Single-bus temperature sensing array positioning and calibrating device based on hot spot identification

Abstract

The invention belongs to the technical field of sensor array positioning and temperature calibration, and particularly relates to a single-bus temperature sensing array positioning and calibration device based on hot spot recognition, which comprises a test module and a main control board, and is characterized in that the test module comprises a heating array substrate, a heating unit array is arranged on the heating array substrate, the heating unit array comprises a plurality of heating units, and the heating units are arranged on the heating array substrate; each heating unit can heat independently; the temperature sensing array comprises a plurality of single-bus temperature sensors; when a single heating unit works, a hot spot is formed on the heating array substrate, the temperature of the hot spot is measured through the temperature sensing array, the positioning and identification of the single-bus temperature sensor are realized, and then the ID number of the single-bus temperature sensor is bound with the physical space position based on the positioning. According to the unibus temperature sensor array positioning and calibrating device based on hot spot identification, the problem of corresponding binding of physical objects and IDs in unibus temperature sensor networking application is effectively solved.

Description

Technical Field

[0001] The present invention belongs to the technical field of sensor array positioning and temperature calibration, and specifically relates to a relative position spatial positioning and temperature calibration device for a sensor array composed of single-bus type temperature sensors, and more particularly to a single-bus temperature sensor array positioning and calibration device based on hot spot recognition. Background Art

[0002] OneWire is a peripheral serial expansion bus technology introduced by DALLAS, USA, which uses a single signal line for transmission. This protocol consists of a bus master node or multiple slave nodes to form a system, and reads data from multiple slave chips through a single signal line. Each slave chip that complies with the OneWire protocol has a unique identification number ROMID, including a 48-bit serial number, an 8-bit family code, and an 8-bit CRC code. The master chip communicates bidirectionally with each chip based on the 64-bit ID. Therefore, the temperature array composed of a single bus temperature sensor can realize large-scale high-density temperature acquisition, while saving the host system I / O pin resources, and has many advantages such as simple wiring, low cost, and easy bus expansion and maintenance.

[0003] However, when a large number of sensors are composed of a single bus to form a sensor array, the sensor ID number read by the host system from the bus cannot correspond to the sensor in the physical space position one by one. Therefore, it is not convenient to bind the sensor ID with the sensor, test object and test parameters during the installation and debugging of the temperature measurement system, which hinders the further promotion and application of single-bus temperature sensors. By spatially positioning the single-bus temperature sensor array, it can be achieved: First, improve the accuracy of temperature measurement: By locating the relative position of each sensor, the spatial resolution of temperature distribution can be determined more accurately, which is crucial for areas where detailed understanding of temperature gradients or temperature changes is required. At the same time, environmental conditions (such as light, ventilation, heat sources, etc.) may vary in different spatial locations, which will affect temperature measurement. By locating each sensor in the sensor array, the impact of these environmental differences on temperature measurement can be better understood and corresponding corrections can be made. Second, realize multi-point temperature monitoring: sensor arrays are usually used to cover larger areas or equipment. By locating the position of each sensor, it can be ensured that the key points of the entire area or equipment are effectively monitored. In addition, in applications where real-time monitoring of multiple points of temperature is required (such as data centers, industrial production lines, etc.), locating each sensor in the sensor array can help quickly identify and solve potential temperature problems. Third, it is conducive to optimizing the layout of the sensor array: By locating the position of each sensor, the layout of the sensor array can be optimized to maximize the coverage and accuracy of temperature measurement. For example, the sensor density can be increased in areas with large temperature gradients, while the number of sensors can be reduced in areas with relatively stable temperatures. A reasonable sensor array layout can avoid unnecessary sensor overlap or omissions while ensuring measurement accuracy, thereby maximizing cost-effectiveness. Fourth, it supports advanced data analysis and visualization: Combining the location information of each sensor with the temperature measurement data can support more advanced data analysis. For example, a more detailed temperature distribution map can be generated through a spatial interpolation algorithm. Displaying the relative position of the sensor array and its measured temperature data in a geographic information system (GIS) or other visualization tools can help decision makers understand the temperature distribution more intuitively and make more accurate decisions.

[0004] Furthermore, it is extremely important to perform temperature calibration on the single-bus temperature sensor array. During the production process, even the same batch of temperature sensors may have different initial measurement accuracy due to factors such as manufacturing process and material differences. Through calibration, this initial error can be eliminated or reduced to ensure that each sensor in the sensor array can provide accurate temperature readings. In addition, the temperature sensor will be affected by environmental factors during use, such as temperature changes, humidity, electromagnetic interference, etc., all of which may cause the sensor measurement value to shift. Through regular calibration, these shifts can be discovered and corrected in time to ensure measurement accuracy. In addition, many industries have strict requirements on the accuracy and reliability of temperature sensors, especially in the fields of medical, aerospace, food processing, etc. Through calibration, it can be ensured that the sensor array meets the relevant industry standards and specifications, thereby meeting industry requirements.

