A process for preparing a PCB board with buried copper blocks

Abstract

The invention relates to the technical field of circuit board processing, and in particular to a copper-buried PCB board preparation process. Under the guidance of a capillary fiber strip, liquid resin can flow into the bottom of a milling groove, that is, the resin filling operation is started from the bottom of the milling groove, which can effectively prevent the formation of cavities in the resin layer, avoid the problems of low stability and short circuit caused by the formation of cavities in the resin layer, and at the same time, the angle of the capillary fiber strip is adjusted by a motor so that the bending direction of the capillary fiber strip is always the same as the extension direction of the milling groove, so that the capillary fiber strip can be smoothly inserted into the milling groove for resin filling operation; a copper-buried PCB board preparation device comprises a connecting plate, a liquid conveyor and a camera; the connecting plate is connected to the liquid conveyor; the camera is installed on the liquid conveyor; it also comprises a cylinder, a joint, a needle tube, a capillary fiber strip and a driving component; the liquid conveyor is connected to the cylinder.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board processing, and more specifically, to a copper-buried PCB board preparation process. Background Art

[0002] For circuit boards with relatively high integration, there are a large number of densely distributed electronic components, and the heat dissipation load is large. In order to meet the heat dissipation needs, the existing technology will bury copper blocks on the circuit board, and use the excellent heat dissipation performance of the copper blocks to efficiently dissipate the heat of the circuit board. After the copper blocks are buried, the copper blocks on the circuit board are milled according to actual wiring requirements, and resin is filled in the milled grooves to prevent short circuits. The resin can also bond adjacent copper blocks together to improve the overall stability of the circuit board. However, in the process of filling resin using existing equipment, since the milled grooves are relatively narrow and the liquid resin has a certain viscosity, the resin settles slowly in the milled grooves, resulting in cavities in the resin layer filled in the milled grooves, which makes it impossible for the resin to completely fill the milled grooves, resulting in low stability. When the copper blocks are loose and come into contact with each other or other conductors enter the cavities, short circuits will occur. Summary of the invention

[0003] In order to overcome the disadvantages of using existing equipment to fill the resin layer in the milled groove with cavities, resulting in low structural stability of the circuit board and short circuit, the present invention provides a buried copper block PCB board preparation process.

[0004] The technical solution is:

[0005] A copper-buried PCB board preparation process, the copper-buried PCB board preparation process is based on a copper-buried PCB board preparation device, the copper-buried PCB board preparation device comprises a connecting plate, a liquid conveyor and a camera; the connecting plate is connected to the liquid conveyor; the liquid conveyor is installed with a camera; it also comprises a cylinder, a joint, a needle tube, a capillary fiber strip, a movable block, a connecting block and a driving assembly; the liquid conveyor is connected to a cylinder; the cylinder is connected to a joint; the joint is connected to a needle tube; the joint is connected to a capillary fiber strip, and the capillary fiber strip passes through the needle tube; the connecting plate is connected to a driving assembly, and the driving assembly is used to drive the liquid conveyor to move vertically and horizontally; two movable blocks are sealed and slidably connected on the joint; a connecting block is fixedly connected between all the movable blocks, the connecting block is fixedly connected to the capillary fiber strip, and the connecting block is set to an alloy material;

[0006] The buried copper block PCB board preparation process comprises the following steps:

[0007] Step 1: Milling grooves, using a milling machine to mill grooves on the circuit board to make embedded grooves on the circuit board; Step 2: Pressing, pressing and fixing the brass block in the embedded groove;

[0008] Step 3: Milling: mill the brass block according to the connectivity requirements of the circuit board, and form a milling groove at the milling position;

[0009] Step 4: Fix the circuit board and brass block on the base plate;

[0010] Step 5: Filling: Use the copper-embedded PCB board preparation device to fill the milled groove with resin;

[0011] Step 6: Drying: Dry the resin in the milling groove to solidify it;

[0012] Step 7: Grind and clean the resin that exceeds the milling groove;

[0013] Step 8: Cleaning: Clean the circuit board and brass block processed in step 7.

