A tubular LED photocatalytic reactor

Abstract

The present application relates to the technical field of photocatalytic reaction, and provides a tubular LED photocatalytic reactor, including a heat-conducting substrate, an LED light source module, a light diffusion layer and a photocatalyst carrier layer; the heat-conducting substrate is a hollow cylindrical member, and the two ends of the outer surface of the heat-conducting substrate are respectively threadedly connected with annular covers; the LED light source module includes a PCB board and a plurality of LED chips arranged on the PCB board, the PCB board is tightly fitted to the outer surface of the heat-conducting substrate, and the two end surfaces of the PCB board are respectively tightly abutted against two annular covers; a heat dissipation structure for assisting heat dissipation is arranged on the inner side of the heat-conducting substrate; the photocatalyst carrier layer includes a light-transmitting outer plate and a photocatalyst surface layer arranged on the outer surface of the light-transmitting outer plate, and the light diffusion layer is arranged between the light-transmitting outer plate and the PCB board, and is used to diffuse light and allow the light source to irradiate the photocatalyst surface layer. Based on this, the photocatalytic reactor can have high heat dissipation performance and maintain a good service life.

Description

Technical Field

[0001] The present application relates to the technical field of photocatalytic reaction, and in particular to a tubular LED photocatalytic reactor. Background Art

[0002] With the rapid development of industry, the problem of wastewater pollution control is becoming more and more serious. Due to different production processes and types, industrial wastewater contains different components, with complex components, high COD, many difficult-to-degrade substances, and strong toxicity, which requires degradation and discharge. Photocatalytic technology stands out among many wastewater treatment processes with its excellent degradation characteristics. Photocatalysts represented by nano-TiO2 have the advantages of stable chemical properties, high activity, and reusability. They have unique advantages in the treatment of medical wastewater, pharmaceutical wastewater, electroplating wastewater, and bleaching and dyeing wastewater, and can be widely used.

[0003] Photocatalytic reactions need to be carried out under light conditions; with the development and progress of modern science and technology, the application of LED lamps has become popular. LED light sources are widely favored by people because of their advantages such as high light efficiency, low power consumption, narrow spectrum, small size, pollution-free, and compliance with energy-saving and environmental protection requirements. Since the spectrum of LED light sources is relatively narrow, usually 20-30nm, in this spectral range, the combination of multiple LED light sources can form any desired spectral shape, thus providing the photocatalyst with a fully absorbable spectrum to facilitate the smooth progress of the photocatalytic reaction.

[0004] Based on this, the technology of providing lighting conditions for photocatalytic reactors through LED light source modules has gradually become popular; the LED light source modules in the prior art usually include LED chips and PCB boards as carriers of LED chips. However, when the LED light source modules are operating to provide lighting, the LED chips will generate a lot of heat. Due to the large number of LED chips, the total LED power is large when the reactor is used, and the heat inside the reactor is high; if the heat cannot be dissipated in time, the temperature of the light source module will rise, which will affect the luminous efficiency and stability of the light source module and shorten the service life of the light source module. Therefore, people are in urgent need of developing a photocatalytic reactor with high heat dissipation performance, which can keep the photocatalytic reactor in good service life. Summary of the invention

[0005] Based on this, the present application provides a tubular LED photocatalytic reactor, which has high heat dissipation performance and can maintain a good service life.

[0006] The tubular LED photocatalytic reactor provided in this application adopts the following technical solution:

[0007] A tubular LED photocatalytic reactor comprises a reactor body; the reactor body comprises a heat-conducting substrate, an LED light source module, a light diffusion layer and a photocatalyst carrier layer; the heat-conducting substrate is a hollow cylindrical member, and both ends of the outer surface of the heat-conducting substrate are respectively threadedly connected with annular sealing covers;

[0008] The LED light source module includes a PCB board and a plurality of LED chips arranged on the PCB board. The PCB board is closely attached to the outer surface of the heat-conducting substrate, and the two end surfaces of the PCB board are closely attached to the two ring-type sealing covers respectively. A heat dissipation structure for assisting heat dissipation is arranged on the inner side of the heat-conducting substrate.

[0009] The photocatalyst carrier layer includes a light-transmitting outer plate and a photocatalyst surface layer arranged on the outer surface of the light-transmitting outer plate. The light diffusion layer is arranged between the light-transmitting outer plate and the PCB board to diffuse light and allow the light source to irradiate the photocatalyst surface layer.

