Periscopic camera module

Abstract

The invention discloses a periscopic camera module which comprises a reflecting prism, an optical lens and a photosensitive component, the reflecting prism is provided with an incident surface, a reflecting surface and an emergent surface which enable incident light to turn, the incident surface of the reflecting prism defines a light incident side of the periscopic camera module, and the emergent surface of the reflecting prism defines a light emergent side of the periscopic camera module. The light sensing assembly comprises a circuit board and a light sensing chip connected to the circuit board, the light sensing chip is provided with a light sensing area and a non-light sensing area surrounding the light sensing area, and the optical lens and the reflecting prism are arranged on a light sensing path of the light sensing assembly. Wherein the photosensitive area of the photosensitive chip is deviated to the light incident side of the periscopic camera module, so that the height size of the periscopic camera module is reduced, and the periscopic camera module is suitable for electronic equipment which pursues light and thin.

Description

Technical Field

[0001] The present invention relates to a camera module, and in particular to a periscope camera module, wherein a photosensitive area of ​​a photosensitive chip of the periscope camera module is biased toward a light incident side so as to reduce the height dimension of the periscope camera module. Background Art

[0002] With the improvement of living standards, consumers have higher and higher requirements for the camera functions of mobile terminal devices such as mobile phones and tablets. For example, the telephoto function is becoming one of the indispensable functions of mobile camera modules. In order to achieve the telephoto function, it is necessary to configure an optical lens with a telephoto function in the camera module, but the optical lens with a telephoto function will increase the height of the camera module, which is difficult to meet the development needs of the thin and light mobile terminal. Based on this, the prior art began to adopt a periscope design scheme, that is, in the periscope camera module, the optical path of the periscope camera module is laid flat, and an optical path reflection component is set on the optical path, so that the optical path is incident on the photosensitive chip of the photosensitive component after turning a certain angle (for example, 90°), so that the height of the entire optical system can be reduced. However, with the improvement of consumers' demand for shooting, the length and width of the photosensitive chip of the photosensitive component are also increasing, which results in the failure of the traditional packaging scheme to further reduce the height of the periscope camera module. Therefore, it is necessary to optimize the packaging structure of the periscope camera module. Summary of the invention

[0003] One object of the present invention is to provide a periscope camera module, wherein the photosensitive chip of the periscope camera module is biased toward the light incident side, so as to help reduce the height dimension of the camera module, so that the periscope camera module is suitable for electronic devices that pursue lightness and thinness.

[0004] One object of the present invention is to provide a periscope camera module, wherein the chip long side of the photosensitive chip located on the light incident side is not provided with a chip pad, which is conducive to reducing the height dimension of the photosensitive chip and further reducing the height dimension of the periscope camera module, and the structure of the photosensitive chip enables the photosensitive chip to be arranged in a manner biased towards the light incident side.

[0005] One object of the present invention is to provide a periscope camera module, wherein the base of the periscope camera module for mounting the optical lens is an injection-molded part made of plastic, and the periscope camera module assembles the optical lens by snapping a cover made of metal onto the base, and the cover made of metal can have a thinner size, so that the optical lens can be arranged in a manner biased toward the light incident side, thereby allowing the photosensitive chip to be arranged in a manner biased toward the light incident side.

[0006] One object of the present invention is to provide a periscope camera module, wherein the periscope camera module forms a front reinforcement portion on the front side of the circuit board, and the side of the front reinforcement portion located on the light incident side has a narrower width dimension, so that it is beneficial to reduce the height dimension of the front reinforcement portion and further reduce the height dimension of the periscope camera module, and the structure of the front reinforcement portion enables the photosensitive chip to be arranged in a manner biased toward the light incident side. For example, in some embodiments, the front reinforcement portion is integrally combined with the front side of the circuit board based on a molding process, and the molding process enables the side of the front reinforcement portion located on the light incident side to have a narrower width dimension, which is beneficial to reduce the height dimension of the front reinforcement portion and further reduce the height dimension of the periscope camera module.

[0007] One object of the present invention is to provide a periscope camera module, by forming the front reinforcement portion on the front side of the circuit board, so that the opening of the circuit board has good structural strength while being biased towards the light incident side, that is, the front reinforcement portion has the function of preventing the circuit board from deforming or breaking, so that the photosensitive chip can be arranged in a manner biased towards the light incident side.

[0008] One object of the present invention is to provide a periscope camera module, wherein the periscope camera module forms a back reinforcement portion on the back side of the circuit board, and the side of the back reinforcement portion located on the light incident side has a wider width dimension. In this way, when the side of the front reinforcement portion located on the light incident side has a narrower width dimension, the back reinforcement portion can reinforce the side of the circuit board located on the light incident side, thereby preventing the circuit board from deforming or breaking.

[0009] One object of the present invention is to provide a periscope camera module, wherein after the front reinforcement portion is formed on the front of the circuit board and the back reinforcement portion is formed on the back of the circuit board, the front reinforcement portion, the back reinforcement portion and / or the circuit board can be cut to further reduce the width of the front reinforcement portion, the back reinforcement portion and / or the circuit board on the light incident side, thereby achieving the purpose of further reducing the height dimension of the periscope camera module. Moreover, when cutting the circuit board, the front reinforcement portion can prevent the circuit board from being deformed or broken due to cutting, thereby improving the yield of the periscope camera module.

[0010] According to one aspect of the present invention, the present invention provides a periscope camera module, which includes:

[0011] Optical lens;

[0012] a light redirecting element capable of redirecting incident light; and

[0013] A photosensitive component includes a circuit board and a photosensitive chip connected to the circuit board, the photosensitive chip has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, the optical lens and the light deflection element are arranged in the photosensitive path of the photosensitive component, wherein the photosensitive area of ​​the photosensitive chip is biased toward the light incident side of the periscope camera module.

[0014] According to one embodiment of the present invention, the light deflecting element is a reflective prism having an incident surface, a reflective surface and an exit surface for deflecting incident light, wherein the incident surface of the reflective prism defines the light incident side of the periscope camera module.

[0015] According to an embodiment of the present invention, the light redirecting element is a reflector having a reflective surface to allow the light redirecting element to redirect incident light by reflection.

[0016] According to one embodiment of the present invention, the photosensitive component includes a front reinforcement portion having a light-through hole, wherein the front reinforcement portion is formed on the front side of the circuit board, and the light-through hole of the front reinforcement portion corresponds to a photosensitive area of ​​the photosensitive chip, wherein a width dimension of the front reinforcement portion on a side of the light incident side of the periscope camera module is smaller than a width dimension of the front reinforcement portion on a side away from the light incident side of the periscope camera module.

[0017] According to one embodiment of the present invention, the photosensitive chip is arranged on the back side of the circuit board, and the circuit board has an opening corresponding to the photosensitive area of ​​the photosensitive chip, wherein the width dimension of the side of the circuit board located on the light incident side of the periscope camera module is smaller than the width dimension of the side of the circuit board away from the light incident side of the periscope camera module.

