Two-component load-bearing adhesive and preparation method thereof

Abstract

This application provides a two-component load-bearing adhesive and a preparation method thereof. The adhesive comprises component A and component B in a mass ratio of 1:(0.2-0.5). Component A comprises the following raw materials in parts by weight: 50 parts epoxy resin; and, based on 50 parts epoxy resin, the following: 20-40 parts glass fiber; 2-10 parts alumina; 10-20 parts aluminum hydroxide; 1-13 parts plasticizer; and 0.05-1 part modifier. The epoxy resin comprises bisphenol A epoxy resin, bisphenol F epoxy resin, and a cycloaliphatic epoxy resin. Component B comprises the following raw materials in parts by weight: 100 parts curing agent and 0-5 parts auxiliary agent, based on 100 parts curing agent. The curing agent comprises polyethylene polyamine, polyetheramine, phenalkamine, and polyamide. The adhesive exhibits excellent bonding strength, compressive strength, toughness, and heat resistance, and is suitable for securing load-bearing points in LNG / LPG storage tanks.

Description

Technical Field

[0001] The present application belongs to the technical field of adhesives, and specifically relates to a two-component load-bearing adhesive and a preparation method thereof. Background Art

[0002] Liquefied petroleum gas (LPG) carriers are specialized transport vessels primarily used to store liquefied gas at a liquid temperature of -163°C, along with corresponding shore-based storage tank systems. The containment system of an LPG carrier's cargo tanks, specifically the tank's isolation barrier and thermal insulation system, is the core technology of LPG carriers. Its primary functions include: providing a completely dense metal film to prevent LPG leakage; and providing excellent thermal insulation to prevent the hull from cooling and losing strength and toughness, thereby maintaining cargo temperature and maintaining the safety of the vessel during transport.

[0003] LPG marine adhesives are used in specific parts and structures of ships. They must be able to firmly bond various components of the hull structure, such as tanks, pipes, and valves, to ensure that these components do not loosen or fall off due to factors such as vibration and impact during transportation. They must also possess excellent heat resistance, high bonding strength, high compressive strength, and high toughness to enhance the ship's load-bearing capacity. However, existing LPG marine adhesives struggle to achieve these properties simultaneously. Summary of the Invention

[0004] The present application provides a two-component load-bearing adhesive and a preparation method thereof, aiming to provide an adhesive having excellent bonding strength, compressive strength, toughness and heat resistance.

[0005] A first aspect of the present application provides a two-component load-bearing adhesive, the two-component load-bearing adhesive comprising component A and component B in a mass ratio of 1:(0.2-0.5);

[0006] Component A comprises the following raw materials in parts by weight: 50 parts of epoxy resin; and, based on 50 parts of epoxy resin, 20-40 parts of glass fiber; 2-10 parts of alumina; 10-20 parts of aluminum hydroxide; 1-13 parts of plasticizer; and 0.05-1 part of modifier; wherein the epoxy resin comprises bisphenol A epoxy resin, bisphenol F epoxy resin, and alicyclic epoxy resin;

[0007] Component B comprises the following raw materials in parts by weight: 100 parts of a curing agent and 0-5 parts of an auxiliary agent based on 100 parts of the curing agent; wherein the curing agent comprises polyethylene polyamine, polyether amine, phenalkamine and polyamide.

[0008] In a feasible embodiment of the first aspect of the present application, the mass ratio of polyethylene polyamine, polyetheramine, phenolic amine and polyamide is 2: (0.6~4): (0.06~2): (1.3~10).

[0009] In a feasible implementation manner of the first aspect of the present application, the mass ratio of polyethylene polyamine, polyetheramine, phenolic amine and polyamide is 2: (1-2): (0.5-1): (2-5), optionally 2: 1: 1: 3.

[0010] In a feasible implementation manner of the first aspect of the present application, the mass ratio of bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin is (5~10):(1~3):1, and can be optionally 7:2:1.