[0014] As a further preferred solution, the driving assembly includes an electric slide rail 1, an electric slider 1, an electric slide rail 2, an electric slider 2 and a telescopic cylinder 1; a plurality of electric slide rails 1 are fixedly connected to the connecting plate; an electric slider 1 is slidably connected to each electric slide rail 1; an electric slide rail 2 is commonly fixedly connected to all electric sliders 1; an electric slider 2 is slidably connected to the electric slide rail 2; a telescopic cylinder 1 is fixedly connected to the electric slider 2, and the telescopic end of the telescopic cylinder 1 is fixedly connected to the liquid conveyor.

[0015] As a further preferred scheme, it also includes a rotating component; the rotating component is connected to cylinder one; the rotating component includes a motor, a gear, a ring and a gear ring; the motor is fixedly connected to cylinder one; the motor output shaft is fixedly connected to the gear; the ring is rotatably connected to cylinder one; the ring is connected to cylinder one, and the ring is detachably connected to joint one; the ring is fixedly connected to the ring, and the gear ring is meshed with the gear.

[0016] As a further preferred solution, a shifting block is also included; each movable block is fixedly connected with a shifting block, and the shifting block is connected to the joint in a damping sliding manner.

[0017] As a further preferred solution, a plurality of shallow grooves are provided on the shifting block.

[0018] As a further preferred scheme, it also includes an auxiliary component; the auxiliary component is connected to the liquid conveyor; the auxiliary component includes two telescopic cylinders, two cylinders, two joints, two needle tubes and two capillary fiber strips; the liquid conveyor is fixedly connected to the two telescopic cylinders; the telescopic end of the two telescopic cylinders is fixedly connected to the two cylinders, the two cylinders are slidably connected to the liquid conveyor, and the two cylinders are connected to the liquid conveyor; the two cylinders are detachably connected to the two joints; the two joints are connected to the two needle tubes; the two capillary fiber strips are fixedly connected to the two joints, and the two capillary fiber strips pass through the two needle tubes.

[0019] As a further preferred solution, it also includes a paddle; a plurality of paddles are fixedly connected between the connector 1 and the needle tube 1; and a plurality of paddles are fixedly connected between the connector 2 and the needle tube 2.

[0020] As a further preferred solution, the pick is provided with rounded corners.

[0021] As a further preferred solution, the surface of the connecting plate is coated with an anti-corrosion layer.

[0022] As a further preferred solution, the camera lens portion is coated with an anti-fog coating.

[0023] The present invention has the following advantages:

[0024] 1. Under the guidance of the capillary fiber strip 1, the liquid resin can flow into the bottom of the milling groove, that is, the resin filling operation starts from the bottom of the milling groove, which can effectively prevent the formation of cavities in the resin layer, and avoid the problems of low stability and short circuit caused by the formation of cavities in the resin layer. At the same time, the angle of the capillary fiber strip 1 is adjusted by the motor, so that the bending direction of the capillary fiber strip 1 is always the same as the extension direction of the milling groove, so that the capillary fiber strip 1 can be smoothly inserted into the milling groove for resin filling operation;

[0025] Second, by pushing the shifting block to control the capillary fiber strip to move downward, the bent lower end of the capillary fiber strip can be extended to the bottom of the milling groove to perform the resin guiding operation, thereby avoiding the problem that the resin cannot be completely guided to the bottom of the milling groove due to the bending of the capillary fiber strip. At the same time, by pushing the shifting block to control the capillary fiber strip to move upward, with the cooperation of the needle tube, the bent lower end of the capillary fiber strip can be straightened to reduce the bending degree of the capillary fiber strip, thereby avoiding the capillary fiber strip from bending excessively and losing the function of guiding the resin, thereby increasing the service life of the capillary fiber strip.