[0018] According to one embodiment of the present invention, the photosensitive component includes a back reinforcement portion having a mounting channel, and the opening of the circuit board is connected to the mounting channel of the back reinforcement portion, wherein the photosensitive chip is mounted on the back side of the circuit board through the mounting channel of the back reinforcement portion, wherein the width dimension of the back reinforcement portion on a side located on the light incident side of the periscope camera module is greater than the width dimension of the back reinforcement portion on a side away from the light incident side of the periscope camera module.

[0019] According to one embodiment of the present invention, the periscope camera module further includes a base made of plastic and a cover made of metal, one end of the base has a base through-hole, one end of the cover has a cover through-hole, the cover is buckled on the side of the base, the periscope camera module forms a receiving cavity between the base and the cover, the base through-hole of the base and the cover through-hole of the cover are respectively connected to the receiving cavity, wherein the reflective prism and the optical lens are received in the receiving cavity, the base through-hole of the base corresponds to the optical lens, and the cover through-hole of the cover corresponds to the incident surface of the reflective prism, wherein the base is mounted on the front mounting surface of the front reinforcement portion of the photosensitive component.

[0020] According to one embodiment of the present invention, the photosensitive component includes a substrate, the substrate is mounted on the back mounting surface of the back reinforcement portion, and there is a gap between the substrate and the photosensitive chip.

[0021] According to one embodiment of the present invention, the gap between the substrate and the photosensitive chip is filled with thermally conductive adhesive.

[0022] According to one embodiment of the present invention, the photosensitive component includes a connecting circuit board, and the connecting circuit board is connected to the short side of the board of the circuit board.

[0023] According to one embodiment of the present invention, the photosensitive component includes a connecting circuit board, the connecting circuit board includes a connecting portion, a bending portion and a lead-out portion, the connecting portion is superimposed on the substrate, and the opposite ends of the bending portion are respectively connected to the short side of the plate of the circuit board and the side of the connecting portion corresponding to the short side of the plate of the circuit board after bending, and the lead-out portion is connected to the side of the connecting portion away from the light incident side of the periscope camera module.

[0024] According to one embodiment of the present invention, the height dimension of the connecting portion of the connecting circuit board is smaller than the height dimension of the circuit board, and the connecting portion is biased toward the side of the circuit board located on the light incident side of the periscope camera module, and the lead-out portion extends outward from the side of the connecting portion away from the light incident side of the periscope camera module and is bent.

[0025] According to an embodiment of the present invention, an arc column is provided at one end of the substrate adjacent to the bending portion, and the bending portion surrounds the outer side of the arc column of the substrate.

[0026] According to one embodiment of the present invention, the photosensitive component has a cutting side, and the cutting side is located on the light incident side of the periscope camera module. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 It is a stereoscopic schematic diagram of a periscope camera module from one viewing angle according to a preferred embodiment of the present invention.

[0028] Figure 2 It is a stereoscopic schematic diagram of another viewing angle of the periscope camera module according to the above preferred embodiment of the present invention.

[0029] Figure 3 It is a three-dimensional cross-sectional schematic diagram of a position of the periscope camera module according to the above preferred embodiment of the present invention.

[0030] Figure 4 It is a three-dimensional cross-sectional schematic diagram of another position of the periscope camera module according to the above preferred embodiment of the present invention.

[0031] Figure 5 yes Figure 4 An enlarged schematic diagram of a local location.

[0032] Figure 6 It is a cross-sectional schematic diagram of a position of the periscope camera module according to the above preferred embodiment of the present invention.

[0033] Figure 7 yes Figure 6 A magnified view of the local location.

[0034] Fig. 8A and Figure 8B It is a schematic diagram of one of the packaging steps of the periscope camera module according to the above-mentioned preferred embodiment of the present invention.

[0035] Fig. 9A and Fig. 9B It is a schematic diagram of the second packaging step of the periscope camera module according to the above preferred embodiment of the present invention.

[0036] Fig. 10A and Fig. 10B It is a schematic diagram of the third packaging step of the periscope camera module according to the above preferred embodiment of the present invention.

[0037] Fig.11A and Fig. 11B It is a schematic diagram of the fourth packaging step of the periscope camera module according to the above preferred embodiment of the present invention.

[0038] Fig. 12A and Fig. 12B It is a schematic diagram of the fifth packaging step of the periscope camera module according to the above-mentioned preferred embodiment of the present invention.

[0039] Fig.13A and Fig. 13BIt is a schematic diagram of the sixth packaging step of the periscope camera module according to the above-mentioned preferred embodiment of the present invention.

[0040] Fig.14 It is a schematic diagram of the seventh packaging step of the periscope camera module according to the above-mentioned preferred embodiment of the present invention.

[0041] Fig.15A and Fig. 15B It is a schematic diagram of the state of a photosensitive component of a periscope camera module before and after cutting according to another preferred embodiment of the present invention.

[0042] Fig.16 It is a cross-sectional schematic diagram of a position of the periscope camera module according to the above preferred embodiment of the present invention.

[0043] Fig.17 yes Fig.16 A magnified view of the local location. DETAILED DESCRIPTION

[0044] Before describing in detail any embodiment of the present invention, it should be understood that the present invention is not limited in its application to the construction and arrangement details of the components described below or illustrated in the following figures. The present invention can have other embodiments and can be practiced or carried out in various ways. In addition, it should be understood that the words and terms used here are for descriptive purposes and should not be considered restrictive. The use of "including", "comprising" or "having" and its variations herein is intended to cover the items and their equivalents and additional items displayed below. Unless otherwise specified or limited, the terms "install", "connect", "support" and "couple" and their variations are widely used and cover direct installation and indirect installation, connection, support and connection. In addition, "connect" and "couple" are not limited to physical or mechanical connections or connections.

[0045] Furthermore, on the first aspect, in the disclosure of the present invention, the orientation or positional relationship indicated by terms such as "longitudinal", "transverse", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" are based on the orientation or positional relationship shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore the above terms cannot be understood as limitations on the present invention; on the second aspect, the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" cannot be understood as a limitation on the quantity.

[0046] With reference to the accompanying drawings of the present invention Figures 1 to 14A periscope camera module according to a preferred embodiment of the present invention will be disclosed and described in the following description, wherein the periscope camera module includes a light deflection element 10, an optical lens 20 and a photosensitive component 30. The light incident on the periscope camera module is incident on the optical lens 20 after being deflected by the light deflection element 10, and reaches the photosensitive component 30 after passing through the optical lens 20. The photosensitive component 30 performs photoelectric conversion to form an image, so as to allow the periscope camera module to obtain image information. Preferably, the light deflection element 10 can deflect the incident light by 90°.

[0047] That is to say, in the attached Figures 1 to 14 In this specific example of the periscope camera module of the present invention, the optical lens 20 and the light deflection element 10 are sequentially arranged in the light sensing path of the photosensitive component 30, that is, the optical lens 20 is located between the light deflection element 10 and the photosensitive component 30. Optionally, in some other examples of the periscope camera module of the present invention, the light deflection element 10 and the optical lens 20 are sequentially arranged in the light sensing path of the photosensitive component 30, that is, the light deflection element 10 is located between the optical lens 20 and the photosensitive component 30. Optionally, in some other examples of the periscope camera module of the present invention, the number of the optical lenses 20 is more than two, and the light deflection element 10 is arranged between two adjacent optical lenses 20; or, the number of the light deflection elements 10 is more than two, and the optical lens 20 is arranged between two adjacent light deflection elements 10.

