Tile-type integrated radio frequency receiving array front end of open architecture

Abstract

The invention discloses a tile-type integrated radio frequency receiving array front end of an open architecture. The front end comprises an antenna module, a tile type front end receiving module, a frequency conversion module, a multifunctional feed panel, a comprehensive digital module and a power supply module, wherein the antenna module is used for receiving space electromagnetic signals; the front-end receiving module amplifies a space electromagnetic signal received by an antenna, performs sub-array-level signal synthesis, and performs amplitude-phase modulation of an analog signal; the frequency conversion module converts a broadband radio frequency signal into an intermediate frequency signal; the multifunctional feed panel provides a connection interface for analog signals and digital signals; the integrated digital module converts analog and radio frequency signals into digital signals, generates high-speed data streams and performs unified control on array surface amplitude-phase frequency conversion; and the power supply module provides power supply and power management for each functional module. The antenna has the advantages of integrated structure, open architecture, reconfigurable function, light and thin structure and broadband reception, and can meet the functional requirements of radar, electronic warfare and communication.

Description

Technical Field

[0001] The present invention relates to the technical field of system design of phased array arrays, in particular to a front end of a tile-type integrated radio frequency receiving array with an open architecture. Background Art

[0002] In modern confrontation environments, the mastery of electromagnetic information determines the key to victory in war. Faced with complex combat environments, shipborne platforms are required to have strong electromagnetic reception capabilities. Traditional shipborne RF receivers have established various receiving channels with many different functions, which has led to the continuous increase of antenna equipment in the superstructure, interference between various systems, and the need for additional electromagnetic compatibility design. It also has a significant impact on the electromagnetic stealth performance of the ship, making it difficult to adapt to future combat needs.

[0003] Patent CN113938146A discloses a Ka-band highly integrated ultra-low noise tile-type receiving component, which adopts the method of assembling a monitoring network and a receiving channel in a component shell to realize a tile-type highly integrated design of the Ka-band. However, the interface in the component is not open and can only be applied to a certain model of product; Patent CN115688210A discloses a tile-type multi-channel transceiver subarray design method, which combines antennas and transceiver components to form a transceiver subarray, improves system integration, and reduces array height, but the subarray is only integrated to the analog channel part, and requires the cooperation of modules such as the back-end digital power supply, and still cannot realize the complete independent subarray function.

[0004] In order to solve the above problems, there is an urgent need for an integrated receiving array that is compatible with radar, electronic warfare, communication and other functions to implement functional control and unified resource scheduling. Summary of the invention

[0005] The purpose of the present invention is to provide a tile-type integrated radio frequency receiving array front end with an open architecture, reconfigurable functions, compatibility with multiple functional applications, and strong expansibility.

[0006] The technical solution to achieve the purpose of the present invention is: an open-architecture tile-type integrated radio frequency receiving array front end, including an antenna module, a front-end receiving module, a frequency conversion module, a multifunctional feed board, an integrated digital module and a power module;

[0007] The antenna module is used to provide matching between spatial electromagnetic and radio frequency transmission channels and regularly monitor the amplitude and phase changes of each channel of the array surface;

[0008] The front-end receiving module is used to amplify the spatial electromagnetic signal received by the antenna, perform signal synthesis at the subarray level, and perform amplitude and phase modulation of the analog signal according to the beam pointing to enhance the signal receiving strength at a certain direction in space;

[0009] The frequency conversion module is used to mix, filter and amplify the broadband radio frequency signal, convert it into an intermediate frequency signal, and suppress the additional spurious signals;

[0010] The multifunctional feeder board is used to provide a connection interface for analog signals and digital signals, and to provide connection control signals and power supply in a forward direction;

[0011] The integrated digital module is used to convert analog and radio frequency signals into digital signals, generate high-speed data streams according to input signals for back-end calculations, and provide a unified control function for array amplitude, phase and frequency conversion;

[0012] The power supply module adopts a high-frequency oscillation switching power supply to convert the input high-voltage signal into a variety of low-voltage power supplies for output, providing power supply and power management for each functional module.

