Electronic equipment, test circuit and test method

Abstract

The invention relates to electronic equipment, a test circuit and a test method. The electronic equipment comprises a system chip which comprises a chip test interface and a modulation chip module; the infrared emission module is electrically connected with the chip test interface and the modulation chip module, and is configured to emit an infrared signal corresponding to a modulation signal to the outside under the condition that the modulation chip module outputs the modulation signal; under the condition that the chip test interface outputs a test signal, an infrared signal corresponding to the test signal is emitted outwards; wherein the test signal is used for testing a fault occurring in the electronic equipment; the modulation signal is used for controlling controlled equipment except the electronic equipment to execute corresponding functions. According to the embodiment of the invention, the electronic equipment can be simplified.

Description

Technical Field

[0001] The present disclosure relates to the field of interface circuits, and in particular to an electronic device, a test circuit, and a debugging test method. Background Art

[0002] With the continuous development of science and technology, electronic devices usually reserve external debugging interfaces, which can be used to analyze and count problems that occur in electronic devices during the research and development stage or after-sales stage of electronic devices. However, when a sub-interface formed by multiplexing a pin of the Universal Serial Bus (USB) interface as an external debugging interface, an analog switch needs to be added to switch audio and debugging outputs, making the chip debugging interface circuit more complicated. Summary of the invention

[0003] In order to overcome the problems existing in the related art, the present disclosure provides an electronic device, a test circuit and a test method, which can simplify the electronic device.

[0004] According to a first aspect of an embodiment of the present disclosure, there is provided an electronic device, comprising at least:

[0005] System on chip, including chip test interface and modulation chip module;

[0006] an infrared transmitting module, electrically connected to the chip test interface and the modulation chip module, and configured to transmit an infrared signal corresponding to the modulation signal when the modulation chip module outputs a modulation signal; and to transmit an infrared signal corresponding to the test signal when the chip test interface outputs a test signal;

[0007] The test signal is used to test a fault of the electronic device; and the modulation signal is used to control a controlled device other than the electronic device to perform a corresponding function.

[0008] In some embodiments, the electronic device further comprises:

[0009] The infrared driving module is electrically connected to the infrared transmitting module, the modulation chip module and the chip test interface, and is configured to drive the infrared transmitting module to transmit an infrared signal corresponding to the modulation signal and an infrared signal corresponding to the test signal.

[0010] In some embodiments, the electronic device further comprises:

[0011] The first anti-backflow module has one end electrically connected to the chip test interface and the other end connected to the modulation chip module and the infrared drive module, and is configured to allow the test signal to be sent to the infrared drive module and prevent the modulation signal from being transmitted to the chip test interface.

[0012] In some embodiments, the electronic device further comprises:

[0013] A second backflow prevention module is electrically connected between the modulation chip module and the infrared driving module and between the first backflow prevention module and the modulation chip module, and is configured to allow the modulation signal to be sent to the infrared driving module and prevent the test signal from being transmitted to the modulation chip module.

[0014] In some embodiments, the first backflow prevention module and the second backflow prevention module both include backflow prevention diodes.

[0015] In some embodiments, the infrared driving module includes a field effect tube; the gate of the field effect tube is electrically connected to the chip test interface and the modulation chip module, the source of the field effect tube is electrically connected to the ground wire, and the drain of the field effect tube is electrically connected to the infrared emission module.

[0016] In some embodiments, the system chip further includes:

[0017] at least one chip module, wherein the chip module comprises a modulation chip module;

[0018] A signal generating module is electrically connected to the chip test interface and the chip module, and is configured to generate the test signal associated with the chip module when the electronic device is turned on, and output the test signal to the outside through the chip test interface.

[0019] In some embodiments, the infrared transmission module includes an infrared light emitting diode.

[0020] In some embodiments, the electronic device further comprises:

[0021] A power supply terminal connected to the infrared emission module;

[0022] The resistor module is connected between the power supply terminal and the infrared emission module.

[0023] In some embodiments, the chip test interface includes an asynchronous receiver and transmitter interface.