[0010] By adopting the above-mentioned technical scheme, when the photocatalytic reactor of the present application is in use, the photocatalytic reactor is placed in a container filled with contaminated liquid, the LED light source module is energized to make the LED chip emit light, the light can be evenly diffused through the light diffusion layer and irradiated to the photocatalyst carrier layer, the light is irradiated to the surface of the photocatalyst through the transparent outer plate to form a photocatalytic reaction, so that the contaminated liquid in contact with the surface of the photocatalyst can undergo a chemical reaction and be degraded and purified.

[0011] When the photocatalytic reactor is running, the LED light source module continuously generates a large amount of heat, and this part of the heat can be transferred to the thermal conductive substrate via the PCB board; since the photocatalytic reactor is in the contaminated liquid, the contaminated liquid can take away the heat on the thermal conductive substrate during the flow into the inner side of the thermal conductive substrate, and the heat dissipation is assisted by the heat dissipation structure, which can greatly improve the heat dissipation performance of the photocatalytic reactor and ensure that the photocatalytic reactor can maintain a good service life.

[0012] Optionally, the heat dissipation structure includes multiple flow guide tubes, each of which is passed through and fixed to the reactor body, and all the flow guide tubes are spirally extended along the axial direction of the reactor body to form a rotating stepped heat exchange channel on the inner side of the heat-conducting substrate; the flow guide tubes are made of heat-conducting metal material, and both ends of the flow guide tubes protrude from the outer surface of the reactor body respectively.

[0013] By adopting the above technical solution, the arrangement of each flow guide tube allows a rotating stepped heat exchange flow channel to be formed on the inner side of the heat conductive substrate. When the contaminated liquid enters the inner side of the heat conductive substrate, it can flow along the heat exchange flow channel and more in a spiral path, thereby prolonging the residence time of the contaminated liquid on the inner side of the heat conductive substrate, which is beneficial for the heat on the heat conductive substrate to be fully transferred to the contaminated liquid for sufficient heat dissipation; and, after absorbing heat, the contaminated liquid contacts the flow guide tube, and its heat can be transferred to the contaminated liquid outside the reactor body through the flow guide tube, which can also play a further heat dissipation role.

[0014] Optionally, the guide tube is a hollow component, the interior of the guide tube is divided into two partition chambers by a partition component, and the two ends of the guide tube are respectively connected to end caps for closing the partition chamber; one of the partition chambers is set as a counterweight chamber, every two adjacent counterweight chambers are located on the same side of the adjacent guide tubes, and a freely movable counterweight body is provided inside the counterweight chamber.

[0015] By adopting the above-mentioned technical solution, the guide tube is placed in a container filled with contaminated liquid, and the contaminated liquid needs to be kept in a flowing state with the help of an external power device; the photocatalytic reactor of the present application is placed inside the container so that it is in a horizontal state and can rotate freely. At this time, a part of the counterweight body is located above the horizontal central axis of the reactor body, and this part of the counterweight body can contact the partition member under its own gravity; the other part of the counterweight body is located below the horizontal central axis of the reactor body, and this part of the counterweight body can rest against the side of the counterweight chamber away from the partition member under its own gravity.

[0016] It can be seen from this that the torque from the counterweight located above the horizontal center axis of the reactor body to the center axis of the reactor body will be smaller than the torque from the counterweight located below the horizontal center axis of the reactor body to the center axis of the reactor body. When impacted by a small force of the contaminated liquid, the reactor body can more easily rotate circumferentially, which can not only enhance the contact between the surface layer of the photocatalyst and the contaminated liquid for degradation and purification, but also help the contaminated liquid on the inner side of the thermal substrate to form turbulence, prolong the residence time of the contaminated liquid on the inner side of the thermally conductive substrate, and further improve the heat dissipation performance.

[0017] Optionally, the counterweight body includes at least one steel ball, the outer diameter of the steel ball is matched with the inner diameter of the counterweight chamber, and each steel ball is freely rolled along the axial direction of the guide tube.

[0018] By adopting the above-mentioned technical scheme, by arranging the steel ball inside the counterweight chamber, the reactor body rotates circumferentially so that the steel ball originally below the horizontal central axis is switched to above the horizontal central axis, or the steel ball originally above the horizontal central axis is switched to below the horizontal central axis, the steel ball can move along the counterweight chamber and impact the inner wall of the counterweight chamber; the impact force of the steel ball acting on the guide tube can further drive the reactor body to rotate, which can not only further improve the flow effect between the contaminated liquid and the heat-conducting substrate and enhance the heat dissipation performance; it is also beneficial for the contaminated liquid to contact with the surface layer of the photocatalyst, so as to facilitate the smooth progress of the photocatalytic reaction.