[0013] Furthermore, the antenna module includes an antenna unit, an internal monitoring unit and an integrated wiring layer;

[0014] The antenna unit is used to match the spatial electromagnetic and radio frequency transmission channels; the antenna unit adopts a low-profile broadband antenna, including a tightly coupled cross-printed antenna, a Vivaldi antenna, a butterfly antenna and an open slot antenna to achieve broadband reception;

[0015] The internal monitoring unit synthesizes the coupling signals of each array element into an array plane internal monitoring signal, which enters the internal monitoring transceiver module at the rear end of the internal monitoring unit to regularly monitor the amplitude and phase changes of each channel of the array plane;

[0016] The integrated wiring layer connects the receiving radio frequency channel and the antenna module port to maintain the phase consistency of each channel;

[0017] The internal monitoring unit and the integrated wiring layer are implemented in the form of embedded wiring in a multi-layer radio frequency printed circuit board, and are designed as an integrated whole with the antenna module.

[0018] Furthermore, the front-end receiving module adopts a silicon-based packaging microsystem to realize the arrangement of the antenna subarray surface, as follows:

[0019] A silicon-based adapter board is used to package the front-end limiting amplifier chip, multi-channel amplitude and phase modulation chip, and combiner chip into a self-sealed device. The package body is stacked and welded to arrange the chips in a high-height manner. The silicon-based packaged microsystem module is patch-welded to the front-end carrier board, and the interface is front-to-back according to the tile-like architecture.

[0020] Furthermore, the frequency conversion module is packaged in an independent box, or the core functional chip is first packaged in a ceramic micro-package and then packaged in a box to improve the integration; the frequency conversion module can integrate channel delay and input switch combination switching functions.

[0021] Furthermore, the multifunctional feeding board adopts a multi-layer printed circuit board plus a micro-interconnection elastic connection method to distribute signals, and signal networks with different functions are arranged in layers inside the printed circuit board to realize the interconnection of various complex signals.

[0022] Furthermore, the integrated digital module is composed of digital, analog and optoelectronic devices, including AD chips, FPGA chips, optoelectronic conversion chips and power management chips, and a SOC chip integrating AD and FPGA computing cores; the integrated digital module can independently control the operation of the sub-arrays and generate directional information of targets in specific directions according to the application requirements of different functions and different payload platforms, and can also enable multiple sub-arrays or the entire array to work in coordination, thereby realizing flexible and configurable array aperture resources.

[0023] Furthermore, the front end of the tile-type integrated RF receiving array adopts a multi-level interface, a tile-type hierarchical connection design, a universal interface between modules, and adopts digital preprocessing, dynamic expansion of the receiver, array RF cancellation, and distributed preprocessing between different sub-arrays to achieve an open architecture and functional reconfiguration; each module has an independent functional interface, and each interface definition is allocated according to power supply, RF, and low-frequency control. A contact-type elastic joint is used. When each module is used separately, it independently realizes its own function. When the technology is upgraded and the modules are replaced, each module is upgraded according to the interface.

[0024] Furthermore, the front end of the tile-type integrated RF receiving array adopts microsystem integration and RF integrated wiring to reduce the volume of the front end of the tile-type integrated RF receiving array; the front end of the tile-type receiving front array adopts a universal architecture, and performs array expansion design according to different payload platforms and array scales, and splices them to form receiving arrays of different scales.

[0025] Furthermore, the front end of the tile-type integrated RF receiving array adopts a stacked design, based on a low-profile conformal antenna, and achieves a conformal design with the surface of the installation platform by designing the rear-end receiving structure arrangement.

[0026] Furthermore, the front end of the tile-type integrated RF receiving array adopts an AD chip that meets the dynamic and sampling rate requirements, covering the working bandwidth of multiple functions, and has both reconnaissance function and narrowband communication receiving function. At the same time, it can also cooperate with distributed radar to perform various forms of spatial beam switching.

