Main-grid-free 0BB detection mechanism

Abstract

A main-grid-free 0BB detection mechanism disclosed by the present invention comprises a lifting support, an upper mounting frame, a lower mounting frame, a gold thread table and a lower copper base, an upper linear module and a lower linear module are mounted on the lifting support, the upper linear module is connected with the side edge of the upper mounting frame, the gold thread table is adjusted back and forth along the upper mounting frame, and tension springs are arranged on both sides of the gold thread table. Gold wires are straightened between the tension springs, the outer side of the lower installation frame is adjusted to the driving end of the lower linear module in the front-back direction, the lower copper base is located in the middle of the lower installation frame, copper discs are arranged in the middle of the lower copper base, and the upper ends of the copper discs are in an upwards-bent arc shape. According to the main-grid-free 0BB detection mechanism, the gold wire is pressed down from the upper part and is matched with the copper disc jacked up from the lower part, so that the electrical performance detection of the auxiliary grid on the 0BB silicon wafer is realized, and the fragment rate is reduced while the cost is reduced and the efficiency is improved during the production of the 0BB silicon wafer.

Description

Technical Field

[0001] The present invention relates to the technical field of silicon wafer production, and in particular to an 0BB detection mechanism for a main-gate-free device. Background Art

[0002] Photovoltaic solar silicon wafers (hereinafter referred to as silicon wafers) are the core part of the solar power generation system and also the most valuable part of the solar power generation system. The function of the silicon wafer is to convert solar energy into electrical energy, which is stored by batteries or directly loaded for work. In existing silicon wafers, there are main grid lines on the front side, which will block the surface of the solar cell, affect the cell's absorption of light, and thus affect the power generation efficiency. In subsequent new silicon wafers, the main grid lines on the front side are removed, which makes it difficult to detect the quality of the silicon wafers during production, affecting the detection of the yield rate. Summary of the invention

[0003] One purpose of the present invention is to provide an OBB detection mechanism for main-gate-less OBB silicon wafers, which can reduce costs and increase efficiency during the use of silicon wafers. The OBB silicon wafers are supported by an arc-shaped copper disk at the bottom and held by elastically contacted gold wires at the top to achieve electrical performance detection and reduce the fragmentation rate.

[0004] To achieve this object, the present invention adopts the following technical solutions:

[0005] A 0BB ​​detection mechanism for a busbar-free device comprises a lifting bracket, an upper mounting frame, a lower mounting frame, a gold wire platform and a lower copper seat, wherein an upper linear module and a lower linear module are mounted on the lifting bracket, the upper linear module is connected to the side of the upper mounting frame, the gold wire platform is adjusted forward and backward along the upper mounting frame, both sides of the gold wire platform are provided with tension springs, gold wires are straightened between the tension springs, the outer side of the lower mounting frame is adjusted along the forward and backward direction on the driving end of the lower linear module, the lower copper seat is located in the middle of the lower mounting frame, copper plates are arranged and placed in the middle of the lower copper seat, and the upper ends of the copper plates are in an arc shape bent upward.

[0006] As a preferred technical solution, an upper frame opening is provided in the middle of the upper mounting frame, the gold wire platform moves within the upper frame opening, a circuit board is installed on the side of the upper frame opening, the circuit board is conductively connected to the end of the gold wire, and a first wire is connected to the outside of the circuit board.

[0007] As a preferred technical solution, a guide light axis is provided on the upper mounting frame along the front-rear direction, and a guide slider is connected to the side of the gold wire stage, and the guide slider slides on the guide light axis.

[0008] As a preferred technical solution, a lower frame opening is provided in the middle of the lower mounting frame, mounting grooves and pressure strips are provided on both sides of the lower frame opening, the outer side of the copper disk is locked in the mounting groove, the pressure strip is pressed on the outer side of the copper disk, and second wires are connected to both sides of the copper disk.

[0009] As a preferred technical solution, a guide groove is connected to the driving end of the lower linear module, and the side position of the lower mounting frame is adjusted in the guide groove.

[0010] As a preferred technical solution, a vertical guide rail is fixed on the lifting bracket, and a vertical slider is connected to the upper mounting frame and the guide groove, and the vertical slider slides on the vertical guide rail along the vertical direction.

[0011] As a preferred technical solution, the lower linear module includes a lower motor, a lower screw rod and a lower nut, the lower motor is connected to the upper end of the lower screw rod, the lower screw rod is threadedly connected to the lower nut, and the guide groove passes through the lifting bracket and is fixedly connected to the lower nut.

[0012] As a preferred technical solution, the upper linear module includes an upper motor, an upper screw rod and an upper nut. The upper motor is connected to the lower end of the upper screw rod, the upper screw rod is threadedly connected to the upper nut, and the upper mounting frame is fixedly connected to the upper nut after passing through the lifting bracket.