[0026] 3. Pre-fill the ends of the milled grooves with resin through two pairs of capillary fiber strips, and then fill the positions other than the ends of the milled grooves with resin through the two pairs of capillary fiber strips, thereby avoiding the problem of being unable to fill the ends of the milled grooves with resin due to the bending of the capillary fiber strips.

[0027] The present invention also has the following beneficial effects:

[0028] The pick has rounded corners to improve the comfort when manually pushing the pick. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 The structural schematic diagram of the device for preparing a PCB board with buried copper blocks according to the present invention is shown;

[0030] Figure 2 The schematic diagram of the structure of the substrate, the circuit board and the brass block of the present invention is shown;

[0031] Figure 3 A schematic diagram of the structure of the auxiliary component of the present invention is shown;

[0032] Figure 4 A schematic diagram of the structure of the rotating assembly of the present invention is shown;

[0033] Figure 5 The structure diagram of the movable block, the connecting block and the shifting block of the present invention is shown;

[0034] Figure 6 A running state diagram of the capillary fiber strip of the present invention is shown.

[0035] Names of the numbers in the figure: 1-connecting plate, 2-liquid conveyor, 3-camera, 4-cylinder one, 5-connector one, 6-needle tube one, 7-capillary fiber strip one, 8-base plate, 9-circuit board, 10-brass block, 201-electric slide rail one, 202-electric slider one, 203-electric slide rail two, 204-electric slider two, 205-telescopic cylinder one, 206-motor, 207-gear, 208-ring, 209-gear ring, 2010-movable block, 2011-connecting block, 2012-pick block, 2013-telescopic cylinder two, 2014-cylinder two, 2015-connector two, 2016-needle tube two, 2017-capillary fiber strip two, 2018-pick, 91-milling groove. DETAILED DESCRIPTION

[0036] The technical solution is further described below in conjunction with specific embodiments. It should be noted that the words indicating directions such as up, down, left, and right mentioned in this article are only for the position of the structure shown in the corresponding drawings. The serial numbers of the parts in this article, such as first, second, etc., are only used to distinguish the objects described and do not have any order or technical meaning. The words such as connection and coupling in this application include direct and indirect connection (coupling) unless otherwise specified.

[0037] Example 1

[0038] A copper-buried PCB board preparation process, the copper-buried PCB board preparation process is based on a copper-buried PCB board preparation device, such as Figure 1-Figure 6As shown, the buried copper block PCB board preparation device includes a connecting plate 1, a liquid conveyor 2 and a camera 3; the connecting plate 1 is connected to the liquid conveyor 2, and the connecting plate 1 is set to an alloy material; the liquid conveyor 2 is installed with a camera 3; it also includes a cylinder 4, a joint 5, a needle tube 6, a capillary fiber strip 7, a movable block 2010, a connecting block 2011 and a driving component; the liquid conveyor 2 is connected and fixedly connected with a cylinder 4, and the liquid conveyor 2 conveys liquid resin into the cylinder 4; the cylinder 4 is connected to a joint 5; the joint 5 is connected and fixedly connected with a needle tube 6; the joint 5 is connected to a capillary fiber strip 7, and the capillary fiber strip 7 passes through the needle tube 6; the connecting plate 1 is connected to a driving component; two movable blocks 2010 are sealed and slidably connected to the joint 5; a connecting block 2011 is fixedly connected between all the movable blocks 2010, the connecting block 2011 is fixedly connected to the capillary fiber strip 7, and the connecting block 2011 is set to an alloy material;

[0039] The buried copper block PCB board preparation process comprises the following steps:

[0040] Step 1: Milling grooves, using a milling machine to perform a milling operation on the circuit board 9 to obtain a pre-buried groove on the circuit board;

[0041] Step 2: Press and fix the brass block 10 in the embedded groove;

[0042] Step 3: Milling: milling the brass block 10 according to the connection requirements of the circuit board 9, and forming a milling groove 91 at the milling position;

[0043] Step 4: Fixing: fix the circuit board 9 and the brass block 10 on the base plate 8;

[0044] Step 5: Filling: Use the copper-embedded PCB board preparation device to fill the milled groove 91 with resin;

[0045] Step 6: Drying, drying the resin in the milled groove 91 to solidify it;

[0046] Step 7: Grinding: Grinding away the resin beyond the milling groove 91;

[0047] Step 8: Cleaning: Clean the circuit board 9 and brass block 10 processed in step 7.

