Silicon-phosphorus crystal forming device and method and application of silicon-phosphorus crystal forming device and method in automobile field

Abstract

The invention relates to the technical field of silicon-phosphorus crystal forming devices, and discloses a silicon-phosphorus crystal forming device, a silicon-phosphorus crystal forming method and application of the silicon-phosphorus crystal forming device and the silicon-phosphorus crystal forming method in the field of automobiles. Forming mold sets are evenly installed on a conveying unit, and a demolding assembly matched with the forming mold sets is installed on the conveying unit; the orientation of the first mold unit, the orientation of the second mold unit and the orientation of the third mold unit are the same as the conveying direction of the conveying unit, and demolding devices corresponding to the first mold unit, the second mold unit and the third mold unit in a one-to-one mode are installed on the support. The demolding operation of the four demolding units including the first demolding unit, the second demolding unit, the third demolding unit and the fourth demolding unit is matched with a wedge-shaped demolding surface on the upper movable mold, and a cleaning blowing force generated when a reset piece on the demolding device is extruded is added; and smooth demolding of the silicon-phosphorus crystal particles formed in the forming mold group can be ensured.

Description

Technical Field

[0001] The invention relates to the technical field of silicon phosphorus crystal forming devices, and in particular to a silicon phosphorus crystal forming device, a forming method and applications thereof in the automotive field. Background Art

[0002] At present, the existing silicon phosphorus crystal forming method uses a flat mold to process the two wide surfaces of a rectangular steel plate into multiple rows of hemispheres with a diameter of 20 mm and sunk into the steel plate. When the two molds are put together, a complete hollow sphere can be formed. The silicon phosphorus crystal liquid is poured into the mold, and a spherical silicon phosphorus crystal product can be obtained after cooling.

[0003] In the silicon-phosphorus crystal forming device with application number CN201010564562.0, sub-grooves and sub-holes are provided at corresponding positions of the movable template; a magnet is provided in the middle of the fixed template; a connecting hole is provided at the inner end of the fixed template, and the closure of the mold group 7 is completed by gravity. When the pouring hole of the mold group is at the bottom, due to the effect of gravity, the two movable templates will automatically be combined with the fixed template. A strong magnet is added to the fixed template. When the mold is closed, due to the effect of magnetic force, when the mold group moves to the pouring hole upward, the mold group will not automatically open due to gravity, thereby ensuring that the mold group can be poured normally.

[0004] However, in the actual silicon phosphorus crystal molding process, after the silicon phosphorus crystal solution is poured into the interior of the mold group, when the mold group filled with the solution is in the process of pouring the solution and turning to the position with the pouring hole facing downward, the two sets of movable templates are not attracted to the fixed templates, so the solution inside the mold group will inevitably flow out from the pouring hole, which will directly lead to the lack of solution inside the mold group, causing bubbles to form inside, and defects will form during the curing process. The silicon phosphorus crystal particles produced in this way will have partial missing and incomplete conditions, which will seriously affect the molding quality of the silicon phosphorus crystal. At the same time, after the silicon phosphorus crystal is formed, the silicon phosphorus crystal particles will adhere to the molding groove. At the same time, there is no suitable demolding angle when the mold group is demolded, which makes it difficult to demold the silicon phosphorus crystal particles, causing the silicon phosphorus crystal particles to be unable to fall off and affecting the subsequent continuous casting and molding.

[0005] Therefore, the present invention proposes a silicon phosphorus crystal forming device, a forming method and its application in the automotive field to solve the above problems. Summary of the invention

[0006] The purpose of the present invention is to provide a silicon phosphorus crystal forming device, a forming method and their application in the automotive field, so as to solve the problems raised in the above background technology.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a silicon phosphorus crystal forming device, comprising a conveying unit, a forming mold group is evenly installed on the conveying unit, a demoulding assembly matching the forming mold group is installed on the conveying unit, the forming mold group comprises a cooling seat, a first mold unit, a second mold unit and a third mold unit with the same structure are installed side by side on the surface of the cooling seat, and the orientation of the first mold unit, the second mold unit and the third mold unit is the same as the conveying direction of the conveying unit, the demoulding assembly comprises a bracket fixed to the front side of the bottom of the conveying unit, and a demoulder corresponding to the first mold unit, the second mold unit and the third mold unit is installed on the bracket; The first mold unit comprises a mounting seat, a receiving groove is formed on the mounting seat, a fixed mold is fixed in the middle of the receiving groove, movable molds are hingedly assembled on the left and right sides of the fixed mold through a rotating shaft, and the contact surface of each group of the movable mold and the fixed mold is set as a wedge-shaped demoulding surface, and the normal of each group of wedge-shaped demoulding surfaces faces upward; Each set of wedge-shaped demolding surfaces is provided with a semicircular forming groove opened on the movable mold and the fixed mold, and the top of the movable mold and the fixed mold are provided with a pouring hole connected to the semicircular forming groove, a pressure plate is fixed on the outer side of the top of each set of movable molds, and a reset part is fixedly connected between the outer wall of each set of movable molds and the inner wall of the storage groove.

