IC-embedded mini-RGBW-LED lamp bead structure and preparation method thereof

Abstract

The invention discloses a mini-RGBW-LED lamp bead structure with an embedded IC and a preparation method of the mini-RGBW-LED lamp bead structure, and relates to the technical field of LED lamp bead structures. According to the manufacturing method, the IC chip and the RGBW chip are arranged in different layer structures, the IC chip is installed on the IC packaging layer, the RGBW chip is installed on the RGBW packaging layer on the top of the IC packaging layer, the RGBW packaging layer has enough space for containing the four RGBW chips, the RGBW chip can be arranged conveniently, the overall size of the mini-RGBW-LED lamp bead structure can be reduced, and the manufacturing cost of the mini-RGBW-LED lamp bead structure can be reduced. When the mini-RGBW-LED lamp bead structure prepared by the invention is used for preparing a display screen, the uniformity and definition of a picture of the display screen can be remarkably improved, and the problem that the definition of the prepared LED display screen is relatively low when RGBW LED lamp beads with built-in ICs are applied to the display screen at present is solved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED lamp bead structures, and in particular to a mini-RGBW-LED lamp bead structure with an embedded IC and a preparation method thereof. Background Art

[0002] The RGBW LED lamp bead structure with built-in IC is a miniature lamp bead that integrates red, green, blue and white LED chips and a control IC. This lamp bead is not only small in size but also powerful. The control IC can receive external signals and adjust the brightness and color of the LED chip according to the signal content, which can achieve rich color effects. In addition, since the IC is set inside the lamp bead, the control circuit can be effectively simplified, making large-scale lighting control easier and convenient for integration with various embedded systems. Based on these advantages, the RGBW LED lamp bead structure with built-in IC is widely used in the display field, such as in the production of micro displays and LED display screens.

[0003] The Chinese patent application number 201520242416.4 discloses an LED bracket with built-in RGBW chips and its LED products, and discloses the following contents: the structure of the LED bracket includes 4PIN conductive pins and an insulating seat, the conductive pins and the insulating seat are integrally inlaid, the top surface of the insulating seat is concave to form a reflective cup, and a partition wall is provided on the reflective cup to divide it into two parts, namely, a first reflective area for accommodating white light LED chips and a second reflective area for accommodating red, green, and blue three-color light LED chips. When such an LED bracket is used to make an LED product, by fixing the white light LED chip in the first reflective area and fixing the red, green, and blue three-color LED chips and the control IC in the second reflective area, the LED product can be used as both lighting and backlight. Although the LED lamp bead with built-in RGBW chip can control the on / off of the LED chip and adjust the brightness and color of the LED chip through the IC chip, the white light LED chip, red light LED chip, green light LED chip, blue light LED chip and control IC in the LED lamp bead with built-in RGBW chip are arranged in the same layer structure. Since the control IC occupies a large space, this will not only cause the overall space occupied by the manufactured LED lamp bead to be large, but also, based on the fact that each pixel in the LED display screen is a lamp bead, the clarity of the display screen is proportional to the number of lamp beads. If you want to obtain higher clarity, you need The more lamp beads are placed, if the LED lamp beads occupy a larger space, the number of lamp beads that can be arranged on the LED display screen will be smaller, which will result in lower clarity of the manufactured LED display screen and make it difficult to meet people's high requirements for display clarity; moreover, due to the large size difference between the control IC and the RGBW chip, the size of the control IC is significantly larger than the size of the RGBW chip. As the size of the LED lamp beads becomes smaller, if the control IC and the RGBW chip are arranged on the same layer, there will be position limitations, making it difficult to center the RGBW chip, resulting in irregular layout of the functional areas, which will further reduce the clarity of the display screen. Summary of the invention

[0004] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to propose a method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC. By arranging the IC chip and the RGBW chip in different layer structures, the RGBW packaging layer has enough space to place four RGBW chips, which is conducive to the layout of the RGBW chips and can reduce the overall size of the mini-RGBW-LED lamp bead structure. The mini-RGBW-LED lamp bead structure prepared by the present invention is used to prepare a display screen, which can significantly improve the uniformity and clarity of the display screen image, and solves the problem that the clarity of the prepared LED display screen is low when the current RGBW LED lamp beads with built-in IC are used in the display screen.

[0005] Another object of the present invention is to provide a mini-RGBW-LED lamp bead structure with an embedded IC, which is prepared by the above-mentioned preparation method.

[0006] In order to solve the above technical problems, the present invention provides a method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC, wherein the mini-RGBW-LED lamp bead structure with an embedded IC includes an insulating seat, a conductive pin assembly, an IC chip, an IC pad assembly, and a light-emitting assembly;

[0007] The insulating seat includes a substrate, an IC packaging layer and an RGBW packaging layer from bottom to top, the IC pad assembly and the light-emitting assembly are both embedded in the insulating seat, and the IC pad assembly is arranged on the top of the substrate, the IC chip is welded on the top of the IC pad assembly, the IC chip is embedded in the IC packaging layer, the light-emitting assembly is embedded in the RGBW packaging layer, and the light-emitting assembly and the IC chip are electrically connected;

[0008] The conductive pin assembly is arranged outside the substrate, and the conductive pin assembly is electrically connected to the IC pad assembly;

[0009] The light-emitting component includes a die-bonding pad, an RGB light-emitting chip, a white light-emitting chip and a light-emitting positive electrode pad, wherein the die-bonding pad and the light-emitting positive electrode pad are both located at the bottom of the RGBW packaging layer, and the RGB light-emitting chip and the white light-emitting chip are respectively installed on the die-bonding pad at intervals, and the RGB light-emitting chip and the white light-emitting chip are arranged in a "straight" shape in the middle of the insulating seat;

[0010] The RGB light-emitting chip and the white light-emitting chip are respectively provided with corresponding positive light-emitting pads, the IC chip is electrically connected to the positive light-emitting pads, and the RGB light-emitting chip and the white light-emitting chip are respectively electrically connected to the corresponding positive light-emitting pads;

[0011] The conductive pin assembly includes a negative power pin, and the die-bonding pad is electrically connected to the negative power pin;

[0012] The method for preparing the mini-RGBW-LED lamp bead structure with embedded IC comprises the following steps:

[0013] (1) manufacturing an IC pad assembly on the top of the substrate, wherein the IC pad assembly and the conductive pin assembly are an integrally formed structure, and the conductive pin assembly is arranged outside the substrate;

[0014] (2) soldering the IC chip to the top of the IC pad assembly, so that the GND solder joint, VDD solder joint, DI solder joint and DO solder joint of the IC chip are respectively electrically connected to the corresponding pads in the IC pad assembly, and then packaging the IC chip to form an IC packaging layer;

[0015] (3) making a die-bonding pad and a positive light-emitting pad on the top of the IC packaging layer, wherein the die-bonding pad and the positive light-emitting pad are respectively arranged on both sides of the top of the IC packaging layer; making a circuit so that the IC chip and the positive light-emitting pad are electrically connected, and the die-bonding pad and the negative power supply pin are electrically connected;

[0016] (4) pressing the RGBW packaging layer having the first packaging hole and the second packaging hole on top of the IC packaging layer;

[0017] (5) Mounting the RGB light-emitting chip and the white light-emitting chip on top of the die-bonding pad, wherein the white light-emitting chip is located inside the first packaging hole, and the RGB light-emitting chip is located inside the second packaging hole, so that the cathode of the RGB light-emitting chip and the cathode of the white light-emitting chip are both electrically connected to the die-bonding pad, and the anode of the RGB light-emitting chip and the anode of the white light-emitting chip are respectively electrically connected to the corresponding anode light-emitting pads through bonding wires;

[0018] (6) Fill the first packaging hole 131 with white light packaging glue, and fill the second packaging hole with RGB packaging glue to obtain a mini-RGBW-LED lamp bead structure with an embedded IC.