[0019] Optionally, the partition member is a spherical airbag fixed in the middle of the guide tube, the outer arc surface of the spherical airbag is tightly bonded to the inner wall of the guide tube, and the outer wall of the guide tube is provided with a through opening connected to the inlet end / outlet end of the spherical airbag.

[0020] By adopting the above-mentioned technical solution, by using a spherical airbag as a partitioning member for separating the inside of the guide tube, the contaminated liquid can enter the spherical airbag along the inlet end of the spherical airbag; when the steel ball moves along the counterweight chamber and hits the spherical airbag, the contaminated liquid inside the spherical airbag can be quickly squeezed out, and this part of the contaminated liquid and the contaminated liquid originally flowing on the inside of the thermally conductive substrate can form impact and turbulence, which is also beneficial to prolong the residence time of the contaminated liquid on the inside of the thermally conductive substrate, thereby further improving the heat dissipation performance.

[0021] Optionally, the heat dissipation structure includes a honeycomb panel arranged on the inner surface of the heat conductive substrate.

[0022] By adopting the above technical solution, the setting of the honeycomb plate can increase the contact area between the contaminated liquid and the honeycomb plate, and is also beneficial for the heat on the thermal conductive substrate to be fully transferred to the contaminated liquid for sufficient heat dissipation, thereby improving the heat dissipation performance of the photocatalytic reactor.

[0023] Optionally, the PCB board includes a plurality of strip sub-boards closely arranged along the outer surface of the thermally conductive substrate, and all LED chips are evenly arranged on each strip sub-board; a special-shaped conductive part is fixed to the side of the strip sub-board, and the special-shaped conductive part has a first extension portion extending toward an adjacent strip sub-board and a second extension portion extending away from the thermally conductive substrate; the abutting surface between the first extension portion and the adjacent strip sub-board is an inclined guide surface, and when the strip sub-board moves along the inclined guide surface in a direction away from the thermally conductive substrate, the movement of the strip sub-board is restricted by the second extension portion.

[0024] By adopting the above-mentioned technical scheme, the PCB board is formed by a plurality of strip sub-boards arranged and enclosed, and the first extension part and the second extension part cooperate to maintain the connectionless cooperation of each strip sub-board; when the photocatalytic reactor has been used for a period of time and one or part of the LED chips fail to light up, the light diffusion layer can be removed and the corresponding faulty strip sub-board can be quickly replaced, which can save resources without scrapping the entire photocatalytic reactor, effectively reducing the cost of degrading and purifying the contaminated liquid.

[0025] Optionally, the second extension portion has a cutting edge on a side away from the strip-shaped sub-board.

[0026] By adopting the above technical solution and setting a cutting edge, when a faulty strip sub-board needs to be replaced, the light diffusion layer at the corresponding position is pressed against the cutting edge, so that the light diffusion layer can be smoothly cut, so as to facilitate rapid replacement and maintenance of the strip sub-board.

[0027] Optionally, threaded sections are respectively provided at both ends of the thermal conductive substrate, and at least one threaded section is provided with a wiring slot, which is used to allow the wires connected to the LED light source module to pass through; the inner surface of the annular cover is provided with an internal thread, and the internal thread and the threaded section are threadedly adapted; in the assembled state, the two end surfaces of the light-transmitting outer plate are respectively tightly abutted against the two annular covers.

[0028] By adopting the above technical solution, the annular sealing cover threadedly connected to the end of the heat-conducting substrate can keep the area between the PCB board and the light-transmitting outer plate sealed, play a waterproof role, and reduce the possibility of contaminated liquid entering the area between the PCB board and the light-transmitting outer plate and contacting the LED chip to cause LED chip failure; the arrangement of the wiring card slot can allow the wire to pass through and connect to the PCB board, thereby facilitating the external power supply to operate the LED light source module to emit light.

[0029] Optionally, in the assembled state, a closed space is formed between the light-transmitting outer panel, the PCB board and the two ring-type covers; the light diffusion layer is made of a transparent silicone material and a scattering agent is added inside, and the light diffusion layer is cured and formed inside the closed space.

