Wafer sealing ring detection device

Abstract

The present invention discloses a wafer sealing ring detection device, which includes an optical path unit and an image processing unit. The optical path unit includes a plurality of optical path emitting components distributed in a circular array, and an optical path reflecting component aligned with the center of the circular array as a reference; the image processing unit includes a visual camera and an image processor aligned with the center of the optical path reflecting component and located below the optical path reflecting component. On the one hand, the present invention obtains the contour information of the sealing ring segment by segment while keeping the sealing ring in motion, and obtains a complete sealing ring contour image based on the piecing together of the contour information of each segment, effectively reducing the interference of external factors, and having high imaging quality. At the same time, image comparison and inspection can be performed simultaneously in the piecing together of multiple segments of images, thereby improving detection accuracy; on the other hand, through the cooperation of the optical path emitting component and the optical path reflecting component, a wider imaging range can be achieved in a narrow space, which is convenient for integration into any wafer processing equipment, and rapid detection of the sealing ring can be achieved, which is conducive to improving production efficiency.

Description

Technical Field

[0001] The invention belongs to the field of detection technology, and in particular relates to a wafer sealing ring detection device. Background Art

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits. Its raw material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing and slicing, the silicon crystal rod forms a silicon wafer. Further, a conductive metal layer is electroplated on the wafer, and the conductive metal layer is processed to make a conductive circuit.

[0003] At present, during the electroplating process, the wafer usually needs to be loaded on a wafer hanger and pressed against the edge of the wafer by a sealing ring to form a seal and conduction effect. Therefore, in order to ensure the quality of electroplating and ensure that the sealing ring is loaded relative to the wafer in accordance with the loading requirements, it is particularly important to detect the loading status of the sealing ring before electroplating. The traditional sealing ring detection device generally includes a camera and a light source for fill light. When the wafer and the sealing ring are loaded on the wafer hanger, the wafer hanger is moved to the designated area, and the light beam emitted by the light source is irradiated on the surface of the sealing ring. Then, the camera is used to obtain the overall image of the sealing ring in the illuminated area and the center position of the sealing ring is analyzed and judged through the processing system to determine whether the loading status of the sealing ring meets the requirements.

[0004] However, in the actual detection process, the existing technology is prone to the following defects:

[0005] 1. The space requirement is high. A large spacing is required to meet the imaging requirements of the camera to obtain the overall contour information of the sealing ring. As a result, the overall size of the detection device is large and can only be set up separately, and cannot be integrated with other equipment used in other processes, which affects the processing efficiency of the wafer;

[0006] 2. By directly acquiring and analyzing the image of the overall contour of the sealing ring, it is easy to cause adverse effects on the acquired image under external interference (such as light interference, hanger vibration, etc.), and the detection data sample is single. The existing processing system is difficult to accurately determine the center position of the sealing ring, resulting in low detection accuracy. Summary of the invention

[0007] The technical problem to be solved by the present invention is to overcome the deficiencies of the prior art and provide a new wafer sealing ring detection device.

[0008] In order to solve the above technical problems, the present invention adopts the following technical solutions:

[0009] A wafer sealing ring detection device comprises an optical path unit and an image processing unit, wherein the optical path unit comprises a plurality of optical path emitting components distributed in an annular array, and an optical path reflecting component aligned with the center of the annular array, wherein the light beams emitted by the plurality of optical path emitting components form a light beam detection area; the image processing unit comprises a visual camera and an image processor aligned with the center of the optical path reflecting component and located below the optical path reflecting component; the center line of the sealing ring is parallel to the center line of the annular array and is loaded on a wafer hanger, the detection device further comprises a shifter for driving the wafer hanger to move radially along the annular array, the sealing ring passes through the light beam detection area section by section, the optical path reflecting component obtains the contour information reflected by the sealing ring section by section, the visual camera converts the contour information into image information and summarizes it to the image processor to piece together the entire sealing ring contour, and detects the center position of the sealing ring based on the sealing ring contour image.

[0010] Preferably, the light beam emitted by each light path emitting component is arranged perpendicular to the plane where the sealing ring is located. Under the irradiation of the vertical light beam, the formation of shadow parts is avoided, and the quality of the reflected image is effectively improved.