[0048] The driving assembly includes an electric slide rail 1 201, an electric slider 1 202, an electric slide rail 2 203, an electric slider 204 and a telescopic cylinder 1 205; two electric slide rails 1 201 are bolted to the connecting plate 1; each electric slide rail 1 201 is slidably connected to an electric slider 1 202; all electric sliders 1 202 are commonly fixedly connected to an electric slide rail 2 203; an electric slider 2 204 is slidably connected to the electric slide rail 203; a telescopic cylinder 1 205 is fixedly connected to the electric slider 204, and the telescopic end of the telescopic cylinder 1 205 is fixedly connected to the liquid conveyor 2, and the liquid conveyor 2 is driven to move up and down by the telescopic cylinder 1 205.

[0049] It also includes a rotating assembly; the rotating assembly is connected to the cylinder-4; the rotating assembly includes a motor 206, a gear 207, a ring 208 and a toothed ring 209; the motor 206 is bolted to the cylinder-4; the output shaft of the motor 206 is fixedly connected to the gear 207, and the gear 207 is set to be made of alloy material; the ring 208 is rotatably connected to the cylinder-4; the ring 208 is connected to the cylinder-4, and the ring 208 is screwed to the joint-5; the toothed ring 209 is fixedly connected to the ring 208, and the toothed ring 209 is meshed with the gear 207, the motor 206 drives the gear 207 to rotate, the gear 207 drives the toothed ring 209 to rotate, and the toothed ring 209 drives the ring 208 to rotate.

[0050] It also includes a shift block 2012; each movable block 2010 is fixedly connected with a shift block 2012, the shift block 2012 is connected to the joint 5 in a damping sliding manner, and the shift block 2012 is manually pushed to move downward, the shift block 2012 drives the movable block 2010 to move downward, the movable block 2010 drives the connecting block 2011 to move downward, and the connecting block 2011 drives the capillary fiber strip 7 to move downward.

[0051] The shift block 2012 is provided with a plurality of shallow grooves for increasing friction.

[0052] The working principle of the above embodiment is as follows:

[0053] First, the connecting plate 1 is fixed on the rack of the warehouse and is located just above the external conveyor belt. The external conveying pipe is connected to the liquid conveyor 2. The external conveyor belt conveys the substrate 8, the circuit board 9 and the brass block 10 to just below the connecting plate 1. Then, the camera 3 is used to observe and record the position of the milling groove 91, and the electric slide rail 1 201 and the electric slider 1 202 are started. The electric slider 1 202 moves back and forth on the electric slide rail 1 201. The electric slider 1 202 drives the electric slide rail 2 203 to move back and forth, and the electric slide rail 2 203 and the electric slider 2 204 are started. The electric slider 204 moves left and right on the electric slide rail 203, that is, the electric slide rail 1 201, the electric slider 1 202, the electric slide rail 203 and the electric slider 204 cooperate to control the telescopic cylinder 1 205 and the parts thereon to move in the horizontal direction, so as to control the capillary fiber strip 1 7 to move to the top of the front end of the milling groove 91, and then start the telescopic cylinder 1 205, the telescopic cylinder 1 205 drives the liquid conveyor 2 to move downward, so that the needle tube 1 6 moves to the top of the milling groove 91, and the lower end of the capillary fiber strip 1 7 is inserted into the bottom of the milling groove 91, and then The rear external delivery pipe delivers liquid resin to the liquid delivery device 2, and the liquid delivery device 2 delivers the liquid resin to the cylinder 4, and then flows from the cylinder 4 into the joint 5, and then flows from the joint 5 into the needle tube 6, and then flows out from the lower port of the needle tube 6, and then moves downward along the surface of the capillary fiber strip 7. Under the guidance of the capillary fiber strip 7, the liquid resin can flow into the bottom of the milling groove 91, that is, the resin filling operation starts from the bottom of the milling groove 91, which can effectively prevent the formation of cavities in the resin layer. At the same time, the telescopic cylinder 205 and the parts thereon are controlled to move backward. Thereby, the needle tube 6 and the capillary fiber strip 7 move backward synchronously, and then the milling groove 91 is filled with liquid resin. After the filling is completed, the liquid conveyor 2 stops conveying liquid resin to the cylinder 4, and the telescopic cylinder 205 drives the liquid conveyor 2 and the parts thereon to move upward back to the original position. When in use, under the guidance of the capillary fiber strip 7, the liquid resin can flow into the bottom of the milling groove 91, that is, the resin filling operation starts from the bottom of the milling groove 91, which can effectively prevent the formation of cavities in the resin layer, and avoid the problems of low stability and short circuit caused by the formation of cavities in the resin layer.