[0005] Therefore, a relative position spatial positioning and temperature calibration device for a sensor array composed of single-bus type temperature sensors is provided to achieve spatial positioning and temperature calibration of each temperature sensor in the single-bus temperature sensor array, which has positive significance for promoting the further promotion and application of single-bus temperature sensors. Summary of the invention

[0006] The purpose of the present invention is to provide a single-bus temperature sensor array positioning and calibration device based on hot spot recognition in order to solve the above-mentioned technical problems, so as to achieve the purpose of spatial positioning and temperature calibration of each temperature sensor in the single-bus temperature sensor array.

[0007] In view of this, the present invention provides a single-bus temperature sensor array positioning and calibration device based on hot spot recognition, comprising: a test module and a main control board, wherein the test module is connected to the main control board, and the main control board can adjust the state of the test module;

[0008] Wherein, the test module includes:

[0009] A heating array substrate, on which a heating unit array is arranged, the heating unit array includes a plurality of heating units, each heating unit can be individually controlled by the main control board to generate heat according to its row and column position;

[0010] A temperature sensing array, comprising a plurality of single-bus temperature sensors, wherein the temperature sensing array is arranged opposite to the heating unit array, and each single-bus temperature sensor is configured with a heating unit corresponding thereto;

[0011] When a single heating unit is working, a hot spot will be formed on the heating array substrate. The temperature of the hot spot will be measured by the temperature sensing array to locate and identify the single-bus temperature sensor. Then, based on the positioning, the ID number of the single-bus temperature sensor will be bound to the physical space position.

[0012] Furthermore, the heating unit array is prepared by printed circuit processing, and the heating array substrate is prepared by using a thermal and electrical isolation multilayer material.

[0013] Furthermore, the temperature sensing array is located on the upper side of the heating array substrate, and the heating unit array is arranged on the lower side of the heating array substrate.

[0014] Furthermore, the test module also includes:

[0015] A liquid cooling plate, wherein cooling liquid flows therein, and the liquid cooling plate is located at the lower side of the heating array substrate;

[0016] The liquid cooling plate is a hollow structure, and a circulating cooling medium is filled in the liquid cooling plate.

[0017] Furthermore, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition also includes: a base;

[0018] A groove is arranged on the upper part of the base to form a housing space for the liquid cooling plate, the heating array substrate, the heating unit array and the temperature sensing array. The temperature sensing array, the heating array substrate, the heating unit array and the liquid cooling plate are arranged in the groove in sequence from top to bottom.

[0019] Furthermore, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition also includes a heat insulation cover, which is buckled on the base, and the test module is located in a closed space formed by the base and the heat insulation cover.

[0020] Furthermore, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition also includes a heating and ventilation module. During operation, the heating and ventilation module can transport air of a certain temperature into the enclosed space formed by the base and the heat insulation cover, so as to regulate the ambient temperature in the enclosed space.

[0021] Furthermore, the heating and ventilation module includes:

[0022] A delivery pipe, one end of which is connected to a first air inlet provided on the outer side wall of the base, and the other end of which is connected to a second air inlet provided on the upper surface of the base, wherein the second air inlet is located in a closed space formed by the base and the heat insulation cover;

[0023] An exhaust port, the exhaust port being arranged on the upper surface of the base, and the exhaust port being capable of connecting the closed space formed by the base and the heat insulation cover with the external atmosphere, so as to discharge the gas in the closed space formed by the base and the heat insulation cover;

[0024] An air temperature sensor, used to measure the ambient temperature in the enclosed space;

[0025] An air inlet temperature sensor is used to detect the temperature of air entering through the first air inlet.

