architecture have driven performance ever higher, even more advanced computer software has been developed to take advantage of these capabilities at relatively higher performance, resulting in today's computer systems that are much more powerful than they were just a few years ago.

[0003] Optical transceivers are widely used in computer systems, particularly those used in data centers, high performance computing (HPC), and other systems that utilize high performance computing networking. One common optical transceiver form factor includes a printed circuit board (PCB) with a laser / optical module mounted within a molded metal shell. The module assembly can be inserted into a socket in a host computing system, which can be provided as a server in a data center, integrated into an HPC system, etc. Summary of the invention

[0004] According to an embodiment of the present disclosure, a structure for thermal management of a pluggable hardware module includes a slot assembly suitable for receiving a hardware module. The slot assembly may include an integrated fluid reservoir containing a thermal interface material (TIM). The slot assembly may also be adapted to define a gap when the hardware module is inserted into the slot assembly. The structure may also include at least one distribution port in fluid communication with the integrated fluid reservoir and the gap. When the hardware module is inserted into the slot assembly, the at least one distribution port may be adapted to automatically distribute the TIM from the integrated fluid reservoir into the gap.

[0005] According to an embodiment of the present invention, an optical transceiver includes at least one optical module encapsulated in a housing. The housing may include a generally rectangular top surface, the top surface defining a pattern suitable for enhancing the capillary action of a thermal interface material (TIM) applied thereon. The top surface may include a groove. When the housing is inserted into a slot, the groove may be suitable for receiving a seal.

[0006] According to an embodiment of the present disclosure, a method for cooling a pluggable hardware module includes providing a slot assembly. The slot assembly may include an integrated fluid reservoir containing a thermal interface material (TIM). The method may also include providing a hardware module. The hardware module and the slot assembly may be adapted to define a gap when the hardware module is inserted into the slot assembly. The method may also include providing at least one distribution port in fluid communication with the integrated fluid reservoir and the gap. The method may also include inserting the hardware module into the slot, wherein the at least one distribution port is adapted to automatically distribute the TIM from the integrated fluid reservoir into the gap when the hardware module is inserted into the slot assembly.

[0007] The above summary is not intended to describe each illustrated embodiment or every implementation of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Preferred embodiments of the present invention will now be described, by way of example only, with reference to the following drawings:

[0009] Figure 1 One embodiment of a data processing system (DPS) consistent with some embodiments is shown.

[0010] Figure 2A is a cross-sectional rear view of a first hardware component suitable for use as a system interface according to some embodiments, Figure 2B It is a cross-sectional side view.

[0011] Figure 3A is a cross-sectional rear view of a second hardware component suitable for use as a system interface according to some embodiments, Figure 3B It is a cross-sectional side view.

[0012] Figure 4A is a cross-sectional rear view of a third hardware component suitable for use as a system interface in accordance with some embodiments, Figure 4B It is a cross-sectional side view.

[0013] Figures 5A-5D is a cross-sectional view of a first embodiment of an opening on a primary fluid reservoir consistent with some embodiments.

[0014] Figures 6A-6D is a cross-sectional view of a second embodiment of an opening on a primary fluid reservoir consistent with some embodiments.

[0015] Figures 7A-7D is a cross-sectional view of a third embodiment of an upper opening of a primary fluid reservoir consistent with some embodiments.

[0016] Figure 8 is a table showing simulated thermal analysis of conventional dry contact and embodiments disclosed herein.

[0017] Figures 9A-9B is a cross-sectional rear view of the second hardware assembly in operation.

[0018] Fig.10 is a flow chart illustrating a method of cooling hardware modules in a DPS according to some embodiments.

[0019] Although the present invention may have various modifications and alternative forms, its details have been shown by way of example in the accompanying drawings and will be described in detail. However, it should be understood that its purpose is not to limit the present invention to the specific embodiments described. On the contrary, the present invention covers all modifications, equivalents and substitutions that fall within the scope of the present invention. DETAILED DESCRIPTION

[0020] Aspects of the present disclosure relate to thermal management; more particularly, aspects relate to thermal management of pluggable hardware modules through self-contained thermal interface materials. Although the present disclosure is not necessarily limited to such applications, various aspects of the present disclosure may be understood by discussing various examples using this context.