[0048] Continue to refer to the attached Figures 1 to 14 The periscope camera module includes a base 40 and a cover body 50, one end of the base 40 has a base through hole 41, one end of the cover body 50 has a cover through hole 51, the cover body 50 is buckled on the side of the base 40, and the periscope camera module forms a receiving cavity 60 between the base 40 and the cover body 50, the base through hole 41 of the base 40 and the cover through hole 51 of the cover body 50 are respectively connected to the receiving cavity 60. The light deflection element 10 and the optical lens 20 are both accommodated in the accommodating cavity 60, and the photosensitive component 30 is arranged at the end of the base 40 where the base through-hole 41 is provided, wherein the cover through-hole 51 of the cover body 50 corresponds to the light deflection element 10, so as to allow the light incident on the periscope camera module to reach the light deflection element 10 after passing through the cover through-hole 51 of the cover body 50, and the base through-hole 41 of the base 40 corresponds to the optical lens 20, so as to allow the incident light passing through the optical lens 20 to reach the photosensitive component 30 after further passing through the base through-hole 41 of the base 40.

[0049] Specifically, the base 40 further has a base groove 42 and a side opening 43 connected to the base groove 42, the base groove 42 is provided with a prism mounting position 421 and a lens mounting position 422, wherein the light deflection element 10 is installed at the prism mounting position 421 through the side opening 43 of the base 40, and the optical lens 20 is installed at the lens mounting position 422 through the side opening 43 of the base 40 in a manner that the base through hole 41 of the base 40 corresponds to the optical lens 20, and after the cover body 50 is buckled onto the base 40 in a manner that the cover through hole 51 of the cover body 50 corresponds to the light deflection element 10, on the one hand, the cover body 50 closes the side opening 43 of the base 40, and on the other hand, the periscope camera module forms the receiving cavity 60 between the base 40 and the cover body 50, and the light deflection element 10 and the optical lens 20 are both received in the receiving cavity 60.

[0050] In some embodiments of the present invention, the light deflection element 10 can be fixedly bonded to the base 40 by glue. In other embodiments of the present invention, the light deflection element 10 can move relative to the base 40 to achieve the optical image stabilization function of the periscope camera module. It is worth mentioning that the light deflection element 10 can move relative to the base 40 by rotating around the height direction and around the width direction axis to achieve the two-axis optical image stabilization of the periscope camera module, wherein the height direction refers to the direction in which the light is incident on the light deflection element 10, the length direction refers to the direction in which the light is emitted from the light deflection element 10, and the width direction refers to the direction that is perpendicular to both the height direction and the length direction, that is, the height direction, length direction and width direction of the periscope camera module are perpendicular to each other.

[0051] In some embodiments of the present invention, the optical lens 20 can be fixedly bonded to the base 40 by glue. In other embodiments of the present invention, the optical lens 20 can move relative to the base 40 to achieve focusing and / or optical image stabilization of the periscope camera module.

[0052] It is worth mentioning that the buckling method of the base 40 and the cover 50 is not limited in the periscope camera module of the present invention. Figures 1 to 14In this specific example of the periscope camera module of the present invention shown, the base 40 is an injection-molded part made of plastic, and at least one buckle 44 is respectively provided on the opposite sides in the width direction and one end where the light deflection element 10 is provided. The cover body 50 is a metal part, which includes a panel 52, two side panels 53 and an end panel 54. The two side panels 53 and the end panel 54 extend downward from the opposite sides and one end of the panel 52, respectively. The opposite sides of the end panel 54 are respectively connected to one end of the two side panels 53. The cover A body through hole 51 is formed on the panel 52, and the two side panels 53 and the end panel 54 are respectively provided with at least one snap hole 55, wherein after the cover body 50 is assembled to the base 40, the panel 52 is located on the side of the base 40 for closing the side opening 43 of the base 40, and each of the side panels 53 and the end panels 54 are respectively located on the opposite sides and the outer side of the end of the base 40, and these snaps 44 of the base 40 are respectively snapped into these snap holes 55 of the cover body 50, so that the base 40 and the cover body 50 are reliably snapped.

[0053] Preferably, refer to the attached Figure 1 The periscope camera module further includes a light shielding portion 70, which is coated on the panel 52 of the cover body 50 and surrounds the cover body perforation 51 of the cover body 50 to reduce the reflection of stray light and improve the imaging quality of the periscope camera module.

[0054] Continue to refer to the attached Figure 6 In this specific example of the periscope camera module of the present invention, the light deflection element 10 is a reflective prism having an incident surface 11, a reflective surface 12 and an exit surface 13. The incident light is incident through the incident surface 11 of the light deflection element 10, and is reflected by the reflective surface 12 and then emitted through the exit surface 13 to achieve the deflection of the incident light. Preferably, the light deflection element 10 deflects the incident light by 90°. For example, in the attached Figures 1 to 14 In this specific example of the periscope camera module of the present invention shown, the incident surface 11, the reflection surface 12 and the exit surface 13 of the light deflection element 10 are all planes, wherein the extension direction of the incident surface 11 and the extension direction of the reflection surface 12 have a 45° angle, the extension direction of the exit surface 13 and the extension direction of the reflection surface 12 have a 45° angle, and the extension direction of the incident surface 11 and the extension direction of the exit surface 13 have a 90° angle, so that the light deflection element 10 can deflect the incident light by 90°. Optionally, in other embodiments of the present invention, the incident surface 11, the reflection surface 12 and the exit surface 13 of the light deflection element 10 can be designed as convex or concave surfaces.

[0055] It is worth mentioning that since the incident light is incident from the incident surface 11 of the light deflection element 10, the incident surface 11 of the light deflection element 10 defines the light incident side 100 of the periscope camera module. In other words, the light incident side 100 of the periscope camera module refers to the side where the external light enters the periscope camera module.

[0056] Optionally, in some other embodiments of the periscope camera module of the present invention, the light deflection element 10 is a reflector having the reflective surface 12, and the incident light can be reflected and deflected by the reflective surface 12 of the light deflection element 10. The emitting surface 12 of the light deflection element 10 can be a plane, a convex surface or a concave surface, which is selected according to needs.

[0057] Continue to refer to the attached Figures 1 to 14 The photosensitive component 30 includes a circuit board 31 and a photosensitive chip 32 connected to the circuit board 31, the photosensitive chip 32 has a photosensitive area 321 and a non-photosensitive area 322 surrounding the photosensitive area 321, wherein the photosensitive component 30 is arranged at the end of the base 40 provided with the base through hole 41 in such a manner that the base through hole 41 of the base 40 corresponds to the photosensitive area 321 of the photosensitive chip 32, so that the optical lens 20 and the light deflection element 10 are sequentially arranged in the photosensitive path of the photosensitive component 30, so that the light incident on the periscope camera module is incident on the optical lens 20 after being deflected by the light deflection element 10, and reaches the photosensitive area 321 of the photosensitive chip 32 of the photosensitive component 30 after passing through the optical lens 20, and the photosensitive chip 32 performs photoelectric conversion to form an image, so as to allow the periscope camera module to obtain image information.