[0027] Compared with the prior art, the present invention has the following significant advantages: (1) It has an open architecture, with forward and backward signal flow, clear hierarchical functions, and independent realization of each function. Modules with the same interface can be replaced independently, and the architecture is open; (2) Functional reconfigurability. The front end of the array can cover the working frequencies and working bandwidths of multiple functions, has high receiving dynamics, is compatible with radar, electronic warfare, communication and other functional applications, and can switch working modes at any time in coordination with the system; (3) It has scalability. The plane size of the front end architecture of the receiving array is smaller than the splicing size of the antenna. The array can be designed to be scalable according to different payload platforms and array scales, and can be arbitrarily spliced ​​to form receiving arrays of different scales. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the design decomposition of the present invention.

[0029] Figure 2 It is a structural block diagram of the front end of an open-architecture tile-type integrated radio frequency receiving array of the present invention.

[0030] Figure 3 It is a schematic structural diagram of the front end of the open architecture tile-type integrated radio frequency receiving array provided in the embodiment.

[0031] Figure 4 It is a schematic diagram of the structure of the front-end receiving module and the frequency conversion module in an embodiment of the present invention.

[0032] Figure 5 It is a schematic diagram of the principle of the expansion array in an embodiment of the present invention.

[0033] Figure 6 It is a schematic diagram of the structure of the tile-type receiving front end expansion splicing in an embodiment of the present invention. DETAILED DESCRIPTION

[0034] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail below in conjunction with the drawings of the specification. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary persons in the art without creative work should fall within the scope of protection of the present invention.

[0035] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0036] Combination Figure 1 to Figure 3The present invention provides an open-architecture tile-type integrated radio frequency receiving array front end, which specifically includes the following parts:

[0037] S1. Components: The front end of a tile-structured integrated RF receiving array mainly includes an antenna module, a front-end receiving module, a frequency conversion module, a multi-functional feeding board, an integrated digital module, a power supply module, etc.

[0038] S2. Working mechanism: The front end of a tile-structured integrated RF receiving array mainly receives electromagnetic signals radiated from space. After analog processing such as limiting amplification, amplitude phase modulation, subarray synthesis, and frequency conversion, it enters the AD sampling digital channel and generates a high-speed data stream after digital preprocessing. The data stream contains basic information such as frequency, amplitude, and phase of the complete electromagnetic signal in space. With this as input, various operations can be performed to obtain spatial electromagnetic perception information such as signal direction, modulation information, and target echo characteristics.

[0039] In order to be compatible with radar, electronic warfare, communication and other functions and provide an integrated universal receiving platform, the analog channel from the electromagnetic signal to the digital sampling end must adopt a broadband design as much as possible to cover the working bandwidth of multiple functions. The digital receiver uses a high-dynamic, high-sampling rate AD chip to improve the resolution in complex electromagnetic environments.

[0040] S3. Architecture design:

[0041] The front end of the integrated RF receiving array of the tile architecture is designed in layers according to the signal flow in the direction of signal transmission. The signal flow is spatial radiation, antenna module, receiving front-end module, frequency conversion module, multi-function feed board, integrated digital module, optical fiber output, and the multi-function feed board provides a connection interface for analog signals and digital signals, and provides connection control signals, power supply and other auxiliary resources forward.

[0042] S4, antenna module: The module function is further decomposed into antenna unit, internal monitoring unit, and integrated wiring layer. The antenna unit provides matching between spatial electromagnetic and radio frequency transmission channels. There are many ways to realize broadband receiving antennas. Tightly coupled cross-printed antennas, Vivaldi antennas, butterfly antennas, open slot antennas and other forms can be selected. The internal monitoring unit mainly provides additional coupling signals for each array element. After the monitoring signals in the array are synthesized, they are uniformly sent to the internal monitoring transceiver module at the back end, which can monitor the amplitude and phase changes of each channel of the array at regular intervals; the integrated wiring layer is mainly used to match the connection between the receiving radio frequency channel and the antenna module port, and the design must maintain the phase consistency of each channel. The internal monitoring unit and the integrated wiring layer are implemented in the form of buried wiring in a multi-layer radio frequency printed circuit board, which can be designed as an integrated part with the antenna unit.

