Uses of the composition and preparation method of the polyolefin resin composition

Abstract

This invention discloses the use of a composition and a method for preparing a polyolefin resin composition. The invention provides the use of a composition in reducing the bubble content in polyolefin resins, the composition comprising compounds A, B, C, and D; wherein compounds A, B, C, and D are different sorbitol compounds. The composition of this invention can effectively reduce the bubble content in polyolefin resin compositions.

Description

Technical Field

[0001] This invention relates to the use of a composition and a method for preparing a polyolefin resin composition. Background Technology

[0002] Polyolefin resin is a high-performance thermoplastic synthetic resin with excellent chemical resistance, heat resistance, electrical insulation, high mechanical strength, and good abrasion resistance.

[0003] CN106661256A discloses a composition for preparing polymer foam, comprising (i) at least substantially amorphous polymer resin selected from poly(methyl methacrylate), polyvinyl chloride, polystyrene, polystyrene copolymers, polycarbonate, polysulfone, polyethersulfone, poly(p-phenylene ether), glycol-modified polyethylene terephthalate, and mixtures or blends thereof; and (ii) 1,3:2,4-bis-(benzylene)-sorbitol derivatives and mixtures thereof. The resulting polyolefin product has a high bubble content.

[0004] CN105623105B discloses a eutectic composition comprising 1,3:2,4-di-O-(p-chlorobenzyl)-D-sorbitol and 1,3:2,4-di(3,4-dimethylbenzyl)-D-sorbitol, wherein the weight ratio of 1,3:2,4-di-O-(p-chlorobenzyl)-D-sorbitol to 1,3:2,4-di(3,4-dimethylbenzyl)-D-sorbitol satisfies a eutectic point of 240℃-245℃. When this composition is used in polyolefin resin products, it produces a significant amount of bubbles. Summary of the Invention

[0005] In view of this, one object of the present invention is to provide a use of a composition capable of reducing the bubble content in polyolefin resins. Another object of the present invention is to provide a method for preparing a polyolefin resin composition. A further object of the present invention is to provide a use of a composition capable of reducing the haze and processing temperature of polyolefin resins.

[0006] The above objectives are achieved through the following scheme.

[0007] On one hand, the present invention provides the use of a composition in reducing the bubble content in polyolefin resins, the composition comprising the following components:

[0008] (1) Compound A as shown in formula (A):

[0009]

[0010] R1 and R2 are each independently selected from halogens;

[0011] (2) Compound B as shown in formula (B):

[0012]

[0013] R3 to R6 are each independently selected from C1 to C6 alkyl groups;

[0014] (3) Compound C as shown in formula (C):

[0015]

[0016] R7 is selected from halogens, and R8 and R9 are each independently selected from C1 to C6 alkyl groups;

[0017] (4) Compound D as shown in formula (D):

[0018]

[0019] Among them, R 10 and R 11 Each alkyl group is independently selected from C1 to C6, R 12 Selected from halogens.

[0020] According to the present invention, preferably, R1 and R2 are independently selected from F, Cl, Br and I, respectively, wherein R1 is located at the para position of the benzene ring and R2 is located at the para position of the benzene ring;

[0021] R3 to R5 are each independently selected from methyl, ethyl, propyl, butyl, pentyl, and hexyl;

[0022] R7 is selected from F, Cl, Br and I, and R8 and R9 are independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl, respectively;

[0023] R 10 and R 11 Each is independently selected from methyl, ethyl, propyl, butyl, pentyl, and hexyl; R 12 Selected from F, Cl, Br and I.

[0024] According to the use of the invention, preferably, the total content of compound A and compound B is greater than or equal to 10 wt% and less than or equal to 90 wt%, based on the total mass of the composition.

[0025] According to the use of the invention, preferably, the total content of compound C and compound D is greater than or equal to 10 wt%, based on the total mass of the composition.

[0026] According to the use of the present invention, preferably, compound A is as shown in formula (I):

[0027]

[0028] Compound B is shown in formula (II):

[0029]

[0030] Compound C is shown in formula (III):

[0031]

[0032] Compound D is shown in formula (IV):

[0033]

[0034] According to the use of the invention, preferably, the amount of the composition is 0.1 to 0.5 wt%, based on the mass of the polyolefin resin.