[0008] Preferably, 1 / 3 of the fixed mold is fixed on the front and rear side walls of the storage groove, the bottom of the movable mold is provided with a lifting ear, and the lifting ear is hingedly assembled on the front and rear side walls of the fixed mold through a rotating shaft, and the mounting seat is fixed on the top of the cooling seat, and the cooling seat is provided with a movable groove corresponding to the fixed mold and two groups of movable molds, and the movable groove is connected to the storage groove, a winding cooling channel is provided inside the cooling seat, and the cooling channel is filled with coolant, and a liquid inlet and a liquid outlet are fixed on the cooling seat, and control valves are installed on the liquid inlet and the liquid outlet.

[0009] Preferably, the reset member comprises a pressure-bearing rubber air bag fixed between the outer wall of the movable mold and the inner wall of the receiving groove, and the pressure-bearing rubber air bag is connected to a nozzle through an air guide tube, and the nozzle is fixed on the top of the bracket, and the nozzle direction of the nozzle corresponds to the wedge-shaped demolding surface.

[0010] Preferably, the conveying unit includes a fixed frame, and a driving sprocket group and a driven sprocket group are respectively installed on the front and rear sides of the fixed frame, and the driving sprocket group and the driven sprocket group are assembled through a chain transmission, the driving sprocket group is connected to the output end of the motor, and fixed support plates are installed at the chain links on the left and right groups of chains, and the cooling seat is installed on the top of the left and right groups of fixed support plates through fixing bolts.

[0011] Preferably, the demolding device includes a first demolding unit, a second demolding unit, a third demolding unit and a fourth demolding unit which are integrally arranged, and the first demolding unit, the second demolding unit, the third demolding unit and the fourth demolding unit are connected in sequence, and the first demolding unit, the second demolding unit, the third demolding unit and the fourth demolding unit have the same structural composition, and are all composed of a first arc extrusion plate, a second arc extrusion plate and a limit plate.

[0012] Preferably, the outer side walls of the four groups of the first arc extrusion plates are semicircular, and the widths of the first arc extrusion plates on the first demolding unit, the second demolding unit, the third demolding unit and the fourth demolding unit are equidistantly distributed and increase successively, the second arc extrusion plates on the first demolding unit, the second demolding unit, the third demolding unit and the fourth demolding unit have the same size, and the limiting plates on the first demolding unit, the second demolding unit, the third demolding unit and the fourth demolding unit have the same size, and their length is d, which is the same as the length of the movable mold.

[0013] Preferably, the horizontal line where the outer side wall of the limiting plate is located is set as the joining line, the width of the limiting plate is the same as the distance between the two groups of pressure plates, the horizontal line where the outer end of the second arc-shaped extrusion plate is located is set as the first demolding line, the horizontal line where the outer end of the first arc-shaped extrusion plate of the first demolding unit is located is set as the second demolding line, the horizontal line where the outer end of the first arc-shaped extrusion plate of the second demolding unit is located is set as the third demolding line, the horizontal line where the outer end of the first arc-shaped extrusion plate of the third demolding unit is located is set as the fourth demolding line, and the horizontal line where the outer end of the first arc-shaped extrusion plate of the fourth demolding unit is located is set as the fifth demolding line.

[0014] Preferably, the movable mold is assembled on the fixed mold, and the horizontal line of the inner side wall of the pressure plate coincides with the mold joining line. When the movable mold rotates to the outermost side around the rotating shaft, the horizontal line of the inner side wall of the pressure plate coincides with the fifth demolding line.

[0015] The present invention discloses a silicon phosphorus crystal forming method, which is realized by using a silicon phosphorus crystal forming device. The forming method comprises the following steps: S1: The silicon phosphorus crystal melt is poured into the molding die set through an external pouring device. When the conveying unit is working, the molding die set is driven to be transported in an orderly manner. During the process of the molding die set being transported from front to back on the conveying unit, the solution in the molding die set is cooled and formed under the heat conduction of the cooling seat. Since the wedge-shaped demoulding surface is tilted upward, the silicon phosphorus crystal in the semicircular molding groove is cooled and formed on the movable die. S2: As the conveying unit is conveyed, during the process of the molding die set being conveyed from the rear end to the downward inverted state, the reset member continuously squeezes the movable die to ensure the tight fit between the movable die and the fixed die, thereby preventing the uncooled molding solution inside the molding die set from leaking; S3: As the conveying unit conveys the inverted molding die set from the rear end to the front side, the silicon phosphorus crystal particles in the semicircular molding groove are gradually solidified and formed. When the molding die set contacts the demoulder, the demoulder has an extrusion effect on the molding die set, prompting the movable mold to overcome the resilience of the reset member and rotate around the rotating shaft. At this time, the wedge-shaped demoulding surface faces downward and the horizontal angle is smaller. Then, the silicon phosphorus crystal particles formed in the semicircular molding groove of the movable mold are more likely to fall naturally under the action of gravity, and there is no demoulding resistance during demoulding; S4: With the conveying of the conveying unit, the demoulding molding die set is separated from the demoulding device, and the reset member pushes the movable mold to reset, and the above operation is repeated to realize a new casting molding operation.

