Liquid distribution system and distribution method

Abstract

The invention provides a liquid distribution system and a liquid distribution method. The liquid distribution system comprises a nozzle, a liquid supply device and a liquid distribution device, the liquid supply device is connected with the liquid distribution device and is used for conveying liquid to the liquid distribution device; the liquid distribution device comprises a liquid distribution mechanism and a gas discharge mechanism, the liquid distribution mechanism is connected with the nozzle and used for discharging the liquid from the nozzle, and the gas discharge mechanism is used for discharging bubbles in the liquid. According to the liquid distribution system and method provided by the embodiment of the invention, the wafer coating efficiency is ensured, bubbles in the liquid can be removed in the liquid distribution process, and the wafer gluing precision is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a liquid distribution system and a liquid distribution method. Background Art

[0002] In the chip manufacturing process, the photolithography machine is usually directly connected to the glue coating and developing equipment. In the glue coating process, the glue coating accuracy of the glue pump directly affects the film thickness of the liquid on the wafer surface. At the same time, the high cleanliness of the flow channel and the joint must be ensured during liquid distribution to prevent the wafer surface from being contaminated by particles and bubbles after glue coating.

[0003] When the existing glue pump distributes liquid, bubbles are easily generated when the liquid flows in the pump body, thereby affecting the glue coating accuracy. Summary of the invention

[0004] The object of the present invention is to provide a liquid dispensing system and a liquid dispensing method, which can remove bubbles in the liquid during the liquid dispensing process and improve the accuracy of wafer glue coating.

[0005] To achieve the above-mentioned object, in a first aspect, the present invention provides a liquid dispensing system, comprising a nozzle, a liquid supply device and a liquid dispensing device;

[0006] The liquid supply device is connected to the liquid dispensing device and is used to deliver liquid to the liquid dispensing device;

[0007] The liquid dispensing device comprises a liquid dispensing mechanism and a gas exhaust mechanism. The liquid dispensing mechanism is connected to the nozzle and is used to discharge the liquid from the nozzle. The gas exhaust mechanism is used to discharge bubbles in the liquid.

[0008] In some embodiments, the liquid dispensing mechanism includes a pumping device and a first liquid buffer;

[0009] The first liquid buffer is connected to the pumping device, and the pumping device is connected to the nozzle. The pumping device is used to suck the liquid in the first liquid buffer into the pumping device and discharge it from the nozzle.

[0010] In some embodiments, the liquid dispensing mechanism further comprises a filter;

[0011] The liquid supply device is connected to the first liquid buffer through the filter, and the filter is used to filter impurities in the liquid.

[0012] In some embodiments, the liquid dispensing mechanism further comprises a controller and a flow sensor;

[0013] The flow sensor is arranged on the first pipeline connecting the nozzle and the pumping device, and is used to detect the flow value of the liquid;

[0014] The controller is electrically connected to the flow sensor and the pumping device, and the controller is used to control the movement of the pumping device so that the liquid is discharged from the nozzle at a uniform speed.

[0015] In some embodiments, the liquid dispensing mechanism further includes an on-off suckback valve electrically connected to the controller, and the on-off suckback valve is disposed in the first pipeline and close to the nozzle.

[0016] In some embodiments, the liquid dispensing mechanism further comprises a first valve, a second valve, a sixth valve, and a seventh valve electrically connected to the controller;

[0017] The first valve is disposed on the second pipeline connecting the liquid supply device and the filter, and is used to open and close the second pipeline;

[0018] The second valve is disposed on a third pipeline connecting the liquid supply device and the first liquid buffer, and one end of the third pipeline intersects with the second pipeline, and the intersection position is located between the liquid supply device and the first valve, and the second valve is used to open and close the third pipeline;

[0019] The sixth valve is disposed on the fourth pipeline connecting the first liquid buffer and the pumping device, and the sixth valve is used to open and close the fourth pipeline;

[0020] The seventh valve is disposed on the first pipeline and is located between the pumping device and the flow sensor. The seventh valve is used to open and close the first pipeline.

[0021] In some embodiments, the discharge mechanism includes a third valve, a fourth valve, and a fifth valve;

[0022] The filter is provided with a fifth pipeline, the fifth pipeline is used to discharge the gas in the filter, and the third valve is provided on the fifth pipeline to open and close the fifth pipeline;

[0023] The first liquid buffer is provided with a sixth pipeline, the sixth pipeline is used to discharge the gas in the first liquid buffer, and the fourth valve is provided on the sixth pipeline to open and close the sixth pipeline;

[0024] A seventh pipeline for exhaust is also connected between the first liquid buffer and the pumping device, and the fifth valve is arranged on the seventh pipeline for opening and closing the seventh pipeline.

