Intelligent control heat dissipation support of forced cooling water channel structure

Abstract

The invention discloses an intelligent control heat dissipation support of a forced cooling water channel structure, which comprises a shell, a contact plate, a supporting block and a back plate of the heat dissipation support, a water channel is arranged between the shell and the contact plate, through holes are formed in two ends of the water channel, interfaces are arranged at the through holes, water pumps are arranged at the interfaces, and the water pumps are connected with the interfaces through guide pipes. A channel of the water pump and the water channel is filled with liquid, the water channel is provided with a temperature conducting piece arranged along a water channel route, the temperature conducting piece is embedded in the bottom face of the contact plate and immersed in the liquid, the temperature conducting piece penetrates through the contact plate and is flatly laid on the upper surface of the contact plate, one end of the temperature conducting piece makes contact with a heat source, the other end of the temperature conducting piece makes contact with the liquid, and the heat dissipation speed of the heat source is increased. The whole temperature conducting piece considers the efficiency of heat conduction and heat exchange, and also considers the flow characteristics of fluid and the stability of the system. Through reasonable structural design and fine parameter optimization, the temperature conducting piece can reduce flow resistance and energy consumption while guaranteeing efficient heat dissipation, and the overall performance of the system is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of water channel structures, and in particular to an intelligently controlled heat dissipation bracket with a strong cooling water channel structure. Background Art

[0002] Under the current technical background, as the performance of smartphones and tablets continues to improve, the heat generated by their internal processors, batteries and other components during operation is also increasing. Long-term high-temperature operation will not only affect the performance of the device, but may also shorten the service life of the device and even cause safety hazards. Therefore, how to effectively dissipate heat has become an urgent problem to be solved during the use of mobile devices.

[0003] Traditional heat dissipation methods, such as heat sinks and fans, can reduce device temperature to a certain extent, but they often have problems such as low heat dissipation efficiency and inconvenience. Especially when using mobile devices, users often need to adjust the position and angle of the device to meet different usage requirements, and traditional heat dissipation devices often cannot meet this requirement or cause inconvenience during use.

[0004] In addition, with the continuous development of intelligent technology, users have higher and higher demands for intelligent auxiliary accessories of mobile devices. Most intelligent heat dissipation brackets ignore the passive heat dissipation efficiency of the body, thus failing to achieve the optimal heat dissipation effect. Summary of the invention

[0005] In order to overcome the deficiencies of the prior art solutions, the present invention provides an intelligent control heat dissipation bracket with a strong cooling water channel structure, which can effectively solve the problem of low heat dissipation efficiency of ordinary water channels mentioned in the background art.

[0006] The technical solution adopted by the present invention to solve its technical problems is: an intelligent control heat dissipation bracket with a strong cooling water channel structure, comprising a shell, a contact plate, a support block and a back plate of the heat dissipation bracket, a water channel is arranged between the shell and the contact plate, through holes are opened at both ends of the water channel, interfaces are arranged at the through holes, a water pump is arranged at the interface, the water pump and the interface are connected through a conduit, the passages of the water pump and the water channel are filled with liquid, the water channel is provided with a temperature conducting member arranged along the water channel line, the temperature conducting member is embedded in the bottom surface of the contact plate and immersed in the liquid, the temperature conducting member penetrates the contact plate and is laid flat on the upper surface of the contact plate, one end of the temperature conducting member contacts the heat source and the other end contacts the liquid, so as to improve the heat dissipation speed of the heat source; The heat conducting member is provided with a plurality of C-shaped grooves, and a flow guide block for causing the flowing liquid to generate eddies is provided in the C-shaped grooves. The C-shaped grooves increase the contact area with the liquid, and the openings of the C-shaped grooves prevent the formation of independent channels that affect the flow rate; The surface of the C-shaped groove is also provided with a plurality of microchannels, so that the flow of the liquid in the channel is more uniform and the contact area between the liquid and the water channel wall is increased.

[0007] Furthermore, the contact plate is a detachable structure, and the cross section of the thermal conductive member can be changed by replacing different contact plates, so that the thermal conductivity of the water channel can be controlled without adjusting the liquid flow rate.

[0008] Furthermore, the guide block and the C-shaped groove are an integrally formed structure.

[0009] Furthermore, the microchannels are arranged in a mesh or parallel pattern on the surface of the C-shaped groove, ensuring that the liquid can fully flow through each area to achieve comprehensive heat exchange.