[0024] According to a second aspect of an embodiment of the present disclosure, a test circuit is provided, which is applied to an electronic device and at least includes:

[0025] A chip test interface, configured to output a test signal; the test signal is used to test a fault occurring in the electronic device;

[0026] The infrared transmitting module is electrically connected to the chip testing interface and is configured to transmit an infrared signal corresponding to the testing signal.

[0027] According to a third aspect of an embodiment of the present disclosure, a testing method is provided. The testing method is applied to the electronic device described in the first aspect. The method includes:

[0028] Acquire a test signal output by a chip test interface of the electronic device; wherein the test signal is used to test a fault occurring in the electronic device;

[0029] An infrared signal corresponding to the test signal is emitted outwardly through the infrared emission module of the electronic device.

[0030] In some embodiments, the method further comprises:

[0031] When the electronic device is powered on, the test signal associated with at least one chip module of the electronic device is generated.

[0032] The technical solution provided by the embodiments of the present disclosure may have the following beneficial effects:

[0033] In the disclosed embodiment, the chip test interface of the electronic device is electrically connected to the infrared transmitting module, so that the infrared transmitting module can not only transmit an infrared signal corresponding to the modulation signal, but also transmit an infrared signal corresponding to the test signal. In other words, the electronic device of the disclosed embodiment reuses the infrared transmitting module to transmit the test signal, and no additional components are introduced into the electronic device. When the test signal is transmitted to the outside to test the failure of the electronic device, the electronic device can be simplified, thereby enriching the functions of the electronic device.

[0034] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0036] Figure 1 is a circuit diagram of an electronic device according to an exemplary embodiment Figure 1 .

[0037] Figure 2 is a circuit diagram of an electronic device according to an exemplary embodiment Figure 2 .

[0038] Figure 3 is a circuit diagram of an electronic device according to an exemplary embodiment Figure 3 .

[0039] Figure 4 is a circuit diagram of an electronic device according to an exemplary embodiment Figure 4 .

[0040] Figure 5 is a circuit diagram of an electronic device according to an exemplary embodiment Figure 5 .

[0041] Figure 6 is a schematic diagram of a test circuit according to an exemplary embodiment.

[0042] Figure 7 It is a flowchart of a testing method according to an exemplary embodiment.

[0043] Figure 8 The present invention is a block diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0044] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present disclosure. Instead, they are merely examples of devices and methods consistent with some aspects of the present disclosure as detailed in the appended claims.

[0045] The present disclosure provides an electronic device, Figure 1 is a circuit diagram of an electronic device according to an exemplary embodiment Figure 1 .like Figure 1 As shown, the electronic device 200 includes:

[0046] System chip, including chip test interface 201 and modulation chip module 202;

[0047] The infrared transmitting module 101 is electrically connected to the chip test interface 201 and the modulation chip module 202, and is configured to transmit an infrared signal corresponding to the modulation signal when the modulation chip module 202 outputs a modulation signal; and to transmit an infrared signal corresponding to the test signal when the chip test interface 201 outputs a test signal;

[0048] The test signal is used to test a fault of the electronic device; and the modulation signal is used to control a controlled device other than the electronic device to perform a corresponding function.

[0049] The above-mentioned electronic device may include a mobile terminal and an infrared camera device, wherein the mobile terminal may include a smart phone, a tablet computer, a notebook or a wearable device; the wearable device may include a smart watch or a smart bracelet, which is not limited in the embodiments of the present disclosure.

[0050] In the disclosed embodiments, during the R&D stage or after-sales stage of the electronic device, the electronic device can output an infrared signal corresponding to the test signal to facilitate the location and statistics of faults in the electronic device. For example, during the after-sales stage, if the electronic device cannot be turned on or freezes, the electronic device will output an infrared signal corresponding to the test signal, and by analyzing the test signal, problems such as a black screen or freezes in the electronic device can be located.

[0051] The above-mentioned system-on-chip (SoC) is an integrated chip module that can integrate basic chips such as processors, controllers, communication modules, sensors, and modulation chip modules. The test signal can be the operating data generated by the system chip, that is, the operating data generated by the multiple basic chips when they are turned on. By analyzing the test signal, the problematic basic chip or the problematic connection line can be located. For example, the operating data generated by multiple basic chips when the screen of an electronic device is black or the operating data generated by multiple basic chips when the electronic device is stuck.

