Assembly equipment and assembly method

Abstract

The present invention relates to an assembly device and an assembly method for assembling an adsorption pad and a pressure ring on a polishing head. The assembly device includes: an adsorption head for adsorbing the adsorption pad; a carrier plate for carrying the pressure ring; a first movement control structure for controlling the relative movement of the adsorption head and / or the carrier plate so that the adsorption pad is attached to the pressure ring; and a pressing structure including a pressing roller for pressing the adsorption pad and the pressure ring after the adsorption pad is attached to the pressure ring. The assembly device provided by the present invention can realize automatic posting of the adsorption pad and the rubber pressure ring, save human resources, improve the accuracy of posting of the adsorption pad and the rubber pressure ring, and improve efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor product manufacturing, and in particular to an assembly device and an assembly method. Background Art

[0002] The polishing machine requires regular replacement of consumable spare parts, such as the TA (wafer adsorption pad) and PAD (abrasive pad). Replacing the adsorption pad is labor-intensive: the pad is attached to a rubber pressure ring (consisting of a rubber membrane and a retaining ring surrounding the rubber membrane) before being installed on the polishing head. Therefore, the replacement process requires a series of steps, including removing the rubber pressure ring, removing the original adsorption pad, and attaching a new one, resulting in high labor costs.

[0003] The placement of the suction pad requires precision: The placement of the suction pad requires certain skills from the operator. The process involves placing the rubber pressure ring after the suction pad is removed into a dedicated placement mold, and then cleaning and applying the adhesive to the surface of the rubber pressure ring. Because the suction pad is smaller than the rubber pressure ring and the surface flatness of the rubber pressure ring is very high, manual placement can cause the suction pad to shift in position and the rubber pressure ring to be unevenly cleaned, leading to bubbles. This can cause equipment failure after installation, affecting production efficiency. Summary of the Invention

[0004] In order to solve the above technical problems, the present invention provides an assembly device and an assembly method to solve the problem of poor pasting when the adsorption pad and the rubber pressure ring are pasted together.

[0005] In order to achieve the above-mentioned purpose, the technical solution adopted in the embodiment of the present invention is: an assembly device for assembling an adsorption pad and a pressure ring on a polishing head, comprising:

[0006] an adsorption head, used for adsorbing the adsorption pad;

[0007] A carrying plate, used for carrying the pressure ring;

[0008] a first movement control structure, configured to control the relative movement of the adsorption head and / or the carrier plate so that the adsorption pad is attached to the pressure ring;

[0009] The pressing structure includes a pressing roller, which is used to press the adsorption pad and the pressing ring after the adsorption pad is attached to the pressing ring.

[0010] Optionally, the adsorption head includes an adsorption chamber and an adsorption surface communicating with the adsorption chamber;

[0011] The adsorption chamber is connected to the vacuum equipment through a vacuum pipeline so that the adsorption surface can be converted between a first state and a second state. In the first state, the adsorption surface is recessed toward the interior of the adsorption chamber to adsorb the adsorption pad. In the second state, the adsorption surface protrudes in a direction away from the adsorption chamber to fit with the pressure ring.

[0012] Optionally, the adsorption chamber has an opening, an elastic metal sheet is provided at the opening, and the elastic metal sheet serves as the adsorption surface.

[0013] Optionally, the carrying plate includes a first carrying platform and a second carrying platform located on the first carrying platform, and the area of ​​the second carrying platform is smaller than the area of ​​the first carrying platform, so that the pressure ring can be mounted on the outside of the second carrying platform.

[0014] Optionally, a foreign body detection structure is also included, including:

[0015] An image acquisition unit, configured to scan and detect the surface of the pressure ring carried on the carrying plate;

[0016] The processing unit is used to determine whether there is foreign matter on the surface of the pressure ring according to the image acquired by the image acquisition unit.

[0017] Optionally, the image acquisition unit includes a laser sensor, and the foreign matter detection structure further includes:

[0018] The moving unit is used to control the rotation of the carrier plate to drive the rotation of the pressure ring during the scanning process of the image acquisition unit.

[0019] Optionally, the foreign object detection structure includes a support rod and a support ring, the support ring is supported on the support rod, and the image acquisition unit is provided on the support ring.