[0025] In some embodiments, the liquid dispensing mechanism also includes a first sensor provided on the first liquid buffer and a second sensor provided on the pumping device, the first sensor being used to detect the liquid level in the first liquid buffer, and the second sensor being used to detect the pressure in the pumping device.

[0026] In some embodiments, the liquid supply device includes a liquid supply tank, a second liquid buffer, and an eighth valve;

[0027] The liquid supply tank and the second liquid buffer are connected via an eighth pipeline, and the eighth valve is arranged on the eighth pipeline to control the on-off of the eighth pipeline.

[0028] In some embodiments, the liquid supply device further includes a ninth valve;

[0029] The second liquid buffer is connected to a ninth pipeline for discharging gas in the second liquid buffer. The ninth valve is disposed on the ninth pipeline for controlling the on-off of the ninth pipeline.

[0030] In a second aspect, an embodiment of the present invention provides a liquid dispensing method, which is applied to the liquid dispensing system, and the dispensing method includes:

[0031] Introducing the liquid in the liquid supply device into the liquid distribution device;

[0032] The liquid dispensing device filters and exhausts the liquid and then discharges the liquid through the nozzle.

[0033] In some embodiments, after filtering and exhausting the liquid and discharging the liquid through the nozzle, the liquid dispensing device further comprises:

[0034] The liquid remaining in the liquid dispensing device is introduced into the liquid supply device.

[0035] The liquid dispensing system and the liquid dispensing method provided by the present invention have the beneficial effects of ensuring the efficiency of wafer coating, removing bubbles in the liquid during the liquid dispensing process, and improving the accuracy of wafer coating. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 A schematic diagram of a liquid dispensing system according to an embodiment of the present invention;

[0037] Figure 2 A detailed diagram of a liquid dispensing device according to an embodiment of the present invention;

[0038] Figure 3 A detailed diagram of the gluing assembly of the embodiment provided by the present invention;

[0039] Figure 4 A detailed diagram of a liquid supply device according to an embodiment of the present invention;

[0040] Figure 5 This is a flow chart of a method for dispensing liquid according to an embodiment of the present invention.

[0041] Reference numerals:

[0042] Liquid supply device 1, liquid supply tank 110, second liquid buffer 120, liquid dispensing device 2, pumping device 210, first liquid buffer 220, filter 230, controller 240, flow sensor 250, on-off sucking back valve 260, first sensor 270, second sensor 280, nozzle 3, glue coating assembly 4, supporting platform 410, motor 420, protective shell 430, first pipeline 501, second pipeline 502, third pipeline 503, fourth pipeline 504, fifth pipeline 505, sixth pipeline 506, seventh pipeline 507, eighth pipeline 508, ninth pipeline 509. DETAILED DESCRIPTION

[0043] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0044] In view of the problems existing in the prior art, an embodiment of the present invention provides a liquid dispensing system, referring to Figure 1 and Figure 2As shown, the liquid distribution system includes a nozzle 3, a liquid supply device 1, a liquid distribution device 2 and a glue coating component 4. The liquid supply device 1 is connected to the liquid distribution device 2, and the liquid supply device 1 is used to provide the collected liquid to the liquid distribution device 2. The liquid distribution device 2 includes a liquid distribution mechanism and a gas exhaust mechanism. The liquid distribution mechanism is connected to the nozzle 3, and is used to discharge the liquid from the nozzle 3 and distribute the liquid on the wafer. It can be understood that the nozzle 3 is arranged above the glue coating component 4, and the glue coating component 4 is used to place the wafer and can drive the wafer to rotate. The gas exhaust mechanism is used to discharge bubbles in the liquid. It should be noted that in this embodiment, the liquid is photoresist.

[0045] Specifically, refer to Figure 3 As shown, the glue coating assembly 4 includes a carrier 410 for placing wafers, and the carrier 410 is connected to the motor 420, and the motor 420 drives the carrier 410 to rotate. A protective shell 430 is provided around the carrier 410 to prevent liquid from splashing.

