A light-emitting device and a display device

Abstract

This invention discloses a light-emitting device and a display device. The light-emitting device includes a transparent layer, a plurality of light-emitting elements arranged at intervals, a driving chip, and two or more pads. The transparent layer includes a first surface and a second surface disposed opposite to each other, the first surface being the light-emitting surface. The plurality of light-emitting elements arranged at intervals are disposed on the second surface of the transparent layer. The driving chip is disposed on the second surface of the transparent layer, spaced apart from the light-emitting elements, and each light-emitting element is electrically connected to different terminals on the driving chip. Two or more pads are spaced above the light-emitting elements and the driving chip. The driving voltage difference between at least one of the light-emitting elements and the other light-emitting elements is between 0.2V and 0.5V, and at least one light-emitting element is connected to different pads than the other light-emitting elements. Therefore, this invention can reduce device power consumption and improve device reliability.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, and more specifically to a light-emitting device and a display device. Background Technology

[0002] In recent years, new display technologies have developed rapidly, with technologies such as OLED and MicroLED receiving extensive research and attention. LED chips, due to their high reliability, long lifespan, and low power consumption, are widely used in display devices, automotive lighting, and general lighting. Furthermore, due to their low power consumption, LEDs have become mainstream in the field of display technology. However, current pixel units formed by packaging three RGB LED chips suffer from problems such as coupling, low-gray flicker, high power consumption, and low reliability, which need to be overcome. Summary of the Invention

[0003] In view of the shortcomings of the prior art described above, the purpose of this invention is to provide a light-emitting device and a display device that can further eliminate coupling, improve low grayscale display, and achieve high luminous efficiency, low power consumption and high reliability.

[0004] To achieve the above and other related objectives, the present invention provides a light-emitting device, comprising:

[0005] The transparent layer includes a first surface and a second surface disposed opposite to each other, wherein the first surface is a light-emitting surface;

[0006] Multiple light-emitting elements arranged at intervals are disposed on the second surface of the transparent layer;

[0007] A driver chip is disposed on the second surface of the transparent layer, spaced apart from the light-emitting elements, and each light-emitting element is electrically connected to a different terminal on the driver chip;

[0008] Two or more pads are spaced apart above the light-emitting element and the driver chip. The driving voltage difference between at least one light-emitting element and the other light-emitting elements is between 0.2 V and 0.5 V, and at least one light-emitting element is connected to a different pad than the other light-emitting elements.

[0009] According to one aspect of the present invention, a light-emitting device is also provided, comprising:

[0010] The transparent layer includes a first surface and a second surface disposed opposite to each other, wherein the first surface is a light-emitting surface;

[0011] Three light-emitting elements are arranged at intervals and disposed on the second surface of the transparent layer;

[0012] A driver chip is disposed on the second surface of the transparent layer and spaced apart from the light-emitting element. The driver chip has eight terminals, including a first terminal, a second terminal, a third terminal, a fourth terminal, a fifth terminal, a sixth terminal, a seventh terminal, and an eighth terminal. The first terminal is connected to the second electrode of the first light-emitting element, the second terminal is connected to the second electrode of the second light-emitting element, and the third terminal is connected to the second electrode of the third light-emitting element.

[0013] The first pad is connected to the first electrode of the first light-emitting element, the second electrode of the second light-emitting element, and the first electrode of the third light-emitting element, and is also connected to the fourth terminal;

[0014] The second pad is connected to the fifth terminal;

[0015] The third pad connects to the sixth terminal;

[0016] The fourth pad connects to the seventh terminal;

[0017] The fifth pad is connected to the eighth terminal. According to one aspect of the present invention, a display device is also provided, comprising:

[0018] Display substrate;

[0019] At least one light-emitting device is disposed on a display substrate, and each light-emitting device is electrically connected to the display substrate. The light-emitting device is the aforementioned light-emitting device.

[0020] Compared with the prior art, the light-emitting device and display device of the present invention have at least the following beneficial effects:

[0021] The light-emitting device of the present invention includes a transparent layer, a plurality of light-emitting elements arranged at intervals, a driving chip, and two or more pads. The transparent layer includes a first surface and a second surface disposed opposite to each other, the first surface being the light-emitting surface. The plurality of light-emitting elements arranged at intervals are disposed on the second surface of the transparent layer. The driving chip is disposed on the second surface of the transparent layer, spaced apart from the light-emitting elements, and each light-emitting element is electrically connected to different terminals on the driving chip. Two or more pads are spaced above the light-emitting elements and the driving chip, and the driving voltage difference between at least one of the light-emitting elements and the remaining light-emitting elements is between 0.2 V and 0.5 V, and at least one light-emitting element is connected to different pads than the remaining light-emitting elements. Furthermore, the present invention drives light-emitting elements with large driving voltage differences separately to avoid unnecessary power consumption caused by inconsistent driving voltages of different light-emitting elements, and to avoid damage to the light-emitting elements caused by mismatched driving voltages, thus improving the reliability and lifespan of the light-emitting elements.

[0022] The display device of the present invention includes the above-described light-emitting device and similarly possesses the above-described technical effects. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the light-emitting device described in Embodiment 1 of the present invention;

[0024] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0025] Figure 3a This is an example from Embodiment 1 of the present invention. Figure 1 A schematic diagram of the cross-section along line B-B';

[0026] Figure 3b This is another example in Embodiment 1 of the present invention. Figure 1 A schematic diagram of the cross-section along line B-B';

[0027] Figure 4 This is a schematic diagram of the light-emitting device described in Embodiment 2 of the present invention;

[0028] Figure 5 This is a schematic diagram of the light-emitting device described in Embodiment 3 of the present invention;

[0029] Figure 6 for Figure 5 Enlarged view of point C in the middle;

[0030] Figure 7 This is a schematic diagram of the light-emitting device described in Embodiment 4 of the present invention;

[0031] Figure 8 for Figure 7 Enlarged view of point D in the middle.