[0035] According to the present invention, preferably, the polyolefin resin is selected from one or more of polyethylene, polypropylene, and polybutene.

[0036] On the other hand, the present invention provides a method for preparing a polyolefin resin composition, comprising the following steps:

[0037] A composition is provided comprising the following components:

[0038] (1) Compound A as shown in formula (A):

[0039]

[0040] R1 and R2 are each independently selected from halogens;

[0041] (2) Compound B as shown in formula (B):

[0042]

[0043] R3 to R6 are each independently selected from C1 to C6 alkyl groups;

[0044] (3) Compound C as shown in formula (C):

[0045]

[0046] R7 is selected from halogens, and R8 and R9 are each independently selected from C1 to C6 alkyl groups;

[0047] (4) Compound D as shown in formula (D):

[0048]

[0049] Among them, R 10 and R11 Each alkyl group is independently selected from C1 to C6, R 12 Selected from halogens;

[0050] The raw materials comprising polyolefin resin and the composition are granulated to obtain polyolefin resin particles, and the polyolefin resin particles are injection molded at 150-350°C to obtain a polyolefin resin composition; or, the raw materials comprising polyolefin resin and the composition are extruded at 150-350°C to obtain a polyolefin resin composition.

[0051] In another aspect, the present invention provides the use of a composition in reducing the haze and / or processing temperature of polyolefin resins, said composition comprising the following components:

[0052] (1) Compound A as shown in formula (A):

[0053]

[0054] R1 and R2 are each independently selected from halogens;

[0055] (2) Compound B as shown in formula (B):

[0056]

[0057] R3 to R6 are each independently selected from C1 to C6 alkyl groups;

[0058] (3) Compound C as shown in formula (C):

[0059]

[0060] Wherein, R7 is selected from halogens, and R8 and R9 are independently selected from C1 to C6 alkyl groups; (4) Compound D as shown in formula (D):

[0061]

[0062] Among them, R 10 and R 11 Each alkyl group is independently selected from C1 to C6, R 12 Selected from halogens.

[0063] According to the present invention, preferably, R1 and R2 are independently selected from F, Cl, Br and I, respectively, wherein R1 is located at the para position of the benzene ring and R2 is located at the para position of the benzene ring;

[0064] R3 to R5 are each independently selected from methyl, ethyl, propyl, butyl, pentyl, and hexyl;

[0065] R7 is selected from F, Cl, Br and I, and R8 and R9 are independently selected from methyl, ethyl, propyl, butyl, pentyl and hexyl, respectively;

[0066] R 10 and R 11 Each is independently selected from methyl, ethyl, propyl, butyl, pentyl, and hexyl; R 12 Selected from F, Cl, Br and I.

[0067] The compositions of the present invention can reduce the bubbles generated during the processing and molding of polyolefin resins, resulting in a polyolefin resin composition free of bubbles. The compositions of the present invention can reduce the haze of polyolefin resins and the processing temperature. When applied to polyolefin resins, the compositions of the present invention can reduce the haze of polyolefin resins over a wide processing temperature range (150–350°C), particularly at lower processing temperatures. Detailed Implementation

[0068] The present invention will be further described below with reference to specific embodiments, but the scope of protection of the present invention is not limited thereto.

[0069] <Uses to reduce air bubbles>

[0070] This invention provides the use of a composition in reducing the air bubble content in polyolefin resins. The composition comprises compounds A, B, C, and D. In some embodiments, the composition consists of compounds A, B, C, and D. These air bubbles can be generated during the processing of the polyolefin resin (e.g., injection molding, extrusion).

[0071] Compound A of the present invention is shown in formula (A):

[0072]

[0073] R1 and R2 are each independently selected from halogens. Preferably, R1 and R2 are each independently selected from F, Cl, Br, and I. R1 and R2 may be the same or different. Preferably, R1 and R2 are the same. More preferably, R1 and R2 are both Cl.

[0074] R1 can substitute at the meta or para position of the benzene ring. Preferably, R1 is located at the para position of the benzene ring. R2 can substitute at the meta or para position of the benzene ring. Preferably, R2 is located at the para position of the benzene ring.