[0046] In some embodiments, reference Figure 2 As shown, the liquid dispensing mechanism includes a pumping device 210 and a first liquid buffer 220. The first liquid buffer 220 is connected to the pumping device 210, and the pumping device 210 is connected to the nozzle 3. The pumping device 210 is used to pump the liquid in the first liquid buffer 220 into the pumping device 210 and discharge it from the nozzle 3.

[0047] In this embodiment, reference Figure 2 As shown, the first liquid buffer 220 may be a container for storing liquid. The pumping device 210 may provide pressure for each connecting pipeline in the distribution system to achieve the suction and distribution of the liquid.

[0048] In some embodiments, reference Figure 2 As shown, the liquid dispensing mechanism further includes a filter 230. The liquid supply device 1 is connected to the first liquid buffer 220 via the filter 230, and the filter 230 is used to filter impurities in the liquid, thereby improving the coating accuracy of the wafer.

[0049] In some embodiments, reference Figure 2As shown, the liquid dispensing mechanism further includes a controller 240 and a flow sensor 250, and the controller 240 is electrically connected to the flow sensor 250 and the pumping device 210. The flow sensor 250 is disposed on the first pipeline 501 connecting the nozzle 3 and the pumping device 210, and the flow sensor 250 is used to detect the flow value of the liquid in the first pipeline 501. The controller 240 is used to control the movement of the pumping device 210 so that the liquid is discharged from the nozzle 3 at a uniform speed, thereby ensuring the stability of the liquid during distribution.

[0050] refer to Figure 2 As shown, in some embodiments, the liquid dispensing mechanism further includes an on-off re-sucking valve 260 electrically connected to the controller 240, and the on-off re-sucking valve 260 is disposed in the first pipeline 501 and close to the nozzle 3. The on-off re-sucking valve 260 may be pneumatically controlled or electrically controlled, and by arranging the on-off re-sucking valve 260 close to the nozzle 3, it is ensured that the corresponding flow path can be opened in time before liquid dispensing, and the liquid is sucked back after dispensing to ensure that no drips are left at the nozzle 3.

[0051] Continue to refer Figure 2 In some embodiments, the liquid dispensing mechanism further includes a first valve (V1), a second valve (V2), a sixth valve (V6), and a seventh valve (V7) electrically connected to the controller 240. The first valve (V1) is provided on the second pipeline 502 connecting the liquid supply device 1 and the filter 230, and is used to open and close the second pipeline 502. The second valve (V2) is provided on the third pipeline 503 connecting the liquid supply device 1 and the first liquid buffer 220, and one end of the third pipeline 503 intersects with the second pipeline 502, and the intersection position is located between the liquid supply device 1 and the first valve (V1), and the second valve (V2) is used to open and close the third pipeline 503. The sixth valve (V6) is provided on the fourth pipeline 504 connecting the first liquid buffer 220 and the pumping device 210, and the sixth valve (V6) is used to open and close the fourth pipeline 504. The seventh valve ( V7 ) is disposed on the first pipeline 501 and is located between the pumping device 210 and the flow sensor 250 . The seventh valve ( V7 ) is used to open and close the first pipeline 501 .

[0052] refer to Figure 2As shown, in some embodiments, the discharge mechanism includes a third valve (V3), a fourth valve (V4) and a fifth valve (V5). The filter 230 is provided with a fifth pipeline 505, the fifth pipeline 505 is used to discharge the gas in the filter 230, the third valve (V3) is provided on the fifth pipeline 505 to open and close the fifth pipeline 505, the first liquid buffer 220 is provided with a sixth pipeline 506, the sixth pipeline 506 is used to discharge the gas in the first liquid buffer 220, the fourth valve (V4) is provided on the sixth pipeline 506 to open and close the sixth pipeline 506. The first liquid buffer 220 and the pumping device 210 are also connected to a seventh pipeline 507 for exhaust, and the fifth valve (V5) is provided on the seventh pipeline 507 to open and close the seventh pipeline 507.

[0053] In some embodiments, the liquid dispensing mechanism further includes a first sensor 270 disposed on the first liquid buffer 220 and a second sensor 280 disposed on the pumping device 210, wherein the first sensor 270 is used to detect the liquid level in the first liquid buffer 220, and to timely detect whether the target liquid level is reached in the first liquid buffer 220. The second sensor 280 is used to detect the pressure in the pumping device 210, and feed the detected pressure value back to the controller 240, and the controller 240 controls the switch of the pumping device 210 according to the pressure value.

