Electronic component unit

Abstract

Provided is a technique capable of improving the quality of an electronic component unit. Shield layers (50) are disposed on a first surface (11a), a second surface (12a), and a third surface (13a) of a housing (10) of an electronic component unit (current sensor). The shield layer (50) employs various pastes (carbon paste and magnetic paste). Since the paste can be freely applied to a desired site, it is possible to configure an optimal shield structure, and it is possible to easily achieve both improvement in both dV / dt characteristics and EMC characteristics. In addition, by adding the magnetic paste, shielding of a radio noise band (a band having a frequency of about 0.1-5.0 MHz) is also possible. Furthermore, since the shield layer (50) is formed by a paste, the shield layer (50) can be configured at low cost compared with a metal shield (vacuum film formation such as vapor deposition or sputtering).

Description

Technical Field

[0001] The invention relates to an electronic component unit having electronic components. Background Art

[0002] Patent Document 1 discloses a current sensing device having an electric shield. Patent Document 1 states that “the electric shield is preferably made of a metal material, a doped semiconductor material, or a conductive material such as graphite.”

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-23824 Summary of the invention

[0006] Technical problem to be solved by the invention

[0007] Therefore, in such electronic component units such as current sensing devices, improvement in quality is desired.

[0008] Therefore, an object of the present invention is to provide a technology capable of improving the quality of an electronic component unit.

[0009] Technical solutions for solving technical problems

[0010] The present invention adopts the following solution to solve the above-mentioned technical problems. It should be noted that the following solution and the statements in brackets are examples after all, and the present invention is not limited to them. In addition, the present invention can be an invention that includes at least one of the specific matters of each invention shown in the following solution. Furthermore, in each specific matter of the invention shown in the following solution, it is possible to add elements that limit the specific matter of the invention to conceptualize it at a lower level, and it is also possible to delete elements that limit the specific matter of the invention to conceptualize it at a higher level.

[0011] Solution 1: The electronic component unit of the present solution is an electronic component unit comprising: an electronic component; a housing that accommodates the electronic component; and a shielding layer that is disposed on at least a portion of an inner surface of the housing and has conductivity and magnetism.

[0012] The electronic component unit of this solution has the following structure.

[0013] (1) Electronic components are provided. Electronic components are electronic elements required for the electronic component unit. Examples of electronic components include a core, a substrate, and the like.

[0014] (2) A housing is provided for accommodating electronic components. The housing may be partially open or may not be open. One or more electronic components are accommodated in the housing.

[0015] (3) A shielding layer having conductivity and magnetism is disposed on at least a portion of the inner surface of the shell. The shielding layer may be one layer or multiple layers. The inner surface of the shell is a surface other than the outer surface of the outermost component among the components constituting the shell. For this reason, the outward-facing surface of the component disposed inside the shell among the components constituting the shell is also the inner surface of the shell.

[0016] According to this solution, since a shielding layer having conductivity and magnetism is provided, the dV / dt characteristics (output characteristics) can be improved by conductivity while the EMC characteristics (influence of electromagnetic waves) can be improved by magnetism, thereby improving the quality of the electronic component unit.

[0017] Furthermore, according to the present solution, since the shielding layer is disposed on the inner surface of the housing, it does not interfere with components disposed on the outer side of the housing or electronic components housed on the inner side of the housing.

[0018] Furthermore, according to the present solution, since the shielding layer is arranged on the inner surface of the housing, the shielding layer can be protected by the housing, and the effect of the shielding layer can be maintained for a long time compared to the case where the shielding layer is arranged on the outer surface of the housing.

[0019] Solution 2: The electronic component unit of this solution is an electronic component unit according to any of the above solutions, characterized in that the shielding layer is a layer obtained by stacking a first layer and a second layer, the first layer is formed by a first material having the conductivity, and the second layer is formed by a second material having the magnetism.

[0020] In the present solution, the shielding layer is a layer obtained by laminating a first layer and a second layer, the first layer is formed of a first material having conductivity, and the second layer is formed of a second material having magnetism.

[0021] According to this solution, since the shielding layer is composed of two layers obtained by laminating the first layer and the second layer, the first layer and the second layer can have the same thickness or different thicknesses, and the shielding layer can be easily adjusted in effect.

