An efficient CPU cooling device for data centers

Abstract

The present invention belongs to the technical field of CPU water cooling equipment, and specifically relates to an efficient data center CPU heat dissipation device, including a water cooling head, a radiator and a hose; the hose is connected between the water cooling head and the radiator; the water cooling head includes a water cooling plate, and a boss is arranged on the lower surface of the water cooling plate; when in use, the boss abuts against the upper end surface of the CPU and cools the CPU; a plurality of grids perpendicular to the boss are arranged around the boss, and a 0.5-1.3mm slit is formed between adjacent grids, and the slit can absorb and store overflowed liquid metal through capillary action. In this scheme, since there are slits between the grids at the edge of the boss, the overflowed liquid metal can be absorbed and stored through capillary action, and the liquid metal can be supplemented when there is too little liquid metal between the water cooling head and the CPU, and the liquid metal can be absorbed and stored when there is too much liquid metal, thereby reducing the probability of the overflowed liquid metal flowing to the server motherboard and reducing the probability of the motherboard short circuit.

Description

Technical Field

[0001] The invention belongs to the technical field of CPU water cooling equipment, and in particular relates to an efficient CPU heat dissipation device for a data center. Background Art

[0002] In data centers that perform efficient data processing, it is often necessary to arrange high-density servers. In order to increase the density of servers, the overall size of the servers is often small, which affects the server CPU's demand for heat dissipation. In the prior art, air-cooled radiators often cannot meet the server CPU's heat dissipation requirements. Therefore, water-cooled radiators are often used in servers for cooling. However, the thermal conductivity between the CPU and the water-cooled radiator will also affect the heat dissipation efficiency. In order to improve the thermal conductivity between the CPU and the water-cooled radiator, liquid metal can be used as the thermal conductor between the CPU and the water-cooled radiator. Due to its electrical conductivity, when there is too little liquid metal, it is easy to cause insufficient thermal conductivity. When there is too much liquid metal, it is easy to cause the liquid metal to flow onto the server motherboard, posing the risk of circuit short circuit.

[0003] To this end, it is necessary to design a CPU cooling device that can reduce the risk of short circuit when there is too much liquid metal and overflows. Summary of the invention

[0004] In order to solve the above problems existing in the prior art, this solution provides an efficient data center CPU cooling device.

[0005] The technical solution adopted by the present invention is:

[0006] An efficient data center CPU cooling device comprises a water cooling head, a radiator and a hose; the hose is connected between the water cooling head and the radiator;

[0007] The water cooling head includes a water cooling plate, a boss is arranged on the lower surface of the water cooling plate, and the lower surface area of ​​the boss is smaller than the area of ​​the upper end surface of the CPU; when in use, the boss is against the upper end surface of the CPU to cool the CPU, and liquid metal is coated between the boss and the CPU as a thermal conductor; a plurality of grid sheets perpendicular to the boss are arranged around the boss, and a slit of 0.5-1.3 mm is formed between adjacent grid sheets, and the slit can absorb and store overflowed liquid metal through capillary action.

[0008] As an alternative or supplement to the above-mentioned CPU cooling device: the water cooling plate includes a plate body, a liquid inlet pipe system and a liquid outlet pipe system; the boss and the grid are arranged on the lower surface of the plate body, and the liquid inlet pipe system and the liquid outlet pipe system are embedded on the upper surface of the plate body and fixed by brazing; a pressure pump is connected between the liquid inlet pipe system and the liquid outlet pipe system, and the liquid inlet pipe system and the liquid outlet pipe system are connected to the radiator through respective hoses.

[0009] As an alternative or supplement to the above-mentioned CPU cooling device: the liquid inlet pipe system includes a first inlet pipe, a second inlet pipe, a first inlet pipe tee and a second inlet pipe tee; the first inlet pipe and the second inlet pipe are parallel to each other, the two ends of the first inlet pipe are respectively connected to the first inlet pipe tee and the second inlet pipe tee, and the two ends of the second inlet pipe are respectively connected to the first inlet pipe tee and the second inlet pipe tee; the second inlet pipe tee is connected to a hose, and the first inlet pipe tee is connected to a pressure pump.