[0032] List of reference numerals in the attached diagram:

[0033] 100 transparent layer 101 First surface 102 Second surface 201 First light-emitting element 202 Second light-emitting element 203 Third light-emitting element 210 First electrode 220 Second electrode 300 driver chip 301 First terminal 302 Second terminal 303 Third terminal 304 Fourth terminal 305 Fifth terminal 306 Sixth terminal 307 Seventh terminal 308 Eighth terminal 400 Fill layer 500 Wiring layer 501 First sub-wiring 502 Second sub-wiring 503 Third sub-wiring 504 Fourth sub-wiring 505 Fifth sub-wiring 506 Sixth sub-wiring 507 Seventh sub-wiring 508 Eighth sub-wiring 509 Ninth sub-wiring 510 Tenth sub-wiring 511 First layer 512 Second floor 600 Encapsulation layer 701 First pad 702 Second pad 703 Third pad 704 Fourth pad 705 Fifth pad 706 Sixth pad Detailed Implementation

[0034] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of this application. It should be noted that, unless otherwise specified, the following embodiments and features in the embodiments can be combined with each other.

[0035] It should be understood that the illustrations provided in the embodiments of this invention are merely schematic representations of the basic concept of the invention. Although the illustrations only show components relevant to the invention and are not drawn according to the actual number, shape, and size of components in implementation, the shape, quantity, and proportion of each component can be arbitrarily changed in actual implementation, and the component layout may also be more complex. The structures, proportions, sizes, etc., shown in the accompanying drawings are only used to complement the content disclosed in the specification for those skilled in the art to understand and read, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportional relationships, or adjustments to the size, without affecting the effects and objectives that the invention can produce, should still fall within the scope of the technical content disclosed in this application.

[0036] To eliminate coupling, improve low-grayscale display, and achieve high luminous efficiency, low power consumption, and high reliability, this embodiment provides a light-emitting device, including:

[0037] The transparent layer includes a first surface and a second surface disposed opposite to each other, wherein the first surface is a light-emitting surface;

[0038] Multiple light-emitting elements arranged at intervals are disposed on the second surface of the transparent layer;

[0039] A driver chip is disposed on the second surface of the transparent layer, spaced apart from the light-emitting elements, and each light-emitting element is electrically connected to a different terminal on the driver chip;

[0040] Two or more pads are spaced apart above the light-emitting elements and the driver chip. The driving voltage difference between at least one of the light-emitting elements and the others is between 0.2 V and 0.5 V, and at least one light-emitting element is connected to a different pad than the others. Therefore, this embodiment drives light-emitting elements with large driving voltage differences separately to avoid unnecessary power consumption caused by inconsistent driving voltages, and also avoids damage to the light-emitting elements caused by mismatched driving voltages, thus improving the reliability and lifespan of the light-emitting elements.

[0041] Optionally, the pads include a first pad, a second pad, and other pads, and the multiple light-emitting elements include a first light-emitting element, a second light-emitting element, and a third light-emitting element. The first and second light-emitting elements are connected to the first pad, and the third light-emitting element is connected to the second pad. In this embodiment, the first and second light-emitting elements and the third light-emitting element with a large difference in driving voltage are driven separately, avoiding unnecessary power consumption caused by inconsistent driving voltages of different light-emitting elements, and also improving the reliability and lifespan of the light-emitting elements.

[0042] Optionally, each light-emitting element includes a first electrode and a second electrode spaced apart, the first electrode and the second electrode being disposed on the side of the light-emitting element away from the transparent layer, the first electrode of the first light-emitting element being connected to a first pad, the first electrode of the second light-emitting element being electrically connected to the first pad, and the first electrode of the third light-emitting element being electrically connected to the second pad.

[0043] Optionally, the multiple spaced pads further include a third pad, a fourth pad, and a fifth pad, and the driver chip includes seven terminals, which include:

[0044] The first terminal is electrically connected to the second electrode of the first light-emitting element;

[0045] The second terminal is electrically connected to the second electrode of the second light-emitting element;

[0046] The third terminal is electrically connected to the second electrode of the third light-emitting element;

[0047] The fourth terminal is electrically connected to the second pad;

[0048] The fifth terminal is electrically connected to the third pad;

[0049] The sixth terminal is electrically connected to the fourth pad;

[0050] The seventh terminal is electrically connected to the fifth pad.

[0051] Optionally, the multiple spaced pads further include a third pad, a fourth pad, a fifth pad, and a sixth pad. The driver chip includes seven terminals, which include:

[0052] The first terminal is electrically connected to the second electrode of the first light-emitting element;

[0053] The second terminal is electrically connected to the second electrode of the second light-emitting element;

[0054] The third terminal is electrically connected to the second electrode of the third light-emitting element;

[0055] The fourth terminal is electrically connected to the sixth pad;

[0056] The fifth terminal is electrically connected to the third pad;

[0057] The sixth terminal is electrically connected to the fourth pad;

[0058] The seventh terminal is electrically connected to the fifth pad.

[0059] In this embodiment, the third light-emitting element and the driving chip can be driven independently via the second and sixth pads, respectively. This avoids unnecessary power consumption caused by inconsistent driving voltages, achieving high luminous efficiency and low power consumption. Furthermore, the light-emitting device includes six pads, with three pads evenly distributed on both sides of the device, which improves the uniformity and reliability of subsequent die bonding.

[0060] Optionally, the multiple spaced pads further include a third pad, a fourth pad, a fifth pad, and a sixth pad. The driver chip includes eight terminals, which include:

[0061] The first terminal is electrically connected to the second electrode of the first light-emitting element;

[0062] The second terminal is electrically connected to the second electrode of the second light-emitting element;

[0063] The third terminal is electrically connected to the second electrode of the third light-emitting element;

[0064] The fourth terminal is electrically connected to the second pad;

[0065] The fifth terminal is electrically connected to the third pad;

[0066] The sixth terminal is electrically connected to the fourth pad;

[0067] The seventh terminal is electrically connected to the fifth pad;

[0068] The eighth terminal is electrically connected to the sixth pad.