[0019] Preferably, the RGB light-emitting chip includes a red light chip, a blue light chip and a green light chip;

[0020] The mini-RGBW-LED lamp bead structure with embedded IC also includes a connecting pad, and four connecting pads are provided. The four connecting pads are independent of each other, and the W soldering point, B soldering point, G soldering point and R soldering point of the IC chip are respectively connected to one side of the four connecting pads, and the other sides of the four connecting pads are respectively used to connect the white light emitting chip, the blue light chip, the green light chip and the red light chip;

[0021] The light-emitting positive electrode pad includes the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad, and the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad are respectively arranged above the corresponding connecting pads;

[0022] The mini-RGBW-LED lamp bead structure with embedded IC further includes a negative electrode connection pad, the negative electrode connection pad is located on the top of the substrate, and the negative electrode connection pad is located below the die-bonding pad, and the negative electrode connection pad is electrically connected to the negative electrode pin of the power supply;

[0023] In step (3), the method of making a circuit to electrically connect the IC chip to the positive light-emitting pad and to electrically connect the die-bonding pad to the negative power supply pin comprises the following steps:

[0024] a. Forming first electroplating holes at the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad, respectively, and the first electroplating holes extend to the corresponding connecting pads; forming second electroplating holes on the die-bonding pad, and the second electroplating holes extend to the pad connected to the negative electrode;

[0025] b. Electroplating is performed in the first electroplating hole and the second electroplating hole to completely fill the first electroplating hole and the second electroplating hole with electroplating metal, and conductive columns are respectively formed in the first electroplating hole and the second electroplating hole. The red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad are respectively electrically connected to the corresponding connecting pads through the conductive columns, and the die-bonding pad and the negative electrode connecting pad are electrically connected.

[0026] Preferably, the components of the white light encapsulation glue include silicone glue and phosphor;

[0027] The components of the RGB packaging glue include epoxy resin glue and diffusion powder.

[0028] Preferably, in the white light encapsulation glue, the mass ratio of the silicone glue to the phosphor is (16-39): (3-10).

[0029] Preferably, in the RGB packaging glue, the mass ratio of the epoxy resin glue to the diffusion powder is (2.3-3.7): (0.7-1.0).

[0030] Correspondingly, the present invention also provides a mini-RGBW-LED lamp bead structure with an embedded IC, which is prepared by the above-mentioned method for preparing the mini-RGBW-LED lamp bead structure with an embedded IC;

[0031] The mini-RGBW-LED lamp bead structure with embedded IC includes an insulating seat, a conductive pin assembly, an IC chip, an IC pad assembly and a light-emitting assembly;

[0032] The insulating seat includes a substrate, an IC packaging layer and an RGBW packaging layer from bottom to top, the IC pad assembly and the light-emitting assembly are both embedded in the insulating seat, and the IC pad assembly is arranged on the top of the substrate, the IC chip is welded on the top of the IC pad assembly, the IC chip is embedded in the IC packaging layer, the light-emitting assembly is embedded in the RGBW packaging layer, and the light-emitting assembly and the IC chip are electrically connected;

[0033] The conductive pin assembly is arranged outside the substrate, and the conductive pin assembly is electrically connected to the IC pad assembly;

[0034] The light-emitting component includes a die-bonding pad, an RGB light-emitting chip, a white light-emitting chip and a light-emitting positive electrode pad, wherein the die-bonding pad and the light-emitting positive electrode pad are both located at the bottom of the RGBW packaging layer, and the RGB light-emitting chip and the white light-emitting chip are respectively installed on the die-bonding pad at intervals, and the RGB light-emitting chip and the white light-emitting chip are arranged in a "straight" shape in the middle of the insulating seat;

[0035] The RGB light-emitting chip and the white light-emitting chip are respectively provided with corresponding positive light-emitting pads, the IC chip is electrically connected to the positive light-emitting pads, and the RGB light-emitting chip and the white light-emitting chip are respectively electrically connected to the corresponding positive light-emitting pads;

[0036] The conductive pin assembly includes a negative power pin, and the die-bonding pad is electrically connected to the negative power pin.

[0037] Preferably, the IC embedded mini-RGBW-LED lamp bead structure further comprises a negative electrode connection pad and a plurality of conductive pillars, the plurality of conductive pillars are embedded in the IC packaging layer, the negative electrode connection pad is located on the top of the substrate, and the negative electrode connection pad is located below the die-bonding pad, and the negative electrode connection pad is electrically connected to the negative electrode pin of the power supply through one of the conductive pillars;

[0038] The RGB light emitting chip includes a red light chip, a blue light chip and a green light chip;

[0039] The mini-RGBW-LED lamp bead structure with embedded IC also includes a connecting pad, and the connecting pad is arranged on the top of the substrate. There are four connecting pads, and the four connecting pads are independent of each other.

[0040] The light-emitting positive electrode pad includes the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad, and the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad are respectively arranged above the corresponding connecting pads;

[0041] The W solder joint, B solder joint, G solder joint and R solder joint of the IC chip are respectively connected to one side of the four connecting pads, and the other sides of the four connecting pads are respectively electrically connected to the white light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the red light positive electrode pad through conductive columns.

[0042] Preferably, the conductive pin assembly further comprises a positive power pin, a data input pin and a data output pin, and the negative power pin, the positive power pin, the data input pin and the data output pin are respectively arranged at four corners of the substrate;

[0043] The mini-RGBW-LED lamp bead structure with built-in IC also includes a plurality of conductive metal wires;

[0044] The IC pad assembly comprises an IC positive pad, an IC negative pad, an IC data input pad and an IC data output pad, wherein the IC positive pad is electrically connected to the positive power pin via a conductive metal wire, the IC negative pad is electrically connected to the negative power pin via a conductive metal wire, the IC data input pad is electrically connected to the data input pin via a conductive metal wire, and the IC data output pad is electrically connected to the data output pin via a conductive metal wire;

[0045] The GND solder joint of the IC chip is connected to the negative pad of the IC, the VDD solder joint of the IC chip is connected to the positive pad of the IC, the DI solder joint of the IC chip is connected to the data input pad of the IC, and the DO solder joint of the IC chip is connected to the data output pad of the IC.

[0046] Preferably, the ratio of the width of the conductive metal wire to the width of the insulating seat is (0.035-0.07):1.

[0047] Preferably, the ratio of the area of ​​the upper surface of the die-bonding pad to the area of ​​the cross section of the insulating seat is (0.3-0.6):1.