[0013] The beneficial effects of the present invention are as follows: a 0BB detection mechanism for a main grid-less device is provided, which realizes the electrical performance detection of the 0BB silicon wafer by pressing down a gold wire from above and cooperating with a copper plate lifted up from below. While reducing the cost and increasing the efficiency of producing 0BB silicon wafers, the present invention can also have the electrical performance capability of detecting the electrical performance of the silicon wafer, thereby reducing the use of silver paste on the silicon wafer, improving production capacity, and reducing the fragmentation rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The present invention is further described in detail below based on the accompanying drawings and embodiments.

[0015] Figure 1 Schematic diagram of the overall structure of an 0BB detection mechanism for a busbar-free device according to an embodiment;

[0016] Figure 2 It is a three-dimensional structural diagram of the upper mounting frame described in the embodiment;

[0017] Figure 3 It is a front view of the upper mounting frame described in the embodiment;

[0018] Figure 4 It is a three-dimensional structural diagram of the lower copper seat described in the embodiment.

[0019] Figures 1 to 4 middle:

[0020] 1. Lifting bracket; 2. Upper mounting frame; 3. Lower mounting frame; 4. Gold wire table; 5. Lower copper seat; 6. Tension spring; 7. Gold wire; 8. Copper plate; 9. Upper frame mouth; 10. Circuit board; 11. First conductor; 12. Guide optical axis; 13. Guide slider; 14. Lower frame mouth; 15. Pressure strip; 16. Second conductor; 17. Guide groove; 18. Vertical guide rail; 19. Vertical slider; 20. Lower motor; 21. Lower screw rod; 22. Lower nut; 23. Upper motor; 24. Upper nut. DETAILED DESCRIPTION

[0021] The technical solution of the present invention is further described below with reference to the accompanying drawings and through specific implementation methods.

[0022] like Figures 1 to 4 As shown, in this embodiment, a 0BB detection mechanism for a main grid-free device includes a lifting bracket 1, an upper mounting frame 2, a lower mounting frame 3, a gold wire platform 4 and a lower copper seat 5. An upper linear module and a lower linear module are installed on the lifting bracket 1. The upper linear module is connected to the side of the upper mounting frame 2. The gold wire platform 4 is adjusted forward and backward along the upper mounting frame 2. Both sides of the gold wire platform 4 have tension springs 6. Gold wires 7 are straightened between the tension springs 6. The outer side of the lower mounting frame 3 is adjusted on the driving end of the lower linear module along the forward and backward direction. The lower copper seat 5 is located in the middle of the lower mounting frame 3. Copper plates 8 are arranged in the middle of the lower copper seat 5, and the upper ends of the copper plates 8 are in an arc shape bent upward.

[0023] When the 0BB silicon wafer comes to the detection mechanism, the upper linear modules on the lifting brackets 1 on both sides control the gold wire stage 4 on the upper mounting frame 2 to move downward, and at the same time, the lower linear module controls the lower copper seat 5 on the lower mounting frame 3 to rise upward. The arc-shaped protrusion in the middle of the copper disk 8 is pressed under the auxiliary grid in the 0BB silicon wafer. Since there is a tension spring 6 on the gold wire stage 4, the gold wire 7 will be in an elastic state when pressed on the auxiliary grid. It is convenient to fit on the auxiliary grid by tightening the screws on both sides of the gold wire stage 4. The tension spring 6 is stretched, and the gold wire 7 and the copper disk 8 form a passage with the auxiliary grid position, so that the electrical performance can be tested. At the same time, the detection mechanism can adjust the front and rear direction according to the specific position of the current 0BB silicon wafer. The upper gold wire stage 4 moves forward and backward along the upper mounting frame 2, and the lower copper disk 8 moves forward and backward on the lifting bracket 1 along the positions on both sides of the lower mounting frame 3 where the lower copper seat 5 is fixed.

[0024] An upper frame opening 9 is provided in the middle of the upper mounting frame 2, and the gold wire stage 4 moves in the upper frame opening 9. A circuit board 10 is installed on the side of the upper frame opening 9. The circuit board 10 is conductively connected to the end of the gold wire 7. A first conductive wire 11 is connected to the outer side of the circuit board 10. The first conductive wire 11 is connected through the gold wire 7 connected to the circuit board 10. When the gold wire 7 is pressed on the auxiliary gate, the 0BB silicon wafer can be connected.

[0025] A guide light axis 12 is arranged on the upper mounting frame 2 along the front-to-back direction, and a guide slider 13 is connected to the side of the gold wire stage 4. The guide slider 13 slides on the guide light axis 12. According to the front-to-back position of the 0BB silicon wafer, the gold wire stage 4 can cooperate with the left and right guide sliders 13 to slide on the guide light axis 12 to adjust the position, and then lock it by the screws on the guide slider 13.

[0026] A lower frame opening 14 is provided in the middle of the lower mounting frame 3, and mounting grooves and pressure strips 15 are provided on both sides of the lower frame opening 14. The outer side of the copper plate 8 is locked in the mounting groove, and the pressure strip 15 is pressed on the upper side of the outer side of the copper plate 8. The second wires 16 are connected to the two sides of the copper plate 8. During the installation process, the two sides of the copper plate 8 are inserted into the mounting grooves, and the pressure strip 15 is pressed down from the top to ensure that the position of the copper plate 8 will not change relative to the lower mounting frame 3.