[0022] Solution 3: The electronic component unit of this solution is an electronic component unit according to any of the above solutions, characterized in that the shielding layer is a layer formed by a mixed material, and the mixed material is obtained by mixing a first material having the conductivity and a second material having the magnetism.

[0023] In this solution, the shielding layer is a layer formed of a mixed material obtained by mixing a first material having conductivity and a second material having magnetism.

[0024] According to the present solution, since the shielding layer is composed of one layer and the one layer is formed of a mixed material obtained by mixing the first material and the second material, it is not necessary to form a plurality of layers, and the shielding layer can be easily manufactured.

[0025] Solution 4: The electronic component unit of this solution is an electronic component unit according to any of the above solutions, characterized in that the first material is carbon paste or metal paste, and the second material is magnetic paste.

[0026] In this solution, the following features are added.

[0027] (1) The first material is carbon paste or metal paste.

[0028] (2) The second material is a magnetic paste.

[0029] According to this solution, since both the first material and the second material are pastes, each layer can be formed by coating, which facilitates manufacturing and reduces costs.

[0030] Solution 5: The electronic component unit of the present solution is an electronic component unit according to any of the above solutions, and is characterized in that the shell comprises: a first annular component having an opening in the center; a second component formed by standing up on the outer periphery of the first component; and a third component formed by standing up on the inner periphery of the first component, and the shielding layer is arranged on at least one of the first inner surface of the first component, the second inner surface of the second component, and the third outer surface of the third component.

[0031] In this solution, the following features are added.

[0032] (1) The housing includes: an annular first member having an opening at the center; a second member formed so as to stand on the outer periphery of the first member; and a third member formed so as to stand on the inner periphery of the first member.

[0033] (2) The shielding layer is formed on at least one of the first surface inside the first member, the second surface inside the second member, and the third surface outside the third member.

[0034] According to this solution, since the shielding layer is formed on at least one of the first surface, the second surface and the third surface, the shielding layer can be configured in a wide range of the inner surface of the shell, or in a limited range of the inner surface of the shell, which can effectively improve the quality of the electronic component unit.

[0035] Effects of the Invention

[0036] According to the present invention, the quality of an electronic component unit can be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figure 1 1 is a perspective view showing the current sensor 100 according to the present embodiment.

[0038] Figure 2 1 is an exploded perspective view showing the current sensor 100 according to the present embodiment.

[0039] Figure 3A 1 is a diagram showing a first type of housing 10 .

[0040] Figure 3B 1 is a diagram showing a first type of housing 10 .

[0041] Figure 4A 2 is a diagram showing a second type of housing 10 .

[0042] Figure 4B 2 is a diagram showing a second type of housing 10 .

[0043] Figure 5A 1 is a diagram showing a third type of housing 10 .

[0044] Figure 5B 1 is a diagram showing a third type of housing 10 .

[0045] Fig. 6A 1 is a diagram showing a fourth type of housing 10 .

[0046] Figure 6B 1 is a diagram showing a fourth type of housing 10 .

[0047] Fig. 7A It is a diagram showing a stacking method of the shield layer 50 .

[0048] Figure 7B It is a diagram showing a stacking method of the shield layer 50 .

[0049] Figure 8 is a diagram showing an evaluation sample of the shielding layer 50 .

[0050] Fig. 9 1 is a cross-sectional view schematically showing the magnetic field measurement jig 200 .

[0051] Fig.10 It is a diagram showing the evaluation results of the shielding characteristics of the magnetic field coupling.

[0052] Fig.11 It is a cross-sectional view schematically showing the electric field measurement jig 300 .

[0053] Fig.12 : is a graph showing the evaluation results of the shielding characteristics of the electric field coupling. DETAILED DESCRIPTION

[0054] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0055] Figure 1 1 is a perspective view showing the current sensor 100 according to the present embodiment. Figure 2 1 is an exploded perspective view showing the current sensor 100 of the present embodiment. Note that in the following drawings, there are places where the size and length of actual objects are changed or exaggerated, or where existing components are omitted and shown.

[0056] like Figure 1 As shown, the current sensor 100 (electronic component unit) is a sensor for measuring current, and includes a case 10 , a core 20 (electronic component), and a substrate 30 (electronic component).

[0057] The housing 10 is a box-shaped member that accommodates the core 20 and the substrate 30, and has a through hole formed in the center. The periphery of the through hole in the housing 10 is open on the front side in the figure, and is not open on the back side in the figure.