[0016] The silicon-phosphorus crystal forming method as described above is used in the automotive field and in the direction of exhaust gas purification. Since silicon-bonded silicon carbide (Si-SiC) material is used for exhaust gas purification of diesel vehicles, this material can reduce the Young's modulus of SiC and prevent the generation and expansion of cracks during regeneration, thereby having higher thermal shock resistance, reducing the sintering temperature of SiC, increasing the adjustability of the pore structure, maintaining high mechanical strength and heat resistance; and maintaining excellent acid corrosion resistance.

[0017] Technical effects and advantages of the present invention: 1. In the process of the molding die set being transported from the rear end to the downward inverted state, the reset member continuously squeezes the movable die to ensure the tight fit between the movable die and the fixed die, thereby preventing the uncooled molding solution inside the molding die set from leaking.

[0018] 2. In the present invention, when the molding die set and the demolding device are in contact, the demolding device has an extrusion effect on the molding die set, prompting the movable die to overcome the resilience of the reset part and rotate around the rotating shaft. At this time, the wedge-shaped demolding surface faces downward and the horizontal angle is smaller. Then, the silicon phosphorus crystal particles formed inside the semicircular molding groove of the movable die are more likely to fall naturally under the action of gravity, and there is no demolding resistance during demolding. At the same time, after the pressure-bearing rubber air bag is squeezed, the internal gas will be introduced into the nozzle through the air guide pipe, and then sprayed to the inside of the wedge-shaped demolding surface, accelerating the falling of the silicon phosphorus crystal particles. At the same time, the ejected high-pressure gas is blown to the semicircular molding groove, which is convenient for blowing and cleaning the semicircular molding groove.

[0019] 3. When demolding, each molding mold group in the present invention will go through the demolding operations of the first demolding unit, the second demolding unit, the third demolding unit, and the fourth demolding unit in sequence to ensure the smoothness of the molding mold group during demolding. Combined with the wedge-shaped demolding surface on the movable mold and the cleaning blowing force generated when the reset part on the demolding device is squeezed, it can ensure that the silicon phosphorus crystal particles formed in the molding mold group are demolded smoothly and avoid the difficulty of demolding. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a schematic diagram of the overall first-view structure of the present invention; Figure 2 It is a schematic diagram of the overall structure of the present invention from a second viewing angle; Figure 3 It is a schematic diagram of the local structure of the present invention; Figure 4 It is a structural schematic diagram of the molding die set of the present invention; Figure 5 This is a schematic structural diagram of the first mold unit of the present invention in a mold closing state; Figure 6 This is a schematic structural diagram of the first mold unit of the present invention in a mold opening state; Figure 7 It is a schematic diagram of the structure of the demoulding device of the present invention.

[0021] In the figure: 10, conveying unit; 11, driving sprocket group; 12, driven sprocket group; 13, chain; 14, motor; 15, fixed support plate; 20, forming mold group; 21, cooling seat; 22, first mold unit; 23, second mold unit; 24, third mold unit; 25, mounting seat; 26, fixed mold; 27, rotating shaft; 28, movable mold; 29, wedge-shaped demoulding surface; 210, semicircular forming groove; 211, pouring hole; 212, pressure plate; 21 3. Storage groove; 214. Resetting member; 30. Demolding assembly; 31. Bracket; 32. Demolding device; 33. First demolding unit; 34. Second demolding unit; 35. Third demolding unit; 36. Fourth demolding unit; 37. First arc-shaped extrusion plate; 38. Second arc-shaped extrusion plate; 39. Limiting plate; 310. Moulding line; 311. First demolding line; 312. Second demolding line; 313. Third demolding line; 314. Fourth demolding line; 315. Fifth demolding line. DETAILED DESCRIPTION

[0022] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0023] like Figures 1 to 7As shown, the present embodiment discloses a silicon phosphorus crystal forming device, including a conveying unit 10, on which a forming mold group 20 is evenly installed, and a demolding assembly 30 matching the forming mold group 20 is installed on the conveying unit 10. In actual use, the silicon phosphorus crystal melt is poured into the forming mold group 20 through an external pouring device. When the conveying unit 10 is working, it drives the forming mold group 20 to be transported in an orderly manner. In this process, natural cooling and molding are realized, and after the silicon phosphorus crystal particles are solidified and formed, they fall naturally after demolding under the action of the demolding assembly 30, and no jamming will occur.