[0026] Furthermore, the single bus temperature sensor array positioning and calibration device based on hot spot identification can operate in a first mode, which is used to calibrate the hot spot temperature of each point on the heating array substrate under standard working conditions. The first mode includes the following steps:

[0027] S1, place the standard temperature sensor array integrated circuit on the heating array substrate, connect it to the main control board through a data line, and then cover it with a heat insulation cover;

[0028] S2, set the working parameters and press the start button to start the test. The main control board controls the temperature of the liquid cooling plate and the air inside the cover according to the set values;

[0029] S3, after the temperature of the liquid cooling plate and the air in the cover is stable, the main control board controls the heating units on the heating array substrate one by one to perform constant power heating, thereby forming a hot spot;

[0030] S4, the main control board uses the ID to read the sensor temperature at the hot spot position. When the temperature value stabilizes, read the temperature value at this time and use the temperature value as the equilibrium temperature T std (i) Assign a value to the heating unit that forms the hot spot and store the temperature value in the hot spot array standard temperature matrix T std middle;

[0031] S5, after all the hot spot temperatures of all the heating units are read in sequence, a complete hot spot array standard temperature matrix T is obtained. std , complete the standard working condition calibration.

[0032] Furthermore, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition can operate in a second mode, and the second mode is used to perform address binding and temperature correction on the temperature sensor array integrated circuit under test, and the second mode includes the following steps:

[0033] P1, place the DUT on the heating array substrate and connect it to the main control board via a data cable, then cover it with a heat shield;

[0034] P2, set the working parameters and press the start button to start the test. The main control board controls the temperature of the liquid cooling plate 301 and the air inside the cover according to the set values;

[0035] P3, after the temperature of the liquid cooling plate and the air in the cover is stable, the main control board controls the heating units on the heating array substrate one by one to perform constant power heating, thereby forming a hot spot;

[0036] P4, the main control board reads the temperature array formed by the temperature values ​​of all sensors on the device under test. After the temperature values ​​are stable, the highest temperature value is extracted and the sensor ID number corresponding to the highest temperature value is read;

[0037] P5, the highest temperature value is taken as the hot spot equilibrium temperature T cal (i) assigning a value to the corresponding sensor, assigning the sensor ID number corresponding to the highest temperature value to the corresponding sensor, and storing the highest temperature value and the sensor ID number corresponding to the highest temperature value in the hot spot equilibrium temperature matrix T corresponding to the hot spot array. cal and ID number matrix Addr;

[0038] P6, after all the heat-generating units have completed the hot spot equilibrium temperature and ID number reading, the hot spot equilibrium temperature matrix T cal The data of the ID matrix Addr is exported to an external storage device to complete the address binding;

[0039] P7, for the standard temperature matrix T std and hot spot equilibrium temperature matrix T cal Make a comparison and calibrate the temperature of the test piece.

[0040] The beneficial effects of the present invention are:

[0041] The single-bus temperature sensor array positioning and calibration device based on hot spot identification described in the present invention is based on heat transfer theory, through integrated design of heat transfer, structure, circuit and other aspects, and utilizes the rapid heat dissipation characteristics of high-temperature small-size heating modules on high-thermal conductivity metal plates to form concentrated heat hot spots on the metal plates. And further, through the numerical response of the temperature sensor to the high-temperature hot spot, the sensor ID is bound to its physical spatial position in the temperature sensor array. At the same time, the program control of the hot spot is realized through circuit design, thereby realizing batch automatic identification and binding of the temperature sensor array.

[0042] The single-bus temperature sensor array positioning and calibration device based on hot spot recognition described in the present invention not only solves the problem of binding physical objects and IDs in the networking application of single-bus temperature sensors, but also improves the efficiency of automatic batch reading and debugging of ID numbers in the bus temperature sensor array networking system, thereby improving the feasibility of networking applications of single-bus temperature sensors in industrial scenarios, reducing installation and debugging costs, simplifying wiring harness layout, and reducing wiring harness costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a three-dimensional structural schematic diagram of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition according to the present invention;

[0044] Figure 2 It is a schematic diagram of the three-dimensional structure of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition described in the present invention from another perspective;

[0045] Figure 3 It is a perspective structural diagram of a single bus temperature sensor array positioning and calibration device based on hot spot recognition according to the present invention;

[0046] Figure 4 It is a perspective structural diagram of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition described in the present invention from another perspective;

[0047] Figure 5 It is a schematic diagram of the three-dimensional structure of the single-bus temperature sensor array positioning and calibration device based on hot spot recognition according to the present invention after the heat shield is removed;

[0048] Figure 6 It is a structural explosion diagram of the single-bus temperature sensing array positioning and calibration device based on hot spot recognition according to the present invention after the heat shield is removed;

[0049] Figure 7 It is a connection logic diagram between modules in the single bus temperature sensor array positioning and calibration device based on hot spot recognition described in the present invention;

[0050] Figure 8 is an operation flow chart of the single bus temperature sensor array positioning and calibration device based on hot spot recognition in the first mode of the present invention;