[0011] In a feasible embodiment of the first aspect of the present application, the number of carbon atoms in the repeating structural unit of the polyamide is 4 to 10, and optionally 4 to 8.

[0012] In a feasible implementation of the first aspect of the present application, component B further includes the following raw materials in parts by weight: 20-40 parts of glass fiber; 10-30 parts of filler (such as 2-10 parts of aluminum oxide; 10-20 parts of aluminum hydroxide).

[0013] In a feasible embodiment of the first aspect of the present application, the modifier includes one or more of a silane coupling agent, a leveling agent and a defoaming agent; and / or the auxiliary agent includes one or more of a catalyst, a dispersant and a defoaming agent.

[0014] A second aspect of the present application provides a method for preparing a two-component load-bearing adhesive, comprising:

[0015] Mixing bisphenol A epoxy resin, bisphenol F epoxy resin, and alicyclic epoxy resin to obtain a first mixture; mixing glass fiber, aluminum hydroxide, aluminum oxide, a modifier, and a plasticizer to obtain a second mixture; and uniformly mixing the first mixture and the second mixture to obtain component A;

[0016] Mixing polyethylene polyamine, polyetheramine, phenalkamine and polyamide to obtain component B;

[0017] Mix component A and component B in a mass ratio of 1: (0.2~0.5) to obtain a two-component load-bearing adhesive.

[0018] In a feasible embodiment of the second aspect of the present application, bisphenol A epoxy resin, bisphenol F epoxy resin, and alicyclic epoxy resin are mixed to obtain a first mixture; glass fiber, aluminum hydroxide, aluminum oxide, a modifier, and a plasticizer are mixed and stirred to obtain a second mixture; and the first mixture and the second mixture are uniformly mixed to obtain component A, comprising:

[0019] Bisphenol A epoxy resin is placed in a container, and bisphenol F epoxy resin and alicyclic epoxy resin in a predetermined mass ratio are added and mixed, and stirred at high speed for 5 to 20 minutes to obtain a first mixture; glass fiber, aluminum hydroxide, aluminum oxide, modifier and plasticizer in predetermined weight parts are placed in a high-speed disperser and mixed and stirred for 5 to 20 minutes, and dried at 80°C to 120°C for 1 hour to 2 hours to obtain a second mixture; the first mixture and the second mixture are mixed uniformly in a mass ratio of 1:1 until no obvious stratification occurs to obtain component A.

[0020] In a feasible embodiment of the second aspect of the present application, the step of uniformly mixing polyethylene polyamine, polyetheramine, phenolic amine and polyamide to obtain component B includes: placing polyethylene polyamine, polyetheramine, phenolic amine and polyamide in a high-speed stirrer and mixing and stirring for 15 to 35 minutes to obtain component B.

[0021] The bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin such as 2021p epoxy resin in component A of the adhesive of the present application undergo intricate cross-linking reactions with four different types of curing agents in component B, namely polyethylene polyamine, polyether amine, phenolic amine and polyamide, to promote the formation of a disordered cross-linked network structure, forming a soft and hard embedded polymer, and wrapping the glass fiber, aluminum hydroxide and aluminum oxide powders in the cross-linked network of the epoxy resin, so that the linear resin is transformed into a tough bulk solid, thereby obtaining an adhesive with excellent bonding strength, compressive strength, toughness and heat resistance.