[0010] Furthermore, microchannels are precisely etched on the surface of the temperature conducting member by chemical vapor deposition.

[0011] Furthermore, a cooling fin arranged on the back of the water channel and a fan arranged on the hot end of the cooling fin are installed inside the shell; and the back plate is provided with a heat dissipation hole penetrating the back plate arranged directly above the fan.

[0012] Furthermore, the housing is also provided with a control module and a battery for monitoring the status of the equipment and controlling the operation of the components, and a window for conveniently observing the operation status of the equipment is provided on the back panel above the battery.

[0013] Furthermore, the thermal conductive component is made of a material with high thermal conductivity and corrosion resistance, such as a titanium alloy or a nickel-based alloy, so as to improve the durability and corrosion resistance of the thermal conductive component while maintaining high thermal conductivity.

[0014] Furthermore, a pressure sensor and a temperature sensor are also provided in the water channel for real-time monitoring of the liquid pressure and temperature in the water channel to ensure that the system operates within a safe and efficient range, and the working state of the water pump can be dynamically adjusted according to the monitoring data.

[0015] Furthermore, a heat-conducting adhesive layer is provided between the contact plate and the heat-conducting member to improve the heat conduction efficiency between the contact plate and the heat-conducting member, while ensuring a close fit between the two to prevent heat leakage.

[0016] Furthermore, the refrigeration plate adopts semiconductor refrigeration technology, which can efficiently transfer heat from the back of the water channel to the fan, and dissipate heat through forced convection of the fan, thereby achieving rapid cooling and improving heat dissipation efficiency.

[0017] Furthermore, the control module is integrated with an intelligent algorithm, which can automatically adjust the working status of the water pump, cooling plate and fan according to the equipment operation status and ambient temperature, realize intelligent heat dissipation management, improve energy efficiency and reduce energy consumption.

[0018] Furthermore, the heat dissipation bracket is also equipped with a remote monitoring and control system, which is connected to devices such as smart phones or computers through a wireless network to realize functions such as remote monitoring of equipment operation status, adjustment of heat dissipation parameters and receiving fault alarms, thereby improving the convenience and intelligence level of management.

[0019] Compared with the prior art, the present invention has the following beneficial effects: The C-shaped groove not only increases the contact area between the heat transfer element and the liquid, but also enables the flowing liquid to generate eddies in the groove through its special shape design. The formation of eddies helps to enhance the mixing and disturbance of the liquid, thereby improving the efficiency of heat exchange. In addition, the opening design of the C-shaped groove cleverly prevents the formation of independent channels and avoids uneven distribution of flow rate. This design ensures the uniform flow of liquid in the entire waterway, further improving the heat dissipation effect.

[0020] Multiple microchannels are set on the surface of the C-shaped groove. The presence of microchannels makes the flow of liquid in the channel more uniform, reduces flow resistance, and increases the rate of heat exchange. At the same time, the microchannel also increases the contact area between the liquid and the water channel wall, further enhancing the heat conduction effect.

[0021] The design of the microchannels not only needs to consider their size and shape, but also their distribution and arrangement on the surface of the C-groove. This ensures that heat can be efficiently transferred from the thermal conductor to the liquid and carried away by the flow of the liquid.

[0022] The entire thermal conductor takes into account the efficiency of heat conduction and heat exchange, as well as the flow characteristics of the fluid and the stability of the system. Through reasonable structural design and fine parameter optimization, the thermal conductor can reduce flow resistance and energy consumption while ensuring efficient heat dissipation, thereby improving the overall performance of the system. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a three-dimensional diagram of the structure of the thermal conductive member and the contact plate of the present invention; Figure 2 It is a schematic cross-sectional view of the structure of the temperature conducting member and the contact plate of the present invention; Figure 3 It is a three-dimensional diagram of the C-shaped groove and guide block structure of the present invention; Figure 4 It is a schematic diagram of the microchannel structure of the present invention; Figure 5 It is a structural stereogram of the present invention; Figure 6 The structure of the present invention is schematically shown Figure 1 ; Figure 7 The structure of the present invention is schematically shown Figure 2 .

[0024] Numbers in the figure: 1-shell, 2-contact plate, 3-support block, 5-water channel, 6-through hole, 7-back plate, 8-interface, 9-control module, 10-battery, 11-fan, 12-water pump, 13-refrigeration plate, 14-window, 15-heat dissipation hole, 16-thermal conduction part, 17-C-type groove, 18-guide block. DETAILED DESCRIPTION

[0025] The embodiments of the present disclosure are described in detail below with reference to the accompanying drawings.