[0043] S5, front-end receiving module: The main function is to further amplify the spatial electromagnetic signal received by the antenna, adopt subarray-level signal synthesis, and perform amplitude and phase modulation of analog signals according to the beam direction to enhance the signal reception strength in a certain direction in space. In order to realize the arrangement of the antenna subarray surface, the microsystem integration design is adopted in the implementation. Specifically, the front-end limiting amplifier chip, multi-channel amplitude and phase modulation chip, combining chip, etc. are packaged into a smaller-sized patch self-sealed device using a silicon-based adapter board. In order to improve the packaging efficiency, the inside of the package body can further adopt the stacking welding method to arrange the chips in a high-altitude manner. The silicon-based packaged microsystem module is patch-welded to the front-end carrier board, and the interface is front-end and back-end according to the tile-type architecture.

[0044] S6, frequency conversion module: The main function is to convert broadband RF signals into lower intermediate frequency signals through mixing, filtering, amplification, etc. In order to retain the integrity of RF information, the frequency conversion system must have high dynamics, and the additional stray signals generated during the frequency conversion process must be suppressed. In order to further cooperate with the array work, the functions of channel delay, input switch combination switching, etc. can be further integrated. In terms of implementation, it is necessary to use chips with multiple functions such as mixing, filtering, amplification, and switching. Since there are many functional chips involved inside and the interconnection relationship is complex, it can be implemented in an independent box packaging method, or the core functional chip can be packaged with ceramic micro-packaging technology, and then the box body is used for secondary packaging to improve the integration.

[0045] S7, multi-function feed board: the main function is to provide the connection interface of analog and digital signals, and to provide connection control signals, power supply and other auxiliary resources. In order to realize the interconnection of various complex signals in a limited space, the implementation mainly adopts multi-layer printed circuit board plus micro-interconnection elastic connection to realize signal distribution, and the signal network with different functions is arranged in layers inside the printed circuit board.

[0046] S8, integrated digital module: The main function is to convert analog and RF signals into digital signals, generate high-speed data streams based on input signals, provide back-end computing data, and also provide unified control functions for array amplitude, phase and frequency conversion control. In terms of implementation, it is mainly composed of digital, analog and optoelectronic devices such as AD chips, FPGA chips, optoelectronic conversion chips, power management chips, etc., and further, SOC chips integrating AD and FPGA computing cores can be used. The integrated digital module can independently control the sub-array operation and generate directional information of targets in specific azimuths according to the application requirements of different functions and different payload platforms, and can also work in coordination with multiple sub-arrays or the entire array to achieve flexible and configurable array aperture resources.

[0047] S9, power module: The main function is to convert the input high-voltage signal into a variety of low-voltage power outputs, provide power supply and power management for each functional module of the sub-array, and receive control signals from the integrated digital module. In terms of implementation, a high-frequency oscillation switching power supply is used to improve the power supply voltage conversion efficiency and minimize the heat consumption of the power module.

[0048] Furthermore, the front end of the tile-type integrated RF receiving array with an open architecture adopts a hierarchical design, which is forward and backward according to the signal flow, with clear hierarchical functions. The antenna module is responsible for the spatial electromagnetic interface, the front-end receiving module is responsible for amplitude and phase modulation, the frequency conversion module is responsible for the conversion of RF to intermediate frequency, the integrated digital module is responsible for digital preprocessing and beam control, and the power module provides high and low voltage conversion. Each module has an independent functional interface, and each interface definition is allocated according to power supply, RF, low-frequency control, etc., and a contact elastic joint is used for implementation. If each module is used separately, it can independently realize its own function, such as technology upgrades and module upgrades. Each module can be upgraded according to the interface without replacing the entire RF front end.