[0069] In this embodiment, the eighth terminal is a signal switch terminal, equivalent to a signal switch. When the voltage input to the EN terminal through the sixth pad reaches a preset value, such as 1.8V, row and column data can directly reach the light-emitting device to drive it. Without the EN terminal, the logic signals before the driver IC would be very complex and unreliable. Therefore, this embodiment adds an EN terminal to the driver chip as a drive switch for the light-emitting device, enabling direct driving of the light-emitting device through the EN terminal, avoiding the complexity of other driving methods that lead to low driving reliability. Similarly, the arrangement of six pads is beneficial for the uniformity and reliability of subsequent die bonding.

[0070] Optionally, the eighth terminal is the EN terminal, which is a signal switch terminal.

[0071] Optionally, the driver chip is an IC chip.

[0072] Optionally, the driver chip is an active driver IC chip, which can completely eliminate coupling and improve the problem of low grayscale display.

[0073] Optionally, the first light-emitting element, the second light-emitting element, and the third light-emitting element are three light-emitting elements that emit light of different colors from each other, and the third light-emitting element is a light-emitting element that radiates red light.

[0074] Optionally, the first light-emitting element is a light-emitting element that radiates blue light, and the second light-emitting element is a light-emitting element that radiates green light; or the first light-emitting element is a light-emitting element that radiates green light, and the second light-emitting element is a light-emitting element that radiates blue light.

[0075] Optionally, the light-emitting device further includes:

[0076] A filling layer is disposed on the sidewall of the light-emitting element and the sidewall of the driver chip.

[0077] Optionally, the light-emitting device further includes:

[0078] The wiring layer is disposed on the fill layer, the light-emitting element and the driver chip. One end is electrically connected to the light-emitting element and the driver chip respectively, and the other end is electrically connected to a plurality of spaced pads respectively.

[0079] Optionally, the light-emitting device further includes a wiring layer, which is disposed above the light-emitting element and the driving chip. The wiring layer includes nine sub-wirings, which include:

[0080] The first sub-wire has one end connected to the first terminal and the other end connected to the second electrode of the first light-emitting element;

[0081] The second sub-wire is connected at one end to the second terminal and at the other end to the second electrode of the second light-emitting element;

[0082] The third sub-wire is connected at one end to the third terminal and at the other end to the second electrode of the third light-emitting element;

[0083] The fourth sub-wiring wire is connected at one end to the first electrode of the first light-emitting element and the first electrode of the second light-emitting element; the other end is connected to the first pad.

[0084] The fifth sub-wire is connected at one end to the first electrode of the third light-emitting element and at the other end to the second pad.

[0085] The sixth sub-wiring connects to the fourth terminal at one end and to the second pad at the other end;

[0086] The seventh sub-wiring connects to the fifth terminal at one end and to the third pad at the other end.

[0087] The eighth sub-wiring connects to the sixth terminal at one end and to the fourth pad at the other end.

[0088] The ninth sub-wiring connects to the seventh terminal at one end and to the fifth pad at the other end.

[0089] Optionally, the light-emitting device further includes a wiring layer, which is disposed above the light-emitting element and the driving chip. The wiring layer includes nine sub-wirings, which include:

[0090] The first sub-wire has one end connected to the first terminal and the other end connected to the second electrode of the first light-emitting element;

[0091] The second sub-wire is connected at one end to the second terminal and at the other end to the second electrode of the second light-emitting element;

[0092] The third sub-wire is connected at one end to the third terminal and at the other end to the second electrode of the third light-emitting element;

[0093] The fourth sub-wiring wire is connected at one end to the first electrode of the first light-emitting element and the first electrode of the second light-emitting element; the other end is connected to the first pad.

[0094] The fifth sub-wire is connected at one end to the first electrode of the third light-emitting element and at the other end to the second pad.

[0095] The sixth sub-wiring connects to the fourth terminal at one end and to the sixth pad at the other end.

[0096] The seventh sub-wiring connects to the fifth terminal at one end and to the third pad at the other end.

[0097] The eighth sub-wiring connects to the sixth terminal at one end and to the fourth pad at the other end.

[0098] The ninth sub-wiring connects to the seventh terminal at one end and to the fifth pad at the other end.

[0099] Optionally, the light-emitting device further includes a wiring layer, which is disposed above the light-emitting element and the driving chip. The wiring layer includes ten sub-wirings, which include:

[0100] The first sub-wire has one end connected to the first terminal and the other end connected to the second electrode of the first light-emitting element;

[0101] The second sub-wire is connected at one end to the second terminal and at the other end to the second electrode of the second light-emitting element;

[0102] The third sub-wire is connected at one end to the third terminal and at the other end to the second electrode of the third light-emitting element;

[0103] The fourth sub-wiring wire is connected at one end to the first electrode of the first light-emitting element and the first electrode of the second light-emitting element; the other end is connected to the first pad.

[0104] The fifth sub-wire is connected at one end to the first electrode of the third light-emitting element and at the other end to the second pad.

[0105] The sixth sub-wiring connects to the fourth terminal at one end and to the second pad at the other end;

[0106] The seventh sub-wiring connects to the fifth terminal at one end and to the third pad at the other end.

[0107] The eighth sub-wiring connects to the sixth terminal at one end and to the fourth pad at the other end.

[0108] The ninth sub-wiring connects to the seventh terminal at one end and to the fifth pad at the other end.

[0109] The tenth sub-wiring connects to the eighth terminal at one end and to the sixth pad at the other end.

[0110] Optionally, the light-emitting device further includes:

[0111] The encapsulation layer fills the space between adjacent sub-routings and covers part of the routing layer, with pads formed on the exposed routing layer.

[0112] Optionally, the driver chip is located in the central area of ​​the transparent layer.

[0113] Optionally, the thickness of the driving chip is greater than the thickness of the light-emitting element, and the thickness of the driving chip is less than or equal to 5 times the thickness of the light-emitting element.