[0026] The following describes the embodiments of the present disclosure through specific examples, and those skilled in the art can easily understand other advantages and effects of the present disclosure from the contents disclosed in this specification. Obviously, the described embodiments are only a part of the embodiments of the present disclosure, rather than all of the embodiments. The present disclosure can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present disclosure. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict. Based on the embodiments in the present disclosure, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present disclosure. Example

[0027] like Figure 1-7 As shown, the present invention provides an intelligent control heat dissipation bracket with a strong cooling water channel 5 structure, including a shell 1, a contact plate 2, a support block 3 and a back plate 7 of the heat dissipation bracket, a water channel 5 is arranged between the shell 1 and the contact plate 2, through holes 6 are opened at both ends of the water channel 5, and an interface 8 is arranged at the through hole 6, and a water pump 12 is arranged at the interface 8, and the water pump 12 is connected to the interface 8 through a conduit, and the passages of the water pump 12 and the water channel 5 are filled with liquid, and the water channel 5 is provided with a thermal conductive member 16 arranged along the route of the water channel 5, and the thermal conductive member 16 is embedded in the bottom surface of the contact plate 2 and immersed in the liquid, and the thermal conductive member 16 penetrates the contact plate 2 and is flattened on the upper surface of the contact plate 2, and one end of the thermal conductive member 16 contacts the heat source and the other end contacts the liquid, so as to improve the heat dissipation speed of the heat source; The heat conducting member 16 is provided with a plurality of C-shaped grooves 17, and a guide block 18 is provided in the C-shaped grooves 17 to generate eddies in the flowing liquid. The C-shaped grooves 17 increase the contact area with the liquid, and the openings of the C-shaped grooves 17 prevent the formation of independent channels that affect the flow rate; The surface of the C-shaped groove 17 is also provided with a plurality of microchannels, so that the flow of the liquid in the channel is more uniform and the contact area between the liquid and the wall of the water channel 5 is increased.

[0028] The water channel 5 is disposed between the housing 1 and the contact plate 2, and is connected to the water pump 12 through the through holes 6 and the interface 8 at both ends to form a closed liquid circulation loop. The water channel 5 is filled with a heat dissipation liquid, such as ethylene glycol, water or other low-viscosity, high-specific heat capacity liquid.

[0029] The thermal conductive member 16 is embedded in the bottom surface of the contact plate 2 and immersed in the liquid, penetrates the contact plate 2 and is laid flat on the upper surface of the contact plate 2. The thermal conductive member 16 is made of a material with high thermal conductivity and corrosion resistance (such as titanium alloy or nickel-based alloy) to improve heat conduction efficiency and durability. A plurality of C-shaped grooves 17 and microchannels are arranged on the thermal conductive member 16 to increase the contact area with the liquid and improve the heat dissipation efficiency. The opening design of the C-shaped groove 17 prevents the formation of independent channels that affect the flow rate, while the microchannels make the flow of the liquid in the channel more uniform.

[0030] The C-shaped groove 17 not only increases the contact area between the heat conducting member 16 and the liquid, but also enables the flowing liquid to generate eddies in the groove through its special shape design. The formation of eddies helps to enhance the mixing and disturbance of the liquid, thereby improving the efficiency of heat exchange. In addition, the opening design of the C-shaped groove 17 cleverly prevents the formation of independent channels and avoids uneven distribution of flow rate. This design ensures the uniform flow of liquid in the entire water channel 5, further improving the heat dissipation effect.

[0031] A plurality of microchannels are arranged on the surface of the C-shaped groove 17. The presence of the microchannels makes the flow of the liquid in the channel more uniform, reduces the flow resistance, and improves the rate of heat exchange. At the same time, the microchannels also increase the contact area between the liquid and the wall of the water channel 5, further enhancing the heat conduction effect.

[0032] The design of the microchannels not only needs to consider their size and shape, but also their distribution and arrangement on the surface of the C-shaped groove 17. This ensures that heat can be efficiently transferred from the heat conducting member 16 to the liquid and carried away by the flow of the liquid.

[0033] The entire thermal conductive element 16 takes into account the efficiency of heat conduction and heat exchange, as well as the flow characteristics of the fluid and the stability of the system. Through reasonable structural design and fine parameter optimization, the thermal conductive element 16 can reduce flow resistance and energy consumption while ensuring efficient heat dissipation, thereby improving the overall performance of the system.