[0048] The implementation of the present invention has the following beneficial effects:

[0049] The insulating seat of the mini-RGBW-LED lamp bead structure prepared by the preparation method of the technical solution includes a substrate, an IC packaging layer and an RGBW packaging layer arranged in sequence from bottom to top, wherein the IC pad assembly is arranged on the top of the substrate, the IC chip is welded on the top of the IC pad assembly, and the IC chip is embedded in the inside of the IC packaging layer, and the light-emitting assembly is embedded in the inside of the RGBW packaging layer, so that the IC packaging layer is used to layout the IC functional layer, and the RGBW packaging layer is used to layout the RGBW chip functional layer. The IC functional layer and the RGBW chip functional layer of the technical solution are in different layer structures, so that the RGBW packaging layer has enough space to place four RGBW chips, which is conducive to the layout of the RGBW chip, so that the RGBW chip can be set in the center, so that the lamp bead brightness is higher, and the uniformity and clarity of the display screen can be improved. In addition, thanks to the IC functional layer and the RGBW chip functional layer being in different layer structures, the occupied space of the mini-RGBW-LED lamp bead structure can be effectively reduced, so that the LED display screen can arrange more lamp beads, and then the brightness and clarity of the LED display screen can be further improved. On the other hand, since the mini-RGBW-LED lamp bead structure of the present technical solution adopts a two-layer functional structure setting, and the IC chip is located at the bottom of the insulating seat, the distance between the IC chip and the bottom surface of the substrate is closer, which is more conducive to the heat dissipation of the IC chip, making the overall heat dissipation performance of the mini-RGBW-LED lamp bead structure better, and can increase the life of the mini-RGBW-LED lamp bead structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0050] Figure 1 It is a schematic diagram of the preparation process of a mini-RGBW-LED lamp bead structure with an embedded IC in one embodiment of the present invention;

[0051] Figure 2 It is a schematic diagram of the structure of a mini-RGBW-LED lamp bead with an embedded IC in one embodiment of the present invention;

[0052] Figure 3 yes Figure 2 The front view of the mini-RGBW-LED lamp bead structure shown;

[0053] Figure 4 yes Figure 2 A longitudinal cross-sectional view of the mini-RGBW-LED lamp bead structure at the conductive column;

[0054] Figure 5 yes Figure 2 A cross-sectional view of the mini-RGBW-LED lamp bead structure at the IC pad assembly;

[0055] Figure 6yes Figure 5 The schematic diagram of the mini-RGBW-LED lamp bead structure after installing the IC chip;

[0056] Figure 7 yes Figure 2 The cross-sectional view of the mini-RGBW-LED lamp bead structure at the die bonding pad shown;

[0057] Figure 8 yes Figure 2 The back view of the mini-RGBW-LED lamp bead structure shown;

[0058] Fig. 9 yes Figure 2 The schematic diagram of the structure of the IC chip in the mini-RGBW-LED lamp bead structure shown;

[0059] In the figure: insulating seat 1, conductive pin assembly 2, IC chip 3, IC pad assembly 4, connecting pad 6, conductive column 7, conductive metal wire 8, negative electrode connecting pad 9, substrate 11, IC packaging layer 12, RGBW packaging layer 13, power supply negative electrode pin 21, power supply positive electrode pin 22, data input pin 23, data output pin 24, IC positive electrode pad 41, IC negative electrode pad 42, IC data input pad 43, IC data output pad 44, die bonding pad 51, RGB light emitting chip 52, white light emitting chip 53, light emitting positive electrode pad 54 , white light packaging glue 55, RGB packaging glue 56, red light connecting pad 61, green light connecting pad 62, blue light connecting pad 63, white light connecting pad 64, GND solder point 31, VDD solder point 32, DI solder point 33, DO solder point 34, R solder point 35, G solder point 36, B solder point 37, W solder point 38, first packaging hole 131, second packaging hole 132, red light chip 521, blue light chip 522, green light chip 523, red light positive electrode pad 541, blue light positive electrode pad 542, green light positive electrode pad 543, white light positive electrode pad 544. DETAILED DESCRIPTION

[0060] To make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0061] In the description of the present invention, it is necessary to understand that the orientations or positional relationships indicated by terms such as “upper”, “lower”, “left”, “right”, “top” and “bottom” are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description. They do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0062] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0063] like Figures 1 to 9 As shown, a method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC, wherein the mini-RGBW-LED lamp bead structure with an embedded IC includes an insulating seat 1, a conductive pin assembly 2, an IC chip 3, an IC pad assembly 4 and a light-emitting assembly;

[0064] The insulating seat 1 includes a substrate 11, an IC packaging layer 12 and an RGBW packaging layer 13 from bottom to top, the IC pad component 4 and the light-emitting component are both embedded in the insulating seat 1, and the IC pad component 4 is arranged on the top of the substrate 11, the IC chip 3 is welded on the top of the IC pad component 4, the IC chip 3 is embedded in the IC packaging layer 12, the light-emitting component is embedded in the RGBW packaging layer 13, and the light-emitting component and the IC chip 3 are electrically connected;

[0065] The conductive pin assembly 2 is disposed outside the substrate 11, and the conductive pin assembly 2 is electrically connected to the IC pad assembly 4;

[0066] The light-emitting component includes a die-bonding pad 51, an RGB light-emitting chip 52, a white light-emitting chip 53 and a positive light-emitting pad 54. The die-bonding pad 51 and the positive light-emitting pad 54 are both located at the bottom of the RGBW packaging layer 13. The RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively installed on the die-bonding pad 51 at intervals, and the RGB light-emitting chip 52 and the white light-emitting chip 53 are arranged in a "straight" shape in the middle of the insulating seat 1.

[0067] The RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively provided with the corresponding positive light-emitting pads 54, the IC chip 3 is electrically connected to the positive light-emitting pads 54, and the RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively electrically connected to the corresponding positive light-emitting pads 54;

[0068] The conductive pin assembly 2 includes a negative power pin 21, and the die-bonding pad 51 is electrically connected to the negative power pin 21;

[0069] The method for preparing the mini-RGBW-LED lamp bead structure with embedded IC comprises the following steps:

[0070] (1) an IC pad assembly 4 is manufactured on the top of the substrate 11, wherein the IC pad assembly 4 and the conductive pin assembly 2 are an integrally formed structure, and the conductive pin assembly 2 is disposed outside the substrate 11;

[0071] (2) soldering the IC chip 3 to the top of the IC pad assembly 4, so that the GND pad 31, VDD pad 32, DI pad 33 and DO pad 34 of the IC chip 3 are electrically connected to the corresponding pads in the IC pad assembly 4, and then packaging the IC chip to form an IC packaging layer 12;

[0072] (3) A die-bonding pad 51 and a positive light-emitting pad 54 are fabricated on the top of the IC packaging layer 12. The die-bonding pad 51 and the positive light-emitting pad 54 are disposed on both sides of the top of the IC packaging layer 12, respectively. A circuit is fabricated to electrically connect the IC chip 3 and the positive light-emitting pad 54, and to electrically connect the die-bonding pad 51 and the negative power supply pin 21;

[0073] (4) Pressing the RGBW packaging layer 13 having the first packaging hole 131 and the second packaging hole 132 onto the top of the IC packaging layer 12;

[0074] (5) The RGB light-emitting chip 52 and the white light-emitting chip 53 are mounted on the top of the die-bonding pad 51, wherein the white light-emitting chip 53 is located inside the first packaging hole 131, and the RGB light-emitting chip 52 is located inside the second packaging hole 132, so that the cathode of the RGB light-emitting chip 52 and the cathode of the white light-emitting chip 53 are both electrically connected to the die-bonding pad 51, and the anode of the RGB light-emitting chip 52 and the anode of the white light-emitting chip 53 are respectively electrically connected to the corresponding anode light-emitting pads 54 through bonding wires;

[0075] (6) Fill the first packaging hole 131 with white light packaging glue 55, and fill the second packaging hole 132 with RGB packaging glue 56, to obtain a mini-RGBW-LED lamp bead structure with an embedded IC.