[0058] Unlike the periscope camera module in the prior art, Figures 1 to 14 In this specific example of the periscope camera module of the present invention, the photosensitive component 30 is arranged on the base 40 in such a way that the photosensitive area 321 of the photosensitive chip 32 is biased toward the light incident side 100 of the periscope camera module, which is conducive to reducing the height dimension of the periscope camera module, so that the periscope camera module is suitable for electronic devices that pursue thinness. Correspondingly, the optical lens 20 is biased toward the light incident side 100 of the periscope camera module. That is to say, in the periscope camera module of the present invention, along the direction when the light is incident on the light deflection element 10, the midpoint of the optical lens 20 in this direction is higher than the midpoint of the periscope camera module in this direction, so that the optical lens 20 is biased toward the light incident side 100 of the periscope camera module.

[0059] It can be understood that in the periscope camera module of the present invention, the base 40 is made of plastic and is usually thicker, the cover 50 is made of metal and is usually thinner, and the optical lens 20 is mounted on the base 40 and accommodated in the accommodating cavity 60 formed between the base 40 and the cover 50. Therefore, by controlling the thickness of the base 40 and the cover 50, the position of the optical lens 20 can be conveniently biased toward the light incident side 100 of the periscope camera module.

[0060] Furthermore, since the photosensitive component 30 is applied to the periscope camera module, in order to reduce the height of the periscope camera module, the circuit board 31 and the photosensitive chip 32 are both designed to be rectangular, and the circuit board 31 has two opposite long sides 311 and two opposite short sides 312. One of the two long sides 311 is located at the light incident side 100 of the periscope camera module, and the other long side 311 is away from the periscope camera module. On the light incident side 100 of the periscope camera module, the circuit board 31 is respectively provided with a row of plate soldering pads 313 on the two plate short sides 312 and one of the two plate long sides 311 which is away from the light incident side 100 of the periscope camera module, that is, one of the two plate long sides 311 of the circuit board 31 which is located on the light incident side 100 of the periscope camera module is not provided with the plate soldering pads 313.

[0061] Correspondingly, the photosensitive chip 32 has two opposite chip long sides 323 and two opposite chip short sides 324, one of the two chip long sides 323 is located at the light incident side 100 of the periscope camera module, and the other chip long side 323 is away from the light incident side 100 of the periscope camera module. The photosensitive chip 32 is provided with a row of chip pads 325 on the two chip short sides 324 and one of the two chip long sides 323 that is away from the light incident side 100 of the periscope camera module, that is, one of the two chip long sides 323 of the photosensitive chip 32 that is located at the light incident side 100 of the periscope camera module is not provided with the chip pads 325, which is conducive to reducing the height dimension of the photosensitive chip 32 and further reducing the height dimension of the periscope camera module.

[0062] It can be understood that in the periscope camera module of the present invention, the photosensitive chip 32 is connected to the circuit board 31, and the positions of the two long sides 311 of the plate of the circuit board 31 and the positions of the two long sides 323 of the chip of the photosensitive chip 32 correspond one to one, and the positions of the two short sides 312 of the plate of the circuit board 31 and the positions of the two short sides 324 of the chip of the photosensitive chip 32 correspond one to one. Therefore, the height dimension of the circuit board 31 is consistent with the distance between the two long sides 311 of the plate of the circuit board 31, and the height dimension of the photosensitive chip 32 is consistent with the distance between the two long sides 323 of the chip of the photosensitive chip 32. One of the long sides 311 of the plate located on the light incident side 100 of the periscope camera module is not provided with the plate pad 313, and one of the two long sides 323 of the photosensitive chip 32 located on the light incident side 100 of the periscope camera module is not provided with the chip pad 325. Therefore, the distance between the two long sides 311 of the plate of the circuit board 31 can be reduced, so that the height dimension of the circuit board 31 can be reduced. Correspondingly, the distance between the two long sides 323 of the photosensitive chip 32 can be reduced, so that the height dimension of the photosensitive chip 32 is reduced, which is beneficial to reduce the height dimension of the periscope camera module.

[0063] Furthermore, since one of the two long sides 311 of the plate of the circuit board 31 located on the light incident side 100 of the periscope camera module is not provided with the plate pad 313, and one of the two long sides 323 of the photosensitive chip 32 located on the light incident side 100 of the periscope camera module is not provided with the chip pad 325, when the photosensitive component 30 is assembled on the base 40, the photosensitive area 321 of the photosensitive chip 32 can be further biased toward the light incident side 100 of the periscope camera module, thereby further achieving the purpose of reducing the height dimension of the periscope camera module.

[0064] It is worth mentioning that the plate pad 313 of the circuit board 31 and the chip pad 325 of the photosensitive chip 32 are connected to each other to connect the photosensitive chip 32 and the circuit board 31. In some embodiments of the present invention, the photosensitive chip 32 is located on the front side of the circuit board 31. For example, the photosensitive chip 32 can be directly mounted on the front side of the circuit board 31, and the chip pad 325 of the photosensitive chip 32 and the plate pad 313 of the circuit board 31 are connected by gold wire to connect the photosensitive chip 32 and the circuit board 31. It is worth mentioning that the front side of the circuit board 31 refers to the side of the circuit board 31 facing the direction of the optical lens 20, and the back side of the circuit board 31 refers to the side of the circuit board 31 facing away from the optical lens 20. Therefore, the front and back sides of the circuit board 31 are located on opposite sides of the circuit board 31.

[0065] In the attached Figures 1 to 14 In the illustrated embodiment of the present invention, the circuit board 31 has an opening 314 that runs through the front and back of the circuit board 31, that is, the opening 314 of the circuit board 31 extends from the front to the back of the circuit board 31. The photosensitive chip 32 is mounted on the back of the circuit board 31 by directly welding the chip pad 325 and the plate pad 313 to connect the photosensitive chip 32 and the circuit board 31, and the opening 314 of the circuit board 31 corresponds to the photosensitive area 321 of the photosensitive chip 32, so that the light emitted through the optical lens 20 can reach the photosensitive area 321 of the photosensitive chip 32 after passing through the opening 314 of the circuit board 31.

[0066] It can be understood that, since one of the two long sides 311 of the plate 31 located on the light incident side 100 of the periscope camera module is not provided with the plate pad 313, the width dimension of the circuit board 31 on the side located on the light incident side 100 of the periscope camera module can be narrowed, which is conducive to reducing the height dimension of the circuit board 31 and further reducing the height dimension of the periscope camera module. Correspondingly, since one of the two long sides 323 of the photosensitive chip 32 located on the light incident side 100 of the periscope camera module is not provided with the chip pad 325, the width dimension of the photosensitive chip 32 on the side located on the light incident side 100 of the periscope camera module can be narrowed, which is conducive to reducing the height dimension of the photosensitive chip 32 and further reducing the height dimension of the periscope camera module.

[0067] Furthermore, the photosensitive component 30 includes a front reinforcement portion 33, and the front reinforcement portion 33 has a light hole 331, wherein the front reinforcement portion 33 is formed on the front side of the circuit board 31, and the photosensitive area 321 of the photosensitive chip 32 corresponds to the light hole 331 of the front reinforcement portion 33, so that the light emitted through the optical lens 20 can reach the photosensitive area 321 of the photosensitive chip 32 after passing through the light hole 331 of the front reinforcement portion 33 and the opening 314 of the circuit board 31.