[0054] In some embodiments, reference Figure 1 and Figure 4 As shown, the liquid supply device 1 includes a liquid supply tank 110, a second liquid buffer 120 and an eighth valve (V8). The liquid supply tank 110 and the second liquid buffer 120 are connected through an eighth pipeline 508, and the eighth valve (V8) is arranged on the eighth pipeline 508 to control the on-off of the eighth pipeline 508.

[0055] In addition, the liquid supply device 1 also includes a ninth valve (V9), and a ninth pipeline 509 is connected to the second liquid buffer 120. The ninth pipeline 509 is used to discharge the gas in the second liquid buffer 120. The ninth valve (V9) is arranged on the ninth pipeline 509 to control the on and off of the ninth pipeline 509.

[0056] It should be noted that the first liquid buffer 220 and the second liquid buffer 120 are connected through the third pipeline 503, and the first liquid buffer 220 and the second liquid buffer 120 are also connected through the second pipeline 502. Therefore, the second pipeline 502 and the third pipeline 503 form a loop, and the first liquid buffer 220 and the second liquid buffer 120 can introduce liquid into each other.

[0057] Based on the liquid dispensing system disclosed in the above embodiment, the present invention further discloses a dispensing method applicable to the above liquid dispensing system, the dispensing method comprising:

[0058] S501: introducing the liquid in the liquid supply device into the liquid distribution device.

[0059] S502: the liquid dispensing device filters and exhausts the liquid and then discharges the liquid through the nozzle.

[0060] S503: introducing the liquid remaining in the liquid dispensing device into the liquid supply device.

[0061] For ease of understanding, the dispensing method in this embodiment is described in conjunction with the liquid dispensing system.

[0062] Combination Figures 1 to 4 As shown, in S501, the first valve (V1) in the second pipeline 502, the fifth valve (V5) in the seventh pipeline 507, and the ninth valve (V9) in the second liquid buffer 120 are all opened, and the remaining valves are closed. Then the pumping device 210 is operated to make the liquid flow from the liquid supply device 1 into the first liquid buffer 220. This stage is the liquid backfilling stage.

[0063] In order to ensure that the influence of bubbles is reduced as much as possible during the liquid distribution process, in this embodiment, after the liquid is distributed into the first liquid buffer 220, the liquid is allowed to fully stand inside the first liquid buffer to reduce the bubbles in the liquid.

[0064] When the liquid in the first liquid buffer 220 reaches the target value, the first valve (V1) and the ninth valve (V9) are closed, and the fourth valve (V4) and the fifth valve (V5) are kept open. The gas inside the first liquid buffer 220 is discharged under the operation of the pumping device 210. This stage is the exhaust stage.

[0065] During the above-mentioned liquid backfilling stage and exhaust stage, the first sensor 270 will continuously detect the liquid level in the first liquid buffer 220. If the first sensor 270 is not triggered, a signal will be fed back to the controller 240, and the controller 240 will issue instructions to the pumping device 210 to repeatedly perform the liquid backfilling stage and the exhaust stage in sequence until the first sensor 270 detects the corresponding liquid level height (target value), stops the liquid backfilling operation, and exhausts the gas in the pumping device 210.

[0066] When the exhaust stage is completed, the first valve (V1), the sixth valve (V6) and the ninth valve (V9) are opened, and the remaining valves are closed. Then the pumping device 210 moves to suck the liquid in the pipeline. This stage is the suction stage.

[0067] Under the suction operation, the liquid from the second liquid buffer 120 passes through the second pipeline 502, the filter 230, the first liquid buffer 220 and the fourth pipeline 504 in sequence, and finally enters the pumping device 210. Then, the first valve (V1), the sixth valve (V6) and the ninth valve (V9) are closed, and the pumping device 210 stops moving, completing the liquid suction operation.

[0068] Thereafter, the first valve (V1), the second valve (V2), the third valve (V3) and the fifth valve (V5) are opened, and the remaining valves are closed. The pumping device 210 moves to discharge bubbles again, and after completion, all valves are closed to enter the next stage.

[0069] The seventh valve (V7) is opened while the other valves are closed, and the pumping device 210 delivers the liquid inside to the first pipeline 501, and the liquid flows through the flow sensor 250 and the on-off suckback valve 260 in sequence and is finally pushed to the nozzle 3. Then, the liquid is discharged from the nozzle 3 onto the wafer on the carrier 410 to perform the spin coating process.

