Processing equipment for chip ceramic cover and electromagnetic wave isolation structure
By designing a processing equipment for chip ceramic covers and electromagnetic wave isolation structures, U-shaped bases, conveyor belts, extrusion rods and driving mechanisms are used to achieve continuous assembly, which solves the problems of low efficiency and unstable assembly of existing equipment and improves Improve processing efficiency and ensure assembly quality.
Patent Information
- Application Number
- CN202411330669.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-24
- Publication Date
- 2025-01-24
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The existing processing equipment for chip ceramic covers and electromagnetic wave isolation structures cannot achieve continuous assembly, resulting in low processing efficiency and difficulty in ensuring the solid and smooth assembly.
Machining equipment including the U -shaped base, the conveyor belt, the extrusion rod and the driver mechanism. The first conveyor belt and second conveyor belt installed in horizontal installation drive the ceramic cover and electromagnetic wave isolation structure forward, and use the squeezing rod and the driver to realize the whereabouts of the electromagnetic wave isolation structure and the tight connection of the ceramic cover.
The continuous assembly of the ceramic cover and the electromagnetic wave isolation structure, improved the processing efficiency, and ensure the strong and flat assembly.
Smart Images

Figure CN119361472A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of chip production, and in particular to a processing device for a chip ceramic cover and an electromagnetic wave isolation structure. Background Art
[0002] The traditional chip ceramic metal packaging technology is to sinter the chip on a high thermal conductivity metal material, then connect the chip's electrical characteristics to the corresponding packaging pins through gold wires, and finally glue the ceramic cover to the packaging pins and the insulating layer. However, since the chip is generally small in size, its input gold wire LG and output gold wire LD are close to each other. The electromagnetic wave signal passing through the chip will be equivalent to a capacitor between its input and output. This capacitor will affect the frequency response curve of the entire device, resulting in reduced performance and stability of the device. Therefore, an M-shaped electromagnetic wave isolation structure can be bonded to the inside of the ceramic cover, which displays the pattern of the wrapped gold wire according to the parameter characteristics of the gold wire LG and the gold wire LD, and is used to absorb or block part of the electromagnetic wave signal.
[0003] The assembly between the ceramic cover and the electromagnetic wave isolation structure requires special processing equipment, but the existing processing equipment for chip ceramic covers and electromagnetic wave isolation structures cannot achieve continuous assembly, the processing efficiency is low, and it is difficult to ensure that the assembly between the ceramic cover and the electromagnetic wave isolation structure is firm and smooth. Summary of the invention
[0004] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a processing device for a chip ceramic cover and an electromagnetic wave isolation structure.
[0005] In order to achieve the above object, the present invention adopts the following technical solutions:
[0006] A processing device for a chip ceramic cover and an electromagnetic wave isolation structure, comprising: a U-shaped base, a first conveyor belt and a second conveyor belt are horizontally installed below and above the inside of the U-shaped base, a first baffle is welded above the tail end of the U-shaped base, and a second baffle is welded below the discharge end of the second conveyor belt inside the U-shaped base;
[0007] Extrusion rods, wherein two extrusion rods are provided, and a horizontal plate is horizontally welded on the top of the two extrusion rods;
[0008] The driving mechanism is used to drive the first conveyor belt and the second conveyor belt to transport and drive the cross plate to rise and fall reciprocally.
[0009] Place the ceramic cover with glue coated inside facing upward on the first conveyor belt in turn, and place the electromagnetic wave isolation structure on the second conveyor belt in turn. Start the first conveyor belt and the second conveyor belt at the same time to transport the ceramic cover and the electromagnetic wave isolation structure forward. Stop conveying when the ceramic cover is transported to the front. At this time, the electromagnetic wave isolation structure leaves the top of the second conveyor belt, and its bottom lacks supporting force, causing it to move downward under the action of gravity until the electromagnetic wave isolation structure falls into the upwardly placed ceramic cover. The ceramic cover and the electromagnetic wave isolation structure are continuously transported forward and assembled one by one, which can achieve continuous assembly and improve processing efficiency.
[0010] As a further technical solution of the present invention, the length of the second conveyor belt is shorter than that of the first conveyor belt, and a controller is fixedly installed on the outer side of the U-shaped base.
[0011] As a further technical solution of the present invention, a limiting rod is vertically welded at one corner of the top of the U-shaped base, the limiting rod passes through the cross plate and is slidably connected to the cross plate, and two extrusion rods are located above the first baffle and the second baffle.