[0010] As an alternative or supplement to the above-mentioned CPU cooling device: the liquid outlet pipe system includes a first outlet pipe, a second outlet pipe, a first outlet pipe tee and a second outlet pipe tee; the first outlet pipe and the second outlet pipe are parallel to each other, the two ends of the first outlet pipe are respectively connected to the first outlet pipe tee and the second outlet pipe tee, and the two ends of the second outlet pipe are respectively connected to the first outlet pipe tee and the second outlet pipe tee; the second outlet pipe tee is connected to a hose, and the first outlet pipe tee is connected to a pressure pump.

[0011] As an alternative or supplement to the above-mentioned CPU cooling device: an outer shell cover is connected above the water cooling plate, and a booster motor, a circuit board and the booster pump are arranged inside the outer shell cover; the booster pump is transmission-connected to the booster motor; the circuit board is connected to the power supply and the booster motor, and is used to control the operating power of the booster motor.

[0012] As an alternative or supplement to the above-mentioned CPU heat dissipation device: the grid plate is triangular in shape and is provided with through holes.

[0013] As an alternative or supplement to the above-mentioned CPU cooling device: the radiator includes a heat pipe and a heat fan, the heat fan is fixedly installed on the side of the heat pipe, and the heat pipe is located on the air outlet side of the heat fan.

[0014] As an alternative or supplement to the above-mentioned CPU cooling device: the heat dissipation pipe includes a U-shaped tube and a plurality of heat sinks, the U-shaped tube includes two arm tubes arranged in parallel with each other, each arm tube is provided with a plurality of overlapping heat sinks, and the heat sinks on different arm tubes are separated from each other.

[0015] As an alternative or supplement to the above-mentioned CPU cooling device: a thermal conductive agent baffle is arranged under the water cooling head, a rectangular hole is arranged at the center of the thermal conductive agent baffle, and the CPU is placed in the rectangular hole; a plurality of extension tongues are arranged at the edge of the rectangular hole, and the free ends of the extension tongues extend to the side elevation of the CPU, and capillary slits parallel to the extension tongues are arranged at the free ends of the extension tongues; the capillary slits are used for adsorbing thermal conductive agent.

[0016] As an alternative or supplement to the above-mentioned CPU cooling device: the thermal conductive agent baffle is composed of an upper metal layer, an insulating film and a lower metal layer from top to bottom, an adhesive layer is provided at the edge of the thermal conductive agent baffle, a lead wire is provided at the edge of the thermal conductive agent baffle, the upper metal layer and the lower metal layer are connected to the alarm circuit through the lead wire, the alarm circuit has a power supply and a buzzer, and when the upper metal layer and the lower metal layer are connected through the thermal conductor, the buzzer is powered on to alarm.

[0017] As an alternative or supplement to the above-mentioned CPU heat dissipation device: the parts of the extended tongue located on both sides of the capillary gap are set to be one long and one short, and the insulating film of the longer part is longer than its upper metal layer and lower metal layer; the upper metal layer and the lower metal layer use metals with different thermal expansion coefficients so that the free end of the extended tongue can warp upward after being heated.

[0018] The beneficial effects of the present invention are as follows: in this solution, since grids are provided at the edge of the bosses, the slits between the grids can absorb and store overflowing liquid metal through capillary action, so that when there is too little liquid metal between the water cooling head and the CPU, the liquid metal can be replenished, and when there is too much liquid metal, the liquid metal can be absorbed and stored, thereby reducing the probability of overflowing liquid metal flowing onto the server motherboard and reducing the probability of a short circuit on the motherboard. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below.

[0020] Figure 1 It is a structural schematic diagram of the CPU cooling device of this solution;

[0021] Figure 2 It is a schematic diagram of the structure of the water cooling head;

[0022] Figure 3 It is a top view of the water cooling plate;

[0023] Figure 4 This is a bottom view of the water cooling plate;

[0024] Figure 5 It is a local structural diagram at the grid;

[0025] Figure 6 It is a schematic diagram of the structure of the heat pipe;

[0026] Figure 7 It is a structural diagram of the thermal conductive agent baffle;

[0027] Figure 8 It is a structural diagram of a single extended tongue.