[0075] According to one embodiment of the present invention, compound A is as follows:

[0076]

[0077] Specifically, compound A is shown in formula (I):

[0078]

[0079] The name of compound A is 1,3:2,4-bis-O-((4-chlorophenyl)methylene)-D-sorbitol.

[0080] Compound B of the present invention is shown in formula (B):

[0081]

[0082] Wherein, R3 to R6 are each independently selected from C1 to C6 alkyl groups; preferably, R3 to R6 are each independently selected from C1 to C3 alkyl groups. R3 to R6 may be each independently selected from methyl, ethyl, propyl, butyl, pentyl, and hexyl. Examples of propyl include, but are not limited to, n-propyl and isopropyl. Examples of butyl include, but are not limited to, n-butyl, isobutyl, sec-butyl, and tert-butyl. Examples of pentyl include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl, and 2,2-dimethylpropyl. Examples of hexyl include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl, and 2,2-dimethylbutyl.

[0083] R3 to R6 can be the same or different. Preferably, R3 to R6 are the same. More preferably, R3 to R6 are all methyl groups.

[0084] According to one embodiment of the present invention, compound B is as follows:

[0085]

[0086] Specifically, compound B is shown in formula (II):

[0087]

[0088] The name of compound B is 1,3:2,4-bis(3,4-dimethylbenzylidene)-D-sorbitol.

[0089] In the composition of the present invention, the total content of compound A and compound B is greater than or equal to 10 wt% and less than or equal to 90 wt%.

[0090] In some embodiments, the total content of compound A and compound B is greater than or equal to 30 wt%. In other embodiments, the total content of compound A and compound B is greater than or equal to 50 wt%. In still other embodiments, the total content of compound A and compound B is greater than or equal to 60 wt%.

[0091] In some embodiments, the total content of compounds A and B is less than or equal to 80 wt%. In some embodiments, the total content of compounds A and B is less than or equal to 70 wt%. In other embodiments, the total content of compounds A and B is less than or equal to 60 wt%. In still other embodiments, the total content of compounds A and B is less than or equal to 50 wt%. In yet another embodiment, the total content of compounds A and B is less than or equal to 40 wt%.

[0092] By controlling the contents of compounds A and B within the above-mentioned range, the bubble content in the molded polyolefin resin composition can be effectively reduced.

[0093] The mass ratio of compound A to compound B can be 1:(0.3-8); preferably 1:(0.5-6); more preferably 1:(0.8-5); and most preferably 1:(0.9-1.2).

[0094] Compound C of the present invention is shown in formula (C):

[0095]

[0096] R7 is selected from halogens, and R8 and R9 are each independently selected from C1 to C6 alkyl groups.

[0097] Preferably, R7 is selected from F, Cl, Br, and I. According to one embodiment of the invention, R7 is Cl.

[0098] Preferably, R8 and R9 are each independently selected from C1-C3 alkyl groups. R8 and R9 can be each independently selected from methyl, ethyl, propyl, butyl, pentyl, and hexyl. Examples of propyl include, but are not limited to, n-propyl and isopropyl. Examples of butyl include, but are not limited to, n-butyl, isobutyl, sec-butyl, and tert-butyl. Examples of pentyl include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl, and 2,2-dimethylpropyl. Examples of hexyl include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl, and 2,2-dimethylbutyl. R8 and R9 can be the same or different. Preferably, R8 and R9 are the same. More preferably, R8 and R9 are both methyl.

[0099] According to one embodiment of the present invention, compound C is as follows:

[0100]

[0101] Specifically, compound C is shown as shown in formula (III):

[0102]

[0103] The name of compound C is 1,3-(3,4-dimethylbenzylidene)-2,4-p-chlorobenzylidene-D-sorbitol.

[0104] The compound D of the present invention is shown in formula (D):

[0105]

[0106] Among them, R 10 and R 11 Each alkyl group is independently selected from C1 to C6, R 12 Selected from halogens.

[0107] Preferably, R 12 Selected from F, Cl, Br, and I. According to one embodiment of the present invention, R... 12 It is Cl.