[0030] By adopting the above-mentioned technical scheme, a molten silica gel solution is injected into a confined space, and a light diffusion layer can be formed after the silica gel solution is solidified and formed, which plays a good protective role for the LED light source film; and because a scattering agent is added to the silica gel solution, the light generated by the LED chip can be diffused by the light diffusion layer and evenly illuminated on the surface of the photocatalyst, so as to fully realize the photocatalytic reaction on the surface of the photocatalyst.

[0031] In summary, the present application includes at least one of the following beneficial technical effects:

[0032] 1. When the photocatalytic reactor is placed in a container filled with contaminated liquid, the contaminated liquid can take away the heat transferred to the thermally conductive substrate during its flow into the inner side of the thermally conductive substrate, and the heat dissipation is assisted by the heat dissipation structure, which can greatly improve the heat dissipation performance of the photocatalytic reactor and ensure that the photocatalytic reactor can maintain a good service life;

[0033] 2. By inserting a plurality of flow guide tubes in the reactor body, a rotating stepped heat exchange flow channel is formed inside the heat conductive substrate. When the contaminated liquid flows through the inside of the heat conductive substrate, it can flow along the heat exchange flow channel and more in a spiral path, thereby prolonging the residence time of the contaminated liquid inside the heat conductive substrate, which is conducive to the full transfer of heat from the heat conductive substrate to the contaminated liquid for full heat dissipation;

[0034] 3. By adding a scattering agent into the silica gel material, the light generated by the LED chip can be diffused by the light diffusion layer and evenly illuminated on the surface of the photocatalyst to fully realize the photocatalytic reaction on the surface of the photocatalyst. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a schematic diagram of the overall structure of the photocatalytic reactor of Example 1;

[0036] Figure 2 is an exploded view of the overall structure of the photocatalytic reactor of Example 1;

[0037] Figure 3 is a schematic diagram of the overall structure of the photocatalytic reactor of Example 2;

[0038] Figure 4 is a schematic diagram of a half-section structure of the flow guide pipe in Example 3;

[0039] Figure 5 is a schematic diagram of the overall structure of the photocatalytic reactor of Example 3;

[0040] Figure 6 is a schematic diagram of a half-section structure of the flow guide pipe in Example 4;

[0041] Figure 7 is a structural schematic diagram of the LED light source module in Example 5;

[0042] Figure 8 This is an axial view of the PCB board in Example 5.

[0043] Explanation of the reference numerals: 1. thermal conductive substrate; 11. threaded section; 12. wiring slot; 2. LED light source module; 21. LED chip; 22. PCB board; 23. strip sub-board; 24. special-shaped conductive part; 241. first extension part; 242. second extension part; 243. cutting edge; 3. light diffusion layer; 4. photocatalyst carrier layer; 41. light-transmitting outer plate; 42. photocatalyst surface layer; 5. ring-type cover; 6. heat dissipation structure; 61. flow guide tube; 611. partition cavity; 612. counterweight cavity; 613. through port; 62. steel ball; 63. end cap; 7. partition member; 71. partition plate; 72. spherical airbag. DETAILED DESCRIPTION

[0044] The following is combined with Figure 1-8 This application is described in further detail. Example 1

[0045] The embodiment of the present application discloses a tubular LED photocatalytic reactor.

[0046] Reference Figure 1 A tubular LED photocatalytic reactor includes a reactor body, wherein the reactor body includes a heat-conducting substrate 1, an LED light source module 2, a light diffusion layer 3 and a photocatalyst carrier layer 4; wherein the heat-conducting substrate 1 is a hollow cylindrical member, and the inner side of the heat-conducting substrate 1 has a heat dissipation space, which can allow the contaminated liquid to pass through for heat dissipation. The heat-conducting substrate 1 in this embodiment is made of aluminum alloy material, which has excellent thermal conductivity; of course, in other feasible embodiments, the material of the heat-conducting substrate 1 can also be processed from copper, iron or other metal materials capable of heat conduction, which is not limited to the content shown in this embodiment.

[0047] A heat dissipation structure 6 for assisting heat dissipation is provided inside the heat conductive substrate 1. In this embodiment, the heat dissipation structure 6 is a honeycomb panel, the material of the honeycomb panel is the same as that of the heat conductive substrate 1, and the honeycomb panel is integrally formed with the heat conductive substrate 1. It should be noted that in other feasible implementations, the heat dissipation structure 6 may also be other structures or other materials, and is not limited to the content shown in this embodiment.