[0021] System designers have been specifying denser designs and faster speeds for computer hardware, including pluggable hardware modules. However, these increased speeds are often accompanied by greater heat generation, which can be difficult to dissipate given the increased density.

[0022] Although conventional slot assemblies include passive heat sinks, the performance of the heat sink is limited by the dry contact interface between the module and the slot. That is, the high thermal impedance of air greatly limits the practical ability to cool pluggable hardware modules. In addition, in many pluggable hardware modules and socket assemblies, the use of thermal pads (even if pre-applied) is not practical because the pads can be scratched, torn or damaged and accumulate in the interface, making module-slot engagement difficult. Therefore, one aspect of the present disclosure is a method and system for automatically applying thermal interface materials (TIMs) to dissipate heat generated by pluggable hardware modules (e.g., optical transceivers, interconnects, etc.). These methods and systems may be particularly suitable for modern, high-density, thermally demanding computing systems used in data centers and HPCs.

[0023] In some embodiments, a pluggable hardware module requiring additional cooling may be adapted to be inserted into a slot assembly. The slot assembly may include a slot physically and thermally connected to a heat sink. In turn, the heat sink may define a cavity in its bottom surface. The heat sink may cooperate with the slot to define a TIM supply reservoir when clamped together by one or more spring retaining clips. The TIM supply reservoir may be filled with a liquid or semi-solid TIM at a manufacturing site or a point of use.

[0024] The TIM in the TIM supply reservoir may include a liquid material (e.g., polyalphaolefin (PAO) oil, etc.); a semi-solid material (e.g., a low viscosity / flowable thermal grease containing suspended submicron or nano silver or ceramic fillers, etc.); a liquid metal (e.g., gallium, GaInSn (Galinstan, gallium indium tin alloy) or GaIN); or other thermally conductive heat transfer media. Embodiments using PAO oil may be particularly ideal for certain applications because such TIMs may have a relatively high viscosity, have been certified by many manufacturers as being usable as TIMs, have relatively high thermal conductivity (approximately 0.18-0.2 W / mK), may allow for relatively thin TIM layers (e.g., between approximately 0.025-0.05 mm), and may be cleaned with a cloth or isopropyl alcohol (IPA) when necessary. Embodiments using liquid metals may be ideal for certain applications because these TIMs typically have relatively high thermal conductivity (e.g., 40 W / mK) and surface tension properties.

[0025] The TIM supply reservoir can have at least one (in some embodiments, multiple) dispensing port. The dispensing port can be sized such that the surface tension of the TIM balances the gravity prior to inserting the hardware module. Thus, the TIM (including liquid TIM embodiments) can remain in the dispensing port and / or the TIM supply reservoir prior to inserting the hardware module into the slot assembly.

[0026] In operation, after the module is inserted into the slot assembly, a gap can be formed between the top / cover surface of the hardware module and the inner surface of the slot / slot assembly. The gap can be limited by a gasket / seal at its periphery to hold the TIM in the gap (e.g., forming a temporary reservoir of the TIM). In some embodiments, the TIM can automatically flow from the TIM supply reservoir into the gap to form a TIM layer in situ. In some embodiments, the walls of the gap (e.g., the top / cover surface of the hardware module and / or the inner surface of the slot / slot assembly) can be roughened and / or patterned to promote / enhance capillary flow of the TIM into and through the gap. In this way, the rough surface can promote wetting, i.e., filling the gap with the TIM after the hardware module is inserted / re-inserted. In addition, or alternatively, a positive pressure can be applied (e.g., by a heat sink retaining spring and / or by a plunger actuated as part of the insertion operation) to further enhance the flow of the TIM into the gap.