[0108] Preferably, R 10 and R 11 Alkyl groups, each independently selected from C1 to C3. R 10 and R 11 It can be independently selected from methyl, ethyl, propyl, butyl, pentyl, and hexyl. Examples of propyl include, but are not limited to, n-propyl and isopropyl. Examples of butyl include, but are not limited to, n-butyl, isobutyl, sec-butyl, and tert-butyl. Examples of pentyl include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl, and 2,2-dimethylpropyl. Examples of hexyl include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl, and 2,2-dimethylbutyl. R 10 and R 11 They can be the same or different. Preferably, R 10 and R 11 Same. More preferably, R 10 and R 11 All are methyl groups.

[0109] According to one embodiment of the present invention, compound D is as follows:

[0110]

[0111] Specifically, compound D is shown in formula (IV):

[0112]

[0113] The name of compound D is 1,3-p-chlorobenzylidene-2,4-(3,4-dimethylbenzylidene)-D-sorbitol.

[0114] In the composition of the present invention, the total content of compound C and compound D is greater than or equal to 10 wt%.

[0115] In some embodiments, the total content of compounds C and D is greater than or equal to 30 wt%. In other embodiments, the total content of compounds C and D is greater than or equal to 40 wt%. In still other embodiments, the total content of compounds C and D is greater than or equal to 50 wt%. In yet other embodiments, the total content of compounds C and D is greater than or equal to 60 wt%.

[0116] In some embodiments, the total content of compounds C and D is less than or equal to 90 wt%. In some embodiments, the total content of compounds C and D is less than or equal to 80 wt%. In other embodiments, the total content of compounds C and D is less than or equal to 70 wt%. In still other embodiments, the total content of compounds C and D is less than or equal to 60 wt%. In yet another embodiment, the total content of compounds C and D is less than or equal to 50 wt%.

[0117] By controlling the contents of compounds C and D within the above-mentioned range, the bubble content in the molded polyolefin resin composition can be effectively reduced.

[0118] The mass ratio of compound C to compound D is 1:(0.5-2); preferably 1:(0.8-1.5); more preferably 1:(0.9-1.2).

[0119] The composition of the present invention can reduce the bubbles generated during the processing of polyolefin resin, and the resulting polyolefin resin composition does not contain bubbles.

[0120] The polyolefin resin of this invention can be selected from one or more of polyethylene, polypropylene, and polybutene. Preferably, the polyolefin resin is polypropylene resin. The polypropylene resin can be isotactic polypropylene, atactic polypropylene, or syndiotactic polypropylene. Polypropylene has better compatibility with the composition of this invention and can better exert the effect of the composition.

[0121] Based on the mass of the polyolefin resin, the amount of the composition can be 0.1 to 0.5 wt%; preferably 0.15 to 0.4 wt%; more preferably 0.2 to 0.35 wt%.

[0122] <Preparation Method of Polyolefin Composition>

[0123] The method for preparing the polyolefin composition of the present invention includes the following steps: molding a raw material containing the composition and a polyolefin resin to obtain a polyolefin resin composition. In some embodiments, the raw material may also contain one or more of pigments and antioxidants. The composition and amount of the composition are as described above and will not be repeated here. Injection molding or extrusion molding processes can be used. The polyolefin resin composition prepared by the method of the present invention does not contain air bubbles.

[0124] The pigments of this invention can be selected from one or more of quinacridone, perylene-based, dioxazine pigments, isoindolineone, pyrrolopyrroledione, phthalocyanine blue, and ultramarine blue.

[0125] Based on polyolefin resin, the amount of pigment can be 0.005-0.2 wt%; preferably 0.008-0.1 wt%; more preferably 0.01-0.05 wt%.

[0126] Injection molding

[0127] Injection molding includes a granulation step and an injection molding step. Specifically, raw materials comprising polyolefin resin and the above composition are granulated to obtain polyolefin resin particles; the polyolefin resin particles are then injection molded to obtain a polyolefin resin composition.

[0128] Raw materials, including polyolefin resin and the composition, can be mixed to obtain a mixture. The mixture is then melted, kneaded, and granulated. In some embodiments, the components of the composition need to be thoroughly mixed before being mixed with the polyolefin resin.