[0028] In the figure: 1-cooling fan; 2-heat dissipation pipe; 21-U-shaped pipe; 22-heat sink; 3-hose; 4-housing cover; 5-boosting pump; 6-water cooling plate; 61-plate body; 611-boss; 612-grating; 613-material hole; 62-liquid inlet pipe system; 621-first inlet pipe; 622-second inlet pipe; 623-first three-way inlet pipe; 624-second three-way inlet pipe; 63-liquid outlet pipe system; 631-first outlet pipe; 632-second outlet pipe; 633-first three-way outlet pipe; 634-second three-way outlet pipe; 7-boosting motor; 8-thermal conductive agent baffle; 81-upper metal layer; 82-insulating film; 83-lower metal layer; 84-rectangular hole; 85-extended tongue; 86-adhesive layer; 87-lead wire; 88-capillary gap; 9-circuit board. DETAILED DESCRIPTION

[0029] The technical solution in this embodiment will be clearly and completely described below in conjunction with the accompanying drawings. The described embodiments are only some of the embodiments, not all of them. Based on the embodiments in this solution, all other embodiments obtained by ordinary technicians in this field without making creative work are within the protection scope of this solution.

[0030] Example 1

[0031] like Figures 1 to 6 As shown, this embodiment designs an efficient data center CPU cooling device, including components such as a water cooling head, a radiator and a hose 3. The hose 3 is connected between the water cooling head and the radiator and is used for conveying water medium or other liquid medium.

[0032] The water cooling head includes components such as a water cooling plate 6, an outer shell 4, a boosting motor 7, a circuit board 9 and a boosting pump 5. The outer shell 4 is fixedly installed above the water cooling plate 6, and the boosting pump 5, the boosting motor 7 and the circuit board 9 are all fixedly installed in the outer shell 4. The boosting pump 5 is connected to the boosting motor 7 by transmission; the circuit board 9 is connected to the power supply and the boosting motor 7, and is used to control the operating power of the boosting motor 7.

[0033] A quadrilateral boss 611 is provided on the lower surface of the water cooling plate 6 , and the lower surface area of ​​the boss 611 is slightly smaller than the area of ​​the upper end surface of the CPU, so as to prevent the thermal conductive agent from flowing downward along the edge of the CPU when overflowing. When the water cooling plate 6 is installed and used, part of the boss 611 is against the upper end surface of the CPU to cool the CPU, and liquid metal (which can be a gallium-based alloy) is coated between the boss 611 and the CPU as a thermal conductor; a plurality of grids 612 perpendicular to the boss 611 are arranged around the boss 611, the side edges of the grids 612 are connected to the side elevations of the boss 611, and the lower ends of the grids 612 do not exceed the lower surface of the boss 611, and a 0.5-1.3 mm slit is formed between adjacent grids 612, and the slit can absorb and store overflowed liquid metal through capillary action, so that when the liquid metal between the water cooling head and the CPU is too little, the liquid metal can be supplemented, and when the liquid metal is too much, the liquid metal can be absorbed and stored, thereby reducing the probability of the overflowed liquid metal flowing to the server motherboard and reducing the probability of the motherboard short circuit.

[0034] The grid sheet 612 is triangular in shape and is provided with through holes, so that the through holes are used to further capillary adsorb the liquid metal, thereby increasing the adsorption amount of the liquid metal.

[0035] The water cooling plate 6 includes a plate body 61, a liquid inlet pipe system 62 and a liquid outlet pipe system 63; the boss 611 and the grid sheet 612 are arranged on the lower surface of the plate body 61, the liquid inlet pipe system 62 and the liquid outlet pipe system 63 are embedded on the upper surface of the plate body 61 and fixed by brazing, and the liquid inlet pipe system 62 and the liquid outlet pipe system 63 are flattened and squeezed, so that the liquid inlet pipe system 62 and the liquid outlet pipe system 63 are flush with the upper surface of the plate body 61. A booster pump 5 is connected between the liquid inlet pipe system 62 and the liquid outlet pipe system 63, and the liquid inlet pipe system 62 and the liquid outlet pipe system 63 are connected to the radiator through respective hoses 3.