[0070] It should be noted that when the liquid enters the first pipeline 501 under the push of the pumping device 210, the second sensor 280 will detect the pressure in this process in real time and feed back the detection result to the controller 240 in real time. The controller 240 calculates whether the pressure change of this process is within the allowable range based on the received pressure signal. If the calculated difference exceeds the allowable range, the controller 240 will adjust the distribution speed of the pumping device 210 in real time to ensure the pressure stability of the entire distribution process.

[0071] In addition, when the pumping device 210 is running to distribute liquid, due to the opening of the seventh valve (V7), the volume in the first pipeline 501 increases. Assuming that the increase is A ml, the internal pressure of the first pipeline 501 will decrease. This causes the liquid column in the nozzle 3 to flow back due to the pressure difference between the inside and outside of the first pipeline 501 at the moment the seventh valve (V7) is opened. In order to compensate for the pressure difference caused by the change in pipeline volume, a corresponding pressure compensation method is also proposed in the embodiment disclosed in the present invention, that is, before the seventh valve (V7) is opened, the pumping device 210 pre-dispenses a certain amount of liquid, and the distribution amount is B ml. It is necessary to ensure that A=B, so that the pressure difference caused by the volume change can be eliminated.

[0072] When the wafer coating process is completed, the second valve (V2), the sixth valve (V6), the seventh valve (V7) and the ninth valve (V9) are opened, and the remaining valves are closed. Therefore, the remaining liquid from the first liquid buffer 220 is pushed and finally pushed back to the second liquid buffer 120 through the third pipeline 503 and the fourth pipeline 504. This stage is a purification stage for performing liquid return.

[0073] Specifically, during the purification stage, part of the liquid in the liquid dispensing device 2 will return to the second liquid buffer 120 located upstream. After the backfilling stage and the exhaust stage are completed, a certain amount of liquid will be filled in the first liquid buffer 220, but the liquid in the first liquid buffer 220 needs to be distributed multiple times to be completely updated to new liquid, which causes part of the liquid to stay in the first liquid buffer 220 for a long time, and the quality of the liquid is easily degraded. In addition, the long stay will also cause the material in the first liquid buffer 220 to precipitate and mix with the liquid. Therefore, the embodiment of the present invention repeatedly pushes the liquid in the first liquid buffer 220 back to the second liquid buffer 120 upstream, and when the backfilling stage of the next cycle is carried out, the liquid pushed to the upstream can be filtered again by the filter 230 and then transported to the first liquid buffer 220, so as to ensure that the liquid is filtered multiple times and that the liquid coated on the surface of the wafer does not contain impurities and bubbles.

[0074] Furthermore, when in the suction stage, the pumping device 210 performs a suction operation on the liquid. Assuming that the suction volume is C ml, the amount of liquid discharged to the outside by the pumping device 210 in the exhaust stage after the suction stage is D ml, the amount of liquid used for wafer surface coating in the distribution stage is E ml, and the amount of liquid used to return to the second liquid buffer at the upstream end in the purification stage is F ml, then: C=D+E+F.

[0075] It can be understood that the amount of liquid discharged by the pumping device 210 in the exhaust phase after the suction phase is D ml, which is the smallest, so the following relationship exists:

[0076] E>D, F>D

[0077] Furthermore, the amount of liquid E used to coat the wafer surface is greater than the amount of liquid F used to return to the upstream end, that is:

[0078] E>F>D

[0079] Therefore, the liquid remaining in the third pipeline 503 will all pass through the filter 230 again after n cycles, so that the liquid sucked in the suction stage of the next cycle after the purification stage is filtered multiple times, ensuring that there is no interference such as particles and bubbles in the liquid. Assuming that the volume of the third pipeline 503 is G ml, it holds that: n = G / F.

[0080] The above is only a specific implementation of the embodiment of the present application, but the protection scope of the embodiment of the present application is not limited thereto, and any changes or replacements within the technical scope disclosed in the embodiment of the present application should be included in the protection scope of the embodiment of the present application. Therefore, the protection scope of the embodiment of the present application should be based on the protection scope of the claims.