[0052] The above-mentioned modulation chip module can output a modulation signal, and the modulation signal can be used to control the controlled device other than the electronic device to perform the corresponding function. For example, the controlled device includes a television device, and the infrared transmission module can send an infrared signal corresponding to the modulation signal to the television device to control the television device to switch channels. For another example, the controlled device includes an air-conditioning device, and the infrared transmission module can send an infrared signal corresponding to the modulation signal to the air-conditioning device to turn on the air-conditioning device.

[0053] In the disclosed embodiment, the infrared transmitting module can be used to transmit an infrared signal corresponding to the modulation signal to control the controlled device other than the electronic device to perform the corresponding function, and can also be used to output an infrared signal corresponding to the test signal, so that the test device can receive the test signal to locate and count the fault problems of the electronic device. It can be seen that the disclosed embodiment directly uses the infrared transmitting module of the electronic device to output the test signal, and no additional components are introduced into the electronic device.

[0054] It should be noted that the test device includes an optical signal interface capable of receiving infrared signals. The optical signal interface and the infrared transmitting module are two matching interfaces, the infrared transmitting module can be a transmitting interface, and the optical signal interface is a receiving interface matching the transmitting interface.

[0055] In some embodiments, the infrared transmitting module includes an infrared light emitting diode. Here, the infrared transmitting module can be used to emit an infrared signal with the same frequency as the modulation signal or the test signal. Correspondingly, the optical signal interface is an interface in the form of an optical coupler, and the optical signal interface can be an infrared signal interface of an infrared receiver.

[0056] The infrared emission module electrically connected to the chip test interface may include the infrared emission module directly electrically connected to the chip test interface, or may include the infrared emission module indirectly connected to the chip test interface, which is not limited in the embodiments of the present disclosure.

[0057] In the disclosed embodiment, the chip test interface of the electronic device is electrically connected to the infrared transmitting module, so that the infrared transmitting module can not only transmit an infrared signal corresponding to the modulation signal, but also transmit an infrared signal corresponding to the test signal. In other words, the electronic device of the disclosed embodiment reuses the infrared transmitting module to transmit the test signal, and no additional components are introduced into the electronic device. While transmitting the test signal to test the fault of the electronic device, the circuit of the electronic device can be simplified.

[0058] Figure 2 is a circuit diagram of an electronic device according to an exemplary embodiment Figure 2 .like Figure 2 As shown, in some embodiments, the electronic device further includes:

[0059] The infrared driving module 102 is connected to the infrared transmitting module 101, the modulation chip module 202 and the chip test interface 201, and is configured to drive the infrared transmitting module 101 to transmit an infrared signal corresponding to the modulation signal and an infrared signal corresponding to the test signal.

[0060] In the disclosed embodiment, the electronic device also has an infrared driving module. In the process of transmitting an infrared signal corresponding to a test signal, the electronic device multiplexes the infrared driving module on the basis of multiplexing the infrared transmitting module to drive the infrared transmitting module to transmit the infrared signal corresponding to the test signal. This can further simplify the circuit in the electronic device and reduce the complexity of the circuit in the electronic device.

[0061] In some embodiments, the infrared driving module includes a field effect tube; the gate of the field effect tube is electrically connected to the chip test interface and the modulation chip module, the source of the field effect tube is electrically connected to the ground wire, and the drain of the field effect tube is electrically connected to the infrared emission module.

[0062] In the disclosed embodiment, the test signal output by the chip test interface to the gate of the field effect transistor can control the on and off of the field effect transistor and thereby enable the infrared transmitting module to emit an infrared signal of the same frequency as the test signal, so that the infrared transmitting module can output an infrared signal corresponding to the test signal.

[0063] Exemplarily, the field effect transistor includes an N-channel field effect transistor, and the on and off of the field effect transistor can be controlled by comparing the voltage difference between the gate and the drain.