[0027] In some embodiments, the TIM supply reservoir may be sized such that its volume substantially exceeds the dispensed volume. For example, for some optical transceiver embodiments, the ratio of the reservoir volume to the dispensed volume may be greater than approximately 10X, 25X, or 50X. In this way, these embodiments may enable multiple (e.g., 10X, 25X, or 50X) insertion / removal / re-insertion cycles of the optical transceiver. Additionally, in some embodiments, the TIM supply reservoir may be refillable if additional cycles are required. Furthermore, some embodiments may include one or more check valves to control TIM dispensing and / or prevent TIM leakage during multiple insertion and reinsertion cycles.

[0028] Thus, one aspect of the present invention is a slot assembly for an optoelectronic hardware module in which a TIM can be stored in an integrated reservoir. When the hardware module is inserted, the TIM from the integrated reservoir can be automatically applied in situ to form a TIM layer that can enhance the thermal interface between the hardware module and the heat sink. Some embodiments can further enable repeated insertion / reinsertion cycles without significant damage or degradation of the performance of the enhanced thermal interface by including a container of sufficient volume and a dispensing and filling port to store and / or dispense the TITvf during each insertion / reinsertion event. Another aspect of the present disclosure is a structure that is capable of dispensing the TITvf in situ using a supplemental positive pressure applied by a heat sink retaining clip / spring.

[0029] Other features and advantages of some embodiments may include optimally designed heat sink wall thickness, reservoir volume, dispensing and filling port diameters, and check valves to provide positive pressure to dispense the TIM for insertion / re-insertion. Some embodiments may also include surface roughness to enhance wetting, and a peripheral groove / gasket along at least one edge to prevent TIM spillage.

[0030] Figure 1 One embodiment of a data processing system (DPS) 100a, 100b (generally referred to herein as DPS 100) is shown consistent with some embodiments. Figure 1 Only representative major components of DPS 100 are shown, and those individual components may have different Figure 1 In some embodiments, DPS 100 may be implemented as a personal computer; a server computer; a portable computer, such as a laptop or notebook computer, a personal data assistant (PDA), a tablet computer, or a smart phone; a processor embedded in a larger device, such as an automobile, an airplane, a teleconferencing system, an appliance; a smart device; or any other suitable type of electronic device. In addition, there may be different Figure 1 Those components or Figure 1 Components other than those shown in FIG, and the number, type, and configuration of such components may vary.

[0031] Figure 1 1. The DPS 100 in FIG. 1 may include a plurality of processing units 110a-110d (collectively referred to as processors 110 or CPUs 110), which may be connected to a main memory 112, a mass storage interface 114, a terminal / display interface 116, a network interface 118, and an input / output ("I / O") interface 120 via a system bus 122. In this embodiment, the mass storage interface 114 may connect the system bus 122 to one or more mass storage devices, such as a direct access (or mass) storage device 140, a USB drive 141, and / or a readable / writable optical drive 142. The network interface 118 may allow the DPS 100a to communicate with other DPSs 100b via a network 106. The main memory 112 may contain an operating system 124, a plurality of application programs 126, and program data 128.

[0032] Figure 1 The DPS100 embodiments in the can be a general-purpose computing device. In these embodiments, the processor 110 can be any device capable of executing program instructions stored in the main memory 112, and can itself be composed of one or more microprocessors and / or integrated circuits. In some embodiments, the DPS100 can include multiple processors and / or processing cores, which is typical for larger, more powerful computer systems; however, in other embodiments, the DPS100 can include only a single processor system and / or a single processor designed to emulate a multi-processor system. In addition, multiple heterogeneous data processing systems can be used to implement (one or more) processors 110, in which the main processor 110 is present on a single chip with the secondary processor. As another illustrative example, the processor 1110 can be a symmetric multiprocessor system containing multiple processors 110 of the same type.

[0033] When the DPS 100 is started, the associated processor(s) 110 may initially execute program instructions that make up an operating system 124. The operating system 124 may, in turn, manage the physical and logical resources of the DPS 100. These resources may include a main memory 112, a mass storage interface 114, a terminal / display interface 116, a network interface 118, and a system bus 122. As with the processor 110, some DPS 100 embodiments may utilize multiple system interfaces 114, 116, 118, 120 and buses 122, which in turn may each include their own separate, fully programmed microprocessor.

