Optimization method for Mini LED printed circuit board with ultrahigh reflectivity
By matching the regional division and heat distribution of the high -high reflective MINI LED printed circuit board, set the deployment rules to deal with the heat concentration phenomenon, solve the problem of hardware damage and safety hazards caused by calories in the printed process. High -efficiency and safe printing process.
Patent Information
- Application Number
- CN202411580221.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-07
- Publication Date
- 2025-01-21
AI Technical Summary
Ultra-high reflectivity Mini LED printed circuit boards are prone to heat concentration during printing, resulting in irreversible hardware damage and safety hazards in the printing environment.
Through the regional division of the MINI LED printed circuit board, detect hardware density and heat distribution, match the calorie concentration position and high density area, set the deployment rules to select a reflectance switching alarm or power off.
Effectively reduce hidden dangers of the printed environment, prevent hardware damage, and improve the printed efficiency and the reliability of the circuit board.
Smart Images
Figure CN119338259A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of monitoring and adjustment technology, and more specifically, to an optimization method for an ultra-high reflectivity Mini LED printed circuit board. Background Art
[0002] Monitoring and dispatching technology is a technology used for real-time monitoring and intelligent dispatching of resources, equipment or personnel. Monitoring and dispatching technology applied to printed circuit boards can detect circuit anomalies in real time and handle anomalies, thereby improving circuit board printing efficiency and ensuring the safety of the circuit board printing environment.
[0003] The prior art has the following deficiencies: With the improvement of printing technology, most Mini LED circuit boards have abandoned the previous ordinary reflectivity and chosen ultra-high reflectivity to improve the efficiency of light utilization. However, while ultra-high reflectivity improves the efficiency of light utilization, it also increases the risk of heat concentration. When heat concentration occurs during the printing process of the Mini LED circuit board, it will cause irreversible damage to the hardware in the circuit board and also pose a safety hazard to the printing environment. Summary of the invention
[0004] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides an optimization method for an ultra-high reflectivity MiniLED printed circuit board. By dividing the interior of the circuit board into areas and screening out hardware-intensive areas, the heat concentration locations are detected in real time for area matching and allocation rules are set, and corresponding responses are provided according to multiple scenarios to solve the problems raised in the above-mentioned background technology.
[0005] To achieve the above object, the present invention provides the following technical solutions: An optimization method for an ultra-high reflectivity Mini LED printed circuit board comprises the following steps: Step S1: obtaining the area of the Mini LED printed circuit board and the areas of various hardware inside the Mini LED printed circuit board, setting the area of regional division according to the area of the Mini LED printed circuit board and the areas of various hardware, and dividing and adjusting the Mini LED printed circuit board according to the area of regional division; Step S2: After the detection area is divided, the total hardware area and the shortest hardware spacing in each area of the Mini LED printed circuit board are analyzed, and the hardware density of the area is analyzed by fuzzy reasoning according to the total hardware area and the shortest hardware spacing in each area, and the high-density area is screened out; Step S3: Detect the heat distribution of the Mini LED printed circuit board and lock the heat concentration position, match the heat concentration position with the high-density area, and obtain the hardware material information in the matching area when the match is successful; Step S4: Setting a deployment rule according to the hardware material information in the matching area, detecting the real-time heat of the matching area and selecting to issue a reflectivity switching alarm or perform a power-off process according to the deployment rule.
[0006] In a preferred embodiment, in step S1, when setting the area of the regional division, the hardware with the largest area among the hardware areas is selected inside the Mini LED printed circuit board, and its area is used as the maximum hardware area. The integer quotient obtained by dividing the area of the Mini LED printed circuit board by the maximum hardware area is used as the regional division ratio, and the remainder area is discarded to compare the Mini LED printed circuit board area with the quotient to obtain the regional division area.
[0007] In a preferred embodiment, in step S1, the specific steps of dividing the Mini LED printed circuit board into regions and adjusting the regions according to the region division areas are as follows: First, divide the Mini LED printed circuit board equally according to the area division, then select the areas where the same hardware appears in the adjacent areas, determine the area size of the same hardware in the area and the adjacent areas, expand the area with large hardware area to the adjacent area, and reduce the area of the corresponding adjacent area accordingly.