[0114] According to one aspect of the present invention, a light-emitting device is also provided, comprising:

[0115] The transparent layer includes a first surface and a second surface disposed opposite to each other, wherein the first surface is a light-emitting surface;

[0116] Three light-emitting elements are arranged at intervals and disposed on the second surface of the transparent layer;

[0117] A driver chip is disposed on the second surface of the transparent layer and spaced apart from the light-emitting element. The driver chip has eight terminals, including a first terminal, a second terminal, a third terminal, a fourth terminal, a fifth terminal, a sixth terminal, a seventh terminal, and an eighth terminal. The first terminal is connected to the second electrode of the first light-emitting element, the second terminal is connected to the second electrode of the second light-emitting element, and the third terminal is connected to the second electrode of the third light-emitting element.

[0118] The first pad is connected to the first electrode of the first light-emitting element, the second electrode of the second light-emitting element, and the first electrode of the third light-emitting element, and is also connected to the fourth terminal;

[0119] The second pad is connected to the fifth terminal;

[0120] The third pad connects to the sixth terminal;

[0121] The fourth pad connects to the seventh terminal;

[0122] The fifth pad connects to the eighth terminal.

[0123] Optionally, the eighth terminal is an EN terminal, which is a signal switch terminal. In this embodiment, the eighth terminal is a signal switch terminal, equivalent to a signal switch. When the voltage input to the EN terminal through the sixth pad reaches a preset value, such as 1.8V, row and column data can directly reach the light-emitting device to drive it. Without an EN terminal, the logic signals before the driver IC would be very complex and unreliable. Therefore, this embodiment adds an EN terminal to the driver chip as a drive switch for the light-emitting device, enabling direct driving of the light-emitting device through the EN terminal, avoiding the complexity of other driving methods that lead to low driving reliability.

[0124] According to one aspect of the present invention, a display device is also provided, comprising:

[0125] Display substrate;

[0126] At least one light-emitting device is disposed on a display substrate, and each light-emitting device is electrically connected to the display substrate. The light-emitting device is the aforementioned light-emitting device. The display device in this embodiment includes the aforementioned light-emitting device and similarly possesses the technical effects of the aforementioned light-emitting device.

[0127] The invention will now be described in detail with specific examples.

[0128] Example 1

[0129] This embodiment provides a light-emitting device, as shown in the reference. Figure 1 The light-emitting device includes a transparent layer 100, a plurality of light-emitting elements arranged at intervals, a driver chip 300, and two or more pads.

[0130] The transparent layer 100 has a light transmittance of over 60% in the visible light range. Optionally, the transparent layer 100 can be a transparent substrate, such as PET, glass, quartz, sapphire, or transparent ceramic, which are light-transmitting substrates. The light-emitting device needs to have a certain thickness for user convenience; therefore, the thickness of the transparent layer 100 is preferably greater than 10 μm, specifically preferably 30 μm~50 μm, 50 μm~100 μm, or 100 μm~300 μm. (Refer to...) Figure 3a Alternatively, in configuration 3b, the transparent layer 100 includes a first surface 101 and a second surface 102 disposed opposite to each other, wherein the first surface 101 is the light-emitting surface of the entire light-emitting device. A light-emitting element and a driving chip 300 are disposed on the second surface 102 of the transparent layer 100.

[0131] Reference Figure 1 and 3a~3b, Multiple light-emitting elements are disposed on the second surface 102 of the transparent layer 100. Since different light-emitting elements typically have different thicknesses, an adhesive layer (not shown in the figure) is provided between the transparent layer 100 and the light-emitting elements. The adhesive layer can be made of an elastic material such as silicone. Therefore, the light-emitting elements are partially embedded in the adhesive layer to keep the electrode surfaces of the light-emitting elements at the same horizontal level and to reduce the height difference between the light-emitting surfaces of each element. This allows the light emitted from the sides of the light-emitting elements to be absorbed as much as possible by the filling layer 400 described below, thereby improving the contrast of the light-emitting device. The thickness of the adhesive layer is preferably 1μm to 15μm or 3μm to 10μm. If the thickness of the adhesive layer is greater than 15μm, the alignment accuracy of the light-emitting elements may be affected.

[0132] In this embodiment, the light-emitting element mainly refers to a micron-sized light-emitting diode, with a width or length ranging from 2 to 5 μm, 5 to 10 μm, 10 to 20 μm, 20 to 50 μm or 50 to 100 μm, and a thickness ranging from 2 to 15 μm, preferably 5 to 10 μm.

[0133] Specifically, each light-emitting element includes a semiconductor stack layer, which may include a first semiconductor layer, a second semiconductor layer, and an active layer disposed between them, arranged in sequence. The first semiconductor layer is an N-type semiconductor layer, the second semiconductor layer is a P-type semiconductor layer, and the active layer is a multilayer quantum well layer, which can provide red, green, or blue light radiation. The N-type semiconductor layer, the multilayer quantum well layer, and the P-type semiconductor layer are only the basic building blocks of the light-emitting element. In addition, the light-emitting element may also include other functional structural layers that optimize its performance.

[0134] In this embodiment, refer to Figure 1The system comprises multiple light-emitting elements, including a first light-emitting element 201, a second light-emitting element 202, and a third light-emitting element 203. The first light-emitting element 201, the second light-emitting element 202, and the third light-emitting element 203 radiate light within different wavelength ranges and have different driving voltages. For example, the first light-emitting element 201 radiates blue light, the second light-emitting element 202 radiates green light, and the third light-emitting element 203 radiates red light. The driving voltage difference between the light-emitting elements radiating blue and green light and those radiating red light is relatively large. In one embodiment, different light-emitting elements may have different semiconductor stacked layers, thereby directly radiating light within different wavelength ranges. The specific material of the semiconductor stacked layer is selected according to the wavelength of the radiated light, and includes, but is not limited to, aluminum gallium arsenide, gallium arsenide phosphide, aluminum gallium indium phosphide, gallium nitride, indium gallium nitride, zinc selenide, or gallium phosphide. In another embodiment, different light-emitting elements may have the same semiconductor stack layer. For example, the semiconductor stack layers in the first light-emitting element 201, the second light-emitting element 202 and the third light-emitting element 203 all radiate blue light rays. A wavelength conversion layer is provided on the light-emitting surface of the second light-emitting element 202 to convert the radiated blue light rays into green light rays, and a wavelength conversion layer is provided on the light-emitting surface of the third light-emitting element 203 to convert the radiated blue light rays into red light rays.