[0064] Figure 3 is a circuit diagram of an electronic device according to an exemplary embodiment Figure 3 .like Figure 3 As shown, in some embodiments, the first anti-backflow module 103, one end of which is electrically connected to the chip test interface 201, and the other end of which is electrically connected to the modulation chip module 202 and the infrared driving module 102, is configured to allow the test signal to be sent to the infrared driving module 102 and prevent the modulation signal from being transmitted to the chip test interface 201.

[0065] That is to say, the embodiment of the present disclosure can achieve unidirectional output of the test signal through the first backflow prevention module.

[0066] In some embodiments, the first anti-backflow module includes a diode. Here, the anode of the anti-backflow diode included in the first anti-backflow module is connected to the chip test interface, and the cathode of the anti-backflow diode included in the first anti-backflow module is connected to the infrared drive module. In the case where the infrared drive module is a field effect transistor, the cathode of the anti-backflow diode included in the first anti-backflow module is connected to the gate of the field effect transistor. In this way, compared with the use of multiple components, the use of diodes as anti-backflow in the embodiment of the present disclosure can save space.

[0067] Figure 4 is a circuit diagram of an electronic device according to an exemplary embodiment Figure 4 .like Figure 4 As shown, in some embodiments, the electronic device further includes:

[0068] The second anti-backflow module 104 is electrically connected between the modulation chip module 202 and the infrared driving module 102 and between the first anti-backflow module 103 and the modulation chip module 202, and is configured to allow the modulation signal to be sent to the infrared driving module 102 and prevent the test signal from being transmitted to the modulation chip module 202.

[0069] In the disclosed embodiment, both the second anti-backflow module and the first anti-backflow module may include an anti-backflow diode. Here, the anode of the anti-backflow diode included in the second anti-backflow module is connected to the chip modulation module, and the cathode of the anti-backflow diode included in the second anti-backflow module is connected to the infrared driving module. When the infrared driving module is a field effect transistor, the cathode of the anti-backflow diode included in the second anti-backflow module is connected to the gate of the field effect transistor. In other words, the cathode of the anti-backflow diode included in the first anti-backflow module and the cathode of the anti-backflow diode included in the second anti-backflow module are electrically connected, and are both electrically connected to the gate of the field effect transistor.

[0070] For example, the second anti-backflow module 104 is an anti-backflow diode 1, the first anti-backflow module 103 is an anti-backflow diode 2, the infrared driving unit 102 is a field effect transistor, the infrared transmitting module 101 is an infrared light emitting diode, and the resistance module is an inductor 106. Figure 5 As shown, the cathode of the anti-backflow diode 1 and the cathode of the anti-backflow diode 2 are both connected to the gate of the field effect tube, the anode of the infrared light emitting diode is connected to the power supply terminal 105, and the cathode of the infrared light emitting diode 101 is connected to the drain of the field effect tube 102. Figure 5 It can be seen that the test signal output by the chip test interface 201 can be sent out through the anti-backflow diode 2 , the field effect transistor 102 and the infrared light emitting diode 101 .

[0071] Correspondingly, if Figure 5 As shown, the test equipment includes: an optical signal interface 301, a power supply 303, an inductor 302 and an asynchronous receiver / transmitter (UART) interface 304, wherein the inductor 302 is connected between the power supply 303 and the optical signal interface 301, and the UART interface 304 connects the inductor 302 and the optical signal interface 301. In this way, the infrared signal corresponding to the test signal is received by the optical signal interface 301 and then transmitted to the UART interface 304, thereby realizing the reception of the test signal.

[0072] In some embodiments, the electronic device further comprises:

[0073] A power supply terminal connected to the infrared emission module;

[0074] The resistor module is connected between the power supply terminal and the infrared emission module.

[0075] In the embodiment of the present disclosure, in the process of transmitting the infrared signal corresponding to the test signal, the electronic device can reuse the power supply terminal and the resistance module in the electronic device on the basis of multiplexing the infrared transmitting module and the infrared driving module to realize the function of the electronic device outputting the test signal. In this way, the electronic device does not introduce additional components, which can further simplify the electronic device circuit and reduce the complexity of the electronic device circuit.