[0008] In a preferred embodiment, in step S2, the hardware areas in each area are summed to obtain the total hardware area of the corresponding area, and the shortest hardware spacing is detected to calculate the shortest distance in the area and the shortest distance outside the area. Before determining the shortest hardware spacing, the spacing of each hardware is determined according to the edge pixel points of each hardware, and the shortest distance in the area and the shortest distance outside the area are calculated. The specific rules are as follows: Rule 1: When two hardware are in the same area, the distance between the closest pixel points on the edge of the two hardware is taken as the shortest distance between the two hardware; Rule 2: Count the shortest distances of different hardware in the same area and compare them, and select the minimum value as the shortest distance in the area; Rule 3: For adjacent regions, the distance between the closest pixels in the hardware edge pixels of the two regions is taken as the shortest distance between the two regions; Rule 4: Count the shortest distances between a region and all surrounding adjacent regions, and select the minimum value as the shortest distance outside the corresponding region.
[0009] In a preferred embodiment, in step S2, fuzzy reasoning is used to analyze the hardware density of the region and the high-density region is screened out. The specific steps are as follows: Define input and output: define the total hardware of the region, the shortest distance within the region, and the shortest distance outside the region as input variables, and define the regional hardware density as the output variable; Determine input status: compare each input with the preset threshold of the corresponding input to determine the input status; Set fuzzy rules: formulate a set of fuzzy rules to describe the degree of influence of different input variables on output variables; Determine the regional hardware density: when the output variable shows that the regional hardware density is high, the corresponding area is marked as a high-density area; when the output variable shows that the regional hardware density is low, the corresponding area is marked as a low-density area.
[0010] In a preferred embodiment, in step S3, an infrared thermal imaging system is used to detect each area of the Mini LED printed circuit board, detect the heat distribution of the Mini LED printed circuit board, take the average temperature in each area as the regional heat, calculate and obtain the regional heat in each area, and take the area with the largest regional heat as the heat concentration location.
[0011] In a preferred embodiment, in step S3, the hardware material information includes the thermal damage definition of the hardware and the high temperature operation time. The thermal damage definition of the hardware is the critical temperature value of the hardware being damaged by heat. The high temperature operation time is obtained by performing a temperature test on each hardware inside the Mini LED printed circuit board. The specific steps are as follows: The minimum value of the hardware damage limit of each hardware inside the Mini LED printed circuit board is selected as the temperature condition, and each hardware is connected to the data acquisition system to monitor the performance of each hardware in real time. The time point when the test starts and the time point when the performance of each hardware drops sharply are recorded, and the difference between the two time points is used to obtain the high-temperature operation time of each hardware.
[0012] In a preferred embodiment, in step S4, a data acquisition system is used to monitor the regional heat of the matching area in real time, and the thermal damage boundaries of each hardware in the matching area are compared. The minimum thermal damage boundary is used as the regional thermal damage boundary of the matching area. At the same time, the high-temperature operation time of each hardware in the matching area is compared, and the minimum high-temperature operation time is used as the regional high-temperature duration boundary.
[0013] In a preferred embodiment, in step S4, when the regional heat of the matching area exceeds the regional heat damage limit, the heat dissipation function is turned on, and the allocation rules are set according to the regional heat damage limit and the regional high temperature duration limit. The specific steps are as follows: If the regional heat of the matching area drops below the regional heat damage limit during the regional high temperature duration, the heat dissipation function is turned off; If the regional heat of the matching area drops below the regional heat damage limit after the regional high temperature duration, the heat dissipation function will be continuously turned on; If the regional temperature tends to be stable and exceeds the regional thermal damage limit during the regional high temperature duration, a reflectivity switching alarm will be immediately issued; If the regional high temperature duration exceeds the duration and the regional stability has not stabilized and exceeds the regional thermal damage limit, power off immediately.