[0036] Specifically: the liquid inlet pipe system 62 includes a first inlet pipe 621, a second inlet pipe 622, a first inlet pipe tee 623 and a second inlet pipe tee 624; the first inlet pipe 621 and the second inlet pipe 622 are parallel to each other, the two ends of the first inlet pipe 621 are respectively connected to the first inlet pipe tee 623 and the second inlet pipe tee 624, and the two ends of the second inlet pipe 622 are respectively connected to the first inlet pipe tee 623 and the second inlet pipe tee 624; the second inlet pipe tee 624 is connected to the hose 3, and the first inlet pipe tee 623 is connected to the pressure pump 5. The liquid outlet pipe system 63 includes a first outlet pipe 631, a second outlet pipe 632, a first outlet pipe tee 633 and a second outlet pipe tee 634; the first outlet pipe 631 and the second outlet pipe 632 are arranged in parallel with each other, the two ends of the first outlet pipe 631 are respectively connected to the first outlet pipe tee 633 and the second outlet pipe tee 634, and the two ends of the second outlet pipe 632 are respectively connected to the first outlet pipe tee 633 and the second outlet pipe tee 634; the second outlet pipe tee 634 is connected to the hose 3, and the first outlet pipe tee 633 is connected to the pressure pump 5. When the water medium flows between the circulation path formed by the water-cooled plate 6, the hose 3, and the radiator, the water pumped out by the booster pump 5 after refueling flows in from the second tee 634 of the outlet pipe and is then divided into the first outlet pipe 631 and the second outlet pipe 632, and then flows into the heat dissipation pipe 2 of the radiator through the second tee 634 of the outlet pipe and the hose 3 connected thereto; after being cooled in the heat dissipation pipe 2, it flows into the first tee 623 of the inlet pipe through another hose 3, and then is divided into the first inlet pipe 621 and the second inlet pipe 622, and flows back to the booster pump 5 through the second tee 624 of the inlet pipe.

[0037] The radiator includes a heat pipe 2 and a heat fan 1. The heat fan 1 is fixedly installed on the side of the heat pipe 2. The heat pipe 2 is located on the air outlet side of the heat fan 1. When cold air blows through the heat pipe 2, the heat in the heat pipe 2 can be dissipated into the air. The heat pipe 2 includes a U-shaped tube 21 and a plurality of heat sinks 22. The U-shaped tube 21 includes two arm tubes arranged in parallel with each other. A plurality of heat sinks 22 overlapping each other are arranged on each arm tube. The heat sink 22 is brazed to the U-shaped tube 21 to effectively achieve heat transfer. The heat sinks 22 on different arm tubes are separated from each other, that is, only one hole is opened on the heat sink 22, and it is only connected to one arm tube, which reduces the difficulty of installing the heat sink 22 on the U-shaped tube 21.

[0038] Example 2

[0039] like Figures 1 to 8 As shown, based on the structure of Example 1, in order to further reduce the probability of liquid metal falling onto the server motherboard, a heat conductive agent baffle 8 is provided below the water cooling head in this embodiment.

[0040] The heat conductive agent baffle 8 is rectangular, and a rectangular hole 84 is provided at the center of the heat conductive agent baffle 8 . After the heat conductive agent baffle 8 is installed, the upper end of the CPU is placed in the rectangular hole 84 .

[0041] A plurality of extension tongues 85 are provided at the edge of the rectangular hole 84. The free end of the extension tongue 85 extends to the side elevation of the CPU. A capillary gap 88 parallel to the extension tongue 85 is provided at the free end of the extension tongue 85. The capillary gap 88 is used to absorb the thermal conductive agent. When the liquid metal flows downward along the side elevation of the CPU, it can contact the extension tongue 85, so that the gap between adjacent extension tongues 85 and the capillary gap 88 are used to absorb the liquid metal, thereby reducing the probability of the liquid metal falling onto the server motherboard.