[0135] Each light-emitting element also includes a first electrode 210 and a second electrode 220. The semiconductor stack has a mesa that exposes a first semiconductor layer, the first electrode 210 is formed on the mesa and electrically connected to the first semiconductor layer, and the second electrode 220 is formed on the second semiconductor layer and electrically connected to the second semiconductor layer.

[0136] Reference Figure 1 and 3a ~3b, The driver chip 300 is also disposed on the second surface 102 of the transparent layer 100, spaced apart from the light-emitting elements. This driver chip 300 is used to process data signals between the controller and the pixels. The driver chip 300 has multiple terminals, and each light-emitting element is electrically connected to a different terminal on the driver chip 300. Optionally, the driver chip 300 is an active-matrix driver IC chip. Using an active-matrix driver IC chip can improve the display quality of the light-emitting module and can be driven at a lower driving voltage, increasing the lifespan of the display panel.

[0137] Optionally, the positions of the driving chip 300 and the light-emitting elements on the transparent layer 100 can be arbitrary, as long as they do not affect the arrangement of other structures. In this embodiment, the driving chip 300 is disposed at the center of the transparent layer 100, and the three light-emitting elements are disposed as a single light-emitting part on one side of the driving chip 300. To avoid the driving chip 300 being too large and occupying too much space in the entire light-emitting device, thus affecting the light emission of the light-emitting part, the size of the driving chip 300 is between approximately 1 μm and 100 μm. Specifically, the size of the driving chip 300 can be 5 μm, 10 μm, 20 μm, 50 μm, 70 μm, or 100 μm. Optionally, the thickness of the driving chip 300 is less than 50 μm. To facilitate the transfer of the driver chip 300 and the light-emitting element onto the transparent layer 100 together, the thickness difference between the driver chip 300 and the light-emitting element is less than 50 μm, for example, less than 25 μm or less than 15 μm. This can effectively improve the transfer yield of the driver chip 300 and the light-emitting element onto the transparent layer 100. Optionally, the thickness of the driver chip 300 is greater than the thickness of the light-emitting element, and the thickness of the driver chip 300 is less than or equal to 5 times the thickness of the light-emitting element. If the thickness of the driver chip 300 is much greater than the thickness of the chip, it is not conducive to the subsequent fabrication of the stacked structure formed on top of the two.

[0138] In this embodiment, refer to Figure 1 and 2 The driver chip 300 includes seven terminals: a first terminal 301, a second terminal 302, a third terminal 303, a fourth terminal 304, a fifth terminal 305, a sixth terminal 306, and a seventh terminal 307. Terminals 301 to 303 can be connected to three light-emitting elements respectively and used to control their switching. Terminal 304 is the positive power supply terminal, terminal 305 is the negative power supply terminal, terminal 306 is a timing signal input terminal, and terminal 307 is a data signal input terminal. However, the number and order of the terminals in the driver chip 300 are not limited to this; that is, the number and function of the terminals in the driver chip 300 can be designed according to the functional requirements of the light-emitting device.

[0139] Optionally, refer to Figure 1 and 3a 3b, the light-emitting device also includes a filling layer 400, which is disposed on the sidewalls of the light-emitting elements and the driving chip 300. The filling layer 400 prevents color mixing or light interference between adjacent light-emitting elements, thereby improving the contrast of the light-emitting device. The filling layer 400 is provided as a black adhesive layer that absorbs light.

[0140] Optionally, refer to Figure 3aAlternatively, in embodiment 3b, the light-emitting device further includes a wiring layer 500, which is disposed on the filling layer 400, the light-emitting element, and the driving chip 300, and is electrically connected to the light-emitting element and the driving chip 300, respectively. The wiring layer 500 includes a plurality of wirings, and an insulating layer is filled around the wiring layer 500 to electrically isolate adjacent wirings. The wiring layer 500 can be a single layer or multiple layers made of at least one material selected from titanium, copper, chromium, nickel, gold, platinum, aluminum, titanium nitride, tantalum nitride, or tantalum. In this embodiment, the wiring layer 500 includes a two-layer structure, specifically a first layer 511 and a second layer 512. The first layer 511 is in direct contact with the light-emitting element and the driving chip 300, and the second layer 512 is formed on the first layer 511. The first layer 511 is used to adhere the second layer 512 to the light-emitting element, the driving chip 300, and the filling layer 400, while the second layer 512 mainly serves a conductive function. The material of the first layer 511 includes, but is not limited to, one or more of titanium, nickel, titanium nitride, tantalum nitride, or tantalum. The material of the second layer 512 includes, but is not limited to, one or more of copper, aluminum, or gold. The wiring layer 500 can be prepared by sputtering, vapor deposition, or other methods. In this embodiment, the wiring layer 500 includes nine sub-wirings, namely, a first sub-wiring 501, a second sub-wiring 502, a third sub-wiring 503, a fourth sub-wiring 504, a fifth sub-wiring 505, a sixth sub-wiring 506, a seventh sub-wiring 507, an eighth sub-wiring 508, and a ninth sub-wiring 509. The sub-wirings are spaced apart and insulated from each other.