[0022] Bisphenol A epoxy resin is a thermoplastic resin, and its cured product has high strength and bonding strength, corrosion resistance and electrical properties, but its heat resistance and toughness are not high, and its resistance to moisture and heat and weather resistance are insufficient. Bisphenol F epoxy resin has a low viscosity, about 1 / 3 of the viscosity of bisphenol A epoxy resin, and has good impregnation properties for fibers, but also has slightly lower heat resistance. The adhesive of the present application is mainly used for LPG marine adhesive, which requires strong load-bearing capacity, strong toughness and good heat resistance. After a large number of experimental studies and demonstrations, the inventors have shown that the epoxy resin requires a combination of three resins: bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin to achieve the above-mentioned effect. Among them, alicyclic epoxy resin contains an alicyclic structure, and the epoxy group is located on the alicyclic structure, which can form a tight and rigid molecular structure. Compared with bisphenol A epoxy resin, its curing properties and the physical properties of the cured product show very different characteristics. The addition of alicyclic epoxy resin increases the cross-linking density and degree of disorder of the reaction, increases the compressibility of the adhesive, and overall makes the adhesive have the characteristics of excellent mechanical strength, low shrinkage, strong toughness and low thermal expansion coefficient.

[0023] The types of curing agents include aliphatic amines, ester ring amines, aromatic amines, polyamides, acid anhydrides, and aromatic curing agents. The choice of curing agent will also affect the performance of the adhesive formed by cross-linking with the epoxy resin. The curing agents used in conjunction with the epoxy resin in this application include curing agents of different segment lengths, which can further promote the formation of a disordered system. For example, low molecular weight polyamides have a relatively complex composition and contain primary amines, secondary amines, and amide groups. They can cure epoxy resins at room temperature and have good adhesion to metals, glass, ceramics, wood, etc. They can play an internal toughening role and further enhance the toughness of the resulting adhesive after reacting with the epoxy resin in this application. DETAILED DESCRIPTION

[0024] In order to make the invention purpose, technical solution and beneficial technical effect of this application clearer, this application is further described in detail with reference to the following embodiments. It should be understood that the embodiments described in this specification are only for explaining this application and are not intended to limit this application.

[0025] For simplicity, only some numerical ranges are explicitly disclosed herein. However, any lower limit can be combined with any upper limit to form an unspecified range; and any lower limit can be combined with other lower limits to form an unspecified range, and similarly, any upper limit can be combined with any other upper limit to form an unspecified range. In addition, although not explicitly stated, each point or individual value between the endpoints of a range is included in the range. Thus, each point or individual value can serve as its own lower limit or upper limit and be combined with any other point or individual value, or with other lower limits or upper limits, to form an unspecified range.

[0026] In the description herein, when a composition is described as containing, comprising or including specific components, or when a process is described as containing, comprising or including specific process steps, it is intended that the composition of the present application also consists essentially of or consists of the components, and the process of the present application also consists essentially of or consists of the process steps.

[0027] The use of the terms "including," "comprising," "containing," and "having" should generally be construed as open ended and non-limiting unless expressly stated otherwise.

[0028] In the description of this article, it should be noted that, unless otherwise specified, “above” and “below” are inclusive of the number themselves, and “a variety” in “one or more” means more than two.

[0029] The above summary of the invention of this application is not intended to describe every disclosed embodiment or every implementation in this application. The following description more specifically illustrates exemplary embodiments. In many places throughout the application, guidance is provided by a series of examples, which can be used in various combinations. In each example, the enumeration is intended only as a representative group and should not be construed as exhaustive.

[0030] Epoxy resin is a typical cross-linked thermosetting polymer material with many excellent properties, such as good mechanical properties, excellent stability, strong adhesion and low shrinkage. It is widely used in related fields such as coatings, adhesives and civil engineering materials, and plays an important role in thermosetting resins.

[0031] Epoxy adhesives are mainly composed of an epoxy resin matrix, a curing agent, an inorganic powder filler, and a modifier. During the reaction between common epoxy resins and curing agents, the chemical chains crosslink and entangle with each other to form a cured product with a three-dimensional cross-linked structure. However, the resulting colloid exhibits high hardness, low toughness, high brittleness and easy cracking, and poor impact resistance. LPG marine adhesives are adhesives used for specific parts and structures of ships. The fixing of the bearing points of LNG / LPG storage tanks requires not only good thermal insulation capabilities, but also the ability to firmly bond the various components of the hull structure, requiring high bonding strength, compressive strength, and toughness.