[0014] The technical effects and advantages of the optimization method for ultra-high reflectivity Mini LED printed circuit board of the present invention are as follows: The present invention partitions the Mini LED printed circuit board, detects the hardware in each area of the circuit board, obtains the area and spacing of the hardware inside the circuit board, analyzes the hardware density of each area according to the internal hardware area and spacing, screens out high-density areas according to the hardware density, and accurately determines the direction of subsequent analysis by dividing and screening the areas, and also reduces the cost of heat dissipation response. The heat distribution is detected to lock the heat concentration position, and it is determined whether the heat concentration position matches the high-density area. By matching the screened high-density area with the heat concentration position, the damage effect of the heat concentration position can be determined. If the match is successful, the information of each hardware material in the matching area of the heat concentration position is obtained. Finally, the deployment rules are set according to the detected heat and the information of each hardware material in the matching area, and the reflectivity switching alarm or power-off processing is selected according to the deployment rules, thereby reducing the safety hazards of the printing environment. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is a schematic diagram of an optimization method for an ultra-high reflectivity Mini LED printed circuit board according to the present invention. DETAILED DESCRIPTION
[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0017] The present invention partitions the Mini LED printed circuit board, detects the hardware in each area of the circuit board, obtains the area and spacing of the hardware inside the circuit board, analyzes the hardware density of each area according to the internal hardware area and spacing, screens out high-density areas according to the hardware density, detects heat distribution and locks the heat concentration position, determines whether the heat concentration position matches the high-density area, and if the match is successful, obtains the hardware material information in the matching area of the heat concentration position, and finally sets the deployment rules according to the detected heat and the hardware material information in the matching area, and selects to perform a reflectivity switching alarm or a power-off process according to the deployment rules.
[0018] Embodiment, an optimization method for ultra-high reflectivity Mini LED printed circuit board, such as Figure 1 As shown, the following steps are included: Step S1: obtaining the area of the Mini LED printed circuit board and the areas of various hardware inside the Mini LED printed circuit board, setting the area of regional division according to the area of the Mini LED printed circuit board and the areas of various hardware, and dividing and adjusting the Mini LED printed circuit board according to the area of regional division; Step S2: After the detection area is divided, the total hardware area and the shortest hardware spacing in each area of the Mini LED printed circuit board are analyzed, and the hardware density of the area is analyzed by fuzzy reasoning according to the total hardware area and the shortest hardware spacing in each area, and the high-density area is screened out; Step S3: Detect the heat distribution of the Mini LED printed circuit board and lock the heat concentration position, match the heat concentration position with the high-density area, and obtain the hardware material information in the matching area when the match is successful; Step S4: Setting a deployment rule according to the hardware material information in the matching area, detecting the real-time heat of the matching area and selecting to issue a reflectivity switching alarm or perform a power-off process according to the deployment rule.
[0019] The specific implementation is as follows: In step S1, the internal hardware and wire layout of the Mini LED printed circuit board are first checked by connecting the Mini LED printed circuit board drawing to the PCB design software to ensure that the wire layout and internal hardware are correct. After the inspection is completed, the internal hardware of the Mini LED printed circuit board is compared with the component information in the PCB design software to determine the internal hardware model, and the area of the Mini LED printed circuit board and the hardware area of each hardware are obtained.
[0020] The Mini LED printed circuit board is divided into regions according to the hardware area of each hardware and the area of the Mini LED printed circuit board. After determining the area of each hardware, the maximum hardware area is selected, that is, the hardware with the largest area among the hardware areas is selected, and its area is used as the maximum hardware area. The quotient obtained by dividing the area of the Mini LED printed circuit board by the maximum hardware area is used as the regional division ratio, that is, after calculating and obtaining the quotient, the area of the Mini LED printed circuit board is compared with the quotient to obtain the regional division area. This can ensure that the regional division area is larger than the maximum hardware area, and avoid being divided into multiple regions due to excessive hardware area. After determining the regional division area, the Mini LED printed circuit board is divided into regions. First, the Mini LED printed circuit board is preliminarily divided into regions according to the regional division area, and the Mini The LED printed circuit board is divided equally, and then the area where the same hardware appears in the adjacent areas is selected, and the area size of the same hardware in the area and the adjacent area is determined. The area and adjacent areas are adjusted according to the area size, and the area with large hardware area is expanded to the adjacent area, and the area of the corresponding adjacent area is reduced accordingly, once again ensuring that the same hardware exists in only one area. It needs to be explained that the area of the regional division is calculated based on the maximum hardware area first, which can reduce the situation where the same hardware appears in a large number of areas while ensuring the accuracy of the division.