[0024] See also Figure 1-Figure 4 The molding mold group 20 includes a cooling seat 21, and a first mold unit 22, a second mold unit 23 and a third mold unit 24 with the same structure are installed side by side on the surface of the cooling seat 21, and the orientation of the first mold unit 22, the second mold unit 23 and the third mold unit 24 is the same as the conveying direction of the conveying unit 10. The demolding assembly 30 includes a bracket 31 fixed to the front side of the bottom of the conveying unit 10, and a demolding device 32 corresponding to the first mold unit 22, the second mold unit 23 and the third mold unit 24 is installed on the bracket 31.

[0025] When in use, the molding mold group 20 is arranged linearly on the conveying unit 10, so that pouring can be achieved in an orderly manner, and each molding mold group has three groups of mold units at the same time, which greatly improves the production efficiency of silicon phosphorus crystal particles, and the orientation of the mold unit is the same as the conveying direction of the conveying unit 10, which facilitates the rapid demolding of the silicon phosphorus crystal particles inside with the cooperation of the demolding device 32 after molding.

[0026] See also Figure 4-Figure 6 The first mold unit 22 includes a mounting seat 25, on which a receiving groove 213 is provided, a fixed mold 26 is fixed in the middle of the receiving groove 213, and movable molds 28 are hingedly assembled on the left and right sides of the fixed mold 26 through a rotating shaft 27, and the contact surface between each group of movable molds 28 and the fixed mold 26 is set as a wedge-shaped demolding surface 29, and the normal of each group of wedge-shaped demolding surfaces 29 faces upward, and each group of wedge-shaped demolding surfaces 29 is provided with a semicircular forming groove 210 opened on the movable mold 28 and the fixed mold 26, and a pouring hole 211 connected to the semicircular forming groove 210 is opened on the top of the movable mold 28 and the fixed mold 26, and a pressure plate 212 is fixed on the outer side of the top of each group of movable molds 28, and a reset member 214 is fixedly connected between the outer wall of each group of movable molds 28 and the inner wall of the receiving groove 213.

[0027] The semicircular molding grooves 210 between the fixed mold 26 and the movable mold 28 overlap to form a circular receiving groove, and the adjacent receiving grooves are connected by the guide grooves, so that when pouring the solution, the solution can flow along the guide grooves between the semicircular molding grooves 210 to ensure the filling fullness of the solution inside the semicircular molding grooves 210, and prevent the occurrence of bubbles that affect the molding quality of the silicon phosphorus crystal particles. With the transmission of the conveying unit 10, during the process of the molding mold group 20 being transported from the rear end to the downward inverted state, the reset part 214 continues to squeeze the movable mold 28 to ensure the close fit between the movable mold 28 and the fixed mold 26, and prevent the uncooled molding solution inside the molding mold group 20 from leaking.

[0028] See also Figure 5 , 1 / 3 of the fixed mold 26 is fixed on the front and rear side walls of the storage groove 213, a lifting ear is provided at the bottom of the movable mold 28, and the lifting ear is hingedly assembled on the front and rear side walls of the fixed mold 26 through a rotating shaft 27, and the mounting seat 25 is fixed on the top of the cooling seat 21, and the cooling seat 21 is provided with a movable groove corresponding to the fixed mold 26 and two groups of movable molds 28, and the movable groove is connected to the storage groove 213, a winding cooling channel is provided inside the cooling seat 21, and the cooling channel is filled with coolant, and a liquid inlet and a liquid outlet are fixed on the cooling seat 21, and control valves are installed on the liquid inlet and the liquid outlet, so as to facilitate the introduction of coolant into the cooling seat 21 through the liquid inlet, and after the silicon-phosphorus crystal solution is introduced into the molding mold group 20, heat conduction cooling of the molding mold group 20 is realized.

[0029] The reset member 214 includes a pressure-bearing rubber air bag fixed between the outer wall of the movable mold 28 and the inner wall of the receiving groove 213, and the pressure-bearing rubber air bag is connected to a nozzle through an air guide tube, and the nozzle is fixed on the top of the bracket 31, and the nozzle jet direction corresponds to the wedge-shaped demoulding surface 29. In actual use, when the molding mold group 20 and the demoulding device 32 are in contact, the demoulding device 32 has an extrusion effect on the molding mold group 20, prompting the movable mold 28 to overcome the resilience of the reset member 214 and rotate around the rotating shaft 27. At this time, The wedge-shaped demolding surface 29 faces downward and has a smaller horizontal angle, so the silicon phosphorus crystal particles formed inside the semicircular molding groove 210 on the movable mold 28 are more likely to fall naturally under the action of gravity, and there is no demolding resistance during demolding. At the same time, after the pressure-bearing rubber air bag is squeezed, the internal gas will be introduced into the nozzle through the air guide pipe, and then sprayed into the wedge-shaped demolding surface 29, accelerating the falling of the silicon phosphorus crystal particles. At the same time, the ejected high-pressure gas is blown toward the semicircular molding groove 210, which is convenient for blowing and cleaning the semicircular molding groove 210.