[0141] Reference Figure 13. Two or more pads are disposed on the wiring layer 500. These two or more pads include a first pad 701, a second pad 702, and other pads. A first light-emitting element 201 and a second light-emitting element 202 are connected to the first pad 701, and a third light-emitting element 203 is connected to the second pad 702, so that the third light-emitting element 203, whose driving voltage is different from that of the first light-emitting element 201 and the second light-emitting element 202, can be driven individually. In this embodiment, the other pads include a third pad 703, a fourth pad 704, and a fifth pad 705. The first pad 701 is connected to the first electrode 210 of the first light-emitting element 201 and the first electrode 210 of the second light-emitting element 202 via a first sub-wiring 501. The second pad 702 is connected to the first electrode 210 of the third light-emitting element 203 via a second sub-wiring 502, and the second pad 702 is connected to the fourth terminal 304 of the driver chip 300 via a sixth sub-wiring 506. The third pad 703 is connected to the fifth terminal 305 via the seventh sub-wiring 507, the fourth pad 704 is connected to the sixth terminal 306 via the eighth sub-wiring 508, and the fifth pad 705 is connected to the seventh terminal 307 via the ninth wiring. The light-emitting elements are also electrically connected to the driver chip 300 via the wiring layer 500. Specifically, the second electrode 220 of the first light-emitting element 201 is connected to the first terminal 301 via the third sub-wiring 503, the second electrode 220 of the second light-emitting element 202 is connected to the second terminal 302 via the fourth sub-wiring 504, and the second electrode 220 of the third light-emitting element 203 is connected to the third terminal 303 via the fifth sub-wiring 505. The first pad 701 (VGB) is electrically connected to the first light-emitting element 201 and the second light-emitting element 202, inputting a driving voltage to them. The second pad 702 (VR) is electrically connected to the third light-emitting element 203 and the driver chip 300, simultaneously inputting a driving voltage to both the third light-emitting element 203 and the driver chip 300. The first light-emitting element 201 and the second light-emitting element 202 are blue and green light-emitting elements, respectively, and the third light-emitting element 203 is a red light-emitting element. Since the driving voltage required for the red light-emitting element differs significantly from that of the blue and green light-emitting elements, driving the red element separately avoids unnecessary power consumption caused by simultaneous driving, thus saving energy. Furthermore, it avoids damage to the light-emitting element caused by driving voltage mismatch, which is beneficial to the reliability and lifespan of the light-emitting element. The third pad 703 (Row / Clk) and the fourth pad 704 (Col / Data) input data signals and timing signals to the driver chip 300, and the fifth pad 705 (Gnd) is electrically connected to the driver chip 300 for grounding. The switching of the three light-emitting elements is controlled by the first terminal 301, the second terminal 302, and the third terminal 303. The light-emitting device emits light with a specific brightness based on the driving voltage.

[0142] Optionally, a package layer 600 is also formed on the wiring layer 500. This package layer 600 has openings corresponding to the number of pads. The pads can be disposed within the openings and exposed to the surface of the package layer; alternatively, they can be formed inside the openings of the package layer. In one example, such as... Figure 3a As shown, the first pad 701 is disposed on the second layer 512 of the wiring layer 500, and the first pad 701 extends from within the encapsulation layer 600, exposing the surface of the encapsulation layer 600. In one example, as... Figure 3b As shown, the first pad 701 is disposed on the second layer 512 of the wiring layer 500, and the first pad 701 is relatively thin, disposed within the opening of the encapsulation layer 600, and not exposed on the surface of the encapsulation layer 600. In this case, the first pad 701 is a thin metal protective layer plated on the wiring layer 500 to prevent oxidation of the wiring layer, and also serves as a pad. Optionally, the material of the first pad 701 is NiAu.

[0143] It is important to note that the spacing between pads needs to be controlled within a reasonable range to avoid interference between adjacent pads, which could affect the yield of the light-emitting device. For example, the spacing between adjacent pads can be controlled to be greater than 60μm to avoid interference between them.

[0144] The encapsulation layer 600 fills the periphery of the pads to provide electrical isolation between adjacent sub-pads. The encapsulation layer 600 is a light-absorbing adhesive layer; for example, it is formed by dispersing a black filler component in transparent or translucent materials such as silicone, epoxy resin, polyimide, low-temperature glass, polysiloxane, or polysilazane. The black filler component in the encapsulation layer 600 includes, but is not limited to, carbon black, titanium nitride, iron oxide, magnetite, and iron powder.

[0145] Example 2

[0146] This embodiment provides a light-emitting device. The similarities between this light-emitting device and that of Embodiment 1 will not be repeated here. The differences are as follows:

[0147] Reference Figure 4 In this embodiment, other pads include a sixth pad 706. Furthermore, in this embodiment, the second pad 702 is only connected to the first electrode 210 of the third light-emitting element 203, and the sixth pad 706 is connected to the fourth terminal 304 of the driver chip 300. This embodiment splits the second pad 702 in Embodiment 1 into the second pad 702 and the sixth pad 706 in this embodiment. This allows the third light-emitting element 203 and the driver chip 300 to be driven independently through different pads, avoiding unnecessary power consumption when their driving voltages are inconsistent. Further, the light-emitting device includes six pads, with three pads evenly distributed on both sides of the device, which is beneficial for the uniformity and reliability of subsequent die bonding.

[0148] Example 3

[0149] This embodiment provides a light-emitting device. The similarities between this light-emitting device and that of Embodiment 1 will not be repeated here. The differences are as follows:

[0150] Reference Figure 5 and Figure 6 In this embodiment, other pads include a sixth pad 706, and the terminals on the driver chip 300 also include an eighth terminal 308. The wiring layer 500 also includes a tenth sub-wiring 510. The sixth pad 706 and the eighth terminal 308 are electrically connected through the tenth sub-wiring 510. The eighth terminal 308 is a signal switch terminal, equivalent to a signal switch. When the voltage input to the EN terminal through the sixth pad 706 reaches a preset value, such as 1.8V, row and column data can directly reach the light-emitting device to drive it. Without the EN terminal, the logic signals before the driver IC would be very complex and have low reliability. Therefore, this embodiment adds an EN terminal to the driver chip 300 as a drive switch for the light-emitting device, enabling direct driving of the light-emitting device through the EN terminal. This avoids the low reliability caused by other complex driving methods, further reducing the power consumption of the light-emitting device and improving device reliability.