[0068] In some embodiments of the present invention, the inner side surface of the front reinforcing portion 33 for forming the light-through hole 331 is a curved surface, which is conducive to demoulding and reducing stray light.

[0069] In other embodiments of the present invention, the inner side surface of the front reinforcement portion 33 for forming the light-through hole 331 is a slope, and the angle between the extending direction of the slope and the central axis of the photosensitive chip 32 (i.e., a line passing through the center of the photosensitive area 321 of the photosensitive chip 32 and perpendicular to the plane where the photosensitive area 321 is located) is less than 45°. Preferably, the angle between the extending direction of the slope and the central axis of the photosensitive chip 32 is 0°, that is, the slope is perpendicular to the plane where the photosensitive area 321 of the photosensitive chip 32 is located. It is worth noting that the slope of the front reinforcement portion 33 refers to the inclination relative to the central axis of the photosensitive chip 32.

[0070] In other embodiments of the present invention, the inner side surface of the front reinforcing portion 33 for forming the light-through hole 331 is composed of an inclined surface and a curved surface, the inclined surface extends outward from the circuit board 31, and the curved surface further extends outward from the inclined surface, wherein the angle between the extending direction of the inclined surface and the central axis of the photosensitive chip 32 is less than 45°. Preferably, the angle between the extending direction of the inclined surface and the central axis of the photosensitive chip 32 is 0°.

[0071] In the periscope camera module of the present invention, the periscope camera module integrally forms the front reinforcement portion 33 on the front side of the circuit board 31 by a molding process. The molding process enables the front reinforcement portion 33 to have a narrower width dimension on the side of the light incident side 100 of the periscope camera module. This is conducive to reducing the height dimension of the front reinforcement portion 33 and further reducing the height dimension of the periscope camera module. In addition, the structure of the front reinforcement portion 33 enables the photosensitive chip 32 to be arranged in a manner biased toward the light incident side 100 of the periscope camera module.

[0072] In addition, by forming the front reinforcement portion 33 on the front side of the circuit board 31, the opening 314 of the circuit board 31 has good structural strength while being biased toward the light incident side 100 of the periscope camera module, that is, the front reinforcement portion 33 has the function of preventing the circuit board 31 from deforming or breaking, so that the photosensitive chip 32 can be arranged in a manner biased toward the light incident side 100 of the periscope camera module.

[0073] It is worth mentioning that, since the front reinforcing portion 33 is formed by molding the molding material integrally on the front of the circuit board 31 through a mold, the front reinforcing portion 33 has a flat front mounting surface 332. It is understandable that the front mounting surface 332 of the front reinforcing portion 33 surrounds the light-through hole 331.

[0074] Continue to refer to the attached Figures 3 to 7 The photosensitive component 30 further includes a back reinforcement part 34, and the back reinforcement part 34 has a mounting channel 341, wherein the back reinforcement part 34 is formed on the back of the circuit board 31, and the opening 314 of the circuit board 31 is connected to the mounting channel 341 of the back reinforcement part 34, and the plate pad 313 of the circuit board 31 is exposed to the mounting channel 341 of the back reinforcement part 34, wherein the photosensitive chip 32 can be reversely mounted on the circuit board 31 through the mounting channel 341 of the back reinforcement part 34. Preferably, the inner side surface of the back reinforcement part 34 for forming the mounting channel 341 is a curved surface, which is conducive to demoulding.

[0075] It is understandable that after the photosensitive chip 32 is mounted on the back of the circuit board 31, the back reinforcement part 34 surrounds the photosensitive chip 32 to allow the back reinforcement part 34 to protect the photosensitive chip 32. Preferably, the height dimension of the back reinforcement part 34 is greater than 30μm, that is, a back mounting surface 342 of the back reinforcement part 34 is at least 30μm lower than the back of the circuit board 31 to allow the back reinforcement part 34 to protect the photosensitive chip 32. Preferably, the height dimension of the back reinforcement part 34 is between 30μm and 50μm. For example, in some typical examples, the height dimension of the back reinforcement part 34 can be 40μm. In this way, the back reinforcement part 34 protects the photosensitive chip 32 without increasing the size of the photosensitive component 30.

[0076] In the periscope camera module of the present invention, the periscope camera module forms the back reinforcement portion 34 on the back of the circuit board 31 by a molding process. Figure 6The width dimension of the back reinforcement portion 34 on the light incident side 100 of the periscope camera module is greater than the width dimension of the back reinforcement portion 34 on the light incident side 100 away from the periscope camera module, that is, the back reinforcement portion 34 on the light incident side 100 of the periscope camera module has a wider width dimension. In this way, when the front reinforcement portion 33 on the light incident side 100 of the periscope camera module has a narrower width dimension, the back reinforcement portion 34 can strengthen the circuit board 31 on the periscope camera module. The side of the light incident side 100 is reinforced to prevent the circuit board 31 from being deformed or broken. At the same time, the side of the back reinforcement part 34 away from the light incident side 100 of the periscope camera module is narrowed so that the back reinforcement part 34 can avoid the plate pad 313 of the circuit board 31 arranged on this side, so as to allow the chip pad 325 of the photosensitive chip 32 arranged on the light incident side 100 away from the periscope camera module to be soldered to the plate pad 313 of the circuit board 31 arranged on the light incident side 100 away from the periscope camera module.

[0077] It is worth mentioning that, since the back reinforcement portion 34 is formed by integrally molding a molding material on the back side of the circuit board 31 through a mold, the back reinforcement portion 34 has a flat back mounting surface 342 .

[0078] Continue to refer to the attached Figures 3 to 6 Since the photosensitive component 30 is provided with the front reinforcement part 33 and the back reinforcement part 34 on the front and back of the circuit board 31 respectively, the front reinforcement part 33 and the back reinforcement part 34 can respectively enhance the strength and flatness of the circuit board 31 on the front and back of the circuit board 31. In the process of manufacturing and using the periscope camera module, the front reinforcement part 33 and the back reinforcement part 34 can make the circuit board 31 not easy to bend and deform, thereby greatly reducing the risk of failure of the photosensitive chip 32.

[0079] It is worth mentioning that the order of forming the front reinforcement portion 33 on the front of the circuit board 31 and forming the back reinforcement portion 34 on the back of the circuit board 31 is not limited in the periscope camera module of the present invention. For example, in some embodiments, first, the front reinforcement portion 33 is formed on the front of the circuit board 31, and secondly, the back reinforcement portion 34 is formed on the back of the circuit board 31. In other embodiments, first, the back reinforcement portion 34 is formed on the back of the circuit board 31, and secondly, the front reinforcement portion 33 is formed on the front of the circuit board 31. In other embodiments, while the front reinforcement portion 33 is formed on the front of the circuit board 31, the back reinforcement portion 34 is formed on the back of the circuit board 31, that is, the front reinforcement portion 33 and the back reinforcement portion 34 are formed by the same molding process.