[0042] The portions of the extended tongue 85 located on both sides of the capillary gap 88 can be set to be one long and one short. The width of the capillary gap 88 is generally 0.2 mm-0.5 mm. When the long and short portions are against the side elevation of the CPU or only the longer portion is against the side elevation of the CPU, the long and short portions can be staggered with each other, thereby increasing the width of the capillary gap 88 and improving the adsorption amount of liquid metal. In addition, the longer portion can support the thermal conductive agent baffle 8 in the horizontal direction, thereby improving the alignment effect of the rectangular hole 84 and the CPU.

[0043] The thermal conductive baffle 8 is composed of an upper metal layer 81, an insulating film 82 and a lower metal layer 83 from top to bottom. An adhesive layer 86 is provided at the edge of the thermal conductive baffle 8 to facilitate pasting the thermal conductive baffle 8 to the CPU gland on the motherboard, or to the lower surface of the water cooling plate 6. A plurality of lead wires 87 are provided at the edge of the thermal conductive baffle 8. The upper metal layer 81 and the lower metal layer 83 are connected to the alarm circuit through the lead wires. The alarm circuit may have a power supply and a buzzer. When the upper metal layer 81 and the lower metal layer 83 are connected through the thermal conductive agent (liquid metal), the buzzer may be powered on to give an alarm, or other alarm prompts may be given, so as to timely discover the overflow of liquid metal and the safety hazards of the server operation. The thickness of the thermal conductive baffle 8 is 0.05-0.2mm.

[0044] The longer portion of the insulating film 82 can be longer than the upper metal layer 81 and the lower metal layer 83, thereby preventing the metal part of the CPU from causing a short circuit between the upper metal layer 81 and the lower metal layer 83; when the upper metal layer 81 and the lower metal layer 83 use metals with different thermal expansion coefficients, for example, the upper metal layer 81 uses invar (or invariant steel, invar) with a thermal expansion coefficient of 1.7-2.0, and the lower metal layer 83 uses a metal with a high thermal expansion coefficient such as zinc or tin, when the liquid metal flows down onto the extension tongue 85, the free end of the extension tongue 85 can be heated and tilted upward, and extend between the CPU and the water cooling plate 6, thereby increasing the adsorption of the liquid metal by the thermal conductive agent baffle 8.

[0045] The above embodiments are merely examples for the purpose of clarifying the description, and are not intended to limit the implementation methods; it is not necessary and impossible to list all implementation methods exhaustively. However, obvious changes or modifications derived therefrom are still within the scope of protection of the present technology.

Claims

1. An efficient data center CPU cooling device, characterized by: It comprises a water cooling head, a radiator and a hose (3); the hose (3) is connected between the water cooling head and the radiator; The water cooling head comprises a water cooling plate (6), the lower surface of the water cooling plate (6) is provided with a boss (611), the area of ​​the boss (611) is smaller than the area of ​​the upper end surface of the CPU; when in use, the boss (611) abuts against the upper end surface of the CPU and cools the CPU, and liquid metal is coated between the boss (611) and the CPU as a heat conductor; a plurality of grid sheets (612) perpendicular to the boss (611) are provided around the boss (611), and slits of 0.5-1.3 mm are formed between adjacent grid sheets (612); the slits can absorb and store overflowed liquid metal through capillary action; The grid plate (612) is triangular in shape, and a through hole is provided on the grid plate (612); A heat conductive agent baffle (8) is arranged below the water cooling head, a rectangular hole (84) is arranged at the center of the heat conductive agent baffle (8), and the CPU is placed in the rectangular hole (84); a plurality of extension tongues (85) are arranged at the edge of the rectangular hole (84), the free ends of the extension tongues (85) extend to the side elevation of the CPU, and capillary slits (88) parallel to the extension tongues (85) are arranged at the free ends of the extension tongues (85); the capillary slits (88) are used to absorb the heat conductive agent.