[0054] During the resin filling process, the capillary fiber strip 7 needs to move in the milling groove 91. At this time, the capillary fiber strip 7 will be subject to the resistance of the liquid resin, which will cause the lower end of the capillary fiber strip 7 to bend in the opposite direction of its movement direction. Over time, the bent capillary fiber strip 7 cannot rebound, which will cause the lower end point of the capillary fiber strip 7 to deviate, resulting in the subsequent resin filling process. The capillary fiber strip 7 cannot be accurately inserted into the milling groove 91, resulting in resin filling failure. Therefore, the extension direction of the milling groove 91 is determined by the camera 3, and before filling the resin, the motor 206 is started, the motor 206 drives the gear 207 to rotate, the gear 207 drives the gear ring 209 to rotate, and the gear ring 209 drives the ring 208 to rotate. The circular ring 208 drives the joint 5 to rotate, and the joint 5 drives the capillary fiber strip 7 to rotate, so that the bending direction of the capillary fiber strip 7 is always the same as the extension direction of the milling groove 91, so that the electric slider 204 controls the capillary fiber strip 7 to move to the top of the milling groove 91, and the lower end of the capillary fiber strip 7 after displacement is also located above the milling groove 91, so that the capillary fiber strip 7 can be smoothly inserted into the milling groove 91 for resin filling operation. When in use, the angle of the capillary fiber strip 7 is adjusted by the motor 206, so that the bending direction of the capillary fiber strip 7 is always the same as the extension direction of the milling groove 91, so that the capillary fiber strip 7 can be smoothly inserted into the milling groove 91 for resin filling operation.

[0055] During the bending process of the lower end of the capillary fiber strip 7, its lower end point is offset upward. When the bending is too large, the lower end point is relatively far away from the bottom of the milling groove 91, resulting in the inability of the capillary fiber strip 7 to completely guide the resin to the bottom of the milling groove 91. Therefore, when it is found that the bending degree of the lower end of the capillary fiber strip 7 is too large, the shifting block 2012 is manually pushed downward, the shifting block 2012 drives the movable block 2010 to move downward, and the movable block 2010 drives the connecting block 2011 to move downward, and the connecting block 2011 is connected to the capillary fiber strip 7. The connecting block 2011 drives the capillary fiber strip 7 to move downward, so that the bent lower end of the capillary fiber strip 7 can extend to the bottom of the milling groove 91, thereby fully guiding the resin into the milling groove 91. When in use, the capillary fiber strip 7 is controlled to move downward by pushing the shifting block 2012, so that the bent lower end of the capillary fiber strip 7 can extend to the bottom of the milling groove 91 to perform the resin guiding operation, thereby avoiding the problem of being unable to fully guide the resin to the bottom of the milling groove 91 due to the bending of the capillary fiber strip 7.