[0049] Furthermore, the front end of the tile-type integrated RF receiving array uses microsystem integration technology and RF integrated wiring technology to greatly reduce the volume. The plane size of the entire front end of the receiving array is smaller than the splicing size of the antenna. Therefore, the array can be expanded according to different load platforms and array sizes. As a universal architecture, the front end of the tile-type receiving array can be arbitrarily spliced ​​to form receiving arrays of different sizes.

[0050] Furthermore, due to its stacked design, the tile-type architecture can further adopt low-profile conformal antennas, carefully design the layout of the back-end receiving structure, achieve conformal design with the surface of the installation platform, and improve the platform's stealth performance.

[0051] Furthermore, the front-end architecture design of the tile-type integrated RF receiving array covers the working bandwidth of multiple functions, and adopts high-dynamic and high-sampling rate AD chips. It can not only meet the wide frequency and wide airspace coverage of the reconnaissance function, instantaneous broadband reception, but also provide high-dynamic and low-distortion narrow-bandwidth communication reception functions, and can cooperate with distributed radars to perform various forms of spatial beam switching. It is compatible with radar, electronic warfare, communication and other functional applications, providing an integrated and reconfigurable receiving platform.

[0052] The expansion splicing method of the front end of the tile-type integrated RF receiving array is as follows: Figure 5 , Figure 6 As shown, the use of microsystem integration technology and radio frequency integrated wiring technology has greatly reduced the volume, and the planar size of the front end of the entire receiving array is smaller than the splicing size of the antenna. Therefore, the array can be designed to be expandable according to different payload platforms and array scales; the front end of the tile-type integrated radio frequency receiving array is a universal architecture that can be arbitrarily spliced ​​to form receiving arrays of different scales.

[0053] In terms of plane size, the sub-array antenna size is calculated based on the phased array surface:

[0054]

[0055] The antenna subarray size is:

[0056] nd x ×md y

[0057] Where d is the array unit spacing; λ min is the wavelength of the highest operating frequency; θ 0 is the scanning angle; n is the number of horizontal antenna elements in the subarray; m is the number of vertical antenna elements in the subarray.

[0058] The plane size of all functional modules of the receiving front-end array is constrained to nd x ×md y The receiving front-end array is formed by front and rear tile-type splicing. According to the size of the array surface of the suitable platform, the receiving front-end array can be expanded in two dimensions to a receiving array surface with any multiple of sub-array elements.

[0059] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0060] Example

[0061] This embodiment provides a front end of an integrated RF receiving array with a tile architecture, which mainly includes an antenna module, a front end receiving module, a frequency conversion module, a multi-functional feeding board, an integrated digital module, a power supply module, etc.

[0062] In terms of design, the schematic diagram of the functional application is as follows Figure 1 As shown in the figure, the front-end architecture of the tile-type integrated RF receiving array is designed to meet the functional applications of radar, electronic warfare, communication, etc., and provide an integrated reconfigurable receiving platform. The design adopts an open architecture, reconfigurable functions, lightweight structure, broadband reception, etc.

[0063] In terms of implementation, in order to achieve full coverage of broadband reception airspace, the system uses multi-beam, analog digital beam synthesis, full-polarization receiving channels and other systems; in order to achieve lightweight design, low-profile broadband antennas, RF microsystem integration, digital SOC integration and other equipment lightweight miniaturized components can be used; in order to achieve open architecture and functional reconfiguration, the design adopts multi-level interfaces and tile-type hierarchical connection design, and universal interfaces between modules, giving full play to digital preprocessing technology, dynamic expansion of receivers, array RF cancellation, and distributed preprocessing technology between different sub-arrays.