[0034] There are interaction forces between the liquid molecules and the molecules of the water channel 5 wall material. When the liquid flows through the microchannel, these intermolecular forces make the liquid molecules adhere more closely to the water channel 5 wall.

[0035] When liquid flows in the microchannel, the surface tension effect of the liquid is enhanced due to the limitation of the channel size, which makes the liquid molecules more inclined to flow along the wall of the water channel 5, thereby increasing the contact area with the wall of the water channel 5.

[0036] The microchannel is small in size, so that the liquid forms a laminar flow in the channel. In the laminar flow state, the interaction between liquid molecules is more frequent and the flow is more orderly. This orderly flow state is conducive to the full contact and energy exchange between the liquid molecules and the molecules of the water channel wall material.

[0037] By combining the heat dissipation of the water channel 5 circulation, the cooling fins 13 and the fan 11, the bracket can quickly and effectively disperse and discharge the heat on the contact plate 2. The antifreeze in the water channel 5 circulates to ensure uniform heat distribution and prevent local overheating; the cooling fins 13 further reduce the temperature of the contact plate 2, and the fan 11 accelerates air flow to help dissipate heat. The three work together to greatly improve the heat dissipation efficiency.

[0038] See also Figure 6 The contact plate 2 is a detachable structure. By replacing different contact plates 2 to change the cross section of the temperature conducting member 16, the heat conduction efficiency of the water channel 5 can be controlled without adjusting the liquid flow rate.

[0039] The contact plate 2 is designed as a detachable structure, so that users can replace the contact plate 2 with different cross-sectional shapes according to actual needs. By replacing the contact plate 2, the cross-sectional shape of the thermal conductive member 16 can be changed, thereby controlling the thermal conductivity of the water channel 5 without adjusting the liquid flow rate.

[0040] See also Figure 3 The guide block 18 and the C-shaped groove 17 are an integrally formed structure.

[0041] The integrally formed design of the guide block 18 and the C-shaped groove 17 makes the flow of the fluid in the C-shaped groove 17 smoother and reduces the flow resistance. The guide block 18 can guide the fluid to form a vortex in the C-shaped groove 17, increasing the contact area between the fluid and the wall of the C-shaped groove 17 and the thermal conductive member 16, thereby improving the heat dissipation efficiency.

[0042] The microchannels are arranged in a mesh or in parallel on the surface of the C-shaped groove 17 to ensure that the liquid can fully flow through each area to achieve comprehensive heat exchange.

[0043] The equivalent diameter of a microchannel is usually in the range of 10 to 1000 μm. This tiny size makes the flow of fluid in the channel faster and more efficient.

[0044] Reticulated arrangement: The microchannels are interwoven in a reticulated manner on the surface of the C-shaped groove 17 to form a complex fluid channel network. This arrangement ensures that the fluid can fully flow and contact in every corner and area of ​​the C-shaped groove 17.

[0045] Parallel arrangement: The microchannels are arranged in parallel lines on the surface of the C-shaped groove 17 to form regular fluid channels. Although this arrangement is relatively simple, it can also ensure uniform distribution and flow of the fluid in the C-shaped groove 17.

[0046] When the fluid is introduced into the C-shaped groove 17, it flows along the path of the microchannel. Due to the small size and arrangement of the microchannel, the fluid will constantly change direction during the flow, thereby ensuring that the fluid can fully flow through every area of ​​the C-shaped groove 17.

[0047] Microchannels arranged in a mesh can form complex fluid flow paths, while microchannels arranged in parallel can form regular fluid flow layers. Both arrangements help improve fluid flow efficiency and heat exchange effects.

[0048] As the fluid flows, it comes into contact with the heat exchange surface in the C-shaped groove 17. Due to the tiny size and arrangement of the microchannels, this contact area is greatly increased.

[0049] When the fluid flows through the heat exchange surface, it absorbs or releases heat, thereby achieving heat exchange. Since the microchannel can ensure that the fluid fully flows through every area of ​​the C-shaped groove 17, it can achieve comprehensive heat exchange.

[0050] Here, microchannels are precisely etched on the surface of the temperature conducting member 16 by chemical vapor deposition.

[0051] Chemical vapor deposition etching steps: 1. Substrate preparation: Select a suitable material of the thermal conductive member 16 as the substrate, and ensure that its surface is clean and flat, and pre-treat the substrate, such as cleaning and deoxidation, to improve the deposition quality and etching effect.