[0048] Reference Figure 2 The LED light source module 2 includes a PCB board 22 and a plurality of LED chips 21, and the plurality of LED chips 21 are evenly arranged in multiple rows and columns on the outer surface of the PCB board 22; in this embodiment, the PCB board 22 is a flexible substrate, which can be wound around the outer surface of the thermal conductive substrate 1 and closely bonded thereto. Of course, in other feasible implementations, the PCB board 22 can also be a rigid substrate, which can be sleeved on the outer surface of the thermal conductive substrate 1 and closely bonded thereto.

[0049] The photocatalyst carrier layer 4 includes a light-transmitting outer plate 41 and a photocatalyst surface layer 42 disposed on the surface of the light-transmitting outer plate 41. The light-transmitting outer plate 41 can be processed from transparent glass or transparent PMMA material and has light-transmitting capability. The light-transmitting outer plate 41 is disposed on the outer peripheral side of the thermal conductive substrate 1 and is coaxial with the PCB board 22. The photocatalyst surface can be a catalyst coating coated on the outer surface of the light-transmitting outer plate 41, or a catalyst surface bonded to the outer surface of the light-transmitting outer plate 41, as long as it can form a photocatalytic reaction under light conditions.

[0050] The two ends of the outer surface of the heat-conducting substrate 1 are respectively provided with annular covers 5; specifically, the two ends of the heat-conducting substrate 1 are respectively provided with threaded sections 11, and the inner surface of the annular covers 5 is provided with internal threads, and the annular covers 5 can be threadedly connected with the threaded sections 11 through the internal threads, so that the annular covers 5 are threadedly connected to the end of the heat-conducting substrate 1. It should be noted here that the outer diameter of the annular covers 5 will be larger than the outer diameter of the light-transmitting outer plate 41. After the two annular covers 5 are connected to the heat-conducting substrate 1, the two end faces of the PCB board 22 can be tightly abutted against the two annular covers 5, and at the same time, the two end faces of the light-transmitting outer plate 41 can also be tightly abutted against the two annular covers 5. The inner diameter of the light-transmitting outer plate 41 is larger than the outer diameter of the PCB board 22, and a sealed space can be formed between the two.

[0051] At least one of the two thread segments 11 is provided with a wiring slot 12, which penetrates the thread segment 11 along the axial direction of the thermal conductive substrate 1, and can allow the wire to pass through when the annular cover 5 is connected to the thermal conductive substrate 1. One end of the wire is electrically connected to the PCB board 22, and the other end is used to be electrically connected to an external power supply, which can supply power to the PCB board 22 to enable the LED light source module 2 to operate and emit light.

[0052] The light diffusion layer 3 is made of transparent silicone material, and a scattering agent is added to the internal components of the silicone, which can make the light evenly diffuse when irradiated on the light diffusion layer 3. The light diffusion layer 3 is arranged between the light-transmitting outer plate 41 and the PCB board 22. In the specific molding process, the light diffusion layer 3 can be smoothly formed by injecting a silicone solution doped with a scattering agent into the sealed space and curing the silicone solution in the sealed space. After the light diffusion layer 3 is formed, the gap between the annular cover 5 and the photocatalyst carrier layer 4 is sealed with silicone rubber, and the wiring card slot 12 can also be sealed with silicone rubber, thereby reducing the possibility of contaminated liquid entering the sealed space and contacting the LED chip 21.

[0053] The implementation principle of Example 1 of the present application is:

[0054] When the photocatalytic reactor of this embodiment is used, the photocatalytic reactor is placed in a container filled with polluted liquid, and the LED light source module 2 is powered on to emit light, which is evenly diffused through the light diffusion layer 3 and irradiated on the photocatalyst surface layer 42, so that the pollution source in contact with the photocatalyst surface layer 42 can be degraded and purified. Since the polluted liquid will flow into the inner side of the heat-conducting substrate 1, the heat transferred to the heat-conducting substrate 1 can be taken away during the flow process, and the heat dissipation is assisted by the heat dissipation structure 6, which can greatly improve the heat dissipation performance of the photocatalytic reactor and ensure that the photocatalytic reactor can maintain a good service life. Example 2

[0055] The embodiment of the present application discloses a tubular LED photocatalytic reactor.