[0058] like Figure 2 As shown, the core 20 is accommodated in the housing 10 , and the substrate 30 is accommodated so as to overlap with the core 20 .

[0059] The housing 10 includes an annular first member 11 having an opening 40 at the center (see FIG. 3 ), a second member 12 formed standing on the outer periphery of the first member 11 , and a third member 13 formed standing on the inner periphery of the first member 11 .

[0060] The core 20 is a laminated core and can converge a magnetic field generated by conduction of a primary current in a state where a primary conductor (bus bar) not shown is inserted into the core 20 .

[0061] An air gap 21 is formed at least at one point in the circumferential direction of the core 20 . A magnetic detection element (magnetic sensor, magnetoelectric converter, etc.) such as a Hall element 31 is disposed in the air gap 21 . The Hall element 31 outputs a detection signal corresponding to the intensity of the magnetic field converged by the core 20 .

[0062] The substrate 30 is in a horizontal U-shape to match the shape of the storage space of the housing 10. In addition to the Hall element 31, various components, IC chips, etc. not shown in the figure are mounted on the substrate 30 to form a current detection circuit. The current detection circuit amplifies the voltage signal output from the Hall element 31, performs various electrical processing, and outputs a detection voltage.

[0063] An external connector 32 is mounted on the substrate 30 and is arranged to protrude from the case 10 when the current sensor 100 is assembled. The current sensor 100 can supply power to the output circuit through the external connector 32 or output a detection voltage from the current detection circuit.

[0064] 〔dV / dt characteristics〕

[0065] In the current sensor 100, it is known that the step-like change in the voltage in the primary conductor affects the change in the output signal (detection voltage). Specifically, it is known that the rapid voltage change of the primary current has a significant effect on the output signal as noise, which is referred to as the dV / dt characteristic of the output signal of the current sensor 100. Such a dV / dt characteristic is considered to be because the noise is transmitted through the stray capacitance between the primary conductor and the core 20 and the current detection circuit.

[0066] In addition, the influence of such noise on the output signal can be suppressed by grounding the core 20 to the ground line (GND) of the current detection circuit. The reason is that by grounding the core 20, most of the noise components are absorbed by the ground line side and are not easily conducted to the current detection circuit. In this embodiment, the core 20 is grounded to the ground line of the current detection circuit by a plate-shaped nickel terminal 33 bonded to the surface (outer peripheral surface) of the core 20.

[0067] 〔Shielding layer〕

[0068] In the present embodiment, a shield layer is provided in the current sensor 100 in order to improve both the dV / dt characteristic and the EMC characteristic.

[0069] The shielding layer is a layer that is disposed on at least a portion of the inner surface of the housing 10 and has conductivity and magnetism.

[0070] Here, the dV / dt characteristic is the characteristic of noise caused by electric field coupling between the primary conductor (bus bar) and the current detection circuit (sensor circuit, ASIC, etc.) as described above. In addition, the EMC characteristic is the characteristic of noise caused by electromagnetic waves input from the outside of the current sensor 100 and electromagnetic waves released to the outside of the current sensor 100.

[0071] Improving dV / dt characteristics and improving EMC characteristics are different phenomena, and therefore separate measures need to be taken. In order to implement separate measures, in this embodiment, two types of pastes (carbon paste and magnetic paste) are applied to the inner surface of the housing 10 to configure a shielding layer.

[0072] The location where the shielding layer is arranged can vary depending on the arrangement location and performance of the electronic components inside the current sensor 100, the size and shape of the housing 10, and the arrangement location and performance of the primary conductor. In this embodiment, any of the following four types can be adopted. Each type is described below.

[0073] [Type 1]

[0074] FIG. 3 is a diagram showing a first type of housing 10, Figure 3A shows a stereogram, Figure 3B A front view is shown.

[0075] In the first type, the shield layer 50 is disposed on the second surface 12 a inside the second member 12 of the housing 10 (a member forming the side surface (surroundings) of the housing 10 in the figure).

[0076] According to the first type, the influence from the side surface of the housing 10 can be reduced.

[0077] 〔Type 2〕

[0078] FIG. 4 is a diagram showing a second type of housing 10, Figure 4A shows a stereogram, Figure 4B A front view is shown.

[0079] In the second type, the shield layer 50 is disposed on the third surface 13 a on the outer side of the third member 13 (member in which the through hole is formed) of the housing 10 .