[0052] 2. Design the microchannel pattern: determine the shape, size and arrangement of the microchannel, draw the microchannel pattern using CAD software, and generate a mask for photolithography or electron beam etching.

[0053] 3. Photolithography or electron beam etching, aligning the mask with the substrate, and using electron beam etching technology to form the pattern outline of the microchannel on the surface of the substrate.

[0054] 4. Chemical vapor deposition: Based on the pattern contour formed by electron beam etching, the required material is deposited on the substrate surface using chemical vapor deposition technology. The type, thickness and uniformity of the deposited material can be controlled by adjusting deposition parameters such as temperature, pressure, gas flow, etc.

[0055] 5. Etching to remove excess material: Use chemical etching or physical etching to remove excess material on the substrate surface, leaving only the deposits in the microchannel.

[0056] 6. Post-processing: The etched microchannels are cleaned, deoxidized and other post-processing steps are performed to improve their surface quality and performance.

[0057] See also Figure 7 A cooling fin 13 arranged on the back of the water channel 5 and a fan 11 arranged at the hot end of the cooling fin 13 are installed inside the shell 1; the back plate 7 is provided with a heat dissipation hole 15 penetrating the back plate 7 directly above the fan 11.

[0058] The fan 11 provided at the hot end of the cooling plate 13 can not only help the cooling plate 13 to dissipate the heat generated during operation by accelerating the air flow, but also form convection to take away the heat faster and keep the cooling plate 13 at a low temperature.

[0059] The heat dissipation holes 15 on the back plate 7 allow the hot air blown out by the fan 11 to be quickly discharged, thereby preventing the hot air from accumulating inside the bracket and affecting the heat dissipation effect.

[0060] See also Figure 7 The housing 1 is also provided with a control module 9 and a battery 10 for monitoring the equipment status and controlling the operation of components. A window 14 is provided at the back plate 7 above the battery 10 for conveniently observing the operation status of the equipment.

[0061] The integrated control module 9 can intelligently adjust the operating speed of the fan 11 and the water pump 12 according to factors such as ambient temperature and equipment load, so as to achieve the best heat dissipation effect and energy consumption balance.

[0062] The built-in battery 10 provides an independent power source for the water pump 12, the fan 11 and the cooling plate 13, and they can work without an external power source, thereby improving the convenience of use.

[0063] The window 14 provided on the back plate 7 allows the user to observe the operation of the device and displays the internal temperature of the housing 1 .

[0064] The integrated control module 9 can automatically adjust the operating speed of the fan 11 and the water pump 12 according to the environmental conditions and the equipment load to achieve intelligent heat dissipation. This can not only ensure the best heat dissipation effect, but also reduce energy consumption while maintaining high efficiency and achieve energy saving.

[0065] The built-in battery 10 provides a convenient power solution for the entire cooling system, and can work without an external power supply, making the bracket more flexible and easy to use, especially suitable for scenarios that need to be moved or cannot be directly connected to a power source.

[0066] The thermal conductive member 16 is made of a material with high thermal conductivity and corrosion resistance, such as a titanium alloy or a nickel-based alloy, so as to improve the durability and corrosion resistance of the thermal conductive member 16 while maintaining high thermal conductivity.

[0067] Materials with high thermal conductivity can transfer heat quickly, so that the thermal conductive element 16 can respond quickly after receiving the heat and effectively transfer the heat to other parts or the heat dissipation system.

[0068] Efficient heat conduction can reduce the temperature gradient, thereby reducing the thermal stress caused by the temperature difference and extending the service life of the thermal conductor 16 and its connecting parts.

[0069] Corrosion-resistant materials such as titanium alloys and nickel-based alloys can effectively resist the erosion of various corrosive chemicals, ensuring that the thermal conductor 16 can still work normally in harsh environments. These materials also have good electrochemical stability and can prevent electrochemical corrosion caused by potential differences, especially in electrolyte environments.

[0070] The improvement of corrosion resistance enables the temperature conducting member 16 to maintain its original performance and shape during long-term use, thereby reducing the frequency of maintenance and replacement.

[0071] Among them, a pressure sensor and a temperature sensor are also provided in the water channel 5 for real-time monitoring of the liquid pressure and temperature in the water channel 5 to ensure that the system operates within a safe and efficient range, and the working state of the water pump 12 can be dynamically adjusted according to the monitoring data.