[0011] According to a specific implementation and preferred aspect of the present invention, the orientation of each optical path emitting component intersects or is arranged parallel to the extension direction of the center line of the annular array. In practical applications, when emitting a light beam, the existing optical path emitting component will inevitably produce refraction (the refraction angle is determined by the material of the light-transmitting element used). Therefore, the present application adjusts the orientation of the light beam emitting component according to the refraction of the light beam emitted by the optical path emitting component used to ensure that the light beam can be vertically emitted to the sealing ring.

[0012] Preferably, each optical path emitting component comprises an emitting body for emitting a light beam, and a light-transmitting cover arranged on the emitting body and capable of transmitting light, wherein a center line of the light-transmitting cover intersects with a center line of the annular array.

[0013] Specifically, the angle between the center line of the light-transmitting cover and the center line of the annular array is equal to the refraction angle formed by the light beam passing through the light-transmitting cover. Here, according to conventional optical calculations, the setting of the angle of the light-transmitting cover is determined to compensate for the refraction of the light beam passing through the light-transmitting cover, which is simple, convenient and accurate.

[0014] Furthermore, the light-transmitting cover is rectangular, and in the orthographic projection in the extension direction of the center line of the annular array, the inner side of the light-transmitting cover is located inside the sealing ring, and the outer side is located outside the sealing ring. Here, it is ensured that each section on the sealing ring is in the light beam detection area.

[0015] According to a specific implementation and preferred aspect of the present invention, the light beam detection area can cover the entire sealing ring, and as the wafer hanger moves, the sealing ring can remain partially or entirely within the light beam detection area.

[0016] Preferably, the movement process of the sealing ring is divided into a first stage, a second stage and a third stage, wherein in the first stage, a part of the sealing ring is in the light beam detection area and keeps its center line gradually approaching the center line of the annular array; in the second stage, the sealing ring is in the light beam detection area as a whole; in the third stage, another part of the sealing ring is in the light beam detection area and keeps its center line gradually away from the center line of the annular array, and the image processor acquires images segment by segment in the first stage and the third stage and pieces together to obtain a first overall contour image, acquires images in the second stage and obtains a second overall contour image, and detects the center position of the sealing ring based on the comparison between the first overall contour image and the second overall contour image. Here, by comprehensively comparing and verifying the first overall contour image obtained by piecing together the segmented images of the sealing ring acquired in the first and third stages with the second overall contour image directly acquired in the second stage, not only sufficient sample data is ensured for the image processor to analyze, but also the detection results can be further verified under the comparison of the two overall contour images, thereby ensuring the accuracy of the detection results.

[0017] Preferably, in the direction of movement of the sealing ring, the center line of the sealing ring is aligned with the center line of the annular array, and in the second stage, when the center line of the sealing ring coincides with the center line of the annular array, the image processor obtains a second overall contour image. The overall contour image obtained at this position has uniform illumination distribution and high image quality.

[0018] According to another specific implementation and preferred aspect of the present invention, the optical path unit further comprises a bracket formed with a detection window, wherein a plurality of optical path emitting components are distributed around the detection window; the optical path reflecting component comprises a plane mirror mounted on the bracket and extending up and down in an inclined manner, wherein the plane mirror can obtain partial or entire contour information reflected by the sealing ring through the detection window. Here, the structure is simple, and it is easy to install and implement.

[0019] Preferably, the upper side of the plane mirror passes through the detection window and emerges from the light path emitting component in the direction close to the sealing ring. Here, the light beam emitted by the light path emitting component is prevented from mistakenly entering the plane mirror under refraction to form reflection, thereby reducing interference with the image information obtained by the visual camera.

[0020] Preferably, the detection device further comprises a guide module, wherein a guide channel extending vertically and matching with the wafer hanger is formed on the guide module, the wafer hanger is inserted in the guide channel, and the transfer device drives the wafer hanger to move up and down along the guide channel. Here, it is ensured that the sealing ring moves smoothly to ensure the imaging quality of the sealing ring in dynamic state.

[0021] In addition, the wafer and the sealing ring are loaded into the mounting groove on the wafer hanger; the image processor compares the contours of each segment of the sealing ring with the edge of the mounting groove to detect whether the center of the wafer and the sealing ring is aligned with the center of the mounting groove.