[0030] The conveying unit 10 includes a fixed frame, and a driving sprocket group 11 and a driven sprocket group 12 are respectively installed on the front and rear sides of the fixed frame, and the driving sprocket group 11 and the driven sprocket group 12 are assembled through a chain 13 for transmission, the driving sprocket group 11 is connected to the output end of the motor 14, and fixed support plates 15 are installed at the chain links on the left and right groups of chains 13, and the cooling seat 21 is installed on the top of the left and right groups of fixed support plates 15 through fixing bolts. When the motor 14 is working, it drives the driving sprocket group 11 to rotate, and the drive of the chain 13 can drive the molding mold group 20 to rotate in an orderly manner, which is convenient for one-to-one casting, and the molding mold group 20 can be cooled and formed during the conveying process.

[0031] See also Figure 3 and Figure 7 The demoulder 32 includes a first demoulding unit 33, a second demoulding unit 34, a third demoulding unit 35 and a fourth demoulding unit 36 ​​which are arranged in an integrated manner, and the first demoulding unit 33, the second demoulding unit 34, the third demoulding unit 35 and the fourth demoulding unit 36 ​​are connected in sequence, and the first demoulding unit 33, the second demoulding unit 34, the third demoulding unit 35 and the fourth demoulding unit 36 ​​have the same structure, and are all composed of a first arc extrusion plate 37, a second arc extrusion plate 38 and a limiting plate 39. The first demoulding unit 33, the second demoulding unit 34, the third demoulding unit 35 and the fourth demoulding unit 36 ​​are connected in sequence. The first unit 35 and the fourth demolding unit 36 ​​are integrally formed and arranged along the conveying direction of the conveying unit 10, so that when the molding mold group 20 contacts the first demolding unit 33, the second demolding unit 34, the third demolding unit 35, and the fourth demolding unit 36 ​​in sequence, it can be demolded four times to ensure that the silicon phosphorus crystal particles inside the molding mold group 20 are demolded with the cooperation of the demolding device 32, and when the molding mold group 20 passes through the first arc extrusion plate 37 and contacts the second arc extrusion plate 38, the movable mold 28 can vibrate at this time, which can accelerate the shedding of the silicon phosphorus crystal particles.

[0032] The outer side walls of the four groups of first arc-shaped extrusion plates 37 are all semicircular, so that when the two groups of movable molds 28 on the molding mold group 20 are in contact with the first arc-shaped extrusion plates 37, the two groups of movable molds 28 can be forced to rotate away from each other under the extrusion of the arc-shaped surface, that is, the movable molds 28 and the fixed molds 26 are forced to separate, so that the silicon phosphorus crystal particles will fall from the movable molds 28, completing the demolding operation.

[0033] See also Figure 7The widths of the first arc-shaped extrusion plates 37 on the first demolding unit 33, the second demolding unit 34, the third demolding unit 35 and the fourth demolding unit 36 ​​are equidistantly distributed and increase in sequence. The second arc-shaped extrusion plates 38 on the first demolding unit 33, the second demolding unit 34, the third demolding unit 35 and the fourth demolding unit 36 ​​are of the same size. The limiting plates 39 on the first demolding unit 33, the second demolding unit 34, the third demolding unit 35 and the fourth demolding unit 36 ​​are of the same size, and their lengths are d, which are the same as the length of the movable mold 28. The horizontal line where the outer wall of the limiting plate 39 is located is set as the mold joining line 310. The width of the limiting plate 39 is the same as the distance between the two groups of pressure plates 212. The horizontal line where the outer end of the second arc-shaped extrusion plate 38 is located is set The first demolding line 311 is set, the horizontal line where the outer end of the first arc-shaped extrusion plate 37 of the first demolding unit 33 is located is set as the second demolding line 312, the horizontal line where the outer end of the first arc-shaped extrusion plate 37 of the second demolding unit 34 is located is set as the third demolding line 313, the horizontal line where the outer end of the first arc-shaped extrusion plate 37 of the third demolding unit 35 is set as the fourth demolding line 314, the horizontal line where the outer end of the first arc-shaped extrusion plate 37 of the fourth demolding unit 36 ​​is set as the fifth demolding line 315, the movable mold 28 is assembled on the fixed mold 26, the horizontal line where the inner side wall of the pressure plate 212 is located coincides with the mold closing line 310, and when the movable mold 28 rotates to the outermost side around the rotating shaft 27, the horizontal line where the inner side wall of the pressure plate 212 is located coincides with the fifth demolding line 315.