[0080] According to the second type, the influence from the primary conductor (bus bar) arranged at the center of the housing 10 can be reduced.

[0081] 〔Third Type〕

[0082] FIG. 5 is a diagram showing a third type of housing 10, Figure 5A shows a stereogram, Figure 5B A front view is shown.

[0083] In the third type, the shield layer 50 is disposed on the first surface 11 a on the inner side of the first member 11 (a member forming the bottom surface in the figure) of the housing 10 .

[0084] According to the third embodiment, the influence from the bottom surface side of the housing 10 can be reduced.

[0085] [Fourth Type]

[0086] FIG. 6 is a diagram showing a fourth type of housing 10, Fig. 6A shows a stereogram, Figure 6B A front view is shown.

[0087] The fourth type is a type in which all of the first to third types are combined, and the shielding layer 50 is disposed on the first surface 11 a , the second surface 12 a , and the third surface 13 a of the housing 10 .

[0088] According to the fourth type, the influence from the side surface of the case 10 , the influence from the primary conductor (bus bar) arranged at the center of the case 10 , and the influence from the bottom surface of the case 10 can all be reduced.

[0089] Any two of the first to third types may be used in combination. In the first to fourth types, the shielding layer 50 may be disposed on at least a portion of each of the first surface 11 a , the second surface 12 a , and the third surface 13 a .

[0090] FIG. 7 is a diagram showing a stacking method of the shield layer 50 .

[0091] The shielding layer 50 can be Fig. 7A The first method shown or Figure 7B The second method is shown.

[0092] [First method]

[0093] like Fig. 7A As shown, the shielding layer 50 is a two-layered layer. Specifically, the shielding layer 50 is composed of a layer obtained by stacking a carbon paste layer 51 (first layer) and a magnetic paste layer 52 (second layer), wherein the carbon paste layer 51 is formed of a carbon paste having conductivity (first material), and the magnetic paste layer 52 is formed of a magnetic paste having magnetism (second material).

[0094] The carbon paste layer 51 may be in contact with the housing 10, and the magnetic paste layer 52 may be in contact with the housing 10. The carbon paste layer 51 and the magnetic paste layer 52 may have the same thickness or different thicknesses.

[0095] [Second Method]

[0096] like Figure 7B As shown, the shielding layer 50 is a single layer. Specifically, the shielding layer 50 is composed of a mixed layer 53 formed of a mixed material in which a carbon paste having conductivity (first material) and a magnetic paste having magnetism (second material) are mixed.

[0097] Carbon paste is a coating material with carbon particles added to resin. Carbon paste improves dV / dt characteristics and EMC characteristics (improves electric field coupling of electromagnetic waves, and even improves shielding characteristics of magnetic field coupling at frequencies above 500MHz).

[0098] Magnetic paste is a coating material in which magnetic powder is added to resin. Magnetic paste improves EMC characteristics (it improves magnetic field coupling of electromagnetic waves, and in particular, the characteristics of magnetic field coupling at low frequencies are improved more than carbon paste and metal paste).

[0099] Figure 8 is a diagram showing an evaluation sample of the shielding layer 50 .

[0100] The evaluation sample S1 is made of carbon paste and magnetic paste. The evaluation sample S1 has a thickness t of 0.258 mm, a horizontal length W of 140 mm, and a vertical length L of 140 mm. The evaluation sample S1 can be Fig. 7A The first method shown can also be Figure 7B The second method is shown.

[0101] The material of the evaluation sample S2 is magnetic paste, and the thickness t of the evaluation sample S2 is 0.2 mm, the length W in the horizontal direction is 140 mm, and the length L in the vertical direction is 140 mm.

[0102] The material of the evaluation sample S3 is carbon paste, and the thickness t of the evaluation sample S3 is 0.02 mm, the length W in the horizontal direction is 140 mm, and the length L in the vertical direction is 140 mm.

[0103] Fig. 9 It is a cross-sectional view schematically showing a magnetic field measurement jig.

[0104] The magnetic field measurement jig 200 includes an upper case 202 accommodating a transmitting antenna 201 and a lower case 204 accommodating a receiving antenna 203 , and can generate a magnetic field 205 from the transmitting antenna 201 toward the receiving antenna 203 .