[0012] As a further technical solution of the present invention, the driving mechanism includes a rotating motor, an L-shaped mounting plate is welded to the outside of the U-shaped base, the rotating motor is horizontally fixedly installed on the inner side of the L-shaped mounting plate, a turntable is fixedly installed on the output end of the rotating motor, a plurality of ratchets are welded to a part of the outer periphery of the turntable, a first driven gear and a second driven gear are respectively provided on opposite sides of the turntable, and the plurality of ratchets are meshed with the first driven gear and the second driven gear in sequence, a first driven shaft is horizontally welded at the center of the first driven gear, the other end of the first driven shaft is rotatably connected to the U-shaped base, the active rollers of the first conveyor belt and the second conveyor belt are respectively horizontally welded with a first linkage shaft and a second linkage shaft, the first linkage shaft and the second linkage shaft both pass through one side of the U-shaped base and are rotatably connected to the U-shaped base, the first linkage shaft and the first driven shaft are connected with the same first belt, and the first linkage shaft and the second linkage shaft are connected with the same second belt.
[0013] Start the rotating motor to drive the turntable to rotate clockwise, and the multiple ratchet teeth on the turntable first mesh with the first driven gear to drive the first driven gear to rotate counterclockwise, and the first driven gear drives the first driven shaft to rotate counterclockwise, and the first driven shaft drives the second linkage shaft to rotate counterclockwise through the first belt, and the second linkage shaft drives the first linkage shaft to rotate counterclockwise through the second belt, and the first linkage shaft and the second linkage shaft respectively drive the active rollers of the first conveyor belt and the second conveyor belt to rotate counterclockwise, and the active roller cooperates with the driven roller to drive the first conveyor belt and the second conveyor belt to convey forward.
[0014] As a further technical solution of the present invention, a second driven shaft is horizontally welded at the center of the second driven gear, and the other end of the second driven shaft is rotatably connected to the U-shaped base. A large disk is welded on the second driven shaft, and a circular groove is opened on one side of the large disk. A small disk is welded at the center of the circular groove, and a plurality of inner convex teeth are welded on part of the inner wall of the circular groove, and a plurality of outer convex teeth are welded on part of the outer circumference of the small disk. A small gear is arranged in the circular groove, and the small gear is meshed with the plurality of inner convex teeth and the plurality of outer convex teeth in sequence. A connecting shaft is horizontally welded at the center of the small gear, and a driving gear is welded on the other end of the connecting shaft. An L-shaped support block is welded on the outside of the U-shaped base, and the connecting shaft passes through the L-shaped support block and is rotatably connected to the L-shaped support block. A rack is vertically meshed on the side of the driving gear, and the rack is welded to one end of the bottom of the horizontal plate.
[0015] When the ceramic cover and the electromagnetic wave isolation structure are transported to the front and the electromagnetic wave isolation structure falls into the interior of the upwardly placed ceramic cover, the multiple ratchet teeth on the turntable engage with the second driven gear to drive the second driven gear to rotate counterclockwise, and the second driven gear drives the second driven shaft to rotate counterclockwise, and the second driven shaft drives the large disc and the small disc to rotate counterclockwise together, and the multiple inner convex teeth on the inner wall of the circular groove first engage with the small gear to drive the small gear to rotate counterclockwise, and the small gear drives the driving gear to rotate counterclockwise through the connecting shaft, and the driving gear drives the rack to move downward, and the rack drives the two extrusion rods to move downward through the cross plate, and the two extrusion rods squeeze the electromagnetic wave isolation structure downward and tightly connect it to the ceramic cover, which can ensure that the assembly between the ceramic cover and the electromagnetic wave isolation structure is more solid and smooth.
[0016] The beneficial effects of the present invention are as follows: the ceramic cover and the electromagnetic wave isolation structure are continuously conveyed forward and assembled one by one, which can realize continuous assembly and improve processing efficiency; the electromagnetic wave isolation structure can be pressed downward and tightly connected to the ceramic cover, which can ensure that the assembly between the ceramic cover and the electromagnetic wave isolation structure is more solid and smooth. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 A schematic diagram of a processing device for a chip ceramic cover and an electromagnetic wave isolation structure proposed by the present invention;
[0018] Figure 2 A schematic diagram of a processing device for a chip ceramic cover and an electromagnetic wave isolation structure proposed by the present invention;
[0019] Figure 3 A schematic diagram of a processing device for a chip ceramic cover and an electromagnetic wave isolation structure proposed by the present invention;
[0020] Figure 4A schematic diagram of a processing device for a chip ceramic cover and an electromagnetic wave isolation structure proposed by the present invention;
[0021] Figure 5 The present invention provides a schematic structural diagram of a processing device for a chip ceramic cover and an electromagnetic wave isolation structure.