[0032] In view of this, the inventors provide a two-component load-bearing adhesive and a preparation method thereof in this application, aiming to provide an adhesive having excellent bonding strength, compressive strength, toughness and heat resistance.

[0033] A first aspect of the present application provides a two-component load-bearing adhesive, the two-component load-bearing adhesive comprising component A and component B in a mass ratio of 1:(0.2-0.5);

[0034] Component A comprises the following raw materials in parts by weight: 50 parts of epoxy resin; and, based on 50 parts of epoxy resin, 20-40 parts of glass fiber; 2-10 parts of alumina; 10-20 parts of aluminum hydroxide; 1-13 parts of plasticizer; and 0.05-1 part of modifier; wherein the epoxy resin comprises bisphenol A epoxy resin, bisphenol F epoxy resin, and alicyclic epoxy resin;

[0035] Component B comprises the following raw materials in parts by weight: 100 parts of a curing agent and 0-5 parts of an auxiliary agent based on 100 parts of the curing agent; wherein the curing agent comprises polyethylene polyamine, polyether amine, phenalkamine and polyamide.

[0036] The bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin in component A of the adhesive of the present application undergo an intricate cross-linking reaction with four different types of curing agents in component B, namely polyethylene polyamine, polyether amine, phenolic amine and polyamide, to promote the formation of a disordered cross-linked network structure, forming a soft and hard embedded polymer, and wrapping the glass fiber, aluminum hydroxide and aluminum oxide powders in the cross-linked network of the epoxy resin, so that the linear resin is transformed into a tough bulk solid, thereby obtaining an adhesive with excellent bonding strength, compressive strength, toughness and heat resistance.

[0037] Bisphenol A epoxy resin is a thermoplastic resin, and its cured product has high strength and bonding strength, corrosion resistance and electrical properties, but its heat resistance and toughness are not high, and its resistance to moisture and heat and weather resistance are insufficient. Bisphenol F epoxy resin has a low viscosity, about 1 / 3 of the viscosity of bisphenol A epoxy resin, and has good impregnation properties for fibers, but also has slightly lower heat resistance. The adhesive of the present application is mainly used for LPG marine adhesive, which requires strong load-bearing capacity, strong toughness and good heat resistance. After a large number of experimental studies and demonstrations, the inventors have shown that the epoxy resin requires a combination of three resins: bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin to achieve the above-mentioned effect. Among them, alicyclic epoxy resin contains an alicyclic structure, and the epoxy group is located on the alicyclic structure, which can form a tight and rigid molecular structure. Compared with bisphenol A epoxy resin, its curing properties and the physical properties of the cured product show very different characteristics. The addition of alicyclic epoxy resin increases the cross-linking density and degree of disorder of the reaction, increases the compressibility of the adhesive, and overall makes the adhesive have excellent mechanical strength, low curing shrinkage, strong toughness and low thermal expansion coefficient.

[0038] The types of curing agents include aliphatic amines, ester ring amines, aromatic amines, polyamides, acid anhydrides, and aromatic curing agents. The choice of curing agent will also affect the performance of the adhesive formed by cross-linking with the epoxy resin. The curing agents used in conjunction with the epoxy resin in this application include curing agents of different segment lengths, which can further promote the formation of a disordered system. For example, low molecular weight polyamides have a relatively complex composition and contain primary amines, secondary amines, and amide groups. They can cure epoxy resins at room temperature and have good adhesion to metals, glass, ceramics, wood, etc. They can play an internal toughening role and further enhance the toughness of the resulting adhesive after reacting with the epoxy resin in this application.

[0039] In some embodiments, the mass ratio of polyethylene polyamine, polyetheramine, phenalkamine and polyamide is 2: (0.6-4): (0.06-2): (1.3-10).