[0056] Before manually pushing the shifting block 2012 to move downward, the shifting block 2012 is first pushed upward, the shifting block 2012 drives the movable block 2010 to move upward, the movable block 2010 drives the connecting block 2011 to move upward, the connecting block 2011 drives the capillary fiber strip 7 to move upward, so that the bent lower end of the capillary fiber strip 7 moves toward the inside of the needle tube 6. In this process, the needle tube 6 limits the bent lower end of the capillary fiber strip 7, so as to straighten the bent lower end of the capillary fiber strip 7. Reduce the degree of bending of the capillary fiber strip 7, and then manually push the shift block 2012 downward to adjust the position of the lower end of the capillary fiber strip 7. When in use, the capillary fiber strip 7 is controlled to move upward by pushing the shift block 2012. With the cooperation of the needle tube 6, the bent lower end of the capillary fiber strip 7 can be straightened to reduce the degree of bending of the capillary fiber strip 7, avoid excessive bending of the capillary fiber strip 7 and lose the function of guiding resin, thereby increasing the service life of the capillary fiber strip 7.

[0057] According to the above working principle, we know that the present invention has the following effects:

[0058] Under the guidance of the capillary fiber strip 7, the liquid resin can flow into the bottom of the milling groove 91, that is, the resin filling operation starts from the bottom of the milling groove 91, which can effectively prevent the formation of cavities in the resin layer, and avoid the problems of low stability and short circuit caused by the formation of cavities in the resin layer. At the same time, the angle of the capillary fiber strip 7 is adjusted by the motor 206, so that the bending direction of the capillary fiber strip 7 is always the same as the extension direction of the milling groove 91, so that the capillary fiber strip 7 can be smoothly inserted into the milling groove 91 for resin filling operation;

[0059] By pushing the shift block 2012 to control the capillary fiber strip 7 to move downward, the bent lower end of the capillary fiber strip 7 can be extended to the bottom of the milling groove 91 for resin guiding operation, thereby avoiding the problem of being unable to completely guide the resin to the bottom of the milling groove 91 due to the bending of the capillary fiber strip 7. At the same time, by pushing the shift block 2012 to control the capillary fiber strip 7 to move upward, with the cooperation of the needle tube 6, the bent lower end of the capillary fiber strip 7 can be straightened, reducing the bending degree of the capillary fiber strip 7, avoiding excessive bending of the capillary fiber strip 7 and losing the function of guiding the resin, thereby improving the service life of the capillary fiber strip 7.

[0060] Example 2

[0061] On the basis of Example 1, Figure 3 and Figure 4As shown, it also includes an auxiliary component; the liquid conveyor 2 is connected to the auxiliary component; the auxiliary component includes a telescopic cylinder 2013, a cylinder 2014, a joint 2015, a needle tube 2016 and a capillary fiber strip 2017; the liquid conveyor 2 is bolted with a telescopic cylinder 2013; the telescopic end of the telescopic cylinder 2013 is fixedly connected to a cylinder 2014, the cylinder 2014 is slidably connected to the liquid conveyor 2, and the cylinder 2014 is connected to the liquid conveyor 2; the joint 2015 is screwed on the cylinder 2014; the needle tube 2016 is connected and fixed to the joint 2015; the capillary fiber strip 2017 is fixedly connected to the joint 2015, and the capillary fiber strip 2017 passes through the needle tube 2016.

[0062] It also includes a paddle 2018; four paddles 2018 are fixedly connected between the connector 1 5 and the needle tube 1 6; four paddles 2018 are also fixedly connected between the connector 2 2015 and the needle tube 2 2016. The connector 2 2015 and the needle tube 2 2016 are manually driven to rotate by the paddle 2018, making it easier to unscrew the connector 2 2015 from the cylinder 2 2014, thereby replacing the blocked needle tube 2 2016.