[0076] The power supply terminal can provide a power supply signal. For example, the power supply terminal can output a power supply signal in the range of 1.5V to 5V.

[0077] The above-mentioned resistance module may be composed of components such as resistance, inductance or capacitance. The resistance, inductance and capacitance may be electrically connected together in series and / or in parallel. In some embodiments, in order to save space and simplify electronic equipment, the resistance module may include an inductance.

[0078] In some embodiments, the chip test interface includes a UART interface. In other embodiments, the chip test interface may also include a Joint Test Action Group (JTAG) interface.

[0079] In some embodiments, the system chip further includes:

[0080] at least one chip module, wherein the chip module at least comprises a modulation chip module;

[0081] A signal generating module is electrically connected to the chip test interface and the chip module, and is configured to generate the test signal associated with the chip module when the electronic device is turned on, and output the test signal to the outside through the chip test interface.

[0082] In the embodiment of the present disclosure, the chip module includes not only a modulation chip module but also basic chip modules such as a communication module, a sensor, a clock chip, and a controller, and the embodiment of the present disclosure does not limit this.

[0083] The signal generating module is configured to generate a test signal associated with the chip module when the electronic device is turned on. That is to say, when the electronic device is turned on, by analyzing the test signals related to each chip module, the cause of the failure of the electronic device can be located. For example, when the chip module includes a screen chip, by analyzing the test signal associated with the screen chip, it can be located whether the screen of the electronic device is faulty after the electronic device is turned on.

[0084] It should be noted that the signal generation module will generate a test signal associated with the chip module when the electronic device is turned on. Since the modulation chip module is still being loaded when the electronic device is turned on, the user cannot control the controlled device other than the electronic device to perform the corresponding function through the modulation chip module. Therefore, the timing of the electronic device outputting the infrared signal corresponding to the modulation signal and the timing of the infrared signal corresponding to the test signal are staggered and cannot be achieved at the same time. Therefore, the embodiment of the present disclosure does not need to set a switch when realizing the two functions of transmitting the infrared signal corresponding to the test signal and the infrared signal corresponding to the modulation signal, and thus it is not necessary to introduce components into the electronic device, which can simplify the circuit of the electronic device.

[0085] The present disclosure also provides a test circuit. Figure 6 FIG. 1 is a schematic diagram of a test circuit according to an exemplary embodiment. Figure 6 As shown, the test circuit 100 is applied in an electronic device, and includes:

[0086] The chip test interface 201 is configured to output a test signal; the test signal is used to test a fault of the electronic device;

[0087] The infrared transmitting module 101 is electrically connected to the chip testing interface 201 and is configured to transmit an infrared signal corresponding to the test signal.

[0088] In the embodiment of the present disclosure, the chip test interface of the test circuit is electrically connected to the infrared transmitting module, so that the infrared transmitting module can not only transmit an infrared signal corresponding to the modulation signal, but also transmit an infrared signal corresponding to the test signal. In other words, the test circuit of the embodiment of the present disclosure reuses the infrared transmitting module to transmit the test signal without introducing additional components, and can simplify the circuit of the test circuit when transmitting the test signal to test the failure of the electronic device, thereby reducing the complexity of the test circuit.

[0089] The present disclosure also provides a testing method. Figure 7 FIG. 1 is a flow chart of a testing method according to an exemplary embodiment. Figure 7 As shown, the test method is applied to the electronic device in one or more of the above embodiments, and the test method may include the following steps:

[0090] S701, obtaining a test signal output by a chip test interface of the electronic device;

[0091] S702: Transmit an infrared signal corresponding to the test signal through the infrared transmission module of the electronic device.

[0092] In the disclosed embodiment, the chip test interface of the electronic device is electrically connected to the infrared transmitting module. Therefore, the test signal output by the chip test interface can be sent to the infrared transmitting module, thereby enabling the infrared transmitting module to emit an infrared signal corresponding to the test signal.