[0021] It should be noted that PCB design software is a tool used to design and layout printed circuit boards and make auxiliary decisions. PCB design software can identify the various hardware models inside the Mini LED printed circuit board and obtain the area of the Mini LED printed circuit board and the hardware area of each hardware.
[0022] In step S2, the hardware area in each area is detected, and the hardware area in each area is summed to obtain the total hardware area of the corresponding area. When obtaining the hardware spacing of each area of the Mini LED printed circuit board, only the shortest spacing of the hardware is obtained. The shorter the shortest spacing between devices in the areas, the more likely heat diffusion will occur, causing greater safety hazards.
[0023] Before determining the shortest distance between hardware, the edge of each hardware is dotted, that is, divided into pixels of equal size and then the distance between each hardware is determined. The specific rules are as follows: Rule 1: When two hardware devices are in the same area, the distance between the closest pixel points on the edge of the two hardware devices is taken as the shortest distance between the two hardware devices.
[0024] Rule 2: Count the shortest distances of different hardware in the same area and compare them, and select the minimum value as the shortest distance in the area.
[0025] Rule 3: For adjacent regions, the distance between the closest pixels in the hardware edge pixels of the two regions is taken as the shortest distance between the two regions.
[0026] Rule 4: Count the shortest distances between a region and all surrounding adjacent regions, and select the minimum value as the shortest distance outside the corresponding region.
[0027] It should be explained that all surrounding adjacent areas are not only adjacent areas of the corresponding area in the four directions, but also include the intermediate areas of the four directions, because the shortest distance outside the area may also appear between the corresponding area and the intermediate area.
[0028] After obtaining the shortest distance within the area and the shortest distance outside the area according to the above rules, the sum of the hardware area of the area, the shortest distance within the area, and the shortest distance outside the area are defined as input variables. The hardware density of the area is analyzed through fuzzy reasoning and high-density areas are screened out. The specific steps are as follows: Define input and output: define the total hardware of the area, the shortest distance within the area, and the shortest distance outside the area as input variables, and define the hardware density of the area as the output variable.
[0029] Determine the input state: compare each input with the preset threshold of the corresponding input to determine the input state. For example, set the sum of the hardware areas of the area to the average sum of the hardware areas of all areas of the Mini LED printed circuit board. When the sum of the hardware areas of the area exceeds the threshold, it is calibrated as "High", otherwise it is calibrated as "Low"; set the thresholds of the shortest distance in the area and the shortest distance outside the area to the average value of the shortest distance in the area and the average value of the shortest distance outside the area respectively. When the shortest distance in the area or the shortest distance outside the area exceeds the corresponding threshold, it is calibrated as "Long", otherwise it is calibrated as "Short".
[0030] Set fuzzy rules: formulate a set of fuzzy rules to describe the influence of different input variables on output variables. For example, mark the total hardware area of the region as S, the shortest distance in the region as N, the shortest distance outside the region as W, and the hardware density of the region as M, then it can be defined as: Rule 1: IF (S is High) AND (N is Short) AND (W is Short)THEN (M isBig) Rule 2: IF (S is Low) AND (N is Long) AND (W is Long)THEN (M isSmall) ... Determine the regional hardware density: when the output variable is "Big", the higher the regional hardware density is, the corresponding area is marked as a high-density area; when the output variable is "Small", the lower the regional hardware density is, the corresponding area is marked as a low-density area.