[0022] In the figure: 1. horizontal plate; 2. rack; 3. large disc; 4. second driven gear; 5. rotating motor; 6. L-shaped mounting plate; 7. first driven gear; 8. first belt; 9. second belt; 10. first linkage shaft; 11. first conveyor belt; 12. second conveyor belt; 13. U-shaped base; 14. first driven shaft; 15. turntable; 16. limit rod; 17. extrusion rod; 18. first baffle; 19. ratchet; 20. second linkage shaft; 21. connecting shaft; 22. driving gear; 23. controller; 24. second baffle; 25. inner convex teeth; 26. outer convex teeth; 27. small gear; 28. circular groove; 29. second driven shaft; 30. small disc. DETAILED DESCRIPTION
[0023] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.
[0024] Please see attached Figure 1 -Attached Figure 5 , a processing device for a chip ceramic cover and an electromagnetic wave isolation structure, comprising: a U-shaped base 13, a first conveyor belt 11 and a second conveyor belt 12 are horizontally installed below and above the inside of the U-shaped base 13, a first baffle plate 18 is welded above the tail end of the U-shaped base 13, and a second baffle plate 24 is welded below the discharge end of the second conveyor belt 12 inside the U-shaped base 13;
[0025] Extrusion rods 17, two extrusion rods 17 are provided, and a horizontal plate 1 is horizontally welded to the top of the two extrusion rods 17;
[0026] The driving mechanism is used to drive the first conveyor belt 11 and the second conveyor belt 12 to transport and drive the horizontal plate 1 to rise and fall back and forth. The first baffle plate 18 and the second baffle plate 24 cooperate with the two sides of the U-shaped base 13 to limit the falling of the electromagnetic wave isolation structure, so that it can only fall directly toward the ceramic cover to prevent it from deviating, and ensure that the electromagnetic wave isolation structure falls exactly into the ceramic cover.
[0027] Please see attached Figure 1-5 In a preferred embodiment, the second conveyor belt 12 is shorter than the first conveyor belt 11 , and a controller 23 is fixedly mounted on the outer side of the U-shaped base 13 . The controller 23 controls the operation of the rotating motor 5 .
[0028] Please see attached Figure 1-5 In a preferred embodiment, a limiting rod 16 is vertically welded at one corner of the top of the U-shaped base 13, the limiting rod 16 passes through the horizontal plate 1 and is slidably connected to the horizontal plate 1, and two extrusion rods 17 are located above the first baffle 18 and the second baffle 24. The limiting rod 16 limits the lifting and lowering of the horizontal plate 1 so that it cannot be skewed.
[0029] Please see attached Figure 1-5 In a preferred embodiment, the driving mechanism includes a rotating motor 5, an L-shaped mounting plate 6 is welded to the outside of the U-shaped base 13, the rotating motor 5 is horizontally fixedly mounted on the inside of the L-shaped mounting plate 6, and a turntable 15 is fixedly mounted on the output end of the rotating motor 5. The L-shaped mounting plate 6 provides support for the rotating motor 5.
[0030] Please see attached Figure 1-5 In a preferred embodiment, a plurality of ratchet teeth 19 are welded on part of the outer periphery of the turntable 15, and a first driven gear 7 and a second driven gear 4 are respectively disposed on opposite sides of the turntable 15, and the plurality of ratchet teeth 19 are meshed with the first driven gear 7 and the second driven gear 4 in sequence.
[0031] Please see attached Figure 1-5 In a preferred embodiment, a first driven shaft 14 is horizontally welded at the center of the first driven gear 7, the other end of the first driven shaft 14 is rotatably connected to the U-shaped base 13, and the active rollers of the first conveyor belt 11 and the second conveyor belt 12 are horizontally welded with a first linkage shaft 10 and a second linkage shaft 20 respectively.
[0032] Please see attached Figure 1-5 In a preferred embodiment, the first linkage shaft 10 and the second linkage shaft 20 both pass through one side of the U-shaped base 13 and are rotatably connected to the U-shaped base 13, the same first belt 8 is connected between the first linkage shaft 10 and the first driven shaft 14, and the same second belt 9 is connected between the first linkage shaft 10 and the second linkage shaft 20.
[0033] Please see attached Figure 1-5 In a preferred embodiment, a second driven shaft 29 is horizontally welded at the center of the second driven gear 4, and the other end of the second driven shaft 29 is rotatably connected to the U-shaped base 13. A large disc 3 is welded on the second driven shaft 29, and a circular groove 28 is opened on one side of the large disc 3, and a small disc 30 is welded at the center of the circular groove 28.