[0034] Instructions (generally, "program code, computer usable program code" or "computer readable program code") for operating system 124 and / or application programs 126 may initially reside in mass storage device 140, which communicates with processor 110 via system bus 122. Program code in different embodiments may be implemented on different physical or tangible computer readable media, such as memory 112 or mass storage device 140. Figure 1 In the illustrative example of , the instructions may be permanently stored in a functional form on the direct access storage device 140. These instructions may then be loaded into the main memory 112 for execution by the processor 110. However, the program code may also be located in a functional form on a computer readable medium, such as the direct access storage device 140 or a readable / writable optical drive 142, which may be selectively removable in some embodiments. It may be loaded or transferred to the DPS 100 for execution by the processor 110.

[0035] Continue to refer Figure 1 , the system bus 122 may be any device that facilitates communication between the processor 110; the main memory 112; and the interfaces 114, 116, 118, 120. Furthermore, while in this embodiment the system bus 122 is a relatively simple single bus structure that provides a direct communication path between the system bus 122, other bus structures are consistent with the present disclosure, including but not limited to hierarchical point-to-point links, star or mesh configurations, multiple hierarchical buses, parallel and redundant paths, etc.

[0036] Main memory 112 and mass storage device 140 may work together to store operating system 124, application programs 126, and program data 128. In some embodiments, main memory 1112 may be a random access semiconductor memory device ("RAM") capable of storing data and program instructions. Figure 1 Main memory 112 is conceptually described as a single monolithic entity, but in some embodiments main memory 112 may be a more complex arrangement, such as a hierarchy of caches and other memory devices. For example, main memory 112 may exist in multiple levels of caches, and these caches may be further divided by function, such that one cache holds instructions while another cache holds non-instruction data used by (one or more) processors 110. Main memory 112 may further be distributed and associated with different processors 110 or sets of processors 110, as is known in any of a variety of so-called non-uniform memory access (NUMA) computer architectures. In addition, some embodiments may utilize a virtual addressing mechanism that allows DPS 100 to appear as if it accesses a large single storage entity rather than multiple smaller storage entities (e.g., main memory 112 and mass storage devices 140).

[0037] Although operating system 124, application programs 126, and program data 128 are Figure 1 100a, but in some embodiments, some or all of them may be physically located on a different computer system (e.g., DPS 100b) and may be accessed remotely, for example, via network 106. Furthermore, operating system 124, application programs 126, and program data 128 need not be fully contained in the same physical DPS 100a at the same time, and may even reside in physical or virtual memory of other DPSs 100b.

[0038] In some embodiments, the system interfaces 114, 116, 118, 120 may support communications with various storage and I / O devices. The mass storage interface 114 may support the attachment of one or more mass storage devices 140, which may include rotating disk drive storage devices, solid-state storage devices (SSDs) that use integrated circuit components as memory to store data persistently, typically using flash memory, or a combination of both. In addition, the mass storage device 140 may also include other devices and assemblies, including disk drive arrays (commonly referred to as RAID arrays) configured to appear as a single mass storage device to the host, and / or archival storage media, such as hard drives, magnetic tapes (e.g., mini DV), writable compact disks (e.g., CD-R and CD-RW), digital versatile disks (e.g., DVD, DVD-R, DVD+R, DVD+RW, DVD-RAM), holographic storage systems, blue laser disks, IBM@Millipede devices, etc. The I / O interface 120 may support the attachment of one or more I / O devices, such as a keyboard, mouse, modem, or printer (not shown).

[0039] The terminal / display interface 116 may be used to connect one or more displays 180 directly to the DPS 100. These displays 180 may be non-intelligent (i.e., dumb) terminals, such as light emitting diode (LED) monitors, or they may themselves be fully programmable workstations that allow information technology (IT) administrators and users to communicate with the DPS 100. Note, however, that while a display interface 116 may be provided to support communications with one or more displays 180, the DPS 100 does not necessarily require a display 180, as all desired interactions with users and other processes may occur via the network 106.