[0076] It is worth noting that the insulating seat 1 of the mini-RGBW-LED lamp bead structure prepared by the preparation method of the present technical solution includes a substrate 11, an IC packaging layer 12 and an RGBW packaging layer 13 arranged in sequence from bottom to top, wherein the IC pad assembly 4 is arranged on the top of the substrate 11, the IC chip 3 is soldered on the top of the IC pad assembly 4, and the IC chip 3 is embedded in the IC packaging layer 12, and the light-emitting assembly is embedded in the RGBW packaging layer 13, so that the IC packaging layer 12 serves as the IC functional layer, and the RGBW packaging layer 13 serves as the RGBW chip functional layer. The IC functional layer and the RGBW chip functional layer of the present technical solution are in different layer structures, so that the RGBW packaging layer 13 has enough space to place four RGBW chips, which is conducive to the layout of the RGBW chip, so that the RGBW chip can be set in the center, so that the lamp bead brightness is higher, and the uniformity and clarity of the display screen can be improved. Moreover, thanks to the fact that the IC functional layer and the RGBW chip functional layer are in different layer structures, the space occupied by the mini-RGBW-LED lamp bead structure can be effectively reduced, so that more lamp beads can be arranged on the LED display screen, thereby further improving the brightness and clarity of the LED display screen. On the other hand, since the mini-RGBW-LED lamp bead structure of the present technical solution adopts a two-layer functional structure setting, and the IC chip 3 is located at the bottom of the insulating seat 1, the distance between the IC chip 3 and the bottom surface of the substrate 11 is closer, which is more conducive to the heat dissipation of the IC chip 3, so that the overall heat dissipation performance of the mini-RGBW-LED lamp bead structure is better, and the life of the mini-RGBW-LED lamp bead structure can be improved.

[0077] This technical solution redesigns the mini-RGBW-LED lamp bead structure, embeds IC in the traditional RGB LE lamp bead structure, and integrates the control circuit into the LED lamp bead. On the one hand, it greatly reduces the number of external circuits and connecting wires, making the circuit simpler, and thus making it easier to make and install the display screen; on the other hand, this technical solution reduces display screen failures caused by poor external circuit connection or component failure by setting IC chips inside the mini-RGBW-LED lamp bead structure and integrating the control circuit into the lamp bead, thereby improving the overall reliability and stability. Moreover, the design of embedded IC enables each lamp bead to be independently controlled, providing great flexibility and convenience, making the display screen more colorful.

[0078] To further illustrate, the light-emitting assembly of the present technical solution includes a die-bonding pad 51, an RGB light-emitting chip 52, a white light-emitting chip 53 and a positive light-emitting pad 54. The RGB light-emitting chip 52 and the white light-emitting chip 53 are both mounted on the die-bonding pad 51 and controlled by the IC chip 3. The present technical solution sets a white light-emitting chip 53 on the RGBW-LED lamp bead, so that the RGBW-LED lamp bead of the present technical solution can light up a separate white light-emitting chip 53, making the display screen brighter.

[0079] Specifically, the method of making the IC pad assembly 4 on the top of the substrate 11 in step (1) of the present technical solution is well known, and the commonly used methods in the art can be used. For example, in one embodiment of the present technical solution, the substrate 11 of the desired shape can be prepared by conventional methods, and the material of the substrate 11 is BT resin; the IC pad assembly and the conductive pin assembly integrated structure of the desired specific structure can be obtained by stamping and stretching the metal substrate; and the IC pad assembly and the conductive pin assembly integrated structure are fixed on the top of the substrate 11 by the commonly used methods in the art, for example, the IC pad assembly and the conductive pin assembly integrated structure can be heated to a certain temperature, so that the heated IC pad assembly and the conductive pin assembly integrated structure can melt the surface of the substrate 11, and after cooling, the IC pad assembly and the conductive pin assembly integrated structure can be fixed on the top of the substrate 11.

[0080] Specifically, in step (2), BT resin is used to encapsulate the IC chip to form an IC encapsulation layer 12. In step (3), the method of making a die-bonding pad 51 and a positive light-emitting pad 54 on the top of the IC encapsulation layer 12 is well known, and the method of making an IC pad assembly 4 on the top of the substrate 11 in the above step (1) can be used, but is not limited thereto. In step (4), the material of the RGBW encapsulation layer 13 is ET resin.

[0081] To further illustrate, the RGB light emitting chip 52 includes a red light chip 521 , a blue light chip 522 , and a green light chip 523 ;

[0082] The mini-RGBW-LED lamp bead structure with embedded IC also includes a connecting pad 6, and four connecting pads 6 are provided. The four connecting pads 6 are independent of each other, and the W solder joint 38, B solder joint 37, G solder joint 36 and R solder joint 35 of the IC chip 3 are respectively connected to one side of the four connecting pads 6, and the other sides of the four connecting pads 6 are respectively used to connect the white light emitting chip 53, the blue light chip 522, the green light chip 523 and the red light chip 521;

[0083] The light-emitting positive electrode pad 54 includes the red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the white light positive electrode pad 544, and the red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the white light positive electrode pad 544 are respectively arranged above the corresponding connecting pad 6;

[0084] The mini-RGBW-LED lamp bead structure with embedded IC further includes a negative electrode connecting pad 9, which is located on the top of the substrate 11 and below the die-bonding pad 51, and the negative electrode connecting pad 9 is electrically connected to the negative electrode pin 21 of the power supply;

[0085] In step (3), the method of making a circuit to electrically connect the IC chip 3 and the positive light-emitting pad 54 and to electrically connect the die-bonding pad 51 and the negative power supply pin 21 comprises the following steps:

[0086] a. First electroplating holes are formed at the red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the white light positive electrode pad 544, respectively, and the first electroplating holes are extended to the corresponding connecting pads 6; a second electroplating hole is formed on the die-bonding pad 51, and the second electroplating hole is extended to the negative electrode connecting pad 9; specifically, the first electroplating hole and the second electroplating hole can be formed by mechanical drilling or etching;

[0087] b. Electroplating is performed in the first electroplating hole and the second electroplating hole to completely fill the first electroplating hole and the second electroplating hole with electroplating metal (such as copper), and conductive columns 7 are respectively formed in the first electroplating hole and the second electroplating hole. The red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the white light positive electrode pad 544 are respectively electrically connected to the corresponding connecting pads 6 through the conductive columns 7, and the die-bonding pad 51 and the negative electrode connecting pad 9 are electrically connected.

[0088] Specifically, in step (5), the positive electrode of the red light chip 521 is connected to the red light positive electrode pad 541 through a bonding wire, the positive electrode of the blue light chip 522 is connected to the blue light positive electrode pad 542 through a bonding wire, the positive electrode of the green light chip 523 is connected to the green light positive electrode pad 543 through a bonding wire, and the positive electrode of the white light emitting chip 53 is connected to the white light positive electrode pad 544 through a bonding wire; and the negative electrode of the red light chip 521 is electrically connected to the crystal bonding pad 51, the negative electrode of the green light chip 523 is electrically connected to the crystal bonding pad 51 through a bonding wire, the negative electrode of the blue light chip 522 is electrically connected to the crystal bonding pad 51 through a bonding wire, and the negative electrode of the white light emitting chip 53 is electrically connected to the crystal bonding pad 51 through a bonding wire, thereby achieving electrical connection.

[0089] Preferably, the conductive pillar 7 is made of copper, which has better conductivity.

[0090] Further explanation, the components of the white light encapsulation glue 55 include silicone glue and phosphor;

[0091] The components of the RGB packaging glue 56 include epoxy resin glue and diffusion powder.

[0092] Specifically, the white light encapsulation glue 55 is filled in the first encapsulation hole 131 of the technical solution, which can make the white light-emitting chip 53 emit white light, and can further improve the brightness of the RGBW-LED lamp bead structure of the technical solution, thereby making the display screen brighter. The material of the white light encapsulation glue 55 of the technical solution is well known and can be purchased directly from the market, or the required materials can be purchased and obtained by simple mixing. In a preferred embodiment of the technical solution, the white light-emitting chip 53 is a blue light chip, and a mixture of silicone glue and phosphor can be used as a white light encapsulation glue, so that it presents white light after emitting light, thereby increasing the brightness of the display screen.