[0093] The above-mentioned test signal is output through the chip test interface. The chip test interface is set in the electronic device and cannot directly output the test signal to the test device. Therefore, the chip test interface is required to send the test signal to the infrared transmitting module as the external output interface, so that the test signal can be output to the test device, and then the test device can receive the test signal and analyze the fault of the electronic device based on the test signal.

[0094] In the disclosed embodiment, the infrared driving module of the electronic device can drive the infrared transmitting module to output an infrared signal corresponding to the modulation signal to control the controlled device outside the electronic device to perform the corresponding function. The electronic device can also control the infrared transmitting module to output an infrared signal corresponding to the test signal through the chip test interface to test the fault of the electronic device. It should be noted that when the modulation chip module of the electronic device needs to output the modulation signal, the chip test interface can be configured to be in a high-impedance state so that the modulation signal cannot be output to the chip test interface; when the chip test interface of the electronic device needs to output the test signal, the modulation chip module can be configured to be in a high-impedance state so that the test signal cannot be output to the modulation chip module. In this way, there is no need to set the first anti-backflow module and the second anti-backflow module in the electronic device, which can save space for the electronic device or simplify the electronic device.

[0095] In some embodiments, the method further includes: generating the test signal associated with at least one chip module of the electronic device when the electronic device is powered on.

[0096] In the disclosed embodiment, when the electronic device is turned on, by analyzing the test signals associated with each chip module, the fault of the electronic device can be located. For example, when the chip module includes a screen chip, by analyzing the test signals associated with the screen chip, it is possible to locate whether the screen of the electronic device is faulty after the electronic device is turned on. In the disclosed embodiment, the chip test interface of the electronic device is electrically connected to the infrared transmitting module, so that the infrared transmitting module can not only emit an infrared signal corresponding to the modulated signal, but also emit an infrared signal corresponding to the test signal. In other words, the electronic device of the disclosed embodiment reuses the infrared transmitting module to transmit the test signal, and does not introduce additional components in the electronic device, which can simplify the circuit of the electronic device while realizing the external emission of the test signal to test the fault of the electronic device.

[0097] Figure 8800 is a block diagram of an electronic device according to an exemplary embodiment. For example, the electronic device 800 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0098] Reference Figure 8 , the electronic device 800 may include one or more of the following components: a processing component 802 , a memory 804 , a power component 806 , a multimedia component 808 , an audio component 810 , an input / output (I / O) interface 812 , a sensor component 814 , and a communication component 816 .

[0099] The processing component 802 generally controls the overall operation of the electronic device 800, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 802 may include one or more processors 820 to execute instructions to complete all or part of the steps of the above-mentioned method. In addition, the processing component 802 may include one or more modules to facilitate the interaction between the processing component 802 and other components. For example, the processing component 802 may include a multimedia module to facilitate the interaction between the multimedia component 808 and the processing component 802.

[0100] The memory 804 is configured to store various types of data to support operations on the electronic device 800. Examples of such data include instructions for any application or method operating on the electronic device 800, contact data, phone book data, messages, pictures, videos, etc. The memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0101] The power supply component 806 provides power to the various components of the electronic device 800. The power supply component 806 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to the electronic device 800.

[0102] The multimedia component 808 includes a screen that provides an output interface between the electronic device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 808 includes a front camera and / or a rear camera. When the device 800 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and the rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

[0103] The audio component 810 is configured to output and / or input audio signals. For example, the audio component 810 includes a microphone (MIC), and when the electronic device 800 is in an operating mode, such as a call mode, a recording mode, and a voice recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 804 or sent via the communication component 816. In some embodiments, the audio component 810 also includes a speaker for outputting audio signals.

[0104] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: home button, volume button, start button, and lock button.

[0105] The sensor assembly 814 includes one or more sensors for providing various aspects of status assessment for the electronic device 800. For example, the sensor assembly 814 can detect the open / closed state of the device 800, the relative positioning of components, such as the display and keypad of the electronic device 800, and the sensor assembly 814 can also detect the position change of the electronic device 800 or a component of the electronic device 800, the presence or absence of contact between the user and the electronic device 800, the orientation or acceleration / deceleration of the electronic device 800, and the temperature change of the electronic device 800. The sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. The sensor assembly 814 may also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 814 may also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor, or a temperature sensor.