[0072] The pressure sensor is placed inside the water channel 5, and can measure the liquid pressure in the water channel 5 in real time, and convert the measured data into electrical signals for output. By monitoring these data, possible pressure anomalies in the water channel 5, such as excessively high or low pressure, can be discovered in time, so that corresponding measures can be taken to intervene and avoid damage to the system caused by the pressure anomaly.

[0073] The temperature sensor is placed inside the water channel 5 to monitor the temperature of the liquid in the water channel 5 in real time. It can accurately convert the temperature into an electrical signal and display and record it through the control system. By monitoring the temperature data, the temperature change of the liquid in the water channel 5 can be understood.

[0074] By inputting the data of the pressure sensor and the temperature sensor into the intelligent control system, the intelligent control of the water pump 12 can be realized. The control system automatically adjusts the speed and power of the water pump 12 according to the real-time monitored pressure and temperature data to meet the actual needs of the system.

[0075] A heat-conducting adhesive layer is provided between the contact plate 2 and the heat-conducting member 16 to improve the heat conduction efficiency between the contact plate 2 and the heat-conducting member 16 and ensure a close fit between the two to prevent heat leakage.

[0076] The thermally conductive adhesive layer provided between the contact plate 2 and the thermal conductive member 16 is a measure to effectively improve the efficiency of heat conduction and ensure that the two are closely fitted to prevent heat leakage. By selecting a thermally conductive adhesive with a high thermal conductivity, a wide temperature resistance range, and compatibility with the materials of the contact plate 2 and the thermal conductive member 16, and using mechanical coating and curing treatment, the thermally conductive adhesive layer can fully fill the tiny gap between the two to form a close fit. The thermally conductive adhesive layer not only improves the efficiency of heat conduction and transfers heat to the thermal conductive member 16 more quickly to achieve effective heat dissipation, but also enhances the structural stability between the contact plate 2 and the thermal conductive member 16 to prevent loosening or falling off due to liquid flow vibration or impact. During use, the condition of the thermally conductive adhesive layer should be checked regularly to avoid overheating and keep it clean and maintained to ensure its long-term stable operation.

[0077] The cooling sheet 13 adopts semiconductor cooling technology, which can efficiently transfer heat from the back of the water channel 5 to the fan 11, and dissipate heat through forced convection of the fan 11, thereby achieving rapid cooling and improving heat dissipation efficiency.

[0078] Semiconductor refrigeration technology, also known as thermoelectric refrigeration technology, works based on the principle of thermoelectric effect. In this refrigeration sheet 13, P-type semiconductor and N-type semiconductor materials are usually included, which are connected together to form a circuit. When current passes through the circuit, heat is transferred at the joints of the semiconductor materials due to the Peltier effect. Specifically, when current flows from a P-type semiconductor to an N-type semiconductor, heat is absorbed at the P-type semiconductor and the temperature decreases, while heat is released at the N-type semiconductor and the temperature increases. Conversely, when the direction of the current changes, the direction of heat transfer will also be opposite.

[0079] The contact plate 2 is a heat absorbing area, i.e., a cold end. When the refrigeration plate 13 is working, it absorbs heat from the contact plate 2, and the heat is then transferred to the hot end water channel 5 through internal conduction of the semiconductor material.

[0080] The fan 11 accelerates the flow of surrounding air by forced convection, thereby removing the heat from the hot end. When the fan 11 is running, it generates a strong airflow, which sweeps over the hot end surface and removes a large amount of heat. Due to the forced convection of the fan 11, the heat on the hot end can be quickly dissipated into the air, thereby achieving rapid cooling.

[0081] Among them, the control module 9 is integrated with an intelligent algorithm, which can automatically adjust the working status of the water pump 12, the cooling plate 13 and the fan 11 according to the equipment operation status and the ambient temperature, realize intelligent heat dissipation management, improve energy efficiency and reduce energy consumption.

[0082] The control module 9 is integrated with an intelligent algorithm, which can automatically adjust the working status of the water pump 12, the cooling plate 13 and the fan 11 according to the equipment operation status and the ambient temperature. By real-time monitoring of the liquid pressure and temperature in the water channel 5, it ensures that the system operates within a safe and efficient range, and dynamically adjusts the working status of the water pump 12 according to the monitoring data.

[0083] Adjust the speed of water pump 12: When the ambient temperature or the device temperature exceeds a preset value, the intelligent algorithm will instruct the control module 9 to increase the rotation speed of the water pump 12 to increase the flow speed and heat dissipation efficiency of the liquid in the water channel 5 .