[0093] Specifically, the second packaging hole 132 of the technical solution is filled with RGB packaging glue 56. The material of the RGB packaging glue 56 is well-known and can be purchased directly from the market, or the required materials can be purchased and obtained by simply mixing using existing processes. For example, the material of the RGB packaging glue 56 is epoxy resin glue, or it can be a mixture of epoxy resin glue and diffusion powder. As a preferred embodiment of the technical solution, the components of the RGB packaging glue 56 include epoxy resin glue and diffusion powder. By adding diffusion powder, the RGB packaging glue 56 has a good refractive index and light transmittance, and also has good water vapor barrier and shock absorption and impact resistance.

[0094] As a further explanation, in the white light encapsulation adhesive 55, the mass ratio of the silicone glue to the phosphor is (16-39): (3-10).

[0095] It is worth noting that the white light-emitting chip 53 of the present technical solution is a blue light chip. By using a mixture of silicone glue and phosphor, the chip can be made to emit white light. The principle is as follows: phosphor is a light conversion material that can absorb light of a specific wavelength (usually blue light) and emit another wavelength (usually yellow light or yellow-green light). In the LED packaging process, the phosphor is coated on the blue light chip. When the blue light emitted by the blue light chip is irradiated on the phosphor particles, a part of the blue light will be absorbed by the phosphor and excite yellow light or yellow-green light. According to the principle of color addition, blue light and yellow light (or yellow-green light) are mixed together to produce white light. In the LED package, the blue light that is not absorbed by the phosphor and the yellow light (or yellow-green light) excited by the phosphor are mixed together to form white light perceived by the human eye. In the present technical solution, the mass ratio of silicone glue and the phosphor is (16-39): (3-10). Within this mass ratio range, white light can be formed instead of blue light, green light or yellow-green light.

[0096] More preferably, the mass ratio of the silicone glue and the phosphor in the white light encapsulation glue 55 is 22:6.7. Within this mass ratio, a purer white light can be obtained, thereby achieving a better effect of increasing the brightness of the display screen and improving the clarity of the display screen.

[0097] Specifically, the silicone glue generally includes component A and component B; in the white light encapsulation glue 55, the mass ratio of component A, component B and the phosphor is (1-4): (15-35): (3-10). Preferably, the mass ratio of component A: component B: phosphor in the white light encapsulation glue 55 is 2:20:6.7.

[0098] Specifically, the silicone glue and fluorescent powder used in this technical solution can be purchased on the market.

[0099] As a further explanation, in the RGB packaging glue 56, the mass ratio of the epoxy resin glue to the diffusion powder is (2.3-3.7): (0.7-1.0).

[0100] It is worth noting that the mass ratio of epoxy resin glue and diffusion powder in the RGB encapsulation glue 56 of the present technical solution is (2.3~3.7): (0.7~1.0). By mixing a specific proportion of diffusion powder in the RGB encapsulation glue 56, the propagation path and uniformity of light can be increased, which helps to reduce the reflection and refraction loss of light inside the packaging structure, improve the light extraction efficiency, and make the light emitted by the RGB light-emitting chip 52 present a more consistent color after mixing, which helps to reduce color deviation and color spot phenomenon, improve the uniformity and consistency of the display effect, and enable the RGB light-emitting chip 52 to present brighter and more vivid colors when displayed.

[0101] Specifically, the epoxy resin glue usually includes component A and component B. In the RGB encapsulation glue 56, the mass ratio of component A, component B and diffusion powder is (1.5-2.5): (0.8-1.2): (0.7-1.0).

[0102] Preferably, in the RGB encapsulation glue 56 , the mass ratio of component A, component B and diffusion powder is 2:1:0.9, which can enable the RGB light-emitting chip 52 to present a better effect during display.

[0103] It is worth mentioning that the epoxy resin glue and diffusion powder used in this technical solution can be purchased from the market.

[0104] A mini-RGBW-LED lamp bead structure with an embedded IC is prepared by the above-mentioned method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC;

[0105] The mini-RGBW-LED lamp bead structure with embedded IC includes an insulating seat 1, a conductive pin assembly 2, an IC chip 3, an IC pad assembly 4 and a light-emitting assembly;

[0106] The insulating seat 1 includes a substrate 11, an IC packaging layer 12 and an RGBW packaging layer 13 from bottom to top, the IC pad component 4 and the light-emitting component are both embedded in the insulating seat 1, and the IC pad component 4 is arranged on the top of the substrate 11, the IC chip 3 is welded on the top of the IC pad component 4, the IC chip 3 is embedded in the IC packaging layer 12, the light-emitting component is embedded in the RGBW packaging layer 13, and the light-emitting component and the IC chip 3 are electrically connected;

[0107] The conductive pin assembly 2 is disposed outside the substrate 11, and the conductive pin assembly 2 is electrically connected to the IC pad assembly 4;

[0108] The light-emitting component includes a die-bonding pad 51, an RGB light-emitting chip 52, a white light-emitting chip 53 and a positive light-emitting pad 54. The die-bonding pad 51 and the positive light-emitting pad 54 are both located at the bottom of the RGBW packaging layer 13. The RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively installed on the die-bonding pad 51 at intervals, and the RGB light-emitting chip 52 and the white light-emitting chip 53 are arranged in a "straight" shape in the middle of the insulating seat 1.

[0109] The RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively provided with the corresponding positive light-emitting pads 54, the IC chip 3 is electrically connected to the positive light-emitting pads 54, and the RGB light-emitting chip 52 and the white light-emitting chip 53 are respectively electrically connected to the corresponding positive light-emitting pads 54;

[0110] The conductive pin assembly 2 includes a negative power pin 21 , and the die-bonding pad 51 is electrically connected to the negative power pin 21 .

[0111] It is worth noting that the technical solution redesigns the lamp bead structure and process preparation method. The insulating seat of the lamp bead structure includes a substrate 11 and an IC packaging layer 12 and an RGBW packaging layer 13 sequentially arranged on the substrate 11. The lamp bead is divided into two functional structures. The IC functional layer is arranged in the IC packaging layer 12, and the RGBW chip functional layer is arranged in the RGBW packaging layer 13. The RGBW packaging layer 13 is provided with a first packaging hole 131 and a second packaging hole 132, so that the RGBW packaging layer 13 forms an RGB area and a white light area. The materials of the substrate 11, the IC packaging layer 12 and the RGBW packaging layer 13 are all BT resin, and the RGBW chip functional layer and the IC functional layer are conductively connected through the conductive column 7. The back pad of the substrate 11 is the lighting pin of the lamp bead; the IC chip uses the flip-chip process and is fixed by solder paste; the second layer of RGBW chips uses the face-up process, the red light chip 521 is fixed by the solid crystal silver glue, the blue light chip 522 and the green light chip 523 are fixed by the solid crystal insulating glue, the chip and the welding wire area (i.e., the solid crystal pad 51 and the positive electrode pad 54) are connected by the bonding wire, and then packaged by the dispensing process, the RGB light-emitting chip 52 is packaged by the RGB packaging glue 56 composed of epoxy resin glue and diffusion powder, and the white light area is packaged by silicone glue and phosphor powder. White light encapsulation glue 55; finally, by cutting and splitting the material, a lamp bead with specific photoelectric characteristics is formed; as the size of the lamp bead becomes smaller, there are position limitations when IC and RGBW are placed on the same layer, and the layout of the functional areas is irregular, which easily leads to unclear display screen images. Therefore, the IC chip is placed on the IC packaging layer 12 to facilitate IC heat dissipation, and the RGBW packaging layer 13 has enough space to place four RGBW chips, and the metal part can be retained more, so that the heat dissipation performance is better. The first packaging hole 131 and the second packaging hole 132 of the RGBW packaging layer 13 are in a bowl-cup structure, and the airtightness is also improved compared with the conventional RGB lamp bead. The mini-RGBW-LED lamp bead structure with embedded IC in this technical solution integrates the control circuit on the LED, making the circuit simpler, and thus easier to manufacture and install. This packaging technology not only improves the life of the lamp bead; the design of embedded IC enables each lamp bead to be independently controlled, providing great flexibility and convenience, making the display screen more colorful, and the RGBW lamp bead can light up a separate white light chip, making the display screen brighter.