[0080] Continue to refer to the attached Figure 6 , the photosensitive component 30 further includes at least one electronic component 35, which can be a passive electronic component such as a resistor, a capacitor, or an active electronic component such as a diode, a memory chip, etc., wherein the electronic component 35 is mounted on the front of the circuit board 31, and the front reinforcement portion 33 wraps the electronic component 35, so that the circuit board 31 does not need to provide a special space for mounting the electronic component 35, which is conducive to reducing the size of the circuit board 31 and reducing the height size of the periscope camera module. It can be understood that by wrapping the electronic component 35 mounted on the circuit board 31 by the front reinforcement portion 33 integrally combined with the circuit board 31, not only can the risk of the electronic component 35 falling off be reduced, but also the electronic component 35 and the photosensitive chip 32 can be isolated to avoid the falling objects of the electronic component 35 from contaminating the photosensitive area 321 of the photosensitive chip 32. Optionally, in other embodiments, the electronic components 35 may be mounted on the back of the circuit board 31, and the back reinforcement portion 34 wraps the electronic components 35. Of course, mounting the electronic components 35 on the front and back of the circuit board 31 is optional. In this embodiment, the front reinforcement portion 33 wraps the electronic components 35 mounted on the front of the circuit board 31, and the back reinforcement portion 34 wraps the electronic components 35 mounted on the back of the circuit board 31.

[0081] Preferably, the electronic component 35 is not mounted on one of the two long sides 311 of the circuit board 31 located on the light incident side 100 of the periscope camera module, that is, the electronic component 35 is only mounted on at least one of the two short sides 312 of the circuit board 31 and one of the two long sides 311 of the circuit board 31 that is away from the light incident side 100 of the periscope camera module. In this way, the one of the two long sides 311 of the circuit board 31 located on the light incident side 100 of the periscope camera module can have a narrower width dimension, which is beneficial to reducing the height dimension of the periscope camera module.

[0082] Now go to the attached Figure 6 , the photosensitive component 30 further includes a filter element 36, which can be mounted on the front mounting surface 332 of the front reinforcement part 33 by glue to keep the filter element 36 in the photosensitive path of the photosensitive chip 32, wherein the filter element 36 can filter unnecessary stray light such as infrared rays in the incident light to improve the imaging quality of the periscope camera module. It can be understood that since the front mounting surface 332 of the front reinforcement part 33 has a higher flatness, the flatness of the filter element 36 can be guaranteed. Preferably, a ring-shaped silk screen is provided around the side of the filter element 36 facing the optical lens 20 to reduce stray light and improve the imaging quality of the periscope camera module.

[0083] Preferably, the filter element 36 is mounted on the inner side of the front mounting surface 332 of the front reinforcement portion 33 by glue, and the base 40 is mounted on the outer side of the front mounting surface 332 of the front reinforcement portion 33 by glue, so that the base through-hole 41 of the base 40 can correspond to the filter element 36 to allow incident light passing through the base through-hole 41 of the base 40 to enter the photosensitive component 30 after passing through the filter element 36.

[0084] Continue to refer to the attached Figures 1 to 14 The photosensitive component 30 further includes a connecting circuit board 37, which is connected to one of the two short sides 312 of the board 31 of the circuit board 31. In this way, the setting of the connecting circuit board 37 will not increase the height dimension of the periscope camera module, wherein the connecting circuit board 37 is used to connect the periscope camera module to the mobile terminal.

[0085] Furthermore, the connecting circuit board 37 includes a connecting portion 371, a bending portion 372 and an output portion 373, the connecting portion 371 is stacked on the back of the circuit board 31, and the opposite ends of the bending portion 372 are respectively connected to one of the short sides 312 of the plate of the circuit board 31 and a side of the connecting portion 371 corresponding to the short side 312 of the plate of the circuit board 31 after bending, and the output portion 373 is connected to a side of the connecting portion 371 away from the light incident side 100 of the periscope camera module.

[0086] In some embodiments of the present invention, the connection portion 371 is a rigid circuit board, and the bending portion 372 is a flexible circuit board. In the process of packaging the periscope camera module, first, the circuit board 31 and the connection portion 371 are side by side, so as to facilitate molding the back reinforcement portion 34 on the back of the circuit board 31 and to facilitate mounting the photosensitive chip 32 on the circuit board 31. Secondly, after bending the bending portion 372, the connection portion 371 can go around the back of the circuit board 31 and be stacked on the circuit board 31 to reduce the width direction of the periscope camera module. It can be understood that since the connection portion 371 is a rigid circuit board, it is convenient to fix the connection portion 371 and reduce the risk of warping of the connection portion 371.

[0087] In addition, the lead-out portion 373 of the connecting circuit board 37 can be bent again, so as to facilitate the connection between the lead-out portion 373 and the mobile terminal. The specific structure of the lead-out portion 373 of the connecting circuit board 37 is not limited in the periscope camera module of the present invention. For example, the lead-out portion 373 can be composed of a flexible circuit board or a soft-hard combination circuit board, and a connector is provided on the lead-out portion 373, which is connected to the mobile terminal through the connector.

[0088] Continue to refer to the attached Figures 1 to 14 The height dimension of the connecting portion 371 of the connecting circuit board 37 is smaller than the height dimension of the circuit board 31, and the connecting portion 371 is biased toward a long side 312 of the plate of the circuit board 31 where the plate pad 313 is not provided. When the lead-out portion 373 extends outward from the side of the connecting portion 371 away from the light incident side 100 of the periscope camera module and is bent, it will not occupy additional space in the height direction of the periscope camera module, which is conducive to reducing the height dimension of the periscope camera module.

[0089] Reference Figure 6 and Figure 7The photosensitive component 30 further includes a substrate 38, which is fixed to the back mounting surface 342 of the back reinforcement portion 34, and there is a gap 301 between the substrate 38 and the back of the photosensitive chip 32. In this way, on the one hand, the substrate 38 can enhance the structural strength of the photosensitive component 30, and on the other hand, the substrate 38 can dissipate heat for the photosensitive chip 32. In some specific examples of the present invention, the substrate 38 can be a metal plate such as an aluminum plate, which can be fixed to the back mounting surface 342 of the back reinforcement portion 34 by, but not limited to, gluing.

[0090] Preferably, the gap 301 of the photosensitive component 30 between the substrate 38 and the back side of the photosensitive chip 32 can be filled with thermal conductive adhesive 302, so that the heat generated by the photosensitive chip 32 during operation can be quickly transferred to the substrate 38 by the thermal conductive adhesive 302, and the heat can be dissipated outwardly by the substrate 38.

[0091] In addition, the connecting portion 371 of the connecting circuit board 37 can be fixed to the substrate 38 in an overlapping manner. For example, the connecting portion 371 can be fixed to the substrate 38 by gluing to overlap the connecting portion 371 on the back of the circuit board 38. Preferably, the substrate 38 has at least one positioning column 381, and the connecting portion 371 of the connecting circuit board 37 has at least one positioning through hole 3711, wherein when the connecting portion 371 is overlapped on the substrate 38, the positioning column 381 of the substrate 38 extends into and is positioned in the positioning through hole 3711 of the connecting portion 371, so as to position the connecting portion 371 and the substrate 38.