[0040] In some embodiments, the polyethylene polyamine includes one or more of triethylenetetramine, diethylenetriamine, and tetraethylenepentamine.

[0041] In some embodiments, the mass ratio of polyethylene polyamine, polyetheramine, phenalkamine and polyamide is 2: (1-2): (0.5-1): (2-5), optionally 2:1:1:3.

[0042] The inventors discovered that by adjusting the above mass ratios in the curing agent, an adhesive with strong weighing capacity, strong bonding properties, and improved toughness can be achieved. Too much polyethylene polyamine results in an overly rapid curing rate, making the system brittle and less tough, while too little softens the system and reduces its load-bearing capacity. Polyetheramines, such as D400, provide toughness enhancement; too much softens the system, while too little makes it brittle and less tough. Phenolic amines promote curing; too much leads to high reactivity, a rapid reaction rate, and a short working time. Polyamide, as the primary curing agent, enhances bonding strength and increases adhesive toughness, and when mixed with the other three in appropriate proportions, produces a good reaction effect.

[0043] In some embodiments, the mass ratio of bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin is (5-10): (1-3): 1, and can be optionally 7:2:1.

[0044] Bisphenol A epoxy resin is a thermoplastic resin, but it also has thermosetting properties. It can be combined with a variety of curing agents, catalysts, and additives to form a variety of cured products with excellent properties, which can meet almost all usage requirements. During curing, it basically does not produce small molecule volatiles, can be molded at low pressure, and is soluble in a variety of solvents. Bisphenol F epoxy resin is a new type of epoxy resin developed to reduce the viscosity of bisphenol A epoxy resin itself while maintaining the same properties. Alicyclic epoxy resin contains an alicyclic structure, and the epoxy groups are located on the alicyclic structure, which can form a tight and rigid molecular structure. The alicyclic skeleton directly acts on the interior of the epoxy resin as a group structure. After curing, the crosslinking density increases, and the finished product has excellent mechanical strength, low shrinkage, and low thermal expansion coefficient.

[0045] The inventors discovered that the mass ratio of the bisphenol A epoxy resin, bisphenol F epoxy resin, and cycloaliphatic epoxy resin can also affect the performance of the adhesive. Epoxy resins within this mass ratio range produce adhesives with high load-bearing capacity, low cure shrinkage, and a low thermal expansion coefficient.

[0046] In some embodiments, the carbon atoms in the repeating structural unit of the polyamide are 4 to 10, and optionally 4 to 8.

[0047] In this application, low molecular weight polyamide, such as polyamide 651, can be used. The low molecular weight polyamide curing agent molecule has a long fatty carbon chain, which can play an internal toughening role, making the cured epoxy resin more toughened. Therefore, the low molecular weight polyamide can be both a curing agent and a toughening agent.

[0048] In some embodiments, component B further comprises the following raw materials in parts by weight: 20-40 parts of glass fiber; 10-30 parts of filler (such as 2-10 parts of aluminum oxide; 10-20 parts of aluminum hydroxide).

[0049] In some embodiments, the modifier includes one or more of a silane coupling agent, a leveling agent, and a defoaming agent; and / or the auxiliary agent includes one or more of a catalyst, a dispersant, and a defoaming agent.

[0050] In an embodiment of the second aspect of the present application, a method for preparing a two-component load-bearing adhesive is provided, comprising:

[0051] Mixing bisphenol A epoxy resin, bisphenol F epoxy resin, and alicyclic epoxy resin to obtain a first mixture; mixing glass fiber, aluminum hydroxide, aluminum oxide, a modifier, and a plasticizer to obtain a second mixture; and uniformly mixing the first mixture and the second mixture to obtain component A;

[0052] Mixing polyethylene polyamine, polyetheramine, phenalkamine and polyamide to obtain component B;

[0053] Mix component A and component B in a mass ratio of 1: (0.2~0.5) to obtain a two-component load-bearing adhesive.