[0151] Example 4

[0152] This embodiment provides a light-emitting device. The similarities between this device and the one in Embodiment 1 will not be repeated here, but the differences are as follows:

[0153] Reference Figure 7 and 8 In this embodiment, the driver chip has eight terminals, including a first terminal 301, a second terminal 302, a third terminal 303, a fourth terminal 304, a fifth terminal 305, a sixth terminal 306, a seventh terminal 307, and an eighth terminal 308. The first terminal 301 is connected to the second electrode 220 of the first light-emitting element 201, the second terminal 302 is connected to the second electrode 220 of the second light-emitting element 202, and the third terminal 303 is connected to the second electrode 220 of the third light-emitting element 203. The pads include a first pad 701, a second pad 702, a third pad 703, a fourth pad 704, and a fifth pad 705. The first pad 701 is connected to the first electrode 210 of the first light-emitting element 201, the first electrode 210 of the second light-emitting element 202, and the first electrode 210 of the third light-emitting element 203, and is also connected to the fourth terminal 304. The second pad 702 is connected to the fifth terminal 305. The third pad 703 is connected to the sixth terminal 306. The fourth pad 704 is connected to the seventh terminal 307. The fifth pad 705 is connected to the eighth terminal 308.

[0154] Specifically, refer to Figure 7 and 8 The wiring layer 500 includes nine sub-wirings, namely, a first sub-wiring 501, a second sub-wiring 502, a third sub-wiring 503, a fourth sub-wiring 504, a fifth sub-wiring 505, a sixth sub-wiring 506, a seventh sub-wiring 507, an eighth sub-wiring 508, and a ninth sub-wiring 509. A first pad 701 is connected to the first electrode 210 of the first light-emitting element 201, the second light-emitting element 202, and the third light-emitting element 203 via the first sub-wiring 501, and is also connected to the fourth terminal 304 of the driver chip 300 via the fifth sub-wiring 505. The second electrodes 220 of the first light-emitting element 201, the second light-emitting element 202, and the third light-emitting element 203 are respectively connected to the first terminal 301, the second terminal 302, and the third terminal 303 via the second sub-wiring 502, the third sub-wiring 503, and the fourth sub-wiring 504. The second pad 702 is connected to the fifth terminal 305 via the sixth sub-wiring 506, the third pad 703 is connected to the sixth terminal 306 via the seventh sub-wiring 507, the fourth pad 704 is connected to the seventh terminal 307 via the eighth sub-wiring 508, and the fifth pad 705 is connected to the eighth terminal 308 via the ninth sub-wiring 509.

[0155] In this embodiment, the first terminals 301 to the seventh terminals 307 of the driver chip 300 function the same as in Embodiment 1, and will not be repeated here. The eighth terminal 308 is a signal switch terminal, equivalent to a signal switch. When the voltage input to the EN terminal through the fifth pad 705 reaches a preset value, such as 1.8V, row and column data can directly reach the light-emitting device to drive it. Without the EN terminal, the logic signals before the driver IC would be very complex and unreliable. Therefore, this embodiment adds an EN terminal to the driver chip 300 as a drive switch for the light-emitting device, enabling direct driving of the light-emitting device through the EN terminal. This avoids the complexity of other driving methods that lead to low driving reliability, and also reduces the power consumption of the light-emitting device.

[0156] Example 5

[0157] This embodiment provides a display device, which includes a display substrate and at least one light-emitting device disposed on the display substrate. The light-emitting device is any one of the light-emitting devices in Embodiments 1 to 4. The pads of the light-emitting device are electrically connected to the display substrate, and the light-emitting surface of the light-emitting device is away from the display substrate. When there are two or more light-emitting devices, the two or more light-emitting devices are spaced apart on the display substrate, and each light-emitting device is electrically connected to the display substrate. Since this display device includes any one of the light-emitting devices in Embodiments 1 to 4, the display device in this embodiment can also save power consumption and improve reliability and service life.

[0158] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in the present invention should still be covered by the claims of the present invention.

Claims

1. A light-emitting device, characterized in that, include: The transparent layer includes a first surface and a second surface disposed opposite to each other, wherein the first surface is a light-emitting surface; Multiple light-emitting elements arranged at intervals are disposed on the second surface of the transparent layer; A driver chip is disposed on the second surface of the transparent layer, spaced apart from the light-emitting elements, and each light-emitting element is electrically connected to different terminals on the driver chip; Two or more pads are spaced apart above the light-emitting element and the driving chip. The difference in driving voltage between at least one of the light-emitting elements and the other light-emitting elements is between 0.2 V and 0.5 V, and the at least one light-emitting element is connected to different pads than the other light-emitting elements.

2. The light-emitting device according to claim 1, characterized in that, The pads include a first pad, a second pad, and other pads. The plurality of light-emitting elements include a first light-emitting element, a second light-emitting element, and a third light-emitting element. The first light-emitting element and the second light-emitting element are connected to the first pad, and the third light-emitting element is connected to the second pad. The driving voltage difference between the third light-emitting element and the first light-emitting element or the second light-emitting element is between 0.2 V and 0.5 V.

3. The light-emitting device according to claim 2, characterized in that, Each of the light-emitting elements includes a first electrode and a second electrode spaced apart, the first electrode and the second electrode being disposed on the side of the light-emitting element away from the transparent layer, the first electrode of the first light-emitting element being connected to the first pad, the first electrode of the second light-emitting element being electrically connected to the first pad, and the first electrode of the third light-emitting element being electrically connected to the second pad.

4. The light-emitting device according to claim 3, characterized in that, The other pads include a third pad, a fourth pad, and a fifth pad. The driver chip includes seven terminals, which include: The first terminal is electrically connected to the second electrode of the first light-emitting element; The second terminal is electrically connected to the second electrode of the second light-emitting element; The third terminal is electrically connected to the second electrode of the third light-emitting element; The fourth terminal is electrically connected to the second pad; The fifth terminal is electrically connected to the third pad; The sixth terminal is electrically connected to the fourth pad; The seventh terminal is electrically connected to the fifth pad.

5. The light-emitting device according to claim 3, characterized in that, The other pads include a third pad, a fourth pad, a fifth pad, and a sixth pad. The driver chip includes seven terminals, which include: The first terminal is electrically connected to the second electrode of the first light-emitting element; The second terminal is electrically connected to the second electrode of the second light-emitting element; The third terminal is electrically connected to the second electrode of the third light-emitting element; The fourth terminal is electrically connected to the sixth pad; The fifth terminal is electrically connected to the third pad; The sixth terminal is electrically connected to the fourth pad; The seventh terminal is electrically connected to the fifth pad.