[0092] Preferably, an arc column 382 is provided at one end of the bending portion 372 of the substrate 38 adjacent to the connecting circuit board 37, wherein when the bending portion 372 is bent to form, the arc column 382 of the substrate 38 is used to guide the bending shape of the bending portion 372 to avoid the bending portion 372 from having a right-angle bending line and improve the reliability of the bending portion 372, wherein after the bending portion 372 is bent to form, the bending portion 372 surrounds the arc column 382 of the substrate 38, and the arc column 382 of the substrate 38 is used to support the bending portion 372 to avoid the bending portion 372 from having a right-angle bending line when subjected to force and improve the reliability of the bending portion 372.

[0093] Attached FIG. 8A to FIG. 14 The packaging process of the periscope camera module of the present invention is shown, which is specifically as follows.

[0094] Reference Fig. 8A and Figure 8BThe circuit board 31 and the connecting portion 371 are side by side, and one of the short sides 312 of the circuit board 31 and one side of the connecting portion 371 are connected by a flexible board 303. One of the two long sides 311 of the circuit board 31 has a narrower width dimension, which is located near Fig. 8A and Figure 8B The other long side 311 of the plate has a wider width dimension, which is located near the top. Fig. 8A and Figure 8B Near the lower position in the figure, three rows of sheet pads 313 are arranged on the back side of the circuit board 31, which are adjacent to the opening 314 of the circuit board 31, and two of the three rows of sheet pads 313 are arranged on the two short sides 312 of the sheet of the circuit board 31, and the other row of sheet pads 313 is arranged on the long side 311 of the sheet with a wider dimension of the circuit board 31.

[0095] Reference Fig. 9A and Fig. 9B The front side of the circuit board 31 is formed with the front side reinforcing portion 33, and the front side reinforcing portion 33 surrounds the opening 314 of the circuit board 31, so that the opening 314 of the circuit board 31 is connected to the light-through hole 331 of the front side reinforcing portion 33, wherein the front side reinforcing portion 34 is located adjacent to the light-through hole 331 of the circuit board 31. Fig. 9A and Fig. 9B The side near the top of the front reinforcement portion 33 has a narrower width dimension, and the front reinforcement portion 33 is located near Fig. 9A and Fig. 9B The back side of the circuit board 31 is formed with the back side reinforcement part 34, and the back side reinforcement part 34 surrounds the opening 314 of the circuit board 31, so that the opening 314 of the circuit board 31 is connected to the mounting channel 341 of the back side reinforcement part 34, wherein the back side reinforcement part 34 is located near the mounting channel 341. Fig. 9A and Fig. 9B The side near the top of the back reinforcement portion 34 has a wider width dimension, and the back reinforcement portion 34 is located near Fig. 9A and Fig. 9B The side near the bottom of the back reinforcement part 34 has a narrower width dimension, so that, on the one hand, the back reinforcement part 34 exposes the plate pad 313 of the circuit board 31 to the mounting channel 341 of the back reinforcement part 34, and on the other hand, the front reinforcement part 33 is located near the mounting channel 341. Fig. 9A and Fig. 9BWhen the side close to the top has a narrower width dimension, the back reinforcement portion 34 can reinforce the long side 311 of the plate located above the circuit board 31, thereby preventing the circuit board 31 from deforming or breaking.

[0096] Reference Fig. 10A and Fig. 10B , the photosensitive chip 32 is provided with the chip pads 325 only on the lower one of the two chip long sides 323 and the two chip short sides 324, wherein the photosensitive chip 32 is mounted on the back of the circuit board 31 through the mounting channel 341 of the back reinforcement part 34, and the chip pads 325 of the photosensitive chip 32 and the plate pads 313 of the circuit board 31 are directly welded. It can be understood that after the photosensitive chip 32 is mounted on the back of the circuit board 31, on the one hand, the opening 314 of the circuit board 31 corresponds to the photosensitive area 321 of the photosensitive chip 32, and on the other hand, the back reinforcement part 34 surrounds the photosensitive chip 32 to protect the photosensitive chip 32.

[0097] The photosensitive chip 32 and the circuit board 31 can be welded by thermocompression bonding. Specifically, a first solder is set on the sheet pad 313 of the circuit board 31, and a second solder is set on the chip pad 325 of the photosensitive chip 32. The first solder and the second solder are bonded by thermocompression to weld the chip pads 325 of the photosensitive chip 32 and the sheet pads 313 of the circuit board 31, thereby realizing the mounting of the photosensitive chip 32 and the circuit board 31. Preferably, a non-conductive glue is further set at the bonding position of the circuit board 31 and the photosensitive chip 32, so as to increase the connection strength between the circuit board 31 and the photosensitive chip 32 while protecting the solder. In some embodiments, the first solder and the second solder may be gold materials. In other embodiments, the first solder may be a tin material, and the second material may be a gold material.

[0098] It is worth mentioning that the timing of setting the first solder on the sheet pad 313 of the circuit board 31 can be selected as needed. For example, in some embodiments, the step of setting the first solder on the sheet pad 313 of the circuit board 31 can be earlier than the step of forming the back reinforcement part 34 on the back of the circuit board 31, that is, after the front reinforcement part 33 is formed on the front of the circuit board 31, first, the first solder is set on the sheet pad 313 of the circuit board 31, for example, the first solder can be set on the sheet pad 313 of the circuit board 31 by a reflow soldering device, and secondly, the back reinforcement part 34 is formed on the back of the circuit board 31, wherein the back reinforcement part 34 avoids the first solder set on the sheet pad 313 of the circuit board 31. Preferably, before the back reinforcement part 34 is formed on the back of the circuit board 31, the circuit board 31, the front molding part 33 and the first solder set on the sheet pad 313 of the circuit board 31 can be cleaned to reduce dirt.

[0099] It is worth mentioning that, in some embodiments of the present invention, the opening 314 of the circuit board 31 is preset, that is, before the front reinforcement part 33 is formed on the front side of the circuit board 31 and the back reinforcement part 34 is formed on the back side, the opening 314 is preset on the circuit board 31. In other embodiments of the present invention, the opening 314 of the circuit board 31 is formed after the front reinforcement part 33 is formed on the front side of the circuit board 31 and the back reinforcement part 34 is formed on the back side, that is, first, the front reinforcement part 33 is formed on the front side of the circuit board 31 and the back reinforcement part 34 is formed on the back side, and secondly, the opening 314 of the circuit board 31 is formed by cutting the part of the circuit board 31 exposed to the light-through hole 331 of the front reinforcement part 33 and the mounting channel 341 of the back reinforcement part 34.

[0100] It is worth mentioning that after the photosensitive chip 32 is mounted on the circuit board 31 , a side encapsulation is provided between the photosensitive chip 32 and the back reinforcement portion 34 to protect the photosensitive chip 32 .

[0101] Reference Fig.11A and Fig. 11B The filter element 36 can be mounted on the front mounting surface 332 of the front reinforcing portion 33 by glue.

[0102] Reference Fig. 12A and Fig. 12B, the substrate 38 is mounted on the back mounting surface 342 of the back reinforcement portion 34, wherein the gap 301 between the substrate 38 and the photosensitive chip 32 can be provided with the thermal conductive adhesive 302 to improve the heat dissipation capacity of the photosensitive component 30.