[0105] Furthermore, the evaluation sample 210 can be placed between the upper housing 202 and the lower housing 204 to measure the shielding characteristics of the magnetic field coupling.

[0106] Fig.10 It is a diagram showing the evaluation results of the shielding characteristics of the magnetic field coupling.

[0107] Specifically, Figure 8 The three evaluation samples S1 to S3 shown are set at Fig. 9 The electromagnetic wave shielding evaluation (magnetic field coupling) is performed using the KEC method using a measuring fixture for magnetic fields of the transmitter side. It should be noted that the KEC method is a method of inserting an evaluation sample between the fixture on the transmitter side and the fixture on the receiver side to evaluate the attenuation of the signal on the receiver side.

[0108] The vertical axis in the figure represents the magnetic field shielding effectiveness (magnetic shielding effectiveness〔dB〕). The higher the value, the higher the magnetic field shielding effectiveness.

[0109] The horizontal axis in the figure represents frequency (frequency [MHz]).

[0110] 〔Evaluation Sample S1〕

[0111] The evaluation sample S1 is a sample formed by a carbon paste and a magnetic paste.

[0112] The evaluation sample S1 has a high magnetic field shielding effect stably from low frequency to high frequency.

[0113] Specifically, the evaluation sample S1 shows a value of 4.2 dB at 0.4 MHz, shows the same value up to about 10.0 MHz, and the value gradually decreases from there to 300 MHz, but increases from about 500 MHz.

[0114] [Evaluation Sample S2]

[0115] The evaluation sample S2 is a sample formed by a magnetic paste.

[0116] The evaluation sample S2 has a high magnetic field shielding effect at low frequencies, but the magnetic field shielding effect becomes low at high frequencies.

[0117] Specifically, the evaluation sample S2 exhibits a value of 4.2 dB at 0.4 MHz, exhibits the same value up to about 10.0 MHz, and gradually decreases from there to 1000 MHz, and does not increase at high frequencies.

[0118] [Evaluation Sample S3]

[0119] The evaluation sample S3 is a sample formed by carbon paste.

[0120] The evaluation sample S3 has a low magnetic field shielding effect at low frequencies, but has a high magnetic field shielding effect at high frequencies.

[0121] Specifically, the evaluation sample S3 exhibits a value of 0.6 dB at 0.4 MHz, the value gradually decreases from there to 1.0 MHz, the same value is exhibited from 1.0 MHz to about 110.0 MHz, and the value gradually increases from there to 1000 MHz.

[0122] Thus, the evaluation sample S1 has the characteristics of the good parts of both the evaluation sample S2 and the evaluation sample S3. In addition, the shield layer 50 of the current sensor 100 has the same structure as that of the evaluation sample S1.

[0123] Fig.11 It is a cross-sectional view schematically showing the electric field measurement jig.

[0124] The electric field measurement jig 300 includes an upper case 302 accommodating a transmitting antenna 301 and a lower case 304 accommodating a receiving antenna 303 , and can generate an electric field 305 from the transmitting antenna 301 toward the receiving antenna 303 .

[0125] Furthermore, the evaluation sample 310 can be placed between the upper housing 302 and the lower housing 304 to measure the shielding characteristics of the electric field coupling.

[0126] Fig.12 It is a diagram showing the evaluation results of the shielding characteristics of the electric field coupling.

[0127] Specifically, Figure 8 The three evaluation samples S1 to S3 shown are set at Fig.11 The electromagnetic wave shielding evaluation (electric field coupling) was performed using the KEC method using a measuring jig for electric fields.

[0128] The vertical axis in the figure represents the magnetic field shielding effectiveness (magnetic shielding effectiveness〔dB〕). The higher the value, the higher the magnetic field shielding effectiveness.

[0129] The horizontal axis in the figure represents frequency (frequency [MHz]).

[0130] 〔Evaluation Sample S1〕

[0131] The evaluation sample S1 is a sample formed by a carbon paste and a magnetic paste.

[0132] The evaluation sample S1 gradually increases in value from a low frequency, and when it exceeds the peak value, the value gradually decreases.

[0133] Specifically, the evaluation sample S1 exhibits a value of 32.0 dB at 0.4 MHz, the value gradually increases to about 60.0 dB at 2.0 MHz, and the value gradually decreases from there to about 10.0 dB at 1000.0 MHz.