[0022] Due to the implementation of the above technical solution, the present invention has the following advantages compared with the prior art:

[0023] The existing technology has high space requirements and requires a large spacing to meet the imaging needs of the camera to obtain the overall contour information of the sealing ring, resulting in a large overall size of the detection device. It can only be set up separately and cannot be integrated with other equipment used in other processes, which affects the processing efficiency of the wafer; and by directly acquiring and analyzing the image of the overall contour of the sealing ring, it is easy to cause adverse effects on the acquired image under external interference (such as light interference, hanger vibration, etc.), and the detection data sample is single, and the existing processing system is difficult to accurately determine the center position of the sealing ring, resulting in low detection accuracy; and the present application improves the structure of the wafer sealing ring detection device The overall design cleverly solves the shortcomings and defects of the existing technology. After adopting the detection device, the wafer and the sealing ring are loaded on the wafer hanger, and the center line of the sealing ring is kept parallel to the center line of the annular array formed by multiple optical path emitting components; when the transfer device drives the wafer hanger to move radially along the annular array, the sealing ring passes through the light beam detection area formed by the light beams emitted by the multiple optical path emitting components section by section. At this time, the optical path reflecting component obtains the contour information reflected by the sealing ring section by section, and the visual camera converts the contour information into image information and summarizes it to the image processor to piece together the entire sealing ring contour, and detects the center position of the sealing ring based on the complete contour image of the sealing ring. Therefore, compared with the prior art, the present invention, on the one hand, effectively reduces interference from external factors and has high imaging quality by acquiring contour information of the sealing ring segment by segment while keeping the sealing ring in motion, and acquiring a complete contour image of the sealing ring based on the piecing together of contour information of each segment. At the same time, image comparison and inspection can be performed simultaneously in the piecing together of multiple image segments, thereby improving detection accuracy. On the other hand, through the cooperation of the optical path emitting component and the optical path reflecting component, a wider imaging range can be achieved in a narrow space, which is convenient for integration into any wafer processing equipment, so as to realize rapid detection of the sealing ring and help improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a front view schematic diagram of a wafer sealing ring detection device of the present invention;

[0025] Figure 2 It is a three-dimensional structural schematic diagram of the optical path unit and the image processing unit of the present invention;

[0026] Figure 3 for Figure 1 A right side schematic diagram of the optical path unit and the image processing unit;

[0027] Figure 4 for Figure 3 AA section view;

[0028] Figure 5 A schematic diagram of an image obtained when the wafer sealing ring is in the first stage;

[0029] Figure 6 A schematic diagram of an image obtained when the wafer sealing ring is in the second stage;

[0030] Figure 7 A schematic diagram of an image obtained when the wafer sealing ring is in the third stage;

[0031] Among them: 1. Transfer device;

[0032] 2. Optical path unit; 20. Bracket; k. Detection window; 21. Optical path emitting component; 210. Emitting body; 211. Transparent cover; 22. Optical path reflecting component; 220. Plane mirror;

[0033] 3. Image processing unit; 30. Visual camera;

[0034] 4. Guide module; 40. Guide channel;

[0035] H, sealing ring; Y, wafer; J, wafer hanger. DETAILED DESCRIPTION

[0036] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0037] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0038] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0039] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0041] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0042] like Figures 1 to 7 As shown, the wafer sealing ring detection device of this embodiment includes a transfer device 1, an optical path unit 2, and an image processing unit 3.

[0043] Specifically, the wafer Y and the sealing ring H of this embodiment are loaded on the wafer hanger J, and the transfer device 1 drives the wafer hanger J to move up and down. The transfer device 1 can be any conventional power mechanism.

[0044] For the convenience of implementation, the detection device of this embodiment further includes a guide module 4, wherein a guide channel 40 extending vertically and matching with the wafer hanger J is formed on the guide module 4, the wafer hanger J is inserted in the guide channel 40, and the transfer device 1 drives the wafer hanger J to move up and down along the guide channel 40. Here, it is ensured that the sealing ring moves smoothly to ensure the imaging quality of the sealing ring in dynamic conditions.