[0020] Optionally, a cleaning structure is further included, for cleaning the pressure ring when the foreign matter detection structure detects a foreign matter.

[0021] Optionally, the cleaning structure includes:

[0022] a nozzle, for spraying a cleaning liquid onto the surface of the pressure ring;

[0023] The air knife is used to spray clean dry air toward the pressure ring.

[0024] Optionally, a second movement control structure is further included, including:

[0025] A first moving part is used to transport the adsorption pad to a first position to be adsorbed by the adsorption head;

[0026] The second moving part is used to transport the pressure ring to a second position to be carried by the carrying plate.

[0027] The present invention also provides an assembly method for assembling an adsorption pad and a pressure ring of a polishing head using the above-mentioned assembly equipment, comprising:

[0028] Adsorbing the adsorption pad through an adsorption head and carrying the pressure ring through a carrying plate;

[0029] Controlling the relative movement of the adsorption head and / or the carrier plate so that the adsorption pad is attached to the pressure ring;

[0030] The fitted adsorption pad and the pressure ring are pressed together by a pressing structure.

[0031] The beneficial effects of the present invention are: through the assembly equipment provided by the present invention, the automatic posting of the adsorption pad and the rubber pressure ring is realized, human resources are saved, and the accuracy of posting of the adsorption pad and the rubber pressure ring is improved, thereby improving efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A schematic diagram showing the relative positional relationship among the adsorption head, the carrier plate, and the foreign matter detection structure in an embodiment of the present invention;

[0033] Figure 2 A schematic diagram showing the relative positional relationship between the fitting area and the pressing area;

[0034] Figure 3 Schematic diagram showing an adsorption head;

[0035] Figure 4 A schematic diagram showing the adsorption head in a first state;

[0036] Figure 5 A schematic diagram showing the adsorption head in a second state;

[0037] Figure 6 a schematic diagram showing a first moving portion;

[0038] Figure 7 A schematic diagram showing a conveyor belt;

[0039] Figure 8 A schematic diagram showing a detection state of a foreign body detection structure performing detection;

[0040] Figure 9 Schematic diagram showing the adsorption pad and pressure ring after attachment. DETAILED DESCRIPTION

[0041] To make the purpose, technical solutions, and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0042] Unless otherwise defined, the technical or scientific terms used in this disclosure should have the usual meanings understood by people with ordinary skills in the field to which this disclosure belongs. The words "first", "second" and similar words used in this disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, words such as "one", "an" or "the" do not indicate a quantity limitation, but rather indicate the existence of at least one. Words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0043] As used in the embodiments of the present disclosure, the terms "parallel," "perpendicular," and "identical" include the strict sense of "parallel," "perpendicular," and "identical," as well as "approximately parallel," "approximately perpendicular," and "approximately identical" with respect to a certain tolerance, which, taking into account the tolerances associated with the measurement of a particular quantity (e.g., limitations of the measurement system), means within an acceptable range of deviation for a particular value as determined by one of ordinary skill in the art. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the stated value.

[0044] In the silicon wafer production process, final polishing (FP) is the final step in controlling wafer flatness and roughness parameters. This process removes defects from previous processes and achieves a mirror-like finish by removing a certain amount of surface roughness from the wafer.

[0045] Conventional FP operations involve bringing a polishing head loaded with a silicon wafer into contact with the surface of a polishing pad attached to a lower platen. Colloidal slurry supplied through a slurry tube reacts with chemicals on the silicon wafer surface, and the wafer is polished due to the physical reaction induced by mechanical pressure.

[0046] To ensure polishing quality, the adsorption pad on the polishing head (including a deformable adsorption film and a hard ring surrounding the adsorption film) needs to be replaced regularly. However, the adsorption pad is attached to the pressure ring (including an elastic film (such as a rubber film) and a hard ring surrounding the elastic film) before being installed on the polishing head. Since the adsorption pad is smaller than the pressure ring and requires a high level of surface flatness, manual attachment can cause the adsorption pad to shift in position and the pressure ring surface to be unevenly cleaned, leading to bubbles. This can cause equipment malfunctions after use, affecting production efficiency.