[0040] The network 106 may be any suitable network or combination of networks and may support any suitable protocol suitable for transmitting data and / or code to / from multiple DPSs 100. Thus, the network interface 118 may be any device that facilitates such communication, regardless of whether the network connection is made using current analog and / or digital technology or via some future networking mechanism. Suitable networks 106 include, but are not limited to, networks implemented using one or more of the following: "InfiniBand" (1B) or Institute of Electrical and Electronics Engineers (IEEE) 802.3x "Ethernet" specifications; cellular transmission networks; wireless networks implemented using one of the following, IEEE 802.I 1x, IEEE 802.16, General Packet Radio Service ("GPRS"), Family Broadcast Service (FRS), or Bluetooth specifications; Ultra-Wideband ("UWB") technology, such as that described in FCC 02-48; or the like. Those skilled in the art will appreciate that many different network and transmission protocols may be used to implement the network 106. The Transmission Control Protocol / Internet Protocol ("TCP / IP") suite includes suitable network and transmission protocols.

[0041] Figure 2A and Figure 2B 2 are rear and side cross-sectional views, respectively, of a first hardware assembly 200 suitable for use as one of the system interfaces 114-120 according to some embodiments. The hardware assembly 200 may include a hardware module 210 (eg, an optical transceiver) and a socket assembly 220.

[0042] The hardware module 210 may include a plurality of optical modules (e.g., transceivers) 213 that are positioned and adapted to automatically mate with corresponding receivers 222 in the slot assembly 220 when the hardware module 210 is inserted, for example, via an opening 223 in an outer wall 224 of the DPS 100 (or other housing or rack containing the hardware module 210). In some embodiments, the hardware module 210 may include a molded housing 211 having a generally rectangular top surface 212. A gasket / seal 216 may extend completely or partially along the perimeter of the top surface 212 and may be retained by a corresponding retaining groove 214. Alternatively, the groove 214 may be adapted to receive a gasket / seal (not shown) attached to the slot assembly 220. The hardware module 210 may also include a printed circuit board 217 and a communication cable 218 on which the optical module 213 is mounted.

[0043] The socket assembly 220 may include a socket 222 and a heat sink 230. The heat sink 230 includes a base 232 physically and thermally connected to a plurality of cooling blades 234. The base 232 of the heat sink 230 may define a cavity so that when the heat sink 230 is clamped and biased against the socket 221 by the holder 250, the heat sink 230 and the socket 222 cooperate to define a TIM supply reservoir 240. The TIM supply reservoir 240 may be filled with a liquid or quasi-liquid thermal interface material (Tllvf) 242 via the upper opening 227.

[0044] The base 232 of the heat sink 230 may also define at least one dispensing port 245. In some embodiments, the size of the dispensing port 245 may be designed so that the surface tension of the TIM 242 is balanced with gravity and / or fluid pressure. In these embodiments, the TIM 242 will tend to remain in the TIM supply reservoir 240 before the hardware module 210 is inserted into the socket assembly 220. Conversely, in some embodiments, the upper opening 227 may have a relatively larger diameter than the dispensing port 245 to facilitate filling of the TIM supply reservoir 240.

[0045] In operation, the fluid reservoir 240 may be sealed with a temporary plug or tape (not shown) to prevent leakage during shipping. To begin installation, the computer administrator may first remove these plugs / tapes and then insert the hardware module 210 through the opening 223 in the outer wall 224 of the DPS 100 and then into the slot assembly 220. When the hardware module 210 is fully inserted, the top surface of the hardware module 210, the inner surface of the slot 222, and the gasket / seal 216 may cooperate to define a gap 265 (e.g., between the electronic hardware module to be cooled and the heat sink). In some embodiments, the gap 265 may be relatively thin / shallow so that the insertion / re-insertion of the hardware module 210 will break the surface tension of the TIM 242 in the TIM supply reservoir 240, thereby allowing the TIM 242 to flow into the gap 265 via gravity and / or capillary action. When the hardware module 210 is inserted into the slot assembly 220, the gasket / seal 216 may hold the TIM 242 in the gap 265.