[0106] The communication component 816 is configured to facilitate wired or wireless communication between the electronic device 800 and other devices. The electronic device 800 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 816 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 816 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0107] In an exemplary embodiment, the electronic device 800 may be implemented by one or more application specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components.

[0108] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 804 including instructions, which can be executed by a processor 820 of the electronic device 800. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0109] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the present disclosure that follow the general principles of the present disclosure and include common knowledge or customary techniques in the art that are not disclosed in the present disclosure. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present disclosure are indicated by the following claims.

[0110] It should be understood that the present disclosure is not limited to the exact structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims

1. An electronic device, characterized in that: include: System on chip, including chip test interface and modulation chip module; an infrared transmitting module, electrically connected to the chip test interface and the modulation chip module, and configured to transmit an infrared signal corresponding to the modulation signal when the modulation chip module outputs a modulation signal; and to transmit an infrared signal corresponding to the test signal when the chip test interface outputs a test signal; The test signal is used to test a fault of the electronic device; and the modulation signal is used to control a controlled device other than the electronic device to perform a corresponding function.

2. The electronic device according to claim 1, characterized in that: The electronic device further comprises: The infrared driving module is electrically connected to the infrared transmitting module, the modulation chip module and the chip test interface, and is configured to drive the infrared transmitting module to emit an infrared signal corresponding to the modulation signal and an infrared signal corresponding to the test signal.

3. The electronic device according to claim 2, characterized in that: The electronic device further comprises: The first anti-backflow module has one end electrically connected to the chip test interface and the other end electrically connected to the modulation chip module and the infrared drive module, and is configured to allow the test signal to be sent to the infrared drive module and prevent the modulation signal from being transmitted to the chip test interface.

4. The electronic device according to claim 3, characterized in that: The electronic device further comprises: A second backflow prevention module is electrically connected between the modulation chip module and the infrared driving module and between the first backflow prevention module and the modulation chip module, and is configured to allow the modulation signal to be sent to the infrared driving module and prevent the test signal from being transmitted to the modulation chip module.

5. The electronic device according to claim 4, characterized in that: The first backflow prevention module and the second backflow prevention module both include backflow prevention diodes.

6. The electronic device according to claim 2, characterized in that: The infrared driving module includes a field effect tube; the gate of the field effect tube is electrically connected to the chip test interface and the modulation chip module, the source of the field effect tube is electrically connected to the ground wire, and the drain of the field effect tube is electrically connected to the infrared emission module.

7. The electronic device according to any one of claims 1 to 6, characterized in that: The system chip also includes: at least one chip module, wherein the chip module comprises a modulation chip module; A signal generating module is electrically connected to the chip test interface and the chip module, and is configured to generate the test signal associated with the chip module when the electronic device is turned on, and output the test signal to the outside through the chip test interface.

8. The electronic device according to any one of claims 1 to 6, characterized in that: The infrared emission module includes an infrared light emitting diode.

9. The electronic device according to any one of claims 1 to 6, characterized in that: The electronic device further comprises: A power supply terminal connected to the infrared emission module; The resistor module is connected between the power supply terminal and the infrared emission module.

10. The electronic device according to any one of claims 1 to 6, characterized in that: The chip test interface includes an asynchronous receiver-transmitter interface.

11. A test circuit, characterized in that: Used in electronic equipment, including: A chip test interface, configured to output a test signal; the test signal is used to test a fault occurring in the electronic device; The infrared transmitting module is electrically connected to the chip testing interface and is configured to transmit an infrared signal corresponding to the testing signal.

12. A testing method, applied to the electronic device according to any one of claims 1 to 10, the method comprising: Acquire a test signal output by a chip test interface of the electronic device; wherein the test signal is used to test a fault occurring in the electronic device; An infrared signal corresponding to the test signal is emitted outwardly through the infrared emission module of the electronic device.

13. The method according to claim 12, characterized in that The method further comprises: When the electronic device is powered on, the test signal associated with at least one chip module of the electronic device is generated.

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