[0129] The granulation temperature can be between 150 and 350°C. In some embodiments, the granulation temperature is preferably between 200 and 300°C.

[0130] The injection temperature can be 150–350°C; preferably 170–300°C; more preferably 180–200°C.

[0131] Extrusion molding

[0132] The raw materials comprising a polyolefin resin and the composition are extruded at 150–350°C to obtain a polyolefin resin composition. Preferably, the raw materials comprising the polyolefin resin and the composition are extruded at 200–300°C.

[0133] <Applications for reducing haze and / or processing temperature>

[0134] This invention provides the use of a composition in reducing haze and / or processing temperature in polyolefin resins. The composition comprises compounds A, B, C, and D. In some embodiments, the composition consists of compounds A, B, C, and D. The composition of this invention, when added to polyolefin resins, achieves good haze reduction over a wide range of processing temperatures. In particular, the composition of this invention, when added to polyolefin resins, achieves good haze reduction at lower processing temperatures. The processing temperature can be 150–350°C; preferably 170–300°C. In some embodiments, the processing temperature is 180–200°C. The processing temperature can be a molding processing temperature, such as injection molding temperature, extrusion temperature, etc.

[0135] Compound A of the present invention is shown in formula (A):

[0136]

[0137] R1 and R2 are each independently selected from halogens. Preferably, R1 and R2 are each independently selected from F, Cl, Br, and I. R1 and R2 may be the same or different. Preferably, R1 and R2 are the same. More preferably, R1 and R2 are both Cl.

[0138] R1 can substitute at the meta or para position of the benzene ring. Preferably, R1 is located at the para position of the benzene ring. R2 can substitute at the meta or para position of the benzene ring. Preferably, R2 is located at the para position of the benzene ring.

[0139] According to one embodiment of the present invention, compound A is as follows:

[0140]

[0141] Specifically, compound A is shown in formula (I):

[0142]

[0143] The name of compound A is 1,3:2,4-bis-O-((4-chlorophenyl)methylene)-D-sorbitol.

[0144] Compound B of the present invention is shown in formula (B):

[0145]

[0146] Wherein, R3 to R6 are each independently selected from C1 to C6 alkyl groups; preferably, R3 to R6 are each independently selected from C1 to C3 alkyl groups. R3 to R6 may be each independently selected from methyl, ethyl, propyl, butyl, pentyl, and hexyl. Examples of propyl include, but are not limited to, n-propyl and isopropyl. Examples of butyl include, but are not limited to, n-butyl, isobutyl, sec-butyl, and tert-butyl. Examples of pentyl include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl, and 2,2-dimethylpropyl. Examples of hexyl include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl, and 2,2-dimethylbutyl.

[0147] R3 to R6 can be the same or different. Preferably, R3 to R6 are the same. More preferably, R3 to R6 are all methyl groups.

[0148] According to one embodiment of the present invention, compound B is as follows:

[0149]

[0150] Specifically, compound B is shown in formula (II):

[0151]

[0152] The name of compound B is 1,3:2,4-bis(3,4-dimethylbenzylidene)-D-sorbitol.

[0153] In the composition of the present invention, the total content of compound A and compound B is greater than or equal to 10 wt% and less than or equal to 90 wt%.

[0154] In some embodiments, the total content of compound A and compound B is greater than or equal to 30 wt%. In other embodiments, the total content of compound A and compound B is greater than or equal to 50 wt%. In still other embodiments, the total content of compound A and compound B is greater than or equal to 60 wt%.

[0155] In some embodiments, the total content of compounds A and B is less than or equal to 80 wt%. In some embodiments, the total content of compounds A and B is less than or equal to 70 wt%. In other embodiments, the total content of compounds A and B is less than or equal to 60 wt%. In still other embodiments, the total content of compounds A and B is less than or equal to 50 wt%. In yet another embodiment, the total content of compounds A and B is less than or equal to 40 wt%.

[0156] By controlling the contents of compounds A and B within the above-mentioned range, the haze and processing temperature of polyolefin resins can be effectively reduced.