[0046] In these embodiments, the inner surface of the socket 222 and the top surface of the hardware module 210 can be roughened and / or patterned to enhance capillary flow, which can help the TIM 242 completely fill the gap 265. Additionally, or alternatively, the heat generated by the hardware module 210 during its operation can heat the TIM 242, which can reduce its viscosity. This change in viscosity can further enable the TIM 242 to flow naturally into the gap 265. Advantageously, the TIM 242 can then act as a "wet" contact interface, which can increase heat transfer from the hardware module 210 through the base 232 to the cooling blade 234 compared to a "dry" contact interface.

[0047] The diameter of the dispensing port 245 can be optimized for capillary retention and dispensing. Liquid TIM can flow out of the dispenser port 245 when the force generated by the pressure on the TIM (e.g., pressure from the retention clamp (Fp) + gravity (Fg)) > capillary force (Fc). In other words, the TIM can flow out of the dispensing port 245 when Fp overcomes Fg minus Fg, where:

[0048] Fg = m*g = p*volume*g* and assuming the dispensing port is a cylinder: F g =p*r 2 *high

[0049] In one illustrative embodiment, this may be equal to

[0050] 800kg / m 3 *3.14*0.001m*0.0015m*9.8m / s 2 =3.6*10-5N

[0051] Fc can also be equal to:

[0052] Fc = 2*π*r*σ*cos(0), where σ is the surface tension of the selected TIM material and angle 0 is the contact angle of the TIM with the dispensing port 245. Continuing with the above illustrative example, a σ of 30 N / m and an angle of 0 to 60 degrees results in a FC of 9.4*10-2 N. The retaining clip (or other biasing structure) can be designed to provide a force greater than (9.4*10-2 N - 3.6*10-594*10-2 N).

[0053] Figure 3A and Figure 3B 1 and 2 are rear and side cross-sectional views, respectively, of a second hardware component 300 suitable for use as one of the system interfaces 114 and 120 according to some embodiments. The hardware component 300 is similar to Figure 2A-2B300. However, in hardware assembly 300, dispensing port 345 may include a valve 375 that is automatically actuated from a normally closed position to an open position when hardware module 310 is inserted into slot 320. The opening of valve 375 may allow TIM 342 to flow into gap 365. In this embodiment, the top surface 370 of primary fluid reservoir 340 may be relatively thin and flexible. Retaining clip 350 may apply a biasing force to the flexible top surface 370 of heat sink 330, deflecting it downward into primary fluid reservoir 340. This deflection may in turn pressurize TIM 342, forcing TIM 342 into secondary fluid reservoir 365.

[0054] Advantageously, the volume of TWI 342 dispensed in this second hardware assembly 300 can be controlled so that the primary reservoir 340 can support repeated insertion / re-insertion cycles. As an illustrative example, aluminum has a Young's modulus of 70 GPa. This means that for a top surface 370 made of aluminum with a thickness of 0.4 mm, the top surface 370 can be displaced 0.12 mm by the retaining clip 350 at 10 lbf. If the volume of the primary fluid reservoir 340 is 1 cm×2 cm×0.5 cm1.0 cm), each dispense will include 2.4×10-2 cm; of TIM 342, approximately 2.4 of the primary fluid reservoir 340. 0 0.

[0055] Figure 4A and Figure 4B 1 and 2 are rear and side cross-sectional views, respectively, of a third hardware component 400 suitable for use as one of the system interfaces 114 and 120 according to some embodiments. The hardware component 400 is similar to Figure 3A-3B 400. However, in hardware assembly 400, primary fluid reservoir 440 may include a removable plug 480. Removable plug 480 may be biased into primary fluid reservoir 440 by retaining clip 450. This third hardware assembly 400 may be desirable for some applications because removable plug 480 may allow for greater biasing movement than flexible top surface 370 in second hardware assembly 300. This feature, in turn, may allow for a larger amount of TIM 442 to be dispensed into second fluid reservoir 465 in each insertion / reinsertion cycle.