[0134] [Evaluation Sample S2]

[0135] The evaluation sample S2 is a sample formed by a magnetic paste.

[0136] The evaluation sample S2 has a low magnetic field shielding effect as a whole.

[0137] Specifically, the evaluation sample S2 exhibits a value of 3.0 dB at 0.4 MHz, and exhibits the same value until the final frequency of approximately 1000.0 MHz.

[0138] [Evaluation Sample S3]

[0139] The evaluation sample S3 is a sample formed by carbon paste.

[0140] The evaluation sample S3 shows substantially the same value as that of the evaluation sample S1.

[0141] Thus, the characteristics of the evaluation sample S3 dominated the evaluation sample S1 (largely affected by the carbon paste), and the characteristics of the poor part of the evaluation sample S2 (the characteristic that the magnetic paste does not have much effect in electric field coupling) were not inherited. It should be noted that, as described above, the shield layer 50 of the current sensor 100 used a shield layer 50 having the same structure as the evaluation sample S1.

[0142] Therefore, by using such a composite material of carbon paste and magnetic paste in the shield layer 50, the shielding characteristics of the magnetic field coupling and the electric field coupling can be improved.

[0143] As described above, according to this embodiment, the following effects are achieved.

[0144] (1) According to this embodiment, since the shield layer 50 having conductivity and magnetism is provided, the dV / dt characteristic (output characteristic) can be improved by conductivity while the EMC characteristic (influence of electromagnetic waves) can be improved by magnetism. As a result, the quality of the current sensor 100 can be improved.

[0145] (2) According to the present embodiment, since the shield layer 50 is disposed on the inner surface of the housing 10 , it does not interfere with components disposed outside the housing 10 , or the core 20 and substrate 30 housed inside the housing 10 .

[0146] (3) According to the present embodiment, since the shielding layer 50 is arranged on the inner surface of the shell 10, the shielding layer 50 can be protected by the shell 10. Compared with the case where the shielding layer 50 is arranged on the outer surface of the shell 10, the possibility of deterioration or damage of the shielding layer 50 is low, and the effect of the shielding layer 50 can be maintained for a long time.

[0147] (4) According to the present embodiment, since the shielding layer 50 is composed of two layers obtained by stacking a carbon paste layer 51 and a magnetic paste layer 52, the carbon paste layer 51 and the magnetic paste layer 52 can be made to have the same thickness or different thicknesses, and the shielding layer 50 can be easily adjusted in effect (for example, only the layer whose effect is to be improved can be thickened).

[0148] (5) According to the present embodiment, since the shield layer 50 is composed of a single layer made of a mixed material obtained by mixing a carbon paste and a magnetic paste, it is not necessary to form a plurality of layers, and the shield layer 50 can be easily manufactured.

[0149] (6) According to the present embodiment, since both the carbon paste and the magnetic paste are pastes (coating materials), each layer can be formed by coating, which facilitates manufacturing and reduces costs.

[0150] (7) According to this embodiment, since the shielding layer 50 is formed on at least one of the first surface 11a, the second surface 12a and the third surface 13a, the shielding layer 50 can be configured in a wide range of the inner surface of the shell 10, or the shielding layer 50 can be configured in a limited range of the inner surface of the shell 10, which can effectively improve the quality of the current sensor 100.

[0151] (8) To improve the dV / dt characteristics and EMC characteristics by using metal or conventional molded products, the structure becomes complicated and the cost increases. Therefore, in the present embodiment, the shielding layer 50 uses various pastes (carbon paste and magnetic paste). Since the paste can be freely applied to the desired location, it is possible to form an optimal shielding structure, and it is easy to take into account the improvement of both the dV / dt characteristics and the EMC characteristics. In addition, by adding magnetic paste, shielding of the radio noise band (frequency band of about 0.1 to 5.0 MHz) becomes possible. Furthermore, since the shielding layer 50 is formed by paste, it can be formed at a low cost compared to metal shielding (vacuum film formation by evaporation, sputtering, etc.).

[0152] 〔Deformation method〕

[0153] The present invention is not limited to the above-described embodiment, and can be implemented with various modifications.

[0154] (1) The electronic component unit is described using a current sensor as an example, but may also be an electronic component unit other than a current sensor (for example, a gate driver, a power module, an LED driver, a transformer, a reactor, a portable information terminal, a portable phone, a charger, etc.).