[0051] Fig. 9 is an operation flow chart of the single bus temperature sensor array positioning and calibration device based on hot spot recognition in the second mode according to the present invention;

[0052] The symbols in the figure are:

[0053] 1. Base; 101. Display screen; 102. Operation buttons; 103. USB interface; 104. Power interface; 105. Communication interface; 106. First air inlet; 107. Water inlet; 108. Water outlet; 2. Heat insulation cover; 3. Test module; 301. Liquid cooling plate; 302. Heating array substrate; 303. Heating unit array; 304. Temperature sensor array; 305. Cooling medium inlet; 306. Cooling medium outlet; 4. Heating and ventilation module; 401. Delivery pipeline; 402. Second air inlet; 403. Exhaust outlet; 404. Air temperature sensor in the cover; 405. Inlet air temperature sensor; 5. Main control board; DETAILED DESCRIPTION

[0054] The following will be combined with the drawings in the embodiments of the present application to clearly describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments in the present application belong to the scope of protection of this application.

[0055] In the description of the present application, it should be noted that the terms used herein are only for describing specific embodiments, and are not intended to limit the exemplary embodiments according to the present application. For ease of description, the sizes of the various parts shown in the drawings are not drawn according to the actual proportional relationship. The technology, methods and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, methods and equipment should be regarded as part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as merely exemplary, rather than as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that similar numbers and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.

[0056] It should be noted that the term "and / or" in the specification and claims of the present application indicates at least one of the connected objects, and the character " / " generally indicates that the front and back related objects are in an "or" relationship. In the description of the present application, the orientation or position relationship indicated by the terminology of orientation words such as "front, back, up, down, left, right", "lateral, vertical, vertical, horizontal" and "top, bottom" is usually based on the orientation or position relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description. Unless otherwise stated, these orientation words do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the scope of protection of the present application; the orientation words "inside and outside" refer to the inside and outside relative to the outline of each component itself.

[0057] It should be noted that, in the present application, the terms "comprise", "include" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises one..." does not exclude the presence of other identical elements in the process, method, article or device including the element. In addition, it should be noted that the scope of the method and device in the embodiment of the present application is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in reverse order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0058] like Figures 1 to 9 As shown, a single-bus temperature sensor array positioning and calibration device based on hot spot recognition includes: a test module 3 and a main control board 5, wherein the test module 3 is connected to the main control board 5, and the main control board 5 can adjust the state of the test module 3;

[0059] Wherein, the test module 3 includes:

[0060] A heating array substrate 302, on which a heating unit array 303 is arranged, wherein the heating unit array 303 includes a plurality of heating units, each of which can be individually controlled by the main control board 5 to generate heat according to its row and column position;

[0061] A temperature sensing array 304, which includes a plurality of single-bus temperature sensors, the temperature sensing array 304 is arranged opposite to the heating unit array 303, and each single-bus temperature sensor is configured with a heating unit corresponding thereto;

[0062] When a single heating unit is working, a hot spot will be formed on the heating array substrate 302. The temperature of the hot spot will be measured by the temperature sensing array 304 to locate and identify the single-bus temperature sensor. Then, the ID number of the single-bus temperature sensor will be bound to the physical space position based on the location.

[0063] As some examples of the present invention, the number of the heating units can be more than the number of the single bus temperature sensors, and it is only necessary to ensure that each single bus temperature sensor is equipped with a heating unit corresponding to it. In this way, the same heating unit array 303 can locate multiple types of temperature sensor arrays 304.

[0064] Preferably, the heating unit array 303 is prepared by printed circuit processing.

[0065] Preferably, the heating array substrate 302 is made of a multi-layer structure material with thermal and electrical isolation, such as a copper substrate or an aluminum substrate.

[0066] Preferably, the temperature sensing array 304 measures the highest temperature point of the hot spot to achieve positioning, identification and temperature calibration of the single-bus temperature sensor.

[0067] As some examples of the present invention, the heating unit array 303 can be set on the upper side or the lower side of the heating array substrate 302. It only needs that the heating unit array 303 can heat the heating array substrate 302 and form hot spots at different positions on the heating array substrate 302.

[0068] Preferably, the heating unit array 303 is arranged on the lower side of the heating array substrate 302 , that is, on the side close to the liquid cooling plate 301 .

[0069] Furthermore, the test module 3 also includes:

[0070] The liquid cooling plate 301 has cooling liquid passing therein. The liquid cooling plate 301 is located on the lower side of the heating array substrate 302, and the temperature sensing array 304 is located on the upper side of the heating array substrate 302. In this way, the operation of the liquid cooling plate 301 can ensure that a constant uniform temperature field is formed around the heating array substrate 302.