6. The light-emitting device according to claim 3, characterized in that, The other pads include a third pad, a fourth pad, a fifth pad, and a sixth pad. The driver chip includes eight terminals, which include: The first terminal is electrically connected to the second electrode of the first light-emitting element; The second terminal is electrically connected to the second electrode of the second light-emitting element; The third terminal is electrically connected to the second electrode of the third light-emitting element; The fourth terminal is electrically connected to the second pad; The fifth terminal is electrically connected to the third pad; The sixth terminal is electrically connected to the fourth pad; The seventh terminal is electrically connected to the fifth pad; The eighth terminal is electrically connected to the sixth pad.

7. The light-emitting device according to claim 6, characterized in that, The eighth terminal is the EN terminal, which is a signal switch terminal.

8. The light-emitting device according to claim 1, characterized in that, The driver chip is an IC chip.

9. The light-emitting device according to claim 1, characterized in that, The driving chip is an active driving IC chip.

10. The light-emitting device according to claim 2, characterized in that, The first light-emitting element, the second light-emitting element, and the third light-emitting element are three light-emitting elements that emit light of different colors from each other, and the third light-emitting element is a light-emitting element that radiates red light.

11. The light-emitting device according to claim 10, characterized in that, The first light-emitting element is a blue light-emitting element, and the second light-emitting element is a green light-emitting element; or the first light-emitting element is a green light-emitting element, and the second light-emitting element is a blue light-emitting element.

12. The light-emitting device according to claim 2, characterized in that, The light-emitting device further includes: A filling layer is disposed on the sidewall of the light-emitting element and the sidewall of the driving chip.

13. The light-emitting device according to claim 12, characterized in that, The light-emitting device further includes: A wiring layer is disposed on the fill layer, the light-emitting element and the driving chip, with one end electrically connected to the light-emitting element and the driving chip respectively, and the other end electrically connected to the plurality of spaced pads respectively.

14. The light-emitting device according to claim 4, characterized in that, The light-emitting device further includes a wiring layer disposed above the light-emitting element and the driving chip. The wiring layer includes nine sub-wirings, which include: The first sub-wire has one end connected to the first terminal and the other end connected to the second electrode of the first light-emitting element; The second sub-wire is connected at one end to the second terminal and at the other end to the second electrode of the second light-emitting element; The third sub-wire is connected at one end to the third terminal and at the other end to the second electrode of the third light-emitting element; The fourth sub-wiring has one end connected to the first electrode of the first light-emitting element and the first electrode of the second light-emitting element; the other end is connected to the first pad connection. The fifth sub-wire is connected at one end to the first electrode of the third light-emitting element and at the other end to the second pad; The sixth sub-wiring is connected at one end to the fourth terminal and at the other end to the second pad; The seventh sub-wiring is connected at one end to the fifth terminal and at the other end to the third pad; The eighth sub-wire is connected at one end to the sixth terminal and at the other end to the fourth pad; The ninth sub-wiring is connected at one end to the seventh terminal and at the other end to the fifth pad.

15. The light-emitting device according to claim 5, characterized in that, The light-emitting device further includes a wiring layer disposed above the light-emitting element and the driving chip. The wiring layer includes nine sub-wirings, which include: The first sub-wire has one end connected to the first terminal and the other end connected to the second electrode of the first light-emitting element; The second sub-wire is connected at one end to the second terminal and at the other end to the second electrode of the second light-emitting element; The third sub-wire is connected at one end to the third terminal and at the other end to the second electrode of the third light-emitting element; The fourth sub-wiring has one end connected to the first electrode of the first light-emitting element and the first electrode of the second light-emitting element; the other end is connected to the first pad connection. The fifth sub-wire is connected at one end to the first electrode of the third light-emitting element and at the other end to the second pad; The sixth sub-wiring is connected at one end to the fourth terminal and at the other end to the sixth pad; The seventh sub-wiring is connected at one end to the fifth terminal and at the other end to the third pad; The eighth sub-wire is connected at one end to the sixth terminal and at the other end to the fourth pad; The ninth sub-wiring is connected at one end to the seventh terminal and at the other end to the fifth pad.

16. The light-emitting device according to claim 6, characterized in that, The light-emitting device further includes a wiring layer disposed above the light-emitting element and the driving chip. The wiring layer includes ten sub-wirings, the ten sub-wirings including: The first sub-wire has one end connected to the first terminal and the other end connected to the second electrode of the first light-emitting element; The second sub-wire is connected at one end to the second terminal and at the other end to the second electrode of the second light-emitting element; The third sub-wire is connected at one end to the third terminal and at the other end to the second electrode of the third light-emitting element; The fourth sub-wiring has one end connected to the first electrode of the first light-emitting element and the first electrode of the second light-emitting element; the other end is connected to the first pad connection. The fifth sub-wire is connected at one end to the first electrode of the third light-emitting element and at the other end to the second pad; The sixth sub-wiring is connected at one end to the fourth terminal and at the other end to the second pad; The seventh sub-wiring is connected at one end to the fifth terminal and at the other end to the third pad; The eighth sub-wire is connected at one end to the sixth terminal and at the other end to the fourth pad; The ninth sub-wiring is connected at one end to the seventh terminal and at the other end to the fifth pad; The tenth sub-wire is connected at one end to the eighth terminal and at the other end to the sixth pad.

17. The light-emitting device according to any one of claims 14 to 16, characterized in that, The light-emitting device further includes: An encapsulation layer fills the space between adjacent sub-routings and covers a portion of the routing layer, with the pads formed on the exposed routing layer.

18. The light-emitting device according to claim 1, characterized in that, The driving chip is disposed in the central region of the second surface of the transparent layer.

19. The light-emitting device according to claim 1, characterized in that, The thickness of the driving chip is greater than the thickness of the light-emitting element, and the thickness of the driving chip is less than or equal to 5 times the thickness of the light-emitting element.

20. A display device, characterized in that, include: Display substrate; At least one light-emitting device is disposed on the display substrate, and each light-emitting device is electrically connected to the display substrate, wherein the light-emitting device is the light-emitting device according to any one of claims 1 to 19.

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