[0045] In this example, the optical path unit 2 includes a bracket 20 with a detection window k, a plurality of optical path emitting components 21 mounted on the bracket 20 and distributed in a circular array around the detection window k, and an optical path reflecting component 22 aligned with the center of the circular array as a reference, wherein the light beams emitted by the plurality of optical path emitting components 21 form a light beam detection area; the center lines of the wafer Y and the sealing ring H loaded on the wafer hanger J are parallel to the center line of the circular array, wherein the light beam detection area can cover the entire sealing ring H, and as the wafer hanger J moves, the wafer hanger J moves synchronously radially along the circular array, and the sealing ring H can remain partially or wholly within the light beam detection area.

[0046] For further convenience of implementation, the light beam emitted by each light path emitting component 21 is arranged perpendicular to the plane where the sealing ring H is located. Under the irradiation of the vertical light beam, the formation of shadow parts is avoided, and the quality of the reflected image is effectively improved.

[0047] At the same time, the orientation of each optical path emitting component 21 intersects or is arranged parallel to the extension direction of the center line of the annular array. In practical applications, when emitting a light beam, the existing optical path emitting component will inevitably produce refraction (the refraction angle is determined by the material of the light-transmitting element used). Therefore, the present application adjusts the orientation of the light beam emitting component according to the refraction of the light beam emitted by the optical path emitting component used to ensure that the light beam can be vertically emitted to the sealing ring.

[0048] In some specific embodiments, each optical path emitting component 21 includes an emitting body 210 for emitting a light beam, and a light-transmitting cover 211 disposed on the emitting body 210 and capable of transmitting light, wherein the center line of the light-transmitting cover 211 is disposed to intersect with the center line of the annular array; the angle between the center line of the light-transmitting cover 211 and the center line of the annular array is equal to the refraction angle formed by the light beam passing through the light-transmitting cover 211. Here, according to conventional optical calculations, the setting of the tilt angle of the light-transmitting cover is determined to compensate for the refraction of the light beam passing through the light-transmitting cover, which is simple, convenient, and highly accurate.

[0049] Furthermore, the light-transmitting cover 211 is rectangular, and in the orthographic projection in the extension direction of the center line of the annular array, the inner side of the light-transmitting cover 211 is located inside the sealing ring H, and the outer side is located outside the sealing ring H. Here, it is ensured that each section on the sealing ring is in the light beam detection area.

[0050] In some specific embodiments, the optical path reflection component 22 includes a plane mirror 220 mounted on the bracket 20 and extending up and down, wherein the plane mirror 220 can obtain partial or entire contour information reflected by the sealing ring H through the detection window k. Here, the structure is simple, easy to install and implement. It should be noted that the plane mirror 220 can be a circular, rectangular or other polygonal reflector, as long as it can cover the entire sealing ring in the orthographic projection in the extension direction of the center line of the annular array.

[0051] At the same time, the upper side of the plane mirror 220 passes through the detection window k and emerges from the light path emitting component 21 in the direction close to the sealing ring H. Here, the light beam emitted by the light path emitting component is prevented from entering the plane mirror by mistake to form a reflection under refraction, thereby reducing the interference with the image information obtained by the visual camera.

[0052] In this example, the image processing unit 3 includes a visual camera 30 aligned with the center of the light path reflecting component 22 and located below the light path reflecting component 22, and an image processor (not shown in the figure, but it is not difficult to imagine). As the wafer hanger J moves, the sealing ring H passes through the light beam detection area segment by segment, and the light path reflecting component 22 obtains the contour information reflected by the sealing ring H segment by segment. The visual camera 30 converts the contour information into image information and summarizes it to the image processor to piece together the entire sealing ring contour, and detects the center position of the sealing ring based on the sealing ring contour image.