[0064] Working principle block diagram, such as Figure 2As shown, the signal flow is: space radiation, antenna module, receiving front-end module, frequency conversion module, multi-function feed board, integrated digital module, optical fiber output. The multi-function feed board provides a connection interface for analog signals and digital signals, and provides connection control signals, power supply and other auxiliary resources in the forward direction. The main function is to receive electromagnetic signals radiated from space, and after analog processing such as limiting amplification, amplitude phase modulation, subarray synthesis, and frequency conversion, enter the AD sampling digital channel, and generate high-speed data streams after digital preprocessing. The data stream contains basic information such as frequency, amplitude, and phase of the complete space electromagnetic signal. The receiving front end covers the working frequency and working bandwidth of multiple functions, and adopts high dynamic and high sampling rate AD chips. It can meet the wide frequency and wide airspace coverage of the reconnaissance function, instantaneous wide bandwidth reception, and can provide high dynamic and low distortion narrow bandwidth communication reception functions. At the same time, it can cooperate with distributed radars to perform various forms of space beam switching.

[0065] The three-dimensional structure diagram of the front terminal array of the tile-type integrated RF receiving array is as follows Figure 3 The channel part includes the three-dimensional structure diagram of the receiving front-end module and the frequency conversion module, as shown in Figure 4 As shown. The front end of the open-architecture tile-type integrated RF receiving array adopts a hierarchical design, which is forward and backward according to the signal flow direction, with clear hierarchical functions. The antenna module is responsible for receiving spatial electromagnetic signals, the front-end receiving module is responsible for amplitude and phase modulation, the frequency conversion module is responsible for the conversion of RF to intermediate frequency, the integrated digital module is responsible for digital preprocessing and beam control, and the power module provides high and low voltage conversion. Each module has an independent functional interface, and the interface definitions are allocated according to power supply, RF, low-frequency control, etc., and contact elastic joints are used for implementation. If each module is used separately, it can independently realize its own function. For example, for technology upgrades and module upgrades, each module can be upgraded according to the interface without replacing the entire RF front end.

[0066] The functions of the antenna module are further decomposed into antenna unit, internal monitoring unit, and integrated wiring layer. The antenna unit provides matching of spatial electromagnetic and RF transmission channels. There are many ways to realize broadband receiving antennas, and various forms such as tightly coupled cross-printed antennas, Vivaldi antennas, butterfly antennas, and open slot antennas can be selected. The internal monitoring unit mainly provides additional coupling signals for each array element. After the monitoring signals in the array are synthesized, they are uniformly sent to the internal monitoring transceiver module at the back end, which can monitor the amplitude and phase changes of each channel of the array at regular intervals; the integrated wiring layer mainly matches the connection between the receiving RF channel and the antenna module port, and the design must maintain the phase consistency of each channel. The internal monitoring unit and the integrated wiring layer are implemented in the form of buried wiring in a multi-layer RF printed circuit board, which can be designed as an integrated unit with the antenna unit.

[0067] The main function of the receiving front-end module is to further amplify the spatial electromagnetic signal received by the antenna, adopt subarray-level signal synthesis, and perform amplitude and phase modulation of analog signals according to the beam direction to enhance the signal reception strength in a certain direction in space. In order to realize the arrangement of the antenna subarray surface, the microsystem integration design is adopted in the implementation. Specifically, the front-end limiting amplifier chip, multi-channel amplitude and phase modulation chip, and combiner chip are packaged into a smaller-sized patch self-sealed device using a silicon-based adapter board. To improve the packaging efficiency, the chip can be further arranged in a high-altitude manner by stacking welding inside the package body. The silicon-based packaged microsystem module is patch-welded to the front-end carrier board, and the interface is front-end and back-end according to the tile-type architecture.

[0068] The main function of the frequency conversion module is to convert the broadband RF signal into a lower intermediate frequency signal through mixing, filtering, amplification, etc. In order to retain the integrity of the RF information, the frequency conversion system must have a higher dynamic range and must suppress the additional spurious signals generated during the frequency conversion process. In order to further cooperate with the array work, the functions of channel delay, input switch combination switching, etc. can be further integrated. In terms of implementation, it is necessary to use chips with multiple functions such as mixing, filtering, amplification, and switching. Since there are many functional chips involved and the interconnection relationship is complex, it can be implemented in an independent box packaging method, or the core functional chip can be packaged with ceramic micro-packaging technology, and then the box body can be used for secondary packaging to improve the integration.