Claims

1. A liquid dispensing system, characterized in that: It includes a nozzle, a liquid supply device and a liquid distribution device; The liquid supply device is connected to the liquid dispensing device and is used to deliver liquid to the liquid dispensing device; The liquid dispensing device comprises a liquid dispensing mechanism and a gas exhaust mechanism. The liquid dispensing mechanism is connected to the nozzle and is used to discharge the liquid from the nozzle. The gas exhaust mechanism is used to discharge bubbles in the liquid.

2. The liquid dispensing system according to claim 1, characterized in that: The liquid dispensing mechanism includes a pumping device and a first liquid buffer; The first liquid buffer is connected to the pumping device, and the pumping device is connected to the nozzle. The pumping device is used to suck the liquid in the first liquid buffer into the pumping device and discharge it from the nozzle.

3. The liquid dispensing system according to claim 2, characterized in that: The liquid dispensing mechanism further comprises a filter; The liquid supply device is connected to the first liquid buffer through the filter, and the filter is used to filter impurities in the liquid.

4. The liquid dispensing system according to claim 3, characterized in that: The liquid dispensing mechanism also includes a controller and a flow sensor; The flow sensor is arranged on the first pipeline connecting the nozzle and the pumping device, and is used to detect the flow value of the liquid; The controller is electrically connected to the flow sensor and the pumping device, and the controller is used to control the movement of the pumping device so that the liquid is discharged from the nozzle at a uniform speed.

5. The liquid dispensing system according to claim 4, characterized in that: The liquid dispensing mechanism further comprises an on-off suckback valve electrically connected to the controller, wherein the on-off suckback valve is arranged in the first pipeline and close to the nozzle.

6. The liquid dispensing system according to claim 5, characterized in that: The liquid dispensing mechanism further comprises a first valve, a second valve, a sixth valve and a seventh valve electrically connected to the controller; The first valve is disposed on the second pipeline connecting the liquid supply device and the filter, and is used to open and close the second pipeline; The second valve is disposed on a third pipeline connecting the liquid supply device and the first liquid buffer, and one end of the third pipeline intersects with the second pipeline, and the intersection position is located between the liquid supply device and the first valve, and the second valve is used to open and close the third pipeline; The sixth valve is disposed on the fourth pipeline connecting the first liquid buffer and the pumping device, and the sixth valve is used to open and close the fourth pipeline; The seventh valve is disposed on the first pipeline and is located between the pumping device and the flow sensor. The seventh valve is used to open and close the first pipeline.

7. The liquid dispensing system according to claim 6, characterized in that: The discharge mechanism includes a third valve, a fourth valve and a fifth valve; The filter is provided with a fifth pipeline, the fifth pipeline is used to discharge the gas in the filter, and the third valve is provided on the fifth pipeline to open and close the fifth pipeline; The first liquid buffer is provided with a sixth pipeline, the sixth pipeline is used to discharge the gas in the first liquid buffer, and the fourth valve is provided on the sixth pipeline to open and close the sixth pipeline; A seventh pipeline for exhaust is also connected between the first liquid buffer and the pumping device, and the fifth valve is arranged on the seventh pipeline for opening and closing the seventh pipeline.

8. The liquid dispensing system according to claim 4, characterized in that: The liquid dispensing mechanism also includes a first sensor arranged on the first liquid buffer and a second sensor arranged on the pumping device, the first sensor is used to detect the liquid level in the first liquid buffer, and the second sensor is used to detect the pressure in the pumping device.

9. The liquid dispensing system according to claim 1, characterized in that: The liquid supply device comprises a liquid supply tank, a second liquid buffer and an eighth valve; The liquid supply tank and the second liquid buffer are connected via an eighth pipeline, and the eighth valve is arranged on the eighth pipeline to control the on-off of the eighth pipeline.

10. The liquid dispensing system according to claim 9, characterized in that: The liquid supply device also includes a ninth valve; The second liquid buffer is connected to a ninth pipeline for discharging gas in the second liquid buffer. The ninth valve is disposed on the ninth pipeline for controlling the on-off of the ninth pipeline.

11. A method for dispensing a liquid, characterized in that: The liquid dispensing system according to any one of claims 1 to 10, wherein the dispensing method comprises: Introducing the liquid in the liquid supply device into the liquid distribution device; The liquid dispensing device filters and exhausts the liquid and then discharges the liquid through the nozzle.

12. The liquid dispensing method according to claim 11, characterized in that: After the liquid dispensing device filters and exhausts the liquid and discharges the liquid through the nozzle, it also includes: The liquid remaining in the liquid dispensing device is introduced into the liquid supply device.

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