[0034] Please see attached Figure 1-5 In a preferred embodiment, a plurality of inner convex teeth 25 are welded to a portion of the inner wall of the circular groove 28, a plurality of outer convex teeth 26 are welded to a portion of the outer periphery of the small disc 30, and a small gear 27 is provided in the circular groove 28, and the small gear 27 is meshed with the plurality of inner convex teeth 25 and the plurality of outer convex teeth 26 in sequence.
[0035] Please see attached Figure 1-5 In a preferred embodiment, a connecting shaft 21 is horizontally welded at the center of the pinion 27, a driving gear 22 is welded at the other end of the connecting shaft 21, an L-shaped support block is welded outside the U-shaped base 13, and the connecting shaft 21 passes through the L-shaped support block and is rotatably connected to the L-shaped support block, a rack 2 is vertically meshed on the side of the driving gear 22, and the rack 2 is welded to one end of the bottom of the horizontal plate 1. The L-shaped support block provides support for the connecting shaft 21.
[0036] From the above description, it can be seen that the above-mentioned embodiment of the present invention achieves the following technical effects: the ceramic cover with glue applied inside is placed upward on the first conveyor belt 11 in turn, and the electromagnetic wave isolation structure is placed on the second conveyor belt 12 in turn, and the rotating motor 5 is started to drive the turntable 15 to rotate clockwise, and the multiple ratchet teeth 19 on the turntable 15 first mesh with the first driven gear 7 to drive the first driven gear 7 to rotate counterclockwise, and the first driven gear 7 drives the first driven shaft 14 to rotate counterclockwise, and the first driven shaft 14 drives the second linkage shaft 20 to rotate counterclockwise through the first belt 8, and the second linkage shaft 20 drives the first linkage shaft 10 to rotate counterclockwise through the second belt 9, and the first linkage shaft 10 and the second linkage shaft 20 respectively drive the active rollers of the first conveyor belt 11 and the second conveyor belt 12 to rotate counterclockwise, and the active roller cooperates with the driven roller to drive the first conveyor belt 11 and the second conveyor belt 12 to convey forward;
[0037] The first conveyor belt 11 and the second conveyor belt 12 convey the ceramic cover and the electromagnetic wave isolation structure forward, and the conveyance stops when the ceramic cover is conveyed to the front. At this time, the electromagnetic wave isolation structure leaves the top of the second conveyor belt 12, and the bottom lacks support force, so that it moves downward under the action of gravity until the electromagnetic wave isolation structure falls into the interior of the ceramic cover placed upward;
[0038] When the ceramic cover and the electromagnetic wave isolation structure are transported to the front, and the electromagnetic wave isolation structure falls into the interior of the ceramic cover placed upward, the multiple ratchet teeth 19 on the turntable 15 mesh with the second driven gear 4 to drive the second driven gear 4 to rotate counterclockwise, and the second driven gear 4 drives the second driven shaft 29 to rotate counterclockwise, and the second driven shaft 29 drives the large disc 3 and the small disc 30 to rotate counterclockwise together, and the multiple inner convex teeth 25 on the inner wall of the circular groove 28 first mesh with the pinion 27 to drive the pinion 27 to rotate counterclockwise, and the pinion 27 drives the driving gear 22 to rotate counterclockwise through the connecting shaft 21, and the driving gear 22 drives the rack 2 to move downward, and the rack 2 drives the two extrusion rods 17 to move downward through the cross plate 1, and the two extrusion rods 17 squeeze the electromagnetic wave isolation structure downward and tightly connect it to the ceramic cover, which can ensure that the assembly between the ceramic cover and the electromagnetic wave isolation structure is more solid and smooth;
[0039] When the multiple inner convex teeth 25 and the pinion 27 are meshed, the multiple outer convex teeth 26 on the outer periphery of the small disc 30 mesh with the pinion 27 to drive the pinion 27 to rotate clockwise, and the pinion 27 drives the driving gear 22 to rotate clockwise through the connecting shaft 21, and the driving gear 22 drives the rack 2 to move upward, and the rack 2 drives the two extrusion rods 17 to move upward and return to their original positions through the cross plate 1;
[0040] The above operation is repeated, and the ceramic cover and the electromagnetic wave isolation structure are continuously transported forward and assembled one by one. The two extrusion rods 17 squeeze downward to tightly connect the ceramic cover and the electromagnetic wave isolation structure together and then return to their original position, so that continuous assembly can be achieved and processing efficiency is improved.
[0041] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.