[0047] refer to Figures 1-9 To address the above issues, this embodiment provides an assembly device for assembling the adsorption pad 200 and the pressure ring 100 on a polishing head. This device automatically attaches the adsorption pad 200 and the pressure ring 100, reducing labor costs. It also improves the accuracy and quality of the attachment of the adsorption pad 200 and the pressure ring 100, preventing equipment malfunctions after installation. It also reduces spare parts consumption and the time required to replace spare parts, improving efficiency.

[0048] Specifically, the assembly equipment provided in this embodiment includes:

[0049] An adsorption head 1, used for adsorbing the adsorption pad 200;

[0050] A carrying plate 2, used for carrying the pressure ring 100;

[0051] a first movement control structure for controlling the relative movement of the adsorption head 1 and / or the carrier plate 2 so that the adsorption pad 200 is attached to the pressure ring 100;

[0052] The pressing structure includes a pressing roller 51 for pressing the adsorption pad 200 and the pressing ring 100 after the adsorption pad 200 is attached to the pressing ring 100 .

[0053] In an exemplary embodiment, the adsorption head 1 includes a main body, an adsorption chamber is provided in the main body, and the adsorption chamber is connected to an external vacuum device via a vacuum line 12 to realize the operation of evacuating and inflating the adsorption chamber. The adsorption end of the main body is provided with an adsorption surface 101 connected to the adsorption chamber, and the adsorption surface 101 is switched between a first state and a second state by evacuating or inflating the air through the vacuum line 12. In the first state, the air is evacuated through the vacuum line 12, and the adsorption surface 101 is recessed toward the interior of the adsorption chamber to adsorb the adsorption pad 200. Figure 4 In the second state, the vacuum pipe 12 is inflated, and the adsorption surface 101 protrudes away from the adsorption chamber. Figure 5 , in conjunction with a certain degree of pressing operation between the adsorption head 1 and the carrier plate 2, the adsorption pad 200 is fitted with the pressure ring 100.

[0054] In an exemplary embodiment, the adsorption chamber has an opening, and an elastic metal sheet is provided at the opening, and the elastic metal sheet serves as the adsorption surface 101 .

[0055] The elastic metal sheet may be a thin sheet fixed on the side wall of the opening.

[0056] The elastic metal sheet may include a bottom sheet and side sheets located around the bottom sheet, and the side sheets are fixed around the opening.

[0057] The elastic metal sheet can be made of a thin iron sheet or aluminum sheet, etc., and there is no limitation here. The thickness of the metal sheet can also be set according to actual needs, as long as it can be deformed to a preset shape under the action of the vacuum or inflation operation through the vacuum pipeline 12.

[0058] In an exemplary embodiment, the adsorption surface 101 can be a side surface of the adsorption chamber, that is, the adsorption surface 101 and the adsorption chamber are an integrated structure, and by reducing the thickness of the side surface of the adsorption chamber located at the adsorption end, the side surface can be reused as the adsorption surface 101.

[0059] In an exemplary embodiment, the supporting plate 2 includes a first supporting platform 21 and a second supporting platform 22 located on the first supporting platform 21. The area of ​​the second supporting platform 22 is smaller than the area of ​​the first supporting platform 21, so that the pressure ring 100 can be mounted on the outside of the second supporting platform 22.

[0060] The shape of the second carrier platform 22 is consistent with the shape of the pressure ring 100, and when the pressure ring 100 is mounted on the second carrier platform 22, the pressure ring 100 is in close contact with the second carrier platform 22. The pressure ring 100 is mounted around the second carrier platform 22, which can keep the pressure ring 100 in a tensioned state and avoid the generation of bubbles when attached to the adsorption pad 200.

[0061] In an exemplary embodiment, the bearing surface of the second bearing platform 22 is a convex surface that protrudes in the direction away from the first bearing platform, which not only has the effect of stably bearing the pressure ring 100, but also the setting of the convex surface can make the elastic surface of the pressure ring 100 subject to stable tension, so that the elastic surface will not appear concave or convex during the pasting operation with the adsorption pad 200.