[0069] The main function of the multifunctional feeder board is to provide a connection interface for analog and digital signals, and to provide auxiliary resources such as connection control signals and power supply. In order to realize the interconnection of various complex signals in a limited space, a multi-layer printed circuit board plus micro-interconnection elastic connection is mainly used to realize signal distribution, and signal networks with different functions are arranged in layers inside the printed circuit board.

[0070] The main function of the integrated digital module is to convert analog and radio frequency signals into digital signals, generate high-speed data streams based on the input signals, provide back-end computing data, and also provide unified control functions for the amplitude, phase and frequency conversion control of the array. In terms of implementation, it is mainly composed of digital, analog and optoelectronic devices such as AD chips, FPGA chips, optoelectronic conversion chips, power management chips, etc., and further, SOC chips integrating AD and FPGA computing cores can be used. The integrated digital module can independently control the operation of the sub-arrays and generate directional information of targets in specific azimuths according to the application requirements of different functions and different payload platforms, and can also work in coordination with multiple sub-arrays or the entire array to achieve flexible and configurable array aperture resources.

[0071] Power supply part: The main function is to convert the input high-voltage signal into a variety of low-voltage power supply outputs, provide power supply and power management for each functional module of the sub-array, and receive integrated digital module control signals. In terms of implementation, a high-frequency oscillation switching power supply is used to improve the power supply voltage conversion efficiency and minimize the heat consumption of the power module.

[0072] The front end expansion and splicing of the tile-type integrated RF receiving array is shown in the three-dimensional diagram Figure 6 As shown in the figure, the microsystem integration technology and RF integrated wiring technology are used to greatly reduce the volume. The plane size of the entire receiving array front end is smaller than the splicing size of the antenna. Therefore, the array surface can be expanded according to different load platforms and array surface scales. The tile-type integrated RF receiving array front end is a universal architecture that can be arbitrarily spliced ​​to form receiving array surfaces of different scales.

[0073] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. An open-architecture tile-type integrated radio frequency receiving array front end, characterized in that: It includes antenna module, front-end receiving module, frequency conversion module, multi-function feeding board, integrated digital module and power supply module; The antenna module is used to provide matching between spatial electromagnetic and radio frequency transmission channels and regularly monitor the amplitude and phase changes of each channel of the array surface; The front-end receiving module is used to amplify the spatial electromagnetic signal received by the antenna, perform signal synthesis at the subarray level, and perform amplitude and phase modulation of the analog signal according to the beam pointing to enhance the signal receiving strength at a certain direction in space; The frequency conversion module is used to mix, filter and amplify the broadband radio frequency signal, convert it into an intermediate frequency signal, and suppress the additional spurious signals; The multifunctional feeder board is used to provide a connection interface for analog signals and digital signals, and to provide connection control signals and power supply in a forward direction; The integrated digital module is used to convert analog and radio frequency signals into digital signals, generate high-speed data streams according to input signals for back-end calculations, and provide a unified control function for array amplitude, phase and frequency conversion; The power supply module adopts a high-frequency oscillation switching power supply to convert the input high-voltage signal into a variety of low-voltage power supplies for output, providing power supply and power management for each functional module.

2. The open architecture tile integrated radio frequency receiving array front end according to claim 1, characterized in that: The antenna module includes an antenna unit, an internal monitoring unit and an integrated wiring layer; The antenna unit is used to match the spatial electromagnetic and radio frequency transmission channels; the antenna unit adopts a low-profile broadband antenna, including a tightly coupled cross-printed antenna, a Vivaldi antenna, a butterfly antenna and an open slot antenna to achieve broadband reception; The internal monitoring unit synthesizes the coupling signals of each array element into an array plane internal monitoring signal, which enters the internal monitoring transceiver module at the rear end of the internal monitoring unit to regularly monitor the amplitude and phase changes of each channel of the array plane; The integrated wiring layer connects the receiving radio frequency channel and the antenna module port to maintain the phase consistency of each channel; The internal monitoring unit and the integrated wiring layer are implemented in the form of embedded wiring in a multi-layer radio frequency printed circuit board, and are designed as an integrated whole with the antenna module.