[0056] Reference Figure 3 The embodiment of the present application discloses a tubular LED photocatalytic reactor, and the remaining components are the same as those in the embodiment 1, and are not described one by one here; the difference from the embodiment 1 is that the heat dissipation structure 6 in the embodiment of the present application includes a plurality of flow guide tubes 61, and the flow guide tubes 61 are made of a heat-conducting metal material. In this embodiment, the same aluminum alloy material as the heat-conducting substrate 1 is selected.

[0057] Each flow guide pipe 61 is inserted through the reactor body and fixed to the reactor body. The axial direction of the flow guide pipe 61 is the same as the radial direction of the reactor body, and all the flow guide pipes 61 are arranged in a spiral extension along the axial direction of the reactor body, so that a rotating stepped heat exchange flow channel is formed inside the heat conductive substrate 1 to extend the residence time of the contaminated liquid inside the heat conductive substrate 1. In addition, both ends of each flow guide pipe 61 protrude from the outer surface of the reactor body to achieve rapid heat dissipation.

[0058] The implementation principle of Example 2 of the present application is:

[0059] In this embodiment, each flow guide tube 61 is provided to form a stepped heat exchange flow channel inside the heat conductive substrate 1. After the contaminated liquid enters the inside of the heat conductive substrate 1, it can flow along the heat exchange flow channel and more in a spiral path, which can extend the residence time of the contaminated liquid inside the heat conductive substrate 1, which is beneficial for the heat on the heat conductive substrate 1 to be fully transferred to the contaminated liquid for sufficient heat dissipation, so that the photocatalytic reactor has high heat dissipation performance. Example 3

[0060] The embodiment of the present application discloses a tubular LED photocatalytic reactor.

[0061] Reference Figure 4 , Figure 5The embodiment of the present application discloses a tubular LED photocatalytic reactor, and the remaining components are the same as those in the embodiment 2, which will not be described one by one here; the difference from the embodiment 2 is that the flow guide tube 61 in the embodiment of the present application is a hollow component, and a partition member 7 is provided on the inner wall of the flow guide tube 61, and the interior of the flow guide tube 61 can be divided into two partition chambers 611 by the partition member 7. It should be noted that the partition member 7 in the present embodiment is a partition plate 71 integrally formed on the inner wall of the flow guide tube 61.

[0062] Both ends of the flow guide tube 61 are respectively threadedly connected with end caps 63, and the end caps 63 are set to close the partition cavity 611; one of the partition cavities 611 on each flow guide tube 61 is set as a counterweight chamber 612, and every two adjacent configuration chambers are located on the same side of the adjacent flow guide tubes 61; based on this, each counterweight chamber 612 is also regarded as being arranged to extend spirally along the axial direction of the reactor body.

[0063] A freely movable counterweight body is disposed inside the counterweight chamber 612. In this embodiment, the counterweight body includes at least one steel ball 62, specifically one steel ball; the outer diameter of the steel ball 62 is equal to the inner diameter of the counterweight chamber 612, and there is a clearance fit between the steel ball 62, so that the steel ball 62 can roll freely along the axial direction of the guide tube 61.

[0064] The implementation principle of Example 3 of the present application is:

[0065] When the photocatalytic reactor of this embodiment is in use, it can be placed in a container in a horizontal state and allowed to rotate freely in a circumferential direction; the container uses an external power device, such as a vibrator, to force the contaminated liquid to be in a flowing state. At this time, the contaminated liquid only needs to be acted on the reactor body by a very small water flow force, so that the reactor body can be rotated in one direction for a long time. This can not only enhance the contact between the photocatalyst surface layer 42 and the contaminated liquid for degradation and purification, but also help the contaminated liquid inside the thermal substrate 1 to form turbulence, prolong the residence time of the contaminated liquid inside the thermal substrate 1, and further improve the heat dissipation performance. Example 4

[0066] The embodiment of the present application discloses a tubular LED photocatalytic reactor.

[0067] Reference Figure 6The embodiment of the present application discloses a tubular LED photocatalytic reactor, and the remaining components are the same as those in Example 3, which will not be described one by one here; the difference from Example 3 is that the partition member 7 in the embodiment of the present application is a spherical airbag 72 fixed to the middle part of the guide tube 61, and the outer arc surface of the spherical airbag 72 is tightly bonded to the inner wall of the guide tube 61, and the outer wall of the guide tube 61 is provided with two through openings 613, and the two through openings 613 can be respectively connected to the inlet end of the spherical airbag 72 and the outlet end of the spherical airbag 72.