[0027] A guide groove 17 is connected to the driving end of the lower linear module, and the side position of the lower mounting frame 3 is adjusted in the guide groove 17. The lower linear module includes a lower motor 20, a lower screw rod 21 and a lower nut 22. The lower motor 20 is connected to the upper end of the lower screw rod 21, and the lower screw rod 21 is threadedly connected to the lower nut 22. The guide groove 17 passes through the lifting bracket 1 and is fixedly connected to the lower nut 22. The lower motor 20 is connected to the lower nut 22 through the lower screw rod 21, so that the guide groove 17 moves up and down at the lower end of the lifting bracket 1, which can ensure the lifting of the lower mounting frame 3. Due to the existence of the guide groove 17, the lower mounting frame 3 drives the copper plate 8 to adjust the front and rear position.

[0028] A vertical guide rail 18 is fixed on the lifting bracket 1, and a vertical slider 19 is connected to the upper mounting frame 2 and the guide groove 17. The vertical slider 19 slides on the vertical guide rail 18 along the vertical direction. Both the upper linear module and the lower linear module are guided by the vertical guide rail 18 to make the gold wire table 4 and the lower copper seat 5 move vertically.

[0029] The upper linear module includes an upper motor 23, an upper screw and an upper nut 24. The upper motor 23 is connected to the lower end of the upper screw, and the upper screw is threadedly connected to the upper nut 24. The upper mounting frame 2 passes through the lifting bracket 1 and is fixedly connected to the upper nut 24. The upper motor 23 is connected to the upper screw and the upper nut 24 through the connection between the upper screw and the upper nut 24, so that the upper mounting frame 2 can move up and down along the lifting bracket 1, driving the gold wire stage 4 to contact the 0BB silicon wafer.

[0030] It should be stated that the above-mentioned specific implementation methods are only preferred embodiments of the present invention and the technical principles used. Within the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by technicians familiar with this technical field should be included in the protection scope of the present invention.

Claims

1. A 0BB ​​detection mechanism for busbar-free, characterized in that: It includes a lifting bracket, an upper mounting frame, a lower mounting frame, a gold wire platform and a lower copper seat. An upper linear module and a lower linear module are installed on the lifting bracket. The upper linear module is connected to the side of the upper mounting frame. The gold wire platform is adjusted forward and backward along the upper mounting frame. Both sides of the gold wire platform are provided with tension springs. Gold wires are straightened between the tension springs. The outer side of the lower mounting frame is adjusted along the forward and backward direction on the driving end of the lower linear module. The lower copper seat is located in the middle of the lower mounting frame. Copper plates are arranged and placed in the middle of the lower copper seat. The upper ends of the copper plates are in an arc shape that is bent upward.

2. The 0BB detection mechanism for busbar-free according to claim 1, characterized in that: An upper frame opening is arranged in the middle of the upper mounting frame, the gold wire platform moves in the upper frame opening, a circuit board is installed on the side of the upper frame opening, the circuit board is conductively connected to the end of the gold wire, and a first wire is connected to the outer side of the circuit board.

3. The 0BB detection mechanism for busbar-free according to claim 1, characterized in that: A guide light axis is arranged on the upper mounting frame along the front-rear direction, and a guide sliding block is connected to the side of the gold wire stage, and the guide sliding block slides on the guide light axis.

4. The 0BB detection mechanism for busbar-free according to claim 1, characterized in that: A lower frame opening is provided in the middle of the lower mounting frame, mounting grooves and pressure strips are provided on both sides of the lower frame opening, the outer side of the copper plate is locked in the mounting groove, the pressure strip is pressed on the outer side of the copper plate, and second wires are connected to both sides of the copper plate.

5. The 0BB detection mechanism for busbar-free according to claim 1, characterized in that: A guide groove is connected to the driving end of the lower linear module, and the side position of the lower mounting frame is adjusted in the guide groove.

6. The 0BB detection mechanism for busbar-free according to claim 5, characterized in that: A vertical guide rail is fixed on the lifting bracket, and a vertical slider is connected to the upper mounting frame and the guide groove. The vertical slider slides on the vertical guide rail along a vertical direction.

7. The 0BB detection mechanism for busbar-free according to claim 5, characterized in that: The lower linear module includes a lower motor, a lower screw rod and a lower nut. The lower motor is connected to the upper end of the lower screw rod. The lower screw rod is threadedly connected to the lower nut. The guide groove passes through the lifting bracket and is fixedly connected to the lower nut.

8. The 0BB detection mechanism for busbar-free according to claim 1, characterized in that: The upper linear module includes an upper motor, an upper screw rod and an upper nut. The upper motor is connected to the lower end of the upper screw rod. The upper screw rod is threadedly connected to the upper nut. The upper mounting frame passes through the lifting bracket and is fixedly connected to the upper nut.

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