[0031] Screen out high-density areas for follow-up analysis. In the high-density area of the Mini LED printed circuit board, the hardware inside the area is more concentrated or the hardware area is larger. When the heat concentration is in the high-density area, it will cause greater harm.
[0032] It should be noted that the thresholds and fuzzy rules of each input variable in this example can be set according to the accuracy requirements. The above steps are only examples. By setting multiple layers of thresholds, the input variables can be classified into multiple fuzzy sets such as "High", "Middle", and "Low", which will not be elaborated here.
[0033] In step S3, after the Mini LED printed circuit board is assembled with ultra-high reflectivity materials, an infrared thermal imaging system is used to detect each area of the Mini LED printed circuit board during operation to detect the heat distribution of the Mini LED printed circuit board, and the average temperature in each area is used as the regional heat.
[0034] It needs to be explained that although different hardware inside the Mini LED printed circuit board generates different amounts of heat when running, there will be more regional heat in some hardware areas that generate more heat, but the heat concentration on the circuit board assembled with ultra-high reflectivity materials is caused by the concentration of light energy in the direct direction of sunlight or at the focusing point. The heat caused by this concentration of light energy is much greater than the heat generated when the hardware is running, so it is easy to judge and the heat generated when the hardware is running can be ignored.
[0035] After calculating and obtaining the regional heat in each area, the area with the largest regional heat is taken as the heat concentration position, and the area where the heat concentration position is located is taken as the matching area to be matched with the regional mark of the corresponding position. When the matching area mark is a high-density area, the information of each hardware material in the matching area is obtained.
[0036] Hardware material information includes the definition of hardware thermal damage and high-temperature operation time. The definition of hardware thermal damage is the critical temperature value of hardware thermal damage, which can be obtained by accessing the material database in the PCB design software. The high-temperature operation time requires temperature testing of each hardware inside the Mini LED printed circuit board. The specific steps are as follows: Before conducting the temperature test, ensure that the connections of each hardware and wire are consistent with the internal conditions of the Mini LED printed circuit board, select the minimum value of the hardware damage limit of each hardware inside the Mini LED printed circuit board as the temperature condition, connect each hardware to the data acquisition system to monitor the performance of each hardware in real time, record the time point when the test starts and the time point when the performance of each hardware drops sharply, and subtract the two time points to obtain the high-temperature operation time of each hardware.
[0037] It should be noted that the infrared thermal imaging system is a device that uses infrared radiation technology to measure and visualize the temperature distribution of objects. It belongs to the data acquisition system. The data acquisition system is a system that obtains the physical parameters and data of the monitoring equipment or system in real time. The regional heat of the internal divided areas of the Mini LED printed circuit board can be monitored in real time by connecting to the data acquisition system. Some hardware has a high thermal damage limit, but under high temperature, the performance will drop sharply in a short period of time, affecting the normal operation of the internal system of the circuit board. Therefore, the high temperature operation time is also used as one of the factors in setting the allocation rules.
[0038] In step S4, the data acquisition system is used to monitor the regional heat of the matching area in real time, and the thermal damage boundaries of each hardware in the matching area are compared. The minimum thermal damage boundary is used as the regional thermal damage boundary of the matching area. Similarly, the high-temperature operation time of each hardware in the matching area is compared, and the minimum high-temperature operation time is used as the regional high-temperature duration boundary.
[0039] The specific steps for setting the deployment rules according to the definition of regional heat damage and the definition of regional high temperature duration are as follows: Condition A: When the Mini LED printed circuit board is in operation, the regional heat of the matching area exceeds the regional thermal damage limit, the heat dissipation function is turned on, and after the regional temperature stabilizes after cooling, the regional temperature is lower than the regional thermal damage limit and the following rules are followed accordingly; Rule A1: When the heat dissipation function is turned on, if the regional heat of the matching area drops below the regional heat damage limit during the regional high temperature duration, the heat dissipation function is turned off.
[0040] Rule A2: When the heat dissipation function is turned on, if the regional heat of the area that exceeds the regional high temperature duration matching area drops below the regional thermal damage limit, the heat dissipation function will continue to be turned on.