[0157] The mass ratio of compound A to compound B can be 1:(0.3-8); preferably 1:(0.5-6); more preferably 1:(0.8-5); and most preferably 1:(0.9-1.2).

[0158] Compound C of the present invention is shown in formula (C):

[0159]

[0160] R7 is selected from halogens, and R8 and R9 are each independently selected from C1 to C6 alkyl groups.

[0161] Preferably, R7 is selected from F, Cl, Br, and I. According to one embodiment of the invention, R7 is Cl.

[0162] Preferably, R8 and R9 are each independently selected from C1-C3 alkyl groups. R8 and R9 can be each independently selected from methyl, ethyl, propyl, butyl, pentyl, and hexyl. Examples of propyl include, but are not limited to, n-propyl and isopropyl. Examples of butyl include, but are not limited to, n-butyl, isobutyl, sec-butyl, and tert-butyl. Examples of pentyl include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl, and 2,2-dimethylpropyl. Examples of hexyl include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl, and 2,2-dimethylbutyl. R8 and R9 can be the same or different. Preferably, R8 and R9 are the same. More preferably, R8 and R9 are both methyl.

[0163] According to one embodiment of the present invention, compound C is as follows:

[0164]

[0165] Specifically, compound C is shown as shown in formula (III):

[0166]

[0167] The name of compound C is 1,3-(3,4-dimethylbenzylidene)-2,4-p-chlorobenzylidene-D-sorbitol.

[0168] The compound D of the present invention is shown in formula (D):

[0169]

[0170] Among them, R 10 and R 11 Each alkyl group is independently selected from C1 to C6, R 12 Selected from halogens.

[0171] Preferably, R 12 Selected from F, Cl, Br, and I. According to one embodiment of the present invention, R... 12 It is Cl.

[0172] Preferably, R 10 and R 11 Alkyl groups, each independently selected from C1 to C3. R 10 and R 11 It can be independently selected from methyl, ethyl, propyl, butyl, pentyl, and hexyl. Examples of propyl include, but are not limited to, n-propyl and isopropyl. Examples of butyl include, but are not limited to, n-butyl, isobutyl, sec-butyl, and tert-butyl. Examples of pentyl include, but are not limited to, n-pentyl, 2-methylbutyl, 3-methylbutyl, 1-ethylpropyl, 2-ethylpropyl, 2,3-dimethylpropyl, and 2,2-dimethylpropyl. Examples of hexyl include, but are not limited to, n-hexyl, 2-methylpentyl, 3-methylpentyl, 2,3-dimethylbutyl, and 2,2-dimethylbutyl. R 10 and R 11 They can be the same or different. Preferably, R 10 and R 11 Same. More preferably, R 10 and R 11 All are methyl groups.

[0173] According to one embodiment of the present invention, compound D is as follows:

[0174]

[0175] Specifically, compound D is shown in formula (IV):

[0176]

[0177] The name of compound D is 1,3-p-chlorobenzylidene-2,4-(3,4-dimethylbenzylidene)-D-sorbitol.

[0178] In the composition of the present invention, the total content of compound C and compound D is greater than or equal to 10 wt%.

[0179] In some embodiments, the total content of compounds C and D is greater than or equal to 30 wt%. In other embodiments, the total content of compounds C and D is greater than or equal to 40 wt%. In still other embodiments, the total content of compounds C and D is greater than or equal to 50 wt%. In yet other embodiments, the total content of compounds C and D is greater than or equal to 60 wt%.

[0180] In some embodiments, the total content of compounds C and D is less than or equal to 90 wt%. In some embodiments, the total content of compounds C and D is less than or equal to 80 wt%. In other embodiments, the total content of compounds C and D is less than or equal to 70 wt%. In still other embodiments, the total content of compounds C and D is less than or equal to 60 wt%. In yet another embodiment, the total content of compounds C and D is less than or equal to 50 wt%.

[0181] By controlling the contents of compounds C and D within the above-mentioned range, the haze and processing temperature of polyolefin resins can be effectively reduced.

[0182] The mass ratio of compound C to compound D is 1:(0.5-2); preferably 1:(0.8-1.5); more preferably 1:(0.9-1.2).