[0071] As some examples of the present invention, the liquid cooling plate 301 is a hollow structure, and the liquid cooling plate 301 is filled with a cooling medium.

[0072] Preferably, the liquid cooling plate 301 is filled with a circulating cooling medium. Specifically, a cooling medium inlet 305 and a cooling medium outlet 306 are respectively provided on the liquid cooling plate 301, and an external low-temperature cooling medium can enter the liquid cooling plate 301 through the cooling medium inlet 305, and be discharged through the cooling medium outlet 306 after heat exchange and temperature increase.

[0073] Furthermore, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition also includes: a base 1, on which the liquid cooling plate 301, the heating array substrate 302, the heating unit array 303, the temperature sensor array 304 and the main control board 5 are arranged.

[0074] Specifically, a groove is provided on the upper portion of the base 1 to form a housing space for the liquid cooling plate 301, the heating array substrate 302, the heating unit array 303 and the temperature sensor array 304. The temperature sensor array 304, the heating array substrate 302, the heating unit array 303 and the liquid cooling plate 301 are arranged in the groove in sequence from top to bottom.

[0075] As some examples of the present invention, a hollow space for accommodating the main control board 5 is also provided in the base 1. Preferably, the main control board 5 is arranged below the liquid cooling plate 301. In this way, the heat generated by the heating unit array 303 can be prevented from having an adverse effect on the main control board 5. At the same time, the liquid cooling plate 301 can be used to cool the space below it, thereby indirectly dissipating the heat for the main control board 5.

[0076] As some examples of the present invention, the base 1 is also provided with a display screen 101, an operation button 102, a USB interface 103, a power interface 104 and a communication interface 105, wherein the display screen 101 is used to display text, pictures, videos and other information, and the operation button 102 is used to input instructions to the display screen 101 or the single-bus temperature sensor array positioning and calibration device based on hot spot recognition and control, and the instructions that can be input by the operation button 102 can be power on, power off, mode switching, etc.; the USB interface 103 is used to implement the hot spot recognition-based The communication connection between the single-bus temperature sensor array positioning and calibration device based on hot spot identification and the external device; the power interface 104 is used to connect to the external power supply equipment and transmit electric energy to the single-bus temperature sensor array positioning and calibration device based on hot spot identification; the communication interface 105 is used to connect to the external cooling equipment and monitor the temperature, flow, start and stop status of the cooling medium (such as water) provided by the cooling equipment. The external cooling equipment is connected to the liquid cooling plate 301 to receive the high-temperature cooling medium discharged from the liquid cooling plate 301, cool it, and then input the low-temperature cooling medium into the liquid cooling plate 301.

[0077] As some examples of the present invention, a water inlet 107 and a water outlet 108 are also provided on the base 1, and the water inlet 107 and the water outlet 108 are respectively connected to the cooling medium inlet 305 and the cooling medium outlet 306 on the liquid cooling plate 301 through connecting hoses. At the same time, the water inlet 107 and the water outlet 108 are also connected to an external cooling device.

[0078] Furthermore, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition further includes a heat shield 2, which is buckled on the base 1, and the test module 3 is located in a closed space formed by the base 1 and the heat shield 2. The function of the heat shield 2 is to provide heat insulation during the test process to reduce heat loss and environmental impact.

[0079] Furthermore, the single-bus temperature sensor array positioning and calibration device based on hot spot recognition also includes a heating and ventilation module 4. During operation, the heating and ventilation module 4 can deliver air of a certain temperature to the enclosed space formed by the base 1 and the heat insulation cover 2, so as to regulate the ambient temperature in the enclosed space.

[0080] Specifically, the heating and ventilation module 4 includes:

[0081] The delivery pipe 401 has one end connected to the first air inlet 106 disposed on the outer side wall of the base 1, and the other end connected to the second air inlet 402 disposed on the upper surface of the base 1, and the second air inlet 402 is located in the closed space enclosed by the base 1 and the heat insulation cover 2. In this way, the delivery pipe 401 can connect the external space of the single bus temperature sensing array positioning and calibration device based on hot spot recognition with the closed space enclosed by the base 1 and the heat insulation cover 2, and can deliver external air to the closed space enclosed by the base 1 and the heat insulation cover 2.

[0082] Furthermore, the heating and ventilation module 4 also includes:

[0083] The exhaust port 403 is arranged on the upper surface of the base 1, and the exhaust port 403 can connect the closed space formed by the base 1 and the heat insulation cover 2 with the external atmosphere to discharge the gas in the closed space formed by the base 1 and the heat insulation cover 2.