[0053] In some specific embodiments, the movement process of the sealing ring H is divided into a first stage, a second stage, and a third stage. In this embodiment, the sealing ring H moves from bottom to top along with the wafer hanger J, and sequentially experiences the first, second, and third stages. Therefore, in the first stage, a part of the sealing ring H is in the light beam detection area and keeps its own center line gradually approaching the center line of the annular array; in the second stage, the sealing ring H is in the light beam detection area as a whole; in the third stage, another part of the sealing ring H is in the light beam detection area and keeps its own center line gradually away from the center line of the annular array. The image processor acquires images segment by segment in the first stage and the third stage and pieces together to obtain a first overall contour image, acquires images in the second stage and obtains a second overall contour image, and detects the center position of the sealing ring based on the comparison between the first overall contour image and the second overall contour image. Here, by comprehensively comparing and verifying the first overall contour image obtained by piecing together the sealing ring segmented images obtained in the first and third stages and the second overall contour image directly obtained in the second stage, not only is sufficient sample data ensured for image processor analysis, but also the detection results can be further verified by comparing the two overall contour images, thereby ensuring the accuracy of the detection results.

[0054] At the same time, in the moving direction of the sealing ring H, the center line of the sealing ring H is aligned with the center line of the annular array, and in the second stage, when the center line of the sealing ring H coincides with the center line of the annular array, the image processor obtains a second overall contour image. The overall contour image obtained at this position has uniform illumination distribution and high image quality.

[0055] In addition, wafer Y and sealing ring H are loaded in the mounting groove on wafer hanger J. After the image processor determines the center position of sealing ring H, it can also compare and analyze the edge of sealing ring H in each segment contour image with the edge of mounting groove on wafer hanger J to determine whether the center of wafer and sealing ring is aligned with the center of mounting groove.

[0056] In summary, after adopting the detection device, the wafer and the sealing ring are loaded on the wafer hanger, and the center line of the sealing ring is kept parallel to the center line of the annular array formed by multiple optical path emitting components; when the transfer device drives the wafer hanger to move radially along the annular array, the sealing ring passes through the light beam detection area formed by the light beams emitted by the multiple optical path emitting components segment by segment. At this time, the optical path reflecting component obtains the contour information reflected by the sealing ring segment by segment, and the visual camera converts the contour information into image information and summarizes it to the image processor to piece together the entire sealing ring contour, and detects the center position of the sealing ring based on the complete contour image of the sealing ring. Therefore, compared with the prior art, the present invention, on the one hand, obtains the contour information of the sealing ring segment by segment while keeping the sealing ring in motion, and obtains a complete contour image of the sealing ring based on the piecing together of the contour information of each segment, thereby effectively reducing the interference of external factors and achieving high imaging quality. At the same time, image comparison and inspection can be performed simultaneously in the piecing together of multiple image segments, thereby improving detection accuracy. On the other hand, through the cooperation of the optical path emitting component and the optical path reflecting component, a wider imaging range can be achieved in a narrow space, which is convenient for integration into any wafer processing equipment, so as to realize rapid detection of the sealing ring and help improve production efficiency. Thirdly, under the irradiation of a vertical light beam, the formation of a shadow part is avoided, thereby effectively improving the quality of the reflected image. At the same time, in actual applications, the existing optical path emitting component will inevitably produce refraction when emitting a light beam (the refraction angle is determined by the material of the light-transmitting element used). Therefore, the present application is based on the optical path emitting component used. The refraction of the light beam emitted by the optical path emitting component is adjusted to ensure that the light beam can be vertically emitted to the sealing ring; fourthly, a first overall contour image obtained by piecing together the segmented images of the sealing ring obtained in the first and third stages is comprehensively compared and verified with a second overall contour image directly obtained in the second stage, which not only ensures sufficient sample data for image processor analysis, but also further verifies the detection results under the comparison of the two overall contour images, thereby ensuring the accuracy of the detection results; fifthly, it prevents the light beam emitted by the optical path emitting component from mistakenly entering the plane mirror to form a reflection under refraction, thereby reducing the interference with the image information obtained by the visual camera; sixthly, after determining the center position of the sealing ring, the edge of the sealing ring in each segment contour image can be compared and analyzed with the edge of the mounting groove on the wafer hanger to determine whether the center of the wafer and the sealing ring is aligned with the center of the mounting groove.

[0057] The above detailed description of the present invention is intended to enable persons familiar with the art to understand the contents of the present invention and implement them. It does not limit the protection scope of the present invention. Any equivalent changes or modifications made according to the spirit of the present invention should be included in the protection scope of the present invention.