[0183] The haze of the polyolefin composition of the present invention is less than or equal to 11%, preferably less than or equal to 8.5%, and more preferably less than or equal to 5.5%. In some embodiments, the haze is 3% to 11%, preferably 4% to 9%, and more preferably 5% to 6%. The haze is measured using a haze meter according to GB / T 2410-2008, and the sample is a thin sheet with a thickness of 1 mm.

[0184] The polyolefin resin of this invention can be selected from one or more of polyethylene, polypropylene, and polybutene. Preferably, the polyolefin resin is polypropylene resin. The polypropylene resin can be isotactic polypropylene, atactic polypropylene, or syndiotactic polypropylene. Polypropylene has better compatibility with the composition of this invention and can better exert the effect of the composition.

[0185] Based on the mass of the polyolefin resin, the amount of the composition can be 0.1-0.5 wt%; preferably 0.15-0.4 wt%; more preferably 0.2-0.35 wt%; and most preferably 0.3-0.35 wt%.

[0186] The raw materials are described below:

[0187] Polypropylene resin: MT20 powder produced by Sinopec Zhongyuan Petrochemical Co., Ltd., with a melt index of 18-22 g / 10 min and an ethylene content of less than 5%.

[0188] Preparation Example 1

[0189] 18.2 g of sorbitol powder, 13.4 g of 3,4-dimethylbenzaldehyde, 14.3 g of p-chlorobenzaldehyde, 200 mL of cyclohexane, 50 mL of methanol, and 2.0 g of p-toluenesulfonic acid were added to a reaction vessel. The mixture was heated, and water and methanol were removed from the system under reflux. The reaction was carried out for 1.5 h, then cooled, neutralized, washed with water, filtered, and dried to obtain the composition.

[0190] The composition was analyzed by gas chromatography. The composition consists of 52 wt% of a mixture of 1,3-(3,4-dimethylbenzylene)-2,4-p-chlorobenzylene-D-sorbitol and 1,3-p-chlorobenzylene-2,4-(3,4-dimethylbenzylene)-D-sorbitol, 23 wt% of 1,3:2,4-di(3,4-dimethylbenzylene)-D-sorbitol and 25 wt% of 1,3:2,4-bis-O-((4-chlorophenyl)methylene)-D-sorbitol.

[0191] Example 1

[0192] 0.2 parts by weight of the composition from Preparation Example 1, 0.01 parts by weight of ultramarine blue, and 100 parts by weight of polypropylene resin were mixed evenly to obtain a mixture. The mixture was added to an extruder, and the extruder temperature was set to 240°C. The mixture melted in the extruder and flowed out from the extruder die. After being cooled with cold water, it was molded to obtain a polyolefin resin composition (a filament with a diameter of approximately 3-5 mm). The presence of air bubbles in the obtained polyolefin resin composition was observed, and the results are shown in Table 1.

[0193] Comparative Example 1

[0194] Except for replacing the composition of Preparation Example 1 with 1,3:2,4-di(3,4-dimethylbenzyl)-D-sorbitol, the rest was the same as in Example 1. The presence or absence of air bubbles in the obtained polyolefin resin composition was observed, and the results are shown in Table 1.

[0195] Comparative Example 2

[0196] Except for replacing the composition of Preparation Example 1 with 1,3:2,4-bis-O-((4-chlorophenyl)methylene)-D-sorbitol, the rest was the same as in Example 1. The presence or absence of air bubbles in the obtained polyolefin resin composition was observed, and the results are shown in Table 1.

[0197] Table 1

[0198] Serial Number Does it contain air bubbles? Example 1 — Comparative Example 1 + Comparative Example 2 +

[0199] Note: "—" indicates no air bubbles, and "+" indicates air bubbles.

[0200] As shown in Table 1, the composition of the present invention can significantly reduce the content of air bubbles in the polyolefin resin composition, and the resulting polyolefin resin composition contains no air bubbles.

[0201] Example 2

[0202] 100 parts by weight of polypropylene resin, 0.2 parts by weight of the composition of Preparation Example 1, and 0.01 parts by weight of ultramarine blue were mixed evenly in a mixer to obtain a mixture. The mixture was melted and kneaded, and then granulated at 220°C to obtain polyolefin resin particles.