[0042] The present invention is intended to cover all such substitutions, modifications and variations that fall within the broad scope of the claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A processing device for chip ceramic cover and electromagnetic wave isolation structure, characterized in that: include: A U-shaped base (13), wherein a first conveyor belt (11) and a second conveyor belt (12) are horizontally installed below and above the interior of the U-shaped base (13), a first baffle plate (18) is welded above the tail end of the U-shaped base (13), and a second baffle plate (24) is welded below the discharge end of the second conveyor belt (12) inside the U-shaped base (13); Extrusion rods (17), wherein two extrusion rods (17) are provided, and a horizontal plate (1) is horizontally welded to the top of the two extrusion rods (17); A driving mechanism is provided, wherein the driving mechanism is used to drive the first conveyor belt (11) and the second conveyor belt (12) to convey and drive the transverse plate (1) to rise and fall reciprocally.
2. A processing device for chip ceramic cover and electromagnetic wave isolation structure according to claim 1, characterized in that: The length of the second conveyor belt (12) is shorter than that of the first conveyor belt (11), and a controller (23) is fixedly mounted on the outer side of the U-shaped base (13).
3. The processing equipment for chip ceramic cover and electromagnetic wave isolation structure according to claim 1, characterized in that: A limiting rod (16) is vertically welded to one corner of the top of the U-shaped base (13), the limiting rod (16) passes through the transverse plate (1) and is slidably connected to the transverse plate (1), and two extrusion rods (17) are located above the first baffle plate (18) and the second baffle plate (24).
4. The processing equipment for chip ceramic cover and electromagnetic wave isolation structure according to claim 1, characterized in that: The driving mechanism comprises a rotating motor (5), an L-shaped mounting plate (6) is welded to the outside of the U-shaped base (13), the rotating motor (5) is horizontally fixedly mounted on the inner side of the L-shaped mounting plate (6), and a rotating disk (15) is fixedly mounted on the output end of the rotating motor (5).
5. The processing equipment for chip ceramic cover and electromagnetic wave isolation structure according to claim 4, characterized in that: A plurality of ratchet teeth (19) are welded on part of the outer periphery of the rotating disk (15), a first driven gear (7) and a second driven gear (4) are respectively provided on opposite sides of the rotating disk (15), and the plurality of ratchet teeth (19) are meshed with the first driven gear (7) and the second driven gear (4) in sequence.
6. The processing equipment for chip ceramic cover and electromagnetic wave isolation structure according to claim 5, characterized in that: A first driven shaft (14) is horizontally welded at the center of the first driven gear (7); the other end of the first driven shaft (14) is rotatably connected to the U-shaped base (13); and the driving rollers of the first conveyor belt (11) and the second conveyor belt (12) are horizontally welded with a first linkage shaft (10) and a second linkage shaft (20), respectively.
7. The processing equipment for chip ceramic cover and electromagnetic wave isolation structure according to claim 6, characterized in that: The first linkage shaft (10) and the second linkage shaft (20) both pass through one side of the U-shaped base (13) and are rotatably connected to the U-shaped base (13); a first belt (8) is connected between the first linkage shaft (10) and the first driven shaft (14); and a second belt (9) is connected between the first linkage shaft (10) and the second linkage shaft (20).
8. The processing equipment for chip ceramic cover and electromagnetic wave isolation structure according to claim 7, characterized in that: A second driven shaft (29) is horizontally welded at the center of the second driven gear (4); the other end of the second driven shaft (29) is rotatably connected to the U-shaped base (13); a large disc (3) is welded on the second driven shaft (29); a circular groove (28) is formed on one side of the large disc (3); and a small disc (30) is welded at the center of the circular groove (28).
9. The processing equipment for chip ceramic cover and electromagnetic wave isolation structure according to claim 8, characterized in that: A plurality of inner convex teeth (25) are welded on a portion of the inner wall of the circular groove (28), a plurality of outer convex teeth (26) are welded on a portion of the outer periphery of the small disc (30), a small gear (27) is arranged in the circular groove (28), and the small gear (27) is meshed with the plurality of inner convex teeth (25) and the plurality of outer convex teeth (26) in sequence.
10. The processing equipment for chip ceramic cover and electromagnetic wave isolation structure according to claim 9, characterized in that: A connecting shaft (21) is horizontally welded at the center of the pinion gear (27), and a driving gear (22) is welded at the other end of the connecting shaft (21). An L-shaped support block is welded outside the U-shaped base (13), and the connecting shaft (21) passes through the L-shaped support block and is rotatably connected to the L-shaped support block. A rack (2) is vertically meshed on the side of the driving gear (22), and the rack (2) is welded to one end of the bottom of the horizontal plate (1).