[0063] The pick 2018 has rounded corners to improve the comfort when the pick 2018 is pushed manually.

[0064] The surface of the connecting plate 1 is coated with an anti-corrosion layer to prevent rust.

[0065] The lens of the camera 3 is coated with an anti-fog coating.

[0066] The working principle of the above embodiment is as follows:

[0067] After the capillary fiber strip 7 is straightened as described in Example 1, it cannot be restored to a completely straight state, and it still has a slight bend problem, and the degree of this bend increases with the use time of the capillary fiber strip 7:

[0068] by Figure 6The displayed state is a viewing angle, the left end of the milling groove 91 is the starting point of filling the resin, and the right end of the milling groove 91 is the end point of filling the resin. When the capillary fiber strip 7 moves to the end position of the milling groove 91, the bent lower end of the capillary fiber strip 7 and the end point of the milling groove 91 will form an angle, and the capillary fiber strip 7 cannot completely guide the resin into the angle, which makes it easy to form a cavity here. Therefore, when filling the resin into the milling groove 91, the electric slider 204 controls the capillary fiber strip 2017 to move to above the end of the milling groove 91, and then the telescopic cylinder 2013 drives the cylinder 2 2014 and the parts thereon to move downward, so that the capillary fiber strip 2017 is inserted into the end of the milling groove 91, and then the liquid conveyor 2 conveys the resin to the cylinder 2 2014, and the resin flows into the joint 2 2015 through the cylinder 2 2014, and then It flows into the second needle tube 2016, and then flows along the surface of the second capillary fiber strip 2017 to the end of the milling groove 91, so that the resin fills the end of the milling groove 91, and then the telescopic cylinder 2013 drives the second cylinder 2014 and the parts thereon to move upward back to their original positions, so that the capillary fiber strip 2017 is away from the milling groove 91, that is, the end of the milling groove 91 is pre-filled with resin through the second capillary fiber strip 2017, and then the resin is filled in the positions other than the end of the milling groove 91 through the capillary fiber strip 1 7, so that all positions of the milling groove 91 are filled with resin. When in use, the end of the milling groove 91 is pre-filled with resin through the second capillary fiber strip 2017, and then the resin is filled in the positions other than the end of the milling groove 91 through the capillary fiber strip 1 7, thereby avoiding the problem of being unable to fill the end of the milling groove 91 with resin due to the bending of the capillary fiber strip 1 7.

[0069] According to the above working principle, we know that the present invention has the following effects:

[0070] The end of the milling groove 91 is pre-filled with resin through the capillary fiber strip 2017, and then the resin is filled in the position other than the end of the milling groove 91 through the capillary fiber strip 1 7, thereby avoiding the problem of being unable to fill the end of the milling groove 91 with resin due to the bending of the capillary fiber strip 1 7.

[0071] On the basis of the above technical effects, the present invention also has the following advantages:

[0072] The pick 2018 has rounded corners to improve the comfort when the pick 2018 is pushed manually.