[0034] In actual use, the molding die set 20 will first contact the first demolding unit 33, and first extrude the two sets of movable dies 28 through the first arc-shaped extrusion plate 37 to complete the first demolding operation. At this time, the inner side walls of the two sets of movable dies 28 are on the second demolding line 312. As the molding die set 20 is conveyed, the two sets of movable dies 28 will be separated from the first arc-shaped extrusion plate 37 and directly flipped against the second arc-shaped extrusion plate 38. In this way, the vibration of the movable die 28 itself is realized by the impact of the rotation of the movable die 28 to the second arc-shaped extrusion plate 38, which facilitates the shedding of the silicon-phosphorus crystal particles. At this time, the two sets of movable dies 28 The inner wall is on the first demolding line 311. Then, as the molding mold group 20 is transferred again, the movable mold 28 rotates and rests on the outer wall of the limiting plate 39. At this time, the inner walls of the two groups of movable molds 28 and the outer walls of the limiting plate 39 are fitted together, and the inner walls of the two groups of movable molds 28 are on the joining line 310. Since d is the same length as the movable mold 28, when the movable mold 28 and the limiting plate 39 are fitted together, the second demolding unit 34, the third demolding unit 35, the fourth demolding unit 36 ​​and this set of molding mold group 20 will not interfere with each other, thereby ensuring the step-by-step demolding operation of this set of molding mold group 20.

[0035] After the demolding operation of the first demolding unit 33, the molding die set 20 will be extruded and demolded with the second demolding unit 34, the third demolding unit 35, and the fourth demolding unit 36 ​​in sequence, and each time it contacts the demolding unit, the eversion angle of the movable mold 28 becomes larger, which can accelerate the shedding of the silicon phosphorus crystal particles. At the same time, each time the movable mold 28 and the first arc extrusion plate 37 are separated and fall on the second arc extrusion plate 38, the impact force of the second arc extrusion plate 38 on the movable mold 28 can be used to make the adhesion and engagement in the movable mold 28 The silicon phosphorus crystal particles can be fallen off. Therefore, when demolding, each group of molding mold sets 20 will pass through the demolding operations of the first demolding unit 33, the second demolding unit 34, the third demolding unit 35, and the fourth demolding unit 36 ​​in sequence to ensure the smoothness of the molding mold set 20 during demolding. In combination with the wedge-shaped demolding surface 29 on the movable mold 28 and the cleaning blowing force generated when the reset part 214 on the demolding device 32 is squeezed, it can ensure that the silicon phosphorus crystal particles formed in the molding mold set 20 are demolded smoothly to avoid the difficulty of demolding.

[0036] The present invention discloses a silicon phosphorus crystal forming method, which is implemented by using the silicon phosphorus crystal forming device as described above, and is characterized in that the forming method comprises the following steps: S1: The silicon phosphorus crystal melt is poured into the molding die set 20 through an external pouring device. When the conveying unit 10 is working, the molding die set 20 is driven to be transported in an orderly manner. During the conveying process of the molding die set 20 from front to back on the conveying unit 10, the solution in the molding die set 20 is cooled and formed under the heat conduction of the cooling seat 21. Since the wedge-shaped demoulding surface 29 is in an inclined upward state, the silicon phosphorus crystal in the semicircular molding groove 210 is cooled and formed on the movable mold 28; S2: As the conveying unit 10 is conveyed, during the process of the molding die set 20 being conveyed from the rear end to the downward inverted state, the reset member 214 continuously presses the movable die 28 to ensure the tight fit between the movable die 28 and the fixed die 26, and prevents the uncooled molding solution inside the molding die set 20 from leaking; S3: As the conveying unit 10 conveys, in the process of conveying the inverted molding die set 20 from the rear end to the front side, the silicon phosphorus crystal particles in the semicircular molding groove 210 are gradually solidified and formed. When the molding die set 20 and the demolding device 32 are in contact, the demolding device 32 has an extrusion effect on the molding die set 20, prompting the movable mold 28 to overcome the resilience of the reset member 214 and rotate around the rotating shaft 27. At this time, the wedge-shaped demolding surface 29 faces downward and the horizontal angle is smaller. Then, the silicon phosphorus crystal particles formed in the semicircular molding groove 210 on the movable mold 28 are more likely to fall naturally under the action of gravity, and there is no demolding resistance during demolding; S4: With the conveying of the conveying unit 10, the demoulding mold set 20 is separated from the demoulding device 32, and the reset member 214 pushes the movable mold 28 to reset, and the above operation is repeated to realize a new casting operation.