[0084] Preferably, the number of the exhaust ports 403 is 3 to 6, and the exhaust ports 403 are arranged around the test module 3 .

[0085] Furthermore, a plurality of air temperature sensors 404 are arranged in the closed space formed by the base 1 and the heat insulation cover 2. The air temperature sensors 404 are used to measure the ambient temperature in the closed space.

[0086] Preferably, the number of the air temperature sensors 404 inside the hood is 3 to 8, and the air temperature sensors 404 inside the hood are evenly arranged at various locations in the closed space.

[0087] In addition, an air inlet temperature sensor 405 is provided at the first air inlet 106 , and the air inlet temperature sensor 405 is used to detect the temperature of air entering through the first air inlet 106 .

[0088] Furthermore, the heating and ventilation module 4 also includes: a heating device and an air delivery device such as a fan, which can achieve constant temperature control of the air temperature in the enclosed space by controlling the heating power and air volume of the heating device and combining the PID algorithm.

[0089] Furthermore, the connection logic between the modules in the single bus temperature sensor array positioning and calibration device based on hot spot recognition is as follows: Figure 7 As shown: the main control board 5 is connected to all sensors and control components to realize functions such as data acquisition, equipment control, data display, and data storage. Specifically, the detection and input devices such as the operation button 102, the air temperature sensor 404 in the hood, the air inlet temperature sensor 404, and the temperature sensor array 304 are respectively connected to the main control board 5, and the detection data or instructions can be input to the main control board 5. In addition, the main control board 5 is also connected to the heating and ventilation module 4, the heating array substrate 302, the display screen 101, and the cooling control module. At the same time, the temperature sensor array 304 is connected to the external storage device through the main control board 5 to store the data in the sensor positioning and calibration process.

[0090] Furthermore, according to different test purposes, the single bus temperature sensor array positioning and calibration device based on hot spot recognition has two operating modes, namely:

[0091] The first mode is used to calibrate the hot spot temperature at each point on the heat-generating array substrate 302 under standard working conditions;

[0092] The second mode is used to perform address binding and temperature correction on the temperature sensing array integrated circuit under test.

[0093] The operation process of the first mode is as follows: Figure 8 As shown, it mainly includes the following steps:

[0094] S1, place the standard temperature sensor array integrated circuit on the heating array substrate 302, and connect it to the main control board 5 through the data line, and then cover it with the heat insulation cover 2;

[0095] S2, set the working parameters, such as the temperature of the liquid cooling plate 301, the air temperature in the cover, etc., and press the start button to start the test. The main control board 5 controls the temperature of the liquid cooling plate 301 and the air temperature in the cover according to the set values;

[0096] S3, after the temperature of the liquid cooling plate 301 and the air in the cover is stable, the main control board 5 controls the heating units on the heating array substrate 302 one by one to perform constant power heating, thereby forming a hot spot;

[0097] S4, the main control board 5 uses the ID to read the sensor temperature at the hot spot position. When the temperature value stabilizes, read the temperature value at this time and use the temperature value as the equilibrium temperature Tstd (i) Assign a value to the heating unit that forms the hot spot and store the temperature value in the hot spot array standard temperature matrix T std middle;

[0098] S5, after all the hot spot temperatures of all the heating units are read in sequence, the complete hot spot array standard temperature matrix T can be obtained. std , complete the standard working condition calibration.

[0099] It should be noted that in the first mode, a matching temperature sensor array integrated circuit standard component is required for testing. The standard component has known ID numbers of each sensor and corresponding ID data files, and each sensor has been temperature calibrated.

[0100] In addition, the operation process of the second mode is as follows Fig. 9 As shown, it mainly includes the following steps:

[0101] P1, place the DUT on the heating array substrate 302, connect it to the main control board 5 via a data line, and then cover it with a heat insulation cover 2;

[0102] P2, set the working parameters, such as the temperature of the liquid cooling plate 301, the air temperature in the cover, etc., and press the start button to start the test. The main control board 5 controls the temperature of the liquid cooling plate 301 and the air temperature in the cover according to the set values;

[0103] P3, after the temperature of the liquid cooling plate 301 and the air in the cover is stable, the main control board 5 controls the heating units on the heating array substrate 302 one by one to perform constant power heating, thereby forming a hot spot;

[0104] P4, the main control board 5 reads the temperature array formed by the temperature values ​​of all sensors on the test piece, extracts the highest temperature value after the temperature value stabilizes, and reads the sensor ID number corresponding to the highest temperature value;