2. The efficient data center CPU cooling device according to claim 1, characterized in that: The water cooling plate (6) comprises a plate body (61), a liquid inlet pipe system (62) and a liquid outlet pipe system (63); the boss (611) and the grid plate (612) are arranged on the lower surface of the plate body (61); the liquid inlet pipe system (62) and the liquid outlet pipe system (63) are embedded in the upper surface of the plate body (61) and fixed by brazing; a booster pump (5) is connected between the liquid inlet pipe system (62) and the liquid outlet pipe system (63); the liquid inlet pipe system (62) and the liquid outlet pipe system (63) are connected to the radiator through respective hoses (3).

3. The efficient data center CPU cooling device according to claim 2 is characterized in that: The liquid inlet pipe system (62) comprises a first inlet pipe (621), a second inlet pipe (622), a first inlet pipe tee (623) and a second inlet pipe tee (624); the first inlet pipe (621) and the second inlet pipe (622) are arranged in parallel with each other, the two ends of the first inlet pipe (621) are respectively connected to the first inlet pipe tee (623) and the second inlet pipe tee (624), and the two ends of the second inlet pipe (622) are respectively connected to the first inlet pipe tee (623) and the second inlet pipe tee (624); the second inlet pipe tee (624) is connected to the hose (3), and the first inlet pipe tee (623) is connected to the pressure pump (5); The liquid outlet pipe system (63) comprises a first outlet pipe (631), a second outlet pipe (632), a first outlet pipe tee (633) and a second outlet pipe tee (634); the first outlet pipe (631) and the second outlet pipe (632) are arranged in parallel with each other, two ends of the first outlet pipe (631) are respectively connected to the first outlet pipe tee (633) and the second outlet pipe tee (634), and two ends of the second outlet pipe (632) are respectively connected to the first outlet pipe tee (633) and the second outlet pipe tee (634); the second outlet pipe tee (634) is connected to the hose (3), and the first outlet pipe tee (633) is connected to the pressure pump (5).

4. The efficient data center CPU cooling device according to claim 3 is characterized in that: An outer shell cover (4) is connected above the water cooling plate (6), and a booster motor (7), a circuit board (9) and the booster pump (5) are arranged inside the outer shell cover (4); the booster pump (5) is transmission-connected to the booster motor (7); the circuit board (9) is connected to a power source and the booster motor (7), and is used to control the operating power of the booster motor (7).

5. The efficient data center CPU cooling device according to claim 1, characterized in that: The radiator comprises a heat dissipation pipe (2) and a heat dissipation fan (1), wherein the heat dissipation fan (1) is fixedly mounted on a side of the heat dissipation pipe (2), and the heat dissipation pipe (2) is located on an air outlet side of the heat dissipation fan (1).

6. The efficient data center CPU cooling device according to claim 5, characterized in that: The heat dissipation pipe (2) comprises a U-shaped pipe (21) and a plurality of heat dissipation fins (22); the U-shaped pipe (21) comprises two arm pipes arranged in parallel with each other, each arm pipe is provided with a plurality of heat dissipation fins (22) overlapping each other, and the heat dissipation fins (22) on different arm pipes are separated from each other.

7. The efficient data center CPU cooling device according to any one of claims 1 to 6, characterized in that: The thermal conductive agent baffle (8) comprises, from top to bottom, an upper metal layer (81), an insulating film (82) and a lower metal layer (83); an adhesive layer (86) is provided at the edge of the thermal conductive agent baffle (8); a lead wire (87) is provided at the edge of the thermal conductive agent baffle (8); the upper metal layer (81) and the lower metal layer (83) are connected to an alarm circuit via the lead wire; the alarm circuit comprises a power supply and a buzzer; when the upper metal layer (81) and the lower metal layer (83) are connected via the thermal conductive agent, the buzzer is powered on to sound an alarm.

8. The efficient data center CPU cooling device according to any one of claims 1 to 6, characterized in that: The portions of the extended tongue (85) located on both sides of the capillary gap (88) are arranged to be one long and one short, and the insulating film (82) of the longer portion is longer than the upper metal layer (81) and the lower metal layer (83); the upper metal layer (81) and the lower metal layer (83) are made of metals with different thermal expansion coefficients, so that the free end of the extended tongue (85) can bend upward after being heated.

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