[0084] On the contrary, when the temperature is lower than the preset value, the rotation speed of the water pump 12 will be reduced to reduce energy consumption.

[0085] Controlling the cooling plate 13 and the fan 11: According to the temperature data and the heat dissipation requirements, the intelligent algorithm will decide whether to turn on or off the cooling plate 13. When the temperature data is lower than the preset value for turning on the cooling plate 13, the cooling plate 13 will be turned off.

[0086] At the same time, the rotation speed of the fan 11 will be dynamically adjusted according to the heat dissipation requirements to ensure a balance between heat dissipation effect and energy consumption.

[0087] Among them, the heat dissipation bracket is also equipped with a remote monitoring and control system, which is connected to devices such as smartphones or computers through a wireless network to realize functions such as remote monitoring of equipment operation status, adjustment of heat dissipation parameters and receiving fault alarms, thereby improving the convenience and intelligence of management.

[0088] Through wireless networks, devices such as smartphones or computers can be connected to the remote monitoring and control system of the heat sink in real time. Users can check the operating status of the heat sink and the heat sink device connected to it at any time anywhere with a network connection. This includes key parameters such as the speed of the heat sink fan 11, the temperature of the heat sink, and the heat dissipation efficiency. Once the heat sink or heat sink device has an abnormality, such as excessive temperature or fan 11 failure, the user can immediately detect it through the remote monitoring system and take timely measures to deal with it.

[0089] The remote monitoring and control system also allows the user to remotely adjust the heat dissipation parameters of the heat dissipation bracket according to actual needs. For example, the user can flexibly adjust the speed of the fan 11, the switching of the heat dissipation mode, etc. according to factors such as the current ambient temperature and the load of the equipment to achieve the best heat dissipation effect. This personalized heat dissipation setting not only helps to protect the equipment from overheating damage, but also reduces energy consumption to a certain extent and improves energy utilization efficiency.

[0090] The remote monitoring and control system has a fault alarm function. When a heat sink or heat dissipation device fails, the system will automatically send an alarm message to the user's smartphone or computer. The alarm message usually includes detailed information such as the fault type, fault location, and recommended repair measures, which helps users quickly locate the problem and take effective solutions. This real-time fault alarm mechanism greatly improves the timeliness and accuracy of equipment maintenance and reduces downtime and repair costs caused by equipment failure.

[0091] The heat dissipation bracket realizes remote connection and control with devices such as smart phones or computers through built-in sensors and wireless network communication technology. Users can view the operating status of the heat dissipation bracket and the heat dissipation device connected to it in real time anywhere there is a network connection, including key parameters such as the speed of the heat dissipation fan 11 and the temperature of the heat sink. At the same time, users can also flexibly adjust the heat dissipation parameters through remote monitoring software according to actual needs to achieve the best heat dissipation effect. When the heat dissipation bracket or heat dissipation device fails, the system will automatically trigger the alarm mechanism and send detailed fault information to the user's device through the wireless network to help users quickly locate the problem and take effective solutions. The implementation of this remote monitoring and control system not only improves the convenience and intelligence level of management, but also helps to protect the equipment from overheating damage, reduce energy consumption, and extend the service life of the equipment.

[0092] In the description of the present invention, it is necessary to understand that the terms "middle", "length", "up", "down", "front", "back", "vertical", "horizontal", "inside", "outside", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0093] In the present invention, unless otherwise clearly specified and limited, the first feature "on" the second feature may be that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. "Multiple" means at least two, such as two, three, etc., unless otherwise clearly and specifically limited.

[0094] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0095] The above is only for explaining the implementation mode of the present invention and is not intended to limit the present invention. For those skilled in the art, any modification, equivalent substitution, improvement, etc. made within the spirit and principle of the present invention without creative work should be included in the protection scope of the present invention.