[0068] The implementation principle of Example 4 of the present application is:

[0069] When the reactor body of the present embodiment rotates circumferentially, the steel ball 62 can move along the counterweight chamber 612 and hit the spherical airbag 72. At this time, the contaminated liquid inside the spherical airbag 72 can be quickly squeezed out in an instant. This part of the contaminated liquid and the contaminated liquid originally flowing on the inner side of the thermal conductive substrate 1 can form impact and turbulence, and can also extend the residence time of the contaminated liquid inside the thermal conductive substrate 1, further improving the heat dissipation performance. Example 5

[0070] The embodiment of the present application discloses a tubular LED photocatalytic reactor.

[0071] Reference Figure 7 The embodiment of the present application discloses a tubular LED photocatalytic reactor, and the remaining components are the same as those in Example 1, and will not be described one by one here; the difference from Example 1 is that the PCB board 22 in the embodiment of the present application includes a plurality of strip sub-boards 23, all of the strip sub-boards 23 are closely arranged along the outer surface of the thermal conductive substrate 1, and all the LED chips 21 are evenly arranged on each strip sub-board 23.

[0072] Reference Figure 8 The side of the strip sub-board 23 is tightly bonded and fixed with a special-shaped conductive member 24, which can be processed from conductive metals such as copper, silver or iron; the special-shaped conductive member 24 has a first extension portion 241 extending in the direction of the adjacent strip sub-board 23 and a second extension portion 242 extending in the direction away from the heat-conducting substrate 1, and the abutting surface of the first extension portion 241 and another adjacent strip sub-board 23 is set as an inclined guide surface. As shown in the figure, when the side edge of the second extension portion 242 is at point A and is in a vertical state, the adjacent inclined guide surface along the time direction needs to be inclined outward relative to the vertical direction, so that when the strip sub-board 23 moves along the inclined guide surface in the direction away from the heat-conducting substrate 1, it can be restricted by the second extension portion 242, so that when each strip sub-board 23 is assembled head to tail in sequence, it can maintain the assembled state, which is conducive to the smooth filling and curing of the light diffusion layer 3.

[0073] In addition, the second extension portion 242 has a cutting edge portion 243 on the side away from the strip sub-board 23. When the LED chip 21 on a strip sub-board 23 fails and is damaged, the light diffusion layer 3 can be smoothly cut by pressing the corresponding position of the light diffusion layer 3 so that it abuts against the cutting edge portion 243, so that the strip sub-board 23 can be quickly replaced and maintained.

[0074] Finally, it should be noted that the solution in this embodiment can also be applied to the solution in Embodiment 2, Embodiment 3 or Embodiment 4, and is not limited to the method shown in this embodiment.

[0075] The implementation principle of Example 5 of the present application is:

[0076] When the photocatalytic reactor has been used for a period of time and one or some of the LED chips 21 fail to light up, the annular cover 5 and the light-transmitting outer plate 41 are removed, forcing the light diffusion layer 3 at the corresponding position to deform inward and press against the cutting edge 243, so that the light diffusion layer 3 can be quickly cut; at this time, the strip sub-board 23 where the faulty LED chip 21 is located is directly forced to move outward, and the strip sub-board 23 can squeeze away the adjacent strip sub-boards 23 and be quickly removed, so as to facilitate the rapid replacement and maintenance of the strip sub-board 23.

[0077] When the strip sub-board 23 is repaired or needs to be replaced with a new strip sub-board 23, the strip sub-board 23 is reinserted between the two strip sub-boards 23, and then the light-transmitting outer plate 41 and the annular cover 5 are reinstalled, and the silica gel solution is re-injected into the position of the cut light diffusion layer 3. After the silica gel solution is re-solidified, it can adhere to the original light diffusion layer 3, and then the maintenance and replacement work of the photocatalytic reactor can be quickly completed.