[0062] Exemplarily, a support column is provided at the bottom of the carrying plate 2 for supporting the carrying plate 2 .

[0063] In an exemplary embodiment, the assembly equipment further includes a foreign body detection structure, including:

[0064] An image acquisition unit, configured to scan and detect the surface of the pressure ring 100 carried on the carrying plate;

[0065] The processing unit is used to determine whether there is foreign matter on the surface of the pressure ring 100 according to the image acquired by the image acquisition unit.

[0066] Move the carrying plate 2 or move the foreign object detection structure so that the carrying plate 2 drives the pressure ring 100 thereon to move to a preset position, so that the pressure ring 100 is located within the scanning detection range of the image acquisition unit, and scan the surface of the pressure ring 100 (the surface is the attachment surface for attaching to the adsorption pad 200) through the image acquisition unit to obtain an image of the pressure ring 100, and analyze and process the image through the processing unit to determine whether there is foreign matter on the surface of the pressure ring 100.

[0067] The image acquisition unit may be a laser sensor 301 , but is not limited thereto.

[0068] In the embodiment where the image unit adopts the laser sensor 301, the foreign matter detection structure further includes:

[0069] The moving unit is used to control the rotation of the carrier plate 2 to drive the pressure ring 100 to rotate during the scanning process of the image acquisition unit.

[0070] The moving unit controls the carrier plate 2 to rotate so that the laser sensor 301 can fully scan the pressure ring 100 .

[0071] Exemplarily, the number of the laser sensors 301 can be set according to actual needs. In some embodiments, the number of the laser sensors 301 is two, and when performing an image scan on the pressure ring 100, the two laser sensors 301 are symmetrically arranged on opposite sides of the pressure ring 100. In this way, the supporting plate 2 can complete a comprehensive scan of the pressure ring 100 by rotating one circle.

[0072] In an exemplary embodiment, the foreign matter detection structure includes a support rod 303 and a support ring 302 . The support ring 302 is supported on the support rod 303 , and the image acquisition unit is disposed on the support ring 302 .

[0073] In some embodiments, two laser sensors 301 are symmetrically arranged on the support ring 302. Figure 8 .

[0074] The area of ​​the support ring 302 is larger than the area of ​​the first supporting platform 21 , so that the supporting plate 2 can be located inside the support ring 302 , so that the supporting plate 2 can be located between the two laser sensors 301 , so that the two laser sensors 301 can scan the pressure ring 100 .

[0075] In some embodiments, in order to facilitate scanning of the pressure ring 100, before starting the scan, the pressure ring 100 needs to be located within the detection area of ​​the laser sensor 301, for example, the vertical distance between the surface of the pressure ring 100 and the center line of the laser beam of the laser sensor 301 is less than or equal to 2 mm.

[0076] In an exemplary embodiment, the assembly equipment further includes a cleaning structure for cleaning the pressure ring 100 when the foreign matter detection structure detects a foreign matter.

[0077] In an exemplary embodiment, the cleaning structure includes:

[0078] A nozzle, used for spraying a cleaning liquid onto the surface of the pressure ring 100;

[0079] The air knife is used to spray clean dry air toward the pressure ring 100 .

[0080] When the foreign matter detection structure detects that there is foreign matter on the surface of the pressure ring 100, such as residual glue, high-pressure cleaning liquid is sprayed toward the pressure ring 100 through the nozzle to clean the surface of the pressure ring 100. After cleaning, high-pressure clean dry air is blown by the air knife to dry the pressure ring 100.

[0081] For example, the pressing ring 100 may be repeatedly cleaned and dried multiple times to effectively clean the pressing ring 100 .

[0082] For example, after cleaning the pressure ring 100, the pressure ring 100 needs to be inspected again by the foreign matter detection structure until no foreign matter is detected on the surface of the pressure ring 100, thereby ensuring the cleanliness of the surface of the pressure ring 100 and ensuring the quality of attachment to the adsorption pad 200.

[0083] Illustratively, the cleaning liquid sprayed by the nozzle may be ultrapure water, but is not limited thereto.

[0084] Exemplarily, a plurality of the nozzles and a plurality of the air knives may be provided to improve cleaning efficiency.