Claims

1. An intelligent control heat dissipation bracket with a strong cooling water channel structure, comprising a shell, a contact plate, a support block and a back plate of the heat dissipation bracket, a water channel is arranged between the shell and the contact plate, through holes are opened at both ends of the water channel, interfaces are arranged at the through holes, a water pump is arranged at the interface, the water pump is connected to the interface through a conduit, the passages of the water pump and the water channel are filled with liquid, characterized in that: The waterway is provided with a heat conducting member arranged along the waterway route, the heat conducting member is embedded in the bottom surface of the contact plate and immersed in the liquid, the heat conducting member penetrates the contact plate and is laid flat on the upper surface of the contact plate, one end of the heat conducting member contacts the heat source and the other end contacts the liquid, thereby improving the heat dissipation speed of the heat source; The heat conducting member is provided with a plurality of C-shaped grooves, and a flow guide block for causing the flowing liquid to generate eddies is provided in the C-shaped grooves. The C-shaped grooves increase the contact area with the liquid, and the openings of the C-shaped grooves prevent the formation of independent channels that affect the flow rate; The surface of the C-shaped groove is also provided with a plurality of microchannels, so that the flow of the liquid in the channel is more uniform and the contact area between the liquid and the water channel wall is increased.

2. The intelligent control heat dissipation bracket with a strong cooling water channel structure according to claim 1, characterized in that: The contact plate is a detachable structure. By replacing different contact plates to change the cross section of the temperature conducting member, the heat conduction efficiency of the water channel can be controlled without adjusting the liquid flow rate.

3. The intelligent control heat dissipation bracket with a strong cooling water channel structure according to claim 1, characterized in that: The guide block and the C-shaped groove are an integrally formed structure.

4. The intelligent control heat dissipation bracket with a strong cooling water channel structure according to claim 1, characterized in that: The microchannels are arranged in a mesh or parallel pattern on the surface of the C-shaped groove, ensuring that the liquid can fully flow through every area to achieve comprehensive heat exchange.

5. The intelligent control heat dissipation bracket with a strong cooling water channel structure according to claim 1, characterized in that: Microchannels are precisely etched on the surface of the thermal conductor by chemical vapor deposition.

6. An intelligent control heat dissipation bracket with a strong cooling water channel structure according to any one of claims 1 to 5, characterized in that: A cooling fin arranged on the back of the water channel and a fan arranged at the hot end of the cooling fin are installed inside the shell; and a heat dissipation hole penetrating through the back plate arranged just above the fan is arranged on the back plate.

7. An intelligent control heat dissipation bracket with a strong cooling water channel structure according to any one of claims 1 to 5, characterized in that: The housing is also provided with a control module and a battery for monitoring the status of the equipment and controlling the operation of the components, and a window for conveniently observing the operation status of the equipment is provided on the back plate above the battery.

8. An intelligent control heat dissipation bracket with a strong cooling water channel structure according to claims 1 to 5, characterized in that: The thermal conductive member is made of a material with high thermal conductivity and corrosion resistance, such as a titanium alloy or a nickel-based alloy, so as to improve the durability and corrosion resistance of the thermal conductive member while maintaining high thermal conductivity.

9. An intelligent control heat dissipation bracket with a strong cooling water channel structure according to any one of claims 1 to 5, characterized in that: The water channel is also provided with a pressure sensor and a temperature sensor for real-time monitoring of the liquid pressure and temperature in the water channel to ensure that the system operates within a safe and efficient range, and the working state of the water pump can be dynamically adjusted according to the monitoring data.

10. An intelligent control heat dissipation bracket with a strong cooling water channel structure according to any one of claims 1 to 5, characterized in that: A heat-conducting adhesive layer is provided between the contact plate and the heat-conducting member to improve the heat conduction efficiency between the contact plate and the heat-conducting member, while ensuring a close fit between the two to prevent heat leakage.

11. The intelligent control heat dissipation bracket with a strong cooling water channel structure according to claim 6, characterized in that: The refrigeration plate adopts semiconductor refrigeration technology, which can efficiently transfer heat from the back of the water channel to the fan, and dissipate heat through forced convection of the fan, thereby achieving rapid cooling and improving heat dissipation efficiency.

12. The intelligent control heat dissipation bracket with a strong cooling water channel structure according to claim 7, characterized in that: The control module is integrated with an intelligent algorithm, which can automatically adjust the working status of the water pump, cooling plate and fan according to the equipment operation status and ambient temperature, realize intelligent heat dissipation management, improve energy efficiency and reduce energy consumption.

13. An intelligent control heat dissipation bracket with a strong cooling water channel structure according to any one of claims 1 to 5, characterized in that: The heat dissipation bracket is also equipped with a remote monitoring and control system, which is connected to devices such as smart phones or computers through a wireless network to realize functions such as remote monitoring of equipment operation status, adjustment of heat dissipation parameters and receiving fault alarms, thereby improving the convenience and intelligence level of management.

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