[0078] The above are preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A tubular LED photocatalytic reactor, comprising a reactor body; characterized in that: The reactor body comprises a heat-conducting substrate (1), an LED light source module (2), a light diffusion layer (3) and a photocatalyst carrier layer (4); the heat-conducting substrate (1) is a hollow cylindrical member, and both ends of the outer surface of the heat-conducting substrate (1) are respectively threadedly connected with an annular sealing cover (5); The LED light source module (2) comprises a PCB board (22) and a plurality of LED chips (21) arranged on the PCB board (22); the PCB board (22) is tightly fitted to the outer surface of the heat-conducting substrate (1), and the two end surfaces of the PCB board (22) are tightly fitted to two annular sealing covers (5) respectively; a heat dissipation structure (6) for assisting heat dissipation is arranged on the inner side of the heat-conducting substrate (1); The photocatalyst carrier layer (4) comprises a light-transmitting outer plate (41) and a photocatalyst surface layer (42) arranged on the outer surface of the light-transmitting outer plate (41); the light diffusion layer (3) is arranged between the light-transmitting outer plate (41) and the PCB board (22) and is used to diffuse light and allow the light source to irradiate the photocatalyst surface layer (42); The heat dissipation structure (6) comprises a plurality of flow guide tubes (61), each of which is passed through and fixed to the reactor body, and all of the flow guide tubes (61) are arranged in a spiral extension along the axial direction of the reactor body, so as to form a rotating stepped heat exchange flow channel inside the heat conductive substrate (1); the flow guide tubes (61) are made of a heat conductive metal material, and both ends of the flow guide tubes (61) protrude from the outer surface of the reactor body respectively; The flow guide tube (61) is a hollow member, the interior of the flow guide tube (61) is divided by a partition member (7) to form two partition chambers (611), and both ends of the flow guide tube (61) are respectively connected with end caps (63) for closing the partition chamber (611); one of the partition chambers (611) is configured as a counterweight chamber (612), and every two adjacent counterweight chambers (612) are located on the same side of the adjacent flow guide tubes (61), and a freely movable counterweight body is provided inside the counterweight chamber (612).

2. The tubular LED photocatalytic reactor according to claim 1, characterized in that: The counterweight body comprises at least one steel ball (62), the outer diameter of the steel ball (62) is matched with the inner diameter of the counterweight chamber (612), and each of the steel balls (62) is freely rollably arranged along the axial direction of the flow guide tube (61).

3. The tubular LED photocatalytic reactor according to claim 2, characterized in that: The partition member (7) is a spherical airbag (72) fixed to the middle of the flow guide tube (61); the outer arc surface of the spherical airbag (72) is tightly bonded to the inner wall of the flow guide tube (61); and the outer wall of the flow guide tube (61) is provided with a through opening (613) connected to the inlet end / outlet end of the spherical airbag (72).

4. The tubular LED photocatalytic reactor according to claim 1, characterized in that: The heat dissipation structure (6) comprises a honeycomb plate arranged on the inner surface of the heat-conducting substrate (1).

5. The tubular LED photocatalytic reactor according to claim 1, characterized in that: The PCB board (22) comprises a plurality of strip-shaped sub-boards (23) closely arranged along the outer surface of the heat-conducting substrate (1), and all the LED chips (21) are evenly arranged on each strip-shaped sub-board (23); a special-shaped conductive member (24) is fixed to the side surface of the strip-shaped sub-board (23), and the special-shaped conductive member (24) has a first extension portion (241) extending in the direction of an adjacent strip-shaped sub-board (23) and a second extension portion (242) extending in the direction away from the heat-conducting substrate (1); the contact surface between the first extension portion (241) and the adjacent strip-shaped sub-board (23) is an inclined guide surface, and when the strip-shaped sub-board (23) moves along the inclined guide surface in the direction away from the heat-conducting substrate (1), the movement of the strip-shaped sub-board (23) is restricted by the second extension portion (242).

6. The tubular LED photocatalytic reactor according to claim 5, characterized in that: The second extension portion (242) has a cutting edge portion (243) on a side away from the strip-shaped sub-plate (23).

7. The tubular LED photocatalytic reactor according to claim 1, characterized in that: The two ends of the heat-conducting substrate (1) are respectively provided with threaded sections (11), and at least one of the threaded sections (11) is provided with a wiring slot (12), and the wiring slot (12) is used to allow a wire connected to the LED light source module (2) to pass through; the inner surface of the annular cover (5) is provided with an internal thread, and the internal thread is threadedly matched with the threaded section (11); in the assembled state, the two end surfaces of the light-transmitting outer plate (41) are respectively tightly abutted against the two annular covers (5).

8. The tubular LED photocatalytic reactor according to claim 1, characterized in that: In the assembled state, the light-transmitting outer plate (41), the PCB board (22) and the two annular sealing covers (5) together form a closed space; the light diffusion layer (3) is made of a transparent silicone material and has a scattering agent added therein; the light diffusion layer (3) is solidified and formed inside the closed space.

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