Claims

1. A wafer sealing ring detection device, comprising an optical path unit and an image processing unit, characterized in that: The optical path unit includes a plurality of optical path emitting components distributed in an annular array, and an optical path reflecting component aligned with the center of the annular array, wherein the light beams emitted by the plurality of optical path emitting components form a light beam detection area; the image processing unit includes a visual camera and an image processor aligned with the center of the optical path reflecting component and located below the optical path reflecting component; the center line of the sealing ring is loaded on the wafer hanger in parallel with the center line of the annular array, and the detection device also includes a shifter for driving the wafer hanger to move radially along the annular array, the sealing ring passes through the light beam detection area section by section, the optical path reflecting component obtains the contour information reflected by the sealing ring section by section, the visual camera converts the contour information into image information and summarizes it to the image processor to piece together the entire sealing ring contour, and detects the center position of the sealing ring based on the sealing ring contour image; The light beam detection area can cover the entire sealing ring, and as the wafer hanger moves, the sealing ring can remain partially or entirely within the light beam detection area; the movement process of the sealing ring is divided into a first stage, a second stage, and a third stage, wherein in the first stage, a portion of the sealing ring is within the light beam detection area and maintains its own center line gradually approaching the center line of the annular array; in the second stage, the sealing ring is entirely within the light beam detection area; in the third stage, another portion of the sealing ring is within the light beam detection area and maintains its own center line gradually away from the center line of the annular array, the image processor acquires images segment by segment in the first stage and the third stage and pieces together to obtain a first overall contour image, acquires images in the second stage and obtains a second overall contour image, and detects the center position of the sealing ring based on the comparison between the first overall contour image and the second overall contour image.

2. The wafer sealing ring detection device according to claim 1, characterized in that: The light beam emitted by each light path emitting component is arranged perpendicular to the plane where the sealing ring is located.

3. The wafer sealing ring detection device according to claim 1 or 2, characterized in that: The orientation of each of the light path emitting components intersects with or is arranged parallel to the extension direction of the center line of the annular array.

4. The wafer sealing ring detection device according to claim 3, characterized in that: Each of the light path emitting components comprises an emitting body for emitting a light beam, and a light-transmitting cover arranged on the emitting body and capable of transmitting light, wherein the center line of the light-transmitting cover intersects with the center line of the annular array.

5. The wafer sealing ring detection device according to claim 4, characterized in that: The angle between the center line of the light-transmitting cover and the center line of the annular array is equal to the refraction angle formed by the light beam passing through the light-transmitting cover.

6. The wafer sealing ring detection device according to claim 4, characterized in that: The light-transmitting cover is rectangular, and in the orthographic projection in the extension direction of the center line of the annular array, the inner side edge of the light-transmitting cover is located inside the sealing ring, and the outer side edge is located outside the sealing ring.

7. The wafer sealing ring detection device according to claim 1, characterized in that: In the movement direction of the sealing ring, the center line of the sealing ring is aligned with the center line of the annular array, and in the second stage, when the center line of the sealing ring coincides with the center line of the annular array, the image processor obtains the second overall contour image.

8. The wafer sealing ring detection device according to claim 1, characterized in that: The optical path unit also includes a bracket formed with a detection window, wherein a plurality of the optical path emitting components are distributed around the detection window; the optical path reflecting component includes a plane mirror mounted on the bracket and extending up and down at an angle, wherein the plane mirror can obtain partial or entire contour information reflected by the sealing ring through the detection window.

9. The wafer sealing ring detection device according to claim 8, characterized in that: The upper side edge of the plane mirror passes through the detection window toward the sealing ring and emerges from the light path emitting component.

10. The wafer sealing ring detection device according to claim 1, characterized in that: The detection device also includes a guide module, wherein a guide channel extending vertically and matching the wafer hanger is formed on the guide module, the wafer hanger is inserted in the guide channel, and the transfer device drives the wafer hanger to move up and down along the guide channel.

11. The wafer sealing ring detection device according to claim 1, characterized in that: The wafer and the sealing ring are loaded in the mounting groove on the wafer hanger; the image processor detects whether the center of the wafer and the sealing ring is aligned with the center of the mounting groove based on the comparison of the contours of each segment of the sealing ring with the edge of the mounting groove.

Images