[0155] (2) In the above embodiment, the shielding layer is formed of carbon paste and magnetic paste as an example, but the present invention is not limited to this combination, and the current sensor (electronic component unit) can be formed by applying two or more pastes on the inner surface of the housing. The combination of the two or more pastes can be the following combination.

[0156] (Example 1) Carbon paste, magnetic paste, insulating paste

[0157] (Example 2) Carbon + magnetic paste (paste with conductivity and magnetism), insulating paste

[0158] (Example 3) Carbon + metal paste (conductive paste obtained by mixing different materials), magnetic paste, insulating paste

[0159] (Example 4) Metal paste, magnetic paste, carbon paste, insulating paste

[0160] It should be noted that the insulating paste in each example may be omitted.

[0161] (3) The shielding layer for improving the dV / dt characteristics and the shielding layer for improving the EMC characteristics may be applied to different locations. It should be noted that when applied to the same location, a paste obtained by mixing powders with different characteristics may be applied, or different pastes may be applied in duplicate (see FIG. 7 ).

[0162] (4) The material constituting the shielding layer may not only be applied to the inner surface of the housing but also be mixed into the housing.

[0163] (5) The first material may also be a metal paste.

[0164] (6) The nickel terminal 33 may not be installed.

[0165] (7) When carbon paste (carbon) is used to improve dV / dt characteristics and magnetic paste is used to improve EMC characteristics, these materials may be applied in two layers or only one of the materials may be applied. In this case, the following method may be used.

[0166] (a) When the first type shown in FIG. 3 and the second type shown in FIG. 4 are combined, the carbon paste and the magnetic paste can be applied as two layers at the position of the shielding layer 50 of the first type, and only the carbon paste or only the magnetic paste can be applied at the position of the shielding layer 50 of the second type. It should be noted that the types can be combined arbitrarily, and which type is to be two layers and which type is to be one layer can also be set arbitrarily.

[0167] (b) In the case of the first type shown in FIG3 , the carbon paste and the magnetic paste can be applied as two layers in a part of the area where the first type shielding layer 50 is arranged, and only the carbon paste or only the magnetic paste can be applied in the remaining area. This is also the same in other types.

[0168] It should be noted that (a) and (b) can also be used in combination.

[0169] The Hall element 31 may be replaced with an element that detects a magnetic field and changes its output, such as a GMR (Giant Magneto Resistive) element or a TMR (Tunnel Magneto Resistance) element.

[0170] Industrial Applicability

[0171] According to the present invention, the quality of an electronic component unit can be improved.

[0172] Description of Reference Numerals

[0173] 10 Shell

[0174] 11 First Part

[0175] 11a Page 1

[0176] 12 Second Part

[0177] 12a Side 2

[0178] 13 Third Part

[0179] 13a The third side

[0180] 20 Core

[0181] 21 Air Gap

[0182] 30 substrate

[0183] 31 Hall element

[0184] 32 External connectors

[0185] 33 Nickel Terminals

[0186] 40 Opening

[0187] 50 Shielding

[0188] 51 Carbon paste layer

[0189] 52 Magnetic paste layer

[0190] 53 Mixed Layer

[0191] 100 Current Sensor

[0192] 200 Magnetic Field Measurement Fixture

[0193] 300 Electric field measurement fixture.

Claims

1. An electronic component unit, comprising: Electronic components; a housing for accommodating the electronic components; and The shielding layer is disposed on at least a portion of the inner surface of the housing and has conductivity and magnetism.

2. The electronic component unit according to claim 1, characterized in that: The shield layer is a layer in which a first layer and a second layer are stacked, the first layer is formed of the first material having the conductivity, and the second layer is formed of the second material having the magnetism.

3. The electronic component unit according to claim 1, characterized in that: The shield layer is a layer formed of a mixed material obtained by mixing a first material having the electrical conductivity and a second material having the magnetic properties.

4. The electronic component unit according to claim 2 or 3, characterized in that: The first material is carbon paste or metal paste, The second material is a magnetic paste.

5. The electronic component unit according to claim 1, characterized in that: The housing comprises: A first annular member having an opening in the center; A second component formed by standing up on the outer periphery of the first component; and The third component is formed by standing up on the inner periphery of the first component, The shielding layer is disposed on at least one of a first surface inside the first member, a second surface inside the second member, and a third surface outside the third member.

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