[0041] Condition B: When the Mini LED printed circuit board is in operation, the regional heat of the matching area exceeds the regional thermal damage limit, the heat dissipation function is turned on, and after the regional temperature stabilizes after cooling, the regional temperature exceeds the regional thermal damage limit and responds according to the following rules; Rule B1: When the heat dissipation function is turned on, if the regional temperature tends to be stable and exceeds the regional thermal damage limit during the regional high temperature duration, a reflectivity switching alarm is immediately issued.
[0042] Rule B1: When the heat dissipation function is turned on, if the regional high temperature duration exceeds the regional stability and the regional thermal damage limit is exceeded, the power will be cut off immediately.
[0043] It should be noted that in the above steps, the regional heat of the matching area is the average temperature in each area, which is detected and calculated by the infrared thermal imaging system included in the data acquisition system. By detecting and analyzing the heat concentration phenomenon and making different responses, the safety risks of the printing environment are reduced and auxiliary analysis data is provided for relevant personnel.
[0044] The above embodiments may be implemented in whole or in part by software, hardware, firmware or any other combination. When implemented by software, the above embodiments may be implemented in whole or in part in the form of a computer program product.
[0045] Those of ordinary skill in the art will appreciate that the modules and algorithm steps of each example described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are performed in hardware or software depends on the specific application of the technical solution and the invention constraints. Professional and technical personnel can use different methods to implement the described functions for each specific application, but such implementation should not be considered to be beyond the scope of this application.
[0046] In addition, each functional module in each embodiment of the present application may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.
[0047] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.
[0048] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. An optimization method for ultra-high reflectivity Mini LED printed circuit board, characterized in that: The following steps are included: Step S1: obtaining the area of the Mini LED printed circuit board and the areas of various hardware inside the Mini LED printed circuit board, setting the area of regional division according to the area of the Mini LED printed circuit board and the areas of various hardware, and dividing and adjusting the Mini LED printed circuit board according to the area of regional division; Step S2: After the detection area is divided, the total hardware area and the shortest hardware spacing in each area of the Mini LED printed circuit board are analyzed, and the hardware density of the area is analyzed by fuzzy reasoning according to the total hardware area and the shortest hardware spacing in each area, and the high-density area is screened out; Step S3: Detect the heat distribution of the Mini LED printed circuit board and lock the heat concentration position, match the heat concentration position with the high-density area, and obtain the hardware material information in the matching area when the match is successful; Step S4: Setting a deployment rule according to the hardware material information in the matching area, detecting the real-time heat of the matching area and selecting to issue a reflectivity switching alarm or perform a power-off process according to the deployment rule.
2. The optimization method for an ultra-high reflectivity Mini LED printed circuit board according to claim 1, characterized in that: In step S1, when setting the area of the regional division, the hardware with the largest area among the hardware areas is selected inside the Mini LED printed circuit board, and its area is used as the maximum hardware area. The integer quotient obtained by dividing the area of the Mini LED printed circuit board by the maximum hardware area is used as the regional division ratio, and the remainder area is discarded to compare the area of the Mini LED printed circuit board with the quotient to obtain the regional division area.
3. The optimization method for ultra-high reflectivity Mini LED printed circuit board according to claim 1, characterized in that: In step S1, the Mini LED printed circuit board is divided and adjusted according to the area of the division. The specific steps are as follows: First, divide the Mini LED printed circuit board equally according to the area division, then select the areas where the same hardware appears in the adjacent areas, determine the area size of the same hardware in the area and the adjacent areas, expand the area with large hardware area to the adjacent area, and reduce the area of the corresponding adjacent area accordingly.