[0085] In an exemplary embodiment, the first movement control structure can independently control the movement of the adsorption head 1 and the carrying plate 2, or simultaneously control the movement of the adsorption head 1 and the carrying plate 2, as long as the positioning and pressing of the carrying plate 2 and the adsorption head 1 can be achieved to achieve the attachment of the adsorption pad 200 and the pressure ring 100.

[0086] Exemplarily, the first movement control structure may include a lifting cylinder for controlling the lifting and lowering of the adsorption head 1 and / or the carrying plate 2, but is not limited thereto.

[0087] In an exemplary embodiment, the adsorption head 1 is located directly above the carrier plate 2, that is, the adsorption head 1 and the carrier plate 2 can be pre-aligned in the horizontal direction through a pre-alignment structure. In this way, when attaching, it is only necessary to move the adsorption head 1 or the carrier plate 2 in the vertical direction, and there is no need to re-align in the horizontal direction, thereby improving efficiency.

[0088] In an exemplary embodiment, in the initial state, that is, before the attachment work, the foreign object detection structure is located between the adsorption head 1 and the carrier plate 2. At this time, the carrier plate 2 rises to a preset position to complete foreign object detection, and then continues to rise to complete the attachment process.

[0089] In the embodiment where the adsorption head 1 is located directly above the carrier plate 2, the assembly device further includes a second movement control structure, including:

[0090] The first moving portion 41 is used to transport the adsorption pad 200 to a first position to be adsorbed by the adsorption head 1; the first position is directly below the adsorption head 1 to facilitate adsorption of the adsorption pad 200;

[0091] The second moving portion 42 is used to transfer the pressure ring 100 to a second position to be carried by the carrier plate 2 . The second position is directly above the carrier plate 2 , so that the carrier plate 2 can rise and fix the pressure ring 100 .

[0092] refer to Figure 1 、 Figure 6 and Figure 7 The first moving part 41 includes a set of clamping claws (refer to Figure 1 The first gripper 402 in the embodiment of the present invention controls the conveyor belt (reference Figure 1 The first conveyor belt 401 in the embodiment of the present invention is provided, and a cylinder 4001 ( Figure 7 The middle cylinder 4001 is meshed with the transmission gear 4002 through a gear), and the transmission belt is driven by the transmission gear 4002 to realize the position transmission of the clamping jaws. The cylinder 4001 realizes the opening and closing of the clamping jaws to clamp or release the adsorption pad 200.

[0093] The second moving part 42 can adopt the same structure as the first moving part 41, that is, it includes a set of clamping claws (refer to Figure 1 The second gripper 404 in the embodiment of the present invention controls the conveyor belt (reference Figure 1 The second conveyor belt 403 in the figure) and the cylinder for controlling the opening and closing of a group of the clamping jaws (moving toward or away from each other), the transmission belt is driven by the transmission gear 4002 to realize the position transmission of the clamping jaws, and the cylinder 4001 realizes the opening and closing of the clamping jaws to clamp or release the adsorption pad 200.

[0094] In an exemplary embodiment, the pressing structure includes a pressing roller 51, referring to Figure 2 After the adsorption pad and the pressure ring are bonded in the bonding area 10, they are transferred to the pressing area 20 for pressing by the pressing roller 51. This prevents the adsorption pad 200 from coming unglued due to the edge of the adsorption pad 200 or the overall pressing being not in place after the bonded adsorption pad 200 and the pressure ring 100 are installed on the polishing head.

[0095] The pressing roller 51 may be made of hard rubber and press the entire adsorption pad 200 without scratching the adsorption pad 200 .

[0096] Illustratively, after the adsorption pad 200 and the pressure ring 100 are bonded together, the first moving part 41 or the second moving part 42 can move the bonded adsorption pad 200 and the pressure ring 100 to a bonding process position, and the pressing operation can be performed by the pressing roller 51 .

[0097] For example, the adsorption pad 200 and the pressure ring 100 after bonding can also be transported by a separately provided movement control structure, which is not limited here.