[0056] Figures 5A-5D is a cross-sectional view of a first embodiment of an upper opening 527 of a primary fluid reservoir 540 consistent with some embodiments. Figures 5A-5D , the check valve 585 is inserted into the fluid column 590 filled with TIM 542. In operation, Figure 5AA fluid column 590 of height H1 is shown before a hardware module (not shown) is first inserted into a slot (not shown). As described above, such insertion may cause some of the TIM 542 to migrate into a secondary fluid reservoir (not shown). Figure 5B Fluid column 590 is shown at height H2 after hardware module 510 has been inserted into slot 520. As shown, H2 Figure 5C The fluid column 590 is shown at a height H3 after the hardware module is first removed (see previous figures). As shown, H3 = H2 because the dispensing port 245 (see Figure 2A-2B ) and / or valve 375 (see Figure 3A-3B ) can keep the remaining TIM542 in the main fluid reservoir 540. Figure 5D The fluid column 590 is shown at a height H4 after the hardware module 510 is reinserted into the slot 520. As shown, H4 < H3, because the check valve 585 again allows some of the TIM 542 in the fluid column 590 to refill the primary fluid reservoir 540. However, advantageously, the check valve 585 does not allow the TITvf 542 to flow in the opposite direction, i.e., from the primary fluid reservoir 540 into the fluid column 590. This may be desirable for embodiments where the TIM 542 is actively biased into the secondary fluid reservoir.

[0057] Figures 6A-6D is a cross-sectional view of a second embodiment of an upper opening 627 of a primary fluid reservoir 620 consistent with some embodiments. Figures 5A-5D The embodiment shown is similar. However, in Figure 6A-6B 642 and is adapted to allow the ingress of air 695. In operation, the insertion / re-insertion of the hardware module (see previous figures) causes the TIM 642 to flow into the secondary fluid reservoir (not shown) such that H4<H3, H3=H2, and H2

[0058] Figures 7A-7D is a cross-sectional view of a third embodiment of an upper opening 727 of a primary fluid reservoir 720 consistent with some embodiments. Figures 6A-6D The embodiment shown is similar. However, in Figure 7A-7B ​​In this case, the fluid column 790 has been directed to the outer wall 724 of the DPS 100, near the opening 723. In operation, the repeated insertion and removal of a hardware module (not shown) causes the TIM 742 to flow into a secondary fluid reservoir (not shown), such that H4 < H3, H3 = H2, and H2 < H1. The check valve 785 will allow the amount of air 795 in the fluid column 790 to increase to compensate for the reduced level of the TIM 742. Advantageously, Figures 7A-7D the upper opening 727 therein can be accessed from the outside of the DPS 100, which can optionally allow the TIM 742 to be refilled into the main fluid reservoir 720 via a "grease nipple" grease fitting (not shown), etc.

[0059] Figure 8 is Table 800, showing a simulated thermal analysis of the embodiments disclosed herein relative to traditional dry contacts. It can be seen that for current-generation optical transceivers, some embodiments of the present disclosure can significantly reduce the temperature rise during operation from +6 - 10 °C to +1.0 - 2.5 °C. Additionally, the table indicates that the thermal limitations of current dry contact technologies may impede the future development of these devices, as the predicted use may result in a temperature rise of up to +12 °C. In contrast, embodiments of the present disclosure can limit those predicted increases to only +2 - 5 °C.

[0060] Figures 9A-9B is a rear cross-sectional view of the second hardware component 300 in operation. More specifically, Fig.9A shows a well-aligned plugging operation, Fig. 9B shows a misaligned plugging operation. In the second hardware component 300, the TIM 342 can be dispensed through a plurality of dispensing ports 345 that are laterally aligned with the insertion vector. The plurality of dispensing ports 345 can help ensure that the TIM 342 can be dispensed even when the hardware module 310 is misaligned during insertion, as Fig. 9B shown. Additionally, the roughness / pattern in the upper surface 3112 of the hardware module 3110 can capture any excess TIM 342 that is dispensed and prevent any spillage beyond the desired thermal interface area.