4. The optimization method for an ultra-high reflectivity Mini LED printed circuit board according to claim 1, characterized in that: In step S2, the hardware areas in each area are summed to obtain the total hardware area of the corresponding area. The shortest hardware spacing is detected to calculate the shortest distance in the area and the shortest distance outside the area. Before determining the shortest hardware spacing, the spacing of each hardware is determined according to the edge pixel points of each hardware and the shortest distance in the area and the shortest distance outside the area are calculated. The specific rules are as follows: Rule 1: When two hardware are in the same area, the distance between the closest pixel points on the edge of the two hardware is taken as the shortest distance between the two hardware; Rule 2: Count the shortest distances of different hardware in the same area and compare them, and select the minimum value as the shortest distance in the area; Rule 3: For adjacent regions, the distance between the closest pixels in the hardware edge pixels of the two regions is taken as the shortest distance between the two regions; Rule 4: Count the shortest distances between a region and all surrounding adjacent regions, and select the minimum value as the shortest distance outside the corresponding region.
5. The optimization method for ultra-high reflectivity Mini LED printed circuit board according to claim 4, characterized in that: In step S2, fuzzy reasoning is used to analyze the hardware density of the area and screen out the high-density area. The specific steps are as follows: Define input and output: define the total hardware of the region, the shortest distance within the region, and the shortest distance outside the region as input variables, and define the regional hardware density as the output variable; Determine input status: compare each input with the preset threshold of the corresponding input to determine the input status; Set fuzzy rules: formulate a set of fuzzy rules to describe the degree of influence of different input variables on output variables; Determine the regional hardware density: when the output variable shows that the regional hardware density is high, the corresponding area is marked as a high-density area; when the output variable shows that the regional hardware density is low, the corresponding area is marked as a low-density area.
6. The optimization method for an ultra-high reflectivity Mini LED printed circuit board according to claim 1, characterized in that: In step S3, each area of the Mini LED printed circuit board is detected by using an infrared thermal imaging system to detect the heat distribution of the Mini LED printed circuit board, and the average temperature in each area is used as the regional heat. After calculating and obtaining the regional heat in each area, the area with the largest regional heat is used as the heat concentration position; The infrared thermal imaging system is a device that uses infrared radiation technology to measure and visualize the temperature distribution of objects. It is used to inspect various areas of Mini LED printed circuit boards.
7. The optimization method for ultra-high reflectivity Mini LED printed circuit board according to claim 1, characterized in that: In step S3, the hardware material information includes the thermal damage definition of the hardware and the high temperature operation time. The thermal damage definition of the hardware is the critical temperature value of the hardware being damaged by heat. The high temperature operation time is obtained by performing temperature tests on the hardware inside the Mini LED printed circuit board. The specific steps are as follows: Select the minimum value of hardware damage definition of each hardware inside the Mini LED printed circuit board as the temperature condition, connect each hardware to the data acquisition system to monitor the performance of each hardware in real time, record the time point of starting the test and the time point when the performance of each hardware drops sharply, and subtract the two time points to obtain the high-temperature operation time of each hardware; A data acquisition system is a system that acquires the physical parameters and data of a monitoring device or system in real time.
8. The optimization method for ultra-high reflectivity Mini LED printed circuit board according to claim 7, characterized in that: In step S4, the data acquisition system is used to monitor the regional heat of the matching area in real time, and the thermal damage boundaries of each hardware in the matching area are compared. The minimum thermal damage boundary is used as the regional thermal damage boundary of the matching area. At the same time, the high-temperature operation time of each hardware in the matching area is compared, and the minimum high-temperature operation time is used as the regional high-temperature duration boundary.
9. The optimization method for ultra-high reflectivity Mini LED printed circuit board according to claim 8, characterized in that: In step S4, when the regional heat of the matching area exceeds the regional heat damage limit, the heat dissipation function is turned on, and the allocation rules are set according to the regional heat damage limit and the regional high temperature duration limit. The specific steps are as follows: If the regional heat of the matching area drops below the regional heat damage limit during the regional high temperature duration, the heat dissipation function is turned off; If the regional heat of the matching area drops below the regional heat damage limit after the regional high temperature duration, the heat dissipation function will be continuously turned on; If the regional temperature tends to be stable and exceeds the regional thermal damage limit during the regional high temperature duration, a reflectivity switching alarm will be immediately issued; If the regional high temperature duration exceeds the limit and the regional stability has not stabilized and exceeds the regional thermal damage limit, power off immediately.