[0098] The present invention also provides an assembly method for assembling the adsorption pad 200 and the pressure ring 100 of the polishing head using the above-mentioned assembly equipment, comprising:

[0099] The adsorption pad 200 is adsorbed by the adsorption head 1, and the pressure ring 100 is carried by the carrying plate 2;

[0100] Controlling the relative movement of the adsorption head 1 and / or the carrier plate 2 so that the adsorption pad 200 is attached to the pressure ring 100;

[0101] The adsorbent pad 200 and the pressing ring 100 are pressed together by a pressing structure.

[0102] Specifically, the assembly method includes:

[0103] The adsorption pad 200 is placed at a preset position, clamped by the clamping claws 402, and transported by a conveyor belt;

[0104] The conveyor moves to the first position (i.e., directly below the adsorption head 1, i.e., the waiting position for adsorption of the adsorption head 1). After the adsorption head 1 descends until it contacts the adsorption pad 200, vacuum is drawn through the vacuum line 12 so that the adsorption surface 101 of the adsorption head 1 adsorbs the adsorption pad 200.

[0105] The pressing ring 100 is placed at a preset position, clamped by the clamping jaws 402, and transported by a conveyor belt;

[0106] The conveyor belt moves to the second position (i.e., directly above the carrier plate 2, i.e., the position where the carrier plate 2 is to be fixed);

[0107] The carrier plate 2 rises to support the pressure ring 100;

[0108] The carrying plate 2 drives the pressure ring 100 to descend or rise to the detection area of ​​the foreign object detection structure (when the image acquisition unit of the foreign object detection structure includes a laser sensor 301, the distance between the surface of the pressure ring 100 and the center of the laser beam is 2 mm), and controls the carrying plate 2 to drive the pressure ring 100 to rotate at a constant speed to start detection.

[0109] If the test result shows that there is no abnormality on the surface of the pressure ring 100, the carrier plate 2 rises and / or the adsorption head 1 descends. When the adsorption head 1 and the carrier plate 2 are located in the preparation operation area (for example, the adsorption head 1 is 4 mm away from the carrier plate 2, but not limited to this), the internal pressure of the adsorption head 1 is relieved and air is started to be inflated into the adsorption chamber, so that the center of the adsorption pad 200 changes from concave to convex (that is, the adsorption surface 101 is in the second state). Due to the shape design of the adsorption head 1 (the inner side of the adsorption head 1 protrudes slightly compared to the outer side, that is, the adsorption surface of the adsorption head forms a convex surface protruding outward), the adsorption pad 200 will not detach immediately when it is in the convex shape for the first time. At this time, the carrier plate 2 begins to slowly move upward until it is completely in contact with the adsorption head 1, so that the pressure ring 100 is in contact with the adsorption pad 200, and the operation is completed.

[0110] If the foreign matter detection result shows that there are residual rubber particles or other impurities on the surface of the pressure ring 100 (i.e., foreign matter is present), the carrier plate 2 is moved to the cleaning area, and the high-pressure nozzle begins to perform cleaning work in the form of spraying cleaning liquid - blowing dry - spraying cleaning liquid - blowing dry repeatedly. After cleaning is completed, the carrier plate 2 is moved to the detection area of ​​the foreign matter detection structure and the detection operation is repeated;

[0111] After the adsorption pad 200 and the pressure ring 100 are fitted together, the supporting plate 2 will drop to the bottom, and the bottom moving structure (which can be a second moving control structure) controls the movement of the fitted adsorption pad 200 and the pressure ring 100, and the adsorption pad 200 and the pressure ring 100 are pressed again by the pressing roller 51, so that the adsorption pad 200 is tightly attached to the pressure ring 100.

[0112] It should be noted that the inner side of the adsorption head 1 protrudes slightly compared to the outer side, that is, the adsorption surface of the adsorption head forms a convex surface protruding outward (because the outer side of the silicon wafer adsorption pad protrudes compared to the inner side, that is, it is designed to have a concave structure, and the adsorption surface of the adsorption head is a convex surface that matches the shape of the silicon wafer surface, so that the adsorption head 1 can be completely fitted with the silicon wafer adsorption pad). The surface of the adsorption head 1 is a slightly deformable stainless steel sheet (that is, the elastic metal sheet, a thin sheet material made of stainless steel). The adsorption chamber in the adsorption head 1 is a closed chamber, and the inward and outward deformation of the stainless steel sheet is achieved through the exhaust gas and the injection gas of the vacuum pipeline 12. When the adsorption head 1 is completely fitted with the silicon wafer adsorption pad, the gas in the adsorption chamber of the adsorption head is extracted to cause the stainless steel sheet to deform inward. At this time, the adsorption pad will be firmly adsorbed on the adsorption head due to the action of atmospheric pressure.