[0054] In some embodiments, the step of mixing bisphenol A epoxy resin, bisphenol F epoxy resin, and alicyclic epoxy resin to obtain a first mixture; mixing glass fiber, aluminum hydroxide, aluminum oxide, a modifier, and a plasticizer to obtain a second mixture; and uniformly mixing the first mixture and the second mixture to obtain component A comprises:

[0055] Bisphenol A epoxy resin is placed in a container, and bisphenol F epoxy resin and alicyclic epoxy resin in a predetermined mass ratio are added and mixed, and stirred at high speed for 5 to 20 minutes to obtain a first mixture; glass fiber, aluminum hydroxide, aluminum oxide, modifier and plasticizer in predetermined weight parts are placed in a high-speed disperser and mixed and stirred for 5 to 20 minutes, and dried at 80°C to 120°C for 1 hour to 2 hours to obtain a second mixture; the first mixture and the second mixture are mixed uniformly in a mass ratio of 1:1 until no obvious stratification occurs to obtain component A.

[0056] In some embodiments, the step of uniformly mixing polyethylene polyamine, polyetheramine, phenalkamine and polyamide to obtain component B includes placing polyethylene polyamine, polyetheramine, phenalkamine and polyamide in a high-speed stirrer and mixing and stirring for 15 to 35 minutes to obtain component B.

[0057] The adhesive of the present application is easy to prepare and operate, and has simple curing conditions. It takes about 8 hours to fully cure at 80°C. Example

[0058] The following examples describe the present disclosure in more detail and are intended to be illustrative only, as various modifications and variations within the scope of the present disclosure will be apparent to those skilled in the art. Unless otherwise indicated, all parts, percentages, and ratios reported in the following examples are by weight, and all reagents used in the examples are commercially available or synthesized according to conventional methods and used directly without further processing, and all instruments used in the examples are commercially available.

[0059] Example 1

[0060] A method for preparing an adhesive, the preparation process is divided into two parts:

[0061] Preparation of component A: Take 35 parts of bisphenol A epoxy resin (Phoenix E51) and put it into a dry flask. Add 10 parts of bisphenol F epoxy resin (Nanya 170) and 5 parts of alicyclic epoxy resin 2021p epoxy resin according to the ratio of 7:2:1. Stir for 10 minutes under high-speed stirring of the stirrer. Use an electronic balance to weigh 30 parts of glass fiber, 15 parts of aluminum hydroxide, 5 parts of alumina, 5 parts of plasticizer, and 5% of the total mass of the three types of epoxy resins. Place the modifier in a high-speed disperser and mix the two for 10 minutes. Put the mixed powder into an oven and spread it flat at 100°C to dry for 1 hour. Then mix the solid and liquid phases evenly at a solid-liquid ratio of 50:50 until there is no obvious stratification to obtain component A.

[0062] Preparation of component B: Add 20 parts of triethylenetetramine, 10 parts of polyetheramine D400 curing agent, 10 parts of phenalkamine (Liansheng LSC203), and 30 parts of polyamide 651 to a dry flask in a mass ratio of 2:1:1:3. Stir and mix under a high-speed stirrer for 25 minutes until the color is uniform and there is no obvious stratification, thereby obtaining component B;

[0063] When using, mix component A and component B in a mass ratio of 100:30 until the color is uniform, then apply it on the object for bonding.

[0064] Example 2

[0065] Compared with Example 1, Example 2 mainly differs in that the mass ratio of triethylenetetramine, D400 curing agent, phenalkamine and polyamide is 2:5:2:1, and the total weight of the curing agent remains unchanged.

[0066] Example 3

[0067] Compared with Example 1, Example 3 mainly differs in that the mass ratio of triethylenetetramine, D400 curing agent, phenalkamine and polyamide is 2:1:1:5, and the total weight of the curing agent remains unchanged.