[0037] The silicon-phosphorus crystal forming method as described above is applied in the automotive field and can be applied in the direction of exhaust gas purification. Since silicon-bonded silicon carbide (Si-SiC) material is used for exhaust gas purification of diesel vehicles, this material can reduce the Young's modulus of SiC, prevent the generation and expansion of cracks during regeneration, and thus have higher thermal shock resistance, reduce the sintering temperature of SiC, increase the adjustability of the pore structure, maintain high mechanical strength and heat resistance; maintain excellent acid corrosion resistance; can also be applied to lightweight materials. In automobile manufacturing, silicon-phosphorus crystal particles can be used as part of lightweight materials; can also be applied to flame retardant materials. Silicon-phosphorus crystal particles are also used to prepare high flame retardant ABS automotive interior parts. This material has good flame retardancy, and the made automotive interior parts are of reliable quality and have anti-aging properties; at the same time, it is also widely used in sound insulation, shock absorption and heat-resistant materials. Silicon-phosphorus crystal particles are also used to manufacture sound insulation, shock absorption and heat-resistant ABS composite materials for automotive interiors. This material can increase the heat resistance temperature and has the effect of sound insulation and shock absorption.

[0038] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, it is still possible for those skilled in the art to modify the technical solutions described in the aforementioned embodiments or to make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A silicon phosphorus crystal forming device, comprising a conveying unit (10), characterized in that: The conveying unit (10) is evenly mounted with a molding die set (20), and a demoulding assembly (30) matching the molding die set (20) is mounted on the conveying unit (10); the molding die set (20) comprises a cooling seat (21), and a first mold unit (22), a second mold unit (23) and a third mold unit (24) having the same structure are mounted side by side on the surface of the cooling seat (21); the orientation of the first mold unit (22), the second mold unit (23) and the third mold unit (24) is the same as the conveying direction of the conveying unit (10); the demoulding assembly (30) comprises a bracket (31) fixed to the front side of the bottom of the conveying unit (10), and a demoulder (32) corresponding to the first mold unit (22), the second mold unit (23) and the third mold unit (24) is mounted on the bracket (31); The first mold unit (22) comprises a mounting seat (25), a receiving groove (213) is formed on the mounting seat (25), a fixed mold (26) is fixed in the middle of the receiving groove (213), and movable molds (28) are hingedly assembled on the left and right sides of the fixed mold (26) via a rotating shaft (27), and the contact surface between each group of the movable mold (28) and the fixed mold (26) is set as a wedge-shaped demoulding surface (29), and the normal of each group of wedge-shaped demoulding surfaces (29) faces upward; Each set of wedge-shaped demoulding surfaces (29) is provided with a semicircular forming groove (210) opened on the movable mold (28) and the fixed mold (26), and a pouring hole (211) connected to the semicircular forming groove (210) is opened on the top of the movable mold (28) and the fixed mold (26), a pressure plate (212) is fixed to the outer side of the top of each set of movable molds (28), and a reset member (214) is fixedly connected between the outer side wall of each set of movable molds (28) and the inner side wall of the receiving groove (213).

2. The silicon-phosphorus crystal forming device according to claim 1, characterized in that: One third of the fixed mold (26) is fixed on the front and rear side walls of the receiving groove (213), a lifting lug is provided at the bottom of the movable mold (28), and the lifting lug is hingedly assembled on the front and rear side walls of the fixed mold (26) through a rotating shaft (27), and the mounting seat (25) is fixed on the top of the cooling seat (21), and the cooling seat (21) is provided with movable grooves corresponding to the fixed mold (26) and two groups of movable molds (28), and the movable grooves are connected to the receiving groove (213), and a winding cooling channel is provided inside the cooling seat (21), and the cooling channel is filled with coolant, and a liquid inlet and a liquid outlet are fixed on the cooling seat (21), and control valves are installed on the liquid inlet and the liquid outlet.

3. The silicon phosphorus crystal forming device according to claim 2, characterized in that: The reset member (214) comprises a pressure-bearing rubber air bag fixed between the outer wall of the movable mold (28) and the inner wall of the receiving groove (213), and the pressure-bearing rubber air bag is connected to an air nozzle via an air guide tube, and the air nozzle is fixed to the top of the bracket (31), and the air jet direction of the air nozzle corresponds to the wedge-shaped demoulding surface (29).

4. The silicon-phosphorus crystal forming device according to claim 1, characterized in that: The conveying unit (10) includes a fixed frame, and a driving sprocket group (11) and a driven sprocket group (12) are respectively installed on the front and rear sides of the fixed frame, and the driving sprocket group (11) and the driven sprocket group (12) are assembled through a chain (13) transmission, the driving sprocket group (11) and the output end of the motor (14) are connected, and fixed support plates (15) are installed at the chain links on the left and right groups of chains (13), and the cooling seat (21) is installed on the top of the left and right groups of fixed support plates (15) through fixing bolts.