[0113] There are a few points to note:

[0114] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure. Other structures may refer to conventional designs.

[0115] (2) For the sake of clarity, the thickness of layers or regions in the drawings used to describe the embodiments of the present disclosure are exaggerated or reduced, i.e., these drawings are not drawn to scale. It is understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or intervening elements may be present.

[0116] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to form new embodiments.

[0117] It will be understood that the above embodiments are merely exemplary embodiments for illustrating the principles of the present invention, and the present invention is not limited thereto. Those skilled in the art will appreciate that various modifications and improvements can be made without departing from the spirit and substance of the present invention, and such modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. An assembly device for assembling an adsorption pad and a pressure ring on a polishing head, characterized in that: include: an adsorption head, used for adsorbing the adsorption pad; A carrying plate, used for carrying the pressure ring; a first movement control structure, configured to control the relative movement of the adsorption head and / or the carrier plate so that the adsorption pad is attached to the pressure ring; A pressing structure, comprising a pressing roller, for pressing the adsorption pad and the pressing ring after the adsorption pad is attached to the pressing ring; The carrying plate includes a first carrying platform and a second carrying platform located on the first carrying platform, wherein the area of ​​the second carrying platform is smaller than that of the first carrying platform, so that the pressure ring can be sleeved on the outside of the second carrying platform; Also includes foreign body detection structure, including: An image acquisition unit, configured to scan and detect the surface of the pressure ring carried on the carrying plate; a processing unit, configured to determine whether there is foreign matter on the surface of the pressure ring according to the image acquired by the image acquisition unit; It also includes a cleaning structure for cleaning the pressure ring when the foreign matter detection structure detects a foreign matter; The cleaning structure comprises: a nozzle, for spraying a cleaning liquid onto the surface of the pressure ring; The air knife is used to spray clean dry air toward the pressure ring.

2. The assembly equipment according to claim 1, characterized in that The adsorption head includes an adsorption chamber and an adsorption surface communicating with the adsorption chamber; The adsorption chamber is connected to the vacuum equipment through a vacuum pipeline so that the adsorption surface can be converted between a first state and a second state. In the first state, the adsorption surface is recessed toward the interior of the adsorption chamber to adsorb the adsorption pad. In the second state, the adsorption surface protrudes in a direction away from the adsorption chamber to fit with the pressure ring.

3. The assembly equipment according to claim 2, characterized in that The adsorption chamber has an opening, and an elastic metal sheet is provided at the opening. The elastic metal sheet serves as the adsorption surface.

4. The assembly equipment according to claim 1, characterized in that The image acquisition unit includes a laser sensor, and the foreign matter detection structure further includes: The moving unit is used to control the rotation of the carrier plate to drive the rotation of the pressure ring during the scanning process of the image acquisition unit.

5. The assembly equipment according to claim 1, characterized in that The foreign matter detection structure includes a support rod and a support ring. The support ring is supported on the support rod, and the image acquisition unit is arranged on the support ring.

6. The assembly equipment according to claim 1, characterized in that Also included is a second movement control structure, comprising: A first moving part is used to transport the adsorption pad to a first position to be adsorbed by the adsorption head; The second moving part is used to transport the pressure ring to a second position to be carried by the carrying plate.

7. An assembly method, characterized in that: Assembling the adsorption pad and the pressure ring of the polishing head by the assembly device according to any one of claims 1 to 6 comprises: Adsorbing the adsorption pad through an adsorption head and carrying the pressure ring through a carrying plate; Controlling the relative movement of the adsorption head and / or the carrier plate so that the adsorption pad is attached to the pressure ring; The fitted adsorption pad and the pressure ring are pressed together by a pressing structure.

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