[0068] Example 4

[0069] Compared with Example 1, Example 4 mainly differs in that the mass ratio of triethylenetetramine, D400 curing agent, phenalkamine and polyamide is 2:2:0.5:5, and the total weight of the curing agent remains unchanged.

[0070] Example 5

[0071] Compared with Example 1, Example 5 mainly differs in that the mass ratio of bisphenol A epoxy resin, bisphenol F epoxy resin and 2021p epoxy resin is 13:1:1, and the total weight of the epoxy resin remains unchanged.

[0072] Example 6

[0073] Compared with Example 1, Example 6 mainly differs in that the mass ratio of bisphenol A epoxy resin, bisphenol F epoxy resin and 2021p epoxy resin is 10:4:1, and the total weight of the epoxy resin remains unchanged.

[0074] Example 7

[0075] Compared with Example 1, Example 7 mainly differs in that the mass ratio of bisphenol A epoxy resin, bisphenol F epoxy resin and 2021p epoxy resin is 5:3:1, and the total weight of the epoxy resin remains unchanged.

[0076] Example 8

[0077] Compared with Example 1, Example 8 mainly differs in that the mass ratio of bisphenol A epoxy resin, bisphenol F epoxy resin and 2021p epoxy resin is 3:4:1, and the total weight of the epoxy resin remains unchanged.

[0078] Example 9

[0079] The main difference between Example 9 and Example 1 is that polyamide 1010 is used to replace polyamide 651.

[0080] Comparative Example 1

[0081] The main difference between Comparative Example 1 and Example 1 is that 2021p epoxy resin is not added to component A, and is replaced by an equal weight portion of bisphenol A epoxy resin.

[0082] Comparative Example 2

[0083] The main difference between Comparative Example 2 and Example 1 is that bisphenol F epoxy resin is not added to component A, and is replaced by bisphenol A epoxy resin in equal parts by weight.

[0084] Comparative Example 3

[0085] Compared with Example 1, the main difference in Comparative Example 3 is that the 2021p epoxy resin in component A is replaced with an equal weight portion of phenolic epoxy resin.

[0086] Comparative Example 4

[0087] The main difference between Comparative Example 4 and Example 1 is that polyamide 651 is not added to component B, but is replaced by an equal weight portion of triethylenetetramine.

[0088] Comparative Example 5

[0089] The main difference between Comparative Example 5 and Example 1 is that no phenalkamine is added to component B, and an equal weight portion of triethylenetetramine is used instead.

[0090] Test section

[0091] The performance tests were conducted on the adhesives of various embodiments and comparative examples, and the test results are shown in Table 1 below.

[0092] Test method:

[0093] Maximum compression load, compression modulus: tested in accordance with ASTM D695-23.

[0094] Elongation and bonding strength: tested in accordance with GB / T 2567 standard.

[0095] Curing shrinkage: tested in accordance with ISO 2577-2007 standard.

[0096] Punch shear strength: tested in accordance with ASTM D732-17 (2017) standard.

[0097] Hardness: Tested in accordance with GBT 43432.3-2023 standard.

[0098] Thermal Expansion Coefficient: Tested in accordance with ASTM D696-08.

[0099] Table 1:

[0100]

[0101] The test results show that the adhesives in the examples exhibit excellent bond strength, compressive strength, toughness, and heat resistance. In particular, they exhibit high compressive strength, strong toughness, and excellent bond strength. Their compression properties fill a gap in domestic load-bearing adhesives, addressing the need for many downstream products to combine excellent bond strength with increased toughness and load-bearing properties. However, the adhesives in Comparative Examples 1-5, because they do not utilize the epoxy resin and curing agent blended in this application, do not perform as well as the examples in overall performance.

[0102] The above embodiments of the present invention are merely examples for the purpose of clearly illustrating the present invention and are not intended to limit the embodiments of the present invention. Those skilled in the art will appreciate that other variations or modifications may be made based on the above description. It is not necessary and impossible to enumerate all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention are intended to be included within the scope of protection of the claims of the present invention.