3. The open architecture tile integrated radio frequency receiving array front end according to claim 1, characterized in that: The front-end receiving module adopts a silicon-based packaging microsystem to realize the arrangement of the antenna subarray surface, as follows: A silicon-based adapter board is used to package the front-end limiting amplifier chip, multi-channel amplitude and phase modulation chip, and combiner chip into a self-sealed device. The package body is stacked and welded to arrange the chips in a high-height manner. The silicon-based packaged microsystem module is patch-welded to the front-end carrier board, and the interface is front-to-back according to the tile-like architecture.

4. The open architecture tile integrated radio frequency receiving array front end according to claim 1, characterized in that: The frequency conversion module is packaged in an independent box body, or the core functional chip is first packaged in a ceramic micro-package manner and then packaged in a box body for secondary packaging to improve the integration; the frequency conversion module can integrate channel delay and input switch combination switching functions.

5. The open architecture tile integrated radio frequency receiving array front end according to claim 1, characterized in that: The multifunctional feed board adopts a multi-layer printed circuit board plus a micro-interconnection elastic connection method to distribute signals, and signal networks with different functions are arranged in layers inside the printed circuit board to realize the interconnection of various complex signals.

6. The open-architecture tile-type integrated radio frequency receiving array front end according to claim 1, characterized in that: The integrated digital module is composed of digital, analog and optoelectronic devices, including AD chips, FPGA chips, optoelectronic conversion chips and power management chips, and a SOC chip that integrates AD and FPGA computing cores; the integrated digital module can independently control the operation of the sub-array and generate directional information of targets in specific directions according to the application requirements of different functions and different payload platforms, and can also enable multiple sub-arrays or the entire array to work in coordination to achieve flexible and configurable array aperture resources.

7. The open architecture tile integrated radio frequency receiving array front end according to claim 1, characterized in that: The front end of the tile-type integrated RF receiving array adopts a multi-level interface, a tile-type hierarchical connection design, a universal interface between modules, and adopts digital preprocessing, dynamic expansion of the receiver, array RF cancellation, and distributed preprocessing between different sub-arrays to achieve an open architecture and functional reconfiguration; each module has an independent functional interface, and each interface definition is allocated according to power supply, RF, and low-frequency control. A contact-type elastic joint is used. When each module is used separately, it independently realizes its own function. When the technology is upgraded and the modules are replaced, each module is upgraded according to the interface.

8. The open architecture tile integrated radio frequency receiving array front end according to claim 1, characterized in that: The front end of the tile-type integrated radio frequency receiving array adopts microsystem integration and radio frequency integrated wiring to reduce the volume of the front end of the tile-type integrated radio frequency receiving array; the front end of the tile-type receiving front array adopts a universal architecture, and the array expansion design is carried out according to different load platforms and array scales, and splicing is used to form receiving arrays of different scales.

9. The open architecture tile integrated radio frequency receiving array front end according to claim 1, characterized in that: The front end of the tile-type integrated radio frequency receiving array adopts a stacked design, based on a low-profile conformal antenna, and achieves a conformal design with the surface of the installation platform by designing the rear-end receiving structure arrangement.

10. The open architecture tile integrated radio frequency receiving array front end according to claim 1, characterized in that: The front end of the tile-type integrated RF receiving array adopts an AD chip that meets the dynamic and sampling rate requirements, covers the working bandwidth of multiple functions, and has both reconnaissance function and narrowband communication receiving function. At the same time, it can also cooperate with distributed radar to perform various forms of spatial beam switching.

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