[0112] Further explanation, the mini-RGBW-LED lamp bead structure with embedded IC also includes a negative electrode connection pad 9 and a plurality of conductive pillars 7, the plurality of conductive pillars 7 are embedded in the IC packaging layer 12, the negative electrode connection pad 9 is located on the top of the substrate 11, and the negative electrode connection pad 9 is located below the die-bonding pad 51, and the negative electrode connection pad 9 is electrically connected to the negative power supply pin 21 through one of the conductive pillars 7;

[0113] The RGB light emitting chip 52 includes a red light chip 521, a blue light chip 522 and a green light chip 523;

[0114] The mini-RGBW-LED lamp bead structure with embedded IC also includes a connecting pad 6, and the connecting pad 6 is arranged on the top of the substrate 11. There are four connecting pads 6, and the four connecting pads 6 are independent of each other.

[0115] The light-emitting positive electrode pad 54 includes the red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the white light positive electrode pad 544, and the red light positive electrode pad 541, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the white light positive electrode pad 544 are respectively arranged above the corresponding connecting pad 6;

[0116] The W solder joint 38, B solder joint 37, G solder joint 36 and R solder joint 35 of the IC chip 3 are respectively connected to one side of the four connecting pads 6, and the other sides of the four connecting pads 6 are respectively electrically connected to the white light positive electrode pad 544, the blue light positive electrode pad 542, the green light positive electrode pad 543 and the red light positive electrode pad 541 through the conductive column 7, so that the IC functional layer and the RGBW chip functional layer of the present technical solution are conductively connected through the conductive column 7.

[0117] Further explanation, the conductive pin assembly 2 further includes a positive power pin 22, a data input pin 23 and a data output pin 24, and the negative power pin 21, the positive power pin 22, the data input pin 23 and the data output pin 24 are respectively arranged at the four corners of the substrate 11;

[0118] The mini-RGBW-LED lamp bead structure with built-in IC also includes a plurality of conductive metal wires 8;

[0119] The IC pad assembly 4 includes an IC positive pad 41, an IC negative pad 42, an IC data input pad 43 and an IC data output pad 44, wherein the IC positive pad 41 is electrically connected to the power positive pin 22 through a conductive metal wire 8, the IC negative pad 42 is electrically connected to the power negative pin 21 through a conductive metal wire 8, the IC data input pad 43 is electrically connected to the data input pin 23 through a conductive metal wire 8, and the IC data output pad 44 is electrically connected to the data output pin 24 through a conductive metal wire 8;

[0120] The GND solder joint 31 of the IC chip 3 is connected to the IC negative pad 42, the VDD solder joint 32 of the IC chip 3 is connected to the IC positive pad 41, the DI solder joint 33 of the IC chip 3 is connected to the IC data input pad 43, and the DO solder joint 34 of the IC chip 3 is connected to the IC data output pad 44.

[0121] The present technical solution has four connecting pads 6, namely a red light connecting pad 61, a green light connecting pad 62, a blue light connecting pad 63 and a white light connecting pad 64, and the four connecting pads 6 are independent of each other;

[0122] The IC chip 3 is provided with eight solder joints, namely a GND solder joint 31, a VDD solder joint 32, a DI solder joint 33, a DO solder joint 34, an R solder joint 35, a G solder joint 36, a B solder joint 37 and a W solder joint 38. The GND solder joint 31 is connected to the IC negative electrode pad 42, the VDD solder joint 32 is connected to the IC positive electrode pad 41, the DI solder joint 33 is connected to the IC data input pad 43, the DO solder joint 34 is connected to the IC data output pad 44, the R solder joint 35 is connected to the red light connection pad 61, the G solder joint 36 is connected to the green light connection pad 62, the B solder joint 37 is connected to the blue light connection pad 63, and the W solder joint 38 is connected to the white light connection pad 64.

[0123] The present technical solution optimizes and improves the structure and layout of the conductive pin assembly 2, the IC pad assembly 4 and the connecting pad 6, making the layout of the IC functional layer and the conductive pin more compact, which is conducive to reducing the volume of the entire mini-RGBW-LED lamp bead structure; and enables the IC chip 3 to be flipped, which not only shortens the signal transmission path, helps to reduce delays, improves signal transmission speed and stability, but also helps the IC chip 3 to dissipate heat, which can further improve the stability and reliability of the lamp bead; at the same time, the IC chip 3 flipping can simplify the packaging process and reduce production costs to a certain extent. The power negative pin 21, the power positive pin 22, the data input pin 23 and the data output pin 24 of the present technical solution are respectively arranged at the four corners of the bottom of the substrate 11, which is not only conducive to wiring on the external PCB board, avoiding interference and conflict between pins, making the wiring clearer and more standardized, but also separates the layout of pins with different functions, which can reduce electrical interference between them and improve the transmission quality of the signal.

[0124] Preferably, a first identification portion (not shown) is provided at the bottom of the substrate 11. Since the negative power pin 21, the positive power pin 22, the data input pin 23 and the data output pin 24 are respectively provided at the four corners of the bottom of the insulating seat 1, and the structures and shapes of these four pins are consistent, it will be difficult to distinguish the negative power pin 21 and the positive power pin 22. Therefore, the first identification portion is provided at the bottom of the insulating seat, which is conducive to identifying the negative power pin 21 and the positive power pin 22. Preferably, the first identification portion is provided at the bottom of the IC chip 3, which can be used to identify the solder joints of the IC chip 3.

[0125] Further explanation, the top surface of the RGBW packaging layer 13 has two concave portions to form a first packaging hole 131 and a second packaging hole 132. The depths of the first packaging hole 131 and the second packaging hole 132 extend to the die-bonding pad 51, respectively. The white light-emitting chip 53 is located in the first packaging hole 131, and the three RGB light-emitting chips, the red light chip 521, the blue light chip 522 and the green light chip 523, are located inside the second packaging hole 132.

[0126] The first packaging hole 131 is filled with white light packaging glue 55, and the second packaging hole 132 is filled with RGB packaging glue 56, so that the white light-emitting chip 53 and the RGB light-emitting chip 52 are tightly wrapped, which can improve the airtightness of the RGBW-LED lamp bead.

[0127] Preferably, the top surfaces of the white light encapsulation glue 55 and the RGB encapsulation glue 56 are flush with the top surface of the insulating seat 1, which can ensure the integrity of the packaging structure, improve packaging reliability, optimize optical performance and simplify the production process, which helps to improve the overall performance and quality of the mini-RGBW-LED lamp bead structure and meet the needs of various application scenarios.

[0128] To further illustrate, the ratio of the width of the conductive metal wire 8 to the width of the insulating seat 1 is (0.035-0.07):1.

[0129] It is worth noting that the soldering reel of the traditional mini-RGBW-LED lamp bead structure is usually directly connected to the conductive pin. Due to the large area of ​​the soldering reel, the deformation of the soldering reel due to thermal expansion and contraction is also large when the mini-RGBW-LED lamp bead structure works for a long time, which can easily lead to small gaps or voids between the soldering reel and the insulating seat, reducing the airtightness of the mini-RGBW-LED lamp bead structure. In the technical solution, the IC pad assembly 4 includes an IC positive pad 41, an IC negative pad 42, an IC data input pad 43 and an IC data output pad 44, wherein the IC positive pad 41, the IC negative pad 42, the IC data input pad 43 and the IC data output pad 44 are connected by conductive metal wires 8 and corresponding conductive pins, respectively, so that the area of ​​the four pads of the IC positive pad 41, the IC negative pad 42, the IC data input pad 43 and the IC data output pad 44 of the technical solution can be designed to be smaller, much smaller than the traditional IC wire pad, and the width of the conductive metal wire 8 is also very small (such as Figure 5 As shown), it can effectively reduce the deformation amplitude of the IC pad assembly 4 and the conductive metal wire 8 during thermal expansion and contraction, thereby ensuring that the mini-RGBW-LED lamp bead structure of the present technical solution can maintain good airtightness for a long time, thereby ensuring the reliability and durability of the mini-RGBW-LED lamp bead structure.