[0103] Reference Fig.13A and Fig. 13B , allowing the flexible sheet 303 to bend around the arc column 382 of the substrate 38 to form the bending portion 372. After bending, the connecting portion 371 can be superimposed on the substrate 38, and the positioning column 381 of the substrate 38 extends into and is positioned in the positioning through hole 3711 of the connecting portion 381.

[0104] Reference Fig.14 After the light deflection element 10, the optical lens 20, the base 40 and the cover body 50 are formed into a lens assembly, one end of the base 40 provided with the base through hole 41 is mounted on the front mounting surface 332 of the front reinforcement portion 33 of the photosensitive component 30 to obtain the periscope camera module.

[0105] Attached FIG. 15A to FIG. 17 A periscope camera module according to another preferred embodiment of the present invention is shown, and the attached Figures 1 to 14 The periscope camera module shown is different in that FIG. 15A to FIG. 17 In the periscope camera module shown, the photosensitive component 30 has a cutting side 304, and the cutting side 304 of the photosensitive component 30 is located on the light incident side 100 of the periscope camera module. In this way, the height dimension of the periscope camera module can be further reduced.

[0106] Specifically, refer to the attached Fig.15A and Fig. 15B After forming the front reinforcing portion 33 on the front of the circuit board 31 and the back reinforcing portion 34 on the back of the circuit board 31, cutting the circuit board 31, the front reinforcing portion 33 and the back reinforcing portion 34 at the adjacent Fig.15A and Fig. 15B The side close to the top of the periscope camera module is narrowed to further narrow the width dimension of the circuit board 31, the width dimension of the front reinforcement part 33 and the width dimension of the back reinforcement part 34. After the periscope camera module is packaged, the photosensitive area 321 of the photosensitive chip 32 can be further biased toward the light incident side 100 of the periscope camera module to reduce the height dimension of the periscope camera module.

[0107] It is understandable that the circuit board 31 is located near Fig.15A and Fig. 15B The side near the top of the board is not provided with the plate pad 313 and the electronic component 35 is not mounted, so when cutting the circuit board 31, the front reinforcement part 33 and the back reinforcement part 34, the board pad 313 and the electronic component 35 are not mounted on the board pad 313 and the electronic component 35. Fig.15A and Fig. 15B When the circuit board 31 and the electronic components 35 are moved to the upper side, the circuit board 31 and the electronic components 35 will not be damaged. Fig.15A and Fig. 15B The front and back sides of the circuit board 31 near the top are respectively formed with the front reinforcing portion 33 and the back reinforcing portion 34, so when cutting the circuit board 31, the front reinforcing portion 33 and the back reinforcing portion 34 are located near the Fig.15A and Fig. 15B When the circuit board 31 is close to the upper side, the circuit board 31 will not have edge collapse, so as to improve the reliability of the periscope camera module.

[0108] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A periscope camera module, characterized in that: include: Optical lens; A light redirecting element capable of redirecting incident light; as well as A photosensitive component includes a circuit board and a photosensitive chip connected to the circuit board, the photosensitive chip has a photosensitive area and a non-photosensitive area surrounding the photosensitive area, the optical lens and the light deflection element are arranged in the photosensitive path of the photosensitive component, wherein the photosensitive area of ​​the photosensitive chip is biased toward the light incident side of the periscope camera module.

2. The periscope camera module according to claim 1, wherein the light deflecting element is a reflective prism having an incident surface, a reflective surface and an exit surface for deflecting incident light, wherein the incident surface of the reflective prism defines the light incident side of the periscope camera module.

3. The periscope camera module according to claim 1, wherein the light deflection element is a reflector having a reflective surface to allow the light deflection element to deflect incident light by reflection.

4. The periscope camera module according to claim 1, wherein the photosensitive component includes a front reinforcement portion having a light-through hole, wherein the front reinforcement portion is formed on the front side of the circuit board, and the light-through hole of the front reinforcement portion corresponds to the photosensitive area of ​​the photosensitive chip, wherein the width dimension of the front reinforcement portion on a side located on the light incident side of the periscope camera module is smaller than the width dimension of the front reinforcement portion on a side away from the light incident side of the periscope camera module.

5. The periscope camera module according to claim 4, wherein the photosensitive chip is arranged on the back side of the circuit board, and the circuit board has an opening corresponding to the photosensitive area of ​​the photosensitive chip, wherein the width dimension of the side of the circuit board located on the light incident side of the periscope camera module is smaller than the width dimension of the side of the circuit board away from the light incident side of the periscope camera module.

6. The periscope camera module according to claim 5, wherein the photosensitive component includes a back reinforcement portion having a mounting channel, the opening of the circuit board is connected to the mounting channel of the back reinforcement portion, wherein the photosensitive chip is mounted on the back side of the circuit board through the mounting channel of the back reinforcement portion, wherein the width dimension of the back reinforcement portion on a side located on the light incident side of the periscope camera module is greater than the width dimension of the back reinforcement portion on a side away from the light incident side of the periscope camera module.

7. The periscope camera module according to claim 4 further includes a base made of plastic and a cover made of metal, one end of the base has a base through-hole, one end of the cover has a cover through-hole, the cover is buckled on the side of the base, the periscope camera module forms a receiving cavity between the base and the cover, the base through-hole of the base and the cover through-hole of the cover are respectively connected to the receiving cavity, wherein the reflective prism and the optical lens are received in the receiving cavity, the base through-hole of the base corresponds to the optical lens, and the cover through-hole of the cover corresponds to the incident surface of the reflective prism, wherein the base is mounted on the front mounting surface of the front reinforcement portion of the photosensitive component.

8. The periscope camera module according to claim 6, wherein the photosensitive component includes a substrate, the substrate is mounted on the back mounting surface of the back reinforcement portion, and there is a gap between the substrate and the photosensitive chip.

9. The periscope camera module according to claim 8, wherein the gap between the substrate and the photosensitive chip is filled with thermal conductive adhesive.

10. The periscope camera module according to any one of claims 1 to 9, wherein the photosensitive component includes a connecting circuit board, and the connecting circuit board is connected to the short side of the circuit board.

11. The periscope camera module according to claim 8 or 9, wherein the photosensitive component includes a connecting circuit board, the connecting circuit board includes a connecting portion, a bending portion and a lead-out portion, the connecting portion is superimposed on the substrate, and the opposite ends of the bending portion are respectively connected to the short side of the plate of the circuit board and the side of the connecting portion corresponding to the short side of the plate of the circuit board after bending, and the lead-out portion is connected to the side of the connecting portion away from the light incident side of the periscope camera module.

12. The periscope camera module according to claim 11, wherein a height dimension of the connecting portion of the connecting circuit board is smaller than a height dimension of the circuit board, and the connecting portion is biased toward a side of the circuit board located on the light incident side of the periscope camera module, and the lead-out portion extends outward from a side of the connecting portion away from the light incident side of the periscope camera module and is bent.

13. The periscope camera module according to claim 11, wherein an arc column is provided at one end of the substrate adjacent to the bending portion, and the bending portion surrounds the outer side of the arc column of the substrate.

14. The periscope camera module according to any one of claims 1 to 9, wherein the photosensitive component has a cutting side, and the cutting side is located at the light incident side of the periscope camera module.

Images