5. The silicon-phosphorus crystal forming device according to claim 1, characterized in that: The demoulder (32) comprises a first demoulding unit (33), a second demoulding unit (34), a third demoulding unit (35) and a fourth demoulding unit (36) which are arranged in an integral manner, and the first demoulding unit (33), the second demoulding unit (34), the third demoulding unit (35) and the fourth demoulding unit (36) are connected in sequence, and the first demoulding unit (33), the second demoulding unit (34), the third demoulding unit (35) and the fourth demoulding unit (36) have the same structural composition, and are all composed of a first arc-shaped extrusion plate (37), a second arc-shaped extrusion plate (38) and a limit plate (39).

6. The silicon-phosphorus crystal forming device according to claim 5, characterized in that: The outer side walls of the four groups of the first arc-shaped extrusion plates (37) are all semicircular, and the widths of the first arc-shaped extrusion plates (37) on the first demoulding unit (33), the second demoulding unit (34), the third demoulding unit (35) and the fourth demoulding unit (36) are equidistantly distributed and increase in sequence, the second arc-shaped extrusion plates (38) on the first demoulding unit (33), the second demoulding unit (34), the third demoulding unit (35) and the fourth demoulding unit (36) are of the same size, and the limiting plates (39) on the first demoulding unit (33), the second demoulding unit (34), the third demoulding unit (35) and the fourth demoulding unit (36) are of the same size, with a length d, which is the same as the length of the movable mold (28).

7. The silicon-phosphorus crystal forming device according to claim 6, characterized in that: The horizontal line where the outer side wall of the limiting plate (39) is located is set as the mold joining line (310), the width of the limiting plate (39) is the same as the distance between the two groups of pressure plates (212), the horizontal line where the outer end of the second arc-shaped extrusion plate (38) is located is set as the first demoulding line (311), the horizontal line where the outer end of the first arc-shaped extrusion plate (37) of the first demoulding unit (33) is located is set as the second demoulding line (312), the horizontal line where the outer end of the first arc-shaped extrusion plate (37) of the second demoulding unit (34) is located is set as the third demoulding line (313), the horizontal line where the outer end of the first arc-shaped extrusion plate (37) of the third demoulding unit (35) is located is set as the fourth demoulding line (314), and the horizontal line where the outer end of the first arc-shaped extrusion plate (37) of the fourth demoulding unit (36) is located is set as the fifth demoulding line (315).

8. The silicon-phosphorus crystal forming device according to claim 7, characterized in that: The movable mold (28) is assembled on the fixed mold (26), and the horizontal line of the inner wall of the pressure plate (212) coincides with the mold joining line (310). When the movable mold (28) rotates to the outermost side around the rotating shaft (27), the horizontal line of the inner wall of the pressure plate (212) coincides with the fifth demoulding line (315).

9. A method for forming a silicon-phosphorus crystal, implemented by using the silicon-phosphorus crystal forming device as claimed in claim 8, characterized in that: The steps of the molding method are: S1: pouring silicon phosphorus crystal melt into the molding die set (20) through an external pouring device, and when the conveying unit (10) is working, the molding die set (20) is driven to be transported in an orderly manner. During the process of the molding die set (20) being transported from front to back on the conveying unit (10), the solution in the molding die set (20) is cooled and formed under the heat conduction effect of the cooling seat (21). Since the wedge-shaped demoulding surface (29) is in an inclined upward state, the silicon phosphorus crystal in the semicircular molding groove (210) is cooled and formed on the movable mold (28); S2: As the conveying unit (10) is conveyed, during the process of the molding die set (20) being conveyed from the rear end to the downward inverted state, the reset member (214) continuously presses the movable die (28) to ensure a tight fit between the movable die (28) and the fixed die (26), thereby preventing the uncooled molding solution inside the molding die set (20) from leaking; S3: As the conveying unit (10) conveys the inverted molding die set (20) from the rear end to the front side, the silicon phosphorus crystal particles in the semicircular molding groove (210) are gradually solidified and formed. When the molding die set (20) and the demoulder (32) are in contact, the demoulder (32) exerts an extrusion effect on the molding die set (20), prompting the movable mold (28) to overcome the resilience of the reset member (214) and rotate around the rotating shaft (27). At this time, the wedge-shaped demoulding surface (29) faces downward and the horizontal angle is smaller. Then, the silicon phosphorus crystal particles formed inside the semicircular molding groove (210) on the movable mold (28) are more likely to fall naturally under the action of gravity, and there is no demoulding resistance during demoulding; S4: As the conveying unit (10) conveys, the demoulding mold set (20) is separated from the demoulding device (32), and the reset member (214) pushes the movable mold (28) to reset, and the above operation is repeated to achieve a new casting operation.

10. The silicon phosphorus crystal forming method as claimed in claim 9 is used in the automotive field.

Images