[0130] Further explanation, one side of the conductive metal wire 8 used to connect the IC negative electrode pad 42 and the negative power supply pin 21 is provided with a negative electrode connecting pad 9 connected to the conductive metal wire 8, and the solid crystal pad 51 is connected to the negative electrode connecting pad 9 through the conductive column 7, thereby electrically connecting the solid crystal pad 51 to the negative power supply pin 21.

[0131] Preferably, the structures of the negative power pin 21, the positive power pin 22, the data input pin 23 and the data output pin 24 of the technical solution are the same, and all include an embedded part and an external part. The embedded part is embedded in the interior of the substrate 11 and connected to the conductive metal wire 8; the external part is arranged outside the insulating seat 1 for connecting to the PCB board of the client. Preferably, the embedded part is an arc-shaped sheet structure, one side of the embedded part is in contact with the insulating seat 1, and the other side is filled with resin (such as epoxy resin), so that the lamp bead is a square body as a whole, which is more conducive to integration.

[0132] To further illustrate, the ratio of the area of ​​the upper surface of the die-bonding pad 51 to the area of ​​the cross section of the insulating base 1 is (0.3-0.6):1.

[0133] It is worth noting that, based on the height difference between the installation positions of the IC chip 3 and the RGBW chip in the technical solution, a two-layer functional structure is formed, which is an IC functional layer and an RGBW chip functional layer from bottom to top. Among them, the IC chip 3 is placed on the IC functional layer at the bottom to facilitate the heat dissipation of the IC chip 3, and the RGBW chip is placed on the RGBW chip functional layer at the top to avoid the influence of the IC chip 3 on the layout of the RGBW chip, so that the top RGBW chip functional layer has enough space to place the four RGBW chips, and the four RGBW chips can be set in the center. For example, in a preferred embodiment of the technical solution, the four RGBW chips are arranged at intervals, and the four RGBW chips are arranged in a "one" shape in the middle of the lamp bead, which can not only improve the brightness of the lamp bead, but also improve the clarity of the display screen. Moreover, since the RGBW chip functional layer is set separately, more metal parts such as the die bonding pad 51 and the positive light-emitting pad 54 can be retained, so that the heat dissipation performance is better, which is conducive to the heat dissipation of the four RGBW chips and the IC chip 3, and further improves the heat dissipation performance of the mini-RGBW-LED lamp bead structure.

[0134] Preferably, in the technical solution, the ratio of the area of ​​the upper surface of the die-bonding pad 51 to the area of ​​the cross section of the insulating seat 1 is (0.3-0.6): 1 (eg Figure 7 As shown), exemplary ratios are 0.3:1, 0.35:1, 0.4:1, 0.45:1, 0.5:1, 0.55:1, and 0.6:1, but are not limited thereto. In the technical solution, the die-bonding pad 51 has a larger area, and the die-bonding pad 51 is made of metal, which is beneficial to heat dissipation and improves the overall performance of the mini-RGBW-LED lamp bead structure.

[0135] Preferably, the mini-RGBW-LED lamp bead structure with built-in IC described in the technical solution has a length of 2.0 to 4.0 mm, a width of 2.0 to 4.0 mm, and a height of 1.2 to 3.5 mm.

[0136] At present, IC embedded lamp beads generally set the IC chip and the light-emitting chip in the same layer structure. Due to the large size of the IC chip, the size of the IC embedded lamp beads produced will be larger. Since the clarity of the display in the LED display is proportional to the number of lamp beads, in a display of a certain size, if larger lamp beads are used, the number of lamp beads that can be arranged on the LED display will be reduced, which will lead to a decrease in the clarity of the LED display. The technical solution sets the mini-RGBW-LED lamp bead structure with built-in IC as a two-layer functional structure (i.e., an IC packaging layer 12 and an RGBW packaging layer 13). The IC functional layer and the RGBW chip functional layer are located in different vertical layer structures, so that the overall size of the manufactured lamp bead is smaller. The mini-RGBW-LED lamp bead structure with built-in IC in the technical solution has a length of 2.0 to 4.0 mm, a width of 2.0 to 4.0 mm, and a height of 1.2 to 3.5 mm, which is close to the size of a conventional Mini RGB LED without embedded IC. The mini-RGBW-LED lamp bead structure with built-in IC in the technical solution can provide higher resolution and finer display effects in a smaller space, ensuring that the LED display has better clarity.

[0137] The technical principle of the present invention is described above in conjunction with specific embodiments. These descriptions are only for explaining the principle of the present invention and cannot be interpreted as limiting the scope of protection of the present invention in any way. Based on the explanations herein, those skilled in the art can associate other specific implementations of the present invention without paying creative labor, and these methods will fall within the scope of protection of the present invention.

Claims

1. A method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC, characterized in that: The mini-RGBW-LED lamp bead structure with embedded IC includes an insulating seat, a conductive pin assembly, an IC chip, an IC pad assembly and a light-emitting assembly; The insulating seat includes a substrate, an IC packaging layer and an RGBW packaging layer from bottom to top, the IC pad assembly and the light-emitting assembly are both embedded in the insulating seat, and the IC pad assembly is arranged on the top of the substrate, the IC chip is welded on the top of the IC pad assembly, the IC chip is embedded in the IC packaging layer, the light-emitting assembly is embedded in the RGBW packaging layer, and the light-emitting assembly and the IC chip are electrically connected; The conductive pin assembly is arranged outside the substrate, and the conductive pin assembly is electrically connected to the IC pad assembly; The light-emitting component includes a die-bonding pad, an RGB light-emitting chip, a white light-emitting chip and a light-emitting positive electrode pad, wherein the die-bonding pad and the light-emitting positive electrode pad are both located at the bottom of the RGBW packaging layer, and the RGB light-emitting chip and the white light-emitting chip are respectively installed at intervals on the die-bonding pad, and the RGB light-emitting chip and the white light-emitting chip are arranged in a "straight" shape in the middle of the insulating seat; The RGB light-emitting chip and the white light-emitting chip are respectively provided with corresponding positive light-emitting pads, the IC chip is electrically connected to the positive light-emitting pads, and the RGB light-emitting chip and the white light-emitting chip are respectively electrically connected to the corresponding positive light-emitting pads; The conductive pin assembly includes a negative power pin, and the die-bonding pad is electrically connected to the negative power pin; The method for preparing the mini-RGBW-LED lamp bead structure with embedded IC comprises the following steps: (1) manufacturing an IC pad assembly on the top of the substrate, wherein the IC pad assembly and the conductive pin assembly are an integrally formed structure, and the conductive pin assembly is arranged outside the substrate; (2) soldering the IC chip to the top of the IC pad assembly, so that the GND solder joint, VDD solder joint, DI solder joint and DO solder joint of the IC chip are respectively electrically connected to the corresponding pads in the IC pad assembly, and then packaging the IC chip to form an IC packaging layer; (3) making a die-bonding pad and a positive light-emitting pad on the top of the IC packaging layer, wherein the die-bonding pad and the positive light-emitting pad are respectively arranged on both sides of the top of the IC packaging layer; making a circuit so that the IC chip and the positive light-emitting pad are electrically connected, and the die-bonding pad and the negative power supply pin are electrically connected; (4) pressing the RGBW packaging layer having the first packaging hole and the second packaging hole on top of the IC packaging layer; (5) Mounting the RGB light-emitting chip and the white light-emitting chip on top of the die-bonding pad, wherein the white light-emitting chip is located inside the first packaging hole, and the RGB light-emitting chip is located inside the second packaging hole, so that the cathode of the RGB light-emitting chip and the cathode of the white light-emitting chip are both electrically connected to the die-bonding pad, and the anode of the RGB light-emitting chip and the anode of the white light-emitting chip are respectively electrically connected to the corresponding anode light-emitting pads through bonding wires; (6) Fill the first packaging hole 131 with white light packaging glue, and fill the second packaging hole with RGB packaging glue to obtain a mini-RGBW-LED lamp bead structure with an embedded IC.