[0203] Polyolefin resin granules are injection molded in an injection molding machine to obtain a polyolefin resin composition (a sheet with a thickness of 1 mm). The temperature of the injection molding machine is set to 190°C.

[0204] The haze was tested according to the method specified in GB / T 2410-2008, and the results are shown in Table 2.

[0205] Example 3

[0206] Except for setting the injection molding machine temperature to 230℃, the rest was the same as in Example 1. The haze was tested according to the method specified in GB / T2410-2008, and the results are shown in Table 2.

[0207] Comparative Example 3

[0208] Except that the composition of Preparation Example 1 was replaced with 1,3:2,4-di(3,4-dimethylbenzyl)-D-sorbitol, the rest was the same as in Example 1. The haze was tested according to the method specified in GB / T 2410-2008, and the results are shown in Table 2.

[0209] Comparative Example 4

[0210] Except for setting the injection molding machine temperature to 230℃, everything else was the same as in Comparative Example 3. The haze was tested according to the method specified in GB / T2410-2008, and the results are shown in Table 2.

[0211] Comparative Example 5

[0212] Except that the composition of Preparation Example 1 was replaced with 1,3:2,4-bis-O-((4-chlorophenyl)methylene)-D-sorbitol, the rest was the same as in Example 1. The haze was tested according to the method specified in GB / T 2410-2008, and the results are shown in Table 2.

[0213] Comparative Example 6

[0214] Except for setting the injection molding machine temperature to 230℃, everything else was the same as in Comparative Example 5. The haze was tested according to the method specified in GB / T2410-2008, and the results are shown in Table 2.

[0215] Comparative Example 7

[0216] 100 parts by weight of polypropylene resin were melted and kneaded, and then granulated at 220°C to obtain polyolefin resin particles.

[0217] Polyolefin resin granules are injection molded in an injection molding machine to obtain polyolefin resin sheets (1 mm thick). The temperature of the injection molding machine is set to 190℃.

[0218] The haze was tested according to the method specified in GB / T 2410-2008, and the results are shown in Table 2.

[0219] Comparative Example 8

[0220] Except for setting the injection molding machine temperature to 230℃, everything else was the same as in Comparative Example 7. The haze was tested according to the method specified in GB / T2410-2008, and the results are shown in Table 2.

[0221] Table 2

[0222] Haze (%) Example 2 10.3 Example 3 10.6 Comparative Example 3 22.1 Comparative Example 4 11.4 Comparative Example 5 13.6 Comparative Example 6 13.8 Comparative Example 7 40.4 Comparative Example 8 41.3

[0223] As shown in Table 2, the compositions of the present invention can effectively reduce the haze of polypropylene resin, especially the haze of polyolefin resin compositions obtained under low-temperature injection molding conditions. The haze can be reduced by more than 70%.

[0224] This invention is not limited to the above-described embodiments. Any modifications, improvements, or substitutions that can be conceived by those skilled in the art without departing from the essential content of this invention fall within the scope of this invention.

Claims

1. Use of a composition in reducing the content of air bubbles generated during the extrusion of polypropylene resin, characterized in that, The composition comprises 52 wt% of a mixture of 1,3-(3,4-dimethylbenzyl)-2,4-p-chlorobenzyl-D-sorbitol and 1,3-p-chlorobenzyl-2,4-(3,4-dimethylbenzyl)-D-sorbitol, 23 wt% of 1,3:2,4-bis(3,4-dimethylbenzyl)-D-sorbitol and 25 wt% of 1,3:2,4-bis-O-((4-chlorophenyl)methylene)-D-sorbitol; Includes the following steps: 0.2 parts by weight of the composition, 0.01 parts by weight of ultramarine blue, and 100 parts by weight of polypropylene resin are mixed evenly to obtain a mixture; the mixture is added to an extruder, and the temperature of the extruder is set to 240°C; the mixture melts in the extruder and flows out from the extruder die, and is cooled and shaped by cold water to obtain a polypropylene resin composition; the polypropylene resin composition is a linear material with a diameter of 3-5 mm, and the polypropylene resin composition does not contain air bubbles.

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