[0105] P5, the highest temperature value is taken as the hot spot equilibrium temperature T cal (i) assigning a value to the corresponding sensor, assigning the sensor ID number corresponding to the highest temperature value to the corresponding sensor, and storing the highest temperature value and the sensor ID number corresponding to the highest temperature value in the hot spot equilibrium temperature matrix T corresponding to the hot spot array. cal and ID number matrix Addr;

[0106] P6, after all the heat-generating units have completed the hot spot equilibrium temperature and ID number reading, the hot spot equilibrium temperature matrix T cal The data of the ID number matrix Addr is exported to an external storage device, and the address binding is finally completed.

[0107] Furthermore, the second mode further comprises the steps of:

[0108] P7, for the standard temperature matrix T std and hot spot equilibrium temperature matrix T cal Make a comparison and calibrate the temperature of the test piece.

[0109] In the present invention, the standard temperature matrix T std and hot spot equilibrium temperature matrix T cal The specific process of making a comparison and realizing temperature correction of the test piece is well known to those skilled in the art and will not be described in detail here.

[0110] In summary, the single-bus temperature sensor array positioning and calibration device based on hot spot identification described in the present invention is based on heat transfer theory, through integrated design of heat transfer, structure, circuit and other aspects, and utilizes the rapid heat dissipation characteristics of high-temperature small-size heating modules on high-thermal conductivity metal plates to form concentrated heat hot spots on the metal plate. And further, through the numerical response of the temperature sensor to the high-temperature hot spot, the sensor ID is bound to its physical spatial position in the temperature sensor array. At the same time, the program control of the hot spot is realized through circuit design, thereby realizing batch automatic identification and binding of the temperature sensor array.

[0111] The single-bus temperature sensor array positioning and calibration device based on hot spot recognition described in the present invention not only solves the problem of binding physical objects and IDs in the networking application of single-bus temperature sensors, but also improves the efficiency of automatic batch reading and debugging of ID numbers in the bus temperature sensor array networking system, thereby improving the feasibility of networking applications of single-bus temperature sensors in industrial scenarios, reducing installation and debugging costs, simplifying wiring harness layout, and reducing wiring harness costs.

[0112] The embodiments of the present application are described above in conjunction with the accompanying drawings. In the absence of conflict, the embodiments in the present application and the features in the embodiments can be combined with each other. The present application is not limited to the above-mentioned specific implementation methods. The above-mentioned specific implementation methods are merely illustrative and not restrictive. Under the guidance of the present application, ordinary technicians in this field can also make many forms without departing from the purpose of the present application and the scope of protection of the claims, all of which are within the protection of the present application.

Claims

1. A single bus temperature sensor array positioning and calibration device based on hot spot recognition, characterized in that: include: A test module (3) and a main control board (5), wherein the test module (3) is connected to the main control board (5), and the main control board (5) is capable of regulating the state of the test module (3); Wherein, the test module (3) comprises: A heating array substrate (302) on which a heating unit array (303) is arranged, wherein the heating unit array (303) includes a plurality of heating units, and each heating unit can be individually controlled by the main control board (5) to generate heat according to its row and column position; A temperature sensing array (304) comprising a plurality of single-bus temperature sensors, wherein the temperature sensing array (304) is arranged opposite to the heating unit array (303), and each single-bus temperature sensor is configured with a heating unit corresponding thereto; When a single heating unit is working, a hot spot will be formed on the heating array substrate (302). The temperature of the hot spot is measured by the temperature sensing array (304) to achieve the positioning and identification of the single-bus temperature sensor. Then, based on the positioning, the ID number of the single-bus temperature sensor is bound to the physical space position.

2. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 1 is characterized in that: The heating unit array (303) is manufactured by printed circuit processing, and the heating array substrate (302) is manufactured by using a thermal and electrical isolation multilayer material.

3. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 1, characterized in that: The temperature sensing array (304) is located on the upper side of the heating array substrate (302), and the heating unit array (303) is arranged on the lower side of the heating array substrate (302).

4. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 1, characterized in that: The test module (3) further comprises: A liquid cooling plate (301) having cooling liquid passing therein, the liquid cooling plate (301) being located on the lower side of the heating array substrate (302); The liquid cooling plate (301) is a hollow structure, and a circulating cooling medium is filled inside the liquid cooling plate (301).

5. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 4 is characterized in that: The single bus temperature sensor array positioning and calibration device based on hot spot recognition also includes: a base (1); A groove is provided on the upper part of the base (1) to form a housing space for the liquid cooling plate (301), the heating array substrate (302), the heating unit array (303) and the temperature sensing array (304); the temperature sensing array (304), the heating array substrate (302), the heating unit array (303) and the liquid cooling plate (301) are arranged in the groove in sequence from top to bottom.

6. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 5, characterized in that: The single-bus temperature sensor array positioning and calibration device based on hot spot recognition also includes a heat insulation cover (2) which is buckled on the base (1), and the test module (3) is located in a closed space formed by the base (1) and the heat insulation cover (2).

7. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 6, characterized in that: The single-bus temperature sensor array positioning and calibration device based on hot spot recognition also includes a heating and ventilation module (4). During operation, the heating and ventilation module (4) can transport air of a certain temperature into the closed space formed by the base (1) and the heat insulation cover (2), so as to regulate the ambient temperature in the closed space.

8. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to claim 7, characterized in that: The heating and ventilation module (4) comprises: a delivery pipe (401), one end of which is connected to a first air inlet (106) arranged on the outer wall of the base (1), and the other end of which is connected to a second air inlet (402) arranged on the upper surface of the base (1), wherein the second air inlet (402) is located in a closed space formed by the base (1) and the heat insulation cover (2); an exhaust port (403), the exhaust port (403) being arranged on the upper surface of the base (1), and the exhaust port (403) being capable of connecting the closed space formed by the base (1) and the heat insulation cover (2) with the external atmosphere, so as to discharge the gas in the closed space formed by the base (1) and the heat insulation cover (2); an air temperature sensor (404), which is used to measure the ambient temperature in the enclosed space; An air inlet temperature sensor (405) is used to detect the temperature of air entering through the first air inlet (106).

9. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to any one of claims 1 to 8, characterized in that: The single bus temperature sensor array positioning and calibration device based on hot spot identification can operate in a first mode, which is used to calibrate the hot spot temperature of each point on the heating array substrate under standard working conditions. The first mode includes the following steps: S1, place the standard temperature sensor array integrated circuit on the heating array substrate, connect it to the main control board through a data line, and then cover it with a heat insulation cover; S2, set the working parameters and press the start button to start the test. The main control board controls the temperature of the liquid cooling plate and the air inside the cover according to the set values; S3, after the temperature of the liquid cooling plate and the air in the cover is stable, the main control board controls the heating units on the heating array substrate one by one to perform constant power heating, thereby forming a hot spot; S4, the main control board uses the ID to read the sensor temperature at the hot spot position. When the temperature value stabilizes, read the temperature value at this time and use the temperature value as the equilibrium temperature T std (i) Assign a value to the heating unit that forms the hot spot and store the temperature value in the hot spot array standard temperature matrix T std middle; S5, after all the hot spot temperatures of all the heating units are read in sequence, a complete hot spot array standard temperature matrix T is obtained. std , complete the standard working condition calibration.

10. The single bus temperature sensor array positioning and calibration device based on hot spot recognition according to any one of claims 1 to 8, characterized in that: The single-bus temperature sensor array positioning and calibration device based on hot spot recognition can operate in a second mode, which is used to perform address binding and temperature correction on a temperature sensor array integrated circuit under test. The second mode includes the following steps: P1, place the DUT on the heating array substrate and connect it to the main control board via a data cable, then cover it with a heat shield; P2, set the working parameters and press the start button to start the test. The main control board controls the temperature of the liquid cooling plate 301 and the air inside the cover according to the set values; P3, after the temperature of the liquid cooling plate and the air in the cover is stable, the main control board controls the heating units on the heating array substrate one by one to perform constant power heating, thereby forming a hot spot; P4, the main control board reads the temperature array formed by the temperature values ​​of all sensors on the device under test. After the temperature values ​​are stable, the highest temperature value is extracted and the sensor ID number corresponding to the highest temperature value is read; P5, the highest temperature value is taken as the hot spot equilibrium temperature T cal (i) assigning a value to the corresponding sensor, assigning the sensor ID number corresponding to the highest temperature value to the corresponding sensor, and storing the highest temperature value and the sensor ID number corresponding to the highest temperature value in the hot spot equilibrium temperature matrix T corresponding to the hot spot array. cal and ID number matrix Addr; P6, after all the heat-generating units have completed the hot spot equilibrium temperature and ID number reading, the hot spot equilibrium temperature matrix T cal The data of the ID matrix Addr is exported to an external storage device to complete the address binding; P7, for the standard temperature matrix T std and hot spot equilibrium temperature matrix T cal Make a comparison and calibrate the temperature of the test piece.

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