Claims

1. A two-component load-bearing adhesive, characterized in that: The two-component load-bearing adhesive comprises component A and component B in a mass ratio of 1:(0.2-0.5); The A component includes the following raw materials in parts by weight: 50 parts of epoxy resin; and based on 50 parts of epoxy resin: 20-40 parts of glass fiber; 2-10 parts of aluminum oxide; 10-20 parts of aluminum hydroxide; 1-13 parts of plasticizer; 0.05-1 part of modifier; The epoxy resin comprises bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin; the mass ratio of the bisphenol A epoxy resin, bisphenol F epoxy resin and alicyclic epoxy resin is (5-10): (1-3): 1; The B component includes the following raw materials in parts by weight: 100 parts of a curing agent and 0-5 parts of an auxiliary agent based on 100 parts of the curing agent; wherein the curing agent includes polyethylene polyamine, polyetheramine, phenalkamine and polyamide; and the mass ratio of the polyethylene polyamine, polyetheramine, phenalkamine and polyamide is 2: (1-2): (0.5-1): (2-5).

2. The two-component load-bearing adhesive according to claim 1, characterized in that: The carbon atoms of the repeating structural unit of the polyamide are 4 to 10.

3. The two-component load-bearing adhesive according to claim 1, characterized in that: The B component further comprises the following raw materials in parts by weight: 20 to 40 parts of glass fiber; and 10 to 30 parts of filler.

4. The two-component load-bearing adhesive according to claim 1, characterized in that: The modifier includes one or more of a silane coupling agent, a leveling agent and a defoaming agent; And / or; the auxiliary agent includes one or more of a catalyst, a dispersant and a defoaming agent.

5. A method for preparing a two-component load-bearing adhesive according to any one of claims 1 to 4, characterized in that: The preparation method comprises: Mixing bisphenol A epoxy resin, bisphenol F epoxy resin, and alicyclic epoxy resin to obtain a first mixture; mixing glass fiber, aluminum hydroxide, aluminum oxide, a modifier, and a plasticizer to obtain a second mixture; and uniformly mixing the first mixture and the second mixture to obtain component A; Mixing polyethylene polyamine, polyetheramine, phenalkamine and polyamide to obtain component B; The component A and the component B are mixed in a mass ratio of 1:(0.2-0.5) to obtain the two-component load-bearing adhesive.

6. The method for preparing the two-component load-bearing adhesive according to claim 5, characterized in that: The steps of mixing bisphenol A epoxy resin, bisphenol F epoxy resin, and alicyclic epoxy resin to obtain a first mixture; mixing glass fiber, aluminum hydroxide, aluminum oxide, a modifier, and a plasticizer to obtain a second mixture; and uniformly mixing the first mixture and the second mixture to obtain component A include: Bisphenol A epoxy resin is placed in a container, and a predetermined mass ratio of bisphenol F epoxy resin and alicyclic epoxy resin are added and mixed, and stirred at high speed for 5 minutes to 20 minutes to obtain a first mixture; glass fiber, aluminum hydroxide, aluminum oxide, modifier and plasticizer in predetermined weight parts are placed in a high-speed disperser and mixed and stirred for 5 minutes to 20 minutes, and dried at 80°C to 120°C for 1 hour to 2 hours to obtain a second mixture; the first mixture and the second mixture are mixed evenly until no obvious stratification occurs to obtain the A component.

7. The method for preparing the two-component load-bearing adhesive according to claim 5, characterized in that: The step of uniformly mixing polyethylene polyamine, polyetheramine, phenalkamine and polyamide to obtain component B comprises: placing polyethylene polyamine, polyetheramine, phenalkamine and polyamide in a high-speed stirrer, mixing and stirring for 15 minutes to 35 minutes to obtain component B.

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