[0061] Fig.101 is a flow chart illustrating a method 1000 of cooling a hardware module in a DPS 100 according to some embodiments. At operation 1010, a system administrator provides a hardware component, such as hardware component 200, hardware component 300, or hardware component 400. The hardware component may include a hardware module, such as hardware module 210, hardware module 310, or hardware module 410. The hardware component may also include a slot, such as slot 220, slot 320, or slot 420. At operation 1020, the system administrator may insert the hardware module into the slot. At operation 1030, the hardware module and the slot may cooperate to form a gap, and a TIM may flow from a storage associated with the slot into the gap, forming a TIM layer between the hardware module and the slot. At operation 1040, the system administrator may enable the hardware module and / or the slot.

[0062] The description of various embodiments of the present disclosure has been presented for illustrative purposes, but is not intended to be exhaustive or limited to the disclosed embodiments. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope of the described embodiments. The terms used herein are intended to explain the principles of the embodiments, practical applications, or technical improvements to existing technologies on the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein. .

Claims

1. A structure for thermal management of a pluggable hardware module, comprising: A socket assembly adapted to receive a hardware module, the socket assembly comprising an integrated fluid reservoir containing a thermal interface material (TIM), wherein the socket assembly is further adapted to define a gap when the hardware module is inserted into the socket assembly; and at least one dispensing port, the at least one dispensing port being in fluid communication with the integrated fluid reservoir and the gap, wherein the at least one dispensing port is adapted to automatically dispense the TIM from the integrated fluid reservoir into the gap when the hardware module is inserted into the socket assembly.

2. The structure according to claim 1, wherein: The hardware modules include optical interconnects.

3. The structure of claim 1, further comprising a seal that houses the TIM in the gap.

4. The structure according to claim 1, wherein: The socket assembly includes a socket; and a heat sink defining a cavity, wherein the socket and the heat sink cooperate to define the integrated fluid reservoir.

5. The structure according to claim 4, wherein: The socket assembly also includes a retaining clip, wherein the retaining clip is adapted to deflect the flexible surface of the heat sink into the cavity.

6. The structure according to claim 4, wherein: The socket assembly also includes a retaining clip, wherein the retaining clip is adapted to bias the plug into the cavity.

7. The structure of claim 1 wherein the TIM comprises a liquid.

8. The structure of claim 7, wherein the liquid comprises a polyalphaolefin (PAO) oil.

9. The structure according to claim 1, wherein: The TIM contains thermal grease.

10. The structure according to claim 1, wherein: The TIM contains liquid metal.

11. The structure according to claim 10, wherein: The liquid metal includes gallium.

12. The structure according to claim 10, wherein: The liquid metal includes Galinstan.

13. The structure according to claim 1, wherein: The at least one dispensing port is sized such that surface tension is balanced with gravity until the hardware module is inserted into the socket assembly.

14. The structure of claim 1 further comprising at least one upper opening in fluid communication with the integrated fluid reservoir, wherein: The upper opening has a larger dimension than the at least one dispensing port.

15. The structure according to claim 13, wherein: The hardware module includes an upper surface having a groove along at least one edge.

16. The structure according to claim 15, wherein: The groove is adapted to receive a seal, wherein the seal retains the TIM in the gap when the hardware module is inserted into the socket assembly.

17. The structure of claim 15, wherein: The upper surface is rough.

18. The structure of claim 15, wherein: The upper surface is patterned.

19. An optical transceiver, comprising: At least one optical module enclosed in the housing, wherein: The housing includes a generally rectangular top surface defining a pattern adapted to enhance capillarity of a thermal interface material (TIM) applied thereon; and a groove in the top surface, wherein the groove is adapted to receive a seal when the housing is inserted into a socket.

20. A method for cooling a pluggable hardware module, comprising: A socket assembly is provided, wherein the socket assembly includes an integrated fluid reservoir containing a thermal interface material (TIM); a hardware module is provided, wherein the hardware module and the socket assembly are adapted to define a gap when the hardware module is inserted into the socket assembly; at least one dispensing port is provided in fluid communication with the integrated fluid reservoir and the gap; and the hardware module is inserted into the socket, wherein at least one dispensing port is adapted to automatically dispense the TIM from the integrated fluid reservoir into the gap when the hardware module is inserted into the socket assembly.

Images