[0073] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A copper-buried PCB board preparation process, the copper-buried PCB board preparation process is based on a copper-buried PCB board preparation device, characterized in that: The copper-embedded PCB board preparation device comprises a connecting plate (1); a liquid conveyor (2) is connected to the connecting plate (1); a camera (3) is installed on the liquid conveyor (2); a cylinder (4) is connected to the liquid conveyor (2); a joint (5) is connected to the cylinder (4); a needle tube (6) is connected to the joint (5); a capillary fiber strip (7) is connected to the joint (5), and the capillary fiber strip (7) passes through the needle tube (6); a driving component is connected to the connecting plate (1), and the driving component is used to drive the liquid conveyor (2) to move vertically and horizontally; two movable blocks (2010) are sealed and slidably connected to the joint (5); a connecting block (2011) is fixedly connected between all the movable blocks (2010), the connecting block (2011) is fixedly connected to the capillary fiber strip (7), and the connecting block (2011) is set to be an alloy material; The buried copper block PCB board preparation process comprises the following steps: Step 1: Milling grooves, using a milling machine to perform a groove milling operation on the circuit board (9) to obtain a pre-buried groove on the circuit board; Step 2: Press and fix the brass block (10) in the embedded groove; Step 3: Milling: milling the brass block (10) according to the connection requirements of the circuit board (9), and forming a milling groove (91) at the milling position; Step 4: Fixing: fix the circuit board (9) and the brass block (10) on the base plate (8); Step 5: Filling: using a copper-embedded PCB board preparation device to fill the milled groove (91) with resin; Step 6: Drying, drying the resin in the milled groove (91) to solidify it; Step 7: Grinding: Grinding away the resin that exceeds the milling groove (91); Step 8: Cleaning: Clean the circuit board (9) and the brass block (10) processed in step 7; It also includes a shifting block (2012); each movable block (2010) is fixedly connected to a shifting block (2012), and the shifting block (2012) is connected to a joint 1 (5) in a damping sliding manner.

2. A copper-buried PCB board preparation process according to claim 1, characterized in that: The driving assembly comprises an electric slide rail 1 (201); a plurality of electric slide rails 1 (201) are fixedly connected to a connecting plate (1); each electric slide rail 1 (201) is slidably connected to an electric slider 1 (202); an electric slide rail 2 (203) is commonly fixedly connected to all the electric sliders 1 (202); an electric slider 2 (204) is slidably connected to the electric slide rail 2 (203); a telescopic cylinder 1 (205) is fixedly connected to the electric slider 2 (204); and a telescopic end of the telescopic cylinder 1 (205) is fixedly connected to a liquid conveyor (2).

3. A copper-buried PCB board preparation process according to claim 2, characterized in that: The invention also comprises a rotating assembly; the rotating assembly is connected to the cylinder one (4); the rotating assembly comprises a motor (206); the motor (206) is fixedly connected to the cylinder one (4); the output shaft of the motor (206) is fixedly connected to a gear (207); a ring (208) is rotatably connected to the cylinder one (4); the ring (208) is connected to the cylinder one (4), and the ring (208) is detachably connected to the joint one (5); a gear ring (209) is fixedly connected to the ring (208), and the gear ring (209) is meshed with the gear (207).

4. A copper-buried PCB board preparation process according to claim 1, characterized in that: The shift block (2012) is provided with a number of shallow grooves.

5. A copper-buried PCB board preparation process according to claim 1, characterized in that: The invention also comprises an auxiliary component; the auxiliary component is connected to the liquid conveyor (2); the auxiliary component comprises a second telescopic cylinder (2013); the second telescopic cylinder (2013) is fixedly connected to the liquid conveyor (2); a second cylinder (2014) is fixedly connected to the telescopic end of the second telescopic cylinder (2013); the second cylinder (2014) is slidably connected to the liquid conveyor (2); the second cylinder (2014) is connected to the liquid conveyor (2); a second connector (2015) is detachably connected to the second cylinder (2014); the second connector (2015) is connected to a second needle tube (2016); a second capillary fiber strip (2017) is fixedly connected to the second connector (2015), and the second capillary fiber strip (2017) passes through the second needle tube (2016).

6. A copper-buried PCB board preparation process according to claim 5, characterized in that: It also includes a pick (2018); a plurality of picks (2018) are fixedly connected between the connector 1 (5) and the needle tube 1 (6); and a plurality of picks (2018) are also fixedly connected between the connector 2 (2015) and the needle tube 2 (2016).

7. A process for preparing a PCB board with buried copper blocks according to any one of claims 1 to 6, characterized in that: The pick (2018) has rounded corners.

8. A copper-buried PCB board preparation process according to claim 7, characterized in that: The surface of the connecting plate (1) is coated with an anti-corrosion layer.

9. A copper-buried PCB board preparation process according to claim 7, characterized in that: The lens portion of the camera (3) is coated with an anti-fog coating.

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