2. The method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC according to claim 1, characterized in that: The RGB light emitting chip includes a red light chip, a blue light chip and a green light chip; The mini-RGBW-LED lamp bead structure with embedded IC also includes a connecting pad, and four connecting pads are provided. The four connecting pads are independent of each other, and the W soldering point, B soldering point, G soldering point and R soldering point of the IC chip are respectively connected to one side of the four connecting pads, and the other sides of the four connecting pads are respectively used to connect the white light emitting chip, the blue light chip, the green light chip and the red light chip; The light-emitting positive electrode pad includes the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad, and the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad are respectively arranged above the corresponding connecting pads; The mini-RGBW-LED lamp bead structure with embedded IC further includes a negative electrode connection pad, the negative electrode connection pad is located on the top of the substrate, and the negative electrode connection pad is located below the die-bonding pad, and the negative electrode connection pad is electrically connected to the negative electrode pin of the power supply; In step (3), the method of making a circuit to electrically connect the IC chip to the positive light-emitting pad and to electrically connect the die-bonding pad to the negative power supply pin comprises the following steps: a. Forming first electroplating holes at the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad, respectively, and the first electroplating holes extend to the corresponding connecting pads; forming second electroplating holes on the die-bonding pad, and the second electroplating holes extend to the pad connected to the negative electrode; b. Electroplating is performed in the first electroplating hole and the second electroplating hole so that the electroplated metal completely fills the first electroplating hole and the second electroplating hole, and the conductive columns respectively formed in the first electroplating hole and the second electroplating hole electrically connect the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad to the corresponding connecting pads respectively through the conductive columns, and the die-bonding pad and the negative electrode connecting pad are electrically connected.

3. The method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC according to claim 1, characterized in that: The components of the white light encapsulation adhesive include silicone glue and phosphor; The components of the RGB packaging glue include epoxy resin glue and diffusion powder.

4. The method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC according to claim 3, characterized in that: In the white light encapsulation adhesive, the mass ratio of the silicone glue to the phosphor is (16-39):(3-10).

5. The method for preparing a mini-RGBW-LED lamp bead structure with an embedded IC according to claim 3, characterized in that: In the RGB packaging glue, the mass ratio of the epoxy resin glue to the diffusion powder is (2.3-3.7): (0.7-1.0).

6. A mini-RGBW-LED lamp bead structure with an embedded IC, characterized in that: Prepared by the preparation method of the mini-RGBW-LED lamp bead structure with embedded IC as described in any one of claims 1 to 5; The mini-RGBW-LED lamp bead structure with embedded IC includes an insulating seat, a conductive pin assembly, an IC chip, an IC pad assembly and a light-emitting assembly; The insulating seat includes a substrate, an IC packaging layer and an RGBW packaging layer from bottom to top, the IC pad assembly and the light-emitting assembly are both embedded in the insulating seat, and the IC pad assembly is arranged on the top of the substrate, the IC chip is welded on the top of the IC pad assembly, the IC chip is embedded in the IC packaging layer, the light-emitting assembly is embedded in the RGBW packaging layer, and the light-emitting assembly and the IC chip are electrically connected; The conductive pin assembly is arranged outside the substrate, and the conductive pin assembly is electrically connected to the IC pad assembly; The light-emitting component includes a die-bonding pad, an RGB light-emitting chip, a white light-emitting chip and a light-emitting positive electrode pad, wherein the die-bonding pad and the light-emitting positive electrode pad are both located at the bottom of the RGBW packaging layer, and the RGB light-emitting chip and the white light-emitting chip are respectively installed at intervals on the die-bonding pad, and the RGB light-emitting chip and the white light-emitting chip are arranged in a "straight" shape in the middle of the insulating seat; The RGB light-emitting chip and the white light-emitting chip are respectively provided with corresponding positive light-emitting pads, the IC chip is electrically connected to the positive light-emitting pads, and the RGB light-emitting chip and the white light-emitting chip are respectively electrically connected to the corresponding positive light-emitting pads; The conductive pin assembly includes a negative power pin, and the die-bonding pad is electrically connected to the negative power pin.

7. The mini-RGBW-LED lamp bead structure with embedded IC according to claim 6, characterized in that: The mini-RGBW-LED lamp bead structure with embedded IC further includes a negative electrode connection pad and a plurality of conductive pillars, wherein the plurality of conductive pillars are embedded in the IC packaging layer, the negative electrode connection pad is located on the top of the substrate, and the negative electrode connection pad is located below the die-bonding pad, and the negative electrode connection pad is electrically connected to the negative electrode pin of the power supply through one of the conductive pillars; The RGB light emitting chip includes a red light chip, a blue light chip and a green light chip; The mini-RGBW-LED lamp bead structure with embedded IC also includes a connecting pad, and the connecting pad is arranged on the top of the substrate. There are four connecting pads, and the four connecting pads are independent of each other. The light-emitting positive electrode pad includes the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad, and the red light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the white light positive electrode pad are respectively arranged above the corresponding connecting pads; The W solder joint, B solder joint, G solder joint and R solder joint of the IC chip are respectively connected to one side of the four connecting pads, and the other sides of the four connecting pads are respectively electrically connected to the white light positive electrode pad, the blue light positive electrode pad, the green light positive electrode pad and the red light positive electrode pad through conductive columns.

8. The mini-RGBW-LED lamp bead structure with embedded IC according to claim 7, characterized in that: The conductive pin assembly further includes a positive power pin, a data input pin and a data output pin, wherein the negative power pin, the positive power pin, the data input pin and the data output pin are respectively arranged at four corners of the substrate; The mini-RGBW-LED lamp bead structure with built-in IC also includes a plurality of conductive metal wires; The IC pad assembly comprises an IC positive pad, an IC negative pad, an IC data input pad and an IC data output pad, wherein the IC positive pad is electrically connected to the positive power pin via a conductive metal wire, the IC negative pad is electrically connected to the negative power pin via a conductive metal wire, the IC data input pad is electrically connected to the data input pin via a conductive metal wire, and the IC data output pad is electrically connected to the data output pin via a conductive metal wire; The GND solder joint of the IC chip is connected to the negative pad of the IC, the VDD solder joint of the IC chip is connected to the positive pad of the IC, the DI solder joint of the IC chip is connected to the data input pad of the IC, and the DO solder joint of the IC chip is connected to the data output pad of the IC.

9. The mini-RGBW-LED lamp bead structure with embedded IC according to claim 8, characterized in that: The ratio of the width of the conductive metal wire to the width of the insulating seat is (0.035-0.07):

1.

10. The mini-RGBW-LED lamp bead structure with embedded IC according to claim 6, characterized in that: The ratio of the area of ​​the upper surface of the die-bonding pad to the area of ​​the cross section of the insulating seat is (0.3-0.6):1.

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